JP2006066729A

JP2006066729A - Circuit board module and manufacturing method thereof

Info

Publication number: JP2006066729A
Application number: JP2004249037A
Authority: JP
Inventors: Eiichi Harada; 栄一原田
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 2004-08-27
Filing date: 2004-08-27
Publication date: 2006-03-09

Abstract

PROBLEM TO BE SOLVED: To improve reliability and productivity of a circuit board module by reducing heat stress in the case of separating electrically connected circuit boards in the case of adding an electronic part, according to a consistency inspection result in the circuit board module for fixing the circuit modules with each other while connecting the plurality of circuit boards electrically. SOLUTION: The circuit board module comprises a printed board (first printed wiring board) 1 provided with terminals 1A and 1B (first terminal); a printed board (second printed wiring board) 2 provided with terminals 2A and 2B (second terminal) respectively corresponding to the terminals 1A and 1B; a conductive member (elastic member) 3 for electrically connecting the terminal 1A and a terminal 2A, and the terminal 1B and the terminal 2B; and an adhesive tape (fixing material) 4 for fixing the printed board 1 and the printed board 2. COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、２枚の印刷配線基板を電気的に接続するとともに、この２枚の印刷配線基板を接合してひとまとめにした回路基板モジュールと、その製造方法に関する。 The present invention relates to a circuit board module in which two printed wiring boards are electrically connected, and the two printed wiring boards are joined together to form a manufacturing method thereof.

多くの電子機器には、電気的に接続される複数の回路基板が搭載されている。この複数の回路基板は、適切な整合（マッチング）が得られた電気的な接続により、特定の機能を達成することができる。このため、回路同士を電気的に接続した後、整合性の検査をし、整合が得られていない場合は、抵抗・コンデンサ・インダクタンス等の電子部品がさらに追加されることにより、適当な整合を得ることができる。 Many electronic devices are equipped with a plurality of circuit boards that are electrically connected. The plurality of circuit boards can achieve a specific function by electrical connection with appropriate matching. For this reason, after the circuits are electrically connected to each other, the matching is inspected. If matching is not achieved, electronic components such as resistors, capacitors, and inductances are further added to achieve appropriate matching. Obtainable.

例えば、高密度相互接続構造物自体やこれに実装された電子部品に欠陥があることが判明した場合、この構造物の補修を可能とする剥離層を積層部分に備える高密度相互接続構造物が知られている。この補修のため、高密度相互接続構造物を分解しなければならない場合、Ｔ_ｑ１（ガラス転移温度）よりも高い温度に加熱することにより、この構造物の積層物の積層部分を基板および電子部品から剥離することが開示されている（特許文献１）。
特許第３２４６６６７号（段落、図３）特開平５−６７８６９号（段落、図９）特開２００１−３５２１７６（段落、図１） For example, when it is found that a high-density interconnect structure itself or an electronic component mounted on the structure is defective, a high-density interconnect structure including a release layer that enables repair of the structure is provided in a laminated portion. Are known. When the high-density interconnect structure must be disassembled for this repair, the laminated portion of the laminate of this structure is heated to a temperature higher than T _q1 (glass transition temperature) to form a substrate and an electronic component. It is disclosed to peel from (Patent Document 1).
Japanese Patent No. 3246667 (paragraph, FIG. 3) Japanese Patent Laid-Open No. 5-67869 (paragraph, FIG. 9) JP 2001-352176 (paragraph, FIG. 1)

しかしながら、特許文献１に開示されているように、高密度相互接続構造物を分解する場合、この構造物自体や実装されている電子部品等も一緒に加熱されるため、この構造物自体や電子部品等に熱ストレスがかかり、特性の劣化あるいは破損が生じる虞がある。 However, as disclosed in Patent Document 1, when disassembling a high-density interconnect structure, the structure itself and the mounted electronic components are also heated together. Thermal stress is applied to parts and the like, which may cause deterioration or damage of characteristics.

また、ＡＣＦ(Anisotoropic Conductive Film)やＮＣＦ（Non-conductive Film）あるいは半田等の接合材を用いて電気的に接続されているともに一体的に形成されている回路基板同士では、調整のため電子部品を追加する場合、接合材を高温で加熱して、基板同士を分離させる必要がある。これにより、回路基板に熱ストレスがかかり、回路基板自体や、回路基板に実装されている回路部品に、特性の劣化或いは破損が生じる虞がある。また、回路基板同士を分離できない場合は、整合のための電子部品を追加できないため、回路基板を破棄しなければならず、生産性が低下してしまう問題ある。 In addition, the circuit boards that are electrically connected and integrally formed using a bonding material such as ACF (Anisotoropic Conductive Film), NCF (Non-conductive Film), or solder are electronic components for adjustment. In the case of adding, it is necessary to separate the substrates by heating the bonding material at a high temperature. As a result, thermal stress is applied to the circuit board, and the circuit board itself or circuit components mounted on the circuit board may be deteriorated or damaged. In addition, when the circuit boards cannot be separated from each other, electronic components for matching cannot be added, and therefore the circuit board must be discarded, resulting in a decrease in productivity.

一方、プリント基板同士を接続するため、雄雌型のスタッキングコネクタが一般に良く利用されている。このように、コネクタを用いて基板同士を接続した場合、基板同士を分離させる際に熱は必要としない。しかし、コネクタは基板間の厚さ方向で０．９ｍｍ以上と厚く、これを備えた基板の厚さも厚くなってしまい、近年要求されている小型化・薄型化等の要求を満たすことが困難であった。 On the other hand, male and female stacking connectors are commonly used to connect printed circuit boards. As described above, when the substrates are connected to each other using the connector, heat is not required when the substrates are separated from each other. However, the connector is as thick as 0.9 mm or more in the thickness direction between the substrates, and the thickness of the substrate provided with the connectors is also increased, making it difficult to meet the demands for downsizing and thinning that have been required in recent years. there were.

