JP2006019520A - Piezo-electric/electrostrictive device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the adhesion of parts held at the other edge of moving parts 11 and 12 in a piezo-electric/electrostrictive device that contains a piezo-electric/electrostrictive element 10b at the side of movable parts 11 and 12 in a substrate 10a having a pair of symmetric movable devices 11 and 12 and a fixed part 13 at either edge of these moving parts 11 and 12. <P>SOLUTION: A substrate 10a constituting a piezo-electric/electrostrictive device is equipped with a pair of long-size devices 15 and 16 that mount parts H at the other edge of movable parts 11 and 12. The mounting devices 15 and 16 extend in a given distance with slit-like clearances 15a and 16a having a predetermined width along the internal surface of movable parts 11 and 12 at return from the other edge of the parts 11 and 12. In this way, the adhesive area of the mount devices 15 and 16 for the parts H can be extended to substantially improve the adhesion of parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention transmits the displacement operation of the piezoelectric / electrostrictive element to a pair of left and right movable parts to control a controlled component held on the other end side of both movable parts, or on the other end side The present invention relates to a piezoelectric / electrostrictive device of a type in which the displacement operation of a pair of left and right movable parts sandwiching a part to be inspected is detected by a piezoelectric / electrostrictive element to detect characteristics of the part to be inspected.

  In the conventional piezoelectric / electrostrictive device of this type, as shown in FIG. 1, piezoelectric / electrostrictive elements 10b are arranged on the outer surfaces of the left and right movable parts 11 and 12 constituting the base 10a. Thus, the movable parts 11 and 12 are connected to each other by the connecting part 13 on one end side, and the movable part main bodies 11a and 12a extend to the other end side. The other end is formed in attachment parts 11b and 12b to which parts H such as controlled parts and parts to be inspected are attached.

  Each attachment portion 11b, 12b protrudes inward with a predetermined width from the other end of each movable portion main body 11a, 12a, and is opposed to each other while maintaining a predetermined interval. The component H is fixed to the inner side surfaces 11b1 and 12b1 (joint surfaces) of the mounting portions 11b and 12b via adhesives h1 and h2 on both side surfaces thereof, and both mounting portions of the movable portions 11 and 12 are attached. 11b and 12b.

  In the piezoelectric / electrostrictive device of this type, when the component H to be attached is long in the longitudinal direction of the device, it is necessary to lengthen the length L4 of each attachment portion 11b, 12b as shown in FIG. In this case, the total length L1 of the device becomes longer by the extension of the length L4 of each attachment portion 11b, 12b. In this way, when the length h of the part H to be attached is the same as the length L4 of each attachment part 11b, 12b, the total length L1 of the device is restricted by the length h of the part H.

  On the other hand, when the long component H shown in FIG. 2 is attached to each of the attachment portions 11b and 12b, the length L4 of each of the attachment portions 11b and 12b is not changed, for example, as shown in FIG. Regardless of the length h, the total length L1 of the device does not change. However, in this case, the length L4 of each mounting portion 11b, 12b is shorter than the length h of the component H, and the area (bonding area) of the joint surface with respect to the component H is reduced, and adhesives h1, h2 are used. When a normal resin adhesive is used, the adhesive strength to the component H is reduced. In the worst case, the reduction in the adhesive strength with respect to the component H causes the component H to be detached from the mounting portions 11b and 12b.

  If the length H of the part H having a long dimension h is not changed, the mass of the part H is increased by the length h, so that when the bonding area is small, for example, When the mounting portions 11b and 12b are in the state shown in FIG. 1, the impact applied to the adhesives h1 and h2 is increased, and the mounting portions 11b and 12b are easily detached from the mounting portions 11b and 12b.

  In the piezoelectric / electrostrictive device of this type, when the component H is detached from one of the attachment portions 11b and 12b, the other of the attachment portions 11b and 12b must support the component H and receive no impact applied to the component H. Don't be. In this state, the component H is easily detached from the other mounting portion, the support balance in the mounting state is broken, and one mounting portion supported by the action of torsional force and the movable portion connected thereto are broken. There is also a fear.

  In order to cope with this, it is necessary to use an adhesive with extremely high adhesive strength, but a special adhesive that can secure sufficient adhesive strength no matter how small the adhesive area is not common. At the same time, there is a limit in using an adhesive having such special characteristics.

  In the piezoelectric / electrostrictive device of this type, when the displacement of both attachment portions 11b and 12b is increased to improve the device characteristics, the movable portion main bodies 11a and 12a of both movable portions 11 and 12 are made long and movable. Although it is necessary to increase the amount of displacement of the main parts 11a and 12a, in order to lengthen the movable parts 11a and 12a of the two movable parts 11 and 12 without increasing the total length L1 of the device, both attachment parts 11b and 12b Must be shortened. As a result, the bonding area of the joint surfaces 11b1, 12b1 in each of the attachment portions 11b, 12b is further reduced, and the adhesive force of the component H to the joint surfaces 11b1, 12b1 of each of the attachment portions 11b, 12b is further weakened. Is more easily detached from the joint surfaces 11b1 and 12b1 and is likely to fall off.

  In the piezoelectric / electrostrictive device of this type, in order to attach the component H to the attachment portions 11b and 12b of both the movable portions 11 and 12, in general, the joint surfaces 11b1 and 12b1 are provided via resin adhesives h1 and h2. However, the resin adhesives h1 and h2 cause a decrease in hardness and Young's modulus with respect to temperature changes above room temperature. The temperature change in the usage state of the piezoelectric / electrostrictive device is, for example, in the range of room temperature to 100 ° C., but even in this temperature range, the adhesives h1 and h2 become soft when the temperature is high. Therefore, the distortion of the adhesives h1 and h2 when an external force is applied is greatly different between the room temperature state and the higher temperature state. The device characteristics of the piezoelectric / electrostrictive device of this type are Even if it is set in the state, it is greatly different in the high temperature state.

  3 and 4 show the respective operating states of the device at a low temperature such as room temperature and at a higher temperature than room temperature. The effect of such a temperature change is that the strain applied to the adhesive increases as the adhesion area decreases, so that the effect of temperature fluctuation also increases. Therefore, the larger the bonding area, the smaller the influence of temperature fluctuation.

  In the piezoelectric / electrostrictive device of this type, when the size of the component H increases and the mass increases, the fixing portion 13 for fixing the device itself must support the combined mass of the component H and the device itself. In the event of an impact, the fixing portion 13 is likely to come off. If the length L2 of the fixing portion 13 is increased in order to increase the bonding area, the total length L1 of the device also increases.

  Accordingly, an object of the present invention is to increase the displacement of each movable part in the piezoelectric / electrostrictive device of this type without changing the overall length of the device and without reducing the adhesion area on the joint surface of the attachment part. In addition, it is to secure sufficient adhesion between each mounting portion and the component and to fix the device itself, and furthermore, to firmly attach the component and the device particularly when large and heavy components or adhesive strength is required.

  The present invention relates to a piezoelectric / electrostrictive device and a method for manufacturing the same, and includes at least one of the movable parts in a base having a pair of movable parts facing each other and a fixed part that connects the movable parts to each other at one end side. A piezoelectric / electrostrictive device in which a piezoelectric / electrostrictive element is disposed on one outer surface is an application target.

  Thus, in the piezoelectric / electrostrictive device according to the present invention, the base body is provided with a pair of long attachment portions for mounting the controlled component or the inspection target component on the other end side of the two movable portions. The mounting portion is characterized in that it is extended from the other end of the movable portion by a predetermined length while holding a slit-like gap having a predetermined width along the inner surface of the movable portion.

  In the piezoelectric / electrostrictive device according to the present invention, the fixed portion constituting the base body is provided with a pair of slit-like gaps having a predetermined width extending along the inner side surface of each movable portion on opposite sides thereof. It can be configured.

  In the piezoelectric / electrostrictive device according to the present invention, the substrate is formed of a ceramic laminate formed by laminating and firing a plurality of ceramic green sheets, or a plurality of metal plates. It can be constituted by a metal laminate formed by lamination and bonding, and can also be constituted by bending a single metal flat plate.

  Further, in the piezoelectric / electrostrictive device according to the present invention, the slit-like gap between the movable part and the mounting part constituting the base and / or the slit-like gap along both movable parts of the fixed part, It is possible to set the dimension so as not to restrict the displacement of the movable part during the operation of the piezoelectric / electrostrictive device, and it is possible to form each attachment part to have the same or similar thickness as each movable part. A controlled component or a component to be inspected is fixed to an inner side surface of each mounting portion constituting these bases via an adhesive, and the piezoelectric / electrostrictive device includes the controlled component or the component to be inspected. It can be used in a state of being sandwiched between the two attachment portions.

  A more specific configuration of the piezoelectric / electrostrictive device according to the present invention includes a pair of opposed plate-like movable parts, a fixed part that connects the two movable parts to each other at one end side, and the movable parts. A piezoelectric / electrostrictive device comprising a base having a mounting portion connected to the other end of the base and a piezoelectric / electrostrictive element disposed on an outer surface of at least one of the movable parts constituting the base. In addition, there is a slit-like gap between each of the movable parts and each of the mounting parts, and the length of the slit-like gap L12 connects each of the movable parts and each of the mounting parts. It is characterized by being set larger than the length L5. In the piezoelectric / electrostrictive device, the length L12 of the slit-shaped gap is at least twice the length L5 of each connecting portion, preferably 5 times or more.

