JP2006066205A - Ic socket and method for manufacturing ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket not generating a crack or bend. <P>SOLUTION: This IC socket comprises through hole group (15) penetrating from the top face to the undersurface of a case (3) and each probe pin (5) housed and supported in each through hole constituting the through hole group. A flange part (27) formed around the probe pin is mounted on a prepreg layer confronting in each through hole, the probe pin is pressed toward the prepreg layer while heating at a temperature higher than a hardening point of the prepreg layer and lower than a melting point of the case to weld the prepreg to the flange part. The prepreg layer is deformed to mitigate stress generated by pressing. By stress relaxation, the crack and the bend are effectively prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC socket for testing an IC (Integrated Circuit) and a method of manufacturing the IC socket.

  Examples of the IC include a BGA (Ball Grid Array) having solder ball terminals arranged in a lattice shape on the lower surface, and a CSP (Chip Size Package). The electrical characteristics and the like are tested when designing and developing such an IC or shipping a finished product. The test is performed by a test apparatus, and an IC is connected to a substrate (target board) constituting the test apparatus via an IC socket. The IC socket incorporates a large number of probe pins for electrically connecting the solder ball terminals and the terminals of the target board.

  By the way, in recent years, the thinness and smallness of electrical products incorporating ICs have progressed, and accordingly, the demand for lightness, thinness, and shortness has also increased for ICs. For this reason, it is necessary to reduce the distance between terminals, also called the BGA ball pitch, from 1.27 mm to 1.00 mm, from 1.00 mm to 0.80 mm, and further, such as 0.65 mm and 0.50 mm. Narrow pitch is progressing. In the background of such a narrow pitch, there is an inevitably demand for a lighter and smaller IC socket and a narrow pitch between probe pins (inter-pin distance).

For example, there is an IC socket described in Patent Document 1 (hereinafter referred to as “conventional socket” as appropriate). Conventional sockets have a large number of probe pins that can be connected to IC connection terminals (solder balls, bumps, etc.), and each probe pin is a resin housing and a resin back cover that is fixed to the housing with screws. It is configured to be able to be held by a pinching action. One end of each of the held probe pins protrudes outside through a through hole penetrating the housing, and the other end protrudes outside through a through hole penetrating the back cover. One end of each protruding probe pin is pressed against the connection terminal of the IC, and the other end is pressed against the connection terminal of the target board, whereby the former connection terminal and the latter connection terminal are brought into conduction. Patent Document 1 does not include a description of a conventional method for fixing a socket, but is fixed to a target board by bolts passed through bolt holes at four corners of the housing.
WO001 / 37381 (page 5, lines 6 to 20, lines 6 and 7)

  The holding of the probe pin by clamping the housing and the back cover described above has the following problems. In other words. As described above, the back cover is fixed to the housing with screws, but stress is applied to the housing by this fixing, and this stress may cause cracking or warping of the housing. The problem to be solved by the present invention is to provide an IC socket that does not cause cracks and warpage as described above, and a method of manufacturing such an IC socket.

  In order to solve the above problems, the present invention has the following configuration. It should be noted that the definitions of terms used to describe the configuration of the invention described in any claim are applicable to the invention described in other claims as long as possible in nature.

(Characteristics of the invention of claim 1)
An IC socket according to the invention described in claim 1 (hereinafter referred to as “socket of claim 1” as appropriate) penetrates a plate-shaped housing having an upper surface and a lower surface and the upper surface of the housing from the upper surface to the lower surface. It has a through-hole group, and each probe pin accommodated and supported by each through-hole which comprises the said through-hole group. The casing is configured to include an upper resin part including the upper surface, a lower resin part including the lower surface, and an intermediate resin part located between the upper resin part and the lower resin part. The through holes include an upper layer hole portion having an inner diameter Ra penetrating the upper layer resin portion, a middle layer hole portion having an inner diameter Rb penetrating the middle layer resin portion, and a lower layer hole portion having an inner diameter Rc penetrating the lower layer resin portion. It is comprised by these. Furthermore, the probe pin includes a pin body having an outer diameter Da (<Ra, Rb, Rc) and a flange portion having an outer diameter Db (Ra>Db> Rc) extending radially from the outer periphery of the pin body. The middle layer resin portion is thermally welded to the flange portion.

