JP2005125195A - Discharge device, coating method, color filter substrate manufacturing method, electroluminescence display device manufacturing method, plasma display device manufacturing method, and wiring manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a discharge device suitable for coating a region, which is cyclically arranged in a color filter substrate, a matrix type display device or the like, with a liquid material and hard to cause coating irregularity, a discharge method and a manufacturing method. <P>SOLUTION: The first and second heads of the discharge device are two heads arbitrarily adjacent to each other in a Y-axis direction among (N) heads in the discharge device. The position of a discharge nozzle row most positioned on the side of the second head in the first head is shifted in an X-axis direction by almost 1/N times the nozzle pitch in the X-axis direction of the head with respect to the position of the discharge nozzle row most positioned on the side of the first head in the second head. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a discharge device that discharges a liquid material, a discharge method, and a coating method using the discharge device, and more specifically, a region that is periodically arranged in a color filter substrate, a matrix display device, or the like. The present invention relates to a discharge device, a discharge method, and a manufacturing method that are suitable for applying a liquid material.

It is known to apply a material to a pixelated region using an ink jet device. For example, it is known to form filter elements of a color filter substrate by using an ink jet device or light emitting portions arranged in a matrix in a matrix display device (for example, Patent Document 1).
JP 2003-127343 A

  In many cases, the pitch of the plurality of discharged portions to which the material is to be applied does not match the nozzle pitch of the ink jet apparatus. The discharged portion is, for example, a portion where a filter element is to be provided.

  For this reason, in the conventional ink jet apparatus, the ink jet head in the direction in which the two ejected parts are arranged so that the distance between the two ejected parts and the distance between the two ejecting nozzles coincide with each other. (Or the direction in which the discharge nozzles are arranged) is inclined. However, in such a configuration, when the distance between the two ejection target parts is different for each color filter, it takes time to change the mounting angle of the inkjet head for each color filter. In order to change the mounting angle of the head, it takes time to newly manufacture a carriage according to the angle of the head and time to mount the head to the new carriage.

  Further, when a liquid material is ejected as droplets to the ejected portion using the ink jet device, the landed droplet material spreads and spreads to every corner of the ejected portion. A uniform layer of material is required. In order to spread and spread a liquid material in every corner of the discharged portion, the volume of each discharged droplet is decreased to increase the number of droplets discharged to one discharged portion, What is necessary is just to make the droplet of material land on the various parts of a to-be-discharged part.

  On the other hand, as the display screen is increased in size, the size of the discharged portion corresponding to the pixel region and the wiring portion is increased. When a plurality of droplets having a minute volume are landed on such a discharged portion, the material already applied in the discharged portion is partially applied before the required number of droplets are landed on one discharged portion. May begin to dry. In such a case, since a droplet that subsequently lands contacts the dried material, a boundary is formed between the dried portion and the liquid portion. As a result, the layer of material is less likely to be uniform. Furthermore, since the degree and tendency of non-uniformity (coating unevenness) in the layer of such materials are different among the portions to be ejected, this can be display unevenness appearing over the entire screen during display.

  The present invention has been made in view of the above problems, and one of its purposes is to provide a discharge device that can easily form a uniform material layer.

  The discharge device of the present invention includes a stage and N heads that are movable relative to the stage in the Y-axis direction and are adjacent to the Y-axis direction. Each of the N heads has a plurality of discharge nozzle arrays extending in the X axis direction orthogonal to the Y axis direction and adjacent to the Y axis direction, and the X heads of the N heads as a whole. The N heads are arranged so that the nozzle pitch in the direction becomes the first length, and the first head and the second head are the Y-axis direction of the N heads. And the position of the ejection nozzle row located closest to the second head in the first head is located closest to the first head in the second head. The first nozzle is displaced in the X-axis direction with respect to the position of the discharge nozzle row. The N is a natural number of 2 or more.

  According to the above feature, a discharge device capable of uniformly applying a liquid material to the discharge target portion is obtained. Two landing positions adjacent to each other in the X-axis direction at a distance of the nozzle pitch in the X-axis direction of the discharge nozzles of the N heads (that is, the nozzle pitch in the X-axis direction of the entire N heads) This is because droplets can be landed at short time intervals.

  Preferably, the plurality of ejection nozzle rows are arranged in each of the N heads such that the nozzle pitch in the X-axis direction of each of the N heads is a second length, The length of 1 is approximately 1 / N times the second length.

  According to the above feature, the nozzle pitch (first length) in the X-axis direction of the entire N heads (that is, the head group) is approximately 1 of the nozzle pitch (second length) in the X-axis direction of the head. / N times. For this reason, the nozzle line density in the X-axis direction of the ejection device can be made higher than the nozzle line density of the head alone.

  In an aspect of the present invention, the plurality of discharge nozzle rows are composed of a first discharge nozzle row and a second discharge nozzle row.

  According to the above feature, the number of nozzles in one head can be increased.

  Preferably, in each of the first discharge nozzle row and the second discharge nozzle row, a plurality of the discharge nozzles are arranged in the X-axis direction at a pitch approximately twice the second length, The X coordinate of the first nozzle of the first discharge nozzle row and the X coordinate of the first nozzle of the second discharge nozzle row are substantially shifted by the second length.

  According to the above feature, the nozzle pitch in the X-axis direction of one head can be reduced. For this reason, the nozzle line density in the X-axis direction of the head can be increased.

  The method for applying a liquid material according to the present invention is an ejection apparatus including N heads adjacent to each other in the Y-axis direction, and extends in the X-axis direction perpendicular to the Y-axis direction and is adjacent to the Y-axis direction. Each of the N heads has a plurality of ejection nozzle arrays, and the N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads is the first length. This is a method for applying a liquid material using a discharge device. Further, in this liquid material coating method, the step (A) of placing the substrate having the portion to be ejected on the stage, and the position of the ejection nozzle row located closest to the second head in the first head are determined. The N heads are shifted in the X-axis direction by the first length with respect to the position of the discharge nozzle row located closest to the first head in the second head. The step (B) of moving the substrate relative to the base in the Y-axis direction, wherein the first head and the second head are any of the N heads adjacent to each other in the Y-axis direction. When the discharge nozzles included in the plurality of discharge nozzle rows enter the region corresponding to the discharge target portion by two steps (B) and (B), the discharge nozzles A liquid material is applied to the discharged parts. Comprising a step (C) to leave, the. The N is a natural number of 2 or more.

  According to the above feature, the liquid material can be uniformly applied to the discharged portion. Two landing positions adjacent to each other in the X-axis direction at a distance of the nozzle pitch in the X-axis direction of the discharge nozzles of the N heads (that is, the nozzle pitch in the X-axis direction of the entire N heads) This is because droplets can be landed at short time intervals.

[Example 1]

Below, the discharge apparatus of this example, the discharge method, and the coating method using the discharge apparatus will be described in the order described below.
A. Overall configuration of discharge device Carriage, C.I. Head / D. Head group Control unit F. Example of discharge method

(A. Overall configuration of discharge device)
As shown in FIG. 1, the discharge device 100 includes a tank 101 that holds a liquid material 111, a tube 110, and a discharge scanning unit 102 that is supplied with the liquid material 111 from the tank 101 via the tube 110. Prepare. The discharge scanning unit 102 includes a carriage 103 that holds a plurality of heads 114 (FIG. 2), a first position control device 104 that controls the position of the carriage 103, a stage 106 that holds a base 10 </ b> A described later, and a stage 106. A second position control device 108 for controlling the position and a control unit 112 are provided. The tank 101 and the plurality of heads 114 in the carriage 103 are connected by a tube 110, and a liquid material 111 is supplied from the tank 101 to each of the plurality of heads 114 by compressed air.

  The first position control device 104 moves the carriage 103 along the X-axis direction and the Z-axis direction orthogonal to the X-axis direction in response to a signal from the control unit 112. Further, the first position control device 104 also has a function of rotating the carriage 103 around an axis parallel to the Z axis. In this embodiment, the Z-axis direction is a direction parallel to the vertical direction (that is, the direction of gravitational acceleration). The second position control device 108 moves the stage 106 along the Y-axis direction orthogonal to both the X-axis direction and the Z-axis direction in accordance with a signal from the control unit 112. Further, the second position control device 108 also has a function of rotating the stage 106 around an axis parallel to the Z axis. In the present specification, the first position control device 104 and the second position control device 108 may be referred to as “scanning units”.