  Note that the length L5 of the connecting portion and the length L12 of the slit-shaped gap in the piezoelectric / electrostrictive device mean the dimensions of the parts defined in the piezoelectric / electrostrictive device shown in FIG.

  The method for manufacturing a piezoelectric / electrostrictive device according to the present invention includes a pair of opposed movable parts, a fixed part that connects the two movable parts to each other on one end side, and an inversion from the other end side of each movable part. In this state, a piezoelectric / electrostrictive element is provided on at least one outer surface of both movable parts of the base having a mounting part that holds a slit-like gap having a predetermined width along the inner side surface of the movable part. This is a method of manufacturing a piezoelectric / electrostrictive device that is provided.

  Thus, the first manufacturing method of the piezoelectric / electrostrictive device according to the present invention employs a base block formed by laminating and firing a large number of ceramic green sheets as the base material, and a predetermined portion of the base block. Is cut along the lamination direction of the ceramic green sheets to form a base body having the movable parts, the fixed parts, and the attachment parts.

  According to a second method of manufacturing a piezoelectric / electrostrictive device according to the present invention, a flexible and bendable metal flat plate is adopted as a material for forming the base, and the base is flattened. A punching structure is formed by punching into the developed shape, and a predetermined part of the punching structure is bent to form a base body having the movable parts, the fixed parts, and the mounting parts. It is characterized by this.

  The third method for manufacturing a piezoelectric / electrostrictive device according to the present invention employs a base block formed by laminating and bonding a plurality of metal plates, and a predetermined portion of the base block is placed on the metal plate. The base body having the movable parts, the fixed parts, and the attachment parts is formed by cutting along the stacking direction.

  The piezoelectric / electrostrictive device according to the present invention is provided with a long attachment part in each movable part constituting the base, and the bonding surface of each attachment part is large, and the attachment part and the component are bonded to each other. The area can be set large. For this reason, according to the piezoelectric / electrostrictive device, the adhesive strength of the component to the joint surface of each attachment portion is strong, and the component does not easily come off from each attachment portion, thus forming a joint structure that is strong against impact. In addition, it is possible to prevent damage to the other mounting portion due to the detachment of the component from the one mounting portion.

  Furthermore, the piezoelectric / electrostrictive device according to the present invention has a pair of left and right movable parts and a piezoelectric / electrostrictive device on at least one outer surface of both movable parts in a base having a fixed part that connects the two movable parts to each other on one end side. A piezoelectric / electrostrictive device comprising an electrostrictive element, wherein the base body has a pair of attachment portions for attaching a controlled component or a component to be inspected on the multi-end side of the two movable portions. The height dimension of the attachment portion is shorter than the device height. In other words, the device height is longer than the height of the component to be attached.

  In addition, the piezoelectric / electrostrictive device according to the present invention is characterized in that the boundary between the attachment portion and the movable portion (thin plate portion) is curved (R shape).

  Further, in the joint structure, each attachment portion is extended from the other end of each movable portion by a predetermined length while holding a slit-like gap having a predetermined width along the inner surface of the movable portion. For this reason, it is possible to form a joint structure having a strong adhesive force between each mounting portion and a component without increasing the overall length of the device and without reducing the displacement characteristics of both movable portions.

  In addition, since the bonding structure has a large part that adheres to the mounting part, the mass increases, and even if the external force applied to the adhesive increases, the bonding area can be increased without increasing the overall length of the device. Distortion per adhesion area can be reduced. For this reason, according to the bonding structure, the influence on the device characteristics due to the temperature change of the adhesive is greatly suppressed as compared with the case where the adhesive area is small, and the set device characteristics are exhibited in a stable state. The operating range can be expanded to a wide temperature range from low temperature to high temperature.

  Furthermore, in the piezoelectric / electrostrictive device according to the present invention, the height of the mounting portion, that is, the dimension in the opposing direction is increased or combined, or the thickness of the mounting portion, that is, the thickness direction of the device. By shortening the size of the device, it is possible to adjust the controlled component or the component to be inspected having a small size so as to match the size of the component and to attach the device while securing a sufficient fixing force.

  Further, by increasing the size of the mounting portion in the opposing direction, the interval between the movable portions facing each other when the component is mounted is widened, and handling in the assembly process can be facilitated. Further, in this case, it becomes easy to insert the assembly jig using the widened space, so that improvement in workability can be expected. At this time, by shortening the dimension of the attachment portion in the thickness direction with respect to the movable portion, the space is further expanded, so that further improvement in workability can be expected. The boundary between the attachment portion and the movable portion is preferably curved (R shape). This is because if the boundary between the mounting portion and the movable portion is curved, stress concentration can be avoided and a structure strong against impact can be formed.

  Further, by narrowing (thinning) the width of the attachment portion relative to the direction in which the movable portions face each other, the attachment and positioning of the components can be facilitated when attaching a thin component. At this time, according to the present invention, since the thickness of the movable portion can be increased with respect to the thickness of the mounting portion, it is possible to increase the strength of the movable portion without reducing the displacement. That is, if the thickness of the mounting part is the same as that of the movable part, and if a large and heavy part is attached, the movable part can be thickened in the opposite direction in order to maintain strength. Increases the amount of displacement. On the other hand, according to the present invention, the thickness of the movable part can be freely determined without depending on the thickness of the mounting part. Therefore, by adjusting the thickness of the movable part, it is possible to ensure the amount of displacement while maintaining the strength. It is.

  In the piezoelectric / electrostrictive device according to the present invention, when slit-like groove portions are provided on both sides of the fixing portion constituting the substrate, the fixing portion can be obtained without increasing the overall length of the device by increasing the length of the groove portion. Can be increased. As a result, the bonding area for fixing the piezoelectric / electrostrictive device can be widened, the adhesive force is increased, and the piezoelectric / electrostrictive device can be firmly fixed. The parts to be attached to the piezoelectric / electrostrictive device are large and increase in mass, and even when the fixing part must maintain the mass of the device and the parts together, the adhesive force can be sufficiently increased, so that the device can be fixed. Can be stabilized.

  The substrate constituting the piezoelectric / electrostrictive device according to the present invention includes a substrate (first substrate) formed of a ceramic laminate formed by laminating and firing a large number of ceramic green sheets, or a single metal plate. A base body (second base body) configured by bending a flat plate and a base body (third base body) configured by laminating a plurality of metal plates and bonding them together. Can do. In this case, it is preferable that the slit-like gap between each movable part and each attachment part constituting these substrates is set to a slit width that does not restrict the displacement of each movable part during operation of the piezoelectric / electrostrictive device. Moreover, it is preferable to form each attachment part in the thickness which is the same as or approximates each movable part. Thereby, the influence which acts on the displacement characteristic of the movable part resulting from a long attachment part can be prevented as much as possible.

  In the first base body, a base block formed by laminating and firing a large number of ceramic green sheets is adopted as a forming material of the first base body, and a predetermined portion of the base block is arranged along the stacking direction of the ceramic layers. It can be easily manufactured by means of cutting and forming a substrate. In addition, the second substrate is made of a flexible and bendable metal flat plate as a forming material, and the flat plate is punched into a shape in which the base is flattened. Thus, it is possible to manufacture easily by forming a punching structure and bending a predetermined part of the punching structure. In the third substrate, a metal flat plate that is flexible and can be bent is adopted as a forming material, and a substrate block formed by laminating and bonding a large number of the flat plates is used. It can be easily manufactured by means for forming a substrate by cutting a predetermined portion of the block along the stacking direction.

  According to the piezoelectric / electrostrictive device of the present invention, various transducers, various actuators, frequency domain functional components (filters), transformers, active vibrators for communication and power, oscillators, discriminators, etc. In addition, it can be used as a sensor element for various sensors such as an ultrasonic sensor, an acceleration sensor, an angular velocity sensor, an impact sensor, and a mass sensor. Especially, displacement and positioning adjustment of various precision parts such as optical equipment and precision equipment, It can utilize suitably for the various actuators used for an angle adjustment mechanism. In addition, the piezoelectric / electrostrictive device according to the present invention is a concept including elements that mutually convert electrical energy and mechanical energy.

  Hereinafter, the present invention will be described with reference to the drawings. FIG. 5 and FIG. 6 show a first piezoelectric / electrostrictive device according to the present invention. The piezoelectric / electrostrictive device 10 includes a base body 10a and a pair of piezoelectric / electrostrictive elements 10b. The base body 10a is formed by firing a laminated body of ceramic green sheets.

  In the piezoelectric / electrostrictive device 10, the base body 10 a has a U shape in which one end side is closed and the other end side is in an open state, and a pair of left and right movable parts 11 and 12 and both movable parts 11 and 12 are provided. It is comprised by the fixing | fixed part 13 mutually connected by the one end part side, and the attaching parts 15 and 16 connected via the connection part 14 to the other end part side of each movable part 11 and 12. FIG. Each of these parts 11 to 16 has an integral structure made of a ceramic structure.