  According to the socket of the first aspect, each probe pin for electrically connecting the terminal of the IC and the terminal of the target board or the like is supported in a state of being accommodated in each through hole. Specifically, the middle layer resin portion welded and fixed to the flange portion of each probe pin supports each probe pin in each through hole. When supporting the probe pin, the middle layer resin portion serves as a cushion. That is, the stress generated by the probe pin support is relaxed. For example, although it is related to the shape of the upper layer hole portion, the lower layer hole portion, and the flange portion, the material of the middle layer resin portion, etc., part of the middle layer resin portion penetrates into the upper layer hole portion and / or the lower layer hole portion due to stress. There may be. This intrusion contributes to stress relaxation by releasing stress generated in the middle layer resin portion. Stress relaxation reduces the occurrence of cracks and warping of the housing (housing), and effectively suppresses the occurrence of defects in the IC socket.

(Characteristics of the invention described in claim 2)
An IC socket according to the invention of claim 2 (hereinafter, appropriately referred to as “socket of claim 2”) is provided with the basic configuration of the socket of claim 1, and the upper resin portion is composed of a melting point t1. The lower layer resin portion is made of a synthetic resin having a melting point t2, and the middle layer resin portion is made of a thermosetting resin having a curing point T (<t1, t2). That is, the middle layer resin portion is cured at a temperature lower than any melting point of the upper layer resin portion or the lower layer resin portion. The melting point t1 and the melting point t2 may be equal or different on the premise that the melting point T is higher than the curing point T.

  According to the socket of the second aspect, in addition to the operational effect of the socket of the first aspect, the middle layer resin portion is cured at a temperature lower than the melting point of either the upper layer resin portion or the lower layer resin portion. If the entire housing is heated at a temperature lower than the curing point T, only the middle-layer resin portion is cured while the upper-layer resin portion and the lower-layer resin portion are left as they are, so that the middle-layer resin portion is welded to the flange portion. The probe pin is supported on the housing. That is, support of the probe pin is realized by a relatively simple method.

(Characteristics of Claim 3)
An IC socket according to the invention of claim 3 (hereinafter referred to as “socket of claim 3” as appropriate) is provided with the basic configuration of the socket of claim 2, and the upper resin portion and the lower resin portion are The middle layer resin portion is made of prepreg and made of glass epoxy.

  According to the socket of claim 3, the action effect of the socket of claim 2 is specifically generated by the glass epoxy and the prepreg.

(Feature of the invention of claim 4)
An IC socket according to the invention of claim 4 (hereinafter referred to as “socket of claim 4” as appropriate) has the basic structure of any one of claims 1 to 3, and the probe pin is a pipe. A movable pin that can be moved in and out in the direction of the upper surface of the housing with respect to the pin body formed in a shape, and a coil spring disposed in the pin body for biasing the movable pin in the protruding direction. It is.

  According to the socket of the fourth aspect, in addition to the operation and effect of the socket of any one of the first to third aspects, the movable pin is brought into contact with the terminal of the IC to be connected to the target board or the like. This contact is made elastically by the action of the means. Therefore, the contact between the terminal and the movable pin is ensured. Further, the distance between the IC and the IC socket (housing) can be set elastically by utilizing the fact that the movable pin can freely move. As a result, the versatility of the IC socket with respect to the IC is improved.

(Feature of the invention of claim 5)
An IC socket manufacturing method according to the invention of claim 5 (hereinafter referred to as “the manufacturing method of claim 5” as appropriate) includes a plate-shaped housing having an upper surface and a lower surface, and the upper surface of the housing. This is a method for manufacturing an IC socket having a through-hole group penetrating to the lower surface and each probe pin accommodated and supported in each through-hole constituting the through-hole group. Specifically, a flange portion formed on the outer periphery of the probe pin is placed on the prepreg layer facing each through-hole constituting the through-hole group, and is equal to or higher than the curing point of the prepreg layer. The prepreg is welded to the flange portion by pressing the probe pin toward the prepreg layer while heating at a temperature lower than the melting point. The IC socket is completed by the above process.