  The stage 106 has a plane parallel to both the X-axis direction and the Y-axis direction. Further, the stage 106 is configured so that a substrate having a discharge target portion to which a predetermined material is to be applied can be fixed or held on the plane. In the present specification, a substrate having a portion to be ejected may be referred to as a “receiving substrate”.

  In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction coincide with the direction in which one of the carriage 103 and the stage 106 moves relative to the other. The virtual origin of the XYZ coordinate system that defines the X-axis direction, the Y-axis direction, and the Z-axis direction is fixed to the reference portion of the ejection device 100. In this specification, the X coordinate, the Y coordinate, and the Z coordinate are coordinates in such an XYZ coordinate system. Note that the above virtual origin may be fixed not only to the reference portion but also to the stage 106 or to the carriage 103.

  As described above, the carriage 103 is moved in the X-axis direction by the first position control device 104. On the other hand, the stage 106 is moved in the Y-axis direction by the second position control means 108. That is, the relative position of the head 114 with respect to the stage 106 is changed by the first position control device 104 and the second position control device 108. More specifically, by these operations, the carriage 103, the head group 114G (FIG. 2), the head 114, or the nozzle 118 (FIG. 3) moves with respect to the discharge target portion positioned on the stage 106 with respect to the Z axis. While maintaining a predetermined distance in the direction, the X-axis direction and the Y-axis direction move relatively, that is, relatively scan. Here, the carriage 103 may move in the Y-axis direction with respect to the stationary discharged portion. Then, the material 111 may be discharged from the nozzle 118 to the stationary discharge target portion within a period in which the carriage 103 moves between two predetermined points along the Y-axis direction. “Relative movement” or “relative scanning” includes moving at least one of the side on which the liquid material 111 is discharged and the side on which the discharged material is landed (on the discharged portion side) with respect to the other. .

  Furthermore, the relative movement of the carriage 103, the head group 114G (FIG. 2), the head 114, or the nozzle 118 (FIG. 3) means that their relative positions with respect to the stage 106, the substrate, or the discharge target portion change. For this reason, in this specification, even when the carriage 103, the head group 114G, the head 114, or the nozzle 118 is stationary with respect to the ejection device 100 and only the stage 106 moves, the carriage 103, the head group 114G. The head 114 or the nozzle 118 is expressed as relative movement with respect to the stage 106, the substrate, or the discharge target portion. In addition, a combination of relative scanning or relative movement and material ejection may be referred to as “application scanning”.

  The carriage 103 and the stage 106 further have a degree of freedom of translation and rotation other than those described above. However, in the present embodiment, descriptions relating to the degrees of freedom other than the above degrees of freedom are omitted for the purpose of simplifying the explanation.

  The control unit 112 is configured to receive ejection data representing a relative position at which the liquid material 111 is to be ejected from an external information processing apparatus. The detailed configuration and function of the control unit 112 will be described later.

(B. Carriage)
FIG. 2 is a view of the carriage 103 observed from the stage 106 side, and the direction perpendicular to the paper surface of FIG. 2 is the Z-axis direction. 2 is the X-axis direction, and the vertical direction is the Y-axis direction.

  As shown in FIG. 2, the carriage 103 holds a plurality of heads 114 each having substantially the same structure. In this embodiment, the number of heads 114 held by the carriage 103 is 24. Each head 114 has a bottom surface provided with a plurality of nozzles 118 described later. The shape of the bottom surface of each head 114 is a polygon having two long sides and two short sides. As shown in FIG. 2, the bottom surface of the head 114 held by the carriage 103 faces the stage 106, and the long side direction and the short side direction of the head 114 are the X-axis direction and the Y-axis direction, respectively. Parallel to Details of the relative positional relationship between the heads 114 will be described later.

  In this specification, the four heads 114 adjacent in the Y-axis direction may be referred to as “head group 114G”. According to this notation, the carriage 103 in FIG. 2 can be expressed as holding six head groups 114G.

(C. Head)
FIG. 3 shows the bottom surface of the head 114. The head 114 has a plurality of nozzles 118 arranged in the X-axis direction. The plurality of nozzles 118 are arranged such that the nozzle pitch HXP in the X-axis direction of the head 114 is about 70 μm. Here, the “nozzle pitch HXP in the X-axis direction of the head 114” is a pitch between a plurality of nozzle images obtained by projecting all the nozzles 118 in the head 114 on the X-axis along the Y-axis direction. Equivalent to. Further, the nozzle pitch HXP of this embodiment corresponds to the second length of the present invention.

  In this embodiment, the plurality of nozzles 118 in the head 114 form a nozzle row 116A and a nozzle row 116B that extend in the X-axis direction. The nozzle row 116A and the nozzle row 116B are adjacent to each other in the Y-axis direction. Further, the distance between the nozzle row 116A and the nozzle row 116B, that is, the distance in the Y-axis direction is DA. In FIG. 3, the Y coordinate of the nozzle row 116A is larger than the Y coordinate of the nozzle row 116B. In each of the nozzle row 116A and the nozzle row 116B, 90 nozzles 118 are aligned in the X-axis direction at regular intervals. In this embodiment, this regular interval is about 140 μm. That is, the nozzle pitch LNP of the nozzle row 116A and the nozzle pitch LNP of the nozzle row 116B are both about 140 μm.

  The position of the nozzle row 116B is shifted from the position of the nozzle row 116A in the positive direction in the X-axis direction (the right direction in FIG. 3) by half the nozzle pitch LNP (about 70 μm). Therefore, the nozzle pitch HXP in the X-axis direction of the head 114 is half the length (about 70 μm) of the nozzle pitch LNP of the nozzle row 116A (or nozzle row 116B).

  Therefore, the nozzle line density in the X-axis direction of the head 114 is twice the nozzle line density of the nozzle row 116A (or nozzle row 116B). In the present specification, “nozzle line density in the X-axis direction” means the number per unit length of a plurality of nozzle images obtained by projecting a plurality of nozzles on the X-axis along the Y-axis direction. It corresponds to.

  Of course, the number of nozzle rows included in the head 114 is not limited to two. The head 114 may include M nozzle rows. Here, M is a natural number of 1 or more. In this case, in each of the M nozzle rows, the plurality of nozzles 118 are arranged at a pitch that is M times the nozzle pitch HXP. Further, when M is a natural number of 2 or more, the other (M−1) nozzle rows are only i times as long as the nozzle pitch HXP with respect to one of the M nozzle rows. There is no overlap in the X-axis direction. Here, i is a natural number from 1 to (M−1).

  Now, since each of the nozzle row 116 </ b> A and the nozzle row 116 </ b> B includes 90 nozzles 118, one head 114 has 180 nozzles 118. However, 5 nozzles at both ends of the nozzle row 116A are set as “pause nozzles”. Similarly, 5 nozzles at both ends of the nozzle row 116B are also set as “pause nozzles”. The liquid material 111 is not discharged from these 20 “pause nozzles”. Therefore, of the 180 nozzles 118 in the head 114, 160 nozzles 118 function as nozzles that discharge the liquid material 111. In the present specification, these 160 nozzles 118 may be referred to as “ejection nozzles”.

  Note that the number of nozzles 118 in one head 114 is not limited to 180. One nozzle 114 may be provided with 360 nozzles. In this case, each of the nozzle arrays 116 </ b> A and 116 </ b> B only needs to include 180 nozzles 118. In the present invention, the number of discharge nozzles is not limited to 160. One head 114 may have P ejection nozzles. Here, P is a natural number equal to or greater than 2, and may be equal to or less than the total number of nozzles in the head 114.

  In the present specification, for the purpose of explaining the relative positional relationship between the heads 114, among the 90 nozzles 118 included in the nozzle row 116 </ b> A, the sixth nozzle 118 from the left is expressed as “reference nozzle 118 </ b> R” of the head 114. To do. That is, among the 80 discharge nozzles in the nozzle row 116A, the leftmost discharge nozzle is the “reference nozzle 118R” of the head 114. Note that the “reference nozzle 118R” may be specified in the same manner for all the heads 114, so the position of the “reference nozzle 118R” does not have to be the above position.

