JP2005353723A - Dicing apparatus, and dicing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device dicing apparatus having a position sensing mechanism with its position sensing accuracy increased for improving the throughput of the dicing apparatus, small in size, and low in cost; and to provide a dicing method. <P>SOLUTION: The dicing apparatus comprises a supply section for supplying an electronic circuit board whereon a plurality of electronic circuits are arrayed as encapsulated in resin, a transport mechanism for lifting the electronic circuit board from the supply section and for transferring the same to a table, and a dicing section for separating the electronic circuit board on the table into individual electronic circuits. The transport mechanism has a positioning means for positioning the electronic circuit board. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention generally relates to a cutting apparatus and a cutting method, and more particularly to a cutting apparatus that cuts out an electronic circuit from a resin-sealed electronic circuit board and a cutting method thereof. The present invention is suitable for manufacturing a micro device such as a semiconductor device.

  With the recent high performance and widespread use of electronic devices, semiconductor manufacturing apparatuses have to manufacture high-quality semiconductor devices used in such electronic devices more efficiently and at higher speeds. In the assembly process (post-process) of the semiconductor manufacturing process, a cutting process in which a workpiece (for example, a wafer or a molded substrate) that has completed the wafer processing process (pre-process) is divided into a number of regions (corresponding to elements such as chips). Apply. In the cutting process, the workpiece is vacuum-sucked on a table called a cutting table, positioned and fixed, and then the workpiece is cut with a blade that rotates at high speed while moving the cutting table in the cutting direction, and is divided into a number of regions. (Separation). The cutting table is configured to be rotatable, and when the cutting of the workpiece in one direction is completed, the cutting table is rotated 90 degrees to cut in the orthogonal direction. For this reason, the divided | segmented area | region becomes a rectangular shape normally.

  In the cutting apparatus, since it is necessary to accurately position the cutting site of the workpiece, the cutting apparatus generally has an alignment mechanism (position detection mechanism). FIG. 5A is an internal configuration diagram illustrating a schematic configuration of an example of a position detection mechanism included in a conventional cutting device. This position detection mechanism has two cameras, a low magnification camera 2 for coarse adjustment and a high magnification camera 4 for fine adjustment. For these cameras 2 and 4, for example, digital cameras using an image sensor such as a CCD or CMOS are used. The light from the reference mark 5 (see FIG. 5B) formed on the work 6 is guided to the two cameras 2 and 4 using the lens 8, the half mirror 10, and the mirror 12. Yes. The visual field centers of the two cameras 2 and 4 coincide on the workpiece 6.

  Since the optical magnification of the low-magnification camera 2 is lower than the optical magnification of the high-magnification camera 4, the field of view S1 of the low-magnification camera 2 is larger than the field of view S2 of the high-magnification camera 4 as shown in FIG. Is also big. Therefore, the low-magnification camera 2 can view a wider area, and the high-magnification camera 4 can detect the position with higher resolution.

  When the workpiece 6 is placed on the cutting table and moved / stopped to a predetermined position, the reference mark 5 enters the field of view S1 of the low-magnification camera 2 (position A in FIG. 5B). The low-power camera 2 detects the reference mark 5 and moves the cutting table (coarse adjustment) to move the reference mark 5 to the center of the field of view S1 of the low-power camera 2 (position B in FIG. 5B). To do. Then, since the reference mark 5 enters the field of view S2 of the high-magnification camera 4, this time, the camera is switched and the reference mark 5 is detected by the high-magnification camera 4. The high magnification camera 4 can detect a positional shift between the reference mark 5 and the center of the visual field with higher resolution than the low magnification camera 2. Based on the detection result of the high-magnification camera 4, the cutting table is moved (fine adjustment), and the reference mark 5 can be positioned at the center of the visual field with high accuracy. As a result, the workpiece 6 can be positioned with high accuracy.

