JP2006060050A - Connection device of semiconductor light emitting element, and semiconductor light emitting device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the connection device of a semiconductor light emitting element having an enough heat dissipation characteristic and a semiconductor light emitting device using it. <P>SOLUTION: The connection device of a semiconductor light emitting element comprises a package composed of a cylindrical first conductor 11 on an outer periphery side surface of which a spiral first groove 21 is formed and in which a first through hole 20 is formed, and a second conductor 12 which is fitted to a first through hole 20 via insulating members 13, 14, and exposed from the first conductor 11 at its one end; and a socket 19 composed of a third conductor 16 which includes a second through hole 27 on the inner periphery side surface of which a spiral second groove 28 is formed and is threaded to the first conductor 11, and a fourth conductor 17 which is joined to the lower surface of the third conductor 16 via an insulating member 18 and makes contact with the exposed end of the second conductor 12. The semiconductor light emitting device is configured in such a way that the semiconductor light emitting element 23 is fixedly mounted to the principal surface of the conductor 12 and electrically connected to the conductor 11 via a connection conductor 24, and thereafter hermetically sealed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor light emitting element connecting device and a semiconductor light emitting device using the same, and more particularly to a semiconductor light emitting element connecting device having a structure suitable for obtaining sufficient heat dissipation characteristics and a semiconductor light emitting device using the same. About.

  Semiconductor light-emitting elements, especially light-emitting diodes (LEDs), are widely used in full-color displays, traffic / signal devices, in-vehicle applications, and the like. In this application, ones with particularly high light output are required.

  In recent years, high luminous flux LEDs that can obtain high light output by driving with a large current exceeding several hundred mA have attracted attention. However, it is a problem how to dissipate the heat generated by the semiconductor light-emitting element caused by flowing a large current. ing.

  2. Description of the Related Art Conventionally, there is known a semiconductor light emitting device in which a package integrally including LEDs is pushed into a socket body and fitted (see, for example, Patent Document 1).

  In the semiconductor light emitting device disclosed in Patent Document 1, a package in which concentric internal conductors and external conductors are fixed by press fit through an insulating film, and the package is inserted by pressing. And a socket body provided with heat radiating blades.

  The internal conductor has an electrical connection end and a mounting surface end face on the opposite side of the electrical connection end. An LED chip is fixed to the electrical connection end, and the LED chip is connected to an external conductor via a bonding wire.

  However, in the semiconductor light emitting device disclosed in Patent Document 1, since the package is only pushed into the socket body, there is a problem that sufficient contact cannot always be obtained depending on the dimensional error of the package and the socket body.

  Therefore, there is a possibility that sufficient heat dissipation characteristics for radiating the heat generated by the semiconductor light emitting element due to the large current drive cannot be obtained.

  Another semiconductor light emitting device is known in which a package including LEDs is screwed into a socket body and fitted (see, for example, Patent Document 2).

  In the semiconductor light emitting device disclosed in Patent Document 2, a collar portion that houses an LED chip placed on an insulating substrate, a protective cover that is transparent to the emission wavelength fitted to one end of the collar portion, and the collar A package having a base fitted to the other end of the part, and a socket body into which the base is screwed.

  One electrode of the LED chip is connected to the screw-like portion on the outer peripheral side surface of the base through wiring, and the other electrode is electrically connected to the electrode at the bottom of the base through wiring.

However, since the semiconductor light emitting device disclosed in Patent Document 2 has a so-called incandescent bulb shape, the contact area between the package and the socket body is small, and only the heat generated by the semiconductor light emitting element due to the large current drive is dissipated. There is a problem that sufficient heat dissipation characteristics cannot be obtained.
JP 2001-257301 A (page 3-5, FIG. 1) JP 2003-173703 A (page 3, FIG. 3)

  The present invention provides a connection device for a semiconductor light-emitting element capable of obtaining sufficient heat dissipation characteristics and a semiconductor light-emitting device using the same.

  In the connection device for a semiconductor light emitting element of one embodiment of the present invention, a first conductor having a spiral first groove formed on the outer peripheral side surface and having a first through hole formed therein is insulated from the first through hole. A package including a second conductor that is fitted through a member and has one end exposed from the first conductor, and a second through hole in which a spiral second groove is formed on an inner peripheral side surface. A third conductor that is screwed to the first conductor, and a fourth conductor that is joined to the third conductor via an insulating member and that is in contact with the exposed end portion of the second conductor. And a socket body including the body.

