JP2006066690A - Electron beam drawing apparatus, temperature control method for electron beam drawing apparatus, and circuit pattern manufacturing apparatus - Google Patents

Abstract

To provide an electron beam drawing apparatus or a circuit pattern manufacturing apparatus that does not require temperature adjustment by reheating by returning to a preliminary chamber and that has high temperature adjustment accuracy of a sample.
The present invention relates to a sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held on a sample holding tray, an atmospheric pressure adjustment over a range from vacuum to atmospheric pressure, and the sample In an electron beam lithography apparatus having the sample chamber for storing the sample to be taken in and out of the chamber while being held in the sample holding tray and a spare chamber adjacent to the sample chamber, a temperature sensor for measuring the temperature of the sample is provided in the sample holding tray The temperature of the sample is measured by the temperature sensor in the sample chamber and the spare chamber, and the temperature of the sample is adjusted based on the temperature measurement value of the temperature sensor.
[Selection] Figure 1

Description

  The present invention provides an electron beam drawing apparatus that performs electron drawing by irradiating a sample in a sample chamber maintained in a vacuum with an electron beam, or a circuit pattern by irradiating a sample in a sample chamber maintained in a vacuum with light. The present invention relates to a circuit pattern manufacturing apparatus.

  An electron beam drawing apparatus draws a circuit pattern of a magnetic head or a semiconductor device on a semiconductor substrate with an electron beam, or engraves a circuit pattern to be an original drawing on a mask or the like for forming the circuit pattern. It is also used for image processing of the reflected electron beam to inspect the completion of the circuit pattern.

  Among the charged particle beams used for electron beam drawing and inspection, it is essential that the electron beam be used in a vacuum.

  In recent years, with the miniaturization of circuit patterns, light sources used for scanners with shorter wavelengths have been required, and devices using EUV light sources have also been developed. Even when an EUV light source is used, use in a vacuum is essential as in the case of an electron beam.

  Hereinafter, a conventional technique will be described using an electron beam drawing apparatus that draws a circuit pattern on a sample using an electron beam as an example.

  An electron beam lithography system generates and scans an electron beam in an ultra-high vacuum environment to form an LSI pattern on a semiconductor substrate or a glass substrate called a reticle used in an exposure apparatus such as a scanner or a stepper. Device.

  FIG. 12 shows a configuration of a conventional electron beam drawing apparatus.

  Here, the points related to the problem of the present invention will be mainly described, and the other reference numerals are the same as those in the embodiments of the present invention.

  The column 1 is evacuated by a vacuum pump (not shown) and kept in a vacuum. A sample holding tray 13 for holding the sample 10 on the stage 3 is placed in the sample chamber 2. The electron beam generated in the column 1 is irradiated to the sample 10 placed in the sample chamber 2. The position of the sample 10 is measured by laser length measurement of the bar mirror 12 on the stage 3.

  Lasers are susceptible to air fluctuations and atmospheric pressure changes in the atmosphere. For this reason, the interferometer 11 for measuring the position is arranged on the inner wall in the sample chamber 2 in a vacuum. The sample chamber 2 is placed on a surface plate 4, and the surface plate 4 is supported by a mount 5 having a function of vibration isolation.

Furthermore, the main body base 6 that holds the mount 5 is installed on the floor 7. The sample chamber 2 is evacuated by a vacuum pump (not shown), and the internal atmosphere is maintained at a high vacuum (for example, 10 ⁻⁴ Pa level).

  Here, the conveyance path of the sample will be described.

  First, the sample holding tray 13 is made to wait in advance on the support base 43 in the preliminary chamber 8 which has been returned to the atmosphere. Subsequently, the gate valve 41 of the preparatory chamber 8 is opened, and the sample is transported by an atmosphere-side robot (not shown) and is mounted and held on the sample holding tray 13.

  Subsequently, the gate valve 41 is closed, and the air in the preliminary chamber 8 is extracted by a vacuum pump (not shown) to shift from the atmospheric atmosphere to a vacuum. When the degree of vacuum is the same as that of the sample chamber 2, the gate valve 40 is opened, and the sample holding tray 13 on which the sample 10 is loaded is conveyed to the fixing mechanism 14 on the stage 3 by the vacuum robot 42.