  In the base body 10a, each of the movable parts 11 and 12 has a piezoelectric / electrostrictive element 10b attached to the outer surface thereof to constitute an operation part, and the fixed part 13 is formed on the upper surface side or the lower surface side thereof, for example, The hard disk magnetic head H, which is a controlled component, is bonded and fixed to the inner surface of each of the mounting portions 15 and 16, for example, and fixed to the gimbal of the suspension that holds the magnetic head of the hard disk. Is done.

  Each attachment part 15 and 16 which comprises the said base | substrate is extended in the predetermined length to the one end part side along the inner surface of each movable part 11 and 12, in the state inverted from the other end part side of each movable part 11 and 12 In addition, predetermined slit-shaped gaps 15 a and 16 a are held between the inner surfaces of the movable parts 11 and 12. Each attachment portion 15, 16 extends to a substantially central portion of each movable portion 11, 12, and an inner surface thereof is formed on the joint surfaces 15 b, 16 b of the magnetic head H. The side surfaces of the magnetic head H are bonded to the entire surfaces of the bonding surfaces 15b and 16b via the adhesives 15c and 16c. As the adhesives 15c and 16c, an adhesive made of an epoxy resin or the like is employed, and a large adhesion area is secured.

  The slit-shaped gaps 15a and 16a between the mounting portions 15 and 16 and the movable portions 11 and 12 are set to dimensions that do not restrict the displacement of the movable portions 11 and 12 when the piezoelectric / electrostrictive device 10 is operated. Yes. In other words, the interval is set such that the movable portions 11 and 12 do not come into contact with the mounting portions 15 and 16 when the movable portions 11 and 12 are displaced. Thereby, the displacement characteristics of the movable parts 11 and 12 due to the mounting parts 15 and 16 located on the inner surface side of the movable parts 11 and 12 and the influence on the device characteristics due to the displacement characteristics are prevented.

  The piezoelectric / electrostrictive device 10 is in the state shown in FIG. 5 when the voltage is not applied to each piezoelectric / electrostrictive element 10b, and is in the state shown in FIG. The central axis) and the central axis n of the attachment portions 15 and 16 substantially coincide with each other. In this state, for example, as shown in the waveform diagram of FIG. 7A, a sine wave Wb having a predetermined bias potential Vb is applied to a pair of electrodes 17a and 17b in one piezoelectric / electrostrictive element 10b. As shown in (b), a sine wave Wa having a phase difference of approximately 180 degrees from the sine wave Wb is applied to the pair of electrodes 17a and 17b in the other piezoelectric / electrostrictive element 10b. As a result, for example, when a maximum voltage is applied to the pair of electrodes 17a and 17b in one piezoelectric / electrostrictive element 10b, the piezoelectric / electrostrictive layer 17c in one piezoelectric / electrostrictive element 10b. Is contracted and displaced in the main surface direction.

  As a result, in the piezoelectric / electrostrictive device 10, as shown in FIG. 6, for example, a stress is generated that bends the one movable portion 11 in the right direction (arrow A direction) in the drawing. 11 bends in the same direction. In this case, since the pair of electrodes 17a and 17b in the other piezoelectric / electrostrictive element 10b is in a state in which no voltage is applied, the other movable portion 12 follows the bending of the one movable portion 11 to move the movable portion 11. Bends in the same direction. As a result, both movable parts 11 a and 11 b are displaced in the right direction in the figure with respect to the major axis m of the piezoelectric / electrostrictive device 10. The displacement amount of this displacement changes according to the maximum value of the applied voltage to each piezoelectric / electrostrictive element 10b. As the maximum value of the voltage increases, the amount of displacement increases.

  As described above, in the piezoelectric / electrostrictive device 10, the minute displacement of the piezoelectric / electrostrictive element 10 b is amplified to a large displacement operation using the bending of both the movable portions 11, 12, so that both movable portions 11, 12, the attachment portions 15 and 16 can be greatly displaced with respect to the major axis m of the piezoelectric / electrostrictive device 10, and for example, the position control of the magnetic head H can be accurately performed. it can.

  By the way, the piezoelectric / electrostrictive device 10 has various remarkable effects as described below as compared with the conventional piezoelectric / electrostrictive device of this type. That is, in the piezoelectric / electrostrictive device 10, the attachment area of the component H (for example, a magnetic head) is set large without increasing the total length of the device to greatly increase the adhesion force, and each attachment portion of the component H It is possible to prevent the 15 and 16 from falling off and the attachment portions 15 and 16 from being damaged. In addition, the thickness of the adhesives 15c and 16c for interposing the part H on the joint surfaces 15b and 16b of the mounting parts 15 and 16 is reduced, and the influence on the device characteristics due to the temperature change of the adhesives 15c and 16c is greatly increased. Can be reduced. In addition, the arm length (movable part main bodies 11a, 12a) of each movable part 11, 12 can be set long, and the maximum displacement amount of both movable parts 11, 12 can be increased to improve device characteristics. Can be planned.

  FIG. 1 showing a conventional piezoelectric / electrostrictive device of this type and FIG. 8 showing a piezoelectric / electrostrictive device 10 according to an example of the present invention show the dimensional relationship between each part of the piezoelectric / electrostrictive device and the substrate. The same symbols are used. In each of these drawings, the symbol L1 is the length of the device (also the total length of the substrate), the symbol L2 is the length of the fixed portion in the substrate, the symbol L3 is the length of the arm of the movable portion in the substrate, and the symbol L4 is the attachment in the substrate It is the length of the joint surface of a part. Further, symbol L5 is the length of the connecting portion that is a specific portion of the piezoelectric / electrostrictive device according to the present invention, and symbol L6 is a movable portion that is a specific portion of the piezoelectric / electrostrictive device according to the present invention. It is the space | interval of the slit-shaped clearance gap between attachment parts.

  As is clear from FIGS. 1 and 8, the piezoelectric / electrostrictive device 10 according to the present invention can confirm the following excellent effects as compared with the conventional piezoelectric / electrostrictive device. it can. That is, the first effect of the piezoelectric / electrostrictive device 10 is that the length L4 of the joint with respect to the component H is very long, and the total area L1 of the base is not increased, so that the adhesion area to the component H is set large. As a result, the adhesive force with respect to the component H becomes remarkably strong, and the component H can be prevented from falling off from the mounting portions 15 and 16 and from being damaged. It is.

  The second effect of the piezoelectric / electrostrictive device 10 is that the bonding area of the component H is increased by increasing the bonding area to the component H due to the length L4 of the joint. The thickness of the adhesives 15c and 16c interposed between the joint surfaces 15b and 16b of the mounting portions 15 and 16 can be reduced, and this greatly affects the device characteristics due to temperature changes of the adhesives 15c and 16c. It is possible to reduce it.

  A third effect of the piezoelectric / electrostrictive device 1 is that the arm length L3 of each movable portion 11 and 12 and the length L4 of the joint surfaces 15b and 16b of the attachment portions 15 and 16 are set independently of each other. In view of the characteristics of the base material, the arm length L3 of the movable parts 11 and 12 and the length L4 of the joint surfaces 15b and 16b of the mounting parts 15 and 16 are arbitrarily increased accordingly. It is possible to improve the device characteristics by setting, and to further strengthen the adhesive force to the component H.

  In the piezoelectric / electrostrictive device 10, when the component H to be used is short as shown in FIG. 9, the adhesives 15 c and 16 c are wound around one end surface side of the component H so as to ensure sufficient adhesive strength. In addition, as shown in FIG. 10, when the part H has a cylindrical shape like the cross section of the optical fiber, adhesives 15 c and 16 c are provided between the outer periphery of the part H and the attachment parts 15 and 16. To ensure sufficient adhesive strength.

  Next, a specific method for manufacturing the piezoelectric / electrostrictive device 10 will be described with reference to FIGS. The manufacturing method is the first manufacturing method of the manufacturing method according to the present invention. In the manufacturing method, each component is defined as follows. The laminate shown in FIG. 12 obtained by laminating the ceramic green sheets 18 shown in FIG. 11 is referred to as a ceramic green laminate 10A1, and the laminate shown in FIG. 13 is obtained by firing and integrating the ceramic green laminate 10A1. Is referred to as a ceramic laminate 10A2, unnecessary portions are cut out from the ceramic laminate 10A2, and the base shown in FIG. 14 in which the mounting portions 15, 16, the movable portions 11, 12 and the fixed portion 13 are integrated is the ceramic base 10a. Called.

  In this manufacturing method, actually, a plurality of piezoelectric / electrostrictive devices 10 are arranged in the vertical direction and the horizontal direction in the same substrate, and finally the ceramic laminate 10A2 is cut in units of chips. Although a large number of piezoelectric / electrostrictive devices 10 are obtained in the same process, a method of taking one piezoelectric / electrostrictive device 10 will be described in order to simplify the description.