  Moreover, in the semiconductor light emitting device using the semiconductor light emitting element connection device according to another aspect of the present invention, a cylindrical shape in which a spiral first groove is formed on the outer peripheral side surface and a first through hole is formed inside. A plurality of packages each including a first conductor, a second conductor fitted into the first through-hole via an insulating member and having one end exposed from the first conductor; A third conductor having a plurality of second through holes formed with spiral second grooves, and the first conductors of the packages screwed into the second through holes; A socket body comprising a fourth conductor joined to the three conductors via an insulating member and in contact with the exposed end of each of the second conductors, and a main body of the second conductor of each of the packages Semiconductor light-emitting elements each fixed to a surface, and each semiconductor light-emitting element connected to each first conductor A connection conductor for electrically connecting each is characterized by having a means for hermetically sealing each said respective semiconductor light emitting element and the respective connection conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the connection apparatus of the semiconductor light-emitting element which can obtain sufficient heat dissipation characteristic, and a semiconductor light-emitting device using the same can be provided.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing a structure of a semiconductor light emitting device using a semiconductor light emitting element connection device according to a first embodiment of the present invention. FIG. 1A is a plan view thereof, and FIG. FIG. 2 is a view showing a method for assembling a semiconductor light emitting device in the order of steps.

  As shown in FIG. 1, the semiconductor light emitting device 10 of this embodiment includes a package 15 in which a first conductor 11 and a second conductor 12 are fitted via insulating members 13 and 14, and a third conductor 16. And a socket body 19 in which the fourth conductor 17 is joined via an insulating member 18.

  The first conductor 11 of the package 15 is formed in a cylindrical shape having a circular first through hole 20, and its main surface, for example, the outer peripheral side on the upper surface side is formed in a polygonal shape, for example, a hexagonal shape, and the remaining outer peripheral side surface Is formed in a circular shape. A spiral first groove 21, for example, a male screw, is formed on the outer peripheral side surface of the remaining portion of the first conductor 11, and protrudes in the cylinder axis direction on the inner peripheral side surface of the first through hole 20 on the upper surface side. A convex portion 22 is formed.

  A connection conductor 24 for electrically connecting the semiconductor light emitting element 23 to the outside, for example, a connection pad 25 for connecting a gold wire is formed on the main surface, for example, the upper surface of the convex portion 22.

  The second conductor 12 of the package 15 is formed in a cylindrical shape having the same circular shape as the cross section of the first through hole 20 of the first conductor 11 and an outer diameter slightly smaller than the inner diameter of the first through hole 20. Yes.

  Moreover, the 2nd conductor 12 has the recessed part 26 in the main surface, for example, the upper surface. The concave portion 26 is formed in a divergent shape on the upper surface side of the second conductor 12, for example, an inverted trapezoidal cross-sectional structure, and its inner surface forms an inclined surface or a parabolic curved surface, and a conductive adhesive on the bottom surface, Alternatively, light emitted from the semiconductor light emitting element 23 fixed by eutectic bonding is led out to the upper surface side of the second conductor 12.

  The first and second conductors 11 and 12 are, for example, copper plated with nickel and silver. The insulating members 13 and 14 are, for example, thermally conductive silicon resin, and further thermally conductive to thermally conductive silicon resin. It is desirable to apply grease.

  The second conductor 12 is fitted into the first through hole 20 of the first conductor 11 via the cylindrical insulating member 13 and the washer-like insulating member 14, and the outer periphery of the second conductor 12 The side surface is inscribed in the inner peripheral side surface of the first conductor 11 through the insulating member 13, and the upper surface of the second conductor is in contact with the lower surface opposite to the main surface of the convex portion 22 through the insulating member 14. .

  The third conductor 16 of the socket body 19 has a circular second through hole 27, and a second spiral member that is screwed into the first groove 21 of the second conductor 12 on the inner peripheral side surface of the second through hole 27. It has a groove 28, for example a female screw.

  The fourth conductor 17 of the socket body 19 is formed in a plate shape, and the third and fourth conductors 16 and 17 are made of copper plated with nickel and silver, for example.

  The insulating member 18 of the socket body 19 is made of, for example, an alumina plate coated with silver brazing on both sides, and has a circular third through hole 29 larger than the second through hole 27 at the center.

  The third conductor 16 is placed on the fourth conductor 17 via the insulating member 18, and the second through hole 27 of the third conductor 16 and the third through hole 29 of the insulating member 18 are concentric. The third conductor 16 is joined to the fourth conductor 17 via the insulating member 18 by heating to a temperature at which the silver solder melts, for example, 700 ° C. and gradually cooling.