  The stage 3 is movable in a two-dimensional plane, and a fixing mechanism 14, a bar mirror 12, and other beam calibration parts (not shown) are attached to the upper surface. The sample holding tray 13 has a sample clamp as holding means. Various means can be considered for the sample clamp depending on the sample, such as electrostatic adsorption if the sample is wear, or a mechanical presser mechanism if the sample is a mask.

  On the other hand, also in the fixing mechanism 14 for fixing the sample holding tray 13 on the stage 3, electrostatic adsorption, mechanical pressing, or the like can be considered. The sample drawn with the electron beam is transported in the reverse order along the transport path. The sample holding tray 13 is transported from the sample chamber 2 into the spare chamber 8, the atmosphere is returned from vacuum to the atmosphere, and only the sample is transported outside the body of the electron beam drawing apparatus.

  Through the above series of operations, the sample can be loaded and unloaded while the sample chamber 2 is kept in a vacuum state, and the throughput is improved. A temperature sensor 75 is mounted on the stage, and the temperature adjustment of the stage is managed by a temperature adjustment device (not shown).

  In the electron beam lithography apparatus, as described above, in order to prevent the energy loss of the electron beam, it is necessary to keep the irradiation path of the electron beam at a high vacuum. However, the conventional electron beam lithography apparatus has the following problems. . That is, a temperature drop of 1/10 ° C. or more occurs in the sample and the sample holding means by evacuating the preliminary chamber. The temperature drop is due to adiabatic expansion. As a result, a temperature difference from the stage side occurs, and the sample and the sample holding tray are thermally expanded during drawing, resulting in poor drawing accuracy.

  On the other hand, conventionally, as shown in, for example, Patent Document 1 (Japanese Patent Laid-Open No. 8-97130), a temperature sensor and a heating means are provided in the sample holding tray, and the temperature is lowered due to adiabatic expansion in the preliminary chamber. There has been proposed an electron beam drawing apparatus that compensates for the above.

  In Patent Document 2 (Japanese Patent Application Laid-Open No. 11-186126), a temperature measuring element is provided on an arm that grips a cassette (sample holding tray) holding a sample, and a temperature change in a preliminary chamber is measured to adjust the temperature. ing. In Patent Document 2, in the sample chamber, the temperature of the sample is adjusted by measuring the temperature of the stage using another temperature measuring element provided on the stage and adjusting the temperature of the stage.

JP 2002-65548 A JP-A-11-186126

  However, in Patent Document 1, when the carry-in from the preliminary chamber to the sample chamber is delayed and falls below the target temperature, it is necessary to return to the preliminary chamber and re-adjust the temperature by reheating.

  In Japanese Patent Application Laid-Open No. 11-186126, since separate temperature measuring elements are used in the preliminary chamber and the sample chamber, the measurement values vary, and the temperature adjustment accuracy of the sample decreases. In addition, since the temperature of the sample is adjusted by measuring the temperature of the stage in the sample chamber, the temperature adjustment accuracy of the sample is further reduced.

  In particular, with the recent miniaturization of circuit patterns, the accuracy required for a sample is several nm at the leading edge level, and the temperature adjustment management of the sample is required to be in the range of 1/100 ° C. to 1/1000 ° C.

  In view of the above problems, the present invention provides an electron beam drawing apparatus or a circuit pattern manufacturing apparatus that does not require temperature adjustment by reheating by returning to a preliminary chamber and that has a high temperature adjustment accuracy of a sample. Objective.

  The present invention includes a sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held on a sample holding tray, an atmospheric pressure adjustment in a range from vacuum to atmospheric pressure, and taking in and out of the sample chamber. In the electron beam drawing apparatus having the sample chamber for keeping the sample held in the sample holding tray and a spare chamber adjacent to the sample chamber, a temperature sensor for measuring the temperature of the sample is provided in the sample holding tray, The temperature measurement of the sample in the sample chamber and the spare chamber is performed by the temperature sensor, and the temperature of the sample is adjusted based on the temperature measurement value of the temperature sensor.

  The present invention also provides a sample chamber maintained in a vacuum for forming a circuit pattern on a sample held on a sample holding tray, an atmospheric pressure adjustment in a range from vacuum to atmospheric pressure, and the sample chamber In a circuit pattern manufacturing apparatus having the sample chamber for storing the sample to be taken in and out while being held in the sample holding tray and a spare chamber adjacent to the sample chamber, a temperature sensor for measuring the temperature of the sample is provided in the sample holding tray The temperature measurement of the sample in the sample chamber and the spare chamber is performed by the temperature sensor, and the temperature of the sample is adjusted based on the temperature measurement value of the temperature sensor.

