JP2006059625A - LED lighting device, pendant lighting fixture and street light - Google Patents

Abstract

Provided is an LED lighting device that has less luminance unevenness, suppresses deterioration of life, and emits indirect light.
An ultraviolet LED module 20 composed of an LED element 10 that emits ultraviolet light and a substrate 11, and a reflective surface 31 that is disposed so as to face the ultraviolet light emission surface 22 of the ultraviolet LED module 20. The LED illumination device 100 includes a reflecting mirror 30 having a phosphor formed on 31. The ultraviolet LED module 20 is disposed at a part of the opening 32 of the reflecting mirror 30, and at least a part of the other part of the opening 32 of the reflecting mirror 30 transmits visible light. In addition, a UV cut filter 34 that attenuates ultraviolet light is provided.
[Selection] Figure 3

Description

  The present invention relates to an LED lighting device. In particular, the present invention relates to a white LED illumination device for general illumination using LED elements that emit ultraviolet light. The present invention also relates to a pendant luminaire and a street lamp provided with such an LED lighting device.

  A light-emitting diode element (hereinafter referred to as an “LED element”) is a semiconductor element that is small, efficient, and emits brightly colored light, and has an excellent monochromatic peak. When emitting white light using an LED element, for example, it is necessary to arrange a red LED element, a green LED element, and a blue LED element in close proximity to perform diffusion color mixing, but each LED element has an excellent monochromatic peak. Therefore, color unevenness is likely to occur. That is, if the light emission from each LED element is not uniform and color mixing is not successful, white light emission with uneven color will occur. Further, it is necessary to balance the emission intensity of the three colors, and there is a problem that the control circuit becomes complicated. In order to easily obtain a white color without using such a complicated device, a technique for obtaining white light emission by combining a blue LED element and a yellow phosphor has been developed (for example, Patent Document 1 and Patent Document 2). ), The most common type of white LED element.

  In addition, in the conventional fluorescent lamp system, since ultraviolet rays emitted from mercury are converted into visible light (particularly white light) by phosphors, an LED element that emits ultraviolet rays and phosphors with a similar model are used. There has also been proposed an illumination device that combines the above (for example, Patent Document 3).

  FIG. 1 shows an illumination device 1000 disclosed in Patent Document 3. FIGS. 1A, 1B, and 1C are an overall perspective view, a cross-sectional view, and a schematic view of the illumination device 1000, respectively. It is a top view.

The lighting device 1000 shown in FIG. 1 has a configuration in which a wiring board 1110 is accommodated inside the envelopes 1120A and 1120B. The envelopes 1120A and 1120B can be made of resin, the envelope 1120A is a light-transmitting cover, and the envelope 1120B has a role as a base for mounting on a ceiling or the like. A semiconductor light emitting device 1130 that emits white light is disposed on the main surface of the wiring board 1110. The semiconductor light emitting device 1130 includes an LED element 1132 and a phosphor 1136 as shown in FIG. Yes. The LED element 1132 is mounted on the mounting member 1134 and is sealed with a resin 1138.
Japanese Patent Laid-Open No. 10-242513 Japanese Patent No. 2998696 JP 11-87770 A

  However, the illumination device 1000 shown in FIG. 1 has the following problems.

  First, the luminance is increased only at a point where the semiconductor light emitting device 1130 is located, luminance unevenness (so-called eyeball) is generated, and there is a high possibility that the general lighting device becomes uncomfortable. Even when the envelope 1120A is a diffusion plate, if the distance between the envelope 1120A and the semiconductor light emitting device 1130 is short, luminance unevenness (eyeball) occurs in the envelope 1120A.

  In the illumination device 1000, as shown in FIG. 2, the ultraviolet light emitting LED element 1136 and the phosphor 1136 are sealed with a resin 1138 in the same manner as when a blue LED element is used (see Patent Documents 1 and 2). However, compared with blue, ultraviolet rays tend to deteriorate the resin 1138 and reduce the transmittance of the resin, so that the lighting device 1000 with a short lifetime is obtained as it is. That is, in the case of a lighting device using LEDs, the long life is often emphasized as one of the advantages, but in the lighting device 1000, an LED lighting device that does not actually have a long life is actually produced.

  In addition, in today's lighting design, not only is it necessary to increase brightness by increasing the brightness, but also so-called soft light or ambient light that uses a lot of indirect light has been increasingly favored. An illumination device that focuses on such indirect light is also desired.

