JP2005272773A - Active energy beam-curable composition for optical material - Google Patents
Active energy beam-curable composition for optical material Download PDFInfo
- Publication number
- JP2005272773A JP2005272773A JP2004091926A JP2004091926A JP2005272773A JP 2005272773 A JP2005272773 A JP 2005272773A JP 2004091926 A JP2004091926 A JP 2004091926A JP 2004091926 A JP2004091926 A JP 2004091926A JP 2005272773 A JP2005272773 A JP 2005272773A
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- JP
- Japan
- Prior art keywords
- acrylate
- meth
- composition
- component
- active energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000203 mixture Substances 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 title claims abstract description 24
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 40
- 239000004593 Epoxy Substances 0.000 claims abstract description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 239000004925 Acrylic resin Substances 0.000 abstract description 6
- 229920000178 Acrylic resin Polymers 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 description 19
- -1 diol compound Chemical class 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000005058 Isophorone diisocyanate Substances 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000012975 dibutyltin dilaurate Substances 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- RBVLUTAXWVILBT-UHFFFAOYSA-N ethyl prop-2-eneperoxoate Chemical compound CCOOC(=O)C=C RBVLUTAXWVILBT-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- BHKAWXZKFKVZLK-UHFFFAOYSA-N 2,3-ditert-butyl-6-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(C(C)(C)C)=C1O BHKAWXZKFKVZLK-UHFFFAOYSA-N 0.000 description 3
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZMZHRHTZJDBLEX-UHFFFAOYSA-N (2-phenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 ZMZHRHTZJDBLEX-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- LXSJHLYEDBJAGK-UHFFFAOYSA-N [4-(2-phenylpropan-2-yl)phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=CC=C1 LXSJHLYEDBJAGK-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- POZQNORNRSITKW-UHFFFAOYSA-N (1,2,2-tribromo-2-phenoxyethyl) prop-2-enoate Chemical compound C=CC(=O)OC(Br)C(Br)(Br)OC1=CC=CC=C1 POZQNORNRSITKW-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- QUEWJUQWKGAHON-UHFFFAOYSA-N (2-phenylphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1C1=CC=CC=C1 QUEWJUQWKGAHON-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- VTEYUPDBOLSXCD-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-2-methylcyclohexane Chemical compound CC1CCCCC1(OOC(C)(C)C)OOC(C)(C)C VTEYUPDBOLSXCD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- OTMBZPVYOQYPBE-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclododecane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCCCCCCCC1 OTMBZPVYOQYPBE-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- IEMBFTKNPXENSE-UHFFFAOYSA-N 2-(2-methylpentan-2-ylperoxy)propan-2-yl hydrogen carbonate Chemical compound CCCC(C)(C)OOC(C)(C)OC(O)=O IEMBFTKNPXENSE-UHFFFAOYSA-N 0.000 description 1
- VAZQKPWSBFZARZ-UHFFFAOYSA-N 2-(2-phenylphenoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1C1=CC=CC=C1 VAZQKPWSBFZARZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical class CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- BZGMEGUFFDTCNP-UHFFFAOYSA-N 2-hydroperoxy-2-methylpentane Chemical compound CCCC(C)(C)OO BZGMEGUFFDTCNP-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- WXDJDZIIPSOZAH-UHFFFAOYSA-N 2-methylpentan-2-yl benzenecarboperoxoate Chemical compound CCCC(C)(C)OOC(=O)C1=CC=CC=C1 WXDJDZIIPSOZAH-UHFFFAOYSA-N 0.000 description 1
- NBASYSYSVRDGEF-UHFFFAOYSA-N 2-methylpentan-2-ylperoxycyclohexane Chemical compound CCCC(C)(C)OOC1CCCCC1 NBASYSYSVRDGEF-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 1
- KJCZZAGVSHHPNH-UHFFFAOYSA-N 2-tert-butylperoxy-2-methylpropane hydrogen peroxide 1-methyl-4-propan-2-ylcyclohexane Chemical compound OO.CC(C)C1CCC(C)CC1.CC(C)(C)OOC(C)(C)C KJCZZAGVSHHPNH-UHFFFAOYSA-N 0.000 description 1
- BQARUDWASOOSRH-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-yl hydrogen carbonate Chemical compound CC(C)(C)OOC(C)(C)OC(O)=O BQARUDWASOOSRH-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- VDHWOHDSOHPGPC-UHFFFAOYSA-N 3,3-dihydroxyoxepan-2-one Chemical compound OC1(O)CCCCOC1=O VDHWOHDSOHPGPC-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- OPPHXULEHGYZRW-UHFFFAOYSA-N 4-methoxy-2,4-dimethyl-2-phenyldiazenylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC1=CC=CC=C1 OPPHXULEHGYZRW-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- AMRTYFYCIRZAJL-UHFFFAOYSA-N C(O)CC(C(O)(O)CO)(CC)CCCC Chemical compound C(O)CC(C(O)(O)CO)(CC)CCCC AMRTYFYCIRZAJL-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- PDLZOMRBHUBXSF-UHFFFAOYSA-N [4-(2-phenylpropan-2-yl)phenyl] 2-methylprop-2-enoate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=CC=C1 PDLZOMRBHUBXSF-UHFFFAOYSA-N 0.000 description 1
- FPBUKYMLBDTKET-UHFFFAOYSA-N [4-(4-methylbenzoyl)phenyl]-phenylmethanone Chemical class C1=CC(C)=CC=C1C(=O)C1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 FPBUKYMLBDTKET-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- JZCDQJCYLFYNFW-UHFFFAOYSA-N hexyl 3-methylbenzenecarboperoxoate Chemical compound CCCCCCOOC(=O)C1=CC=CC(C)=C1 JZCDQJCYLFYNFW-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- OROJFILAYVDTTR-UHFFFAOYSA-N oxirane;4-(2-phenylpropan-2-yl)phenol Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 OROJFILAYVDTTR-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- JIYXDFNAPHIAFH-UHFFFAOYSA-N tert-butyl 3-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OC(C)(C)C)=C1 JIYXDFNAPHIAFH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- XTXFUQOLBKQKJU-UHFFFAOYSA-N tert-butylperoxy(trimethyl)silane Chemical compound CC(C)(C)OO[Si](C)(C)C XTXFUQOLBKQKJU-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
本発明は、活性エネルギー線硬化型光学材料用組成物に関するものであり、活性エネルギー線硬化型組成物、並びにレンズシート及び光学材料を組み立てる際の接着剤等の光学材料の技術分野に属するものである。 TECHNICAL FIELD The present invention relates to an active energy ray-curable composition for optical materials, and belongs to the technical field of active energy ray-curable compositions and optical materials such as adhesives when assembling lens sheets and optical materials. is there.
従来、フレネルレンズ及びレンチキュラーレンズ等のレンズシートは、プレス法及びキャスト法等の方法により、成形して製造されていた。
しかしながら、前者のプレス法は加熱、加圧及び冷却のサイクルで製造するため、生産性が悪いという問題があった。又、後者のキャスト法は、金型にモノマーを流し込んで重合するため製作時間が長くかかるとともに金型が多数個必要なため、製造コストが上がるという問題があった。
Conventionally, lens sheets such as Fresnel lenses and lenticular lenses have been manufactured by molding by a method such as a press method or a cast method.