本発明は、複数の回路基板を電気的に接続させながら、回路基板同士を固定する回路基板モジュールにおいて、整合性の検査結果に応じて電子部品を追加する場合、電気的に接続されている回路基板を分離する際の熱ストレスを軽減させ、これにより回路基板モジュールの信頼性あるいは生産性の向上を図ることを目的とする。 The present invention provides a circuit board module for fixing circuit boards to each other while electrically connecting a plurality of circuit boards. An object of the present invention is to reduce the thermal stress when separating the substrates, thereby improving the reliability or productivity of the circuit board module.

上記目的を達成するため、本発明の回路基板モジュールは、第１の端子を備える第１の印刷配線基板と、前記第１の端子と対応する位置に第２の端子を備える第２の印刷配線基板と、前記第１の印刷配線基板と前記第２の印刷配線基板とを両者が面接触した状態で一体的に固定する固着部材と、前記第１の印刷配線基板と前記第２の印刷配線基板との間に配置される、弾性有する導電性部材とを具備し、前記弾性を有する導電性部材は、前記第１の端子と前記第２の端子とを電気的に接続しかつ前記第１の印刷配線基板と前記第２の印刷配線基板とを面接触させずに保持する第１の状態と、前記第１の端子と前記第２の端子とを電気的に接続しかつ前記第１の印刷配線基板と前記第２の印刷配線基板とを面接触させる第２の状態とを有する。また、本発明の回路基板モジュールの製造方法は、第１の端子を備える第１の印刷配線基板と、前記第１の端子と電気的に接続される第２の端子を備える第２の印刷配線基板とを相互に重ね合わせて接合することにより回路基板モジュールを製造する方法であって、前記第１の印刷配線基板及び第２の印刷配線基板の接合面間に固着部材を配置する工程と、前記第１及び第２の印刷配線基板を対向配置しかつ前記第１の端子と第２の端子との間に弾性を有する導電性部材を配置した状態で、前記第１及び第２の印刷配線基板を相対的に押圧することにより、前記弾性を有する導電部材により前記第１及び第２の端子間を電気的に接続しかつ前記第１及び第２の印刷配線基板の接合面を面接触させない第１の状態に保持する工程と、前記第１および第２の印刷配線基板間に前記導電性部材を介して電力を供給し、前記第１及び第２の印刷配線基板の回路特性を検査する工程と、前記検査の結果調整が不要な場合に、前記第１及び第２の印刷配線基板を前記第１の状態からさらに押圧して、前記第１及び第２の端子間を前記弾性を有する導電性部材により電気的に接続しかつ前記第１及び第２の印刷配線基板の接合面間を前記固着部材により接合させる工程と、前記検査の結果回路特性の調整が必要な場合に、前記第１及び第２の印刷配線基板を相互に分離したのち、前記第１及び第２の印刷配線基板の少なくとも一方に調整用回路部品を実装する工程と、前記調整用の回路部品の実装終了後に、前記第１の端子と第２の端子との間に弾性を有する導電性部材を配置しかつ調整用回路部品を挟持する状態で前記第１及び第２の印刷配線基板を相対的に押圧することにより、前記第１及び第２の端子間を前記弾性を有する導電性部材により電気的に接続しかつ前記第１及び第２の印刷配線基板の接合面間を前記固定部材により接合させる工程とを具備する。 In order to achieve the above object, a circuit board module according to the present invention includes a first printed wiring board having a first terminal and a second printed wiring having a second terminal at a position corresponding to the first terminal. A substrate, a fixing member that integrally fixes the first printed wiring board and the second printed wiring board in a state where they are in surface contact, and the first printed wiring board and the second printed wiring. An elastic conductive member disposed between the first terminal and the second terminal; and the first conductive member electrically connected to the first terminal and the first terminal. A first state in which the printed wiring board and the second printed wiring board are held without being in surface contact, the first terminal and the second terminal are electrically connected, and the first A second state in which the printed wiring board and the second printed wiring board are brought into surface contact with each other. In addition, the circuit board module manufacturing method of the present invention includes a first printed wiring board having a first terminal, and a second printed wiring having a second terminal electrically connected to the first terminal. A method of manufacturing a circuit board module by superimposing and bonding the substrates to each other, the step of disposing a fixing member between the bonding surfaces of the first printed wiring board and the second printed wiring board; The first and second printed wirings in a state where the first and second printed wiring boards are arranged to face each other and an elastic conductive member is disposed between the first terminal and the second terminal. By relatively pressing the substrate, the first and second terminals are electrically connected by the conductive member having elasticity, and the bonding surfaces of the first and second printed wiring boards are not brought into surface contact. Holding the first state; and And supplying the electric power between the second printed wiring boards via the conductive member and inspecting the circuit characteristics of the first and second printed wiring boards, and adjusting the result of the inspection is unnecessary. The first and second printed wiring boards are further pressed from the first state to electrically connect the first and second terminals by the conductive member having elasticity and the first And the step of bonding the bonding surfaces of the second printed wiring board by the fixing member, and when the circuit characteristics need to be adjusted as a result of the inspection, the first and second printed wiring boards are separated from each other. Thereafter, a step of mounting the adjustment circuit component on at least one of the first and second printed wiring boards, and after the completion of the mounting of the adjustment circuit component, between the first terminal and the second terminal. An adjustment conductive circuit part provided with an electrically conductive member having elasticity By relatively pressing the first and second printed wiring boards in a state of sandwiching the first and second printed circuit boards, the first and second terminals are electrically connected by the conductive member having elasticity and the first A step of bonding the bonding surfaces of the first and second printed wiring boards by the fixing member.

この構成により、第１の端子１と第２の端子とを電気的に接続し検査を施した後であっても、固着剤と第１あるいは第２の印刷配線基板のいずれか一方とが接着していない第２の状態であれば、第１の印刷配線基板と第２の印刷配線基板とを容易に引き離すことができる。よって、第１の状態における検査の後、調整が必要であるとして調整用の電子部品を追加する場合であっても、引き離す際の第１，２の印刷配線基板にかかるストレスを軽減できる。また、回路基板モジュールの信頼性の向上を図ることができる。さらに、整合のための電子部品を追加できないことに起因し低下している生産性を向上できる。 With this configuration, even after the first terminal 1 and the second terminal are electrically connected and inspected, the fixing agent and either the first or second printed wiring board are bonded. If the second state is not performed, the first printed wiring board and the second printed wiring board can be easily separated from each other. Therefore, even if an electronic component for adjustment is added after the inspection in the first state because adjustment is necessary, the stress applied to the first and second printed wiring boards during separation can be reduced. In addition, the reliability of the circuit board module can be improved. Furthermore, productivity that is reduced due to the inability to add electronic components for matching can be improved.