  According to the present invention, it is possible to provide an electron beam drawing apparatus or a circuit pattern manufacturing apparatus with high drawing accuracy with high temperature adjustment accuracy of a sample without requiring temperature adjustment by reheating by returning to the preliminary chamber.

  Examples according to embodiments of the present invention will be described with reference to the drawings.

  First, the outline of the electron beam drawing apparatus and the sample holding tray will be described with reference to FIGS. 1 and 2. This electron beam drawing apparatus draws a circuit pattern of a magnetic head or a semiconductor device on a semiconductor substrate with an electron beam, or engraves a circuit pattern to be an original drawing on a mask or the like for forming the circuit pattern.

  The column 1 is provided so as to rise in the sample chamber 2. The stage 3 in the sample chamber 2 can move in a two-dimensional plane. In other words, it is a stand that can be moved back and forth and left and right. The stage 3 has a fixing mechanism 14 and a bar mirror 12 on the upper side.

  The position of the sample 10 on the stage 3 is measured by the interferometer 11 and the bar mirror 12 provided on the inner wall of the sample chamber 2. The sample 10 is held on the fixing mechanism 14 of the stage 3 using a sample clamp or the like while being held on the sample holding tray 13.

  The sample chamber 2 is placed on the surface plate 4. Since the surface plate 4 is placed on the main body base 6 laid on the floor 7 via the mount 5, the sample chamber 2 is subjected to vibration isolation so that vibration is not transmitted.

  In the preliminary chamber 8 adjacent to the sample chamber 2, a support base 43 and a vacuum robot 42 are provided. A sample holding tray 13 is placed on the support base 43 in advance. The gate valve 41 of the preliminary chamber 8 is opened, and the sample 10 transported by a robot on the atmosphere side (not shown) is mounted and held on the waiting sample holding tray 13.

  Thereafter, the gate valve 41 is closed, and the air in the preliminary chamber 8 is extracted by a vacuum pump (not shown) to shift from the atmospheric atmosphere to a vacuum. When the degree of vacuum is the same as that of the sample chamber 2, the gate valve 40 is opened, and the sample holding tray 13 on which the sample 10 is loaded is conveyed to the fixing mechanism 14 on the stage 3 by the vacuum robot 42.

  A drawing process is performed on the sample 10 in the sample chamber 2. Drawing is performed by irradiating the sample 10 with a beam of an electron beam generated in the column 1 to form a circuit pattern. The sample that has been drawn is transported in the reverse order along the transport path. The sample holding tray 13 is transported from the sample chamber 2 into the spare chamber 8, the atmosphere is returned from vacuum to the atmosphere, and only the sample is transported outside the body of the electron beam drawing apparatus.

  The temperature adjustment of the sample will be described.

  A temperature sensor 20 is attached inside the sample holding tray 13. A tray-side sensor connection terminal 21 </ b> A to which the lead wire of the temperature sensor 20 is connected is provided on the lower surface of the sample holding tray 13. On the stage 3, a stage-side sensor connection terminal 22C is provided. When the sample holding tray 13 is placed on the fixing mechanism 14 of the stage 3, the tray side sensor connection terminal 21 </ b> A and the stage side sensor connection terminal 22 </ b> C come into contact with each other and the temperature sensor 20 can measure the temperature in the sample chamber 2. It becomes.

  In the preliminary chamber 8, a support base side sensor connection terminal 22 </ b> D is provided on the support base 43. When the sample holding tray 13 is placed on the support base 43, the tray-side sensor connection terminal 21A and the support-base-side sensor connection terminal 22D come into contact with each other, and the temperature in the spare chamber 8 can be measured by the temperature sensor 20. .

  Thus, the temperature measurement of the sample 10 is performed both when the sample 10 is placed in the sample chamber 2 and when the sample 10 is on standby in the spare chamber 8. In addition, since temperature measurement at different locations in the sample chamber 2 and the spare chamber 8 is performed by the same temperature sensor 20 provided in the sample holding tray 13, differences in gain characteristics and offset of the temperature sensor can be suppressed to be small, and Compared with a device using a temperature sensor, temperature measurement does not vary and temperature measurement accuracy is improved.

  Moreover, the temperature measurement of a sample can be performed stably at a location close to the sample.