However, the former pressing method has a problem of poor productivity because it is manufactured by a cycle of heating, pressurizing and cooling. Further, the latter casting method has a problem that it takes a long manufacturing time because a monomer is poured into a mold for polymerization, and a large number of molds are required, resulting in an increase in manufacturing cost.
一方、活性エネルギー線硬化型組成物は、速硬化性を有し、生産性に優れているため、前記問題を解決するため、レンズシートの製造用の活性エネルギー線硬化型組成物について、種々の提案がなされている(例えば特許文献1〜同6)。 On the other hand, since the active energy ray-curable composition has fast curability and is excellent in productivity, in order to solve the above problems, various active energy ray-curable compositions for producing lens sheets are available. Proposals have been made (for example, Patent Documents 1 to 6).
しかしながら、従来の活性エネルギー線硬化型組成物は、屈折率及び透明性の点で不十分であり、さらにこの点を改良すべく、ビスフェノール型ジ(メタ)アクリレートと芳香族環を有するモノ(メタ)アクリレートを併用した組成物が検討されている(例えば、特許文献7及び同8)。
又、近年においては、光学材料の製造において、高屈折率の材料同士を貼り合せる際に使用される接着剤組成物に対しても、硬化物が高屈折率を有することが要求される様になってきている(特許文献9及び10)
However, conventional active energy ray-curable compositions are insufficient in terms of refractive index and transparency, and in order to further improve this point, mono (meta) having a bisphenol di (meth) acrylate and an aromatic ring. ) Compositions using acrylate in combination have been studied (for example, Patent Documents 7 and 8).
In recent years, in the production of optical materials, the cured product is required to have a high refractive index even for an adhesive composition used when bonding high refractive materials. (Patent Documents 9 and 10)
しかしながら、前記した活性エネルギー線硬化型組成物は、プロジェクションテレビ等の薄型化で要求される様な、さらに高度の屈折率が要求される用途では不十分なものであった。
又、レンズ金型と透明基板の間に活性エネルギー線硬化型組成物を流し込み、硬化させてレンズを製造する技術においては、レンズ部と透明基板との間に十分な密着性が得られないことが多い。とりわけ、透明基板として、透明性や耐候性に優れ、この種の材料として多く使用されるメタクリル樹脂を用いた場合、活性エネルギー線硬化型組成物の硬化物との密着性が不十分であることが多かった。
又、前記した従来の光学材料用の接着剤組成物は、硬化物が着色してしまうことがあったり(特許文献9)、組成物の粘度が高くなってしまい、取り扱い難くなってしまうことがあった(特許文献10)。
本発明者は、作業性に優れ、得られる硬化物が高屈折率を有し、樹脂基板、特に(メタ)アクリル樹脂に対する密着性に優れる活性エネルギー線硬化型光学材料用組成物を見出すため鋭意検討を行ったのである。
However, the above-described active energy ray-curable composition is insufficient for applications that require a higher refractive index, such as those required for thinning projection televisions and the like.
In addition, in the technology for producing a lens by pouring an active energy ray-curable composition between a lens mold and a transparent substrate and curing the composition, sufficient adhesion cannot be obtained between the lens portion and the transparent substrate. There are many. In particular, when a methacrylic resin, which is excellent in transparency and weather resistance as a transparent substrate and is frequently used as this kind of material, has insufficient adhesion to the cured product of the active energy ray-curable composition. There were many.
In addition, the above-described conventional adhesive composition for optical materials may cause the cured product to be colored (Patent Document 9), or the viscosity of the composition may increase, making it difficult to handle. (Patent Document 10).
The present inventor is eager to find a composition for an active energy ray-curable optical material that is excellent in workability, has a high refractive index, and has excellent adhesion to a resin substrate, particularly (meth) acrylic resin. It was examined.
本発明者は、上記の課題を解決するため鋭意研究した結果、ウレタン(メタ)アクリレート及び/又はエポキシ(メタ)アクリレートと、特定の芳香族系(メタ)アクリレートを併用した組成物が有効であることを見出し、本発明を完成した。
以下、本発明を詳細に説明する。
尚、本明細書においては、アクリレート又はメタクリレートを(メタ)アクリレートと表す。
As a result of intensive studies to solve the above problems, the present inventor is effective to use a composition in which urethane (meth) acrylate and / or epoxy (meth) acrylate and a specific aromatic (meth) acrylate are used in combination. As a result, the present invention has been completed.
Hereinafter, the present invention will be described in detail.
In the present specification, acrylate or methacrylate is represented as (meth) acrylate.
本発明は、ウレタン(メタ)アクリレート及び/又はエポキシ(メタ)アクリレート(A)〔以下(A)成分という〕、並びに後記式(1)及び/又は式(2)で表される(メタ)アクリレート(B)〔以下(B)成分という〕を含有する活性エネルギー線硬化型光学材料用組成物に関するものである。
以下、それぞれの成分について説明する。
The present invention relates to urethane (meth) acrylate and / or epoxy (meth) acrylate (A) [hereinafter referred to as component (A)], and (meth) acrylate represented by the following formula (1) and / or formula (2). The present invention relates to an active energy ray-curable optical material composition containing (B) [hereinafter referred to as component (B)].
Hereinafter, each component will be described.
1.(A)成分
本発明では、(A)成分としてウレタン(メタ)アクリレート〔以下(A−1)成分という〕及び/又はエポキシ(メタ)アクリレート〔以下(A−2)成分という〕を使用する。
(A−1)成分としては、種々のウレタン(メタ)アクリレートが使用でき、例えば、有機ジイソシアネート〔以下(a)成分という〕、ジオール化合物〔以下(b)成分という〕及び1分子中に1個の水酸基を有する(メタ)アクリレート〔以下(c)成分という〕を反応させることにより得られたもの等を挙げることができる。
1. (A) Component In the present invention, urethane (meth) acrylate (hereinafter referred to as (A-1) component) and / or epoxy (meth) acrylate (hereinafter referred to as (A-2) component) is used as component (A).
As the component (A-1), various urethane (meth) acrylates can be used. For example, an organic diisocyanate [hereinafter referred to as component (a)], a diol compound (hereinafter referred to as component (b)) and one in one molecule. And the like obtained by reacting (meth) acrylate having a hydroxyl group (hereinafter referred to as component (c)).
(a)成分としては、種々の有機ジイソシアネート化合物が使用でき、具体例としては、例えばトリレンジイソシアネート、イソホロンジイソシアネート、キシリレンジイソシアネート、4,4′−ジフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネート及びトリメチルヘキサメチレンジイソシアネート等を挙げることができる。
これらの中でも、屈折率の観点からはトリレンジイソシアネート、シキシレンジイソシアネート等の芳香族有機ジイソシアネート等が好ましく、長期にわたる使用で部材が黄変しにくいという点からイソホロンジイソシアネートがより好ましい。
As the component (a), various organic diisocyanate compounds can be used. Specific examples include tolylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and the like. Can be mentioned.