  Further, in the present specification, a portion including the discharge nozzles in the nozzle row 116A is referred to as “discharge nozzle row 116A ′”. Further, the nozzle 118 positioned at the head of the ejection nozzle row 116A 'may be referred to as “head nozzle 118RA”. In the case of FIG. 3, the nozzle 118 located on the leftmost side of the ejection nozzle row 116A ', that is, the sixth nozzle from the left of the nozzle row 116A is the leading nozzle 118RA. In this embodiment, the “reference nozzle 118R” and the “first nozzle 118RA” are the same nozzle.

  Similarly, in the present specification, a portion including the discharge nozzles in the nozzle row 116B is referred to as “discharge nozzle row 116B ′”. Further, the nozzle 118 positioned at the head of the ejection nozzle row 116B 'may be referred to as "head nozzle 118RB". In the case of FIG. 3, the nozzle 118 located on the leftmost side of the discharge nozzle row 116B ′, that is, the sixth nozzle from the left of the nozzle row 116B is the top nozzle 118RB.

  The positions of the head nozzles 118RA and 118RB may be different for each head 114. For example, as shown in FIG. 3B, in a certain head 114, the first nozzle 118RB of the discharge nozzle row 116B 'may be the nozzle 118 located fifth from the left of the nozzle row 116B. Note that the position of the leading nozzle 118RA in FIG. 3B is the same as the position of the leading nozzle 118RA in FIG. Further, the number of ejection nozzles included in the head 114 in FIG. 3B is the same as the number of ejection nozzles in the head 114 in FIG.

  As shown in FIGS. 4A and 4B, each head 114 is an inkjet head. More specifically, each head 114 includes a diaphragm 126 and a nozzle plate 128. Between the diaphragm 126 and the nozzle plate 128, a liquid pool 129 in which the liquid material 111 supplied from the tank 101 through the hole 131 is always filled is located.

  In addition, a plurality of partition walls 122 are located between the diaphragm 126 and the nozzle plate 128. A portion surrounded by the diaphragm 126, the nozzle plate 128, and the pair of partition walls 122 is a cavity 120. Since the cavities 120 are provided corresponding to the nozzles 118, the number of the cavities 120 and the number of the nozzles 118 are the same. The liquid material 111 is supplied from the liquid pool 129 to the cavity 120 via the supply port 130 positioned between the pair of partition walls 122.

  On the diaphragm 126, the vibrator 124 is positioned corresponding to each cavity 120. The vibrator 124 includes a piezoelectric element 124C and a pair of electrodes 124A and 124B that sandwich the piezoelectric element 124C. By applying a driving voltage between the pair of electrodes 124A and 124B, the liquid material 111 is discharged from the corresponding nozzle 118. The shape of the nozzle 118 is adjusted so that the liquid material 111 is discharged from the nozzle 118 in the Z-axis direction.

  Here, the “liquid material” in this specification refers to a material having a viscosity that can be discharged from a nozzle. In this case, it does not matter whether the material is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from the nozzle, and even if a solid substance is mixed, it may be a fluid as a whole.

  The control unit 112 (FIG. 1) may be configured to give a signal to each of the plurality of transducers 124 independently of each other. That is, the volume of the material 111 ejected from the nozzle 118 may be controlled for each nozzle 118 according to a signal from the control unit 112. In such a case, the volume of the material 111 discharged from each of the nozzles 118 may be variable between 0 pl to 42 pl (picoliter). Further, as will be described later, the control unit 112 can also set the nozzle 118 that performs the ejection operation during the application scan and the nozzle 118 that does not perform the ejection operation.

  In this specification, a portion including one nozzle 118, a cavity 120 corresponding to the nozzle 118, and a vibrator 124 corresponding to the cavity 120 may be referred to as “ejection unit 127”. According to this notation, one head 114 has the same number of ejection units 127 as the number of nozzles 118. The discharge unit 127 may include an electrothermal conversion element instead of the piezo element. That is, the discharge unit 127 may have a configuration for discharging a material by utilizing thermal expansion of the material by the electrothermal conversion element.

(D. Head group)
Next, the relative positional relationship of the four heads 114 in the head group 114G will be described. FIG. 5 shows two head groups 114G adjacent to each other in the carriage 103 of FIG.

  As shown in FIG. 5, each head group 114 </ b> G includes four heads 114. The four heads 114 are arranged in the head group 114 such that the nozzle pitch GXP in the X-axis direction of the head group 114G is approximately ¼ times the nozzle pitch HXP in the X-axis direction of the head 114. Yes.

  In the present embodiment, since the nozzle pitch HXP in the X-axis direction of the head 114 is about 70 μm, the nozzle pitch GXP in the X-axis direction of the head group 114G is about 17.5 μm, which is a quarter of that. Here, the “nozzle pitch GXP of the head group 114G in the X-axis direction” is the interval between a plurality of nozzle images obtained by projecting all the nozzles 118 in the head group 114G onto the X-axis along the Y-axis direction. It corresponds to the pitch. Further, the nozzle pitch GXP of this embodiment corresponds to the “first length” of the present invention. The nozzle pitch GXP can also be expressed as the nozzle pitch in the X-axis direction of the entire N (N = 4 in this embodiment) heads.

  Of course, the number of heads 114 included in the head group 114G is not limited to four. The head group 114G may include N heads 114. Here, N is a natural number of 2 or more. In this case, the N heads 114 may be arranged in the head group 114G so that the nozzle pitch GXP is approximately 1 / N times the nozzle pitch HXP.

  Hereinafter, the relative positional relationship of the head 114 of this embodiment will be described more specifically.

  First, for the purpose of simplifying the description, the four heads 114 included in the upper left head group 114G in FIG. 5 are moved toward the negative direction in the Y-axis direction (downward in FIG. 5). , Head 1143 and head 1144. Similarly, the four heads 114 included in the lower right head group 114G in FIG. 5 are respectively expressed as a head 1145, a head 1146, a head 1147, and a head 1148 from the top.

  Further, in this specification, the discharge nozzle rows 116A ′ and 116B ′ in the head 1141 are denoted as discharge nozzle rows 1A and 1B, and the discharge nozzle rows 116A ′ and 116B ′ in the head 1142 are denoted as discharge nozzle rows 2A and 2B. , The discharge nozzle arrays 116A ′ and 116B ′ in the head 1143 are expressed as discharge nozzle arrays 3A and 3B, and the discharge nozzle arrays 116A ′ and 116B ′ in the head 1144 are expressed as discharge nozzle arrays 4A and 4B. Similarly, in this specification, the discharge nozzle arrays 116A ′ and 116B ′ in the head 1145 are expressed as discharge nozzle arrays 5A and 5B, and the discharge nozzle arrays 116A ′ and 116B ′ in the head 1146 are expressed as discharge nozzle arrays 6A and 6B. , The discharge nozzle arrays 116A ′ and 116B ′ in the head 1147 are expressed as discharge nozzle arrays 7A and 7B, and the discharge nozzle arrays 116A ′ and 116B ′ in the head 1148 are expressed as discharge nozzle arrays 8A and 8B.

  Each of these discharge nozzle arrays 1A to 8B is actually composed of 80 discharge nozzles (nozzles 118). As described above, in each of the discharge nozzle arrays 1A to 8B, these 80 discharge nozzles are arranged in the X-axis direction. However, in FIG. 5, for convenience of explanation, each of the discharge nozzle arrays 1 </ b> A to 8 </ b> B is drawn to include four discharge nozzles.

  Further, in FIG. 5, the leftmost nozzle 118 of the discharge nozzle row 1A is the reference nozzle 118R of the head 1141, the leftmost nozzle 118 of the discharge nozzle row 2A is the reference nozzle 118R of the head 1142, and the discharge nozzle row 3A. The leftmost nozzle 118 is the reference nozzle 118R of the head 1143, the leftmost nozzle 118 of the discharge nozzle row 4A is the reference nozzle 118R of the head 1144, and the leftmost nozzle 118 of the discharge nozzle row 5A is the head 1145. This is the reference nozzle 118R.