  That is, it is desirable to measure the temperature of the sample directly, but it is desirable to directly measure the temperature of the sample. However, since the sample is selected at a position where the temperature sensor is brought into contact, the place of contact is limited. In addition, the sample may be deformed by the contact pressure with which the temperature sensor contacts, and drawing errors may occur. However, according to the embodiment of the present invention, since the temperature sensor is provided in the sample holding tray, it is not necessary to select the contact position of the temperature sensor, there is no deformation of the sample due to the contact of the temperature sensor, and a stable temperature near the sample. Measurement is now possible.

  Further, the temperature measurement of the sample 10 is performed by the temperature sensor 20 provided in the sample holding tray 13 in the sample chamber 2 and in the spare chamber 8, so that the temperature sensor is provided on the stage side and the sample holding tray side. There is no temperature difference compared to the existing one, and the temperature measurement accuracy is improved accordingly.

The temperature difference between the stage side and the sample holding tray side is about a few hundred degrees Celsius. Further, a heating wire heater 30 for adjusting the temperature is provided in the fixing mechanism 14 and the support base 43. . The temperature adjustment in the preliminary chamber and the sample chamber is performed by controlling energization of the heater 30.

  The temperature measurement value of the temperature sensor 20 is converted by the temperature converter 52, the difference between the converted temperature information and the target temperature is calculated by the control unit 50, and the control unit 50 controls the heater driver 51 so that the difference is reduced. By controlling, it is possible to keep the sample at a predetermined temperature and to perform drawing with high accuracy.

  The connection terminals will be described in detail with reference to FIGS.

  First, it demonstrates based on FIG.

  The stage side sensor connection terminal 22C of the stage 3 is formed of a pin. The pin stage side sensor connection terminal 22 </ b> C is slidably held in the connection terminal case 62. The connection terminal case 62 is attached to the mounting base 63 of the stage 3. A push spring 60 is housed in the connection terminal case 62. The stage-side sensor connection terminal 22 </ b> C is pressed by the pressing spring 60. A sensor lead wire is connected to the rear end of the stage side sensor connection terminal 22C. The other end of the sensor lead wire is connected to the temperature converter 52.

  The stage-side sensor connection terminal 22 </ b> C contacts the tray-side sensor connection terminal 21 </ b> A of the sample holding tray 13. Since the stage-side sensor connection terminal 22C is pressed against the tray-side sensor connection terminal 21A by the pressing spring 60, a predetermined contact pressure is maintained in contact between the stage-side sensor connection terminal 22C and the tray-side sensor connection terminal 21A. . For this reason, the contact state of the stage side sensor connection terminal 22C and the tray side sensor connection terminal 21A is kept good.

  FIG. 4 shows another embodiment of the connection terminal.

  This embodiment is different from the embodiment shown in FIG. 3 in that the tray side sensor connection terminal 21A is shaped like a pin. Also in this embodiment, the contact state between the stage-side sensor connection terminal 22C and the tray-side sensor connection terminal 21A is kept good.

  Further, the configuration of the connection terminal described in FIGS. 3 and 4 is also used for the support base 43 of the spare chamber 8.

  As described above, since the contact of the connection terminal is maintained in a good contact state at a predetermined contact pressure by the pressing force of the pressing spring 60 in both the preliminary chamber 8 and the sample chamber 2, a connection failure of the connection terminal may occur. In addition, the signal of the temperature measurement value of the temperature sensor 20 can be reliably taken into the temperature converter 52.

  FIG. 5 shows another embodiment of the connection terminal. In this embodiment, a leaf spring is used.

  The stage-side sensor connection terminal 22 </ b> C is formed of a leaf spring and is supported by the column 65 of the stage 3. The stage-side sensor connection terminal 22 </ b> C contacts the tray-side sensor connection terminal 21 </ b> A of the sample holding tray 13. The stage-side sensor connection terminal 22C is pressed against the tray-side sensor connection terminal 21A by the action of the leaf spring, so that a predetermined contact pressure is maintained in contact between the stage-side sensor connection terminal 22C and the tray-side sensor connection terminal 21A. It is. For this reason, the contact state of the stage side sensor connection terminal 22C and the tray side sensor connection terminal 21A is kept good. Since a leaf spring is used, the configuration is very simple and the manufacturing cost is low.

  FIG. 6 is an example of another connection terminal. In this embodiment, the contact portion of the connection terminal is sandwiched using a leaf spring.