Among these, from the viewpoint of refractive index, aromatic organic diisocyanates such as tolylene diisocyanate and sixylene diisocyanate are preferable, and isophorone diisocyanate is more preferable from the viewpoint that the member is hardly yellowed after long-term use.
(b)成分としては、水酸基を2個有する化合物であれば種々の化合物が使用でき、その代表的なものとしては、例えばエチレングリコール、プロピレングリコール、3−メチル−1,5−ペンタンジオール、1,3−ブチレングリコール、ネオペンチルグリコール、1,4−ブタンジオール、1,6−ヘキサンジオール、シクロヘキサンジメチロール、トリシクロデカンジメチロール、2−ブチル−2−エチル−プロパンジオール、ビスフェノールAポリエトキシグリコール、ビスフェノールAポリプロポキシグリコール及びポリテトラメチレングリコール等のジオール;ジオールと2塩基酸又はその無水物(例えば、無水コハク酸、アジピン酸、アゼライン酸、イソフタル酸、テレフタル酸及び無水フタル酸等)の反応物であるポリエステルジオール;ジオールとε−カプロラクトンとの反応物;ポリエステルジオールとε−カプロラクトンとの反応物であるポリカプロラクトンジオール;並びにポリカーボネートジオール(C4)等を挙げることができる。 As the component (b), various compounds can be used as long as they are compounds having two hydroxyl groups. Typical examples thereof include ethylene glycol, propylene glycol, 3-methyl-1,5-pentanediol, , 3-butylene glycol, neopentyl glycol, 1,4-butanediol, 1,6-hexanediol, cyclohexane dimethylol, tricyclodecane dimethylol, 2-butyl-2-ethyl-propanediol, bisphenol A polyethoxy glycol Diols such as bisphenol A polypropoxyglycol and polytetramethylene glycol; reaction of diol with dibasic acid or its anhydride (eg succinic anhydride, adipic acid, azelaic acid, isophthalic acid, terephthalic acid, phthalic anhydride, etc.) Polyes Rujioru; reaction product of the diol and ε- caprolactone; polycaprolactone diol is the reaction product of a polyester diol and ε- caprolactone; and polycarbonate diol (C4), and the like.
(c)成分としては、水酸基を有する(メタ)アクリレートであれば種々の化合物が使用でき、具体例としては、例えば2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、ポリエチレングリコールモノ(メタ)アクリレート(重合度:平均値としてn=2〜10)、ポリプロピレングリコールモノ(メタ)アクリレート(重合度:平均値としてn=2〜10)及びペンタエリスリトールトリ(メタ)アクリレート等を挙げることができる。
これらの中でも、2−ヒドロキシエチルアクリレート及び2−ヒドロキシプロピルアクリレート等のヒドロキシ(炭素数2〜4)アルキルアクリレートが好ましい。
As the component (c), various compounds can be used as long as they are (meth) acrylates having a hydroxyl group. Specific examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4- Hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) acrylate (degree of polymerization: n = 2 to 10 as an average value), polypropylene glycol mono (meth) acrylate (degree of polymerization: n = 2 to 10 as an average value) and penta Examples include erythritol tri (meth) acrylate.
Among these, hydroxy (2 to 4 carbon atoms) alkyl acrylates such as 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate are preferable.
(A−1)成分の製造方法は、常法に従えば良く、例えば、前記(a)成分と(b)成分とをウレタン化反応させ、次いでこの反応物に(c)成分を反応させればよい。
(a)成分と(b)成分の使用割合は、(b)成分の水酸基1当量に対して(a)成分のイソシアネート基の1.1〜2.0当量が好ましく、より好ましくは1.5〜2.0当量である。
このウレタン化反応の反応温度は、通常常温〜100℃、好ましくは40〜85℃である。
このウレタン化反応で得られた末端イソシアネート基を有する化合物(以下ウレタン化反応物という)と(c)成分の反応においては、ウレタン化反応物のイソシアネート基の1当量に対して(c)成分の水酸基の0.9〜1.5当量を反応させるのが好ましく、特に好ましくは1.0〜1.2当量である。この反応には、反応中のラジカル重合によるゲル化を防ぐ為に反応混合物を通常50〜2000ppmのハイドロキノン、ハイドロキノンモノメチルエーテル、p−メトキシフェノール、p−ベンゾキノン等の重合禁止剤を添加しておくことが好ましい。又、このアクリレート化反応の反応温度は、通常常温〜100℃、好ましくは50〜85℃である。
これらイソシアネート基と水酸基との反応は無触媒で進行するが、例えば、トリエチルアミン及びジブチル錫ジラウレート等の慣用の触媒を使用することが好ましい。
(A-1) The manufacturing method of a component should just follow a conventional method, for example, the said (a) component and (b) component can be urethanated, and then (c) component can be made to react with this reaction material. That's fine.
The proportion of component (a) and component (b) used is preferably 1.1 to 2.0 equivalents of the isocyanate group of component (a), more preferably 1.5 to 1 equivalent of hydroxyl group of component (b). -2.0 equivalents.
The reaction temperature for this urethanization reaction is usually from room temperature to 100 ° C, preferably from 40 to 85 ° C.
In the reaction of the compound having a terminal isocyanate group obtained by this urethanation reaction (hereinafter referred to as urethanization reaction product) and the component (c), the component (c) is added to 1 equivalent of the isocyanate group of the urethanization reaction product. It is preferable to react 0.9 to 1.5 equivalents of the hydroxyl group, and particularly preferably 1.0 to 1.2 equivalents. In this reaction, a polymerization inhibitor such as hydroquinone, hydroquinone monomethyl ether, p-methoxyphenol, p-benzoquinone or the like is usually added to the reaction mixture in order to prevent gelation due to radical polymerization during the reaction. Is preferred. The reaction temperature for the acrylated reaction is usually from room temperature to 100 ° C, preferably from 50 to 85 ° C.
Although the reaction between these isocyanate groups and hydroxyl groups proceeds without a catalyst, it is preferable to use a conventional catalyst such as triethylamine and dibutyltin dilaurate.
(A−2)成分の具体例としては、例えば、エポキシ樹脂(例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノール・ノボラック型エポキシ樹脂、クレゾール・ノボラック型エポキシ樹脂等)と(メタ)アクリル酸の反応物であるエポキシ(メタ)アクリレート等を挙げることができる。好ましいものとしては、例えば、ビスフェノールA型エポキシアクリレート等を挙げることができる。 Specific examples of the component (A-2) include, for example, epoxy resins (for example, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol / novolak type epoxy resins, cresol / novolak type epoxy resins) and (meth). An epoxy (meth) acrylate which is a reaction product of acrylic acid can be used. Preferable examples include bisphenol A type epoxy acrylate.
2.(B)成分
本発明では、(B)成分として下記式(1)及び/又は式(2)で表される化合物を使用する。
2. (B) component In this invention, the compound represented by following formula (1) and / or Formula (2) is used as (B) component.