本発明により、電気的に接続されている回路基板を剥がす際の熱ストレスを軽減できる。これにより、回路基板モジュールの信頼性あるいは生産性の向上を図ることができる。 According to the present invention, it is possible to reduce thermal stress when peeling an electrically connected circuit board. Thereby, the reliability or productivity of the circuit board module can be improved.

以下、図面を参照しながら、本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、この発明に係わる回路基板モジュールの縦断面図である。 FIG. 1 is a longitudinal sectional view of a circuit board module according to the present invention.

図１に示すとおり、回路基板モジュールは、プリント基板（第１の印刷配線基板）１と、プリント基板（第２の印刷配線基板）２と、導電性部材３と、粘着テープ（固着材）４とを含む。 As shown in FIG. 1, the circuit board module includes a printed circuit board (first printed circuit board) 1, a printed circuit board (second printed circuit board) 2, a conductive member 3, and an adhesive tape (adhesive material) 4. Including.

プリント基板１は、一方の面に端子（第１の端子）１Ａ，１Ｂを、他の面に電子部品５１，５２を、内部に所定の配線パターン６１を有する。なお、端子１Ａ，１Ｂは、配線パターン６１の一部分であって、電子部品５１，５２は、例えば半田により配線パターン６１と接続されている。 The printed circuit board 1 has terminals (first terminals) 1A and 1B on one surface, electronic components 51 and 52 on the other surface, and a predetermined wiring pattern 61 inside. The terminals 1A and 1B are a part of the wiring pattern 61, and the electronic components 51 and 52 are connected to the wiring pattern 61 by, for example, solder.

プリント基板２は、プリント基板１と対向する面に、端子１Ａ，１Ｂとそれぞれ対応する位置に備えられている端子（第２の端子）２Ａ，２Ｂと，電子部品５３，５４とを有し、他の面に電子部品５５，５６を有し、内部に所定の配線パターン６２と、電子部品５７，５８を有する。なお、端子２Ａ，２Ｂは、配線パターン６２の一部分であって、電子部品５４−５８は、例えば半田により配線パターン６１と接続されている。また、電子部品５３は、半田等の接着剤を介さずに、配線パターン６２の一部分である端子３Ａ，３Ｂ（第３の端子）と電気的に接続され、粘着テープ４により、プリント基板２に固定されている。 The printed circuit board 2 has terminals (second terminals) 2A and 2B provided at positions corresponding to the terminals 1A and 1B on the surface facing the printed circuit board 1, and electronic components 53 and 54, respectively. The other surface has electronic components 55 and 56, and has a predetermined wiring pattern 62 and electronic components 57 and 58 inside. The terminals 2A and 2B are a part of the wiring pattern 62, and the electronic components 54-58 are connected to the wiring pattern 61 by, for example, solder. Further, the electronic component 53 is electrically connected to the terminals 3A and 3B (third terminals) which are part of the wiring pattern 62 without using an adhesive such as solder, and is attached to the printed circuit board 2 by the adhesive tape 4. It is fixed.

端子１Ａは端子２Ａと、端子１Ｂは端子２Ｂと、それぞれ導電性部材３を介して電気的に接続されている。このように、配線パターン６１と配線パターン６２が接続されて、プリント基板１とプリント基板２は、特定の機能を有する１つの回路基板モジュールとなる。後に詳細に説明するが、プリント基板１，２は、電気的に接続された状態で電力が供給され、所定の検査が施されて、特定の機能を最適に実行するための適切な整合（マッチング）を有しているか否かが判断される。この検査において、マッチングを調整する必要がある場合、例えばチップ型の抵抗・コンデンサ・インダクタンス等である電子部品５３が追加される。よって、本実施の形態においては、図１に示すように、プリント基板１，２の間に電子部品５３が配置されているが、検査の結果に応じて、電子部品５３を含まないものも、本発明が適用可能な回路基板モジュールと言える。 The terminal 1A is electrically connected to the terminal 2A, and the terminal 1B is electrically connected to the terminal 2B via the conductive member 3, respectively. In this way, the wiring pattern 61 and the wiring pattern 62 are connected, and the printed circuit board 1 and the printed circuit board 2 become one circuit board module having a specific function. As will be described in detail later, the printed circuit boards 1 and 2 are supplied with electric power in an electrically connected state, subjected to a predetermined inspection, and appropriately matched (matching) to optimally execute a specific function. ) Is determined. In this inspection, when matching needs to be adjusted, an electronic component 53 such as a chip-type resistor, capacitor, or inductance is added. Therefore, in the present embodiment, as shown in FIG. 1, the electronic component 53 is arranged between the printed boards 1 and 2, but the electronic component 53 is not included depending on the result of the inspection. It can be said that the present invention is applicable to a circuit board module.