  The tray-side sensor connection terminal 21A is formed of pins. The stage side sensor connection terminal 22 </ b> C is formed by a pair of leaf springs and is supported by the mounting base 66 of the stage 3.

  The pin tray-side sensor connection terminal 21A contacts the stage-side sensor connection terminal 22C formed by a pair of leaf springs. The contact using this leaf spring maintains a predetermined contact pressure, so that the contact state between the stage-side sensor connection terminal 22C and the tray-side sensor connection terminal 21A is kept good. Further, the connection of the connection terminals does not depend on the overlay of the sample holding tray 13 on the stage 3. Since the contact is made by sandwiching the leaf springs, unlike the case of depending on the overlapping, the contact state does not change depending on the mounting state of the sample holding tray 13, and a stable contact state can be obtained.

  In this way, it is desirable that the connection terminal connection using a push spring or a leaf spring has a smaller surface roughness of the contact surface. The contact resistance of the contact surface is reduced, and the measurement error is reduced. Further, a more stable contact state can be obtained by making the material of the contact portion itself an elastic body such as a push spring or a leaf spring.

  The temperature adjustment of the preliminary chamber will be described with reference to FIGS.

  FIG. 7 is a diagram showing the temperature change of the sample in the conventional electron beam lithography apparatus described with reference to FIG. From the atmosphere (A section), it is transported into the preliminary chamber and held on the sample holding tray, and then evacuated until the degree of vacuum is the same as that of the sample chamber (B section).

  By evacuation, the sample is cooled by adiabatic expansion and falls from the target temperature. The temperature drop is about 0.1 ° C. The time of B section is about 20 minutes. The reason why the temperature rises once it falls by about 0.1 ° C. is because it receives the surrounding temperature.

  Next, the sample is transported to the sample chamber while being placed on the sample holding tray, transferred to the stage, the electron beam is calibrated (section C-1), and a waiting time is provided until the sample temperature becomes compatible with the stage temperature. (C-2 section), and then drawing is performed (C-3 section). The sections C-1, C-2, and C-3 are times when the sample is in the sample chamber. C-2 section is about (20-30) minutes.

  FIG. 8 shows the temperature change of the sample in the example of the present invention.

  While the preliminary chamber 8 is evacuated, the temperature of the sample 10 and the sample holding tray 13 decreases. At this time, based on the temperature information of the temperature sensor 20 provided on the sample holding tray 13, the sample 10 is brought to the target temperature via the sample holding tray 13 by heating of the heater 30 mounted on the support base 43 in the preliminary chamber 8. Feedback control is performed so as to approach.

  As a result, the temperature of the sample 10 held by the sample holding means 13 rises and approaches the target temperature, so that the temperature curve rises earlier than in the conventional example.

  Next, it is transported to the sample chamber 2 while being placed on the sample holding tray 13 and transferred to the stage 3 and calibrated in the same manner as in the prior art, but at the same time further targeted by the heater 30 provided in the fixing mechanism 14 on the stage 3. Heating is controlled to approach the temperature. Thereafter, when the temperature falls within the allowable value, drawing is started.

  Through these series of operations, the temperature of the sample 10 and the sample holding tray 13 that have decreased in the preliminary chamber 8 can be brought close to the target temperature in a short time. Thereby, the conventional temperature waiting time (C-2 section) is short or can be removed, and high-precision drawing can be performed without reducing the throughput. Since the temperature waiting time (C-2 section) of about (20-30) minutes is shortened or unnecessary, the throughput is greatly improved.

  Moreover, even during drawing, the drawing accuracy can be further improved by feeding back the heater 30 based on the temperature information of the temperature sensor 20.

  In the embodiment of the present invention, the heater has been described as an example of the heating means for temperature adjustment, but the same effect can be obtained even if a Peltier element capable of temperature adjustment water or heating / cooling is used. However, in the case of temperature-controlled water, it is desirable that the stage is mounted on a non-moving part from the viewpoint of avoiding contamination in the sample chamber due to piping damage.

  Also, since highly accurate feedback control of temperature-controlled water is difficult compared to electrical control means such as a heater, the temperature is constantly adjusted at a constant temperature (for example, the target temperature), and the temperature sensor value is within an allowable range ( For example, when the temperature falls within 0.03 ° C. with respect to the target value, highly accurate drawing is possible even in a sequence operation such as transporting to the sample chamber or starting drawing.