  According to the manufacturing method of the fifth aspect, the prepreg layer serves as a cushion to relieve stress caused by the probe pin support. That is, the force pressing the probe pin generates a stress in the prepreg layer, but this stress is relieved by the deformation of the prepreg. Therefore, there is almost no occurrence of cracks or warpage in the housing. For example, a part of the prepreg layer may enter each through hole due to stress. This penetration contributes to stress relaxation by releasing the stress generated in the prepreg layer. Stress relaxation reduces the occurrence of cracks and warping of the housing (housing), and effectively suppresses the occurrence of defects in the IC socket. The prepreg layer is welded to the flange portion of each probe pin. By welding, each probe pin is supported in each through hole, and an IC socket is completed.

(Characteristics of the invention described in claim 6)
The manufacturing method of the IC socket according to the invention of claim 6 (hereinafter referred to as “the manufacturing method of claim 6” as appropriate) comprises the basic configuration of the manufacturing method of claim 5 and then the pressing and heating. It is designed to be performed in a vacuum state.

  According to the manufacturing method of claim 6, in addition to the effect of the manufacturing method of claim 5, the pressing and heating are performed in a vacuum state, and therefore, in the prepreg layer and / or between the prepreg layer and the flange portion. Air bubbles are difficult to form. When bubbles are formed, the bonding force by welding is weakened by that amount, but if bubbles are not formed, a firm bonding can be realized.

  According to the present invention, the IC socket does not crack or warp. Therefore, it is possible to provide an IC socket that has a low defect occurrence rate and is structurally and electrically stable.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of use of an IC socket. FIG. 2 is a perspective view of the IC socket. FIG. 3 is a plan view of the IC socket. FIG. 4 is a longitudinal sectional view of the IC socket. FIG. 5 is a perspective view for explaining a method of manufacturing an IC socket. FIG. 6 is a longitudinal sectional view of the IC socket before pressurization. FIG. 7 is a longitudinal sectional view of the vacuum chamber. FIG. 8 is a block diagram showing the manufacturing process of the IC socket. In addition, the code | symbol 51a shown in FIG. 4 has shown a part of solidified intermediate | middle layer resin part 51 (it has shown in black for easy understanding). Further, the movable pin, coil spring and contact portion of the pro-pin shown in FIGS. 4 and 6 are drawn without breaking. Further, in FIG. 7, the mold and the IC socket are drawn without breaking.

(Overall structure of IC socket)
As shown in FIGS. 1 to 3, the IC socket 1 includes a housing 3 and a plurality of probe pins 5 (probe pin group 5) supported by the housing 3. The support structure of the probe pin 5 will be described later. In this specification, a single probe pin is expressed as “probe pin 5”, and a single probe pin is expressed as “probe pin group 5”. Each probe pin 5 constituting the probe pin group 5 is formed in the same structure.

(Schematic structure of the housing)
This will be described with reference to FIGS. The housing 3 is a rectangular plate-like member having an upper surface 11 and a lower surface 13 and is made of a synthetic resin composed of three layers as will be described later. The upper surface 11 is formed larger (for example, about 1.5 times) than the upper surface of an IC (not shown) to be connected. A plurality of through-holes 15 (through-hole groups 15) for housing and supporting the probe pins 5 are formed in the housing 3 in the thickness direction. In addition, in this specification, when showing a single through-hole, it represents as "the through-hole 15", and when showing the through-hole which is an aggregate | assembly, it represents as "the through-hole group 15." Each through-hole 15 which comprises the through-hole group 15 is formed in the same structure.