導電性部材３は、プリント基板１とプリント基板２とが向かい合う面に対して直交するＨ方向に収縮できる弾性を有し、かつ、接触する端子間を電気的に接続する導電性を有する。よって、導電性部材３は、Ｈ方向に収縮していない状態で端子２Ａ，２Ｂに配置され、プリント基板１の端子１Ａ，１Ｂと接触しているとき、プリント基板２が粘着テープ４と接触しない高さを有する。本実施の形態においては、メッキ、蒸着により形成される導電性の薄膜を、表面に有する樹脂材からなる導電性部材３を使用している。導電性の薄膜の材料としては、Ｃｕ，Ａｇ，Ｎｉ，Ａｕ，Ｓｎ，Ａｌ等が利用できる。また、樹脂材としては、天然ゴム，一般ゴム，シリコーンゴム，フロロシリコーンゴム，エチレン・プロピレンゴム，クロロプレンゴム，二トリルゴム，水添二トリルゴム，ブチルゴム，ハイパロン，アクリルゴム，ウレタンゴム，フッ素ゴム等が利用できる。特に、耐酸耐アルカリ性に優れた水添二トリルゴム，ブチルゴム，ハイパロン等は、メッキや蒸着等により導電性部材が付着しやすいため、有用である。なお、この構成に限らず、導電性部材３は、樹脂材の表面に導電性の薄膜が接着剤等を用いて接着されている構成であってもよい。 The conductive member 3 has elasticity capable of contracting in the H direction perpendicular to the surface where the printed circuit board 1 and the printed circuit board 2 face each other, and has electrical conductivity for electrically connecting the contacting terminals. Therefore, the conductive member 3 is disposed on the terminals 2A and 2B without being contracted in the H direction, and the printed circuit board 2 does not contact the adhesive tape 4 when contacting the terminals 1A and 1B of the printed circuit board 1. Has a height. In the present embodiment, the conductive member 3 made of a resin material having a conductive thin film formed by plating and vapor deposition on the surface is used. Cu, Ag, Ni, Au, Sn, Al, etc. can be used as the material for the conductive thin film. Resin materials include natural rubber, general rubber, silicone rubber, fluorosilicone rubber, ethylene / propylene rubber, chloroprene rubber, nitrile rubber, hydrogenated nitrile rubber, butyl rubber, hypalon, acrylic rubber, urethane rubber, fluorine rubber, etc. Available. In particular, hydrogenated nitrile rubber, butyl rubber, hyperon, etc., which are excellent in acid and alkali resistance, are useful because the conductive member easily adheres by plating or vapor deposition. The conductive member 3 is not limited to this configuration, and a conductive thin film may be bonded to the surface of the resin material using an adhesive or the like.

粘着テープ４は、導電性部材３を除いて、プリント基板１およびプリント基板２の向かい合う面のそれぞれと接着し、プリント基板１とプリント基板２とを固着している。本実施の形態においては、例えば厚さ０．２ｍｍのアクリル系あるいはシリコン系の両面テープを使用できる。なお、固着部材とは、プリント基板１，２と接触すると、引き剥がすのはほとんど不可能であるような強い固着力を有するものであってもよく、また、一度接触したとしても、ある程度の力を加えることにより引き剥がすことができるような固着力を有するものであってもよい。また、粘着テープ４は、接触するプリント基板１，２の接触面に形成される凹凸形状を吸収するため、この凹凸形状に沿って密着できる弾性を有することが好ましい。 The adhesive tape 4 is bonded to each of the opposing surfaces of the printed circuit board 1 and the printed circuit board 2 except for the conductive member 3, and fixes the printed circuit board 1 and the printed circuit board 2. In the present embodiment, for example, an acrylic or silicon double-sided tape having a thickness of 0.2 mm can be used. It should be noted that the fixing member may have a strong fixing force that is almost impossible to peel off when contacting the printed circuit boards 1 and 2, and even if it contacts once, a certain amount of force is required. It may have a fixing force that can be peeled off by adding. Moreover, since the adhesive tape 4 absorbs the uneven | corrugated shape formed in the contact surface of the printed circuit boards 1 and 2 which contacts, it is preferable to have the elasticity which can contact | adhere along this uneven | corrugated shape.

このように、プリント基板１とプリント基板２は、導電性部材３を介して端子１Ａと２Ａ，端子１Ｂと２Ｂとが電気的に接続され、粘着テープ４を介して固着され、電力が供給されると特定の機能を有する回路基板モジュールとしてひとまとめにされている。 As described above, the printed circuit board 1 and the printed circuit board 2 are electrically connected to the terminals 1A and 2A and the terminals 1B and 2B through the conductive member 3, and are fixed through the adhesive tape 4 to be supplied with power. Then, they are grouped as a circuit board module having a specific function.

本実施の形態において、電子部品５１−５８としては、チップ型の抵抗、コンデンサ、インダクタンス、ＩＣパッケージ、ベアＩＣチップ等が利用できる。 In the present embodiment, chip-type resistors, capacitors, inductances, IC packages, bare IC chips, and the like can be used as the electronic components 51-58.

次に、図２、３、４を用いて、図１に示す回路基板モジュールの検査を含む製造方法の一例について説明する。 Next, an example of a manufacturing method including inspection of the circuit board module shown in FIG. 1 will be described with reference to FIGS.

図２に示すとおり、プリント基板１に、半田を用いて電子部品５１，５２を接続し、端子１Ａ，１Ｂを除くプリント基板１の表面に、粘着テープ４を接着させる。なお、この順番は、任意に変更可能である。これと並行して、プリント基板２に、半田を用いて電子部品５４−５６を接続し、端子２Ａ，２Ｂが上面にくるようにプリント基板２を水平に配置し、端子２Ａ，２Ｂに導電性部材３を配置する。 As shown in FIG. 2, the electronic components 51 and 52 are connected to the printed circuit board 1 using solder, and the adhesive tape 4 is adhered to the surface of the printed circuit board 1 excluding the terminals 1A and 1B. This order can be arbitrarily changed. In parallel with this, the electronic components 54-56 are connected to the printed circuit board 2 using solder, the printed circuit board 2 is horizontally disposed so that the terminals 2A and 2B are on the upper surface, and the terminals 2A and 2B are electrically conductive. The member 3 is disposed.

そして、端子１Ａと端子２Ａ、端子１Ｂと端子２Ｂとを位置的に対応させた状態で、このプリント基板１とプリント２とを対向して配置し、所定の間隔を離して、プリント基板１をプリント基板２に近付ける。 Then, in a state where the terminals 1A and 2A, and the terminals 1B and 2B correspond to each other, the printed circuit board 1 and the print 2 are arranged to face each other, and the printed circuit board 1 is separated by a predetermined interval. Approach the printed circuit board 2.