  Further, in this specification, the X coordinate, Y coordinate, and Z coordinate of the reference nozzle 118R of each of the heads 1141, 1142, 1143, and 1144 may be referred to as “head X coordinate, Y coordinate, Z coordinate”. According to this notation, in the present embodiment, for example, the Y coordinate of the head 1141 is larger than the Y coordinate of the head 1142.

  In this specification, the X coordinate, Y coordinate, and Z coordinate of the first nozzle of the discharge nozzle row may be referred to as “X coordinate, Y coordinate, Z coordinate of the discharge nozzle row”. According to this notation, for example, in the head 1141, the Y coordinate of the ejection nozzle row 1A is larger than the Y coordinate of the ejection nozzle row 1B. In this specification, for example, in the head 1141, the ejection nozzle row 1A may be described as having the maximum Y coordinate. Similarly, in the head 1141, the ejection nozzle row 1B may be described as having the minimum Y coordinate. These notations mean that the Y coordinate of the discharge nozzle array 1A (or 1B) is the maximum (or minimum) among the Y coordinates of the plurality of discharge nozzle arrays in the head 1141.

  Now, in the head 1141, the discharge nozzle row 1A is displaced from the discharge nozzle row 1B in the positive direction (right side of the drawing) in the X-axis direction by substantially the length of the nozzle pitch HXP. Specifically, the X coordinate of the first nozzle 118RA of the discharge nozzle row 1A is shifted in the positive direction in the X-axis direction by the length of the nozzle pitch HXP with respect to the X coordinate of the first nozzle 118RB of the discharge nozzle row 1B. ing.

  On the other hand, in the head 1142, the ejection nozzle row 2A is shifted from the ejection nozzle row 2B in the negative direction (left side in the drawing) in the X-axis direction by substantially the length of the nozzle pitch HXP. Specifically, the X coordinate of the first nozzle 118RA of the discharge nozzle row 2A is shifted in the negative direction in the X axis direction by the length of the nozzle pitch HXP with respect to the X coordinate of the first nozzle 118RB of the discharge nozzle row 2B. ing.

  The arrangement of the discharge nozzle arrays 3A and 3B in the head 1143 is the same as the arrangement of the discharge nozzle arrays 1A and 1B in the head 1141. Further, the arrangement of the ejection nozzle rows 4A and 4B in the head 1144 is the same as the arrangement of the ejection nozzle rows 2A and 2B in the head 1142.

  In this embodiment, of the N heads 114 (1141 to 1144 in FIG. 5), any two heads adjacent in the Y-axis direction are referred to as a first head and a second head. In this case, the Y coordinate of the first head is larger than the Y coordinate of the second head. In the present embodiment, the position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. The pitch HXP is deviated in one direction parallel to the X-axis direction by approximately 1 / N times the pitch HXP. Hereinafter, the relative positional relationship between the heads will be described in more detail.

  The relative positional relationship between the heads 1141 and 1142 adjacent to each other in the Y-axis direction is as follows. As described above, the Y coordinate of the head 1141 is larger than the Y coordinate of the head 1142. The X coordinate of the head nozzle 118RB of the discharge nozzle row 1B in the head 1141 is negative in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the X coordinate of the head nozzle 118RA of the discharge nozzle row 2A in the head 1142. It is shifted to. Accordingly, the position of the discharge nozzle row 1B is shifted in the negative direction in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the position of the discharge nozzle row 2A. In this embodiment, since the nozzle pitch HXP is about 70 μm, the deviation of the X coordinates of the two leading nozzles 118RA and 118RB is about 17.5 μm (70 μm × 1/4). Further, the direction in which the above-mentioned leading nozzle 118RB is displaced from the above-mentioned 118RA may be not only the negative direction in the X-axis direction but also the positive direction.

  Since the head 1141 and the head 1142 are arranged so that the relative positional relationship between the head nozzle 118RB of the discharge nozzle row 1B and the head nozzle 118RA of the discharge nozzle row 2A is the above relationship, the discharge nozzle row 1B. The X coordinate of the other discharge nozzles (that is, the nozzle 118) is also in the negative direction in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the X coordinate of the other corresponding discharge nozzles in the discharge nozzle row 2A. It's off.

  The relative positional relationship between the heads 1142 and 1143 that are adjacent to each other in the Y-axis direction is as follows. The Y coordinate of the head 1142 is larger than the Y coordinate of the head 1143. The X coordinate of the head nozzle 118RB of the discharge nozzle row 2B in the head 1142 is negative in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the X coordinate of the head nozzle 118RA of the discharge nozzle row 3A in the head 1143. It is shifted to. Therefore, the position of the discharge nozzle row 2B is shifted in the negative direction in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the position of the discharge nozzle row 3A. It should be noted that the direction of deviation may be the same as the direction in which the discharge nozzle row 1B is displaced from the discharge nozzle row 2A.

  The relative positional relationship between the heads 1143 and 1144 adjacent to each other in the Y-axis direction is as follows. The Y coordinate of the head 1143 is larger than the Y coordinate of the head 1144. The X coordinate of the head nozzle 118RB of the discharge nozzle row 3B in the head 1143 is a negative direction in the X axis direction by about 1/4 times the nozzle pitch HXP with respect to the X coordinate of the head nozzle 118RA of the discharge nozzle row 4A in the head 1144. It is shifted to. Therefore, the position of the discharge nozzle row 3B is shifted in the negative direction in the X-axis direction by about 1/4 times the nozzle pitch HXP with respect to the position of the discharge nozzle row 4A. It should be noted that the direction of deviation may be the same as the direction in which the discharge nozzle row 1B is displaced from the discharge nozzle row 2A.

  Since the first nozzles 118RA, 118RB of the discharge nozzle arrays 1A, 1B, 2A, 2B, 3A, 3B, 4A, 4B are arranged as described above, for example, the two nozzles 118RA, 118RB of the head 1141 Between the X coordinates, the X coordinate of the leading nozzle 118RA of the ejection nozzle row 2A, the X coordinate of the leading nozzle 118RB of the ejection nozzle row 3B, and the X coordinate of the leading nozzle 118RA of the ejection nozzle row 4A are contained. In the head 1141, the X coordinates of the other three corresponding nozzles are similarly placed between the X coordinates of the other nozzle pairs that are close to each other.

  Thus, the position of the discharge nozzle row located closest to the second head in the first head is set to the nozzle pitch with respect to the position of the discharge nozzle row located closest to the first head in the second head. It is shifted in one direction parallel to the X-axis direction by approximately 1/4 times the HXP. For this reason, the nozzle pitch GXP along the X-axis direction of the head group 114G is approximately ¼ of the nozzle pitch HXP of one head 114 in the X-axis direction.

  According to the above configuration, two droplets can be landed at short time intervals at two landing positions adjacent to each other at a distance of the nozzle pitch GXP in the X-axis direction. Specifically, two droplets are sequentially formed on two adjacent landing positions at the shortest landing position distance among the landing position distances in the X-axis direction that can be set by the discharge device in one scanning period. Land. For this reason, the time for which the droplets are isolated with a minimum volume on the discharged portion is shortened. Accordingly, the droplets are not partially dried on the discharged portion. In addition, the possibility that the landed droplet contacts the dried material is also reduced. For at least the above reasons, the discharge device of this embodiment can form a uniform layer of material on the discharge target portion. The minimum volume corresponds to the volume of one droplet ejected from the nozzle.

  Next, the relative positional relationship between the two adjacent head groups 114G in FIG. 5 is based on the relative positional relationship between the head nozzles 118RA and 118RB in the head 1141 and the head nozzles 118RA and 118RB in the head 1145. explain. In this embodiment, the X coordinate of the head nozzle located on the head end side of the head nozzle 118RA and head nozzle 118RB of the head 1145 is located on the head end side of the head nozzle 118RA and head nozzle 118RB of the head 1141. With respect to the X coordinate of the head nozzle located, it is shifted in the positive direction by the length of the product of the nozzle pitch HXP and the number of discharge nozzles. In this embodiment, since the nozzle pitch HXP is about 70 μm and the number of discharge nozzles per head is 160, the product of the nozzle pitch HXP and the number of discharge nozzles is approximately 11200 μm. In the example of FIG. 5, since the number of discharge nozzles is eight for convenience of explanation, the X coordinate of the head nozzle 118RA of the head 1145 is approximately 560 μm (70 μm × 8) with respect to the X coordinate of the head nozzle 118RB of the head 1141. ) So as to be shifted in the positive direction of the X-axis direction.

