JP2005215754A - Method for manufacturing sheet with ic tag and device for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attach a plurality of IC chips to a base sheet body constituted of package materials or the like while positioning them at predetermined intervals. <P>SOLUTION: A base material sheet body 10 having a base sheet 11 is prepared, and the base sheet body 10 is inserted between a forme cylinder 30 and an impression cylinder 31. An IC chip 20 is supplied from an IC chip supply nozzle 37 to a surface 40a of a preliminary absorption roll 40. The IC chip 20 supplied to the surface 40a of the preliminary absorption roll 40 is attracted by an attraction hole 41, and conveyed to the forme cylinder 30 side, and received by a recess 31. In this case, the IC chip 20 delivered to the forme cylinder 30 side is smoothly sucked in the recess 31 held to a negative pressure by an attraction source 35 and an attraction tube 36. The IC chip 20 in the recess 31 is transferred to the base sheet body 10 side by pressurizing the base sheet body 10 between the forme cylinder 30 and the impression cylinder 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a sheet with a non-contact IC tag and a manufacturing apparatus thereof that can exchange data with an external reader / writer in a non-contact manner.

  Conventionally, a non-contact IC tag that exchanges data with an external reader / writer in a non-contact manner has an IC chip. Such a non-contact IC tag is used for products such as packaging materials (base sheet bodies). A large number of sheets are continuously attached, and thus a sheet with a non-contact IC tag is obtained.

  As described above, a large number of non-contact IC tags having IC chips are continuously attached to a packaging material or the like. In this case, the IC chip of the non-contact IC tag is required to be attached to a base sheet body such as a packaging material at a predetermined interval while being accurately arranged.

  The present invention has been made in consideration of the above points, and can attach a large number of IC chips to a base sheet body such as a packaging material while positioning them easily and accurately, which enables high quality. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus for a sheet with an IC tag, which can easily manufacture a sheet with an IC tag.

  The present invention includes a step of preparing a base sheet body having at least a base sheet, a step of feeding an IC chip to the surface of the main suction roll having a recess formed on the surface, and a step of filling the IC chip into the recess, A step of inserting the base sheet body between the main suction roll and the impression cylinder arranged to face the main suction roll, and transferring the IC chip filled in the recess of the main suction roll to the base sheet body And a method of manufacturing a sheet with an IC tag.

  This invention is a manufacturing method of the sheet | seat with an IC tag characterized by a base material sheet body having an antenna circuit provided on the base material sheet.

  The present invention is a process of supplying an IC chip to the surface of a pre-adsorption roll having an adsorption hole formed on the surface, adsorbing the IC chip to the adsorption hole of the pre-adsorption roll, and then sending the IC chip to the surface of the main adsorption roll Is further provided. The manufacturing method of the sheet | seat with an IC tag characterized by the above-mentioned.

  The present invention includes a rotatable main suction roll formed with a recess, an impression cylinder that is disposed opposite the main suction roll and presses a base sheet body having at least a base sheet between the main suction roll, A pre-adsorption roll provided in the vicinity of the main adsorption roll; an IC chip supply means for supplying an IC chip to the surface of the pre-adsorption roll; A main suction mechanism that makes the inside of the concave portion negative pressure, and the IC chip is supplied while being sucked into the suction hole of the preliminary suction roll, and the IC chip sucked into the suction hole of the preliminary suction roll is supplied to the concave portion of the main suction roll. The IC tag-attached sheet manufacturing apparatus is characterized in that the IC chip is transferred while adsorbed inside, and then the IC chip is transferred to the base sheet body.

  In the present invention, the main suction mechanism of the main suction roll is driven and controlled by the main control unit, and the main control unit rotates the main suction roll while the recess reaches the impression cylinder from the vicinity of the preliminary suction roll. And the main suction mechanism is controlled so that the concave portion is opened to the atmosphere while the concave portion reaches the preliminary suction roll from the impression cylinder. .

  In the present invention, the pre-adsorption mechanism of the pre-adsorption roll is driven and controlled by the pre-control unit. The pre-control unit rotates the pre-adsorption roll while the adsorption hole reaches the main adsorption roll from the vicinity of the IC chip supply means. A device for producing a sheet with an IC tag, characterized in that a negative suction is applied to the hole and the pre-suction mechanism is controlled so that the suction hole is opened to the atmosphere while the suction hole reaches the IC chip supply means from the main suction roll. .

