JP2006076246A - Substrate lamination method, chip forming method using the lamination method and chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination method capable of laminating substrates with hardly receiving the limitation of the thickness of the substrates and without damaging the substrates. <P>SOLUTION: A lamination method for laminating a first thermoplastic resin substrate and a second thermoplastic resin substrate is provided, wherein the first and second thermoplastic resin substrates are made to face each other and the contact face is subjected to friction and pressing to laminate the same. Because the substrates are bonded together by frictional heat generated in the mutual contact face of the substrates, the heat does not prevail on the whole of the first and second thermoplastic resin substrates and it is possible, therefore, to prevent collapse or deformation of the substrates by heat. Because the energy transmission by friction and pressing is hardly susceptible of the limitation by the thickness of the substrates, the first and second thermoplastic resin substrates can be formed into a relatively thick form. Therefore, it is easy to perform processings such as forming grooves on the substrate surface and also it is possible to enhance the strength of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate bonding method and a chip manufactured by the bonding method.

  In recent years, the importance of detecting, detecting and quantifying biological substances and chemical substances such as DNA (Doexyribo Nucleic Acid), enzymes, proteins, antigens, antibodies, viruses and cells has increased in the fields of medicine, health, food and pharmaceuticals. is doing. Various biochips and microchemical chips that can easily measure them have been proposed. These chips are formed by laminating two substrates, and a technique for laminating the substrates is particularly important. For bonding the substrates, for example, an adhesive such as a hot-melt adhesive or a UV (Ultra Violet) adhesive is used.

  The hot melt adhesive is a linear polymer copolymer mainly composed of an ethylene vinyl acetate copolymer (EVA). EVA has a fluidity that softens at 80 ° to 110 ° and can be bonded at 160 ° to 180 °. Therefore, the substrates can be bonded together by applying a hot melt adhesive heated and melted at about 180 ° to the bonding surface of the substrates and cooling.

  The UV adhesive is an adhesive containing a photopolymerization initiator, an acrylic oligomer, an acrylic monomer, and the like, and a polymer constituting the UV adhesive is radically polymerized by irradiation with UV light. A UV adhesive is applied to the bonding surface of the substrate, and UV light having a wavelength of 150 nm to 410 nm is irradiated from the outside of the substrate while being heated to 40 ° to 80 °. At this time, the acrylic oligomer and the acrylic monomer are polymerized by radicals generated from the photopolymerization initiator to form a polymer, thereby bonding the substrates together.

Patent Document 1 discloses a microfluidic device in which a stencil is sandwiched between a first substrate and a second substrate. A part of the stencil is cut or removed, and the microstructure is formed by bonding the stencil to the first substrate or the second substrate with an adhesive.
Special table 2003-527972 gazette

  However, in the case of using a hot melt adhesive, since the adhesive heated to about 160 ° to 180 ° is used, the entire substrate to which the adhesive is applied becomes high temperature. Therefore, pattern collapse of the flow path and reagent storage part formed in the substrate occurs. In addition, when biological substances or chemical substances are fixed to the flow path, the reagent storage unit, or the like, they are deactivated due to the high temperature of the substrate. Furthermore, the reaction of the biological substance or the chemical substance is hindered by the molten adhesive flowing into the flow path or the reagent storage part. Also in Patent Document 1, an adhesive is used for bonding the substrates, and there is a possibility that the micro structure may be broken or the substance fixed to the microfluidic device may be deactivated due to heat during bonding.

  When using a UV adhesive, the material of the substrate is limited to a material that sufficiently transmits UV light, and the thickness of the substrate is also limited to a thin substrate of about 0.6 mm or less.

  In view of the above, an object of the present invention is to provide a bonding method capable of bonding substrates without being restricted by the thickness of the substrates and without damaging the substrates.

  A first invention of the present application is a method for bonding a first thermoplastic resin substrate and a second thermoplastic resin substrate to solve the above-mentioned problem, wherein the first and second thermoplastic resin substrates are opposed to each other. And a bonding method for bonding the first and second thermoplastic resin substrates by frictionally pressing the contact surfaces.

  When the first and second thermoplastic resin substrates are frictionally pressed, the thermoplastic resin on the contact surface is melted by frictional heat, and the first and second thermoplastic resin substrates are bonded together. Thus, since the substrates are bonded to each other by frictional heat generated on the contact surfaces of the substrates, no heat is applied to the entire first and second thermoplastic resin substrates. Therefore, the collapse and deformation of the substrate due to heat can be prevented. Moreover, since the transmission of energy by friction pressing is not easily limited by the thickness of the substrate, the first and second thermoplastic resin substrates can be formed relatively thick. Therefore, processing such as forming grooves on the substrate surface is easy, and the substrate strength can be increased.

  According to a second invention of the present application, in the first invention, a contact surface between the first thermoplastic resin substrate and the second thermoplastic resin substrate by applying ultrasonic vibration to the first or second thermoplastic resin substrate. Provided is a method of bonding that causes friction.

  By applying and pressing ultrasonic waves to the first and second thermoplastic resin substrates, ultrasonic energy is concentrated on the contact surfaces of the first and second thermoplastic resin substrates, and a large frictional heat is generated. Therefore, the temperature of the thermoplastic resin on the contact surface instantaneously rises and melts, and the first and second thermoplastic resin substrates are bonded together.