  In order to employ the first production method according to the present invention, first, a binder, a solvent, a dispersant, a plasticizer, and the like are added to and mixed with ceramic powder such as zirconia to produce a slurry, and the slurry is subjected to a defoaming treatment. Then, a ceramic green sheet having a predetermined thickness is produced by a method such as a reverse roll coater method or a doctor blade method.

  Next, the ceramic green sheets 18 are processed into various shapes and thicknesses by a method such as punching using a mold or laser processing, and a plurality of ceramic green sheets 18 for forming a substrate shown in FIG. obtain. The ceramic green sheets 18a to 18j are a plurality of (for example, four) ceramic green sheets 18c, 18d, 18g, and 18h in which a window k1 for forming a space between at least the movable parts 11 and 12 is formed. A plurality of sheets (for example, seven sheets) in which window portions k1 for forming attachment portions 15 and 16 having joint surfaces 15b and 16b facing each other and a window portion k1 for forming a space between the portions 11 and 12 are formed. Ceramic green sheets 18e... 18f, a plurality of (for example, two) ceramic green sheets 18b and 18i formed with window portions k3 to form slit-like gaps 15a and 16a, and a plurality of sheets that later become movable portions 11 and 12. (For example, two ceramic green sheets 18a and 18j are prepared.

  Thereafter, as shown in FIG. 12, the ceramic green sheets 18a and 18j are sandwiched between the ceramic green sheets 18c to 18h, the ceramic green sheets 18b and 18i, the ceramic green sheets 18e. Then, pressure bonding is performed to obtain a ceramic green laminate 10A1. In this lamination, the ceramic green sheets 18e ... 18f are laminated in the center. In this case, the presence of the window portion k2 generates a portion where no pressure is applied at the time of pressure bonding. Therefore, it is necessary to change the order of lamination and pressure bonding so that such a portion does not occur. Thereafter, the ceramic green laminate 10A1 is fired to obtain a ceramic laminate 10A2 shown in FIG.

  The number and order of lamination for forming the ceramic green laminate 10A1 are appropriately changed according to the set structure. For example, the shapes of the windows k1 to k3 correspond to the set structure. By appropriately changing the number of ceramic green sheets 18 and the like, the ceramic green laminate 10A1 having a set structure can be obtained. The shapes of the windows k1 to k3 can be determined according to a desired function, and the number of ceramic green sheets 18 and the thickness of each ceramic green sheet 18 are not particularly limited.

  The pressure bonding to the laminated ceramic green sheets 18 can further improve the laminating property by applying heat. Further, when laminating the ceramic green sheets 18, ceramic powder, a paste mainly composed of a binder, a slurry, and the like are applied and printed on the ceramic green sheets 18 to form a bonding auxiliary layer. It is possible to improve the lamination property. In this case, it is preferable to employ a ceramic powder having the same or similar composition as the ceramic used in the ceramic green sheet 18 as the ceramic powder, thereby ensuring the reliability of the lamination of the ceramic green sheets 18. .

  When the ceramic green sheets 18a and 18j are thin, it is preferable to handle them using a plastic film, in particular, a polyethylene terephthalate film whose surface is coated with a silicone release agent.

  In order to form the piezoelectric / electrostrictive element 10b on both surfaces of the obtained ceramic laminate 10A2 as shown in FIG. 13, that is, on the surfaces formed by the laminated ceramic green sheets 18a and 18j, as shown in FIG. The piezoelectric / electrostrictive element body (piezoelectric / electrostrictive element body 30 described later) is formed. As a method of forming the piezoelectric / electrostrictive element body 30, a thick film forming method such as a screen printing method, a dipping method, a coating method, an electrophoresis method, an ion beam method, a sputtering method, a vacuum deposition method, an ion plating method, a chemical method, or the like. Thin film formation methods such as vapor deposition (CVD) and plating can be used. By forming the piezoelectric / electrostrictive element body 30 using such a film forming method, the piezoelectric / electrostrictive element 10b is integrally joined to the movable portions 11 and 12 without using an adhesive. Thus, reliability and reproducibility can be ensured, and integration can be facilitated.

  In forming the piezoelectric / electrostrictive element body 30, it is particularly preferable to employ a thick film forming method. If a thick film forming method is used for forming the piezoelectric / electrostrictive layers 31 to 34, a paste or a slurry mainly composed of piezoelectric ceramic particles having an average particle diameter of 0.01 to 5 μm, preferably 0.05 to 3 μm, and powder. This is because a film can be formed using a suspension, an emulsion, a sol or the like, and good piezoelectric / electrostrictive characteristics can be obtained by firing the film.

  The electrophoresis method for forming the piezoelectric / electrostrictive element body 30 has an advantage that the film can be formed with high density and high shape accuracy. In addition, the screen printing method is advantageous in simplifying the manufacturing process because film formation and pattern formation can be performed simultaneously.

  The formation of the piezoelectric / electrostrictive element body 30 will be described more specifically. First, the ceramic green laminate 10A1 is first fired at a temperature of 1200 ° C. to 1600 ° C. and integrated to obtain the ceramic laminate 10A2. The electrodes 36 of the movable parts 11 and 12 are printed and fired at predetermined positions on both surfaces of the ceramic laminate 10A2, then the piezoelectric / electrostrictive layer 34 is printed and fired, and the other electrode 35 is printed and fired. These are repeated a predetermined number of times, and a plurality of piezoelectric / electrostrictive layers 33 to 31 are formed in the same manner as the piezoelectric / electrostrictive layer 34 during this period. Thereafter, terminals 37 and 38 for electrically connecting the electrodes 35 and 36 to the drive circuit are printed and fired. In the formation of the piezoelectric / electrostrictive element body 30, the lowermost electrode 36 is printed and fired, and the piezoelectric / electrostrictive layer 34 and the electrode 35 are printed and fired. This unit is printed and fired any number of times. The piezoelectric / electrostrictive element body 30 may be formed by repeating the above.

  In the formation of the piezoelectric / electrostrictive element body 30, platinum (Pt) is used as one electrode 36, lead zirconate titanate (PZT) is used as the piezoelectric / electrostrictive layers 31 to 34, and gold (Au) is used as the other electrode 35. When the material is selected such that the firing temperature of each member becomes lower according to the stacking order, such as silver (Ag) as the terminals 37 and 38, re-sintering of the material fired before that occurs at a certain firing stage. In addition, it is possible to avoid the occurrence of problems such as peeling or aggregation of electrode materials. In addition, by selecting an appropriate material, each member of the piezoelectric / electrostrictive element body 30 and the terminals 37 and 38 can be sequentially printed and integrally fired at one time. After forming the strained layer 31, the outermost electrode 35 and the like can be provided at a low temperature. Each member of the piezoelectric / electrostrictive element body 30 and the terminals 37 and 38 do not necessarily require heat treatment.

  In the formation of the piezoelectric / electrostrictive element body 30, the piezoelectric / electrostrictive element body 30 is formed in advance on both surfaces of the ceramic green laminate 10A1, that is, the respective surfaces of the ceramic green sheets 18a and 18j. The body 10A1 and the piezoelectric / electrostrictive element body 30 are preferably fired at the same time. In the simultaneous firing, all the constituent films of the ceramic green laminate 10A1 and the piezoelectric / electrostrictive element body 30 may be fired, and one electrode 36 and the ceramic green laminate 10A1 are fired simultaneously. Or a method of simultaneously firing the other constituent film excluding the other electrode 35 and the ceramic green laminate 10A1.

  As a method of simultaneously firing the piezoelectric / electrostrictive element body 30 and the ceramic green laminate 10A1, the precursors of the piezoelectric / electrostrictive layers 31 to 34 are formed by a tape forming method using a slurry raw material, and before this firing. The precursors of the piezoelectric / electrostrictive layers 31 to 34 are laminated on the surface of the ceramic green laminate 10A1 by thermocompression bonding or the like and fired at the same time to attach the mounting parts 15 and 16, the movable parts 11 and 12, the piezoelectric / electrostrictive layer. The method of producing 31-34 and the fixing | fixed part 13 simultaneously is mentioned. However, in this method, it is necessary to previously form the electrode 36 on the surface of the ceramic green laminate 10A1 and / or the piezoelectric / electrostrictive layers 31 to 34 using the film forming method described above.

  As another method, the electrodes 35 and 36 and the piezoelectric / electrostrictive layer 31 which are the respective constituent layers of the piezoelectric / electrostrictive element body 30 are screen-printed on at least a portion of the ceramic green laminate 10A1 which finally becomes the movable portion. ~ 34 are formed and fired at the same time.

  The firing temperature of the constituent film of the piezoelectric / electrostrictive element body 30 is appropriately determined depending on the material constituting the piezoelectric / electrostrictive element body 30, but is generally 500 ° C. to 1500 ° C., and for the piezoelectric / electrostrictive layers 31 to 34, The temperature is preferably 1000 ° C to 1400 ° C. In this case, in order to control the composition of the piezoelectric / electrostrictive layers 31 to 34, it is preferable to sinter in the presence of an evaporation source of the material of the piezoelectric / electrostrictive layers 31 to 34. When the piezoelectric / electrostrictive layers 31 to 34 and the ceramic green laminate 10A1 are simultaneously fired, it is necessary to match the firing conditions of both. The piezoelectric / electrostrictive element body 30 is not necessarily formed on both sides of the ceramic laminated body 10A2 or the ceramic green laminated body 10A1, but may be of course only on one side.