  According to the present invention, a large number of IC chips can be affixed to a base sheet made of a packaging material or the like while accurately positioning at a predetermined interval. For this reason, a high quality sheet with an IC tag can be easily manufactured.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 6 are views showing an embodiment of a manufacturing method and a manufacturing apparatus for a sheet with an IC tag according to the present invention.

  First, the IC-tagged sheet will be described with reference to FIG. The IC tag-attached sheet 1 has a base material sheet body 10 composed of a base material sheet 11 such as a packaging material, an antenna circuit 14 provided on the surface of the base material sheet 11, and a printed pattern 5. An IC chip 20 is provided on the sheet body 10.

  Among these, the IC chip 20 and the antenna circuit 14 constitute an IC tag.

  The IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces thereof, and is connected to the antenna circuit 14 on the base sheet body 10 through conductive bumps or anisotropic conductive adhesive material.

  The IC chip 20 is accurately transferred to a predetermined position of the base sheet 11 as described later, and is securely connected to the antenna circuit 14 provided in advance on the surface of the base sheet 11.

  Next, an apparatus for manufacturing a sheet with an IC tag will be described with reference to FIG. This IC tag-attached sheet manufacturing apparatus has a plate cylinder (main suction roll) 30 in which a plurality of recesses 31 are formed at a predetermined interval on a surface 30 a and is rotatably arranged, and is opposed to the plate cylinder 30. An impression cylinder 32 that pressurizes the substrate sheet body 10 between the plate cylinder 30 and a pressure-bonding fixing that crimps the substrate sheet body 10 and the IC chip 20 that come out between the plate cylinder 30 and the impression cylinder 32. A portion 33 and a crimping movable portion 34 are provided.

  A pre-adsorption roll 40 having a plurality of adsorbing holes 41 formed on the surface 40a at a predetermined interval is rotatably disposed above the plate cylinder 30 so that the circumference between the adsorbing holes 41 of the pre-adsorption roll 40 can be rotated. The directional distance coincides with the circumferential distance of the concave portion 31 of the plate cylinder 30. An IC chip supply nozzle (IC chip supply means) 37 is provided above the preliminary suction roll 40, and the IC chip supply nozzle 37 is filled with a large number of IC chips 20.

  As shown in FIG. 1, an IC chip receiver 37 b is provided on the side of the preliminary suction roll 40. Of the IC chips 20 supplied from the preliminary IC chip supply nozzle 37 to the preliminary suction roll 40, The IC chip 20 that is not attracted by the suction holes 41 falls and is stored in the IC chip receiver 37b. The IC chip 20 in the IC chip receiver 37b is returned to the IC chip supply nozzle 37 via the IC chip supply line 37a.

  Next, the recess 31 of the plate cylinder 30 will be described in detail with reference to FIG. The concave portion 31 of the plate cylinder 30 is disposed so as to be lowered from the surface 30a of the plate cylinder 30, and the IC chip storage portion 31a in which the IC chip 20 is stored, and from the surface 30a of the plate cylinder 30 toward the IC chip storage portion 31a. And a flat inclined portion 31b extending.

  The recess 31 has a flat sector shape, and the IC chip storage portion 31a is located at the base end of the sector shape. The IC chip storage portion 31a of the recess 31 is located behind the recess 31 in the rotation direction of the plate cylinder 30. The sector shape of the recess 31 is generally left and right with respect to the axis L perpendicular to the plate cylinder 30. It has become.

  Here, FIG. 3A is a cross-sectional view schematically showing the recess 31 of the plate cylinder 30, and FIG. 3B is a plan view thereof.

  The IC chip 20 disposed in the IC chip storage portion 31a of the recess 31 is orthogonal to the axis L, but the direction of the IC chip 20 in the IC chip storage portion 31a is set to the axis L as shown in FIG. Alternatively, it may be inclined by 45 °.

  Further, as shown in FIG. 6, the shape of the recess 31 in the IC chip storage portion 31a may be rectangular.