  Next, another embodiment will be described with reference to FIG. 9 and FIG.

  Here, the differences from the embodiment shown in FIG. 1 are mainly described, and the other portions are denoted by the same reference numerals as those in the embodiment of FIG.

  This embodiment is characterized in that the sample holding tray 13 is provided with a heating wire heater 70 as a heating means. It is desirable to wire over the entire surface so that the heat generated by the heater 70 is transmitted to the entire surface of the sample holding tray 13.

  The tray-side heating connection terminal 21 </ b> B connected to the heater 70 is provided on the lower surface of the sample holding tray 13. On the stage 3, a stage-side heating connection terminal 22E is provided. An external heating lead wire is connected to the stage side heating connection terminal 22E. The other end of the heating external lead wire is connected to the heater driver 51.

  The support base 43 of the preliminary chamber 8 includes a support base side heating connection terminal 22F. An external heating lead wire is connected to the support base side heating connection terminal 22F. The other end of the heating external lead wire is connected to the heater driver 51.

  In this manner, the sample holding tray 13 is provided with the heater 70 as a heating means, and the stage side heating connection terminal 22E that is detachably contacted with the tray side heating connection terminal 21B is provided on the stage 3, and the support base 43 is also provided. A support-side heating connection terminal 22F that is detachably in contact with the tray-side heating connection terminal 21B is provided. As a result, the sample holding tray 13 can be heated by the heater 70 of the sample holding tray 13 in either the preliminary chamber 8 or the sample chamber 2 simply by changing the sample holding tray 13. Further, since heating is performed by the same heater 70 in both the preliminary chamber 8 and the sample chamber 2, there is no variation in heating. In addition, since the heating temperature is adjusted by the heater 70 provided in the sample holding tray 13 in direct contact with the sample 10 in both the preliminary chamber 8 and the sample chamber 2, the responsiveness is good and the target temperature can be quickly reached. It becomes possible to approach.

  Further, since the heater 70 is provided on the sample holding tray 13, it is not necessary to mount a heater on the stage 3 and the support base 43, and the cost of the electron beam drawing apparatus can be reduced.

  In order to improve measurement accuracy, recent temperature sensors have a temperature measurement method in which configuration data for each temperature sensor is stored in a storage device such as a ROM to calibrate the signal. In the embodiment of the present invention, the above temperature measurement method is applied, and the measurement data can be calibrated by interposing a storage device immediately before the temperature converter 52.

  The same calibration data can be used by connecting the signal wire which is the sensor lead wire of the temperature sensor 20 from the stage 3 and the support base 43 by providing the connection portion 53 in front of the storage device. . As a result, the temperature of the sample holding tray 13 and the sample 10 at different locations can be measured with high accuracy with a minimum configuration made up of a one-channel temperature converter, one storage device, and one temperature sensor. Therefore, the cost of the electron beam drawing apparatus can be reduced.

  Similarly, the wiring of the heater 30 from the stage 3 and the support base 43 is connected by the connecting portion 53 immediately before the heater driver 51, and the difference is the minimum configuration that can be made with one channel heater driver and one heater. It is possible to control the temperature adjustment of the sample holding tray 13 and the sample 10 at the place.

  Further, in either the temperature sensor or the heater, if a changeover switch (not shown) is provided in the connection portion 53 so that the changeover switch is switched according to the place where the sample holding tray is placed, the sample holding tray is placed. Since the heater and temperature sensor lines that are not present are cut off, the electron beam drawing apparatus can be operated more safely.

  Next, the countermeasure against the magnetic field will be described with reference to FIG.

  When the heater 30 mounted on the sample holding tray 13 is energized, a magnetic field is generated, which affects electron beam drawing and impairs drawing accuracy. Take the following magnetic field countermeasures.

(1). Limiting the current flowing through the heater Since the amount of current flowing through the heater is proportional to the magnitude of the generated magnetic field, the current is limited by software or a control circuit so that a magnetic field exceeding the allowable magnetic field fluctuation amount is not generated.

(2). The magnetic field is canceled by the wiring of the heater. As shown in FIG. 11B, a pair of heating wires as the heater 30 is twisted or wired so that the pair of heating wires run in parallel. Such wiring reverses the current direction 80 flowing through the pair of heating wires, cancels out the generated magnetic flux, and suppresses the generation of a magnetic field.

  Next, supplementary explanation of the embodiment will be given.