  This invention is made | formed in view of this point, The main objective is that there is little brightness nonuniformity, suppresses the lifetime deterioration, and provides the LED illuminating device which irradiates an indirect light. Another object of the present invention is to provide a pendant luminaire and a street light provided with such an LED lighting device.

  The LED illumination device according to the present invention includes an ultraviolet LED module including an LED element that emits ultraviolet light, a substrate on which the LED element is disposed, and a reflection disposed to face the ultraviolet light emission surface of the ultraviolet LED module. A reflection mirror having a surface and a phosphor formed on the reflection surface, wherein the ultraviolet LED module is disposed in a part of the opening of the reflection mirror, and the opening of the reflection mirror A UV cut filter that transmits visible light and attenuates ultraviolet light is provided in at least a part of the other parts of the unit.

  In a preferred embodiment, the opening of the reflecting mirror is closed by the ultraviolet LED module and the UV cut filter.

  The phosphor is preferably made of a fluorescent material that emits white light by the ultraviolet light from the LED element.

  A photocatalyst may be formed on the reflecting surface of the reflecting mirror.

  In a preferred embodiment, the photocatalyst includes titanium oxide.

  In a preferred embodiment, a heat radiating member for radiating heat of the LED element is provided on the back surface of the ultraviolet LED module.

  The heat radiating member is preferably a heat sink.

  A fan may be attached to the heat sink.

  In a preferred embodiment, the LED element constituting the ultraviolet LED module has an LED chip that emits ultraviolet light, and a metal base portion that houses the LED chip and is formed with a reflective surface that reflects the ultraviolet light. Package, and at least a part of the metal base part and an ultraviolet transmitting member that covers the LED chip, and a plurality of the LED chips are provided in the ultraviolet LED module.

  In a preferred embodiment, the LED element is an LED chip that emits ultraviolet rays, and the LED chip is two-dimensionally mounted on the substrate, and each LED chip is accommodated on the substrate. An opening is provided, and a reflection plate is mounted on which the wall surface of the opening serves as a reflection surface.

  Preferably, the substrate is a heat dissipation substrate, and the LED chip is flip-chip mounted on the substrate.

  In a preferred embodiment, the reflecting mirror has a substantially hemispherical shape, and an outer edge portion of the reflecting mirror, the ultraviolet LED module, and the UV cut filter are substantially flush with each other. It is arranged to be located.

  In a preferred embodiment, the ultraviolet LED module is located in the center of the opening of the reflecting mirror.

  In a preferred embodiment, the UV cut filter is located in the center of the opening of the reflecting mirror, and the ultraviolet LED module is disposed in contact with the reflecting mirror.

  The pendant lighting device of the present invention includes the LED lighting device and a cord attached to the LED lighting device.

  The street light of the present invention includes the LED lighting device and a support bar that supports the LED lighting device.

  The support rod preferably functions as a heat sink.

  According to the LED lighting device of the present invention, since the reflecting mirror having the fluorescent material formed on the reflecting surface arranged to face the ultraviolet emitting surface of the ultraviolet LED module is provided, there is little luminance unevenness and the lifetime is deteriorated. It can be suppressed and irradiated with indirect light. Moreover, since the UV cut filter is provided in the part where the ultraviolet LED module is not disposed in the opening of the reflecting mirror, it is possible to cut the ultraviolet light that has not been converted into visible light. It can be set as a suitable lighting device for general lighting.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.

(Embodiment 1)
The LED lighting device 100 according to the embodiment of the present invention will be described with reference to FIGS. 3 and 4. FIG. 3 schematically shows the configuration of the LED lighting device 100 of the present embodiment. FIG. 4 is a perspective view thereof.

  The LED lighting device 100 according to the present embodiment includes an ultraviolet LED module 20 and a reflecting mirror 30. The ultraviolet LED module 20 includes an LED element 10 that emits ultraviolet light and a substrate 11 on which the LED element 10 is disposed. The reflecting mirror 30 has a reflecting surface 31 disposed so as to face the ultraviolet emitting surface 22 of the ultraviolet LED module 20, and a phosphor (not shown) is formed on the reflecting surface 31. The emission wavelength of the ultraviolet LED in the present embodiment is 200 to 420 nm, typically about 360 nm.

