JP2006012875A - Semiconductor device cooling device - Google Patents

Abstract

The present invention provides a cooling device that realizes heat radiation with a high heat generation amount in a limited space in a semiconductor element with high heat generation.
An evaporator 2, a condenser 3 and a liquid pump 4 for cooling a CPU (semiconductor element) 1 are connected to a closed circuit sequentially by piping, and a fan 5 for cooling the condenser 3 is provided. The sub condenser 6 and the main condenser 3 are divided, and the sub condenser 6 is installed on the evaporator 2.
[Selection] Figure 2

Description

  The present invention relates to a cooling device that cools a highly heat-generating semiconductor element such as a CPU of a computer, and relates to a condenser structure.

  In cooling a semiconductor element which is a high heating element such as a CPU of a computer, there is a limit in an air cooling type cooling device in a large computer such as a server, and in order to obtain a larger cooling capacity in a narrow space, a refrigerant circulation type cooling device Has been proposed (see, for example, Patent Document 1).

  FIG. 8 is a schematic plan view of a 1U server incorporating a conventional refrigerant circulation cooling device, and FIG. 9 is a side view thereof.

  8 and 9, an evaporator 2 brought into contact with the surface of the CPU 1 through a heat transfer material is installed, and the evaporator is connected to the condenser 3 and the liquid pump 4 so as to constitute a circulation circuit by piping. A refrigerant is sealed inside the circulation circuit. A fan 5 for blowing air is installed in the vicinity of the condenser, and all of them are housed inside the server body. With this configuration, the heat of the heating element such as the CPU 1 is absorbed by the latent heat of the phase change of the refrigerant in the evaporator 2 and is dissipated to the atmosphere by the condenser 3, thereby reducing the temperature of the heating element such as the CPU 1 to a predetermined temperature or less. I can keep it.

  FIG. 10 is a schematic plan view when a refrigerant circulation type cooling device is incorporated in a conventional 1U server having two CPUs, and the connection between the first evaporator 2a and the second evaporator 2b is difficult due to the diversion. In order to avoid this, the refrigerant is connected in series, and the refrigerant partially evaporated in the first evaporator 2a is guided to the second evaporator 2b.

FIG. 11 is a Mollier diagram showing the refrigerant state of the refrigerant circulation cooling device shown in FIG. Referring to FIG. 11, the state of the refrigerant is explained. The refrigerant that has entered the evaporator 2 at the point A in the liquid region absorbs heat from the CPU 1 and is sent to the condenser 3 at the point B in the two-phase region. The heat is dissipated in the vessel 3, and the pressure is slightly increased by the liquid pump 4 in the state of the point C in the liquid region, and is sent again to the evaporator 2.
JP 2003-318341 A

  In the evaporator, if the amount of heat absorption is large and the refrigerant enters the superheated steam area beyond the gas-liquid mixing area, the latent heat cannot be used and the cooling performance is extremely deteriorated, so that it remains in the gas-liquid mixing area even at the maximum heat generation. It is necessary to adjust the amount of refrigerant.

  Recently, the amount of heat generation has increased with the improvement in CPU performance, and the demand for further improvement in the performance of the cooler is increasing.

  Accordingly, an object of the present invention is to provide a cooling device that realizes heat radiation with a high calorific value in a limited space.

In order to achieve this object, the cooling device of the present invention comprises an evaporator, a condenser, and a liquid pump for cooling a semiconductor element, which are connected to a closed circuit sequentially by piping, and the cooling of the semiconductor element provided with a fan for cooling the condenser. In the apparatus, by installing a radiator on the evaporator, a cooling apparatus that realizes high heat generation in a limited space can be provided.

  ADVANTAGE OF THE INVENTION According to this invention, the cooling device of the semiconductor element corresponding to the emitted-heat amount increase can be provided, without increasing the capacity | capacitance of a main condenser.

  In addition, even if the liquid pump breaks down and the refrigerant circulates, the evaporator has a radiator or sub-condenser so that the temperature rise rate of the evaporator can be delayed, protecting the semiconductor elements. This has the effect of creating a time margin until the circuit works.

  Furthermore, in the case of dealing with a plurality of heating elements, the dryness of the refrigerant entering the second evaporator can be reduced, so that the risk of the refrigerant state at the outlet of the second evaporator entering the superheated steam region can be prevented, and reliability can be improved. High cooling device.

  According to the first aspect of the present invention, since the condenser is divided and the sub-condenser is provided on the evaporator, a part of the heat radiation can be dissipated so that the heat radiation capacity of the main condenser is not increased. The amount of heat released can be increased.

  According to the second aspect of the present invention, a plurality of evaporators are arranged in accordance with a plurality of semiconductor elements, and a sub-condenser is provided on each of the plurality of evaporators connected in series. The heat radiation amount of the cooling device can be increased without increasing the heat radiation capacity, and the refrigerant state at the evaporator outlet can be maintained in the gas-liquid mixing zone.

  The invention according to claim 3 can increase the cooling capacity of the cooling device without increasing the capacity of the condenser because a radiator is provided on the evaporator to dissipate part of the heat received by the evaporator. .

  The semiconductor element cooling device according to the present invention realizes cooling of a high heat generation semiconductor element whose calorific value has increased with the development of a small and high performance electronic device in a limited space. This will be described with reference to the drawings.

(Embodiment 1)
1 is a schematic plan view showing a CPU cooling device of a 1U server according to Embodiment 1 of the present invention, and FIG. 2 is a schematic side view thereof.