  The piezoelectric / electrostrictive element body 30 is not formed directly on the ceramic laminate 10A2, but is formed as a separate body by the above-described method, and this is arbitrarily cut to form the piezoelectric / electrostrictive element 10b. The formed piezoelectric / electrostrictive element 10b can also be produced by pasting on a previously formed substrate 10a with an adhesive such as organic resin or glass.

  The ceramic laminate 10A2 on which the piezoelectric / electrostrictive element body 30 is formed is formed in the piezoelectric / electrostrictive device 10 according to the present invention by cutting a predetermined portion. The ceramic laminated body 10A2 integrated with the piezoelectric / electrostrictive element body 30 is cut along cutting lines C1, C2, and C3 shown in FIG. 13, whereby the side and tip portions of the ceramic laminated body 10A2 are cut off. As shown in FIG. 14, by this cutting, the piezoelectric / electrostrictive device 10 having the attachment portions 15 and 16 having the joint surfaces 15b and 16b facing each other, in which the ceramic base 10a and the piezoelectric / electrostrictive element 10b are integrated. Is formed.

  The ceramic laminate 10A2 and the piezoelectric / electrostrictive element body 30 may be cut along the cutting lines C1, C2 and then along the cutting line C3, or after cutting along the cutting line C3. You may cut along cutting lines C1 and C2. Of course, these cuttings may be performed simultaneously. Further, the end face of the fixing portion 13 facing the cutting line C3 may be appropriately cut as the cutting line C4 when the total length of the piezoelectric / electrostrictive device is precisely controlled, for example.

  In the manufacturing method, unnecessary portions are cut out from the ceramic laminate 10A2, and at the same time, the ceramic base 10a and the piezoelectric / electrostrictive element 10b are integrally provided with attachment portions 15 and 16 having joint surfaces 15b and 16b facing each other. Since the piezoelectric / electrostrictive device 10 can be obtained, the manufacturing process can be simplified and the yield of the piezoelectric / electrostrictive device 10 can be improved.

  The manufacturing method is configured in such a manner that a plurality of piezoelectric / electrostrictive devices 10 are arranged in the vertical direction and the horizontal direction on the same substrate (an integrated structure of the ceramic laminate 10A2 and the piezoelectric / electrostrictive element body 30). Thus, it is particularly preferable when a large number of piezoelectric / electrostrictive devices 10 are taken in the same process. As a cutting method, in addition to mechanical processing such as dicing processing and wire saw processing, laser processing such as YAG laser and excimer laser and electron beam processing can be applied. For cutting out the ceramic laminate 10A2, these processing methods are combined. For example, the cutting lines C1 and C2 shown in FIG. 13 are wire sawing, and the cutting lines C3 and C4 orthogonal to the cutting lines C1 and C2 (formation of the end faces of the fixing part 13 and the mounting parts 15 and 16) are dicing. It is preferable to do. Similarly to the method for producing the piezoelectric / electrostrictive device 20 described later, the ceramic substrate 10a and the piezoelectric / electrostrictive element 10b, which are individually cut and formed, are prepared separately, and bonded to each other. The strain device 10 can also be created.

  The material of the mounting portions 15 and 16 and the fixing portion 13 constituting the base body 10a is not particularly limited as long as it has rigidity, but it is preferable to use a ceramic to which a ceramic green sheet lamination method can be applied. Specific examples include materials mainly composed of stabilized zirconia, partially stabilized zirconia, alumina, magnesia, silicon nitride, aluminum nitride, and titanium oxide, and mixtures thereof. In view of high mechanical strength and toughness, zirconia, particularly a material mainly composed of stabilized zirconia and a material mainly composed of partially stabilized zirconia are preferable.

  As described above, the movable portions 11 and 12 constituting the base body 10a are portions that are driven by the displacement of the piezoelectric / electrostrictive element 10b. The movable portions 11 and 12 are flexible thin plate-like members, and amplify the expansion / contraction displacement of the piezoelectric / electrostrictive element 10b disposed on the surface as a bending displacement and transmit it to the attachment portions 15 and 16. Has the function of Therefore, the shape and material of the movable parts 11 and 12 need only be flexible and have a mechanical strength that does not cause damage due to bending deformation. The responsiveness and operability of the mounting parts 15 and 16 are sufficient. It can be selected as appropriate in consideration.

  The thickness L10 of the movable parts 11 and 12 is preferably about 2 μm to 100 μm, and the combined thickness of the movable parts 11 and 12 and the piezoelectric / electrostrictive element 10b is preferably 7 μm to 500 μm. The thickness of the electrodes 35 and 36 is preferably 0.1 μm to 50 μm, and the thickness of the piezoelectric / electrostrictive layers 31 to 34 is preferably 3 μm to 300 μm.

  As the material constituting the movable parts 11 and 12, ceramics similar to the attachment parts 15 and 16 and the fixed part 13 can be preferably used, and zirconia, in particular, a material mainly composed of stabilized zirconia or partially stabilized. A zirconia-based material is most preferably used because of its high mechanical strength, high toughness, and low reactivity with piezoelectric / electrostrictive layers and electrode materials even when it is thin.

  In the stabilized zirconia and the partially stabilized zirconia, those stabilized or partially stabilized as follows are preferable. That is, as a compound that stabilizes or partially stabilizes zirconia, there are yttrium oxide, ytterbium oxide, cerium oxide, calcium oxide, and magnesium oxide, and by adding and containing at least one compound thereof, or The target zirconia can be stabilized not only by adding one kind of compound but also by adding these compounds in combination.

  The amount of each compound added is 1 to 30 mol%, preferably 1.5 to 10 mol% in the case of yttrium oxide or ytterbium oxide, and 6 to 6 in the case of cerium oxide. 50 mol%, preferably 8 to 20 mol%, and in the case of calcium oxide or magnesium oxide, 5 to 40 mol%, preferably 5 to 20 mol%. Among them, it is particularly preferable to use yttrium oxide as a stabilizing material. In this case, it is 1.5 to 10 mol%, and more preferably 2 to 4 mol%. Further, alumina, silica, transition metal oxide, etc. can be added in the range of 0.05 to 20 wt% as additives such as sintering aids, but as a method for forming the piezoelectric / electrostrictive element 10b. In the case of employing the integration by firing by the film forming method, it is also preferable to add alumina, magnesia, transition metal oxide or the like as an additive. Moreover, it is desirable that the average crystal particle diameter of zirconia be 0.05 to 1 μm so that a mechanical strength and a stable crystal phase can be obtained. Further, as described above, the movable parts 11 and 12 can be made of the same ceramics as the attachment parts 15 and 16 and the fixed part 13, but are preferably configured using substantially the same material. However, this is advantageous in reducing the reliability of the bonded portion, the strength of the piezoelectric / electrostrictive device 10, and the complexity of the structure.

  FIG. 15 shows a modified example in which the first piezoelectric / electrostrictive device 10 is modified. In the piezoelectric / electrostrictive device 10A according to the modified example, each movable part 11 in the fixed part 13 constituting the base 10a, Slit-like gaps 13a and 13b that face the gaps 15a and 16a are provided at the 12-side portion. Resin is formed on the inner wall of the slit-like gaps 15a and 16a and the slit-like gaps 13a and 13b. The elastic members 19a and 19b are filled.

  The piezoelectric / electrostrictive device 10A is intended to cope with an impact from the outside of the movable parts 11 and 12 facing the attachment parts 15 and 16 through slit-shaped gaps 15a and 16a. is there. In the piezoelectric / electrostrictive device 10A, when the movable parts 11 and 12 are subjected to an impact from the outside, the stress concentrated on the connecting parts 14 of the movable parts 11 and 12 and the fixed parts 15 and 16 is: It is dispersed and absorbed by the elastic members 19a and 19b, and the impact resistance of the movable parts 11 and 12 due to the stress concentration at the connecting part 14 is improved.

  16 and 17 show a second piezoelectric / electrostrictive device 20 according to the present invention. The piezoelectric / electrostrictive device 20 includes a base body 20a and a pair of piezoelectric / electrostrictive elements 20b. The base body 20a is configured by bending a single metal flat plate. In the piezoelectric / electrostrictive device 20, the base body 20 a includes a pair of left and right movable parts 21 and 22, a fixed part 23 that connects the movable parts 21 and 22 to each other on one end side, and the movable parts 21 and 22. It is comprised by a pair of attachment parts 25 and 26 connected via the connection part 24 to the other end part side. Each of these parts 21 to 26 is integrally formed by a single metal flat plate, and the piezoelectric / electrostrictive element 20b is a piezoelectric / electrostrictive device 10 constituting the first piezoelectric / electrostrictive device 10. This is the same as the electrostrictive element 10b.