  As shown in FIG. 1, the plate cylinder (main suction roll) 30 has a main suction mechanism capable of setting a negative pressure in the recess 31. This main suction mechanism has a suction source 35 provided inside the plate cylinder 30 and a suction line 36 that connects the IC chip storage portion 31 a of each recess 31 and the suction source 35. In this case, an air communication layer 39 is formed on the bottom surface of the recess 31 of the plate cylinder 30, and the IC chip storage portion 31 a of the recess 31 is connected to the suction line 36 via the air communication layer 39.

  The plate cylinder 30 includes a region A in which the recess 31 reaches the impression cylinder 32 from the vicinity of the preliminary suction roll 40 toward the rotation direction of the plate cylinder 30, and a region B in which the recess 31 reaches the vicinity of the preliminary suction roll 40 from the impression cylinder 32. have.

  Each adsorption line 36 is provided with a control valve (not shown), and the control valve and the adsorption source 35 are controlled by a main control unit 38. In this case, the main control unit 38 opens the control valve of the suction line 36 corresponding to the recess 31 in the region A in the plate cylinder 30 and closes the control valve of the suction line 36 corresponding to the recess 31 in the region B. . In this way, the concave portion 31 in the region A of the plate cylinder 30 is kept at a negative pressure, and the concave portion 31 in the region B is opened to the atmosphere.

  Further, as shown in FIG. 1, the preliminary suction roll 40 has a preliminary suction mechanism capable of setting the suction hole 41 to a negative pressure. This preliminary suction mechanism has a suction source 45 provided in the preliminary suction roll 40, and a suction line 46 connecting each suction hole 41 and the suction source 45.

  In this case, the preliminary suction roll 40 includes an area C in which the suction holes 41 reach the vicinity of the plate cylinder 30 from the vicinity of the IC chip supply nozzle 37 in the rotation direction of the preliminary suction roll 40, and the suction holes 41 from the vicinity of the plate cylinder 30. And a region C reaching the chip supply nozzle 37.

Each adsorption line 46 is provided with a control valve (not shown), and the control valve and the adsorption source 45 are controlled by a preliminary control unit 38a. In this case, the preliminary control unit 38a opens the control valve of the suction line 46 corresponding to the suction hole 41 in the region C of the preliminary suction roll 40, and opens the control valve of the suction line 46 corresponding to the suction hole 41 in the region D. Closed. In this way, the suction hole 41 in the region C of the preliminary suction roll is kept at a negative pressure, and the suction hole 41 in the region D is opened to the atmosphere.

  Next, the manufacturing method of a sheet | seat with an IC tag is demonstrated.

  First, the printed pattern 5 is formed on the surface of the base material sheet 11 such as a packaging material (FIG. 4A), and then the antenna circuit 14 is formed on the surface of the base material sheet 11 (FIG. 4B). )). In this way, the base sheet body 10 is produced. The base sheet body 10 is fed out from the sheet body supply unit 1 a, inserted between the plate cylinder (main suction roll) 30 and the impression cylinder 32, and pressurized between the plate cylinder 30 and the impression cylinder 32. The

  During this time, a large number of IC chips 20 are supplied from the IC chip supply nozzle 37 to the surface 40 a of the preliminary suction roll 40.

  The IC chip 20 supplied to the surface 40 a of the pre-adsorption roll 40 is adsorbed in the adsorption holes 41 provided on the surface 40 a of the pre-adsorption roll 40 and is sent to the plate cylinder 30 side as the pre-adsorption roll 40 rotates. . In this case, the suction hole 41 on the surface 40 a of the preliminary suction roll 40 communicates with the suction source 45 via the suction line 46, and the suction hole 41 in the region C of the preliminary suction roll 40 is constantly set to a negative pressure by the suction source 45. Therefore, the IC chip 20 can be reliably sent to the plate cylinder 30 by the preliminary suction roll 40.

  When the suction hole 41 of the preliminary suction roll 40 reaches the plate cylinder 30, the suction hole 41 is opened to the atmosphere, and the IC chip 20 sucked by the suction hole 41 is smoothly transferred into the respective recesses 31 of the plate cylinder 30. . Thus, each IC chip 20 can be reliably filled into the recess 31 of the plate cylinder 30 while the IC chip 20 is adsorbed by the adsorption holes 41 of the preliminary adsorption roll 40.