  This will be described with reference to FIGS. The housing 3 is configured by laminating three layers including an upper resin part 41, a lower resin part 61, and an intermediate resin part 51 located between the upper resin part 41 and the lower resin part 61. is there. The configuration of each layer can be as follows, for example. That is, the upper resin part 41 used in this embodiment is made of glass epoxy made by laminating and pressing a glass nonwoven fabric into epoxy resin, and the lower resin part 61 is also made of glass epoxy. The middle layer resin portion 51 is constituted by a prepreg. Here, the prepreg constituting the middle layer resin portion 51 has a curing point T lower than the melting point t1 of the upper layer resin portion 41 and the melting point t2 of the lower layer resin portion 61 when an IC socket manufacturing method described later is adopted. It is necessary. The reason is that the prepreg can be welded to the flange portion 27 of the probe pin 5 by heating only the middle layer resin portion 51 when the IC socket 1 is manufactured. Although the prepreg employed in the present embodiment is a thermosetting material, a thermoplastic material can be employed by appropriately selecting the heating temperature, the timing of heat blocking, and the like. The welding of the middle layer resin portion 51 will be described again when the method for manufacturing the IC socket 1 is described. In the present embodiment, since the upper layer resin portion 41 and the lower layer resin portion 61 are made of the same glass epoxy, the melting point t1 and the melting point t2 are equal, but a glass epoxy having a different melting point is adopted, or a synthetic resin other than glass epoxy In the case of adopting, the melting point must exceed the curing point T of the prepreg. In addition, the curing point T of the prepreg used in the present embodiment is, for example, in the range of 170 to 220 ° C., and is generally around 180 ° C.

  The ratio of the thickness of the upper resin portion 41 or the lower resin portion 61 to the thickness of the housing 3 can be set as appropriate in accordance with the length of the probe pin 5, the position and thickness of a flange portion (described later), and the like. In the present embodiment, the three-layer structure is used. For example, the upper layer resin portion 41 itself is formed of a plurality of different materials, so that the housing 3 is formed of four or more layers. I do not disturb. In any case, the melting point of the layers other than the middle layer resin portion 51 is required to be higher than the curing point T of the middle layer resin portion 51.

(Through hole structure)
This will be described with reference to FIG. The through hole 15 has an upper layer hole portion 16 having an inner diameter Ra penetrating the upper layer resin portion 41, an intermediate layer portion 17 having an inner diameter Rb penetrating the middle layer resin portion 51, and a lower layer hole portion having an inner diameter Rc penetrating the lower layer resin portion 61. 18. The cross sections of the upper layer hole portion 16, the middle layer hole portion 17, and the lower layer hole portion 18 are all substantially circular sharing the central axis. Here, the inner diameter Ra is set larger than the inner diameter Rb, and the inner diameter Rb is set larger than the inner diameter Rc. The relationship between the sizes of the hole diameters will be described again after the structure of the probe pin 5 is described.

(Probe pin structure)
This will be described with reference to FIGS. The probe pin 5 includes a pin body 21, a flange portion 27 extending in a radial direction from the outer periphery of the pin body 21, a movable pin 23 positioned at the upper portion of the pin body 21, and a contact portion 29 positioned at the lower portion of the pin body 21. , And a coil spring 25 is provided inside the pin body 21. The pin body 21 can be constituted by a metal pipe such as beryllium copper. The pin body 21 has substantially the same length as the thickness dimension of the housing 3 and an outer diameter Da (<Ra, Rb, Rc).

(Flange structure)
The flange portion 27 has an outer diameter Db, which is set to be smaller than the inner diameter Ra of the upper layer hole portion 16 and larger than the inner diameter Rc of the lower layer resin portion 18 (that is, Ra>Db> Rc). The reason why the outer diameter Db is set smaller than the inner diameter Ra is to allow the flange portion 27 to pass through the upper layer hole portion 16, and the reason why the outer diameter Db is set larger than the inner diameter Rc is that the flange portion 27 This is so as not to fall into the lower layer hole 18 (that is, to remain in the middle layer hole 17). The middle layer resin portion 51 around the middle layer hole portion 17 is thermally welded to the flange portion 27. As a result, the inner diameter Rb of the middle layer hole portion 17 is substantially equal to the outer diameter Db of the flange portion 27. That is, the middle layer resin portion (prepreg layer) 51 facing the middle layer hole portion 17 is welded to the flange portion 27 so that the probe pin 5 can be housed and supported in the through hole 5.