すなわち、図３に示すように、プリント基板２と粘着テープ４とは接触せずに、導電性部材３と端子１Ａ，１Ｂとが接触する所定の間隔を確保して、プリント基板１とプリント基板２は近付けられる（第１の状態）。従って、端子１Ａと端子２Ａが、端子１Ｂと端子２Ｂが、それぞれ電気的に接続され、つまり配線パターン６１と配線パターン６２とが接続される。 That is, as shown in FIG. 3, the printed circuit board 2 and the adhesive tape 4 are not in contact with each other, and a predetermined interval between the conductive member 3 and the terminals 1A and 1B is secured, so that the printed circuit board 1 and the printed circuit board are secured. 2 is approached (first state). Accordingly, the terminal 1A and the terminal 2A are electrically connected, and the terminal 1B and the terminal 2B are electrically connected, that is, the wiring pattern 61 and the wiring pattern 62 are connected.

この状態で、配線パターン６１および配線パターン６２と接続されている電源装置１００から特定の電力が供給され、配線パターン６１および配線パターン６２と接続されている検査装置２００により配線パターン６１，６２に対して特定の検査が施される。検査の結果、調整の必要がないと判断された場合、矢印の方向にさらに力が加えられ、粘着テープ４とプリント基板２とが接着し、図１に示したような回路基板モジュールが完成する。 In this state, specific power is supplied from the power supply device 100 connected to the wiring pattern 61 and the wiring pattern 62, and the inspection device 200 connected to the wiring pattern 61 and the wiring pattern 62 applies to the wiring patterns 61 and 62. Specific inspections. As a result of the inspection, if it is determined that adjustment is not necessary, further force is applied in the direction of the arrow, and the adhesive tape 4 and the printed circuit board 2 are bonded to complete the circuit board module as shown in FIG. .

また、検査の結果、調整する必要があると判断された場合、図４に示すとおり、プリント基板１とプリント基板２とを離し、プリント基板２の端子３Ａ，３Ｂ上に電子部品５３を配置する。このとき、端子３Ａ，３Ｂと電子部品５３とは、半田等の接着剤を介さずに、対応する電極同士が接触しているだけである。 If it is determined as a result of the inspection that adjustment is required, the printed circuit board 1 and the printed circuit board 2 are separated from each other and the electronic component 53 is disposed on the terminals 3A and 3B of the printed circuit board 2 as shown in FIG. . At this time, the corresponding electrodes of the terminals 3A and 3B and the electronic component 53 are merely in contact with each other without using an adhesive such as solder.

そして、導電性部材３と端子１Ａ，１Ｂとが接触し、かつ、プリント基板２と粘着テープ４とが接着する位置まで、プリント基板１とプリント基板２と近付け、プリント基板１とプリント基板２とを固着させる。従って、電子部品５３は、粘着テープ４により、プリント基板２に固定され、端子３Ａ，３Ｂとの電気的な接続が確保される（第２の状態）。 The printed circuit board 1 and the printed circuit board 2 are brought close to the position where the conductive member 3 contacts the terminals 1A and 1B and the printed circuit board 2 and the adhesive tape 4 adhere to each other. To fix. Therefore, the electronic component 53 is fixed to the printed circuit board 2 by the adhesive tape 4, and electrical connection with the terminals 3A and 3B is secured (second state).

なお、電子部品５３がプリント基板２の端子３Ａ，３Ｂ上に配置された後再度検査が施されてもよい。すなわち、電子部品５３を端子３Ａ，３Ｂ上に配置した後、プリント基板２と粘着テープ４とは接触せずに、導電性部材３と端子２Ａ，２Ｂとが接触する位置まで、プリント基板１とプリント基板２を近付け、もう一度検査を施し、調整が必要であれば、他の調整用の電子部品をプリント基板２の所定の位置にさらに追加できる。そして、検査の結果、調整の必要がないと判断された後で、導電性部材３と端子１Ａ，１Ｂとが接触し、かつ、プリント基板２と粘着テープ４とが接触する位置まで、プリント基板１とプリント基板２と近付け、プリント基板１とプリント基板２とを固着させる。 In addition, after the electronic component 53 is arrange | positioned on the terminals 3A and 3B of the printed circuit board 2, it may test | inspect again. That is, after the electronic component 53 is disposed on the terminals 3A and 3B, the printed circuit board 1 and the adhesive tape 4 are not in contact with each other, and the printed circuit board 1 and the terminals 2A and 2B are in contact with each other. If the printed circuit board 2 is brought close to it, the inspection is performed again, and adjustment is necessary, other electronic components for adjustment can be further added to predetermined positions on the printed circuit board 2. As a result of the inspection, it is determined that no adjustment is necessary, and until the position where the conductive member 3 contacts the terminals 1A and 1B and the printed circuit board 2 and the adhesive tape 4 contact each other, the printed circuit board. 1 and the printed circuit board 2 are brought close to each other, and the printed circuit board 1 and the printed circuit board 2 are fixed.

なお、導電性部材３は、例えば導電性接着剤や半田を用いて端子１Ａ，１Ｂあるいは端子２Ａ，２Ｂに、予め固着されていてもよい。この場合、導電性部材３が端子２Ａ，２Ｂに接着される場合は、上に図２−４を用いて説明した方法が適用できる。このように、導電性部材３を、端子２Ａ，２Ｂと同一面上に電子部品５４を備えるプリント基板２に固着する場合、半田を用いると、電子部品５４を接続する工程において同時に接続できるため、作業効率を向上できる。 The conductive member 3 may be fixed in advance to the terminals 1A and 1B or the terminals 2A and 2B using, for example, a conductive adhesive or solder. In this case, when the conductive member 3 is bonded to the terminals 2A and 2B, the method described above with reference to FIGS. 2-4 can be applied. As described above, when the conductive member 3 is fixed to the printed circuit board 2 including the electronic component 54 on the same plane as the terminals 2A and 2B, since solder can be used at the same time in the step of connecting the electronic component 54, Work efficiency can be improved.

次に、接着剤を用いて端子１Ａ，１Ｂに、導電性部材３が予め固着されているプリント基板１を利用した、本発明に係る回路基板モジュールの検査を含む製造方法の他の例について、図５−８を用いて説明する。なお、同じ構成を有する部材については同じ符号を付して以下説明する。 Next, another example of the manufacturing method including the inspection of the circuit board module according to the present invention using the printed circuit board 1 in which the conductive member 3 is fixed in advance to the terminals 1A and 1B using an adhesive. This will be described with reference to FIGS. Members having the same configuration are denoted by the same reference numerals and will be described below.