  As shown in FIG. 2, in assembling the semiconductor light emitting device 10, first, the semiconductor light emitting element 23 is fixed to the bottom surface of the recess 26 of the second conductor 12 by a conductive adhesive or eutectic bonding. Next, after inserting the second conductor 12 into the cylindrical insulating member 13 and placing the washer-like insulating member 14 on the upper surface of the second conductor 12, the second conductor 12 is replaced with the first conductor 11. The first through hole 20 is inserted.

  Thereby, the second conductor 12 is inscribed in the inner peripheral side surface of the first conductor 11 through the tubular insulating member 13, and is in contact with the lower surface of the convex portion 22 through the washer-like insulating member 14. The first conductor 11 is electrically insulated and fitted. At this time, the lower end portion of the second conductor 12 protrudes from the lower end portion of the first conductor 11 and is exposed.

  Next, after the semiconductor light emitting element 23 is connected to the connection pad 25 via a connection conductor (not shown), the resin transparent to the emission wavelength in the recess 26 and in the first through hole 20 above the recess 26. (Not shown) is filled, and the semiconductor light emitting element 23 and the connection conductor (not shown) are hermetically sealed.

  Next, a lens 15 that condenses light emitted from the semiconductor light emitting element 23 in one direction is attached to the upper surface of the first conductor 11 with an adhesive, thereby obtaining a package 15 in which the semiconductor light emitting element 23 is integrated. .

  Next, the first groove 21 of the package 15 is applied to the second groove 28 of the socket body 19, and the package 15 is screwed into the socket body 19 by rotating the hexagonal portion of the package 15 with a tightening tool.

  When the lower surface of the second conductor 12 comes into contact with the fourth conductor 17, the convex portion 22 becomes a stopper and the upper surface of the second conductor 12 is pressed by the convex portion 22, so that the package 15 is screwed to the socket body 19. Is done.

  As a result, the first conductor 11 and the third conductor 16 are electrically connected via the first groove 21 and the second groove 28, and the second conductor 12 and the fourth conductor 17 are electrically connected by contact. Thus, the semiconductor light emitting device 40 is completed.

  That is, the first conductor 11 itself constitutes one wiring and is electrically connected to the outside via the third conductor 16. Similarly, the second conductor 12 confidently forms the other wiring and is electrically connected to the outside via the fourth conductor 17.

Accordingly, a sufficient contact area between the first conductor 11 and the third conductor 16 can be obtained, so that the third conductor 16 and the fourth conductor 17 function as a heat sink.
As a result, the heat generated by the semiconductor light emitting element 23 is dissipated to the outside through the third conductor 16 and the fourth conductor 17, so that sufficient heat dissipation characteristics can be obtained.

  3A and 3B are diagrams showing a configuration of a collective semiconductor light-emitting device using a connection device for semiconductor light-emitting elements, in which FIG. 3A is a plan view and FIG. 3B is a BB line in FIG. It is sectional drawing which cut | disconnected along and was seen in the arrow direction.

  As shown in FIG. 3, in the collective semiconductor light emitting device 40 of this embodiment, the socket body 41 has a rectangular plate-shaped third conductor 42, and the third conductor 42 is spaced apart by a predetermined interval. A number of second through holes 47 are formed. A spiral second groove 48, for example, a female screw, is formed on the inner peripheral side surface of the second through hole 47 so as to be screwed into the first groove 21 of the second conductor 12 of the package 15.

  In addition, the socket body 41 has an insulating member 44 formed in the same rectangular shape as the third conductor 42, and the insulating member 44 has a position corresponding to the second through hole 47 of the third conductor 42. A circular third through hole 49 larger than the second through hole 47 is formed. The insulating member 44 is bonded to the lower surface of the third conductor 42.

  The socket body 41 has a plate-like fourth conductor 43 formed in the same rectangular shape as the third conductor 42, and the fourth conductor 43 is connected to the third conductor via the insulating member 44. Bonded to the lower surface of the conductor 42.

  Then, by screwing each package 15 to each second through hole 47 of the socket body 41, one electrode of the semiconductor light emitting element 23 of many packages 15 is commonly connected to the third conductor 42, and the other The electrodes are commonly connected to the fourth conductor 43.

  As a result, the third conductor 42 and the fourth conductor 43 function not only as a common cathode wiring and a common anode wiring but also as a heat radiating plate, so that the collective semiconductor light emitting device 40 having sufficient heat dissipation characteristics can be obtained. It is.