  The ultraviolet LED module 20 is disposed in a part of the opening 32 of the reflecting mirror 30, and a UV cut filter 34 is provided in at least a part of the other part of the opening 32 of the reflecting mirror 30. Is provided. The UV cut filter 34 has a function of transmitting visible light and attenuating ultraviolet light. For example, the UV cut filter 34 is made of a resin such as soda glass or epoxy resin that does not transmit UV. It is also possible to form the UV cut filter 34 from a material in which an ultraviolet absorber is dispersed in a translucent resin. In the present embodiment, UV (ultraviolet light) refers to light having a wavelength of 200 nm to 420 nm. However, the transmission and non-transmission of the UV cut filter mean transmission and non-transmission in the emission wavelength region of the LED used.

  In the configuration of the present embodiment, the opening 32 of the reflecting mirror 30 is blocked by the ultraviolet LED module 20 and the UV cut filter 34. In the illustrated example, the ultraviolet LED module 20 is disposed at the center of the opening 32 of the reflecting mirror 30, and a UV cut filter 34 is disposed around the center. Further, the outer edge portion 36 of the reflecting mirror 30, the ultraviolet LED module 20, and the UV cut filter 34 are arranged so as to be substantially located on the same plane, and a portion on the emission surface side of the LED illumination device 100 is It has a flat configuration.

  The reflecting mirror 30 has a substantially hemispherical shape, and has a reflecting surface 31 such as a paraboloid or an ellipsoid. The material constituting the reflecting mirror 30 is, for example, a metal having high thermal conductivity such as aluminum or stainless steel, or a ceramic material having high thermal conductivity such as alumina. The reflecting surface 31 is coated with a phosphor and the surface is a diffusing surface. For example, the inner surface of the reflecting mirror 30 is like a diffusing surface of an integrating sphere.

  When the LED illumination device 100 of this embodiment is used as a white LED illumination device for general illumination, the phosphor is composed of a fluorescent material that emits white light by ultraviolet light from the LED element 10. For example, phosphors that absorb ultraviolet rays and develop red (R), green (G), and blue (B) colors may be mixed at a predetermined ratio.

As a phosphor (fluorescent substance) that absorbs ultraviolet rays and efficiently emits secondary light, for example, red is CaS: Eu ²⁺ , CaSiN: Eu ²⁺ , Sr ₂ Si ₅ N ₈ : Eu ²⁺ , (Sr, Ca) ₂ SiO ₄ : Eu ²⁺ , Y ₂ O ₂ S: Eu, green is SrGa ₂ S ₄ : Eu ²⁺ (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ , Y ₃ Al ₅ O ₁₂ : Ce ³⁺ , 3 (Ba, Mg, Eu, Mn ) O · 8Al 2 O 3, blue, may be mentioned _{(Sr, Ca, Ba, Eu} ) 10 a _{(PO 4) 6 · C l2} . If these phosphors are mixed at an appropriate ratio, not only white color but almost all color tones can be expressed.

The thickness of the phosphor is, for example, about 10 μm to 1 mm, preferably 20 to 200 μm. Moreover, it is also possible to form a photocatalytic material such as titanium oxide on the reflecting surface 31 together with the phosphor. Since titanium oxide (TiO ₂ ) is a white powder, it can function as an irregular reflection agent (diffusion agent). Therefore, the degree of irregular reflection (diffusion) of the reflection surface 31 is increased and emitted from the phosphor. The color mixture of each color can be made favorable. Further, as the irregularly reflecting agent (diffusing agent), for example, powder and fine particles such as zirconia and alumina can be used.

  A heat sink 40 that dissipates heat from the LED element 10 is provided on the back surface 24 of the ultraviolet LED module 20. Further, in this example, a fan 42 is also attached to the heat sink 40. By providing the heat sink 40 and the fan 42, it is possible to prevent the life of the LED element 10 from being reduced due to heat generation, thereby suppressing the reduction in the life of the LED lighting device 100.

