JP2006074291A - Manufacturing method of electronic device - Google Patents

Abstract

An electronic device capable of improving productivity by simplifying an assembling process is provided.
A method of manufacturing an electronic device according to the present invention includes a step A of preparing a mother board having a plurality of substrate areas arranged in a matrix and mounting an electronic component element on each board area of the mother board. And a step B of placing and bonding a case member having an annular side wall portion standing on the outer peripheral portion for sealing the electronic component element on the substrate region, and the case member placed on each substrate region of the mother substrate. And a step C of simultaneously obtaining a plurality of electronic devices by collectively cutting the outer periphery of the case member.
[Selection] Figure 2

Description

  The present invention relates to an electronic device such as a crystal resonator used in an electronic device such as a portable communication device or an electronic computer.

Conventionally, crystal resonators have been used in electronic devices such as portable communication devices and electronic computers.
As such a conventional crystal resonator, for example, as shown in FIG. 6, a pair of electrodes that are electrically connected to the upper surface of an insulating base 21 provided with a pair of connection pads via a conductive adhesive. A crystal resonator element 25 having a plurality of vibration electrodes and a seal ring 26 surrounding the crystal resonator element 25 are attached, and a metal lid 27 is joined to the upper portion of the seal ring 26 by seam welding or the like. Accordingly, there is known a structure in which the mounting region of the crystal resonator element 25 is hermetically sealed (see, for example, Patent Document 1). The crystal resonator is connected via an input / output terminal provided on the lower surface of the insulating base 21. When a fluctuation voltage from the outside is applied between the vibrating electrodes of the quartz vibrating element 25, thickness shear vibration is caused at a predetermined frequency according to the characteristics of the quartz vibrating element 25, and the resonance Reference signal having a predetermined frequency is oscillated and output by the external oscillation circuit based on the wave number. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

  Further, the above-described insulating base 21 of the crystal resonator is formed by a multi-cavity technique in which a large mother substrate from which a plurality of insulating bases 21 can be cut is obtained to obtain individual pieces. Then, the quartz resonator element 25 and the seal ring 26 are attached to the obtained piece (insulating base member 21), and the lid 27 is joined to the upper portion of the seal ring 26, whereby the crystal resonator is manufactured.

The lid 27 of the crystal resonator element described above is also generally obtained by dividing a large metal plate from which a plurality of lids 27 can be cut out, like the insulating base 21. During use, external noise is shielded by holding the lid 27 at the ground potential. Such a lid 27 is electrically connected to the ground terminal on the lower surface of the insulating base 21 via the seal ring 26 and the conductor pattern of the insulating base 21.
JP 2001-274649 A JP 2001-028517 A

  However, in the above-described conventional crystal resonator, it is necessary to obtain an insulating base 21 by dividing a large mother substrate prior to its assembly, and the insulating substrates 21 are obtained in separate dividing steps. As a result, the assembling process of the crystal unit becomes complicated, and there is a disadvantage that the productivity is not improved.

Further, as described above, when assembling the crystal resonator after the insulating base 21 and the lid 27 are prepared in advance, it is necessary to perform a work for holding the plurality of insulating bases 21 individually on the carrier. However, there is a drawback that the assembly process of the crystal resonator becomes complicated.
The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide an electronic device that can simplify an assembly process and improve productivity.

Preparing a mother board having a plurality of substrate areas arranged in a matrix and mounting electronic component elements on each board area of the mother board; and
A step B of mounting and joining a case member in which an annular side wall portion is erected on an outer peripheral portion for sealing the electronic component element to the substrate region;
And a step C of simultaneously obtaining a plurality of electronic devices by collectively cutting the outer peripheral portion of the case member placed on each substrate region of the mother board.

The electronic device manufacturing method of the present invention is characterized in that the electronic component element is a crystal resonator element.
Furthermore, in the manufacturing method of the electronic device according to the present invention, in the step B, the protrusion formed on the case member is fitted to the recess of the outer peripheral wall portion in the substrate region of the mother board. The location is temporarily fixed.

  Still further, in the method of manufacturing an electronic device according to the present invention, in the step C, the cut portion of the mother substrate is collectively cut inside the outer peripheral wall portion in the substrate region, and after cutting, the case member is cut. At least one convex portion is cut out.