(Movable pin structure)
The movable pin 23 has a movable pin main body 23a having a circular horizontal cross section and a flange portion 23b integrally formed at the lower end of the movable pin main body 23a. It is made of a metal such as copper. The movable pin main body 23a has an outer diameter (diameter slightly smaller than the inner diameter D4 of the small diameter hole 22h so that the pin main body 21 can slide (vertically move) in the length direction of the pin main body 21 within the small diameter hole 22h. ) D5. The flange portion 23b has a diameter smaller than that of the inner diameter D3 of the pin body 21 and larger than that of the inner diameter D4 of the small diameter hole 22h. That is, the flange portion 23 b is formed inside the pin body 21 so as to be slidable (up and down) in the length direction of the pin body 21. By forming as described above, the movable pin 23 can be moved in and out (vertically moved) in the length direction of the pin main body 21 with respect to the pin main body 21, and the annular protrusion 22 allows the pin main body 23a to move in and out. It comes into contact with the flange portion 23b and functions as a retaining member that prevents the movable pin 23 from being detached from the pin body 21. The peripheral wall surface of the small-diameter hole 22h and the outer peripheral surface of the movable pin 23 are configured so that electrical contact with the former is not interrupted when the latter appears and disappears. Note that most of the movable pin 23 is configured to protrude upward from the upper surface 11 of the housing 3. This is to enable connection with an IC connection terminal (not shown).

(Contact structure)
The contact portion 29 is a member integrated with the lower end of the pin body 21 and is also made of a metal such as beryllium copper. Since the contact portion 29 is a part for bringing the entire probe pin 5 into contact with a pad (not shown) of the target board B (see FIG. 1), the shape thereof is easily brought into physical and electrical contact with the pad. Preferably formed. The shape of the contact portion 29 is configured to protrude downward from the lower surface 13 of the housing 3 when stored and supported in the through hole 15. The contact portion 29 is electrically connected to the movable pin 23 via the pin body 21.

(Structure of coil spring)
The coil spring 25 is configured to be able to urge the movable pin 23 in the protruding direction by contacting the lower surface of the flange portion 23b while being placed on the upper end of the contact portion 29 inside the pin main body 21. In order to perform such a function, the coil spring 25 may be made of a metal such as a piano wire.

(IC socket manufacturing method)
This will be described with reference to FIGS. First, a rectangular plate-like glass epoxy plate constituting the upper layer resin portion 41, a rectangular plate-like prepreg constituting the middle layer resin portion 51, and a rectangular plate-like glass epoxy constituting the lower layer resin portion 61 are prepared. (First step). The upper and lower glass epoxies and the prepreg are formed to have a size in which a small number of margins are added to a size that allows a large number of housings 3 to be obtained. When the number of the casings 3 is taken, the size is obtained by adding the surrounding margin (not shown) to the size of n × m. That is, for example, when taking 120 pieces, the size of 10 × 12 (= 120) pieces and the size of the surrounding margin are required. Next, the upper layer resin portion 41 has upper layer hole portions 16,..., The middle layer resin portion 51 has the same number of upper layer hole portions 16,. The same number of lower layer holes 18,... As the holes 16,... Are formed by a drill (second process). The number of holes to be formed is nm times the number of holes required for one case when the case 3 is taken. In the present embodiment, the middle layer hole portion 17 before the welding and the lower layer hole portion 18 are set to the same inner diameter (that is, Rb = Rc), so that the middle layer resin portion 51 and the lower layer resin portion 61 Can be formed simultaneously. This is because it saves time and is more convenient than drilling holes individually. When the drilling is completed, the upper resin part 41, the middle resin part 51, and the lower resin part 61 are laminated via an adhesive (third step). This completes the case 3 (nm pieces) adjacent to each other. A part of the housing 3 at this time is as shown in the longitudinal sectional view of FIG. That is, a step portion 53 is formed between the upper layer hole portion 16 and the middle layer hole portion 17 by the middle layer resin portion 51 facing the inside of the through hole 15, and the middle layer hole portion 17 and the lower layer hole portion 18 have the same inner diameter.

  Next, the probe pins 5 are dropped into the through holes 15 from the upper surface 11 side of the housing 3 and stored (fourth step). The dropping is performed such that the direction of the contact portion 29 of the probe pin 5 faces the lower surface 13 of the housing 3. Since the dropped flange portion 27 of the probe pin 5 is placed on the stepped portion 53 in the through hole 15, the probe pin 5 cannot be lowered any further. At this time, a part of the movable pin 23 and the upper end shoulder portion of the pin main body 21 protrude upward from the upper surface 11, and the contact portion 29 protrudes downward from the lower surface 13. The dropping of each probe pin 5 is performed for all the housings 3.