  According to a third aspect of the present invention, the first and second thermoplastic resin substrates are opposed to each other via a thermoplastic elastomer layer, the contact surface between the first thermoplastic resin substrate and the thermoplastic elastomer layer, and the second thermoplastic resin. Provided is a bonding method in which the first thermoplastic resin substrate, the second thermoplastic resin substrate, and the thermoplastic elastomer layer are bonded together by frictionally pressing a contact surface between a resin substrate and the thermoplastic elastomer layer.

  By making both the substrates face each other through the thermoplastic elastomer layer as described above, the first thermoplastic resin substrate and the thermoplastic elastomer layer face each other, and the second thermoplastic resin substrate and the thermoplastic elastomer layer face each other. To do. When the two substrates are frictionally pressed in this state, the contact surface between the thermoplastic elastomer layer and the first and second thermoplastic resin substrates is melted by frictional heat. Therefore, the first and second thermoplastic resin substrate thermoplastics can be bonded together via the thermoplastic elastomer layer. Moreover, since the thermoplastic elastomer layer has the property of rubber elasticity as well as thermoplasticity, it can enhance the adhesion between the first and second thermoplastic resin substrates, and can improve water tightness and air tightness. In particular, even when the tip area is large and the frictional pressure is not uniformly applied from the horn 40 to the whole tip, watertightness and airtightness can be maintained, which is preferable.

  A fourth invention of the present application provides the bonding method according to the third invention, wherein the melting point of the thermoplastic resin constituting the first and second thermoplastic resin substrates and the melting point of the thermoplastic elastomer layer are substantially the same. .

  Since the melting point of the thermoplastic resin and the melting point of the thermoplastic elastomer layer are substantially the same, the first and second thermoplastic resins and the thermoplastic elastomer layer melt almost simultaneously. Therefore, the first and second thermoplastic resin substrates and the thermoplastic elastomer layer can be easily bonded.

  A fifth invention of the present application is the third invention, wherein the contact surface between the first thermoplastic resin substrate and the thermoplastic elastomer layer is applied to the first or second thermoplastic resin substrate by applying ultrasonic vibration to the first or second thermoplastic resin substrate. Provided is a bonding method for causing friction on a contact surface between a second thermoplastic resin substrate and the thermoplastic elastomer layer.

  According to a sixth aspect of the present invention, the first thermoplastic resin substrate and the second thermoplastic resin substrate are opposed to each other through the thermoplastic elastomer layer, and the first thermoplastic resin substrate, the thermoplastic elastomer layer, and the second thermoplastic resin are opposed to each other. A bonding method is provided in which a part of a substrate is frictionally pressed with a pin to form a hole from the first thermoplastic resin substrate to the second thermoplastic resin substrate that penetrates the thermoplastic elastomer layer.

  Since the holes are formed by frictional pressure applied by pins, the thermoplastic resin and the thermoplastic elastomer forming the substrate are melted along the sidewalls of the holes by frictional heat. At this time, the molten thermoplastic resin and thermoplastic elastomer form a film along the side wall of the hole. By this film, the first and second thermoplastic resin substrates are bonded together. In addition, since a thermoplastic elastomer having elasticity is interposed between the first and second thermoplastic resin substrates, airtightness and watertightness are maintained even when pinpoint bonding is performed by the formed holes. be able to. Furthermore, when the hole is formed, it is only necessary to frictionally press the portion where the hole is formed, so that the collapse or deformation of the substrate other than the portion where the hole is formed can be prevented. Moreover, the energy of frictional press can be minimized.

  A seventh invention of the present application is the sixth invention, wherein the first thermoplastic resin substrate, the second thermoplastic resin substrate, and the thermoplastic resin are applied to the first or second thermoplastic resin substrate by applying ultrasonic vibration. Provided is a bonding method for generating friction on a contact surface between an elastomer layer and the pin.

  The eighth invention of the present application is a method of forming a chip formed by bonding a first thermoplastic resin substrate and a second thermoplastic resin substrate, wherein a flow path is formed on a main surface of the first thermoplastic resin substrate. A flow path forming step to be formed, a facing step in which the first thermoplastic resin substrate and the second thermoplastic resin substrate are opposed to each other so that a main surface on which the flow path is formed contacts, (2) A chip forming method including a bonding step of bonding the first and second thermoplastic resin substrates by frictionally pressing a contact surface of the thermoplastic resin substrate.

  The first and second thermoplastic resin substrates are frictionally pressed to generate frictional heat on the contact surfaces of the substrates, thereby bonding the substrates to each other. Therefore, heat is not applied to the entire first and second thermoplastic resin substrates. Therefore, it is possible to prevent the channel from collapsing due to heat. Further, the bonding of the two substrates by friction pressing is not easily limited by the thickness of the substrates, and the substrates can be formed relatively thick.

  The ninth invention of the present application provides the chip forming method according to claim 8, further comprising a fixing step of fixing a detection substance for detecting the substance to be measured in the flow channel in the eighth invention.

  Examples of the detection substance include biological substances such as enzymes, proteins, antigens, antibodies, bacteria, yeasts, and microorganisms, and chemical substances. Since the substrates are bonded together by frictional heat generated on the contact surfaces of the first and second thermoplastic resin substrates, heat is not applied to the entire first thermoplastic resin substrate in which the flow path is formed. Therefore, it is possible to prevent the detection substance fixed in the flow path from being deactivated and the reaction between the detection substance and the measurement target substance from being inhibited by heat.