  According to the method for manufacturing an electronic device of the present invention, first, a mother board on which electronic component elements are mounted in each board area and a member corresponding to the board area of the mother board are prepared, and the annular side wall portion stands. Place the case member on the mother board so that the electronic component element is sealed, and then join the case member, and then, the case member mounting location joined to each substrate region of the mother board In order to obtain a plurality of electronic devices at the same time by collectively cutting along the outer peripheral portion of the substrate, it is not necessary to divide the substrate into individual pieces prior to assembly of the electronic device, The substrate can be cut by batch division.

In addition, in this case, when the electronic device is assembled, the mother board itself functions as a carrier, so that a complicated operation of individually holding the pieces divided from the mother board on the carrier becomes unnecessary.
As a result, the assembly process of the electronic device is greatly simplified, and the productivity of the electronic device can be improved.

  According to the electronic device manufacturing method of the present invention, the positioning of the substrate region and the case member is performed by fitting at least one convex portion formed on the case member and a recess in the outer peripheral wall portion of the substrate region. And after joining a fitting location temporarily, it joins by heat-processing. If the substrate region of the mother substrate is cut in a lump and, after cutting, at least one convex portion of the case member is cut off, the case member is displaced, so that hermetic sealing cannot be performed. To prevent problems such as leakage failure.

  Further, according to the method for manufacturing an electronic device of the present invention, the cut portion of the mother substrate is collectively cut inside the outer peripheral wall portion formed in the substrate region, and the positioning of the substrate region and the case member is performed as described above. A plurality of convex portions formed on the case member and a dent in the outer peripheral wall portion of the substrate region corresponding to the convex portion are fitted, and after cutting, at least one convex portion of the case member is cut off. As a result, the dicer is less likely to come into contact with the bonding material when the mother substrate is cut, so that it is possible to effectively prevent defects such as cracks in the bonding material due to contact with the dicer.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view of a crystal resonator obtained when the manufacturing method of the present invention is applied to the manufacture of a crystal resonator. The crystal resonator shown in FIG. It is composed of a crystal resonator element 5 as a component element and a case member 8.

  The insulating substrate 1 is made of, for example, a ceramic material such as glass-ceramic or alumina ceramic, and a pair of connection pads 2 and a bonding conductor layer 4 surrounding the periphery are provided on the upper surface side. In addition, external terminals 3 such as an input terminal, an output terminal, and a ground terminal are provided on the lower surface side.

  A pair of connection pads 2 provided on the upper surface side of the insulating base 1 are electrically connected to a vibration electrode 6 of a crystal resonator element 5 described later on the upper surface side via a conductive adhesive, and on the lower surface side. It is electrically connected to an input / output terminal (input terminal, output terminal) on the lower surface of the insulating substrate via the conductor layer 4 on the insulating substrate 1 and via conductors inside the insulating substrate.

On the other hand, the conductor layer 4 is electrically connected to a case member 8 (described later) via a bonding material 9 on the upper surface side, and is connected to a ground terminal on the lower surface of the insulating substrate via a via conductor or the like inside the insulating substrate on the lower surface side. Electrically connected.
The conductor layer 4 is for joining a case member 8 to be described later to the upper surface of the container body 1 via the joining material 6, and the conductor layer 4 is a base layer made of W or Mo as described above. The structure is such that a Ni layer and an Au layer are sequentially deposited on the surface.

The external terminal described above is electrically connected to the circuit wiring of the external electric circuit via a conductive adhesive such as solder when the crystal resonator is mounted on an external electric circuit such as a mother board. Yes.
In addition, a crystal resonator element 5 is mounted on the upper surface side of the insulating base 1 described above.
The quartz resonator element 5 is formed by attaching and forming a pair of vibrating electrodes 6 on both main surfaces of a quartz piece cut along a predetermined crystal axis, and a fluctuation voltage from the outside passes through the pair of vibrating electrodes 6 and the quartz piece. When applied to, thickness shear vibration occurs at a predetermined frequency.