  Next, vacuum press is performed. The vacuum press starts by first setting the housing 3 into which the probe pin group 5 is dropped on the lower mold 83 of the mold 81 shown in FIG. The mold 81 includes an upper mold 85 in addition to the lower mold 83, and is supported so as to be movable up and down with respect to the lower mold 83 by a support mechanism (not shown). The upper die 85 is for raising the case 3 when setting it on the lower die 83, and for lowering and pressing each probe pin 5 of the case 3 set after lowering. Escape holes 85h,..., The same number as the number of probe pins 5 are formed on the lower surface side of the upper mold 85, and each upper hole 85 receives a part of the movable pin 23 so that the upper mold 85 is moved to the pin body 21. It is comprised so that a top shoulder part of can be pressed. Although the movable pin 23 itself may be pressed against the urging force of the coil spring 25, pressing only the pin body 21 does not apply a load due to the pressing to the coil spring 25. On the other hand, the contact portion 29 is configured to be able to enter into a clearance hole 83h formed on the upper surface side of the lower mold 83. This is to prevent contact with the lower mold 83 due to intrusion into the escape holes 83h. Reference numerals 91h and 91h denote heaters for applying heat to the casing 3 (middle layer resin portion 51) by heating the mold 81.

  Return to the vacuum press. When the upper mold 85 is raised in the vacuum chamber 91 and the housing 3 is set on the lower mold 83, the air in the vacuum chamber 91 is evacuated to make a vacuum and the heaters 91 h and 91 h are turned on to turn on the mold 81. Increase temperature. As described above, since the curing point T of the prepreg constituting the middle layer resin portion 51 is around 180 ° C., the upper mold 85 is slightly lowered when it reaches around 180 ° C. That is, the probe pin group 5 is pressed while heating the casing (fifth step). At this time, since the temperature of the mold 81 exceeds the curing point T of the middle layer resin portion 51, at least the middle layer hole portion 17 of the middle layer resin portion 51 is deformed by the pressing force received through the flange portion 27. At this time, the probe pin group 5 is pushed in such that the flange portion 27 bites into the middle layer resin portion 51 by further lowering the upper die 85.

  At this time, the middle layer resin portion 51 serves as a cushion due to its flexibility and disperses the pressing force received through the flange portion 27. That is, the pressing force acting on the housing 3 is relaxed. Due to factors such as the thickness of the middle layer resin portion 51, the properties of the middle layer resin portion 51, the size of the gap between the middle layer hole portion 17 and the flange portion 27, a part of the middle layer resin portion 51 pushed away by the flange portion 27 is an upper layer. There may be a case where it enters the hole 16 and rides on the upper surface of the flange 27 or enters the lower layer hole 18. In this case, climbing or intrusion plays a role of releasing the received pressing force without stopping. That is, this partly contributes to relief of the pressing force acting on the housing 3. The relaxation of the pressing force prevents an excessive load from being applied to the housing 3 and indirectly prevents cracks and warpage. In addition, it is normal that a part of the middle layer resin portion 51 enters under the lower surface of the flange portion 27, but there is a case where it does not enter for some reason.

  Here, when the middle layer resin portion 51 is cured and welded to the periphery of the flange portion 27, the upper die 85 is raised and the casings 3,... Are taken out from the die 81 (sixth step). At this time, due to welding, the inner diameter Rb of the middle layer hole portion 17 is in a state where the hole diameter is reduced and is substantially equal to the outer diameter Db of the flange portion 27, and the flange portion 27 is firmly supported by the middle layer resin portion 51. The housing 3 is not cracked or warped. Thus, the manufacturing process of the IC socket 1 is completed. It should be noted that pressurization by the mold 81 or its release, heating by the heaters 91h and 91h or heat shut-off as necessary, and addition of a cooling step, etc., especially the properties of the middle layer resin portion 51 (for example, thermoplasticity, thermosetting, etc. Property, melting point), thickness, etc., can be changed as appropriate. That is, it is possible to select whether to shut off the heating in the pressurized state, release the pressure in the heated state, or the like. The reason why the heating and pressing described above are performed in the vacuum chamber 91 is to prevent air from entering the middle layer resin portion 51 and / or between the middle layer resin portion 51 and the flange portion 27. If air enters, the strength of the welded portion may be insufficient, so this fear is eliminated. If it is determined that there is no problem in strength even if welding is performed in the air, the process in the vacuum chamber 91 may be performed in the air.