  However, according to this conventional position detection mechanism, many operations are required for positioning, and it takes time to cut the workpiece 6. After the reference mark 5 on the workpiece 6 is detected by the low-magnification camera 2 in order to more reliably capture, it is necessary to detect the reference mark 5 by the high-magnification camera 4 in order to detect the reference mark 5 with higher accuracy. You have to switch cameras. Further, as shown in FIG. 6, the positioning needs to be performed on at least three reference marks 5 a to 5 c (or four reference marks 5 a to 5 d) near the four corners on the workpiece 6. That is, the in-plane rotation angle deviation in the longitudinal direction of the workpiece 6 (rotation angle deviation in the plane including the paper surface of FIG. 6) is corrected based on the reference marks 5a and 5b, and the workpiece is determined based on the reference marks 5a and 5c. 6 is corrected based on the reference marks 5a and 5b, and the positional deviation along the longitudinal direction of the workpiece 6 is corrected again based on the reference marks 5a and 5b. It is necessary to correct the positional deviation along the short direction. Therefore, the procedure and time required for position detection and correction have become enormous. Therefore, the throughput of cutting the workpiece 6 is not improved, and the manufacturing efficiency of the semiconductor device is low.

  Furthermore, since the light from the reference mark is branched by the half mirror 10 and is incident on the two cameras 2 and 4, the optical signal level detected by each camera 2 and 4 is halved and good signal detection is performed. Is difficult. The center of the field of view of the two cameras 2 and 4 must be the same, but in reality, there may be a center shift. Furthermore, since the camera has two cameras, ie, the low-power camera 2 and the high-power camera 4, there is a problem that the position detection mechanism is increased in size and costs are increased.

  The present invention has been made in view of the above circumstances, and a cutting apparatus having a small and low-cost position detection mechanism capable of improving the throughput of cutting a semiconductor device and performing position detection with high accuracy, and It is an exemplary object to provide a cutting method.

  In order to achieve the above object, a cutting apparatus according to an exemplary aspect of the present invention includes a supply unit that supplies an electronic circuit board on which a plurality of resin-sealed electronic circuits are arranged, and a supply unit that supplies the electronic circuit board. A cutting apparatus having a transport mechanism that lifts and transfers the electronic circuit board placed on the cutting table, and a cutting unit that cuts the electronic circuit board placed on the cutting table into individual electronic circuits. It has a positioning means for positioning the circuit board.

  According to this cutting apparatus, since the transport mechanism has positioning means for positioning the electronic circuit board, the electronic circuit component can be lifted from the supply unit while positioning with high accuracy and high reproducibility. Therefore, the electronic circuit component can be placed on the cutting table while positioning with high accuracy and high reproducibility. Here, the positioning means is constituted by, for example, a positioning pin or a contact member having a position reference surface.

  Since the electronic circuit components are placed on the cutting table while being positioned with high accuracy, the position detecting mechanism for demarcating the cutting site does not require a low-magnification camera, and the cutting apparatus is made small and low cost. Can do. Furthermore, since the camera switching operation is not required for position detection, the position detection procedure and time can be greatly reduced. As a result, it is possible to contribute to the improvement of the throughput of cutting the semiconductor device, and the manufacturing efficiency of the semiconductor device is improved.

  Since a plurality of cameras are not used, it is not necessary to branch the optical signal from the reference mark, and position detection can be performed without deteriorating the optical signal intensity. Therefore, position detection can be reliably performed based on a good optical signal. In addition, there is no occurrence of discrepancy between the visual field centers.

  A cutting method according to another exemplary aspect of the present invention is a cutting method for cutting an electronic circuit board on which a plurality of resin-sealed electronic circuits are arranged into individual electronic circuits, and supplying the electronic circuit board A step of positioning and gripping the supplied electronic circuit board, a step of lifting the gripped electronic circuit board and transferring it onto the cutting table, and an electronic circuit board placed on the cutting table. And a step of cutting into individual electronic circuits.

  According to this cutting method, since the electronic circuit board is gripped while being positioned, the electronic circuit component can be lifted from the supply unit with high accuracy and high position reproducibility. Therefore, the electronic circuit component can be placed on the cutting table while positioning with high accuracy and high reproducibility. Here, “positioning” means positioning using, for example, a positioning pin or a contact member having a position reference surface.