Such a quartz-crystal vibrating element 5 electrically and mechanically connects the vibrating electrode 6 attached to both main surfaces thereof and the corresponding connection pad 2 on the upper surface of the insulating base via the conductive adhesive 7. Thus, the insulating substrate 1 is mounted on the upper surface side.
The side wall of the case member 8 is bent outward along the exposed surface of the insulating base 1, and the case member 8 and the insulating base 1 are brazed across the bent portion. The area of the joint portion increases, the joint strength between the case member 8 and the insulating substrate 1 is improved, and the airtightness is also improved.

  The case member 8 is for accommodating the quartz vibrating element 5 in the region of the insulating base 1 and hermetically sealing it, and is electrically connected to the ground terminal on the lower surface of the insulating base via the conductor layer 4 described above. Connected. Therefore, when the crystal resonator is used, the case member 8 is held at the ground potential, and the crystal vibration element 5 is well protected from unnecessary external electrical action such as noise due to the shielding effect of the case member 8. Is done.

  Thus, the crystal resonator described above applies a variable voltage from the outside between the vibration electrodes 6-6 of the crystal resonator element 5 via the input / output terminal provided on the lower surface of the insulating base 1. A thickness-shear vibration is caused at a predetermined frequency according to the function of the crystal resonator, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency of the crystal resonator. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

Next, a manufacturing method of the above-described crystal resonator will be described with reference to FIG.
(Process A)
First, as shown in FIG. 2A, a mother substrate 14 having a plurality of substrate regions arranged in a matrix is prepared, and the crystal resonator element 5 is mounted on each substrate region of the mother substrate 14.
The mother substrate 14 includes, for example, three layers of rectangular flat plate substrates made of a ceramic material such as glass-ceramic and alumina ceramic, and further a matrix shape made of a ceramic material, that is, vertical m columns × horizontal n rows ( m and n are natural numbers of 2 or more.) Each substrate is formed by laminating a plurality of substrates having a plurality of rectangular holes arranged in a matrix and having the holes arranged in a matrix at the center. In the region, a pair of connection pads 2 on the bottom surface of the cavity portion and a bonding conductor layer 4 surrounding the periphery of the opening are deposited and formed on the upper surface side, and external terminals 3 such as input / output terminals and ground terminals are formed on the lower surface side. Deposited and formed.

Such a mother substrate 14 is formed, for example, on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent or the like to a ceramic material powder made of alumina ceramic or the like, and the connection pads 2, external terminals 3, conductor patterns, etc. The conductor paste is printed and applied in a predetermined pattern, and a plurality of the pastes are stacked, press-molded, and then fired at a high temperature.
Further, one crystal resonator element 5 is mounted on each substrate region of the obtained mother substrate 14, and the vibration electrode 6 of the crystal resonator element 5 and the mounting pad 2 on the upper surface of the mother substrate are interposed via the conductive adhesive 7. Connected electrically and mechanically.
In the present embodiment, as shown in FIG. 2, a predetermined spare area is provided between the substrate areas arranged in a matrix.

(Process B)
Next, as shown in FIG. 2B, the case member 8 corresponding to the substrate region of the mother substrate 14 is placed in a one-to-one manner so that the crystal resonator element 5 mounted on the substrate region is sealed. Place on the mother board 14.
An outer peripheral wall portion 13 is provided in the substrate region, and a convex portion 10 is formed on the case member 8. The convex part 10 of the said case member 8 and the dent 12 of the said outer peripheral wall part 13 are fitted, and a temporary stop is performed using a laser, an ultrasonic wave, etc.
The case member 8 is manufactured by processing a metal plate having a thickness of 60 μm to 100 μm made of metal such as 42 alloy, Kovar, or phosphor bronze into a predetermined shape by a conventionally known sheet metal processing.

A bonding material 9 made of a nickel (Ni) layer and a gold tin (Au—Sn) layer is formed on the lower surface of the case member 8. The bonding material 9 functions as a brazing material layer for bonding the case member 8 to the insulating base 1, and the composition ratio of gold tin is set to, for example, 80% gold and 20% tin, The thickness is set to 10 μm to 30 μm, for example.