〔式(1)及び式(2)において、R1及びR2は、いずれも水素原子又はメチル基を表す。〕 In [Equation (1) and (2), R 1 and R 2 are both a hydrogen atom or a methyl group. ]
式(1)で表される(メタ)アクリレートの具体例としては、R1が水素原子である、o−フェニルフェニルアクリレート、R1がメチル基であるo−フェニルフェニルメタクリレートを挙げることができる。
式(2)で表される(メタ)アクリレートの具体例としては、R2が水素原子である、p−クミルフェニルアクリレート、R2がメチル基である、p−クミルフェニルメタクリレートを挙げることができる。
Specific examples of the (meth) acrylate represented by the formula (1) include o-phenylphenyl acrylate in which R 1 is a hydrogen atom, and o-phenylphenyl methacrylate in which R 1 is a methyl group.
Specific examples of the (meth) acrylate represented by the formula (2) include p-cumylphenyl acrylate in which R 2 is a hydrogen atom, and p-cumylphenyl methacrylate in which R 2 is a methyl group. Can do.
尚、本発明の(B)成分と異なる、フェニル基を1個有する(メタ)アクリレートや、アルキレンオキサイド基を有する化合物は、組成物の硬化物が高屈折率を有するものとならない。 In addition, the (meth) acrylate which has one phenyl group different from the (B) component of this invention, and the compound which has an alkylene oxide group do not become what the hardened | cured material of a composition has a high refractive index.
3.その他の成分
本発明では、本発明の組成物の、樹脂基材に対する密着性を向上させたり、組成物の粘度を低減したり、接着力を向上させる目的で、(B)成分以外の不飽和結合含有化合物〔以下(C)という〕を使用しても良い。
(C)成分の具体例としては、例えばフェノキシエチル(メタ)アクリレート、フェニルオキシエチルオキシエチル(メタ)アクリレート、フェニルポリ(重合度:平均値としてn=2〜4)エトキシアクリレート、o−フェニルフェニルオキシエチル(メタ)アクリレート、o−フェニルフェニルオキシエチルオキシエチル(メタ)アクリレート、o−フェニルフェニルポリ(重合度:平均値としてn=2〜4)エトキシアクリレート、トリブロモフェニルオキシエチル(メタ)アクリレート、トリブロモベンジル(メタ)アクリレート、ビスフェノールAポリ(重合度:平均値としてn=2〜15)エトキシジ(メタ)アクリレート、1,6−ヘキサンジオールジアクリレート、ポリエチレングリコールジ(メタ)アクリレート、ノナンジオールジ(メタ)アクリレート、N−ビニルカプロラクタム、アクリロイルモルホリン及びトリメチロールプロパンポリエトキシトリ(メタ)アクリレート等を挙げることができる。
3. Other components In the present invention, in order to improve the adhesion of the composition of the present invention to the resin substrate, to reduce the viscosity of the composition, or to improve the adhesive strength, the unsaturated components other than the component (B) A bond-containing compound [hereinafter referred to as (C)] may be used.
Specific examples of the component (C) include, for example, phenoxyethyl (meth) acrylate, phenyloxyethyloxyethyl (meth) acrylate, phenyl poly (degree of polymerization: n = 2 to 4 as an average value) ethoxy acrylate, o-phenylphenyl Oxyethyl (meth) acrylate, o-phenylphenyloxyethyloxyethyl (meth) acrylate, o-phenylphenyl poly (degree of polymerization: n = 2 to 4 as an average value) ethoxy acrylate, tribromophenyloxyethyl (meth) acrylate , Tribromobenzyl (meth) acrylate, bisphenol A poly (degree of polymerization: n = 2 to 15 as an average value) ethoxydi (meth) acrylate, 1,6-hexanediol diacrylate, polyethylene glycol di (meth) acrylate, nonane Oruji (meth) acrylate, N- vinyl caprolactam, acryloyl morpholine and trimethylolpropane polyethoxy tri (meth) acrylate.
これらのうち好ましいものとしては、例えばフェノキシエチルアクリレート、フェニルポリ(重合度:平均値としてn=2〜4)エトキシアクリレート、o−フェニルフェニルオキシエチルアクリレート、o−フェニルフェニルポリ(重合度:平均値としてn=2〜4)エトキシアクリレート、トリブロモフェニルオキシエチルアクリレート、ビスフェノールAポリ(重合度:平均値としてn=4〜10)エトキシジアクリレート等の屈折率の高いアクリレートモノマー等を挙げることができる。 Among these, preferred are, for example, phenoxyethyl acrylate, phenyl poly (degree of polymerization: n = 2 to 4 as an average value) ethoxy acrylate, o-phenylphenyloxyethyl acrylate, o-phenylphenyl poly (degree of polymerization: average value) N = 2 to 4) ethoxy acrylate, tribromophenyloxyethyl acrylate, bisphenol A poly (degree of polymerization: n = 4 to 10 as an average value) ethoxydiacrylate and the like acrylate monomers having a high refractive index, and the like. .
本発明の組成物は、活性エネルギー線の照射により硬化するものであるが、この場合の活性エネルギー線としては、電子線、可視光線及び紫外線等が挙げられる。これらの中でも、特別な装置を必要とせず、簡便であるため、可視光線又は紫外線が好ましい。
可視光線又は紫外線硬化型組成物とする場合、組成物に光重合開始剤を配合する。尚、電子線硬化型組成物とする場合は、光重合開始剤を必ずしも配合する必要はない。
光重合開始剤〔以下(D)成分という〕の具体例としては、ベンゾイン、ベンゾインメチルエーテル及びベンゾインプロピルエーテル等のベンゾイン;アセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシ−2−フェニルアセトフェノン、1,1−ジクロロアセトフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノ−プロパン−1−オン及びN,N−ジメチルアミノアセトフェノン等のアセトフェノン;2−メチルアントラキノン、1−クロロアントラキノン及び2−アミルアントラキノン等のアントラキノン;2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2−クロロチオキサントン及び2,4−ジイソプロピルチオキサントン等のチオキサントン;アセトフェノンジメチルケタール及びベンジルジメチルケタール等のケタール;ベンゾフェノン、メチルベンゾフェノン、4,4’−ジクロロベンゾフェノン、4,4’−ビスジエチルアミノベンゾフェノン、ミヒラーズケトン及び4−ベンゾイル−4’−メチルジフェニルサルファイド等のベンゾフェノン;並びに2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド等が挙げられる。
(D)成分は、単独で使用しても、2種以上を併用しても良い。
The composition of the present invention is cured by irradiation with active energy rays, and examples of the active energy rays in this case include electron beams, visible rays, and ultraviolet rays. Among these, visible light or ultraviolet light is preferable because it does not require a special device and is simple.
When a visible light or ultraviolet curable composition is used, a photopolymerization initiator is added to the composition. In addition, when setting it as an electron beam curable composition, it is not necessary to mix | blend a photoinitiator.
Specific examples of the photopolymerization initiator [hereinafter referred to as component (D)] include benzoin such as benzoin, benzoin methyl ether and benzoin propyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy- 2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one and N, N-dimethylamino Acetophenones such as acetophenone; anthraquinones such as 2-methylanthraquinone, 1-chloroanthraquinone and 2-amylanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-di Thioxanthones such as sopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, methylbenzophenone, 4,4′-dichlorobenzophenone, 4,4′-bisdiethylaminobenzophenone, Michler's ketone, and 4-benzoyl-4′-methyl Benzophenones such as diphenyl sulfide; and 2,4,6-trimethylbenzoyl diphenylphosphine oxide.