  In the above embodiment, the example in which the temperature sensor is attached to the inside of the sample holding tray has been described. However, the same effect can be obtained even if the temperature sensor is attached to the portion close to the sample or the side opposite to the sample. Furthermore, it is possible to perform temperature measurement with higher accuracy by performing calculations such as attaching two or more temperature sensors and averaging the measurement data.

  In addition, when there is another vacuum chamber (for example, a standby chamber for waiting for a sample) between the sample chamber and the spare chamber, the temperature information of the sample holding tray can be obtained by adopting the same configuration as the above-described spare chamber. Needless to say, collection or temperature adjustment control is possible.

  In addition, it is possible to perform drawing with higher accuracy by providing a function for keeping the temperature of the stage constant by mounting a temperature sensor and temperature adjusting means on the stage. That is, since the drawing accuracy deteriorates even if the temperature of the stage itself changes due to temperature adjustment control of the sample and the sample holding tray, it is desirable to provide a temperature adjustment control function separately.

  Further, by setting the stage set temperature lower than the target temperature of the sample holding tray, it becomes possible to always control only by the heating adjustment control of the heater. That is, if the heating amount is reduced, the temperature of the stage is lower than the target temperature of the sample holding tray, so the temperature is lowered, and if the heating amount is increased, the temperature is raised.

  Further, although the electron beam drawing apparatus has been described as an example, the same effect can be obtained in other circuit pattern manufacturing apparatuses such as a scanner that requires exposure in a vacuum.

The figure which shows schematic structure of the electron beam drawing apparatus in the Example of this invention. In the Example of this invention, the perspective view of a sample holding tray. The figure which shows the combination of the connection terminal using the elastic body for press contacts in the Example of this invention. The figure which shows the combination of the connection terminal using the elastic body for press contacts in the other Example of this invention. The figure which shows the combination of the connection terminal using the elastic body for press contacts in the other Example of this invention. The figure which shows the combination of the connection terminal using the elastic body for press contacts in the other Example of this invention. The figure which concerns on a prior art example and shows the temperature graph of a sample. The figure which shows the temperature graph of a sample in the Example of this invention. The figure which shows schematic structure of the electron beam drawing apparatus in the other Example of this invention. The perspective view of a sample holding tray in other examples of the present invention. The figure which shows the wiring of a heat generating line in the Example of this invention. The figure which concerns on a prior art example and shows schematic structure of an electron beam drawing apparatus.

Explanation of symbols

  2 ... Sample chamber, 8 ... Preliminary chamber, 13 ... Sample holding tray, 20 ... Temperature sensor.

Claims (10)

A sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held in a sample holding tray, and a sample in which the pressure is adjusted over a range from vacuum to atmospheric pressure, and the sample is taken in and out of the sample chamber. In the electron beam lithography apparatus having the sample chamber to be kept in the sample holding tray and the adjacent spare chamber,
A temperature sensor for measuring the temperature of the sample is provided in the sample holding tray;
Perform temperature measurement of the sample in the sample chamber and the reserve chamber with the temperature sensor,
An electron beam drawing apparatus, wherein the temperature of the sample is adjusted based on a temperature measurement value of the temperature sensor. A sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held in a sample holding tray, and a sample in which the pressure is adjusted over a range from vacuum to atmospheric pressure, and the sample is taken in and out of the sample chamber. A spare chamber next to the sample chamber to be kept in the sample holding tray;
A movable stage that is provided in the sample chamber and on which the sample holding tray holding the sample is placed, and a support base that is provided in the spare chamber and on which the sample holding tray holding the sample is placed. In an electron beam drawing apparatus having
A heating means for heating the sample is provided on the stage and the support base,
A temperature sensor for measuring the temperature of the sample is provided in the sample holding tray;
Perform temperature measurement of the sample in the sample chamber and the reserve chamber with the temperature sensor,
An electron beam drawing apparatus characterized in that the heating value of the heating means is adjusted based on a temperature measurement value of the temperature sensor. A sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held in a sample holding tray, and a sample in which the pressure is adjusted over a range from vacuum to atmospheric pressure, and the sample is taken in and out of the sample chamber. A preparatory chamber adjacent to the sample chamber that is held in the sample holding tray, and a stage that is provided in the sample chamber and that can move vertically and horizontally on which the sample holding tray holding the sample is placed. An electron beam lithography apparatus having a support table provided in the preliminary chamber and on which the sample holding tray holding the sample is placed;
A temperature sensor for measuring the temperature of the sample is provided in the sample holding tray;
A heating means for heating the sample is provided in the sample holding tray,
Perform temperature measurement of the sample in the sample chamber and the reserve chamber with the temperature sensor,
An electron beam drawing apparatus characterized in that the heating value of the heating means is adjusted based on a temperature measurement value of the temperature sensor. The electron beam drawing apparatus according to claim 2, wherein
The sample holding tray is provided with a tray side sensor connection terminal to which the lead wire of the temperature sensor is connected,
The support base has a sensor-side sensor connection terminal connected to a sensor lead wire that is detachably contacted with the tray-side sensor connection terminal when the sample holding tray is placed on the support base. Provided,
The stage is provided with a stage-side sensor connection terminal connected to a sensor lead wire that is detachably contacted with the tray-side sensor connection terminal when the sample holding tray is placed on the stage. An electron beam drawing apparatus. The electron beam drawing apparatus according to claim 3.
The sample holding tray is provided with a tray-side sensor connection terminal connected to the lead wire of the temperature sensor, and a tray-side heating connection terminal connected to the heating means,
When the sample holding tray is placed on the support table, the support table is connected to a sensor lead wire that removably contacts the tray-side sensor connection terminal. A support base side heating connection terminal connected to a terminal and a heating lead wire in a detachable contact with the tray side heating connection terminal;
When the sample holding tray is placed on the stage, the stage has a sensor-side connection terminal connected to a sensor lead wire that removably contacts the tray-side sensor connection terminal; 2. An electron beam drawing apparatus comprising: a stage side heating connection terminal connected to a heating external lead wire in a detachable contact with the tray side heating connection terminal. The electron beam drawing apparatus according to claim 4.
A combination of connection terminals in which the tray side sensor connection terminal and the support base side sensor connection terminal are detachably contacted, and the tray side sensor connection terminal and the stage side sensor connection terminal are detachably contacted. The combination of connection terminals is an electron beam drawing apparatus characterized in that at least one of the connection terminals has an elastic body for pressing contact. The electron beam drawing apparatus according to claim 5.
A combination of connection terminals in which the tray side sensor connection terminal and the support base side sensor connection terminal are detachably contacted, and the tray side heating connection terminal and the support base side heating connection terminal are detachably in contact. A combination of connection terminals to be connected, a combination of connection terminals in which the tray-side sensor connection terminal and the stage-side sensor connection terminal are detachably contacted, and a connection of the tray-side heating connection terminal to the stage-side heating connection terminal An electron beam drawing apparatus characterized in that at least one connection terminal has an elastic body for pressing contact in any combination of connection terminals that freely come into contact. The electron beam drawing apparatus according to claim 2, wherein
An electron beam drawing apparatus characterized in that a pair of heating wires is used as the heating means, and twisted wirings or parallel wirings are used so that directions of currents flowing through the pair of heating wires are opposite to each other. A sample chamber maintained in a vacuum for performing drawing with an electron beam on a sample held in a sample holding tray, and a sample in which the pressure is adjusted over a range from vacuum to atmospheric pressure, and the sample is taken in and out of the sample chamber. In the temperature control method of the electron beam lithography apparatus having the sample chamber to be kept in the sample holding tray and the adjacent spare chamber,
A temperature sensor for measuring the temperature of the sample is provided in the sample holding tray;
Perform temperature measurement of the sample in the sample chamber and the reserve chamber with the temperature sensor,
A temperature control method for an electron beam lithography apparatus, wherein a difference between a temperature measurement value of the temperature sensor and a target temperature is calculated by a control unit, and the temperature control of the sample is performed by the control unit so that the difference becomes small . A sample chamber kept in a vacuum for forming a circuit pattern on a sample held in a sample holding tray, and a sample whose pressure is adjusted over a range from vacuum to atmospheric pressure and which is taken in and out of the sample chamber. In the circuit pattern manufacturing apparatus having the sample chamber to be kept in the sample holding tray and the adjacent spare chamber,
A temperature sensor for measuring the temperature of the sample is provided in the sample holding tray;
Perform temperature measurement of the sample in the sample chamber and the reserve chamber with the temperature sensor,
A circuit pattern manufacturing apparatus that adjusts the temperature of the sample based on a temperature measurement value of the temperature sensor.

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