  The tenth invention of the present application includes a first thermoplastic resin substrate having a flow path formed on a main surface, and a second thermoplastic resin substrate facing the first thermoplastic resin substrate so as to cover the flow path. A chip is provided in which the contact surfaces of the first and second thermoplastic resin substrates are bonded to each other by frictionally pressing the first and second thermoplastic resin substrates against each other. The chip has the same effects as the first invention of the present application.

  The eleventh invention of the present application includes a first thermoplastic resin substrate having a flow path formed on a main surface thereof, a thermoplastic elastomer layer facing the first thermoplastic resin substrate so as to cover the flow path, and the first A second thermoplastic resin substrate sandwiching the thermoplastic elastomer layer together with the thermoplastic resin substrate, the first and second thermoplastic resin substrates facing each other through the thermoplastic elastomer layer, and the first thermoplastic resin By frictionally pressing the contact surface between the substrate and the thermoplastic elastomer layer and the contact surface between the second thermoplastic resin substrate and the thermoplastic elastomer layer, the first thermoplastic resin substrate and the second thermoplastic resin Provided is a chip in which a substrate and a thermoplastic elastomer layer are bonded together. The chip of the eleventh invention of the present application has the same effects as the third invention of the present application.

  The twelfth invention of the present application includes a first thermoplastic resin substrate having a flow path formed on a main surface, a thermoplastic elastomer layer facing the first thermoplastic resin substrate so as to cover the flow path, and the first A second thermoplastic resin substrate sandwiching the thermoplastic elastomer layer together with the thermoplastic resin substrate, the first and second thermoplastic resin substrates facing each other through the thermoplastic elastomer layer, and the first thermoplastic resin The second thermoplastic resin substrate that penetrates the thermoplastic elastomer layer from the first thermoplastic resin substrate by frictionally pressing a part of the substrate, the thermoplastic elastomer layer, and the second thermoplastic resin substrate with pins. Provided is a chip in which a hole leading to is formed. The chip of the twelfth invention of the present application has the same effects as the sixth invention of the present application.

  By causing the first and second thermoplastic resin substrates to face each other and frictionally pressing the contact surfaces, frictional heat generated on the contact surfaces is generated. Since the substrates are bonded to each other by frictional heat generated on the contact surface, heat is not applied to the entire first and second thermoplastic resin substrates. Therefore, the collapse and deformation of the substrate due to heat can be prevented. Moreover, since the transmission of energy by friction pressing is not easily limited by the thickness of the substrate, the first and second thermoplastic resin substrates can be formed relatively thick.

<Outline of the invention>
The contact surfaces of the thermoplastic resin substrates, which are thermoplastic resins, are bonded together by friction pressing. At this time, the contact surfaces of the substrates are melted by frictional heat, and the substrates are bonded to each other. Therefore, since heat is not applied to the entire substrate, melting and collapse of the substrate can be prevented.

<First embodiment>
FIG. 1A is a plan view of a chip according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. The chip 100 includes a first thermoplastic resin substrate 10 and a second thermoplastic resin substrate 20 that are made of a thermoplastic resin, and the substrates are bonded to each other. Examples of the thermoplastic resin include polyethylene terephthalate (PET), polyethylene (Polyethylene), polypropylene (Polypropylene), polystyrene (Polystyrenes), polycarbonate (Polycarbonate), PMMA (Poly Methyl Methacrylate), and the like.

  Moreover, the reagent storage part 13 and the flow path 15 are formed by removing a part of main surface of the 1st thermoplastic resin board | substrate 10. FIG. The reagent storage unit 13 stores a reagent used for detecting a measurement target substance that is a measurement target. The flow path 15 is formed with a groove formed in the first thermoplastic resin substrate 10 and a main surface of the second thermoplastic resin substrate 20 as side walls, and the substance to be measured passes therethrough. As shown in FIG. 1A, a gold thin film 17 is formed at the bottom of the flow path 15 at a desired position of the chip 100, and a detection substance 19 for detecting a measurement target substance is fixed on the gold thin film 17. You may do it. Examples of the detection substance 19 and the reagent include enzymes such as peroxidase, cholesterol oxidase, and cholesterol esterase, proteins, antigens, antibodies, biological substances such as bacteria, yeast, and microorganisms, and chemical substances.

  Next, a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 of the chip 100 shown in FIG. 1 will be described with reference to FIG. FIG. 2 is a cross-sectional view illustrating a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 together. The main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the second thermoplastic resin substrate 20 (see FIG. 2A). Then, the horn 40 frictionally presses the first and second thermoplastic resin substrates 10 and 20 facing each other (see FIG. 2B). Here, the frictional press means that the horn 40 is vibrated while applying a force by the horn 40. The frictional pressing is performed, for example, by applying ultrasonic waves to the horn 40 while applying pressure by the horn 40.