  FIG. 4 is a diagram showing an equivalent circuit of the collective semiconductor light emitting device 40 shown in FIG. As shown in FIG. 4, the cathodes K of the plurality of semiconductor light emitting elements 23 are connected in parallel with the fourth conductor 43 as a common cathode wiring and the anode A with the third conductor 42 as a common anode wiring. Connected to a power source 46.

  Furthermore, if a plurality of collective semiconductor light emitting devices 40 are connected in series or in parallel, a larger collective semiconductor light emitting device can be easily configured.

  As described above, according to the present embodiment, the package 15 in which the spiral first groove 21 is formed on the outer peripheral side surface is fitted into the socket body 41 in which the spiral second groove 48 is formed on the inner peripheral side surface. Therefore, a sufficient contact area between the package 15 and the socket body 41 can be obtained.

  As a result, sufficient heat dissipation characteristics can be obtained, so that a highly reliable semiconductor light-emitting device that operates with a large current can be provided.

  Here, a case where a large number of socket bodies 41 are integrally formed has been described. However, a large number of socket bodies may be placed on a substrate at a predetermined interval, and the socket bodies may be electrically connected to each other via wiring. Absent.

  Moreover, although the case where the 3rd conductor and the 4th conductor were joined by the alumina board which coated silver brazing as an insulating member was demonstrated, in the range in which a required heat dissipation characteristic is acquired, an organic type insulating adhesive agent, For example, you may join with an epoxy-type adhesive agent. According to this, since the heat treatment temperature at the time of joining can be lowered, there is an advantage that the joining process can be simplified.

  Furthermore, although the case where the insulating member is made of a heat conductive silicon resin has been described, the insulating member may be a dielectric film or ceramics.

  5A and 5B are diagrams showing a configuration of a semiconductor light emitting device using a semiconductor light emitting element connection device according to Example 2 of the present invention. FIG. 5A is a plan view thereof, and FIG. 5B is a plan view of FIG. It is a cross-sectional view taken along the line C-C in FIG.

  In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and different portions will be described.

  The present embodiment is different from the first embodiment in that connection pads are formed on the upper surface of the second conductor 12 via an insulating member.

  That is, as shown in FIG. 5, the semiconductor light emitting device 50 includes a main part of a washer-like insulating member 53 for electrical insulation between the lower surface of the convex portion 54 of the first conductor 11 and the upper surface of the second conductor 12. A conductive film 51 is formed on a surface, for example, an upper surface, and a connection pad 52 is formed on a part of the conductive film 51. And the convex part 54 of the internal peripheral side surface of the 1st conductor 11 is formed in the magnitude | size which does not crush the bonding ball of the connection conductor 24 which exposes the connection pad 52 and is connected to the connection pad 52. .

  The conductive film 51 is preferably made of copper formed by, for example, electroless plating, and further plated with nickel and silver.

  By fitting the second conductor 12 into the first through hole 20 of the first conductor 11 via the insulating members 13 and 53, the conductive film 51 contacts the lower surface of the convex portion 54, and the semiconductor light emitting element 23 is It is electrically connected to the first conductor 11.

  Accordingly, when the package 15 is screwed to the socket body 19, there is an advantage that even if the positional relationship between the first conductor 11 and the second conductor 12 is twisted, the connection conductor 24 is not pulled and may be disconnected. .

  If the insulating member 53 is fixed to the upper surface of the second conductor 12 using, for example, an insulating adhesive, and the semiconductor light emitting element 23 is connected in advance to the connection pad 52 via the connection conductor 24, the semiconductor light emitting device 50. The assembly process is simplified, and there is an advantage that the second conductor 12 can be freely attached and detached after the assembly.

  As described above, according to the present embodiment, the first conductor 11 and the second conductor 12 are electrically connected through the conductive film 51, so the first conductor 11 and the second conductor Even when the positional relationship of 12 is twisted, there is no fear that the connection conductor 24 is pulled and disconnected, and a highly reliable semiconductor light emitting device can be provided.

  In the above-described embodiments, the case where the insulating member 13 is cylindrical and the insulating members 14 and 53 are washer-shaped has been described. However, the present invention is not limited to this, and the insulating members 13 and 14 or the insulating members 13 and 53 are not limited thereto. For example, a bottomed cylindrical insulating member having a hole that exposes the concave portion 26 may be used.

  Moreover, although the case where the 2nd conductor 12 was cylindrical shape was demonstrated, you may be a prismatic conductor as shown, for example in FIG. According to this, since the positional relationship between the first conductor 11 and the second conductor 12 is not twisted, there is no possibility that the connection conductor 24 is pulled and disconnected.