  After filling in the respective recesses 31 of the plate cylinder 30 in this way, the IC chip 20 in the recess 31 is transferred to the substrate sheet body 10 side pressed between the plate cylinder 30 and the impression cylinder 32. (See FIG. 4 (c)).

  Next, the filling action of the IC chip 20 in the recess 31 of the plate cylinder 30 will be described. The IC chip 20 sucked by the suction holes 41 of the preliminary suction roll 40 is delivered to the concave portion 31 side of the plate cylinder 30. That is, as shown in FIGS. 3A and 3B, the IC chip 20 is guided from the surface 30a of the plate cylinder 30 along the inclined portion 31b of the recess 31 as the plate cylinder 30 and the preliminary suction roll 40 rotate. Then, it is guided to the IC chip storage part 31a.

  At this time, the recess 31 has a flat sector shape, and the IC chip storage portion 31 a is located at the base end of the sector shape, and is located behind the recess 31 in the rotation direction of the plate cylinder 30. Therefore, the IC chip 20 on the surface 30a of the plate cylinder 30 can be smoothly guided to the IC chip storage part 31a through the inclined part 31b, and the IC chip 20 can be stored in the IC chip storage part 31a with high accuracy. .

  Further, the IC chip storage portion 31a of the recess 31 communicates with the suction source 35 via the suction line 36, and the recess 31 in the area A of the plate cylinder 30 is always kept at a negative pressure by the suction source 35. The IC chip 20 supplied from the supply nozzle 37 a to the surface 30 a of the plate cylinder 30 can be reliably drawn into the IC chip storage portion 31 a of the recess 31. Further, the IC chip 20 accommodated in the IC chip accommodating portion 31a can be securely held up to the impression cylinder 32.

  In addition, since a plurality of IC chip storage portions 31a of the recesses 31 provided on the surface 30a of the plate cylinder 30 are formed at a predetermined interval, the IC chips 20 are accurately spaced at a predetermined interval toward the base sheet 10 side. Transfer can be performed while positioning well.

  The IC chip 20 transferred to the base sheet body 10 side is then crimped and heated by the crimping fixing part 33 and the crimping movable part 34. Thereby, the IC chip 20 is firmly bonded to the antenna circuit 14 by the bumps or the anisotropic conductive adhesive film 18.

  Since the IC chip 20 has electrodes 21 and 21 on the top and bottom surfaces, an additional antenna circuit 14a can be provided on the IC chip 20 by printing, transferring, or pasting (FIG. 4D). And FIG. 8).

  In this way, the IC tag-attached sheet 1 constituted by the base sheet 10 composed of the base sheet 11, the antenna circuit 14, and the printed pattern 5 and the IC chip 20 is obtained. The IC-tagged sheet 1 obtained in this way is designed to exchange data without contact with an external reader / writer.

  The IC tag-attached sheet 1 is then sent to a non-illustrated post-bonding main press-bonding section, where it is finally press-bonded, and the IC chip 20 is securely bonded to the base sheet 11 of the IC tag-attached sheet 1. The

  As described above, according to the present embodiment, it is possible to transfer a large number of IC chips 20 to the base sheet body 10 having the base sheet 11 while accurately positioning the chip chips 20 at a predetermined interval, and the quality is high. A sheet with an IC tag can be easily manufactured.

  Next, a modification of the present invention will be described with reference to FIGS.

  As shown in FIGS. 7A and 7B, when the base sheet body 10 includes the base sheet 11 and the pattern 5 and does not include the antenna circuit 14, it is necessary to connect the IC chip 20 to the antenna circuit 14. Absent. In this case, the IC chip 20 has an antenna function instead of the antenna circuit. At this time, as shown in FIGS. 7 (a) and 7 (b), the base sheet body 10 includes a base sheet 11 and a pattern 5 (FIG. 7 (a)). The IC chip 20 is transferred from the recess 31 of the plate cylinder 30 and mounted.