  Thus, frictional heat is applied to the contact surfaces 11 of the first and second thermoplastic resin substrates 10 and 20 by frictionally pressing the contact surfaces of the first and second thermoplastic resin substrates 10 and 20 facing each other by the horn 40. Occurs. Since the first and second thermoplastic resin substrates 10 and 20 are thermoplastic resins, their contact surfaces 11 are melted by frictional heat, and the first and second thermoplastic resin substrates 10 and 20 are bonded to each other. More specifically, the contact surface 10 a of the first thermoplastic resin substrate 10 that contacts the second thermoplastic resin substrate 20 and the contact surface 20 a of the second thermoplastic resin substrate 20 that contacts the first thermoplastic resin substrate 10. And melt. At this time, frictional heat is generated on the contact surfaces of the first and second thermoplastic resin substrates 10 and 20, and no heat is applied to the entire first and second thermoplastic resin substrates 10 and 20. Therefore, collapse and deformation of the first and second thermoplastic resin substrates 10 and 20 due to heat can be prevented, and pattern collapse of the reagent storage unit 13 and the flow path 15 formed in the substrate can be prevented.

  In addition, when pressure and ultrasonic waves are applied to the horn 40 as described above and frictional pressure is applied to the first and second thermoplastic resin substrates, ultrasonic energy is applied to the contact surfaces of the first and second thermoplastic resin substrates. Concentrate and generate large frictional heat. Therefore, the temperature of the thermoplastic resin on the contact surface instantaneously rises and melts, and the first and second thermoplastic resin substrates are bonded together. The substrate to which pressure is applied from the horn 40 may be the first thermoplastic resin substrate 10 or the second thermoplastic resin substrate 20.

  The above-described bonding method does not use light transmittance such as UV transparency of the substrate. Moreover, since the transmission of energy by friction pressing is not easily limited by the thickness of the substrate, the first and second thermoplastic resin substrates 10 and 20 can be formed relatively thick. Therefore, it is possible to relatively increase the thickness of the substrate in order to form grooves on the substrate surface such as the reagent storage unit 13 and the flow path 15. Further, by increasing the thickness of the substrate in this way, processing becomes easy and the strength of the substrate can be increased.

  Furthermore, when the detection substance 19 is fixed to the reagent storage unit 13 or the flow path 15, the detection substance 19 is deactivated because heat is not applied to the entire first and second thermoplastic resin substrates 10 and 20. In addition, it is possible to prevent the reaction between the detection substance 19 and the measurement target substance from being inhibited. In addition, it is possible to prevent the reagent storage unit 13 and the side walls of the flow path 15 from melting and inhibiting the reaction of the detection substance 19.

  Although the flow path 15 is formed in the first thermoplastic resin substrate 10 in the above, the flow path may be formed in the second thermoplastic resin substrate 20.

<First embodiment>
The method for bonding the chip 100 according to the first embodiment will be described again with reference to FIG. As the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20, polyethylene terephthalate (PET) having a thickness of 1 mm and a length of 30 mm × width of 30 mm is used. PET has a melting point of 245 ° C. and a tensile modulus of 421 MPa.

  First, as shown in FIG. 2A, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the second thermoplastic resin substrate 20. Next, as shown in FIG. 2B, ultrasonic waves of 50 Ws and 20 kHz are applied for 0.4 seconds from the entire surface of the first thermoplastic resin substrate 10 with a horn 40 under a pressure of 0.1 MPa. . The contact surface between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 is melted by the frictional heat generated at this time, and the substrates are bonded to each other.

<Second Embodiment>
FIG. 3A is a plan view of a chip according to the second embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line BB ′ of FIG. In the chip 150, a thermoplastic elastomer layer 30 formed of a thermoplastic elastomer is sandwiched between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. Other configurations are the same as those of the first embodiment, and thus the description thereof is omitted. Here, the flow path 15 is formed using the grooves formed in the first thermoplastic resin substrate 10 and the thermoplastic elastomer layer 30 as side walls. Examples of the thermoplastic elastomer include polymer materials such as styrene, olefin, vinyl chloride, urethane, ester, and amide.

  Next, a method of bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 through the thermoplastic elastomer layer 30 of the chip 150 shown in FIG. 3 will be described using FIG. FIG. 4 is a cross-sectional view showing a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 with the thermoplastic elastomer layer 30 interposed therebetween. The first and second thermoplastic resin substrates 10 and 20 are opposed to each other so that the thermoplastic elastomer layer 30 is sandwiched between the first and second thermoplastic resin substrates 10 and 20. That is, the first thermoplastic resin substrate 10 and the thermoplastic elastomer layer 30 face each other, and the second thermoplastic resin substrate 20 and the thermoplastic elastomer layer 30 face each other. At this time, the main surface on which the flow path 15 of the first thermoplastic resin substrate 10 is formed is opposed to the thermoplastic elastomer layer 30 (see FIG. 4A). And it friction-presses with the horn 40 from the upper part of the 1st and 2nd thermoplastic resin substrates 10 and 20 which oppose via the thermoplastic elastomer layer 30 (refer FIG.4 (b)).

  Thus, the frictional pressing with the horn 40 causes the contact surfaces 30a and 30b of the thermoplastic elastomer layer 30 in contact with the first and second thermoplastic resin substrates 10 and 20 and the first in contact with the thermoplastic elastomer layer 30. The contact surface 10a of the thermoplastic resin substrate 10 and the contact surface 20a of the second thermoplastic resin substrate 20 that contacts the thermoplastic elastomer layer 30 are melted. Therefore, the first and second thermoplastic resin substrate thermoplastics 10 and 20 can be bonded together via the thermoplastic elastomer layer 30. Moreover, since the thermoplastic elastomer layer 30 has the property of rubber elasticity as well as thermoplasticity, it can enhance the adhesion between the first and second thermoplastic resin substrates 10 and 20 and can improve the water tightness and air tightness. In particular, even when the tip area is large and the frictional pressure is not uniformly applied from the horn 40 to the whole tip, the water tightness and the air tightness can be maintained. Further, as in the first embodiment, it is possible to prevent pattern collapse of the first and second thermoplastic resin substrates 10 and 20, the reagent storage unit 13, the flow path 15, and the like. Moreover, it is hard to receive the restriction | limiting by the thickness of a board | substrate. When the detection substance 19 is fixed, inactivation of the detection substance 19 and inhibition of the reaction of the detection substance 19 can be prevented.