In the example shown in FIGS. 3 and 4, the cord 50 is attached to the reflecting mirror 30 of the LED lighting device 100 to form a pendant lighting fixture. If the attachment 52 of the cord 50 is attached to the ceiling, it can be hung from the ceiling. The cord 50 is a power cord, for example. Note that the cord 50 may be provided with a wiring for switching the amount of light, or another line may be formed. Furthermore, the cord 50 is not limited to the reflecting mirror 30 and can be attached to other portions. Further, the cord (power cord) 50 is made by bringing together fine wires mainly made of copper, and has a surface coated with an insulating material. In this embodiment, the total cross-sectional area of the copper portion is 2 mm (or more than 2), and the configuration is 1 mm ² or more, so that the heat of the reflecting mirror can be efficiently transmitted to the cord and through the wiring. An effect of dissipating heat can be obtained. At this time, the insulating material is more effective when the film is thinner, and is preferably substantially 1 mm or less.

  In the LED illumination device 100 of the present embodiment, the light from the LED element 10 is provided because the LED illumination device 100 includes a reflecting mirror in which a phosphor is formed on the reflecting surface 31 that is disposed to face the ultraviolet emitting surface 22 of the ultraviolet LED module 20. The radiation direction of 70 and the irradiation direction of the light 80 emitted from the LED lighting device 100 can be made different, and luminance unevenness can be suppressed.

  That is, in the illuminating device 1000 shown in FIG. 1, the light emission direction of the semiconductor light emitting device 1130 and the light irradiating direction of the illuminating device 1000 are the same. In the configuration of the present embodiment, since the light 80 is reflected by the reflecting mirror 30 to be the reflected light 75 and then the irradiation light 80, the high-luminance portion where the LED element 10 is present cannot be directly seen. Brightness unevenness can be suppressed. In addition, since the indirect light 80 is irradiated through the reflecting mirror 30, it is possible to provide a lighting device that emits so-called soft light. Furthermore, since the phosphor is formed on the reflecting surface 31 of the reflecting mirror 30, the reflecting surface 31 can be made a diffusing surface, and thereby the luminance unevenness can be further effectively suppressed. Further, if an irregular reflection agent is also formed on the reflection surface 31, the effect can be further increased.

  In addition, the phosphor is formed on the reflecting surface 31 of the reflecting mirror 30 and is different from the configuration in which the phosphor 1136 is sealed with the resin 1138 as shown in FIG. Accordingly, the shortening of the life of the LED lighting device can be suppressed. To explain further, in the case of a blue LED having a light emission center wavelength of around 470 nm, the decrease in the transmittance of the resin when it is lit for a long time is at a satisfactory level, but in the case of an LED in the ultraviolet region with a light emission wavelength of 420 nm or less. If the use time is long, the resin is discolored and the light output is reduced. According to the configuration of the present embodiment, such a problem can be avoided.

  And in the structure of this embodiment, since the UV cut filter 34 was provided in the part in which the ultraviolet LED module 20 is not arrange | positioned among the opening parts 32 of the reflective mirror 30, it was not converted into visible light. Ultraviolet rays can be cut, and as a result, the illumination device 100 suitable for general illumination can be obtained.

  As shown in FIG. 5, a ventilation hole 90 is formed in a part of the reflecting mirror 30 (or a part of the UV cut filter 34), and the air flow 92 from the fan 42 is caused to enter the reflecting mirror 30. You may make it take in. In the example shown in FIG. 5, a through hole (not shown) is formed in the ultraviolet LED module 20 as an intake port for the air 92 from the fan 42. Inside the reflector 30 is a phosphor layer containing titanium oxide as a photocatalyst, and the air that has cooled the LED is stirred in the reflector 30. The stirred air is cooled through a reflector such as aluminum having a high thermal conductivity. Further, since the area of the reflecting mirror 30 is much larger than the area of the substrate on which the LED is mounted, a sufficient heat dissipation effect can be obtained. In addition, bacteria and organic substances in the air are decomposed by the photocatalyst and UV light formed on the reflecting mirror surface, so that sterilization and deodorizing effects can be obtained. In addition, since the above-described configuration has a structure in which UV light is not emitted from the irradiation surface, the safety is high and the UV output can be increased, so that the effect of increasing the decomposition ability can also be obtained.

  Next, the configuration of the ultraviolet LED module 20 will be described with reference to FIGS. Fig.6 (a) is sectional drawing which shows typically the LED element 10 which comprises the ultraviolet LED module 20 of this embodiment, and FIG.6 (b) is the perspective view.