  Further, as shown in FIG. 8, after the electrode 21 on the bottom surface of the IC chip 20 and the antenna circuit 14 of the base sheet 10 are connected, an additional antenna circuit 14a is provided on the IC chip 20 by printing or transferring. The antenna circuit 14 a may be connected to the upper surface bump 21 of the IC chip 20. In this case, the electrodes 21 and 21 of the IC chip 20 are bonded to the antenna circuit 14 and the additional antenna circuit 14a via the anisotropic conductive adhesive materials 18 and 18, respectively.

Schematic which shows the manufacturing method and manufacturing apparatus of a sheet | seat with an IC tag by this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in a base material sheet body. The figure which shows the recessed part of a printing cylinder. The figure which shows the state which transfers and mounts an IC chip on a base material sheet body. The perspective view which shows the recessed part of a printing cylinder. The perspective view which shows the recessed part of a printing cylinder. The figure which shows the state which transcribe | transfers and mounts an IC chip on the base material sheet | seat body which shows the modification of this invention. The figure which shows the sheet | seat with an IC tag which provides an IC chip in the base material sheet | seat body which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet with IC tag 10 Base sheet body 11 Base sheet 14 Antenna circuit 14a Additional antenna circuit 18 Anisotropic conductive adhesive film 20 IC chip 21 Electrode 30 Plate cylinder 31 Recess 32 Impression cylinder 35 Suction source 36 Suction line 37 IC chip Supply nozzle 37a IC chip supply line 37b IC chip receiver 38 Main control unit 38a Preliminary control unit 40 Preliminary adsorption roll 41 Adsorption hole 45 Adsorption source 46 Adsorption line

Claims (6)

Preparing a base sheet body having at least a base sheet;
A step of sending an IC chip to the surface of the main suction roll having a recess formed on the surface, and filling the IC chip into the recess;
A step of inserting the base sheet body between the main suction roll and the impression cylinder arranged to face the main suction roll, and transferring the IC chip filled in the recess of the main suction roll to the base sheet body A method for producing a sheet with an IC tag, comprising:   The method for producing a sheet with an IC tag according to claim 1, wherein the base sheet body has an antenna circuit provided on the base sheet.   The method further includes the step of supplying the IC chip to the surface of the pre-adsorption roll having the adsorption hole formed on the surface, and adsorbing the IC chip to the adsorption hole of the pre-adsorption roll, and then sending the IC chip to the surface of the main adsorption roll. The manufacturing method of the sheet | seat with an IC tag of Claim 1 characterized by the above-mentioned. A rotatable main suction roll having a recess,
An impression cylinder that is disposed opposite to the main adsorption roll and presses the base sheet body having at least the base sheet between the main adsorption roll,
A preliminary adsorption roll provided in the vicinity of the main adsorption roll;
IC chip supply means for supplying an IC chip to the surface of the preliminary suction roll;
A pre-adsorption mechanism in which the suction hole of the pre-adsorption roll has a negative pressure;
A main suction mechanism that creates a negative pressure in the recess of the main suction roll,
The IC chip is supplied while being adsorbed in the adsorption hole of the preliminary adsorption roll, and the IC chip adsorbed in the adsorption hole of the preliminary adsorption roll is delivered while adsorbing in the recess of the main adsorption roll. An apparatus for producing a sheet with an IC tag, wherein   The main suction mechanism of the main suction roll is driven and controlled by the main control unit. The main control unit rotates the main suction roll and the concave portion reaches the impression cylinder from the vicinity of the preliminary suction roll. The apparatus for producing a sheet with an IC tag according to claim 4, wherein the main suction mechanism is controlled so that the concave portion is opened to the atmosphere while reaching the preliminary suction roll from the impression cylinder.   The pre-adsorption mechanism of the pre-adsorption roll is driven and controlled by the pre-control unit. The pre-control unit rotates the pre-adsorption roll so that the adsorbing hole is negatively pressurized while the adsorbing hole reaches the main adsorption roll from the vicinity of the IC chip supply means. 5. The apparatus for producing a sheet with an IC tag according to claim 4, wherein the pre-suction mechanism is controlled so that the suction hole is opened to the atmosphere while the suction hole reaches the IC chip supply means from the main suction roll.

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