  Since the electronic circuit component is placed on the cutting table while being positioned with high accuracy, a low-magnification camera is not required for the position detection mechanism for defining the cutting site. Since the camera switching operation is not necessary for position detection, the position detection procedure and time can be greatly reduced. As a result, it is possible to contribute to the improvement of the throughput of cutting the semiconductor device, and the manufacturing efficiency of the semiconductor device is improved.

  In the transposition step, it is more desirable to transpose the electronic circuit board on the cutting table while positioning the electronic circuit board. Thus, the electronic circuit board can be placed on the table with higher accuracy and higher position reproducibility. As a result, if the positional accuracy when the electronic circuit board is placed on the cutting table exceeds the positional accuracy necessary for defining the cutting site of the electronic circuit board, it is necessary to detect the position at the time of cutting. Thus, the position detection mechanism itself can be eliminated.

  Further objects and other features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, the position detection throughput can be improved, and as a result, the semiconductor device cutting throughput can be improved. Therefore, the manufacturing efficiency of the semiconductor device is improved. Furthermore, position detection can be performed without degrading the optical signal intensity from the reference mark. Therefore, position detection can be reliably performed based on a good optical signal. In addition, since a plurality of imaging means and optical magnifications are not used, the entire position detection mechanism can be reduced in size and cost.

[Embodiment 1]
A cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a schematic configuration of a cutting device 1 according to an embodiment of the present invention as viewed from above. The cutting apparatus 1 is roughly configured to include a workpiece supply unit (supply unit) 14, a cutting unit 16, an inspection unit 18, a workpiece storage unit 20, and a control unit 22.

  The workpiece supply unit 14 is for sending the workpiece 6 as a cutting target toward the cutting unit 16. In the present embodiment, the workpiece 6 is a resin-sealed electronic circuit board on which a plurality of electronic circuits are arranged. Reference marks 5 a to 5 c as reference positions are formed at the end of the work 6 on the mounting surface side. The marks 5a to 5c are used as a reference when detecting the position of the workpiece 6 by a position detection mechanism 32 described later. (See also FIG. 6). However, the reference position is not limited to the reference marks 5a to 5c, and the shape and position of the reference mark can be changed as appropriate according to circumstances. The position may be used as a reference position. A positioning hole 6c (see also FIG. 2) described later may be detected as the reference position. The workpiece supply unit 14 is generally configured to include a stacker 26 for stacking the workpieces 6, a delivery mechanism for delivering one workpiece 6 from the stacker 26, and a supply table 15 for supporting the delivered workpiece 6.

  The workpiece 6 placed on the supply table 15 is lifted by the transport mechanism 24 and is transferred onto the cutting table 28. The transport mechanism 24 includes, for example, a gripping unit 25 at the tip and is configured by a robot arm or an XYZ moving stage. Can do.

  FIG. 2 is a cross-sectional view illustrating a schematic configuration of the grip portion 25. In FIG. 2, the right half of the center line shows a schematic configuration of the grip portion 25, and the left half is an internal configuration diagram showing a schematic configuration of a CCD camera 36 described later.

  The grip portion 25 includes a grip plate 25a, a suction plate 25c, a positioning pin (a part of positioning means) 25d, a spring 25e, and a stripper 25f. The holding plate 25a is a plate or a block for holding the workpiece 6, and is formed of a metal such as aluminum or a plastic such as polycarbonate. The workpiece 6 is adsorbed to the holding plate 25a by air adsorption means (not shown). Therefore, air holes 25b are formed in the gripping plate 25a.

  The suction plate 25c is used to make the suction of the workpiece 6 to the gripping plate 25a more reliable, and has a generally sucker shape. The suction plate 25c is formed of an elastic member such as rubber and is provided so as to surround the air hole 25b. The workpiece 6 is placed on the jig plate 17 on the supply table 15 and the cutting table 28 with the resin sealing portion 6a on the lower side and the mounting surface side 6b on the upper side. The jig plate 17 is positioned in order to avoid collision with the air holes 17a communicating with the air holes 28a of the cutting table 28 and the positioning pins 25d in order to suck the work 6 to the cutting table 28 by air suction means (not shown). An escape hole 17b into which the tip of the pin 25d is inserted is formed. The suction plate 25 c is configured to suck the mounting surface side 6 b of the workpiece 6.