  The LED element 10 in the present embodiment includes an LED chip 12 that emits ultraviolet rays and a metal package (package having a metal base portion) 14 that houses the LED chip 12. When the terminals 18 of the metal package 14 are mounted on the substrate 11 (see FIG. 3), electrical conduction of the LED chip 12 can be ensured. The metal package 14 is formed with a reflective surface 15 that reflects ultraviolet rays from the LED chip 12, and an ultraviolet transmissive glass (ultraviolet transmissive member) 16 that covers the LED chip 12 is formed on the metal package 14. Has been. In this example, the ultraviolet transmissive glass 16 is formed in a cannonball shape, and a material having high translucency is used at the wavelength emitted by the LED, and is made of, for example, quartz.

  The LED chip 12 is a semiconductor element having a light emitting layer made of InGaN. The LED chip 12 is known to change the emission wavelength and the emission efficiency depending on the In composition. FIG. 7 shows the relationship between the wavelength and the external quantum efficiency. In the LED chip 12 having the InGaN light emitting layer, the wavelength increases as the In composition ratio increases. The external quantum efficiency is a conversion ratio of photon energy that can be extracted outside the LED with respect to input energy.

  As shown in FIG. 7, there is a peak around 400 nm (more precisely, 405 nm). As a result, when an InGaN-based LED is selected, the total light emission efficiency of the lighting device can be improved by using the LED having this wavelength. Further, in the configuration of this embodiment, by using a plurality of LED chips 12, the amount of ultraviolet rays emitted from the ultraviolet LED module 20 is increased.

  The ultraviolet LED module 20 can also be configured as shown in FIG. 8 (a) is a top view schematically showing the configuration of the ultraviolet LED module 20, FIG. 8 (b) is a sectional view taken along line VIIIB-VIIIB in FIG. 8 (a), and FIG. 8C is a perspective view thereof.

  In the ultraviolet LED module 20 shown in FIG. 8, the LED chips 12 are mounted on the substrate 11 two-dimensionally (in a matrix). In the present embodiment, the LED chip 12 is flip-chip mounted on the substrate 11.

  The substrate 11 is a heat dissipation substrate. In the present embodiment, a heat dissipation substrate having a thermal conductivity of 1.0 W / Km or more is used. For such a heat dissipation substrate, for example, a high heat conductive material such as aluminum is used. There are a metal substrate having an insulating member formed on the surface as a base, a ceramic substrate mainly made of ceramic, a composite substrate, and the like. A reflective plate 17 is placed on the substrate 11, and the reflective plate 17 is provided with an opening 19 for accommodating each LED chip 12. The wall surface of the opening 19 is the reflecting surface 15. The reflecting plate 17 preferably has a high thermal conductivity and a high surface reflectance, and is made of, for example, aluminum or copper plated with silver.

  In the case of the configuration shown in FIG. 8, since it is a high heat dissipation configuration, it has a high density (for example, the LED arrangement pitch is about 1 to 10 mm, in this embodiment 2 mm pitch) and a large output (light output of 1 W or more). UV light source can be obtained. Therefore, it is possible to emit a large amount of UV light from a relatively small area, and as a result, it is possible to realize indirect illumination that is small in size and has little light loss.

  An example in which the ultraviolet LED module 20 shown in FIG. 8 is combined with a heat sink 40 and a fan 42 is shown in FIG. The heat sink 40 is made of copper with fins 42, for example. The fan 42 is, for example, a DC axial fan, and operates with DC (direct current) together with the LED, so that an effect of simplifying the circuit configuration can be obtained. Further, by unifying the power source voltage of the LED light source and the operating voltage of the fan, a lighting device having a simpler configuration can be obtained.

  For example, the illumination light source according to the present embodiment has a configuration in which three ultraviolet LEDs having an operating voltage of approximately 3.6 V and a resistance of 30 Ω are connected in series, and five parallel LEDs are configured with a total of 15 ultraviolet LEDs. ing. The rating of the lighting device is 12V, 200 mA, and it is designed to flow 40 mA to each LED. Here, 12V is used as a general DC voltage. Since the voltage is relatively low, there is little risk of electric shock and the like, which is advantageous from the viewpoint of safety. Also, general lead batteries and the like having many 12V are on the market, and can be used as a relatively versatile illumination light source. Further, since the operating voltage of the fan is 12 V, the illumination light source and the fan have the same voltage, and there is no need for a booster / decompressor circuit, and the circuit configuration is very simple.