  In the lower right head group 114G in FIG. 5, the relative positional relationship between the heads 1145, 1146, 1147, and 1148 is the same as the relative positional relationship of the heads 1141, 1142, 1143, and 1144 in the upper left head group 114G in FIG. It is. For this reason, the nozzle pitch in the X-axis direction of the entire two head groups 114G in FIG. 5 is also substantially 1/4 times the nozzle pitch HXP. Since the six head groups 114G (FIG. 2) are arranged in the relative positional relationship as described above, the nozzle pitch in the X-axis direction of the six heads 114G, that is, the nozzle pitch in the X-axis direction of the carriage 103, Is about 1/4 times the nozzle pitch HXP.

(E. Control part)
Next, the configuration of the control unit 112 will be described. As shown in FIG. 6, the control unit 112 includes an input buffer memory 200, a storage unit 202, a processing unit 204, a scan driving unit 206, and a head driving unit 208. The buffer memory 202 and the processing unit 204 are connected so that they can communicate with each other. The processing unit 204 and the storage unit 202 are connected to be communicable with each other. The processing unit 204 and the scan driving unit 206 are connected so as to communicate with each other. The processing unit 204 and the head driving unit 20 are connected to be communicable with each other. The scanning drive unit 206 is connected to the first position control unit 104 and the second position control unit 108 so as to communicate with each other. Similarly, the head driving unit 208 is connected to each of the plurality of heads 114 so as to communicate with each other.

  The input buffer memory 200 receives ejection data for ejecting droplets of the liquid material 111 from the external information processing apparatus. The ejection data indicates data representing the relative positions of all the ejected parts on the substrate and the number of relative scans required to apply the liquid material 111 to all the ejected parts to a desired thickness. Data, data specifying the nozzle 118 functioning as the on-nozzle 118A, and data specifying the nozzle 118 functioning as the off-nozzle 118B. The on-nozzle 118A and the off-nozzle 118B will be described later. The input buffer memory 200 supplies the ejection data to the processing unit 204, and the processing unit 204 stores the ejection data in the storage unit 202. In FIG. 6, the storage means 202 is a RAM.

  The processing unit 204 gives data indicating the relative position of the nozzle 118 to the discharge target unit to the scan driving unit 206 based on the discharge data in the storage unit 202. The scanning drive unit 206 supplies the first position control means 104 and the second position control means 108 with a drive signal corresponding to this data and an ejection period EP (FIG. 7) described later. As a result, the head 114 performs relative scanning with respect to the discharge target portion. On the other hand, the processing unit 204 gives a selection signal SC for designating ON / OFF of the nozzle 118 at each ejection timing to the head driving unit 208 based on the ejection data stored in the storage unit 202 and the ejection cycle EP. . The head driving unit 208 gives the head 114 an ejection signal ES necessary for ejecting the liquid material 111 based on the selection signal SC. As a result, the liquid material 111 is discharged as droplets from the corresponding nozzle 118 in the head 114.

  The control unit 112 may be a computer including a CPU, a ROM, and a RAM. In this case, the function of the control unit 112 is realized by a software program executed by a computer. Of course, the control unit 112 may be realized by a dedicated circuit (hardware).

  Next, the configuration and function of the head drive unit 208 in the control unit 112 will be described.

  As shown in FIG. 7A, the head drive unit 208 includes one drive signal generation unit 203 and a plurality of analog switches AS. As shown in FIG. 7B, the drive signal generation unit 203 generates a drive signal DS. The potential of the drive signal DS changes with respect to the reference potential L over time. Specifically, the drive signal DS includes a plurality of ejection waveforms P that are repeated at the ejection cycle EP. Here, the discharge waveform P corresponds to a drive voltage waveform to be applied between a pair of electrodes of the corresponding vibrator 124 in order to discharge one droplet from the nozzle 118.

  The drive signal DS is supplied to each input terminal of the analog switch AS. Each of the analog switches AS is provided corresponding to each of the ejection units 127. That is, the number of analog switches AS and the number of ejection units 127 (that is, the number of nozzles 118) are the same.

  The processing unit 204 gives a selection signal SC indicating ON / OFF of the nozzle 118 to each analog switch AS. Here, the selection signal SC can take either a high level or a low level independently for each analog switch AS. On the other hand, the analog switch AS supplies the ejection signal ES to the electrode 124A of the vibrator 124 according to the drive signal DS and the selection signal SC. Specifically, when the selection signal SC is at a high level, the analog switch AS propagates the drive signal DS as the ejection signal ES to the electrode 124A. On the other hand, when the selection signal SC is at a low level, the potential of the ejection signal ES output from the analog switch AS becomes the reference potential L. When the drive signal DS is given to the electrode 124A of the vibrator 124, the liquid material 111 is discharged from the nozzle 118 corresponding to the vibrator 124. A reference potential L is applied to the electrode 124B of each vibrator 124.

  In the example shown in FIG. 7B, a high-level period is set in each of the two selection signals SC so that the discharge waveform P appears in the cycle 2EP that is twice the discharge cycle EP in each of the two discharge signals ES. A low-level period is set. As a result, the liquid material 111 is discharged from each of the two corresponding nozzles 118 with a period of 2EP. A common drive signal DS from the common drive signal generation unit 203 is given to each of the vibrators 124 corresponding to these two nozzles 118. For this reason, the liquid material 111 is discharged from the two nozzles 118 at substantially the same timing.

  With the above configuration, the ejection device 100 performs application scanning of the liquid material 111 in accordance with ejection data given to the control unit 112.

(F. Example of discharge method)
With reference to FIGS. 8A and 8B, description will be given of a method in which the discharge device 100 discharges the liquid material 111 to the stripe-shaped target parallel to the X-axis direction, that is, the discharged portion 18L. . Specifically, the position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. Applying a liquid material, including the step of moving N heads relative to the ejected portion 18L in the Y-axis direction while shifting in one direction parallel to the X-axis direction by approximately 1 / N times the pitch HXP. A method will be described. Note that, as described above, the first head and the second head are arbitrary two heads adjacent to each other in the Y-axis direction among the N heads. Further, the Y coordinate of the first head is larger than the Y coordinate of the second head.

  In the example shown in FIG. 8A, the heads 1141, 1142, 1143, 1144, and 1145 described in FIG. 5 overlap the ejected portion 18L in this order by the relative movement of the carriage 103 in the Y-axis direction.

  As shown in FIG. 8A, first, the carriage 103 starts to move relative to the stage 106 in the Y-axis direction. When the discharge nozzle row 1A overlaps the discharged portion 18L, the material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 1A to the discharged portion 18L. On the right side of the label “1A” in FIG. 8B, landing positions P1, P2, P3, and P4 due to the discharge of the discharge nozzle row 1A are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 1A.

  Next to the discharge nozzle row 1A, the discharge nozzle row 1B overlaps the discharged portion 18L. When the discharge nozzle row 1B overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 1B to the discharged portion 18L. On the right side of the label “1B” in FIG. 8B, landing positions P5, P6, P7, and P8 due to the discharge of the discharge nozzle row 1B are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 1B. However, the distance between the landing position due to the discharge of the discharge nozzle row 1B and the landing position due to the discharge of the discharge nozzle row 1A preceding the discharge nozzle row 1B is approximately 70 μm. Note that, on the right side of the label “1B” in FIG. 8B, the landing position by the discharge of the discharge nozzle row preceding the discharge nozzle row 1B is drawn with a white circle.

  Next to the discharge nozzle row 1B, the discharge nozzle row 2A overlaps the discharged portion 18L. When the discharge nozzle row 2A overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 2A to the discharged portion 18L. On the right side of the label “2A” in FIG. 8B, landing positions P9, P10, P11, and P12 due to the ejection of the ejection nozzle row 2A are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 2A. However, the distance between the landing position (for example, P9) due to the discharge of the discharge nozzle row 2A and the landing position (for example, P5) due to the discharge of the discharge nozzle row 1B preceding the discharge nozzle row 2A is approximately 17.5 μm. is there. The landing position by the nozzle row preceding the discharge nozzle row 2A is drawn with a white circle on the right side of the label “2A” in FIG.