  In the base 20a, each movable part 21, 22 has an operation part formed by attaching each piezoelectric / electrostrictive element 20b to the outer side surface thereof, and the fixed part 23 is formed on the lower surface side of, for example, a hard disk. A magnetic head H for a hard disk, which is a controlled component, is bonded and fixed to the inner side surface of each mounting portion 25, for example, and fixed to the gimbal of the suspension that holds the magnetic head.

  Each movable portion 21, 22 constituting the base body 20 a has a narrow flat plate shape that is bent from each side edge portion of the flat plate-like fixed portion 23, and extends beyond the fixed portion 23 to the other end side. It extends for a predetermined length. Each mounting portion 25, 26 is integral with each movable portion 21, 22 via a connecting portion 24, and each movable portion 21, 22 is reversed from the other end side of each movable portion 21, 22. A predetermined length is extended to one end side along the inner side surface, and predetermined slit-shaped gaps 25a and 26a are held between the inner side surfaces of the movable parts 21 and 22, respectively.

  Each mounting portion 25, 26 extends to a substantially central portion of each movable portion 21, 22, and its inner side surface is formed on the bonding surface 25b, 26b of the magnetic head H, and each of the bonding surfaces 25b, 26b. Similar to the piezoelectric / electrostrictive device 10, each side surface of the magnetic head H is bonded to the entire surface via an adhesive. As the adhesive, an adhesive made of an epoxy resin or the like is employed, and a large joining area is secured.

  The base 20a constituting the piezoelectric / electrostrictive device 20 extends a predetermined length along the inner side surface of each movable part 21, 22 while being inverted from the other end part side of each movable part 21, 22. Each mounting portion 25, 26, each mounting portion 25, 26 holds a predetermined slit-shaped gap 25 a, 26 a between the inner surface of each movable portion 21, 22, and It is substantially the same as the piezoelectric / electrostrictive device 10 in that the inner side surfaces of the mounting portions 25, 26 are formed on the joint surfaces 25b, 26b of the component H, and operates in the same manner as the piezoelectric / electrostrictive device 10. However, the same operational effects can be obtained. Thus, the base body 20a constituting the second piezoelectric / electrostrictive device 20 according to the present invention is formed by the second manufacturing method according to the present invention described below.

  The base 20a constituting the second piezoelectric / electrostrictive device 20 according to the present invention is formed using a base base plate 20A shown in FIG. The substrate base plate 20A is formed by punching a metal flat plate into a shape in which the substrate 20a is developed into a flat plate shape, and is folded along each two-dot chain line E1, E2, E3 shown in FIG. It is bent. The base substrate 20A is formed on the base body 20a including the movable portions 21 and 22, the fixed portion 23, the connecting portion 24, and the mounting portions 25 and 26 by this bending process. In the base body 20, slit-like gaps 25 a and 26 a are secured between the movable parts 21 and 22 and the attachment parts 25 and 26. Piezoelectric / electrostrictive elements 20b are bonded to the outer surfaces of the movable parts 21 and 22 of the base body 20a formed by bending in this way with an adhesive to form the piezoelectric / electrostrictive device 20. Is done.

  As the piezoelectric / electrostrictive elements 10a and 20a constituting the first piezoelectric / electrostrictive device 10 and the second piezoelectric / electrostrictive device 20, conventionally known piezoelectric / electrostrictive elements can be adopted. As the piezoelectric / electrostrictive devices 10 and 20, a piezoelectric / electrostrictive element 30A shown in FIG. 20 developed by the present applicant is adopted. The piezoelectric / electrostrictive element 30A has a piezoelectric / electrostrictive layer having a four-layer structure. The piezoelectric / electrostrictive layer 30A is interposed between and surrounded by the piezoelectric / electrostrictive layers 31, 32, 33, and 34. The first and second electrodes 35 and 36 and a pair of terminals 37 and 38 are used. The piezoelectric / electrostrictive element 30A corresponds to the piezoelectric / electrostrictive element body 30 shown in FIG.

  Piezoelectric ceramics are used for the piezoelectric / electrostrictive layers 31 to 34 constituting the piezoelectric / electrostrictive element 30A, but electrostrictive ceramics, ferroelectric ceramics, antiferroelectric ceramics, and the like can also be used. However, when a piezoelectric / electrostrictive device is used for positioning a magnetic head of a hard disk drive, etc., since the linearity between the displacement of the mounting portion and the drive voltage or output voltage is important, a material with a small strain history is used. It is preferable. It is preferable to use a material having a coercive electric field of 10 kV / mm or less.

  As a material for forming the piezoelectric / electrostrictive layers 31 to 34, specifically, lead zirconate, lead titanate, lead magnesium niobate, lead zinc niobate, lead manganese niobate, lead antimony stannate, Mention may be made of lead manganese tungstate, lead cobalt niobate, barium titanate, sodium bismuth titanate, potassium sodium niobate, strontium bismuth tantalate or the like, or an appropriate mixture thereof. In particular, a material mainly composed of lead zirconate, lead titanate, and lead magnesium niobate, or a material mainly composed of sodium bismuth titanate is preferable.

  An appropriate material may be added to the material for forming the piezoelectric / electrostrictive layers 31 to 34 to adjust the characteristics of the piezoelectric / electrostrictive layer. Additives include oxides such as lanthanum, calcium, strontium, molybdenum, tungsten, barium, niobium, zinc, nickel, manganese, cesium, cadmium, chromium, cobalt, antimony, iron, yttrium, tantalum, lithium, bismuth, tin Alternatively, a material that finally becomes an oxide, or an appropriate mixture thereof can be used. For example, there is an advantage that coercive electric field and piezoelectric characteristics can be adjusted by adding lanthanum or strontium to lead zirconate, lead titanate, lead magnesium niobate or the like as the main component. In addition, addition of materials that are easily vitrified such as silica should be avoided. This is because a material that is easily vitrified such as silica easily reacts with the piezoelectric / electrostrictive layer during the heat treatment of the piezoelectric / electrostrictive layer, and changes its composition to deteriorate the piezoelectric characteristics.

  The electrodes 35 and 36 constituting the piezoelectric / electrostrictive element 30A are preferably formed of a metal material that is solid at room temperature and has excellent conductivity. Metal materials include aluminum, titanium, chromium, iron, cobalt, nickel, copper, zinc, niobium, molybdenum, ruthenium, palladium, rhodium, silver, tin, tantalum, tungsten, iridium, platinum, gold, lead, etc. A single substance or an alloy of these metals can be used. Further, a cermet material obtained by dispersing ceramics of the same material as or different from that of the piezoelectric / electrostrictive layer in these metal materials can also be used.

  The piezoelectric / electrostrictive element 30A is preferably formed by integrally firing the piezoelectric / electrostrictive layers 31 to 34 and the electrodes 35 and 36 in a stacked state. In this case, the electrodes 35 and 36 are made of a high melting point metal material such as platinum, palladium, or an alloy thereof, a material for forming the high melting point metal material and the piezoelectric / electrostrictive layers 31 to 34, or other ceramics. It is preferable to employ an electrode made of a cermet material that is a mixture with the material. Since the thickness of the electrodes 35 and 36 is a factor that affects the displacement of the piezoelectric / electrostrictive element 30, it is preferably a thin film as thin as possible. For this reason, in order for the electrode formed by firing integrally with the piezoelectric / electrostrictive layers 31 to 34 to be as thin as possible, the material for forming the electrodes 35 and 36 is a metal paste, such as a gold resinate paste, platinum It is preferably used in the form of a resinate paste, a silver resinate paste or the like.

  The thickness of the piezoelectric / electrostrictive element 30A is preferably in the range of 40 μm to 180 μm when used as the piezoelectric / electrostrictive elements 10 b and 20 b of the piezoelectric / electrostrictive devices 10 and 20 of each embodiment. If the thickness is less than 40 μm, it is easily damaged during handling, and if the thickness exceeds 180 μm, it is difficult to reduce the size of the device. In addition, the piezoelectric / electrostrictive element has a multilayer structure like the piezoelectric / electrostrictive element 30, so that the output can be increased and the displacement of the device can be increased. In addition, since the rigidity of the device is improved by making the piezoelectric / electrostrictive element have a multilayer structure, there is an advantage that the resonance frequency of the device is increased and the displacement operation of the device can be speeded up.

  The piezoelectric / electrostrictive element 30A is a large-area original plate formed by laminating and firing the piezoelectric / electrostrictive layers 31 to 34 and the electrodes 35 and 36 by printing or tape molding, for example, a piezoelectric / electrostrictive element body 30. It is created by means of cutting a large number of pieces into a predetermined size with a dicer, slicer, wire saw or the like. Since the piezoelectric / electrostrictive element 30A is thin and low in hardness as compared with the ceramic substrate, the cutting speed of the original plate can be set fast, and a large amount can be processed at high speed.

  The piezoelectric / electrostrictive element 30A has a simple plate-like structure and is easy to handle, and since the surface area is small, the amount of dirt attached is small and the dirt is easy to remove. However, since the piezoelectric / electrostrictive element 30A is mainly made of a ceramic material, it is necessary to set appropriate cleaning conditions in ultrasonic cleaning. In the piezoelectric / electrostrictive element cut out from the original plate, it is precisely cleaned by US cleaning, and then heat-treated at 100 ° C. to 1000 ° C. in the atmosphere to remove moisture and organic matter contained in the fine pores of the ceramic material. It is preferable to remove completely.