  In the above description, the flow path 15 is formed in the first thermoplastic resin substrate 10, but the flow path 15 and the like may be formed in the second thermoplastic resin substrate 20.

  When the flow path 15 and the like are formed only on the first thermoplastic resin substrate 10, the first thermoplastic resin substrate 10, the second thermoplastic resin substrate 20, and the thermoplastic elastomer layer 30 may be bonded as follows. good. FIG. 5 is a cross-sectional view showing another method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 with the thermoplastic elastomer layer 30 interposed therebetween.

  The second thermoplastic resin substrate 20 and the thermoplastic elastomer layer 30 are opposed to each other. At this time, the adhesive 21 is applied to the opposing surface (see FIG. 5A). Then, the second thermoplastic resin substrate 20 and the thermoplastic elastomer layer 30 are attached by friction pressing from the upper part of the thermoplastic elastomer layer 30 with the horn 40 (see FIG. 5B). Further, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the thermoplastic elastomer layer 30 (see FIG. 5C). And it friction-presses with the horn 40 from the upper part of the 1st thermoplastic resin board | substrate 10 (refer FIG.5 (d)).

  Thus, by frictional pressing with the horn 40, the contact surface of the thermoplastic elastomer layer 30 that contacts the first thermoplastic resin substrate 10, the contact surface of the first thermoplastic resin substrate 10 that contacts the thermoplastic elastomer layer 30. Melts. Therefore, the first thermoplastic resin substrate thermoplastic 10 and the thermoplastic elastomer layer 30 can be bonded together. Further, since the adhesive 21 applied to the contact surface between the second thermoplastic resin substrate 20 and the thermoplastic elastomer layer 30 does not pass through the thermoplastic elastomer layer 30, the adhesive 21 applied to the flow path 15 of the first thermoplastic resin substrate 10. Does not flow.

  6 to 8 show another example of the cross section taken along the line B-B 'of FIG. The cross section of B-B 'can also be formed as shown in FIGS. In FIG. 6, the thermoplastic elastomer layer 30 corresponding to the portion where the flow path 15 of the first thermoplastic resin substrate 10 is formed is removed. In FIG. 7, the flow path 15 is formed across the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20. In FIG. 8, the groove | channel 25 is formed in the 2nd thermoplastic resin substrate 20 corresponding to the part in which the flow path 15 of the 1st thermoplastic resin substrate 10 is formed. A thermoplastic elastomer layer 30 is embedded in the groove 15.

<Second embodiment>
FIG. 9A is a plan view of a biochip related to the biochip 180 according to the second embodiment, and FIG. 9B is a cross-sectional view taken along the line CC ′ of FIG. 9A.

  In the biochip 180, the thermoplastic elastomer layer 30 is sandwiched between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. The first thermoplastic resin substrate 10 is a polyethylene terephthalate (PET) having a thickness of 1.5 mm, a length of 30 mm × a width of 30 mm, and the second thermoplastic resin substrate 20 is a PET having a thickness of 1 mm, a length of 30 mm × width of 30 mm. It is. Here, PET has a melting point of 245 ° C. and a tensile elastic modulus of 421 MPa. The thermoplastic elastomer layer 30 is a polyether thermoplastic elastomer having a thickness of 0.5 mm. The thermoplastic elastomer layer 30 has a melting point of 182 ° C., a tensile elastic modulus of 45 MPa, and a rubber hardness (JIS standard type D) of 40.

  A flow path 15 having a width of 100 μm and a depth of 200 μm is formed on the main surface of the first thermoplastic resin substrate 10. In addition, inflow ports 181 and 183 and an outflow port 185 that lead through the first thermoplastic resin substrate 10 and are connected to the flow path 15 to guide the substance to be measured inside and outside the biochip are formed. A 2-methacryloyloxyethylphorylcholine (MPC) polymer is formed on the surface of the flow path 15 as the biocompatible film 13 in order to prevent the measurement target substance introduced into the biochip 180 from adsorbing into the flow path wall. Has been. Further, as shown in FIG. 9B, a gold thin film 17 is formed at a desired position of the flow path 15, and the detection substance 19 is immobilized on the gold thin film 17. For example, an antibody that binds to a specific antigen is immobilized. The antibody is fixed to the gold thin film 17 via an alkyl group having a carboxyl group or an amino group at one end and a thiol group at the other end.

  Next, a method for attaching the biochip 180 shown in FIG. 9 will be described with reference to FIG. FIG. 10 is a cross-sectional view showing a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 with the thermoplastic elastomer layer 30 interposed therebetween.