  The positioning pin 25d is for gripping the workpiece 6 to the gripping portion 25 while positioning the workpiece 6. The gripping plate 25a has a rectangular gripping surface that substantially corresponds to the rectangular shape of the workpiece 6 in plan view (see also FIG. 6), and the positioning pins 25d correspond to approximately four corners of the rectangular gripping surface. There are 3 to 4 locations. A positioning hole (a part of positioning means) 6c is formed in the workpiece 6 at a position corresponding to the positioning pin 25d. The positioning pin 25d is, for example, a rod-shaped member having a circular cross section whose diameter is precisely processed to a predetermined dimension. The positioning hole 6c is a round hole formed so that the diameter thereof substantially matches the positioning pin 25d.

  The spring 25e and the stripper 25f are arranged so as to be sandwiched between the positioning pin 25d and the workpiece 6. These are for facilitating separation of the workpiece 6 from the holding plate 25a. The spring 25e biases the workpiece 6 in the direction of pulling out the positioning pin 25d via the stripper 25f, and when the air suction by the gripping plate 25a is stopped, the workpiece 6 is pulled out of the positioning pin 25d and separated from the gripping plate 25a. . Since the air adsorption force is stronger than the urging force of the spring 25e, the workpiece 6 is not separated from the gripping plate 25a during the air adsorption.

  The cutting unit 16 is for cutting the workpiece 6 placed on the cutting table 28 into a predetermined size while detecting the position. The cutting unit 16 has a blade 30, a position detection mechanism 32, a positioning stage (not shown), a moving mechanism (not shown), and cleaning units 34a and 34b. The blade 30 is for cutting the workpiece 6 into a predetermined dimension, and for example, a disk-shaped rotary grindstone or the like is used. The blade 30 is movable in the XZ axis direction by a moving mechanism (not shown).

  The position detection mechanism 32 is for accurately detecting the position of the workpiece 6 and has one CCD camera 36 as an imaging means. The CCD camera 36 detects the reference marks 5a to 5c as reference positions on the workpiece 6, and detects the position of the workpiece 6 based on the mark positions. An internal configuration diagram showing a schematic configuration of the CCD camera 36 is shown on the left half of the center line of FIG. The CCD camera 36 includes a CCD imaging device 38, a lens 44, a half mirror (not shown), coaxial illumination (not shown), ring illumination (not shown), and the like, and is roughly configured. The workpiece 6 is illuminated by coaxial illumination and ring illumination, and the reflected light is detected by the CCD image sensor 38 through the lens 44 and the half mirror. Of course, the image pickup means may be any digital image pickup means that can convert the detected optical signal into an electrical signal, perform AD conversion, and output it as digital image data. In addition to the CCD camera, for example, a camera using a CMOS sensor may be used. It is also possible to apply. As the optical magnification of the CCD camera 36, one fixed one is used. The magnification is set so that the marks 5 a to 5 c are present in the field of view of the CCD camera 36 when the positioning stage for moving the cutting table 28 on which the workpiece 6 is placed stops at a predetermined position. The CCD camera 36 can also be moved in the XZ direction by a moving stage. Of course, three or four positioning holes 6c may be detected instead of detecting the reference marks 5a to 5c by the position detection mechanism 32.

  The positioning stage moves and stops the cutting table 28 in the XY direction and the rotational direction in the XY plane. For example, a precision moving stage or the like is used. This positioning stage can stop the cutting table 28 with a predetermined stop accuracy. That is, when the positioning stage is moved and stopped with the workpiece 6 placed on the cutting table 28, any of the reference marks 5a to 5c on the workpiece 6 falls within the field of view of the CCD camera 36. The optical magnification of the CCD camera 36 is, for example, 1.0. However, in this embodiment, since the workpiece 6 is positioned on the cutting table 28 with high accuracy, the reference marks 5a to 5c are the CCD camera. It surely falls within 36 fields of view.