(D) A component may be used independently or may use 2 or more types together.
(D)成分には、必要に応じて光増感剤を併用することができる。光増感剤としては、N,N−ジメチルアミノ安息香酸エチルエステル、N,N−ジメチルアミノ安息香酸イソアミルエステル、トリエチルアミン及びトリエタノールアミン等が挙げられる。 (D) A photosensitizer can be used together with a component as needed. Examples of the photosensitizer include N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, triethylamine, and triethanolamine.
本発明の組成物は、さらに硬化を進行させる目的で、組成物に熱重合開始剤を配合し、活性エネルギー線照射後に加熱させることもできる。
熱重合開始剤としては、種々の化合物を使用することができ、有機過酸化物及びアゾ系開始剤が好ましい。
有機過酸化物の具体例としては、1,1−ビス(t−ブチルパーオキシ)2−メチルシクロヘキサン、1,1−ビス(t−ヘキシルパーオキシ)−3,3,5−トリメチルシクロヘキサン、1,1−ビス(t−ヘキシルパーオキシ)シクロヘキサン、1,1−ビス(t−ブチルパーオキシ)−3,3,5−トリメチルシクロヘキサン、1,1−ビス(t−ブチルパーオキシ)シクロヘキサン、2,2−ビス(4,4−ジ−ブチルパーオキシシクロヘキシル)プロパン、1,1−ビス(t−ブチルパーオキシ)シクロドデカン、t−ヘキシルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシマレイン酸、t−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート、t−ブチルパーオキシラウレート、2,5−ジメチル−2,5−ジ(m−トルオイルパーオキシ)ヘキサン、t−ブチルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシ2−エチルヘキシルモノカーボネート、t−ヘキシルパーオキシベンゾエート、2,5−ジーメチル−2,5−ジ(ベンゾイルパーオキシ)ヘキサン、t−ブチルパーオキシアセテート、2,2−ビス(t−ブチルパーオキシ)ブタン、t−ブチルパーオキシベンゾエート、n−ブチル−4,4−ビス(t−ブチルパーオキシ)バレレート、ジ−t−ブチルパーオキシイソフタレート、α、α‘−ビス(t−ブチルパーオキシ)ジイソプロピルベンゼン、ジクミルパーオキサイド、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン、t−ブチルクミルパーオキサイド、ジ−t−ブチルパーオキサイド、p−メンタンハイドロパーオキサイド、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキシン−3、ジイソプロピルベンゼンハイドロパーオキサイド、t−ブチルトリメチルシリルパーオキサイド、1,1,3,3−テトラメチルブチルハイドロパーオキサイド、クメンハイドロパーオキサイド、t−ヘキシルハイドロパーオキサイド及びt−ブチルハイドロパーオキサイド等が挙げられる。
The composition of the present invention can be heated after irradiation with active energy rays by blending the composition with a thermal polymerization initiator for the purpose of further curing.
Various compounds can be used as the thermal polymerization initiator, and organic peroxides and azo initiators are preferred.
Specific examples of the organic peroxide include 1,1-bis (t-butylperoxy) 2-methylcyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, , 1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, , 2-bis (4,4-di-butylperoxycyclohexyl) propane, 1,1-bis (t-butylperoxy) cyclododecane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxymaleic acid, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl- , 5-di (m-toluoylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5 -Di (benzoylperoxy) hexane, t-butylperoxyacetate, 2,2-bis (t-butylperoxy) butane, t-butylperoxybenzoate, n-butyl-4,4-bis (t-butyl) Peroxy) valerate, di-t-butylperoxyisophthalate, α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t- Butylperoxy) hexane, t-butylcumyl peroxide, di-t-butylperoxide P-menthane hydroperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3, diisopropylbenzene hydroperoxide, t-butyltrimethylsilyl peroxide, 1,1,3 Examples include 3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-hexyl hydroperoxide, and t-butyl hydroperoxide.
アゾ系化合物の具体例としては、1,1’−アゾビス(シクロヘキサン−1−カルボニトリル)、2−(カルバモイルアゾ)イソブチロニトリル、2−フェニルアゾ−4−メトキシ−2,4−ジメチルバレロニトリル、アゾジ−t−オクタン及びアゾジ−t−ブタン等が挙げられる。
これらは単独で用いても良いし、2種以上を併用しても良い。又、有機過酸化物は還元剤と組み合わせることによりレドックス反応とすることも可能である。
Specific examples of the azo compound include 1,1′-azobis (cyclohexane-1-carbonitrile), 2- (carbamoylazo) isobutyronitrile, 2-phenylazo-4-methoxy-2,4-dimethylvaleronitrile. Azodi-t-octane and azodi-t-butane.
These may be used alone or in combination of two or more. Moreover, an organic peroxide can also be made into a redox reaction by combining with a reducing agent.
本発明の組成物には、前記成分以外にも、さらに所望により、光安定剤(例えば、ヒンダードアミン系化合物等)、可塑剤、離型剤、消泡剤、レベリング剤、酸化防止剤、重合禁止剤、帯電防止剤及び非反応性ポリマー(例えば、ポリエステルエラストマー、ポリウレタンエラストマー及びポリ(メタ)アクリレートポリマー等)等を配合することができる。 In addition to the above components, the composition of the present invention may further contain a light stabilizer (for example, a hindered amine compound), a plasticizer, a mold release agent, an antifoaming agent, a leveling agent, an antioxidant, and a polymerization inhibitor, as desired. An agent, an antistatic agent, a non-reactive polymer (for example, polyester elastomer, polyurethane elastomer, poly (meth) acrylate polymer, etc.), and the like can be blended.
4.活性エネルギー線硬化型光学材料用組成物
本発明は、前記(A)成分と(B)成分を必須とするものである。
(A)成分と(B)成分の割合としては、(A)及び(B)成分の合計量を基準として、(A)成分が10〜70質量部で(B)成分が30〜90質量部が好ましく、より好ましくは(A)成分が20〜60質量部及び(B)成分が40〜80質量部である。
(A)成分が10質量部に満たないと、十分な接着性能が得られないものとなってしまうことがあり、一方、70質量部を超えると、硬化物の屈折率が不十分になったり、粘度が高くなりすぎ作業性が低下してしまうことがある。
(C)成分を使用する場合の割合としては、(A)及び(B)成分の合計量に対して5〜60質量部が好ましく、より好ましくは10〜50質量部である。
(D)成分を使用する場合の割合としては、(A)及び(B)成分の合計量又は(A)〜(C)成分の合計量を100質量部に対して、0.1〜15質量部が好ましく、より好ましくは0.5〜10質量部である。
4). Active energy ray-curable optical material composition The present invention essentially comprises the component (A) and the component (B).
As a ratio of (A) component and (B) component, (A) component is 10-70 mass parts and (B) component is 30-90 mass parts on the basis of the total amount of (A) and (B) component. More preferably, (A) component is 20-60 mass parts and (B) component is 40-80 mass parts.