  In the present embodiment, an example in which a plurality of LED chips 12 are provided in the ultraviolet LED module 20 is shown, but one LED chip 12 having a large light output is also possible. The chip having a large light output here refers to a chip in which the size of the light emitting surface of the LED chip is 0.5 mm square or more. Note that the size of the chip used in this embodiment is 0.3 mm square.

  However, a chip having a large light output has a high UV output per unit area of the LED package, and therefore there is a possibility that deterioration of the resin or glass in the package portion will also increase. Therefore, it is also effective to arrange a large number of small output LEDs so that the UV output per unit area of the package is below a certain level. In general, when the size of one LED chip is increased, the unit price per unit light emitting area is increased, and therefore, it is preferable to use a large number from the viewpoint of cost.

(Embodiment 2)
Next, a modified example according to the LED lighting device of the embodiment of the present invention will be described with reference to FIGS. For the sake of brevity, the same points as in the first embodiment are omitted or simplified.

  As shown in FIG. 10, the LED illumination device 100 according to the embodiment of the present invention places the UV cut filter 34 in the center of the opening 32 of the reflecting mirror 30 and contacts the ultraviolet LED module 20 with the reflecting mirror 30. It can also be arranged. In the example shown in FIG. 10, the ultraviolet LED module 20 has a donut shape, and the UV cut filter 34 is located in the center thereof.

  Since the ultraviolet LED module 20 is brought into contact with the reflecting mirror 30 in this manner, the heat generated by the LED element 10 can be transmitted to the reflecting mirror 30, so that the heat sink 40 shown in FIG. 3 can be omitted. In order to improve heat dissipation, the reflecting mirror 30 is preferably made of, for example, a highly thermally conductive metal such as aluminum or a ceramic material such as alumina.

  Further, even when the ultraviolet LED module 20 is positioned at the center as in the configuration shown in FIG. 11, the ultraviolet LED module 20 can be brought into contact with the reflecting mirror 30 by changing the shape of the reflecting mirror 30. . In this example, the reflecting mirror 30 is divided into two parts (30A, 30B) and has a shape rotated about a line 85.

  Furthermore, the LED lighting device 100 according to the embodiment of the present invention can be formed not only in the form of a pendant as shown in FIG. 3 but also in the form of a street lamp as shown in FIG. In the configuration shown in FIG. 12, the ultraviolet LED module 20 is brought into contact with a support bar (pole) 60 to transmit heat to the support bar 60. Thus, by utilizing the support bar 60 as a heat sink, the member of the heat sink 40 shown in FIG. 3 can be omitted. In the case where the support rod 60 functions as a heat sink, it is preferable that the support rod 60 be made of a material having excellent heat conductivity (for example, a metal material having a high thermal conductivity such as aluminum or a ceramic material such as alumina).

  As shown in FIG. 13, the street lighting type LED lighting device 100 can also change the shape of the reflecting mirror 30 and attach the ultraviolet LED module 20 disposed on the support rod 60 to the end of the reflecting mirror 30. is there. The roadside tree type LED lighting device 100 can be used not only outdoors but also indoors.

  In the above-described embodiment, an illumination device for downlight is mainly shown, but it can also be used as an illumination device for uplight. For example, in the configuration shown in FIG. 12, if the bottom of the reflecting mirror 30 is attached to the upper part of the support bar 60, it can be used for uprighting. Further, for example, a predetermined base can be attached to the LED lighting apparatus 100 as shown in FIG. 10 to form a stand.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course various modifications are possible. For example, the configurations and modifications in Embodiments 1 and 2 can be combined as appropriate. Moreover, although the case of the titanium oxide (or the thing which has titanium oxide as a main component) was demonstrated as an example of a photocatalyst in the above-mentioned embodiment, the same effect can be acquired also with another photocatalyst. Here, the photocatalyst refers to a photocatalyst capable of sterilizing and deodorizing a substance in the vicinity of the catalyst when the photocatalyst is irradiated with light (not limited to UV). Furthermore, although the example of 12V was introduced as an example of DC voltage in the above-mentioned embodiment, it is added that there is 24V as another example of a general DC voltage.

  According to the present invention, it is possible to provide an LED illumination device that has less luminance unevenness, suppresses deterioration of life, and irradiates indirect light. Therefore, particularly for general illumination using LED elements that emit ultraviolet light. This can contribute to the spread of white LED lighting devices.