  The cleaning units 34a and 34b are for cleaning by blowing high-pressure water and air to the workpiece 24 after cutting.

  The inspection unit 18 performs various inspections such as the dimensions of the workpiece 6 after cutting. For example, when the workpiece 6 is an electronic circuit board on which a plurality of resin-sealed electronic circuits are arranged, the inspection unit 18 performs inspection such as continuity inspection of each individual electronic circuit (for example, a semiconductor device) after cutting. .

  The workpiece storage unit 20 is for storing the workpiece 6 after inspection. The control unit 22 performs operation control and data processing of the entire cutting device 1, and is roughly configured to include an arithmetic processing device, a memory for storing various data, and a display device.

  Next, operation | movement of this cutting device is demonstrated.

  First, the feeding mechanism feeds one workpiece 6 out of the workpieces 6 stacked and arranged on the stacker 26. The fed workpiece 6 is placed on a jig plate 17 on the supply table 15. The workpiece 6 is attracted to the grip plate 25a of the transport mechanism 24. At this time, the positioning pin 25d provided on the gripping plate 25a is inserted into the positioning hole 6c of the workpiece 6 and positioned, and the workpiece 6 is attracted to the gripping plate 25a by air suction. Of course, other adsorption (for example, magnetic adsorption or electrostatic adsorption) may be used, or clamping means may be provided at the tip of the arm so that the workpiece 6 may be clamped. Since the positioning pin 25d is inserted into the positioning hole 6c, the position of the workpiece 6 on the grip plate 25a is accurately positioned. Since the escape plate 17 b is formed in the jig plate 17 on the supply table 15, the positioning pin 25 d does not collide with the jig plate 17.

  The transport mechanism 24 moves the workpiece 6 while holding the workpiece 6, and transfers (transfers) the workpiece 6 onto the jig plate 17 on the cutting table 28. At this time, air suction is stopped on the gripping portion 25 side, and air suction is started on the cutting table 28 side. Since air suction is stopped on the gripping portion 25 side, the workpiece 6 is easily separated from the gripping plate 25a by the spring 25e and the stripper 25f. Further, since air suction has started on the cutting table 28 side, the workpiece 6 is firmly fixed to the cutting table 28. Since the workpiece 6 is accurately positioned and attracted to the gripping plate 25a, if the gripping plate 25a is accurately positioned with respect to the cutting table 28, the workpiece 6 is accurately positioned on the cutting table 28. Will be placed.

  Subsequently, the cutting device 1 performs positioning and position correction of the rotational angle deviation of the workpiece 6 in the XY plane. The positioning stage moves the cutting table 28 on which the workpiece 6 is placed to a predetermined position near the position detection mechanism 32 and stops. Since the workpiece 6 is accurately positioned on the cutting table 28, the reference mark 5a stops within the field of view of the CCD camera 36.

  After the fiducial mark 5a is imaged and detected by the CCD camera 36 and its position C is specified, the fiducial marks 5b and 5c are also position-detected to complete the detection of the rotational angle deviation of the workpiece 6 and the position correction.

  When the detection of the rotational angle deviation in the XY plane of the workpiece 6 is completed, the coordinate position of the workpiece 6 in the X direction and the Y direction is continuously detected. The workpiece 6 is stopped by moving the positioning stage so that the reference mark 5 a again enters the field of view of the CCD camera 36. The data of the coordinates of the reference mark 5a is taken and sent to the memory of the control unit 22.

  Next, the workpiece 6 is stopped by moving the positioning stage so that the reference mark 5b enters the field of view of the CCD camera 36. The data of the coordinates of the reference mark 5b is taken and sent to the memory of the control unit 22. The workpiece 6 can be positioned in the Y direction based on the coordinate data of the reference mark 5a and the coordinate data of the reference mark 5b.