  Next to the discharge nozzle row 2A, the discharge nozzle row 2B overlaps the discharged portion 18L. When the discharge nozzle row 2B overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 2B to the discharged portion 18L. On the right side of the label “2B” in FIG. 8B, landing positions P13, P14, P15, and P16 due to the ejection of the ejection nozzle row 2B are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 2B. However, the shortest distance between the landing position due to ejection of the ejection nozzle row 2B and the landing position due to ejection of the nozzle row preceding the ejection nozzle row 2B is approximately 17.5 μm. Note that, on the right side of the label “2B” in FIG. 8B, the landing position by the discharge of the discharge nozzle row preceding the discharge nozzle row 2B is drawn with a white circle.

  Next to the discharge nozzle row 2B, the discharge nozzle row 3A overlaps the discharged portion 18L. When the discharge nozzle row 3A overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 3A to the discharged portion 18L. On the right side of the label “3A” in FIG. 8B, landing positions P17, P18, P19, and P20 due to the discharge of the discharge nozzle row 3A are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 3A. However, the distance between the landing position (for example, P17) due to discharge of the discharge nozzle row 3A and the landing position (for example, P13) due to discharge of the discharge nozzle row 2B preceding the discharge nozzle row 3A is approximately 17.5 μm. is there. In addition, the landing position by the discharge nozzle row preceding the discharge nozzle row 3A is drawn by a white circle on the right side of the label “3A” in FIG. 8B.

  Next to the discharge nozzle row 3A, the discharge nozzle row 3B overlaps the discharged portion 18L. When the discharge nozzle row 3B overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 3B to the discharged portion 18L. On the right side of the label “3B” in FIG. 8B, landing positions P21, P22, P23, and P24 due to the discharge of the discharge nozzle row 3B are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 3B. However, the shortest distance between the landing position by the discharge of the discharge nozzle row 3B and the landing position by the discharge of the nozzle row preceding the discharge nozzle row 3B is approximately 17.5 μm. Note that, on the right side of the label “3B” in FIG. 8B, the landing position by the discharge of the discharge nozzle row preceding the discharge nozzle row 3B is drawn with a white circle.

  Next to the discharge nozzle row 3B, the discharge nozzle row 4A overlaps the discharged portion 18L. When the discharge nozzle row 4A overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 4A to the discharged portion 18L. On the right side of the label “4A” in FIG. 8B, landing positions P25, P26, P27, and P28 due to the ejection of the ejection nozzle row 4A are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 4A. However, the distance between the landing position (for example, P25) due to discharge of the discharge nozzle row 4A and the landing position (for example, P21) due to discharge of the discharge nozzle row 3B preceding the discharge nozzle row 4A is approximately 17.5 μm. is there. In addition, the landing position by the discharge nozzle row preceding the discharge nozzle row 4A is drawn with a white circle on the right side of the label “4A” in FIG.

  Next to the discharge nozzle row 4A, the discharge nozzle row 4B overlaps the discharged portion 18L. When the discharge nozzle row 4B overlaps the discharged portion 18L, the liquid material 111 is discharged almost simultaneously from the nozzles 118 included in the discharge nozzle row 4B to the discharged portion 18L. On the right side of the label “4B” in FIG. 8B, landing positions P29, P30, P31, and P32 due to the discharge of the discharge nozzle row 4B are drawn with black circles. As shown in FIG. 8B, the liquid material 111 lands on the discharged portion 18L at a pitch of approximately 140 μm in the X-axis direction by the discharge of the discharge nozzle row 3B. However, the distance between the landing position due to ejection of the ejection nozzle row 3B and the landing position due to ejection of the nozzle row preceding the ejection nozzle row 3B is approximately 17.5 μm. Note that, on the right side of the label “4B” in FIG. 8B, the landing position by the discharge of the discharge nozzle row preceding the discharge nozzle row 4B is drawn with a white circle.

  Through the steps so far, the droplets of the liquid material 111 land so as to cover each of the landing positions arranged at a pitch of approximately ¼ of the nozzle pitch HXP. The landed liquid material 111 spreads from the landing position to the periphery, and finally forms a layer of the striped material 111.

  Then, after the discharge nozzle row 4B, the discharge nozzle row 5A overlaps the portion to be discharged 18L. When the discharge nozzle row 5A overlaps the discharge target portion 18L, the liquid material 111 is simultaneously discharged from the nozzles 118 included in the discharge nozzle row 5A to the discharge target portion 18L. On the right side of the label “5A” in FIG. 8B, the landing position P33 due to the ejection of the ejection nozzle row 5A is drawn with a black circle. By the discharge of the discharge nozzle row 5A, the liquid material 111 is landed on the discharge target portion 18L at a pitch of approximately 140 μm in the X-axis direction. However, the distance between the landing position P33 due to the discharge of the discharge nozzle row 5A and the rightmost landing position P32 due to the discharge of the discharge nozzle row 4B preceding the discharge nozzle row 5A is approximately 17.5 μm. The landing position by the nozzle row preceding the discharge nozzle row 5A is drawn with a white circle on the right side of the label “5A” in FIG.

  Thereafter, the discharge nozzle row 5B and the subsequent portions overlap in this order with other portions of the discharge target portion 18L, and the liquid material 111 is discharged from each discharge nozzle row to the discharge target portion 18L in the same manner as the discharge nozzle rows 1A to 5A. Is discharged. As a result, while the head group 114G moves relative to the ejected portion 18L only once in the Y-axis direction, the length is 1/4 times the nozzle pitch HXP in the X-axis direction of the head 114, that is, 17.5 μm. The liquid material 111 lands at a pitch of.

  One example of the stripe-shaped discharged portion 18L is a portion for forming a metal wiring in an electronic device. Therefore, the discharge device 100 of the present embodiment can be applied to a wiring manufacturing apparatus that manufactures metal wiring by discharging a liquid wiring material. For example, the present invention can be applied to a wiring manufacturing apparatus in which the address electrode 54 is formed on the support substrate 52 in the plasma display device 50 (FIGS. 21 to 22) described later.

  According to the present embodiment, in the ejection device 100, the plurality of nozzles 118 are arranged in a direction (X-axis direction) orthogonal to the direction in which the carriage 103 relatively moves (Y-axis direction). For this reason, the liquid material 111 can be discharged from the plurality of nozzles 118 almost simultaneously to the discharged portion 18L extending in the X-axis direction. As a result, one drive signal generation unit 203 that generates the drive signal DS may be provided for the plurality of nozzles 118. In addition, since the discharge timings from the plurality of nozzles 118 arranged in one direction are almost simultaneous, a circuit configuration for delaying the drive signal DS from the drive signal generation unit 203 is not necessary. As a result, there are few factors that cause rounding in the waveform of the drive signal DS, and therefore, a precise ejection waveform P can be applied to the vibrator 124. Therefore, the discharge of the liquid material 111 from the nozzle 118 is more stable.

According to the present embodiment, in the ejection device 100, the nozzle pitch in the X-axis direction of the head group 114G is 1 / N times the nozzle pitch in the X-axis direction of the head. Here, N is the number of heads 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the ejection device 100 is higher than the nozzle line density in the X-axis direction of the single head. As a result, a finer landing pattern can be formed along the X-axis direction within a period of relative movement of the carriage 103 only once in the Y-axis direction.
[Example 2]

  An example in which the present invention is applied to a color filter substrate manufacturing apparatus will be described.

  A base body 10A shown in FIGS. 9A and 9B is a substrate that becomes the color filter substrate 10 through processing by a manufacturing apparatus 1 (FIG. 10) described later. The base 10A has a plurality of discharged portions 18R, 18G, and 18B arranged in a matrix.

  Specifically, the base body 10 </ b> A includes a support substrate 12 having optical transparency, a black matrix 14 formed on the support substrate 12, and a bank 16 formed on the black matrix 14. The black matrix 14 is formed of a light-shielding material. The black matrix 14 and the bank 16 on the black matrix 14 are positioned on the support substrate 12 so that a plurality of matrix-like light transmission portions, that is, a plurality of matrix-like pixel regions are defined.