  Prior to bonding the substrates, the gold thin film 17 and the detection substance 19 are fixed at desired positions in the flow path. By immobilizing the antibody that is the detection substance 19 before bonding, the antibody can be immobilized reliably and easily. Next, the first and second thermoplastic resin substrates 10 and 20 are opposed to each other so that the thermoplastic elastomer layer 30 is sandwiched between the first and second thermoplastic resin substrates 10 and 20. At this time, the main surface on which the flow path 15 of the first thermoplastic resin substrate 10 is formed is opposed to the thermoplastic elastomer layer 30 (see FIG. 10A). Then, an ultrasonic wave of 80 Ws and 20 kHz is applied from the upper part of the first and second thermoplastic resin substrates 10 and 20 facing each other through the thermoplastic elastomer layer 30 by a horn 40 under a pressure of 0.1 MPa. Apply for 4 seconds. (See FIG. 10 (b)).

  Thereafter, the MPC polymer solution is poured from the inlets 181 and 183 and the outlet 185, and the MPC polymer is formed on the inner wall of the channel 15 to complete the biochip 180.

  As described above, by frictional pressing with the horn 40, the contact surfaces of the first thermoplastic resin substrate 10, the second thermoplastic resin substrate 20, and the thermoplastic elastomer layer 30 are melted and bonded together. In particular, since the melting points of the first and second thermoplastic resin substrates 10 and 20 and the melting point of the thermoplastic elastomer layer 30 are substantially equal, they are melted at the same time and securely bonded together.

  A fluorescently labeled antigen is introduced into the channel 15 of the completed biochip 180 as a substance to be measured from the inflow ports 181 and 183. Here, in the case where an antibody that is already immobilized as the detection substance 19 reacts with an antigen, fluorescence is developed when light is irradiated from the outside of the biochip 180. Therefore, the presence of a specific antigen can be detected and measured.

<Third Embodiment>
FIG. 11A is a plan view of a chip according to a third embodiment of the present invention, and FIG. 11B is a cross-sectional view taken along the line DD ′ of FIG. In the chip 200, the thermoplastic elastomer layer 30 is sandwiched between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. The chip 200 has one or more holes 50, and the first thermoplastic resin substrate 10, the second thermoplastic resin substrate 20, and the thermoplastic elastomer are formed by an adhesive film 55 formed along the side wall of the hole 50. The layer 30 is bonded.

  Next, a method of bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 through the thermoplastic elastomer layer 30 of the chip 200 shown in FIG. 11 will be described using FIG. FIG. 12 is a cross-sectional view showing a method for bonding the chip 200 having the hole 50 in which the adhesive film 55 is formed. The first and second thermoplastic resin substrates 10 and 20 are opposed to each other so that the thermoplastic elastomer layer 30 is sandwiched between the first and second thermoplastic resin substrates 10 and 20. At this time, the main surface on which the flow path 15 of the first thermoplastic resin substrate 10 is formed is opposed to the thermoplastic elastomer layer 30 (see FIG. 12A). And from the upper part of the 1st and 2nd thermoplastic resin board | substrates 10 and 20 which oppose through the thermoplastic elastomer layer 30, it frictionally presses with the horn 45 which has the pin 60 which protrudes from the bottom face (FIG. 12 (b)).

  Thus, when the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20 are frictionally pressed by the pins 60 formed on the bottom surface of the horn 45, as shown in FIG. The pin 60 is inserted. Therefore, a hole 50 is formed from the first thermoplastic resin substrate 10 through the thermoplastic elastomer layer 30 to the second thermoplastic resin substrate 20. At this time, the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20 that are in contact with the pin 60 are melted by the frictional pressure applied by the pin 60, and are continuous along the hole 50. An adhesive film 55 is formed. The adhesive film 55 bonds the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20 in the hole 50 in which the adhesive film 55 is formed. The adhesive film 55 of the holes 50 as described above is formed by partially pressing the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20 with the pins 60. Therefore, collapse and deformation of the substrate other than the portion where the hole 50 is formed can be prevented. In addition, since not a whole substrate but a part of the substrate is frictionally pressed by the pin 60, the energy of the frictional pressing can be minimized. In addition, since the elastic thermoplastic elastomer layer 30 is interposed between the first and second thermoplastic resin substrates 10 and 20, even if pinpoint bonding is performed by the holes 50, airtightness and watertightness are achieved. Can keep sex.

  In addition, when forming the several hole 50 and the adhesive film 55, you may apply the pin 60 simultaneously and may friction-press, or you may friction-press one place at a time. When the hole 50 having the adhesive film 55 is formed by friction pressing simultaneously at a plurality of locations, the chip production efficiency per unit time is improved.

<Third embodiment>
The method for bonding the chip 100 according to the third embodiment will be described again with reference to FIG. As the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20, PET having a thickness of 1 mm and a length of 30 mm × width of 30 mm is used.

  First, as shown in FIG. 12A, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the second thermoplastic resin substrate 20. Next, as shown in FIG. 12B, the first thermoplastic resin substrate 10, the thermoplastic elastomer layer 30, and the second thermoplastic resin substrate 20 with which the pins 60 abut are brought together by the horn 45 provided with the pins 60. 30 Ws and 20 kHz ultrasonic waves are applied for 0.2 seconds under a pressure of 0.1 MPa. At this time, the contact surfaces of the pins 60, the first thermoplastic resin substrate 10, the second thermoplastic resin substrate 20, and the thermoplastic elastomer layer 30 are melted by frictional heat to form an adhesive film 55, and the substrates are bonded together. The

<Example of Fourth Embodiment>
FIG. 13A is a plan view of a chip 300 according to the fourth embodiment of the present invention, and FIG. 13B is a cross-sectional view taken along line EE ′ of FIG.