  Subsequently, the workpiece 6 is stopped by moving the positioning stage so that the reference mark 5 a again enters the field of view of the CCD camera 36. The data of the coordinates of the reference mark 5a is taken and sent to the memory of the control unit 22.

  Next, the workpiece 6 is stopped by moving the positioning stage so that the reference mark 5c enters the field of view of the CCD camera 36. The data of the coordinates of the reference mark 5 c is taken and sent to the memory of the control unit 22. Based on the coordinate data of the reference mark 5a and the coordinate data of the reference mark 5c, the workpiece 6 can be positioned in the X direction.

  When the high-precision positioning of the workpiece 6 in the XY direction and the rotational direction in the XY plane is completed, the workpiece 6 is cut into a predetermined dimension by the blade 30 while operating the positioning stage and the moving stage based on the positioning data. For example, when the work 6 is an electronic circuit board on which several tens of electronic circuits are arranged, the electronic circuit board is cut into X and Y directions to form individual electronic circuits. Since the workpiece 6 is adsorbed to the cutting table 28 by air, it does not move or drop from the cutting table 28 during or after cutting.

  The workpiece 6 after being cut by the positioning stage is moved to the cleaning units 34a and 34b, cleaned by spraying water or a cleaning agent, and dried by spraying air. The cleaned workpiece 6 is moved to the inspection unit 18, and the continuity inspection and other inspections of the cut individual workpieces are performed. Thereafter, the work is stored in the work storage unit 20.

  As described above, according to the cutting device according to the present embodiment, since the workpiece 6 is accurately positioned and placed on the cutting table 28, the XY of the workpiece 6 can be performed with fewer procedures than in the past. And high-precision positioning in the direction of rotation in the XY plane. Therefore, the time required for positioning is shortened, and the workpiece 6 can be efficiently cut.

  Further, since the position detection mechanism 32 has one CCD camera 36 and the CCD camera 36 has one fixed optical magnification, the position detection mechanism itself can be reduced in size and cost. .

[Embodiment 2]
FIG. 3 is a cross-sectional view showing a schematic configuration near the grip portion 25 of the transport mechanism of the cutting apparatus according to Embodiment 2 of the present invention. In addition, about the structure similar to Embodiment 1, the same code | symbol is attached | subjected and the description shall be abbreviate | omitted.

  In this embodiment, a guide pin (a part of positioning means) 27 is further provided on the holding plate 25a, and a guide hole (a part of positioning means) 28b is formed in the cutting table 28. This guide pin 27 is for making the positioning of the holding plate 25a and the cutting table 28 more accurate. For example, the guide pin 27 is a rod-shaped member having a circular cross section with a predetermined diameter, and the tip is spherical. Therefore, even when the grip portion 25 is displaced for some reason during conveyance, the insertion into the guide hole 28b is ensured. Three to four guide pins 27 are provided at positions corresponding to the four corners of the rectangular shape in plan view of the holding plate 25a. First, the guide pin 27 is inserted into the guide hole 28b, and the first stage rough positioning is performed, whereby the positioning pin 25d is guided and accurately inserted into the positioning hole 6c.

  The workpiece 6 that is accurately positioned and attracted to the gripping plate 25 a is transferred onto the jig plate 17 on the cutting table 28. At this time, in the present embodiment, the positioning of the gripping plate 25a and the cutting table 28 is accurately performed by the guide pins 27 and the guide holes 28b, so that the workpiece 6 is more accurately positioned than in the case of the first embodiment. It can be placed on the cutting table 28.

[Embodiment 3]
FIG. 4 is a cross-sectional view showing a schematic configuration in the vicinity of the grip portion 25 of the transport mechanism of the cutting apparatus according to Embodiment 3 of the present invention. In addition, about the structure similar to Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In this embodiment, the gripping part 25 can simultaneously suck two workpieces 6 and transfer them from the supply table 15 to the cutting table 28. Although not shown, of course, two workpieces 6 are simultaneously supplied from the stacker 26 to the supply table 15 as well.