If the component (A) is less than 10 parts by mass, sufficient adhesion performance may not be obtained. On the other hand, if it exceeds 70 parts by mass, the refractive index of the cured product may be insufficient. In some cases, the viscosity becomes too high and workability may be reduced.
(C) As a ratio in the case of using a component, 5-60 mass parts is preferable with respect to the total amount of (A) and (B) component, More preferably, it is 10-50 mass parts.
(D) As a ratio in the case of using a component, 0.1-15 mass with respect to 100 mass parts for the total amount of (A) and (B) component or the total amount of (A)-(C) component. Part is preferable, and more preferably 0.5 to 10 parts by mass.
本発明の組成物は、前記(A)及び(B)成分、必要に応じてその他の成分を、常法に従い、攪拌・混合して製造することができる。 The composition of the present invention can be produced by stirring and mixing the above-mentioned components (A) and (B) and other components as necessary according to a conventional method.
本発明の組成物の使用方法としては、常法に従い、組成物に活性エネルギー線を照射し硬化させれば良い。
活性エネルギー線としては、電子線、可視光線及び紫外線等が挙げられる。これらの中でも、特別な装置を必要とせず、簡便であるため、可視光線又は紫外線が好ましい。紫外線照射装置としては、高圧水銀灯等が挙げられる。
活性エネルギー線の照射量及び照射時間等は、使用する組成物及び用途に応じて、適宜設定すれば良い。
As a method of using the composition of the present invention, the composition may be cured by irradiating the composition with active energy rays.
Examples of the active energy ray include an electron beam, visible light, and ultraviolet light. Among these, visible light or ultraviolet light is preferable because it does not require a special device and is simple. Examples of the ultraviolet irradiation device include a high-pressure mercury lamp.
What is necessary is just to set suitably the irradiation amount of an active energy ray, irradiation time, etc. according to the composition to be used and a use.
本発明の組成物は、その硬化物の25℃における屈折率が1.55以上を有するものが好ましく、好ましくは1.58以上である。 The composition of the present invention preferably has a cured product having a refractive index at 25 ° C. of 1.55 or more, preferably 1.58 or more.
本発明の組成物の硬化物は、高屈折率かつ透明性を有するため、フレネルレンズ、レンチキュラーレンズ及びプリズムシート等のレンズシート、並びにプラスチックレンズ等の種々の光学材料に使用できる。
レンズシートとしては、更に詳細には、ビデオプロビェクター、プロジェクションテレビ及び液晶ディスプレイ等用途が挙げられる。
Since the cured product of the composition of the present invention has a high refractive index and transparency, it can be used for various optical materials such as lens sheets such as Fresnel lenses, lenticular lenses and prism sheets, and plastic lenses.
More specifically, examples of the lens sheet include uses such as a video projector, a projection television, and a liquid crystal display.
本発明の組成物を使用してレンズシートを製造する例について説明する。
比較的膜厚の薄いレンズシートを製造する場合は、本発明の組成物を、目的のレンズの形状を有するスタンパーと称される金型に塗布し、該組成物の層を設け、その層の上に透明基板を接着させる。
次いで、透明基板側から活性エネルギー線を照射して、組成物を硬化させ、この後、金型から剥離させる。
The example which manufactures a lens sheet using the composition of this invention is demonstrated.
When producing a relatively thin lens sheet, the composition of the present invention is applied to a mold called a stamper having the shape of the target lens, and a layer of the composition is provided. A transparent substrate is bonded on top.
Next, active energy rays are irradiated from the transparent substrate side to cure the composition, and then peel from the mold.
一方、比較的膜厚の厚いレンズシートを製造する場合は、目的のレンズの形状を有する金型と透明基板の間に、本発明の組成物を流し込む。
次いで、透明基板側から活性エネルギー線を照射して、組成物を硬化させ、この後、金型から脱型させる。
On the other hand, when producing a lens sheet having a relatively thick film thickness, the composition of the present invention is poured between a mold having a target lens shape and a transparent substrate.
Next, active energy rays are irradiated from the transparent substrate side to cure the composition, and thereafter, the mold is removed from the mold.
前記透明基板としては、樹脂基板が好ましく、具体例としては、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、(メタ)アクリル樹脂、又はこれらの混合樹脂等のシ−ト状のものが使用できる。これらの中でも、(メタ)アクリル樹脂が好ましい。
前記金型としては、その材質は特に限定されないが、例えば真鍮及びニッケル等の金属、並びにエポキシ樹脂等の樹脂が挙げられる。金型の寿命が長い点で、金属製であることが好ましい。
As the transparent substrate, a resin substrate is preferable. As a specific example, a sheet-like substrate such as a polycarbonate resin, a polystyrene resin, a polyester resin, a (meth) acrylic resin, or a mixed resin thereof can be used. Among these, (meth) acrylic resins are preferable.
The material of the mold is not particularly limited, and examples thereof include metals such as brass and nickel, and resins such as epoxy resins. It is preferable that the mold is made of metal in view of the long life of the mold.
本発明の組成物は、特に光学材料の接着剤として好ましく使用することができる。
この場合の使用方法としては、貼り合せる基材のうちの片方に組成物を塗布し、もう一方の基材でラミネートし、活性エネルギー線を照射する方法等が挙げられる。
このときの基材としては、例えば、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、(メタ)アクリル樹脂、又はこれらの混合樹脂を貼りあわせや、これらの樹脂基材とレンズシートとの張り合わせ等が挙げられる。これらの中でも、(メタ)アクリル樹脂の接着に好ましく使用できる。
Especially the composition of this invention can be preferably used as an adhesive agent of an optical material.
As a usage method in this case, there is a method of applying the composition to one of the substrates to be bonded, laminating with the other substrate, and irradiating with active energy rays.
As a base material at this time, for example, a polycarbonate resin, a polystyrene resin, a polyester resin, a (meth) acrylic resin, or a mixed resin thereof are bonded together, or the resin base material and a lens sheet are bonded together. . Among these, it can be preferably used for adhesion of (meth) acrylic resin.
本発明の組成物は、低粘度で取り扱いが容易であるうえ、その硬化物が高屈折率を有しており、レンズシート等の光学材料の製造に好適である。さらに、本発明の組成物は、各種プラスチック基材との密着性及び接着強度等の接着性に優れることから、これら光学材料の貼り合わせのための接着剤として好適に使用できる。 The composition of the present invention is low in viscosity and easy to handle, and its cured product has a high refractive index, which is suitable for the production of optical materials such as lens sheets. Furthermore, since the composition of this invention is excellent in adhesiveness, such as adhesiveness with various plastic base materials, and adhesive strength, it can be used conveniently as an adhesive agent for bonding of these optical materials.
本発明の組成物は、(A)及び(B)成分を必須とするものである。
組成物としては、さらに(C)成分を含むものが好ましく、さらに(D)成分を含むものが好ましい。
組成物の硬化物としては、25℃における屈折率が1.55以上を有するものが好ましい。
組成物の用途としては、光学材料用の接着剤が好ましい。
The composition of the present invention essentially comprises the components (A) and (B).