  In the chip 300, the thermoplastic elastomer layer 30 is sandwiched between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. The main surface of the first thermoplastic resin substrate 10 includes a first opening 80a, a second opening 80b, a first flow path 70 and a second opening that connect the first opening 80a and the second opening 80b. A second flow path 75 that connects 80b and the outside of the chip 300 is provided. Further, the second thermoplastic resin substrate 20 is provided with a third flow path 90 to which a pressure to the outside or the inside of the chip 300 is applied. As shown in FIG. 13B, the portion where the third flow path 90 opens in the main surface of the second thermoplastic resin substrate 20 corresponds to the second flow path 70 of the first thermoplastic resin substrate 10. .

  The chip 300 is bonded to the contact surface of the first thermoplastic resin substrate 10, the second thermoplastic resin substrate 20, and the thermoplastic elastomer layer 30 due to frictional pressure as in the second embodiment. Done. Therefore, pattern collapse of the first and second openings 80a and 80b, the first, second, and third flow paths 70, 75, and 90 can be prevented. Moreover, since the thermoplastic elastomer layer 30 has the property of rubber elasticity as well as thermoplasticity, the adhesiveness of the first and second thermoplastic resin substrates 10 and 20 can be improved, and water tightness and air tightness can be improved.

  14A and 14B are explanatory diagrams for explaining the movement of the chip 300 to which pressure from the outside to the inside of the chip 300 is applied, and FIG. 14C is a view for applying pressure from the inside of the chip 300 to the outside. It is explanatory drawing explaining the motion of the chip | tip 300 to be performed. As shown in FIG. 14A, when pressure is applied to the third channel 90 from the outside to the inside of the chip 300, the heat of the portion of the third channel 90 that opens on the main surface of the second thermoplastic resin substrate 20 The plastic elastomer layer 30 is subjected to pressure. At this time, the thermoplastic elastomer layer 30 expands so that the passage of the first flow path 70 connecting the first opening 80a and the second opening 80b becomes narrow. Therefore, the fluid in the first and second openings 80a and 80b is led out of the chip 300 via the second flow path 75 (see FIG. 14A). Next, when pressure from the outside to the inside of the chip 300 is further applied to the third channel 90, the thermoplastic elastomer layer 30 expands so as to block the first channel 70. Therefore, the fluid flow between the first opening 80a and the second opening 80b stops (see FIG. 14B).

  Next, as shown in FIG. 14C, when a pressure from the inside of the chip 300 to the outside is applied to the third flow path 90, the thermoplastic elastomer layer 30 is pulled toward the second thermoplastic resin substrate 20. Stretch like so. Therefore, for example, the fluid is taken into the chip 300 through the second flow path 75. Thus, the thermoplastic elastomer layer 30 having rubber elasticity can be used as a valve or a pump for opening and closing the first opening 80a and the second opening 80b.

  The thermoplastic resin substrate bonded by using the present invention can prevent the substrate from collapsing or deforming due to heat, and is not easily limited by the thickness of the substrate. Therefore, it can be applied to biochips and microchemical chips where channels, reagent storages, etc. are formed inside the substrate to measure biological materials and chemicals such as DNA, enzymes, proteins, antigens, retreats, viruses and cells. Is possible.

(A) The top view of the chip | tip concerning the example of 1st Embodiment of this invention. (B) Sectional drawing in the A-A 'line of Fig.1 (a). (A) Sectional drawing (1) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20. FIG. (B) Sectional drawing (2) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20. FIG. (A) The top view of the chip | tip concerning the example of 2nd Embodiment of this invention. (B) Sectional drawing in the B-B 'line of Fig.3 (a). (A) Sectional drawing (1) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 through the thermoplastic elastomer layer 30 of the chip | tip 150 shown in FIG. (B) Sectional drawing (2) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 through the thermoplastic elastomer layer 30 of the chip | tip 150 shown in FIG. (A) Sectional drawing (1) which shows another bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 through the thermoplastic elastomer layer 30. FIG. (B) Sectional drawing (2) which shows another bonding method of the 1st thermoplastic resin substrate 10 and the 2nd thermoplastic resin substrate 20 through the thermoplastic elastomer layer 30. FIG. (C) Sectional drawing (3) which shows another bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 through the thermoplastic elastomer layer 30. FIG. (D) Sectional drawing (4) which shows another bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 through the thermoplastic elastomer layer 30. FIG. Another example (1) of the cross section of B-B 'of Fig.3 (a). Another example (2) of the cross section of B-B 'of Fig.3 (a). Another example (3) of the cross section of B-B 'of Fig.3 (a). (A) The top view of the biochip which concerns on the biochip 180 which concerns on 2nd Example. FIG. 9B is a cross-sectional view taken along line C-C ′ in FIG. (A) The biochip 180 bonding method (1) shown in FIG. (B) The biochip 180 bonding method (2) shown in FIG. (A) The top view of the chip | tip concerning the example of 3rd Embodiment of this invention. (B) Sectional drawing in the D-D 'line | wire of Fig.11 (a). (A) Sectional drawing (1) which shows the bonding method of the chip | tip 200 which has the hole 50 in which the adhesive film 55 was formed. (B) Sectional drawing (2) which shows the bonding method of the chip | tip 200 which has the hole 50 in which the adhesive film 55 was formed. (A) The top view of the chip | tip 300 which concerns on the example of 4th Embodiment of this invention. FIG. 13B is a sectional view taken along line E-E ′ in FIG. (A) Explanatory drawing (1) explaining the motion of the chip | tip 300 to which the pressure from the exterior to the inside of the chip | tip 300 is applied. (B) Explanatory drawing (2) explaining the motion of the chip | tip 300 to which the pressure from the exterior to the inside of the chip | tip 300 is applied. (C) Explanatory drawing explaining the motion of the chip | tip 300 to which the pressure from the inside of the chip | tip 300 to the outside is applied.