Such a case member 8 is placed on the mother substrate 14 such that the crystal resonator elements 5 of the substrate region corresponding to the inside of each cover region 11 are arranged, and thereafter, this is, for example, 300 ° C. to The case member 8 is joined to the mother board 14 by placing in a heating furnace maintained at a temperature of 350 ° C. and heating and melting the joining material 9 at a high temperature. Thereafter, the integrated mother board 14 and case member 8 are gradually cooled to room temperature.
The series of bonding steps described above is preferably performed in an inert gas atmosphere such as nitrogen gas or argon gas, or in a vacuum atmosphere, whereby an inert gas is contained in the space in which the crystal resonator element 5 is accommodated. Since it is filled, it is possible to effectively prevent the quartz resonator element 5 from being corroded and deteriorated by oxygen, moisture in the atmosphere, or the like.

(Process C)
Finally, as shown in FIG. 2C, the cut portions of the mother substrate 14 integrated in the step B are collectively cut at the outer peripheral wall portion of the substrate region, and after cutting, at least one of the case members 8 is cut. The convex part 10 of the location is excised. Therefore, the dicer is less likely to come into contact with the bonding material when the mother substrate 14 is cut, thereby effectively preventing a defect such as a crack from occurring in the bonding material due to the contact with the dicer.

The mother substrate 14 is cut by, for example, collectively cutting the mother substrate 14 from the mother substrate side using a dicer or the like, whereby a plurality of crystal resonators are obtained simultaneously.
In addition, in this case, since the mother board itself functions as a carrier when assembling the crystal unit, there is no need for complicated operations such as individually holding pieces divided from the mother board 14 on the carrier. Become.

As a result, the assembly process of the crystal unit is greatly simplified, and the productivity of the crystal unit can be improved.
In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
Further, in the step C of the above-described embodiment, as shown in FIG. 2B, if the bonding material 9 for bonding both is not present at the cut portion of the mother substrate 14, the mother substrate 14 and the case member 8 are removed. The dicer rarely comes into contact with the bonding material 9 at the time of cutting, so that it is possible to effectively prevent defects such as cracks in the bonding material 9 due to the contact with the dicer, and deterioration of the sealing performance. Therefore, it is preferable that the bonding material 9 for bonding the mother substrate and the case member 8 does not exist at the cut portion of the mother substrate 14 in the process C.

Further, in the above-described embodiment, the spare area is provided between the substrate areas of the mother board 14, but the board areas may be arranged close to each other without providing a spare area therebetween. . The same applies to the case member 8.
Furthermore, in the above-described embodiment, the crystal resonator is configured by using a crystal resonator element as an electronic component element. However, other electronic devices, for example, an IC element or other piezoelectric element as an electronic component element are used. The present invention can also be applied to an electronic apparatus using the above.
In addition, although the case member 8 described in this specification is drawn by reverse concave shape, even if the case shape is flat, it can be applied with the idea intended by the present invention.

It is a disassembled perspective view of the crystal oscillator (electronic device) manufactured with the manufacturing method of this invention. (A) thru | or (c) is a perspective view for demonstrating the manufacturing method concerning one Embodiment of this invention. It is sectional drawing of the crystal oscillator (electronic device) manufactured with the conventional manufacturing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Connection pad 3 ... External terminal 4 ... Conductor layer 5 ... Crystal oscillation element (electronic component element)
DESCRIPTION OF SYMBOLS 6 ... Vibrating electrode 7 ... Conductive adhesive 8 ... Cover member 9 ... Bonding material 10 ... Convex part 11 ... Cover area | region 12 ... Indentation 13 ... Outer peripheral wall part 14 ... Mother board

Claims (4)

Preparing a mother board having a plurality of substrate areas arranged in a matrix, and mounting an electronic component element on each board area of the mother board; and
A step B of mounting and joining a case member in which an annular side wall portion is erected on an outer peripheral portion for sealing the electronic component element to the substrate region;
And a step C of simultaneously obtaining a plurality of electronic devices by collectively cutting the outer peripheral portion of the case member placed on each substrate region of the mother substrate. The method of manufacturing an electronic device according to claim 1, wherein the electronic component element is a crystal resonator element. In the step B, the projecting portion formed on the case member temporarily fits the fitting portion after fitting the recess of the outer peripheral wall portion in the substrate region of the mother board. An electronic device manufacturing method according to claim 1 or 2. The step C is characterized in that, in the step C, the cut portion of the mother substrate is collectively cut by an outer peripheral wall portion in the substrate region, and after the cutting, at least one convex portion of the case member is cut off. A method for manufacturing an electronic device according to claim 1.

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