(A) is the whole perspective view of the conventional illuminating device 1000, (b) is the cross-sectional view, (c) is the schematic plan view Sectional view of a conventional semiconductor light emitting device 1130 Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention. The perspective view of the LED lighting apparatus 100 which concerns on embodiment of this invention. Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention. (A) is sectional drawing of the LED element 10, (b) is the perspective view. Graph showing the relationship between wavelength of InGaN LED and external quantum efficiency (A) is a top view schematically showing the configuration of the ultraviolet LED module 20, (b) is a sectional view taken along line VIIIB-VIIIB in (a), and (c) is a perspective view thereof. Sectional drawing which shows the structure which combined the ultraviolet LED module 20, the heat sink 40, and the fan 42 Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention. Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention. Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention. Sectional drawing of the LED lighting apparatus 100 which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Board | substrate 12 LED chip 14 Metal package 15 Reflective surface 16 Ultraviolet transmissive glass 17 Reflector 18 Terminal 19 Opening part 20 Ultraviolet LED module 22 Ultraviolet light emission surface 30 Reflective mirror 31 Reflective surface 32 Reflective mirror opening part 34 UV cut filter 36 Reflective mirror 40 heat sink 42 fan 50 cord 52 attachment tool 60 support rod 90 ventilation hole 100 lighting device 1000 lighting device

Claims (17)

An ultraviolet LED module comprising an LED element that emits ultraviolet light, and a substrate on which the LED element is disposed;
A reflecting surface having a reflecting surface arranged opposite to the ultraviolet light emitting surface of the ultraviolet LED module, and a phosphor formed on the reflecting surface;
The ultraviolet LED module is disposed in a part of the opening of the reflecting mirror, and
The LED lighting device, wherein a UV cut filter that transmits visible light and attenuates ultraviolet light is provided in at least a part of the other part of the opening of the reflecting mirror. The LED illumination device according to claim 1, wherein an opening of the reflecting mirror is blocked by the ultraviolet LED module and the UV cut filter. The LED lighting device according to claim 1, wherein the phosphor is made of a fluorescent material that emits white light by the ultraviolet light from the LED element. The LED lighting device according to any one of claims 1 to 3, wherein a photocatalyst is formed on the reflecting surface of the reflecting mirror. The LED lighting device according to claim 4, wherein the photocatalyst includes titanium oxide. The LED lighting device according to claim 1, wherein a heat radiating member for radiating heat of the LED element is provided on a back surface of the ultraviolet LED module. The LED lighting device according to claim 6, wherein the heat dissipation member is a heat sink. The LED lighting device according to claim 7, wherein a fan is attached to the heat sink. The LED elements constituting the ultraviolet LED module are:
An LED chip that emits ultraviolet rays;
A package having a metal base portion in which the LED chip is housed and a reflective surface for reflecting the ultraviolet rays is formed;
An ultraviolet transmissive member covering at least a part of the metal base and the LED chip,
The LED lighting device according to claim 1, wherein a plurality of the LED chips are provided in the ultraviolet LED module. The LED element comprises an LED chip that emits ultraviolet rays,
The LED chip is two-dimensionally mounted on the substrate,
The LED lighting device according to claim 1, wherein an opening for storing each LED chip is provided on the substrate, and a reflecting plate having a wall surface of the opening as a reflecting surface is placed. The substrate is a heat dissipation substrate;
The LED lighting device according to claim 10, wherein the LED chip is flip-chip mounted on the substrate. The reflecting mirror has a substantially hemispherical shape,
The LED according to any one of claims 1 to 11, wherein an outer edge portion of the reflecting mirror, the ultraviolet LED module, and the UV cut filter are disposed so as to be substantially located on the same plane. Lighting device. The LED illumination device according to claim 12, wherein the ultraviolet LED module is located at a center of the opening of the reflecting mirror. The UV cut filter is located in the center of the opening of the reflecting mirror,
The LED illumination device according to claim 12, wherein the ultraviolet LED module is disposed in contact with the reflecting mirror. LED lighting device according to any one of claims 1 to 14,
A pendant lighting fixture comprising a cord attached to the LED lighting device. LED lighting device according to any one of claims 1 to 14,
A street lamp comprising a support bar for supporting the LED lighting device. The street light according to claim 16, wherein the support bar functions as a heat sink.

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