Explanation of symbols

10: first thermoplastic resin substrate 15: flow path 17: gold thin film 19: sensing substance 20: second thermoplastic resin substrate 30: thermoplastic elastomer layer 40, 45: horn 60: pin

Claims (12)

A method for bonding a first thermoplastic resin substrate and a second thermoplastic resin substrate,
A bonding method in which the first and second thermoplastic resin substrates are bonded to each other by causing the first and second thermoplastic resin substrates to face each other and frictionally pressing the contact surfaces.   2. The friction is generated on the contact surface between the first thermoplastic resin substrate and the second thermoplastic resin substrate by applying ultrasonic vibration to the first or second thermoplastic resin substrate. Method of pasting.   The first and second thermoplastic resin substrates are opposed to each other through a thermoplastic elastomer layer, a contact surface between the first thermoplastic resin substrate and the thermoplastic elastomer layer, and the second thermoplastic resin substrate and the thermoplastic resin. A bonding method in which the first thermoplastic resin substrate, the second thermoplastic resin substrate, and the thermoplastic elastomer layer are bonded together by frictionally pressing a contact surface with the elastomer layer.   The bonding method according to claim 3, wherein a melting point of the thermoplastic resin constituting the first and second thermoplastic resin substrates is substantially the same as a melting point of the thermoplastic elastomer layer.   By applying ultrasonic vibration to the first or second thermoplastic resin substrate, the contact surface between the first thermoplastic resin substrate and the thermoplastic elastomer layer, and the second thermoplastic resin substrate and the thermoplastic elastomer. The bonding method according to claim 3, wherein friction is generated on a contact surface with the layer.   The first thermoplastic resin substrate and the second thermoplastic resin substrate are opposed to each other through the thermoplastic elastomer layer, and the first thermoplastic resin substrate, the thermoplastic elastomer layer, and a part of the second thermoplastic resin substrate are pinned. The bonding method of forming the hole from the said 1st thermoplastic resin substrate to the said 2nd thermoplastic resin substrate which penetrates the said thermoplastic elastomer layer by friction-pressing by.   By applying ultrasonic vibration to the first or second thermoplastic resin substrate, friction is caused on the contact surfaces of the first thermoplastic resin substrate, the second thermoplastic resin substrate, the thermoplastic elastomer layer, and the pins. The bonding method according to claim 6, which is generated. A method for forming a chip formed by bonding a first thermoplastic resin substrate and a second thermoplastic resin substrate,
A flow path forming step for forming a flow path on a main surface of the first thermoplastic resin substrate;
An opposing step of opposing the first thermoplastic resin substrate and the second thermoplastic resin substrate so that the main surface on which the flow path is formed is in contact;
A bonding step of bonding the first and second thermoplastic resin substrates by frictionally pressing the contact surfaces of the first and second thermoplastic resin substrates;
A method of forming a chip including:   The chip formation method according to claim 8, further comprising a fixing step of fixing a detection substance for detecting the measurement target substance in the flow path. A first thermoplastic resin substrate having a flow path formed on the main surface;
A second thermoplastic resin substrate facing the first thermoplastic resin substrate so as to cover the flow path,
A chip in which the contact surfaces of the first and second thermoplastic resin substrates are bonded together by friction-pressing the first and second thermoplastic resin substrates against each other. A first thermoplastic resin substrate having a flow path formed on the main surface;
A thermoplastic elastomer layer facing the first thermoplastic resin substrate so as to cover the flow path;
A second thermoplastic resin substrate sandwiching the thermoplastic elastomer layer together with the first thermoplastic resin substrate,
The first and second thermoplastic resin substrates are opposed to each other through the thermoplastic elastomer layer, the contact surface between the first thermoplastic resin substrate and the thermoplastic elastomer layer, the second thermoplastic resin substrate, and the heat. A chip in which the first thermoplastic resin substrate, the second thermoplastic resin substrate, and the thermoplastic elastomer layer are bonded to each other by frictionally pressing a contact surface with the plastic elastomer layer. A first thermoplastic resin substrate having a flow path formed on the main surface;
A thermoplastic elastomer layer facing the first thermoplastic resin substrate so as to cover the flow path;
A second thermoplastic resin substrate sandwiching the thermoplastic elastomer layer together with the first thermoplastic resin substrate,
The first and second thermoplastic resin substrates are opposed to each other through the thermoplastic elastomer layer, and the first thermoplastic resin substrate, the thermoplastic elastomer layer, and a part of the second thermoplastic resin substrate are rubbed with pins. The chip | tip in which the hole from the said 1st thermoplastic resin substrate to the said 2nd thermoplastic resin substrate which penetrates the said thermoplastic elastomer layer is formed by pressing.

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