  When the piezoelectric / electrostrictive element 30A is employed as the piezoelectric / electrostrictive elements 10b and 20b constituting the piezoelectric / electrostrictive devices 10 and 20 according to the embodiments, the piezoelectric / electrostrictive element 30A is bonded to the substrate. It is preferable to use resin adhesives such as epoxy resin, UV resin, hot melt adhesive, and inorganic adhesives such as glass, cement, solder, brazing material, etc. A mixture of powder and ceramic powder can also be used. The hardness of the adhesive is preferably 80 or more on Shore D.

  In addition, it is preferable that a rough surface process such as blasting, etching, plating, or the like is performed in advance on the surface portion of the substrate to which the piezoelectric / electrostrictive element 30A is bonded. By making the surface roughness of the adhesion site about Ra = 0.1 μm to 5 μm, the adhesion area can be expanded and the adhesion strength can be improved. In this case, it is preferable that the surface of the adhesion part on the piezoelectric / electrostrictive element side is also rough. If the electrode is not desired to be electrically connected to the substrate, the electrode is not disposed on the surface of the lowermost piezoelectric / electrostrictive layer.

  When solder or brazing material is used as the adhesive, it is preferable to dispose a metal material electrode layer on the surface of the piezoelectric / electrostrictive element in order to improve wettability. The thickness of the adhesive is preferably in the range of 1 μm to 50 μm. A thinner adhesive is preferable in terms of reducing variations in device displacement and resonance characteristics, and in terms of space saving, but in order to ensure adhesive strength, displacement, resonance, and other characteristics, the adhesive used is Set the optimal thickness for each agent.

  When bonding the piezoelectric / electrostrictive element to the base, the piezoelectric / electrostrictive element is placed on the fixing part side of the base so that the piezoelectric / electrostrictive element is completely placed at the bending position of the fixing part. Glue. The piezoelectric / electrostrictive element is preferably bonded so as to coincide with the end of the base on the fixed part side. However, in order to facilitate the connection between the terminal of the piezoelectric / electrostrictive element and the external terminal, the piezoelectric / electrostrictive element is used. The element may be bonded by protruding outward from the end of the base. However, since the piezoelectric / electrostrictive element is easily damaged as compared with a base made of metal, it needs to be handled with care. Affix the piezoelectric / electrostrictive element to a predetermined position on the substrate with an adhesive, then cut and clean it to create a device

  The third piezoelectric / electrostrictive device according to the present invention is obtained by replacing the base having the same shape as the base 10a constituting the first piezoelectric / electrostrictive device 10 from ceramic to metal. The base material is changed from ceramic to metal. In addition, the third manufacturing method according to the present invention is employed for manufacturing the piezoelectric / electrostrictive device.

  In the third manufacturing method, a substrate is formed by preparing a metal plate instead of the ceramic green sheet in the first manufacturing method, and laminating and bonding them. As a means for bonding, bonding with an adhesive such as an organic resin or glass, brazing, soldering, diffusion bonding, ultrasonic bonding, thermocompression bonding, or a cladding method can be employed. In addition, it is possible to adopt means for integrating the laminated metal plates by welding or the like.

  In addition to punching with a mold, laser processing, electric discharge processing, etching, sandblasting, and the like can be employed for creating the window portion of each metal plate to be laminated. As the material of the metal plate constituting the substrate, the same material as the material of the substrate 20a of the piezoelectric / electrostrictive device 20 can be adopted.

  In the manufacturing method, a metal plate and a ceramic plate can be used together as a constituent material of the base, and thus a base with a hybrid structure can be formed. To make a further leap forward, a resin substrate can be formed by using a resin as a constituent material of the substrate. Depending on the application of the piezoelectric / electrostrictive device, a piezoelectric / electrostrictive component having a resin substrate as a constituent member can be used. It is also possible to configure the device.

  In the manufacturing method, the number and order of adhesion for stacking and integrating the metal plates are not limited in any way, and the number, shape, thickness, etc. of the metal plates are appropriately determined according to the set structure. Is done. A metal member (thick plate) obtained by casting may be partially sandwiched. In addition, in the said manufacturing method, if there is no problem in the adhesion | attachment method and material, it can replace with a metal plate and can also employ | adopt a carbon material and a resin material.

  As the piezoelectric / electrostrictive element to be used, the piezoelectric / electrostrictive element 30A1 can be adopted in the same manner as the piezoelectric / electrostrictive elements 10b and 20b of the piezoelectric / electrostrictive devices 10 and 20. For example, the piezoelectric / electrostrictive element body 30 can be bonded to a predetermined position of the substrate with an adhesive, and then cut and washed to form a piezoelectric / electrostrictive device. The piezoelectric / electrostrictive element is preferably composed of four or more layers. The piezoelectric / electrostrictive element is preferably composed of 10 layers or less. The piezoelectric / electrostrictive element is preferably produced by a printing multilayer method. The positional deviation of the electrodes of the piezoelectric / electrostrictive element is preferably 50 μm or less. If the number of piezoelectric / electrostrictive layers is increased, the driving force can be increased. However, the power consumption increases accordingly, and therefore when actually implemented, the number of layers may be appropriately determined according to the application. It is preferable to manufacture using a film forming method such as a thin film or a thick film. A piezoelectric / electrostrictive element may be formed on a support substrate by a sputtering method, a CVD method, a sol-gel method, or the like, and may be attached together with the support substrate, or may be peeled off from the support substrate and attached.

  When the substrate is made of a metal material, it is preferable to employ a cold-rolled metal plate for at least the movable part.

  (Example 1): In this example, the first piezoelectric / electrostrictive device 10 according to the present invention is prepared, and the dimensional relationship between each part of the piezoelectric / electrostrictive device 10 and the component H is shown in FIG. Show. In the piezoelectric / electrostrictive device 10, the reference symbol L denotes the length of the device (the total length of the base) L 1, the length L 2 of the fixed portion of the base, the length L 3 of the arm of the movable portion of the base, and the mounting portion of the base The length L4 of the joint surface, the length L5 of the connecting part, the gap L6 of the slit-like gap between the movable part and the attachment part, the gap L7 between the two movable parts, the gap L8 between the two attachment parts, The thickness L9, the thickness L10 of the movable portion, the height L11 of the movable portion (distance in the front and back direction of the paper surface), and the length L12 of the slit-shaped gap are shown.

  The other symbol M of the same system is the total width M1 of the device, the length M2 where the end of the substantial drive part of the piezoelectric / electrostrictive element is applied to the fixed part, and the thickness M3 of the attachment part and the piezoelectric / electrostrictive element. , The horizontal length M4 of the component H, the vertical length M5 of the component H, and the thickness M6 of the adhesive are shown.

  In the piezoelectric / electrostrictive device 10, the relationship between the distance L8 between the two attachment portions and the lateral length M4 of the piezoelectric / electrostrictive device is L8 ≧ M4, and more preferably L8−M4. In the case of L8 <M4, it is necessary to widen between the two mounting portions when inserting the component H, and there is a risk of damaging the device when expanding between the two mounting portions. The thickness M6 of the adhesive is 0.1 to 0.005 mm, preferably 0.05 to 0.01 mm. When the thickness M6 of the adhesive is greater than 0.1 mm, the influence of temperature on the displacement of both movable parts at high temperatures becomes large. In addition, since the difference between the distance L8 between the two attachment portions and the lateral length M4 of the electrostrictive device is small, the component H is inserted between the attachment portions, or the component H is inserted between the attachment portions. It is difficult to inject, and it is difficult to control the thickness of the adhesive. For this reason, when the thickness M6 of the adhesive is set to be smaller than 0.01 mm, the adhesive strength to the component H is likely to vary. For this reason, the thickness M6 of the adhesive is more preferably 0.01 to 0.03 mm.

  In the piezoelectric / electrostrictive device 10, the relationship between the length L5 of the connecting portion and the thickness L10 of the movable portion is L5 ≧ L10, and the relationship between the length L5 of the connecting portion and the thickness L9 of the attachment portion is L5 ≧. L9. Since the connecting part is a part that connects the movable part and the mounting part and is the weakest part in the structure, if the length L5 of the connecting part does not satisfy these relationships, the connecting part is easily damaged. Become. The relationship between the longitudinal length M5 of the component H and the length L4 of the joint surface of the mounting portion is M5 ≧ L4. The joint surface of the attachment portion functions to ensure the adhesive strength to the component H, and it does not make sense to make the length L4 of the joint surface of the attachment portion longer than the longitudinal length M5 of the component H. However, this is not the case when the part to be adopted has a shape different from that of the part H, for example, when the part has the shape shown in FIGS.