図５に示すとおり、プリント基板１に、半田を用いて電子部品５１，５２を接続し、端子１Ａ，１Ｂには、接着材７を介して導電性部材３を固定する。また、端子１Ａ，１Ｂの領域すなわち、導電性部材３に対応する領域を除く、プリント基板１の表面に、粘着テープ４を接着させる。なお、これら順番は、任意に変更可能である。これと並行して、プリント基板２に、半田を用いて電子部品５４−５６を接続する。 As shown in FIG. 5, the electronic components 51 and 52 are connected to the printed circuit board 1 using solder, and the conductive member 3 is fixed to the terminals 1 A and 1 B via an adhesive 7. Further, the adhesive tape 4 is adhered to the surface of the printed circuit board 1 excluding the regions of the terminals 1A and 1B, that is, the region corresponding to the conductive member 3. These orders can be arbitrarily changed. In parallel with this, the electronic components 54 to 56 are connected to the printed circuit board 2 using solder.

すなわち、図６に示すように、プリント基板２と粘着テープ４とは接触されずに、導電性部材３と端子２Ａ，２Ｂとが接触する所定の間隔を確保して、プリント基板１とプリント基板２は近付けられ、端子１Ａと端子２Ａ、端子１Ｂと端子２Ｂがそれぞれ電気的に接続される。 That is, as shown in FIG. 6, the printed circuit board 2 and the adhesive tape 4 are not in contact with each other, and a predetermined distance between the conductive member 3 and the terminals 2A and 2B is secured, so that the printed circuit board 1 and the printed circuit board are secured. 2 is brought close, and the terminals 1A and 2A, and the terminals 1B and 2B are electrically connected to each other.

この状態で、電源装置１００から特定の電力が供給され、検査装置２００により配線パターン６１，６２に関する特定の検査が施される。検査の結果、調整の必要がないと判断された場合、矢印の方向にさらに力が加えられ、粘着テープ４とプリント基板２とが接触し、図１に示したような回路基板モジュールが完成する。 In this state, specific power is supplied from the power supply device 100, and a specific inspection regarding the wiring patterns 61 and 62 is performed by the inspection device 200. As a result of the inspection, if it is determined that adjustment is not necessary, further force is applied in the direction of the arrow, and the adhesive tape 4 and the printed board 2 come into contact with each other to complete the circuit board module as shown in FIG. .

また、検査の結果、調整する必要があると判断された場合、図７に示すとおり、プリント基板１とプリント基板２とを離し、プリント基板２の所定の位置に電子部品５３を配置する。このとき、プリント基板２と電子部品５３とは、半田等の接着材を介さずに、対応する電極同士が接触しているだけである。 If it is determined as a result of the inspection that adjustment is required, the printed circuit board 1 and the printed circuit board 2 are separated from each other and the electronic component 53 is disposed at a predetermined position on the printed circuit board 2 as shown in FIG. At this time, the printed circuit board 2 and the electronic component 53 are merely in contact with each other without using an adhesive such as solder.

そして、導電性部材３と端子２Ａ，２Ｂとが接触し、かつ、プリント基板２と粘着テープ４とが接触する位置まで、プリント基板１とプリント基板２と近付け、プリント基板１とプリント基板２とを固着させる。従って、電子部品５３は、粘着テープ４により、プリント基板２の対応する位置に固定される。 Then, the printed circuit board 1 and the printed circuit board 2 are brought close to the position where the conductive member 3 contacts the terminals 2A and 2B and the printed circuit board 2 and the adhesive tape 4 are in contact with each other. To fix. Accordingly, the electronic component 53 is fixed to the corresponding position on the printed circuit board 2 by the adhesive tape 4.

なお、電子部品５３がプリント基板２の所定位置に配置された後、プリント基板２と粘着テープ４とは接触せずに、導電性部材３と端子２Ａ，２Ｂとが接触する位置まで、プリント基板１とプリント基板２を近付け、もう一度検査を施し、調整が必要な場合、他の調整用の電子部品をさらに追加してもよい。そして、検査の結果、調整の必要がないと判断された後で、導電性部材３と端子２Ａ，２Ｂとが接触し、かつ、プリント基板２と粘着テープ４とが接触する位置まで、プリント基板１とプリント基板２と近付け、プリント基板１とプリント基板２とを固着させてもよい。 In addition, after the electronic component 53 is arrange | positioned in the predetermined position of the printed circuit board 2, the printed circuit board 2 and the adhesive tape 4 are not contacted, but the printed circuit board is reached to the position where the conductive member 3 and the terminals 2A and 2B are in contact. When 1 and the printed circuit board 2 are brought close to each other and inspected once again and adjustment is necessary, other electronic components for adjustment may be further added. As a result of the inspection, it is determined that adjustment is not necessary, and until the position where the conductive member 3 contacts the terminals 2A and 2B and the printed circuit board 2 and the adhesive tape 4 contact each other, the printed circuit board. 1 and the printed circuit board 2 may be brought close to each other, and the printed circuit board 1 and the printed circuit board 2 may be fixed.

図１−４を用いて説明したとおり、導電性部材３は、粘着テープ４が接着しているプリント基板１の端子１Ａ，１Ｂは、粘着性や、接着性等を有する固着手段を利用せずに、単に接触することだけで電気的に接続可能である。この構成により、端子１Ａと端子２Ａ、端子１Ｂと端子２Ｂとを電気的に接続し検査を施した後であっても、粘着テープ４とプリント基板２とが接着していなければ、プリント基板１とプリント基板２と容易に引き離すことができる。よって、検査の結果により、電子部品５３を追加する場合であっても、プリント基板１，２にかかるストレスを軽減できる。また、回路基板モジュールの信頼性の向上を図ることができる。さらに、整合のための電子部品を追加できないことに起因し低下している生産性を向上できる。 As described with reference to FIGS. 1 to 4, the conductive member 3 does not use the fixing means having adhesiveness or adhesiveness for the terminals 1 A and 1 B of the printed circuit board 1 to which the adhesive tape 4 is adhered. In addition, it can be electrically connected simply by contact. With this configuration, even after the terminals 1A and 2A and the terminals 1B and 2B are electrically connected and inspected, if the adhesive tape 4 and the printed board 2 are not bonded, the printed board 1 And can be easily separated from the printed circuit board 2. Therefore, the stress applied to the printed circuit boards 1 and 2 can be reduced even when the electronic component 53 is added according to the inspection result. In addition, the reliability of the circuit board module can be improved. Furthermore, productivity that is reduced due to the inability to add electronic components for matching can be improved.