  In this way, the gripping unit 25 grips the plurality of workpieces 6 at the same time and transfers them onto the cutting table 28, and further cuts the plurality of workpieces 6 adsorbed on the cutting table 28 by the cutting unit 16 at the same time. Since the efficiency is improved, the manufacturing efficiency of the semiconductor device can be further improved.

  In the first to third embodiments, when the position of the reference marks 5a to 5c is detected by the position detection mechanism 32 after the workpiece 6 is transferred to the cutting table 28, a positional deviation occurs due to some external factor. If it is determined that the gripping portion 25 has been moved, the gripper 25 is brought close to the workpiece 6 again, and the positioning pin 25d is inserted into the positioning hole 6c of the workpiece 6, thereby correcting the position.

  In the first to third embodiments, the position of the workpiece 6 is detected by the position detection mechanism 32. If the positioning accuracy necessary for cutting the workpiece 6 by the positioning means according to the present invention can be secured, It is not necessary to detect the position of the workpiece 6, and the position detection mechanism 32 itself can be omitted. Thereby, the cutting device 1 is further reduced in size and cost.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. For example, the present invention can of course be configured as in the fourth embodiment described below.

[Embodiment 4]
In the first embodiment, positioning pins 25d provided on the gripping plate 25a are inserted into positioning holes 6c formed in substantially four corners of the workpiece 6. However, as shown in FIG. 6, three to four positioning pins 25 d provided on the rectangular gripping plate 25 a come into contact with the outer periphery 6 d of the workpiece 6 to position the workpiece 6. Also good.

  The positioning pins 25d are arranged at intervals so as to substantially encompass the outer shape of the workpiece 6, and the workpiece 6 can be positioned with high accuracy when the gripping plate 25a adsorbs the workpiece 6. By configuring in this way, it is not necessary to form the positioning hole 6c for inserting the positioning pin 25d in the workpiece 6, which can further contribute to cost reduction.

It is the top view which looked at schematic structure of the cutting device concerning Embodiment 1 of the present invention from the upper part. The right half of the center line is a cross-sectional view showing a schematic configuration of a gripping part used in the cutting apparatus shown in FIG. 1, and the left half is an internal configuration diagram showing a schematic configuration of a CCD camera. It is sectional drawing which shows schematic structure of the holding part vicinity of the conveyance mechanism of the cutting device which concerns on Embodiment 2 of this invention. It is sectional drawing which shows schematic structure of the holding part vicinity of the conveyance mechanism of the cutting device which concerns on Embodiment 3 of this invention. (A) is an internal block diagram which shows schematic structure of an example of the position detection mechanism which the conventional cutting device has, (b) is explanatory drawing which shows a mode that a mark exists in the visual field of a camera. It is the top view which looked at the work from the upper part.

Explanation of symbols

1: Cutting devices 5, 5a to 5c: Reference mark 6: Workpiece (electronic circuit board)
6c: positioning hole (part of positioning means)
14: Work supply part (supply part)
15: Supply table 24: Conveying mechanism 25: Grasping part 25a: Grasping plate 25d: Positioning pin (part of positioning means)
27: Guide pin (part of positioning means)
28: Cutting table 28b: Guide hole (part of positioning means)
32: Position detection mechanism 36: Imaging means (CCD camera, digital imaging means)

Claims (3)

A supply unit for supplying an electronic circuit board on which a plurality of resin-sealed electronic circuits are arranged;
A transport mechanism for lifting the electronic circuit board from the supply unit and transposing it on a cutting table;
A cutting device having a cutting section for cutting the electronic circuit board placed on the cutting table into individual electronic circuits,
The cutting apparatus, wherein the transport mechanism has positioning means for positioning the electronic circuit board. A cutting method for cutting an electronic circuit board in which a plurality of resin-sealed electronic circuits are arranged into individual electronic circuits,
Supplying the electronic circuit board;
Gripping while positioning the supplied electronic circuit board;
Lifting the gripped electronic circuit board and transposing it on a cutting table;
Cutting the electronic circuit board placed on the cutting table into individual electronic circuits. The cutting method according to claim 2, wherein, in the transposing step, the electronic circuit board is transposed on the cutting table while positioning.