  In the piezoelectric / electrostrictive device 10, an interval L6 of a slit-like gap (slit gap) between the movable part and the attachment part is 0.2 to 0.001 mm, preferably 0.1 to 0.01 mm. More preferably, it is 0.07-0.03 mm. If the gap L6 between the slit gaps is less than 0.001 mm, the displacement operation of the movable part is restricted by contact with the mounting part when the two movable parts are highly displaced. Further, when the slit gap distance L6 is larger than 0.2 mm, the total width M1 in the lateral direction of the device becomes large and is meaningless. When the component H is joined to the mounting portion, the adhesive to be injected wraps around the slit gap, and the slit gap is easily embedded. When the gap L6 between the slit gaps is 0.03 mm or more, the wraparound of the adhesive into the slit gap is suppressed.

  In this case, it is important to control the amount of the adhesive so that the adhesive does not protrude from the joint surface of the mounting portion, and it is preferable that the slit gap interval L6 is larger than the thickness M6 of the adhesive. The piezoelectric / electrostrictive device 10 has a mode of providing a stopper function against an impact from the outside of the movable part by utilizing the contact between the movable part and the mounting part at the time of high displacement operation of both movable parts. You can also

  The length L12 of the slit-shaped gap is at least twice the length L5 of the connecting portion, preferably at least five times. As a result, even when the length M5 of the component H and the length L4 of the mounting portion cannot be made the same, in other words, even when M5> L4, the bonding area with respect to the component H is set larger to ensure the bonding strength. In addition, a large displacement can be ensured by setting the arm length L3 of the movable portion to be long.

  In the piezoelectric / electrostrictive device 10, the mounting portion has a thickness L9 of 0.2 to 0.11 mm, preferably 0.1 to 0.02 mm, and more preferably 0.07 to 0.03 mm. If the thickness L9 of the attachment portion exceeds 0.2 mm, the entire width M1 of the device becomes undesirably large, and if the thickness L9 of the attachment portion is less than 0.01, the device tends to break. The thickness L10 of the movable part is 0.2 to 0.001 mm, preferably 0.1 to 0.01 mm, more preferably 0.08 to 0.03 mm. From the viewpoint of space saving of the device, the length L2 of the fixed portion, the arm length L3 of the movable portion, the length L5 of the connecting portion, the gap L6 of the slit gap, the thickness L9 of the mounting portion, the thickness L10 of the movable portion The adhesive thickness M6 is preferably as small as possible, which reduces the overall length L1 and the overall width M1 of the device.

  In the piezoelectric / electrostrictive device 10, the arm length L3 of the movable part is 0.2 to 3 mm, preferably 0.3 to 2 mm. The length L4 of the joint surface of the mounting portion is 0.05 to 2 mm. The distance L7 between the movable parts is 0.1 to 2 mm, preferably 0.2 to 1.6 mm. The thickness L9 of the mounting portion is 0.002 to 0.1 mm, preferably 0.01 to 0.08 mm. The height L11 of the movable part is 0.05 to 2 mm, preferably 0.1 to 0.5 mm. The thickness M3 between the mounting portion and the piezoelectric / electrostrictive element is 0.0007 to 0.5 mm. In these dimensions, the arm length L3 of the movable part / the distance L7 between the two movable parts is 0.5 to 10, preferably 0.5 to 5. The distance L7 between the two movable parts / the thickness L10 of the movable parts is 0.5 to 20, preferably 1 to 15, and more preferably 1 to 10. The thickness L10 of the movable part and the height L11 of the movable part are L10 <L11. The thickness L10 of the movable portion and the length M2 that the end of the substantial drive portion of the piezoelectric / electrostrictive element is applied to the fixed portion are M2> (L10) / 2.

  (Example 2): In this example, the first piezoelectric / electrostrictive device 10 according to the present invention is modified, and the base corresponds to the base of the piezoelectric / electrostrictive device shown in FIG. / The electrostrictive device 10B is prepared, and the dimensional relationship of each part of the piezoelectric / electrostrictive device 10B is shown in FIG. The code L of the same system in the piezoelectric / electrostrictive device 10B is the same as that of the piezoelectric / electrostrictive device 10 formed in the first embodiment, but the dimensions of a part thereof and the dimensions of each part of the component H are as follows. Omitted. However, in the piezoelectric / electrostrictive device 10B, a slit-like gap width L13 and a slit-like gap length L14 on the fixed part, which are not present in the piezoelectric / electrostrictive device 10, are added. Yes.

  In the piezoelectric / electrostrictive device 10B, the width L13 of the slit-shaped gap of the fixed portion is 0.2 to 0.001 mm, preferably 0.1 to 0.01 mm, more preferably 0.07 to 0.03 mm. is there. Further, the length L14 of the slit-like gap of the fixed portion can be a length until the fixed portion interferes with the component H, but is preferably 0.05 to 2 mm, more preferably 0.1 to 0.2 mm. 5 mm. In addition, the dimension of the other site | part is set to the same dimension as the piezoelectric / electrostrictive device 10 produced in Example 1. FIG.

It is a top view which shows an example of the conventional piezoelectric / electrostrictive device. It is a top view which shows another example of the conventional piezoelectric / electrostrictive device. It is a top view which shows the operation state of the piezoelectric / electrostrictive device which concerns on an example of the past. It is a top view which shows the state which the malfunction at the time of operation | movement of the same piezoelectric / electrostrictive device occurred. 1 is a plan view showing a first piezoelectric / electrostrictive device according to the present invention. It is a top view which shows the operation state of the same piezoelectric / electrostrictive device. It is a wave form diagram (a) and (b) of a voltage applied to each piezoelectric / electrostrictive element of the same piezoelectric / electrostrictive device. It is a top view which shows the dimensional relationship with respect to the conventional piezoelectric / electrostrictive device (illustrated in FIG. 1) of the piezoelectric / electrostrictive device. It is a top view which shows the state which clamped different components of the same piezoelectric / electrostrictive device. It is a top view which shows the state which clamped further different components of the same piezoelectric / electrostrictive device. It is a perspective view which shows each ceramic green sheet which comprises the base | substrate of the same piezoelectric / electrostrictive device. It is a partially-omission perspective view which shows the ceramic green sheet laminated body formed by laminating | stacking the same ceramic green sheet. It is a perspective view which shows the structure which integrated the ceramic laminated body formed by baking the ceramic green sheet laminated body, and the piezoelectric / electrostrictive element body. It is a perspective view showing the same piezoelectric / electrostrictive device formed by cutting the same structure. It is a top view which shows the modification of the same piezoelectric / electrostrictive device. It is a perspective view which shows the 2nd piezoelectric / electrostrictive device which concerns on this invention. It is the same piezoelectric / electrostrictive device, Comprising: It is a perspective view which shows the state which does not clamp components. It is a perspective view which shows the base substrate for forming the base | substrate which comprises the piezoelectric / electrostrictive device. It is a perspective view which shows the base | substrate formed from the same base | substrate original plate. It is a perspective view which expands and shows the piezoelectric / electrostrictive element employ | adopted with the piezoelectric / electrostrictive device of this invention. It is a top view which shows the dimensional relationship of the piezoelectric / electrostrictive device created in Example 1 which concerns on this invention. It is a top view which shows the dimensional relationship of the piezoelectric / electrostrictive device created in Example 2 which concerns on this invention. It is the same piezoelectric / electrostrictive device, Comprising: It is a top view which shows the piezoelectric device when an attachment part is made high. It is the same piezoelectric / electrostrictive device, Comprising: It is a perspective view which shows the piezoelectric device when an attachment part is made high.

Explanation of symbols

10, 10A, 10B ... piezoelectric / electrostrictive device, 10A1 ... ceramic green sheet laminate, 10A2 ... ceramic laminate, 10a ... substrate, 10b ... piezoelectric / electrostrictive element, 11,12 ... movable part, 13 ... fixed part, 13a, 13b ... slit-like gaps, 14 ... connecting parts, 15, 16 ... mounting parts, 15a, 16a ... slit-like gaps, 15b, 16b ... joining surfaces, 15c, 16c ... adhesives, 17a, 17b ... electrodes, 17c ... piezoelectric / electrostrictive layer, 18 (18a-18j) ... ceramic green sheet, 19a, 19b ... elastic member, 20 ... piezoelectric / electrostrictive device, 20A ... substrate base plate, 20a ... substrate, 20b ... piezoelectric / electrostrictive element 21, 22, movable part, 23, fixed part, 24, connecting part, 25, 26, mounting part, 25 a, 26 a, gap, 25 b, 26 b, bonding surface, 30, piezoelectric / electrostrictive element Body, 30A ... piezoelectric / electrostrictive element, 31 to 34 ... piezoelectric / electrostrictive layer, 35, 36 ... electrode, 37, 38 ... terminal.

Claims (2)

A piezoelectric / electrostrictive element in which a piezoelectric / electrostrictive element is disposed on at least one outer surface of the two movable parts in a base having a pair of left and right movable parts and a fixed part that connects the two movable parts to each other on one end side. A strain device,
The base includes a pair of attachment portions for attaching controlled parts or parts to be inspected on the multi-end side of both movable parts, and the height of the attachment parts is shorter than the device height. / Electrostrictive device. 2. The piezoelectric / electrostrictive device according to claim 1, wherein a boundary between the attachment portion and the movable portion is curved.

Images