また、検査を施した後調整が必要でなければ、そのまま、端子１Ａ，１Ｂと導電性部材３とを接触させるためにプリント基板１とプリント基板２とを近付けたのと同じ方向に力を加え、プリント基板１とプリント基板２とを少し近付けて粘着テープ４とプリント基板２とを接着させるだけで、プリント基板１とプリント基板２を固着できる。このため、容易に回路基板モジュールを製造でき、検査・組み立ての時間を短縮でき、作業効率が向上する。よって、回路基板モジュールの生産性の向上を図ることができる。 Further, if adjustment is not necessary after the inspection, a force is applied in the same direction in which the printed circuit board 1 and the printed circuit board 2 are brought closer to contact the terminals 1A and 1B and the conductive member 3 as they are. By simply bringing the printed circuit board 1 and the printed circuit board 2 close to each other and adhering the adhesive tape 4 and the printed circuit board 2 to each other, the printed circuit board 1 and the printed circuit board 2 can be fixed. For this reason, a circuit board module can be manufactured easily, inspection and assembly time can be shortened, and work efficiency can be improved. Therefore, the productivity of the circuit board module can be improved.

さらに、プリント基板１とプリント基板２とを固着する粘着テープ４は薄く、回路基板モジュールの厚さも薄くできる。よって、回路基板モジュールの小型化を図ることができる。なお、本実施の形態においては、両基板間の絶縁性を確保するために要求される間隔を考慮して、０．２ｍｍの両面テープを用いたが、これに限られず、固着力が確保されるならばより薄い両面テープが利用されてもよい。ちなみに、一般によく利用されているプリント基板間を接続するためのスタッキングコネクタは、上述したとおり、雄雌型の２つの部材をプリント基板のそれぞれに固定させる構成を有し、厚さは０．９ｍｍ程度である。従って、回路基板モジュールの厚さは薄く、本発明の課題の１つである「コネクタを用いた接続による厚さ問題」を改善できた。 Further, the adhesive tape 4 for fixing the printed board 1 and the printed board 2 is thin, and the thickness of the circuit board module can be reduced. Therefore, the circuit board module can be reduced in size. In this embodiment, a 0.2 mm double-sided tape is used in consideration of the space required for ensuring insulation between the two substrates. However, the present invention is not limited to this, and a fixing force is ensured. A thinner double-sided tape may be used. By the way, the stacking connector for connecting the printed boards that are commonly used generally has a structure in which two male and female members are fixed to each of the printed boards as described above, and the thickness is 0.9 mm. Degree. Therefore, the thickness of the circuit board module is thin, and the “thickness problem due to connection using a connector” which is one of the problems of the present invention can be improved.

また、調整用として追加される電子部品５３は、半田等の接着剤を介さず、粘着テープ４により固定されることで、配線パターン２の対応する接続部分と接触により電気的に接続されている。この構成により、短時間で簡単な接続が可能であり、接合する際に用いられる半田を溶融するための熱が加えられないため、熱劣化がない。このため、回路基板モジュールの信頼性あるいは生産性の向上を図ることができる。 Further, the electronic component 53 added for adjustment is electrically connected to the corresponding connection portion of the wiring pattern 2 by being fixed by the adhesive tape 4 without using an adhesive such as solder. . With this configuration, a simple connection is possible in a short time, and heat for melting the solder used for joining is not applied, so there is no thermal degradation. For this reason, it is possible to improve the reliability or productivity of the circuit board module.

さらに、プリント基板１に、プリント基板１とプリント基板２とを接続するより前に、電子部品５１，５２を予め接続しておくことにより、接合する際に用いられる半田を溶融するための熱が、プリント基板２に与えられないため、熱劣化を軽減できる。同様に、プリント基板２に電子部品５４−５６を予め接続しておくことにより、プリント基板１における熱劣化を軽減できる。これにより、回路基板モジュールの信頼性の向上を図ることができる。 Furthermore, by connecting the electronic components 51 and 52 in advance before connecting the printed circuit board 1 and the printed circuit board 2 to the printed circuit board 1, heat for melting the solder used for joining is increased. Since it is not given to the printed circuit board 2, thermal degradation can be reduced. Similarly, by preliminarily connecting the electronic components 54-56 to the printed circuit board 2, thermal deterioration in the printed circuit board 1 can be reduced. Thereby, the reliability of a circuit board module can be improved.

また、粘着テープ４は、弾性と柔軟性を有しているため、被接着面が図１に示すプリント基板１，２のように凹凸形状であっても、被接着面の構造に沿って密着することができる。このため、プリント基板１，２の固着力が向上する。また、粘着テープ４は、導電性部材３が配置される領域を除いて、プリント基板１，２の対向する面と広く接着しているため、固着力をより向上する。 Moreover, since the adhesive tape 4 has elasticity and flexibility, it adheres along the structure of the adherend surface even if the adherend surface is uneven as in the printed boards 1 and 2 shown in FIG. can do. For this reason, the adhering force of the printed circuit boards 1 and 2 is improved. Moreover, since the adhesive tape 4 is widely bonded to the opposing surfaces of the printed boards 1 and 2 except for the region where the conductive member 3 is disposed, the adhesive force is further improved.