  In the cooling device for the CPU of the 1U server shown in the figure, the refrigerant that has been heated in the evaporator 2 in close contact with the CPU 1 and is in a gas-liquid mixed state is partially radiated by the sub-condenser 6 provided on the evaporator 2. Later, it is condensed and liquefied by the main condensing unit 3 and sent again to the evaporator 2 by the liquid pump 4.

  FIG. 3 is a Mollier diagram showing the refrigerant state of the CPU cooling device according to the first embodiment of the present invention. The state of the refrigerant will be described with reference to FIG. 3. The refrigerant that has entered the evaporator 2 at the point A is heated to the point B by the heating element 1 and sent to the subcondenser 6, and dissipates the heat in the state of the point C1. 3, the heat is further radiated and the liquid pump 4 is sucked in the state of the point C in the liquid region.

  Therefore, the necessary heat radiation amount is shared by the sub-condenser 6 and the main condenser 3, and the heat radiation capacity of the cooling device can be increased without increasing the capacity of the main condenser 3.

(Embodiment 2)
FIG. 4 is a schematic plan view showing a CPU cooling device of a 1U server according to Embodiment 2 of the present invention, in which two evaporators are installed.

  In the CPU cooling apparatus shown in the figure, the refrigerant that is heated in the first evaporator 2a placed in close contact with the first CPU (not shown) and is in a gas-liquid mixed state is provided on the first evaporator 2a. After the heat is partially dissipated by the first sub-condenser 6a, the refrigerant that is heated in the second evaporator 2b closely attached to the second CPU (not shown) and is in a gas-liquid mixed state is put on the evaporator. After the heat is partially dissipated by the provided second sub-condenser 6b, it is condensed and liquefied by the main condenser 3 and sent again to the first evaporator 2a by the liquid pump 4.

  FIG. 5 is a Mollier diagram showing the refrigerant state of the CPU cooling device according to the second embodiment of the present invention. The state of the refrigerant will be described with reference to FIG. 5. Point A is the inlet of the first evaporator 2a, point B1 is the outlet of the first evaporator 2a, point C1 is the outlet of the first sub-condenser 6a, and point B is the second evaporation. The outlet of the condenser 2b, the point C2 represents the outlet of the second sub-condenser 6b, and the point C represents the outlet of the main condenser 3.

  By adding the heat radiation amount (B1-C1) and (B2-C2) radiated by the sub-condensers 6a and 6b in addition to the heat radiation amount (C2-C) of the main condenser 3 as the heat radiation amount of the entire cooling device, The heat dissipation capability of the cooling device can be increased without increasing the capacity of the main condenser 3.

  Further, by performing heat dissipation of (B1-C1) by the sub-condenser 6a, the point B can be moved in the liquid rich direction accordingly.

(Embodiment 3)
FIG. 6 is a schematic plan view showing a CPU cooling device for a 1U server according to Embodiment 3 of the present invention. In the CPU cooling apparatus shown in the figure, the refrigerant that has been heated in the evaporator 2 closely attached to the CPU 1 and is in a gas-liquid mixed state is condensed by the condenser 3 and sent to the evaporator 2 again by the liquid pump 4. . A part of the amount of heat transferred from the CPU 1 to the evaporator 2 is cooled by the radiator 7 installed on the evaporator 2, and the remaining amount of heat is guided to the condenser 3 by the refrigerant.

  FIG. 7 is a Mollier diagram showing the refrigerant state of the CPU cooling device according to the third embodiment of the present invention. The state of the refrigerant will be described with reference to FIG. 7. The refrigerant that has entered the evaporator 2 at the point A is heated to the point B by the heating element 1 and transferred to the condenser 3, and is radiated and liquefied at the point C in the liquid region. It is sucked into the pump 4. Since a part of the heat generated by the CPU 1 is radiated by the radiator 7, the amount of heat received by the evaporator 2 is reduced accordingly.

  Therefore, the required heat radiation amount is shared by the radiator 7 and the condenser 3, and the heat radiation capacity of the cooling device can be increased without increasing the capacity of the condenser 3.

1 is a schematic plan view showing a CPU cooling device of a 1U server according to Embodiment 1 of the present invention. Side view of the CPU cooling device Mollier diagram showing refrigerant state of the CPU cooling device Plane | planar schematic diagram which shows CPU cooling device of 1U server by Embodiment 2 of this invention Mollier diagram showing refrigerant state of the CPU cooling device The plane schematic diagram which shows the CPU cooling device of 1U server by Embodiment 3 of this invention Mollier diagram showing refrigerant state of the CPU cooling device Plane schematic diagram of a 1U server incorporating a conventional refrigerant circulation cooling device Same side schematic diagram A schematic plan view of a refrigerant circulation cooling device built into a conventional 1U server with two CPUs Mollier diagram showing the refrigerant state of the refrigerant circulation cooling device shown in FIG.

Explanation of symbols

1 CPU (semiconductor element)
2 Evaporator 3 Condenser (Main condenser)
4 Liquid pump 5 Fan 6 Sub-condenser 7 Radiator

Claims (3)

An evaporator, a condenser, and a liquid pump for cooling a semiconductor element are sequentially connected to a closed circuit by piping, and the semiconductor element cooling apparatus includes a fan for cooling the condenser. A cooling device for a semiconductor device, wherein the cooling device is divided into condensers, and the sub-condenser is installed on the evaporator. The cooling device for a semiconductor device according to claim 1, wherein a plurality of evaporators are arranged in accordance with the plurality of semiconductor devices, and a sub-condenser is installed on all of the evaporators. In a semiconductor device cooling apparatus having a fan for cooling the condenser, an evaporator for cooling the semiconductor device, a condenser, and a liquid pump are sequentially connected to the closed circuit by piping, and a radiator is installed on the evaporator. A cooling device for a semiconductor element, characterized by comprising:

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