  Finally, dicing (cutting) is performed (seventh step). Dicing is an operation of cutting a large number of adjacent casings 3,... With a cutter (not shown). Specifically, after cutting the peripheral blank portion, that is, the ear portion, the adjacent housings 3 (IC connectors 1) are cut. Taking a large number of pieces increases the labor of dicing compared to manufacturing each one, but since the process of heating while pressing can be performed in a lump, it can save time and is advantageous in terms of time. It is.

It is a perspective view which shows the usage example of IC socket. It is a perspective view of an IC socket. It is a top view of IC socket. It is a longitudinal cross-sectional view of an IC socket. It is a perspective view for demonstrating the manufacturing method of IC socket. It is a longitudinal cross-sectional view of the IC socket before pressurization. It is a longitudinal cross-sectional view of a vacuum chamber. It is a block diagram which shows the manufacturing process of IC socket.

Explanation of symbols

1 IC socket 3 Housing 5 Probe pin (probe pin group)
11 Upper surface 13 Lower surface 15 Through hole (through hole group)
16 Upper layer hole portion 17 Middle layer hole portion 18 Lower layer hole portion 21 Pin body 22 Annular projection 22h Small diameter hole 23 Movable pin 23a Pin body 23b Flange portion 25 Coil spring 27 Flange portion 29 Contact portion 41 Upper layer resin portion 51 Middle layer resin portion 53 Step portion 61 Lower layer resin part 81 Mold 83 Lower mold 83h Escape hole 85 Upper mold 85h Escape hole 91 Vacuum chamber 91h Heater B Target board

Claims (6)

A plate-shaped housing having an upper surface and a lower surface;
A through hole group penetrating from the upper surface of the housing to the lower surface;
An IC socket having each probe pin housed and supported in each through-hole constituting the through-hole group,
The casing is configured to include an upper layer resin portion including the upper surface, a lower layer resin portion including the lower surface, and an intermediate layer resin portion located between the upper resin portion and the lower resin portion. ,
Each through-hole has an upper-layer hole portion with an inner diameter Ra that penetrates the upper-layer resin portion, a middle-layer hole portion with an inner diameter Rb that passes through the middle-layer resin portion, and a lower-layer hole portion with an inner diameter Rc that passes through the lower-layer resin portion. , And
The probe pin includes a pin body having an outer diameter Da (<Ra, Rb, Rc) and a flange portion having an outer diameter Db (Ra>Db> Rc) extending radially from the outer periphery of the pin body. And
An IC socket, wherein the middle layer resin portion is thermally welded to the flange portion. The upper layer resin portion is made of a synthetic resin having a melting point t1, the lower layer resin portion is made of a synthetic resin having a melting point t2, and the middle layer resin portion is made of a thermosetting resin having a curing point T (<t1, t2). The IC socket according to claim 1. The IC socket according to claim 2, wherein the upper layer resin portion and the lower layer resin portion are made of glass epoxy, and the middle layer resin portion is made of prepreg. A movable pin that can be projected and retracted in the direction of the upper surface of the housing with respect to the pin main body formed in a pipe shape, and a coil spring disposed in the pin main body for biasing the movable pin in a protruding direction. The IC socket according to any one of claims 1 to 3, wherein the IC socket is configured to include. A plate-shaped housing having an upper surface and a lower surface;
A through hole group penetrating from the upper surface of the housing to the lower surface;
Each of the probe pins housed and supported in each through hole constituting the through hole group, and a manufacturing method of an IC socket,
A flange portion formed on the outer periphery of the probe pin is placed on the prepreg layer facing each through-hole constituting the through-hole group, and the temperature is higher than the curing point of the prepreg layer and lower than the melting point of the housing. A method of manufacturing an IC socket, wherein the prepreg is welded to the flange portion by pressing the probe pin toward the prepreg layer while heating. The method of manufacturing an IC socket according to claim 5, wherein the pressing and heating are performed in a vacuum state.

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