As a composition, what further contains (C) component is preferable, and what further contains (D) component is preferable.
As a hardened | cured material of a composition, what has a refractive index in 25 degreeC of 1.55 or more is preferable.
As an application of the composition, an adhesive for optical materials is preferable.
以下、本発明を実施例及び比較例により具体的に説明する。尚、以下において「部」とあるのは、特に断りのない限り全て「質量部」を示す。 Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. In the following description, “part” means “part by mass” unless otherwise specified.
〇合成例1.〔(A)成分の製造〕
あらかじめ酸素/窒素混合気体を吹き込んでおいた3Lのフラスコに、イソホロンジイソシアネート(以下IPDIという)533部を仕込み、室温にてさらに1時間酸素/窒素混合気体をバブリングした後に、ジブチル錫ジラウレート(以下DBTLという)2部、ジt−ブチルヒドロキシトルエン0.6部を仕込み、浴温を60℃に昇温開始した後に、滴下漏斗を用いて、ポリテトラメチレングリコール〔重量平均分子量1,000;保土ヶ谷化学(株)製PTG−1000〕1234部を1時間かけてフラスコ中に滴下した。
次に、2−ヒドロキシエチルアクリレート(以下HEAという)278部を1時間かけてフラスコ内に滴下し、滴下終了後、浴温を80℃に昇温し、さらに3時間反応を行い、IRにてイソシアネートに基づくピークが検出されなくなったため反応を終了した。得られたウレタンアクリレートを(A−1−1)という。
(A−1−1)の屈折率(25℃)は1.483、粘度(25℃)は123,500mPa・sであった。
O Synthesis example 1. [Production of component (A)]
After charging 533 parts of isophorone diisocyanate (hereinafter referred to as IPDI) into a 3 L flask previously blown with an oxygen / nitrogen mixed gas and bubbling the oxygen / nitrogen mixed gas at room temperature for an additional hour, dibutyltin dilaurate (hereinafter referred to as DBTL). 2 parts) and 0.6 part of di-t-butylhydroxytoluene were charged, and the temperature of the bath was started at 60 ° C. Then, using a dropping funnel, polytetramethylene glycol [weight average molecular weight 1,000; Hodogaya Chemical 1234 parts of PTG-1000 manufactured by Ltd. was dropped into the flask over 1 hour.
Next, 278 parts of 2-hydroxyethyl acrylate (hereinafter referred to as HEA) was dropped into the flask over 1 hour. After completion of the dropwise addition, the bath temperature was raised to 80 ° C., and the reaction was further continued for 3 hours. The reaction was terminated because no peaks based on isocyanate were detected. The obtained urethane acrylate is referred to as (A-1-1).
(A-1-1) had a refractive index (25 ° C.) of 1.383 and a viscosity (25 ° C.) of 123,500 mPa · s.
〇合成例2.〔(A)成分の製造〕
合成例1において、IPDI377部、DBTL1部及びジt−ブチルヒドロキシトルエン0.3部を使用し、PTG−1000に代えプラクセル205〔ダイセル化学工業(株)製カプロラクトンジオール;平均分子量530〕444部を使用した以外は、合成例1と同様の方法でウレタン化反応を行った。
次に、HEA198部を使用し、浴温を80℃昇温した後、さらに2時間反応する以外は、合成例1と同様の方法で反応を行った。
得られたウレタンアクリレートを(A−1−2)という。
(A−1−2)の屈折率(25℃)は1.494、粘度(25℃)は64,500mPa・sであった。
O Synthesis example 2 [Production of component (A)]
In Synthesis Example 1, 377 parts of IPDI, 1 part of DBTL, and 0.3 part of di-t-butylhydroxytoluene were used, and instead of PTG-1000, 444 parts of Plaxel 205 (caprolactone diol manufactured by Daicel Chemical Industries, Ltd .; average molecular weight 530) A urethanization reaction was performed in the same manner as in Synthesis Example 1 except that it was used.
Next, 198 parts of HEA was used, and after raising the bath temperature to 80 ° C., the reaction was performed in the same manner as in Synthesis Example 1 except that the reaction was further continued for 2 hours.
The obtained urethane acrylate is referred to as (A-1-2).
(A-1-2) had a refractive index (25 ° C.) of 1.494 and a viscosity (25 ° C.) of 64,500 mPa · s.
〇合成例3.〔(A)成分の製造〕
合成例1において、2Lのフラスコを使用し、IPDI70部、DBTL0.8部、ジt−ブチルヒドロキシトルエン0.3部を使用し、PTG−1000に代えハイプレックスHX−2050〔東邦理化(株)製1,6−ヘキサンジオールとo−フタル酸との繰り返しからなるジオール;平均分子量2,000〕500部を使用した以外は、合成例1と同様の方法で反応を行った。
次に、希釈剤としてフェノキシエチルアクリレート250部とHEA18部との混合物を使用し、浴温を80℃昇温した後、さらに2時間反応する以外は、合成例1と同様の方法で反応を行った。
得られたウレタンアクリレートを(A−1−3)という。
(A−1−3)の屈折率(25℃)は1.490、粘度(25℃)は143,300mPa・sであった。
O Synthesis example 3. [Production of component (A)]
In Synthesis Example 1, a 2 L flask was used, IPDI 70 parts, DBTL 0.8 parts, di-t-butylhydroxytoluene 0.3 parts were used, and instead of PTG-1000, Hiplex HX-2050 [Toho Rika Co., Ltd. The reaction was carried out in the same manner as in Synthesis Example 1 except that 500 parts of a diol consisting of repetition of 1,6-hexanediol and o-phthalic acid produced; average molecular weight of 2,000] was used.
Next, the reaction was carried out in the same manner as in Synthesis Example 1 except that a mixture of 250 parts of phenoxyethyl acrylate and 18 parts of HEA was used as a diluent, the bath temperature was raised to 80 ° C., and the reaction was further continued for 2 hours. It was.
The obtained urethane acrylate is referred to as (A-1-3).
(A-1-3) had a refractive index (25 ° C.) of 1.490 and a viscosity (25 ° C.) of 143,300 mPa · s.
○実施例1〜10及び比較例1〜2
表1に示す各成分を、常法に従い攪拌・混合し、あらかじめ80℃に保った乾燥機中で、固体状の光重合開始剤を15分かけて加熱溶解させ、紫外線硬化型組成物を調製した。
得られた組成物について、以下の評価を行った。
○ Examples 1 to 10 and Comparative Examples 1 and 2
Each component shown in Table 1 is stirred and mixed according to a conventional method, and a solid photopolymerization initiator is heated and dissolved over 15 minutes in a drier previously maintained at 80 ° C. to prepare an ultraviolet curable composition. did.
The following evaluation was performed about the obtained composition.
(1)粘度
作業性を評価するため、得られた組成物について粘度を測定した。東機産業(株)製RE80型粘度計(E型)を用いて25℃で粘度測定を行った。
(1) Viscosity In order to evaluate workability, the viscosity of the obtained composition was measured. The viscosity was measured at 25 ° C. using a RE80 type viscometer (E type) manufactured by Toki Sangyo Co., Ltd.