  In each pixel region, the recesses defined by the support substrate 12, the black matrix 14, and the bank 16 correspond to the discharged portion 18R, the discharged portion 18G, and the discharged portion 18B. The discharged portion 18R is a region where the filter layer 111FR that transmits only light in the red wavelength region is to be formed, and the discharged portion 18G is formed with the filter layer 111FG that transmits only light in the green wavelength region. The discharged portion 18B is a region where the filter layer 111FB that transmits only light in the blue wavelength region is to be formed.

  The base body 10A shown in FIG. 9B is located on a virtual plane parallel to both the X-axis direction and the Y-axis direction. The row direction and the column direction of the matrix formed by the plurality of discharged portions 18R, 18G, and 18B are parallel to the X-axis direction and the Y-axis direction, respectively. In the base body 10A, the discharged portion 18R, the discharged portion 18G, and the discharged portion 18B are periodically arranged in this order in the Y-axis direction. On the other hand, the discharged parts 18R are arranged in a line at a predetermined fixed interval in the X-axis direction, and the discharged parts 18G are arranged in a line at a predetermined fixed interval in the X-axis direction. In addition, the discharged portions 18B are arranged in a line at predetermined intervals in the X-axis direction. Note that the X-axis direction and the Y-axis direction are orthogonal to each other.

  The constant interval LRY along the Y-axis direction between the discharged portions 18R, that is, the pitch is approximately 560 μm. This interval is the same as the constant interval LGY along the Y-axis direction between the discharged portions 18G, and is the same as the fixed interval LBY along the Y-axis direction between the discharged portions 18B. Further, the planar image of the discharged portion 18R is a rectangle determined by the long side and the short side. Specifically, the length of the discharged portion 18R in the Y-axis direction is approximately 100 μm, and the length in the X-axis direction is approximately 300 μm. The discharged portion 18G and the discharged portion 18B also have the same shape and size as the discharged portion 18R. The distance between the discharged parts and the size of the discharged parts correspond to the distance and the size of the pixel areas corresponding to the same color in a high-definition television having a size of about 40 inches.

  A manufacturing apparatus 1 shown in FIG. 10 is an apparatus that discharges a corresponding color filter material to each of the discharge target portions 18R, 18G, and 18B of the base body 10A of FIG. Specifically, the manufacturing apparatus 1 includes a discharge device 100R that applies the color filter material 111R to all of the discharged portions 18R, a drying device 150R that dries the color filter material 111R on the discharged portions 18R, and a discharged portion. 100G for applying the color filter material 111G to all of 18G, a drying device 150G for drying the color filter material 111G on the discharged portion 18G, 100B for applying the color filter material 111B to all of the discharged portions 18B, A drying device 150B that dries the color filter material 111B of the discharge unit 18B, an oven 160 that reheats (post-bake) the color filter materials 111R, 111G, and 111B, and a layer of post-baked color filter materials 111R, 111G, and 111B Discharging to provide a protective film 20 on It includes a location 100C, and the drying device 150C for drying the protective film 20, a curing device 165 which cures by heating the dried protective film 20 again, the. Further, the manufacturing apparatus 1 transports the base body 10A in the order of the ejection device 100R, the drying device 150R, the ejection device 100G, the drying device 150G, the ejection device 100B, the drying device 150B, the ejection device 100C, the drying device 150C, and the curing device 165. A device 170 is also provided.

  As shown in FIG. 11, the configuration of the ejection device 100R is basically the same as the configuration of the ejection device 100 of the first embodiment. However, the configuration of the ejection device 100R is different from the configuration of the ejection device 100 in that the ejection device 100R includes a tank 101R and a tube 110R for the liquid color filter material 111R instead of the tank 101 and the tube 110. Of the constituent elements of the ejection device 100R, the same constituent elements as those of the ejection device 100 are denoted by the same reference numerals as those in the first embodiment, and redundant description is omitted.

  The configuration of the ejection device 100G, the configuration of the ejection device 100B, and the configuration of the ejection device 100C are basically the same as the configuration of the ejection device 100R. However, the configuration of the ejection device 100G is different from the configuration of the ejection device 100R in that the ejection device 100G includes a tank and a tube for the color filter material 111G instead of the tank 101R and the tube 110R in the ejection device 100R. Similarly, the configuration of the ejection device 100B is different from the configuration of the ejection device 100R in that the ejection device 100B includes a tank and a tube for the color filter material 111B instead of the tank 101R and the tube 110R. Further, the configuration of the ejection device 100C is different from the configuration of the ejection device 100R in that the ejection device 100C includes a tank and a tube for protective film material instead of the tank 101R and the tube 110R. In addition, the liquid color filter materials 111R, 111G, and 111B in this embodiment are examples of the liquid material of the present invention.

  Next, the operation of the ejection device 100R will be described. The discharge device 100R discharges the same material to a plurality of discharge target portions 18R arranged in a matrix on the base 10A. As described in Examples 3 to 5, the base body 10A may be replaced with a substrate for an electroluminescence display device, may be replaced with a back substrate for a plasma display device, and includes an electron-emitting device. The substrate of the image display device may be replaced.

  The base body 10A of FIG. 12 is held by the stage 106 so that the long side direction and the short side direction of the discharged portion 18R coincide with the X axis direction and the Y axis direction, respectively.

  First, before the first scanning period starts, the control unit 112 determines that the carriage 103, that is, the X coordinate of several nozzles 118 falls within the X coordinate range of the discharge target 18R according to the discharge data. The head group 114G is moved relative to the base body 10A in the X-axis direction. The X coordinate range of the discharged portion 18R is a range determined by the X coordinates of both ends of the discharged portion 18R. In the present embodiment, the length of the long side of the discharged portion 18R is about 300 μm, and the nozzle pitch HXP in the X-axis direction of the head group 114G is 17.5 μm. For this reason, the 16 or 17 nozzles 118 in the head group 114G fall within the X coordinate range of one discharge target 18R. No color filter material 111R is discharged from the nozzle 118 outside the X coordinate range within the scanning period.

  By the way, in this embodiment, as shown in FIG. 29, the “scanning period” means that one side of the carriage 103 extends along the Y-axis direction from one end E1 (or the other end E2) to the other end E2 (or one end). E1) means a period during which the relative movement is performed once. The “scanning range 134” means a range in which the carriage 103 relatively moves in order to apply a material to all the discharged portions 18R on the base 10A, and all the discharged portions 18R are covered by the scanning range 134. Yes. In some cases, the term “scanning range” may mean a range in which one nozzle 118 relatively moves, may mean a range in which one nozzle row 116 moves relatively, or one head. 114 may mean a range in which relative movement is performed.

  When the first scanning period starts, the head group 114G starts to relatively move from the one end E1 of the scanning range 134 in the positive direction in the Y-axis direction (upward in the drawing in FIG. 12). Then, these nozzle rows enter the region corresponding to the target portion 18R in the order of the ejection nozzle rows 1A, 1B, 2A, 2B, 3A, 3B, 4A, and 4B. Note that the X coordinate of the head group 114G does not change during the first scanning period.

  Here, the controller 112 causes the carriage 103 so that one nozzle 118 and the portion to be ejected 18R aligned in the Y-axis direction overlap each other at an interval that is an integral multiple of the ejection cycle EP (FIG. 7B). Determines the speed of relative movement. This is because the other nozzles 118 in the nozzle row including the one nozzle 118 also overlap with the respective ejection target portions 18R at time intervals that are integral multiples of the ejection cycle EP. In this embodiment, since the pitch in the Y-axis direction of the ejected portion 18R is LRY (FIG. 9B), assuming that the speed of relative movement of the carriage 103 with respect to the stage 106 is V, V = LRY / (k · EP) It is. Here, k is an integer.

  In the example shown in FIG. 12, when the discharge nozzle row 1A enters a region corresponding to one discharge target 18R, the leftmost nozzle 118 of the discharge nozzle row 1A, the second nozzle 118 from the left, From, the color filter material 111 is discharged. Then, after the discharge nozzle row 1A, the discharge nozzle row 1B enters a region corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the second nozzle 118 from the left and the third nozzle from the left of the discharge nozzle row 1B.