  Further, the case where the outer peripheral side surface on the main surface side of the first conductor 11 has a hexagonal cross section has been described. However, there is no particular limitation as long as the package 15 can be screwed into the socket body 19 with a tightening tool. Processing may be performed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the semiconductor light-emitting device using the connection device of the semiconductor light-emitting device based on Example 1 of this invention, Fig.1 (a) is the top view, FIG.1 (b) is A of Fig.1 (a). Sectional drawing cut | disconnected along the A line and looked at the arrow direction. The figure which shows the manufacturing process of the semiconductor light-emitting device using the connection apparatus of the semiconductor light-emitting device based on Example 1 of this invention in order. FIG. 3A is a plan view of the collective semiconductor light-emitting device using the semiconductor light-emitting element connection device according to Example 1 of the present invention, and FIG. Sectional drawing cut | disconnected along B line and looked at the arrow direction. The figure which shows the equivalent circuit of the collective semiconductor light-emitting device using the connection device of the semiconductor light-emitting element which concerns on Example 1 of this invention. FIG. 5A is a plan view of a semiconductor light emitting device using a semiconductor light emitting element connection device according to Example 2 of the present invention, and FIG. 5B is a plan view of FIG. It is sectional drawing cut | disconnected along the -C line and looked at the arrow direction. The top view which shows the other structure of the semiconductor light-emitting device using the connection apparatus of the semiconductor light-emitting element based on the Example of this invention.

Explanation of symbols

10, 50, 60 Semiconductor light emitting device 11 First conductor 12 Second conductor 13, 14, 17, 44, 53, 63 Insulating member 15 Package 16, 42 Third conductor 18, 43 Fourth conductor 19, 41 Socket body 20 First through hole 21 First groove 22, 54, 64 Protruding portion 23 Semiconductor light emitting element 24 Connection conductor 25, 52, 62 Connection pad 26 Recessed portion 27, 47 Second through hole 28, 48 Second groove 29, 49 Third through hole 30 Lens 40 Collective semiconductor light emitting device 45 Resistor 46 Power supply 51, 61 Conductive film

Claims (5)

A cylindrical first conductor in which a spiral first groove is formed on the outer peripheral side surface and a first through hole is formed inside is fitted to the first through hole via an insulating member, and one end portion is A package comprising a second conductor exposed from the first conductor;
A third conductor having a second through hole in which a spiral second groove is formed on an inner peripheral side surface and screwed into the first conductor, and an insulating member interposed between the third conductor and the third conductor A connection device for a semiconductor light emitting element, comprising: a socket body that includes a fourth conductor that is bonded and that contacts the exposed end portion of the second conductor. A cylindrical first conductor in which a spiral first groove is formed on the outer peripheral side surface and a first through hole is formed inside is fitted to the first through hole via an insulating member, and one end portion is A package comprising a second conductor exposed from the first conductor;
A third conductor having a second through hole in which a spiral second groove is formed on an inner peripheral side surface and screwed into the first conductor, and an insulating member interposed between the third conductor and the third conductor A socket body comprising a fourth conductor joined and in contact with the exposed end of the second conductor;
A semiconductor light emitting element fixed to the main surface of the second conductor of the package;
A connection conductor for electrically connecting the semiconductor light emitting element to the first conductor;
A semiconductor light emitting device comprising: a means for hermetically sealing the semiconductor light emitting element and the connection conductor. A cylindrical first conductor in which a spiral first groove is formed on the outer peripheral side surface and a first through hole is formed inside is fitted to the first through hole via an insulating member, and one end portion is A plurality of packages comprising a second conductor exposed from the first conductor;
A third conductive material having a plurality of second through holes each having a spiral second groove formed on an inner peripheral side surface, and the first conductors of the packages screwed into the second through holes. A socket body comprising a body and a fourth conductor bonded to a surface opposite to the main surface of the third conductor via an insulating member and in contact with the exposed end portion of each second conductor; ,
A semiconductor light emitting element fixed to the main surface of the second conductor of each package;
A connection conductor for electrically connecting each of the semiconductor light emitting elements to each of the first conductors;
And a means for hermetically sealing each of the semiconductor light emitting elements and the connection conductors.   The convex part which the main surface of a said 2nd conductor contact | abuts via the said insulating member is further formed in the inner peripheral side surface of a said 1st through-hole. Semiconductor light emitting device.   5. The semiconductor light emitting device according to claim 2, wherein an outer peripheral side surface on a main surface side of the first conductor is formed in a polygonal cross section.

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