(2)屈折率
得られた組成物を、バーコーターを用いて、室温で長さ15cm×幅7cm×厚さ1mmのPMMA板に膜厚50μmで塗布した。これを、コンベアスピード10m/分、ランプ高さ10cm、出力80W/cmの高圧水銀ランプにて、2パス紫外線照射を行い硬化させた。
屈折率、密着性を評価した。
得られた硬化物の屈折率(25℃)を、(株)アタゴ製アッベ屈折計DR−M2により測定した。
(2) Refractive Index The obtained composition was applied to a PMMA plate having a length of 15 cm, a width of 7 cm, and a thickness of 1 mm at a film thickness of 50 μm at room temperature using a bar coater. This was cured by two-pass ultraviolet irradiation with a high-pressure mercury lamp having a conveyor speed of 10 m / min, a lamp height of 10 cm, and an output of 80 W / cm.
Refractive index and adhesion were evaluated.
The refractive index (25 ° C.) of the obtained cured product was measured with an Abbe refractometer DR-M2 manufactured by Atago Co., Ltd.
(3)密着性
屈折率の評価と同様の方法で得られた硬化物について、碁盤目剥離試験により樹脂基材との密着性を評価した。表2中における〇、△、×は、以下の意味を示す。
○:残った桝目の数が90〜100
△:残った桝目の数が60〜80
×:残った桝目の数が0〜59
(3) Adhesiveness About the hardened | cured material obtained by the method similar to evaluation of refractive index, the adhesiveness with the resin base material was evaluated by the cross-cut peel test. In Table 2, O, Δ, and X have the following meanings.
○: The number of remaining squares is 90-100
Δ: Number of remaining squares is 60-80
X: The number of remaining squares is 0 to 59
(4)接着性
得られた組成物を、厚さ50μmのPETフィルムをスペーサーとして用い、室温で長さ15cm×幅7cm×厚さ1mmのPMMA板に塗布し、さらにこの上に易接着PETフィルムをかぶせてラミネートすることにより膜厚50μmの樹脂層を得た。これを、コンベアスピード10m/分、ランプ高さ10cm、出力80W/cmの高圧水銀ランプにて、PMMA板側から2パス紫外線照射を行い硬化させた。
得られた硬化物を、易接着PETフィルム側から樹脂層を幅25mmで切り取り、引っ張り試験機にサンプルを取り付け、引張り速度300mm/minにて180度剥離で評価を行った。
(4) Adhesiveness The obtained composition was applied to a PMMA plate having a length of 15 cm, a width of 7 cm, and a thickness of 1 mm at room temperature using a PET film having a thickness of 50 μm as a spacer. A resin layer having a thickness of 50 μm was obtained by laminating the film. This was cured by two-pass ultraviolet irradiation from the PMMA plate side with a high-pressure mercury lamp having a conveyor speed of 10 m / min, a lamp height of 10 cm, and an output of 80 W / cm.
The obtained cured product was cut off from the easy-adhesive PET film side with a width of 25 mm, the sample was attached to a tensile tester, and evaluation was performed by 180-degree peeling at a pulling speed of 300 mm / min.
尚、表1における略号は、以下の意味を示す。
・A−1−1:合成例1で製造したウレタンアクリレート
・A−1−2:合成例2で製造したウレタンアクリレート
・A−1−3:合成例3で製造したウレタンアクリレート
・SP−1509:ビスフェノールAのエポキシアクリレート、昭和高分子(株)製SP−1509
・p−CPA:p−クミルフェニルアクリレート
・o−PPA:o−フェニルフェニルアクリレート
・M−110:p−クミルフェノールエチレンオキサイド1モル変性モノアクリレート、東亞合成(株)製アロニックスM−110
・POA:フェノキシエチルアクリレート
・ACMO:アクリロイルモルホリン
・M−210:ビスフェノールAエチレンオキサイド4モル変性ジアクリレート、東亞合成(株)製アロニックスM−210
・Irg184:1−ヒドロキシシクロヘキシルフェニルケトン、チバ・スペシャルティ・ケミカルズ製イルガキュア184
In addition, the symbol in Table 1 shows the following meanings.
A-1-1: Urethane acrylate produced in Synthesis Example 1 A-1-2: Urethane acrylate produced in Synthesis Example 2 A-1-3: Urethane acrylate produced in Synthesis Example 3 SP-1509: Epoxy acrylate of bisphenol A, SP-1509 manufactured by Showa Polymer Co., Ltd.
P-CPA: p-cumylphenyl acrylate o-PPA: o-phenylphenyl acrylate M-110: p-cumylphenol ethylene oxide 1 mol-modified monoacrylate, Aronix M-110 manufactured by Toagosei Co., Ltd.
POA: phenoxyethyl acrylate ACMO: acryloylmorpholine M-210: bisphenol A ethylene oxide 4 mol modified diacrylate, Aronix M-210 manufactured by Toagosei Co., Ltd.
Irg184: 1-hydroxycyclohexyl phenyl ketone, Ciba Specialty Chemicals Irgacure 184
表2の評価結果から明らかなように、本発明の組成物は、低粘度であり作業性が良好であった。又、その硬化物は、屈折率が1.55以上であるためレンズシート等の光学材料に好適に使用できる。又、密着性や接着力も良好であるため、光学材料の接着にも好適に使用できるものであった。
一方、(B)成分を含有しない組成物では、作業性、密着性及び接着力は優れるものの、高屈折率の硬化物を得ることができなかったり(比較例1)、比較的良好な密着性を有する場合でも、作業性、屈折率及び接着力に劣るものしか得られなかった(比較例2)。又、(A)成分を含有しない組成物では、作業性、屈折率は良好であるが、十分な密着性及び接着力を有するものではなかった(比較例3)。
As is clear from the evaluation results in Table 2, the composition of the present invention had low viscosity and good workability. Moreover, since the cured product has a refractive index of 1.55 or more, it can be suitably used for an optical material such as a lens sheet. In addition, since it has good adhesion and adhesive strength, it can be suitably used for bonding optical materials.
On the other hand, the composition containing no component (B) is excellent in workability, adhesion and adhesive strength, but cannot obtain a cured product having a high refractive index (Comparative Example 1) or relatively good adhesion. Even if it has, only the thing inferior to workability | operativity, refractive index, and adhesive force was obtained (comparative example 2). The composition containing no component (A) has good workability and refractive index, but did not have sufficient adhesion and adhesive strength (Comparative Example 3).
本発明の組成物は、ビデオプロジェクター、プロジェクションテレビ及び液晶ディスプレイ等に使用するフレネルレンズ及びレンチキュラーレンズ等のレンズシートの製造に使用でき、並びにこれら光学材料の接着で使用される接着剤等として好適に使用することができる。
The composition of the present invention can be used for the production of lens sheets such as Fresnel lenses and lenticular lenses used in video projectors, projection televisions, liquid crystal displays and the like, and is suitably used as an adhesive used in bonding these optical materials. Can be used.
Claims (5)
The adhesive for optical materials which consists of a composition in any one of Claims 1-4.
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