さらに、柔軟性を有する粘着テープ４は、プリント基板１，２の両方が、剛性を有する基板であった場合、自身の変形によりプリント基板１，２の変形に追従できるため、プリント基板１，２の固着力を維持できる。また、固着材としては、粘着テープ４に変えて、スプレー等により、導電性部材３を除いてプリント基板１あるいはプリント基板２に塗布された接着剤も利用できる。この場合、塗布される接着剤は、粘着テープ４に比べて追従性が低いため、プリント基板１，２の少なくとも一方は、可撓性を有するフレキシブル基板であることが好ましい。 Furthermore, the flexible adhesive tape 4 can follow the deformation of the printed circuit boards 1 and 2 by its own deformation when both the printed circuit boards 1 and 2 are rigid substrates. Can be maintained. As the fixing material, an adhesive applied to the printed circuit board 1 or the printed circuit board 2 except for the conductive member 3 by spraying or the like instead of the adhesive tape 4 can be used. In this case, since the applied adhesive is less followable than the adhesive tape 4, at least one of the printed boards 1 and 2 is preferably a flexible flexible board.

なお、上述した特定の検査とは、例えば、プリント基板１，２は、電力が供給され、特定の機能を最適に実行するための適切な整合（マッチング）を有しているか否かの検査である。この検査において、両プリント基板１，２における回路特性で調整が必要であると判断された場合（例えば電気的特性の差、バラツキ等がある場合）、最適な電子部品が追加される。 The specific inspection described above is, for example, an inspection of whether or not the printed boards 1 and 2 are supplied with power and have an appropriate matching for optimal execution of a specific function. is there. In this inspection, when it is determined that the circuit characteristics of both the printed circuit boards 1 and 2 need to be adjusted (for example, when there is a difference in electrical characteristics, variation, etc.), an optimal electronic component is added.

また、図１を用いて説明した導電性部材３はこの構成に限られず、例えば、Ｈ方向に収縮できる弾性を有する導電性のバネであってもよい。このバネ材としては、ステンレス、リン青銅、アルミニウム等が利用できる。 Further, the conductive member 3 described with reference to FIG. 1 is not limited to this configuration, and may be a conductive spring having elasticity capable of contracting in the H direction, for example. As this spring material, stainless steel, phosphor bronze, aluminum or the like can be used.

本発明の一実施の形態に係る回路基板モジュールの断面図。Sectional drawing of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の一例を説明する断面図。Sectional drawing explaining an example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の一例を説明する断面図。Sectional drawing explaining an example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の一例を説明する断面図。Sectional drawing explaining an example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の他の例を説明する断面図。Sectional drawing explaining the other example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の他の例を説明する断面図。Sectional drawing explaining the other example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention. 本発明の一実施の形態に係る回路基板モジュールの検査を含む製造方法の他の例を説明する断面図。Sectional drawing explaining the other example of the manufacturing method including the test | inspection of the circuit board module which concerns on one embodiment of this invention.

Explanation of symbols

１・・・プリント基板（第１の印刷配線基板）、２・・・プリント基板（第２の印刷配線基板）、３・・・導電性部材、４・・・粘着テープ（固着材）、１Ａ，１Ｂ・・・第１の端子、２Ａ，２Ｂ・・・第２の端子、５１−５８・・・電子部品、６１，６２・・・配線パターン。 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board (1st printed wiring board), 2 ... Printed circuit board (2nd printed wiring board), 3 ... Conductive member, 4 ... Adhesive tape (adhesive material), 1A , 1B... First terminal, 2A, 2B... Second terminal, 51-58.

Claims

A first printed wiring board comprising a first terminal;
A second printed wiring board comprising a second terminal at a position corresponding to the first terminal;
A fixing member that integrally fixes the first printed wiring board and the second printed wiring board in a state in which both are in surface contact;
An elastic conductive member disposed between the first printed wiring board and the second printed wiring board;
The conductive member having elasticity electrically connects the first terminal and the second terminal and does not bring the first printed wiring board and the second printed wiring board into surface contact. A first state to be held, a second electrical connection between the first terminal and the second terminal, and a surface contact between the first printed wiring board and the second printed wiring board. A circuit board module having a state.

2. The circuit board module according to claim 1, wherein the conductive member having elasticity contracts at least in a direction orthogonal to a surface where the first printed wiring board and the second printed wiring board face each other.

The circuit board module according to claim 1, wherein the conductive member having elasticity is a rubber material having a conductive thin film formed on a surface thereof.

The circuit board module according to claim 1, wherein the conductive member having elasticity is a spring made of a conductive material.

The circuit board module according to claim 1, wherein the conductive member having elasticity has adhesiveness on a surface that contacts at least one of the first and second terminals.

6. The adhesive member according to claim 1, wherein the fixing member is an adhesive member having elasticity and disposed between the first and second printed wiring boards and joining the first and second printed wiring boards. Circuit board module.

A circuit by overlapping and joining a first printed wiring board having a first terminal and a second printed wiring board having a second terminal electrically connected to the first terminal. A method for manufacturing a substrate module, comprising:
Disposing a fixing member between bonding surfaces of the first printed wiring board and the second printed wiring board;
The first and second printed wirings in a state where the first and second printed wiring boards are arranged to face each other and an elastic conductive member is disposed between the first terminal and the second terminal. By pressing the substrate, the first and second terminals are electrically connected by the elastic conductive member and the bonding surfaces of the first and second printed wiring boards are not brought into surface contact with each other. Maintaining the state; and
Supplying power through the conductive member between the first and second printed wiring boards and inspecting circuit characteristics of the first and second printed wiring boards;
When adjustment of the inspection result is unnecessary, the first and second printed wiring boards are further pressed from the first state, and the elastic conductive member between the first and second terminals is provided. Electrically connecting and bonding the bonding surfaces of the first and second printed wiring boards by the fixing member;
If adjustment is required as a result of the inspection, the first and second printed wiring boards are separated from each other, and then an adjustment circuit component is mounted on at least one of the first and second printed wiring boards. Process,
After completion of the mounting of the adjustment circuit component, the conductive member having elasticity is disposed between the first terminal and the second terminal, and the adjustment circuit component is sandwiched between the first and second terminals. By pressing the printed wiring board, the first and second terminals are electrically connected by the conductive member having elasticity, and the joint surfaces of the first and second printed wiring boards are fixed. A method of manufacturing a circuit board module comprising a step of bonding by a member.

Prior to the step of holding the first and second printed wiring boards in the first state, the conductive member having elasticity is used as the first terminal of the first printed wiring board or the second printed wiring. The method of manufacturing a circuit board module according to claim 7, further comprising a step of fixing to any one of the second terminals of the board.