  Next to the discharge nozzle row 1B, the discharge nozzle row 2A enters the area corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 in the discharge nozzle row 2A and the second nozzle 118 from the left. Then, after the discharge nozzle row 2A, the discharge nozzle row 2B enters a region corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 and the second nozzle 118 from the left in the discharge nozzle row 2B.

  Next to the discharge nozzle row 2B, the discharge nozzle row 3A enters the area corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 of the discharge nozzle row 3A and the second nozzle 118 from the left. Then, after the discharge nozzle row 3A, the discharge nozzle row 3B enters the area corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 and the second nozzle 118 from the left in the discharge nozzle row 3B.

  Next to the discharge nozzle row 3B, the discharge nozzle row 4A enters a region corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 in the discharge nozzle row 4A and the second nozzle 118 from the left. Then, after the discharge nozzle row 4A, the discharge nozzle row 4B enters a region corresponding to the one portion to be discharged 18R. Then, the color filter material 111R is discharged from the leftmost nozzle 118 and the second nozzle 118 from the left in the discharge nozzle row 4B.

  The ejection device of the present embodiment can land two droplets at short time intervals at two landing positions adjacent to each other at a distance of the nozzle pitch GXP in the X-axis direction. Specifically, two droplets land in order on two adjacent landing positions at the shortest distance between the landing positions among the distances between the landing positions in the X-axis direction that can be set by the discharge device in one scanning period. To do. For this reason, the time for which the droplets are isolated with a minimum volume on the discharged portion is shortened. As a result, the droplets are not partially dried. In addition, the possibility that the landed droplet contacts the dried material is also reduced. Therefore, according to the discharge apparatus of the present embodiment, a uniform layer of the color filter material can be formed on the discharge target portion. In addition, said minimum volume is corresponded to the volume (volume of a color filter material) of one droplet discharged from a nozzle.

  Furthermore, according to the present embodiment, the color filter material 111R having a required volume can be discharged to one discharge target portion 18R within one scanning period. This is because the nozzle pitch GXP in the X-axis direction of the head group 114G is approximately ¼ of the nozzle pitch HXP in the X-axis direction of one head 114. Therefore, more nozzles can be used in one scanning period. This is because 118 overlaps one discharged portion.

  On the other hand, as shown in FIG. 12, within the first scanning period, the leftmost nozzle 118 in the discharge nozzle row 1B, the second nozzle 118 from the right in the discharge nozzle row 2A, and the right in the discharge nozzle row 3B. The second nozzle 118 and the second nozzle 118 from the right in the ejection nozzle row 4A do not overlap the ejection target 18R even once. Therefore, no color filter material 111R is discharged from these nozzles.

  When the first scanning period ends, the control unit 112 starts the next scanning period after relatively moving the head group 114G in the X-axis direction, and applies the color filter material 111R to the ejection target 18R that has not been applied yet. Is discharged.

  The process of applying the color filter material 111R to the discharge target portion 18R has been described above. Below, a series of processes until the color filter substrate 10 is obtained by the manufacturing apparatus 1 will be described.

  First, the base body 10A of FIG. 9 is prepared according to the following procedure. First, a metal thin film is formed on the support substrate 12 by sputtering or vapor deposition. Thereafter, a lattice-like black matrix 14 is formed from the metal thin film by a photolithography process. Examples of the material of the black matrix 14 are metal chromium and chromium oxide. Note that the support substrate 12 is a substrate having optical transparency with respect to visible light, for example, a glass substrate. Subsequently, a resist layer made of a negative photosensitive resin composition is applied so as to cover the support substrate 12 and the black matrix 14. Then, the resist layer is exposed while closely contacting the mask film formed in a matrix pattern shape on the resist layer. Thereafter, the bank 16 is obtained by removing an unexposed portion of the resist layer by an etching process. The base body 10A is obtained through the above steps.

  In place of the bank 16, a bank made of resin black may be used. In that case, the metal thin film (black matrix 14) is not required, and the bank layer is only one layer.

  Next, the substrate 10A is made lyophilic by oxygen plasma treatment under atmospheric pressure. By this processing, the surface of the support substrate 12, the surface of the black matrix 14, the surface of the bank 16, and the recesses defined by the support substrate 12, the black matrix 14, and the bank 16 (part of the pixel region) The surface becomes lyophilic. Further, thereafter, a plasma treatment using tetrafluoromethane as a treatment gas is performed on the base 10A. By the plasma treatment using tetrafluoromethane, the surface of the bank 16 in each recess is fluorinated (treated to be liquid repellent), whereby the surface of the bank 16 becomes liquid repellent. Note that the surface of the support substrate 12 and the surface of the black matrix 14 to which lyophilicity was previously imparted by plasma treatment using tetrafluoromethane slightly lose lyophilicity, but these surfaces are still lyophilic. maintain. In this way, the surface of the recess is subjected to predetermined surface treatment on the surface of the recess defined by the support substrate 12, the black matrix 14, and the bank 16, so that the surface of the recess becomes the discharged portions 18 R, 18 G, 18 B. Become.

  Depending on the material of the support substrate 12, the material of the black matrix 14, and the material of the bank 16, a surface exhibiting desired lyophilicity and liquid repellency can be obtained without performing the above surface treatment. There is also. In such a case, the surfaces of the recesses defined by the support substrate 12, the black matrix 14, and the bank 16 are the discharged portions 18R, 18G, and 18B without performing the surface treatment.

  The substrate 10A on which the discharged portions 18R, 18G, and 18B are formed is carried to the stage 106 of the discharge device 100R by the transfer device 170 and placed on the stage 106. Then, as illustrated in FIG. 13A, the discharge device 100R discharges the color filter material 111R from the head 114 so that the layer of the color filter material 111R is formed on all of the discharge target portions 18R. Specifically, the discharge device 100R applies the color filter material 111R to the discharge target portion 18R by the discharge method described with reference to FIG. When the layer of the color filter material 111R is formed on all of the discharged portions 18R of the base 10A, the transport device 170 positions the base 10A in the drying device 150R. Then, the filter layer 111FR is obtained on the discharged portion 18R by completely drying the color filter material 111R on the discharged portion 18R.

  Next, the transport device 170 positions the base body 10A on the stage 106 of the ejection device 100G. Then, as illustrated in FIG. 13B, the ejection device 100G ejects the color filter material 111G from the head 114 so that the layer of the color filter material 111G is formed on the entire ejection target 18G. Specifically, the ejection device 100G applies the color filter material 111G to the ejection target portion 18G by the ejection method described with reference to FIG. When the layer of the color filter material 111G is formed on all of the discharge target portions 18G of the base 10A, the transport device 170 positions the base 10A in the drying device 150G. Then, the filter layer 111FG is obtained on the discharged portion 18G by completely drying the color filter material 111G on the discharged portion 18G.

  Next, the transport device 170 positions the base body 10A on the stage 106 of the ejection device 100B. Then, as shown in FIG. 13C, the ejection device 100B ejects the color filter material 111B from the head 114 so that the layer of the color filter material 111B is formed on all of the ejection target portions 18B. Specifically, the ejection device 100B applies the color filter material 111B to the ejected portion 18B by the ejection method described with reference to FIG. When the layer of the color filter material 111B is formed on all of the discharged portions 18B of the base 10A, the transport device 170 positions the base 10A in the drying device 150B. Then, the filter layer 111FB is obtained on the discharged portion 18B by completely drying the color filter material 111B on the discharged portion 18B.

  Next, the transfer device 170 positions the base body 10 </ b> A in the oven 160. Thereafter, the oven 160 reheats (post-bake) the filter layers 111FR, 111FG, and 111FB.

  Next, the transport device 170 positions the base body 10A on the stage 106 of the ejection device 100C. The ejection device 100C ejects a liquid protective film material so that the protective film 20 is formed so as to cover the filter layers 111FR, 111FG, 111FB and the bank 16. After the protective film 20 covering the filter layers 111FR, 111FG, 111FB and the bank 16 is formed, the transfer device 170 positions the base body 10A in the oven 150C. Then, after the oven 150C completely dries the protective film 20, the curing device 165 heats the protective film 20 and completely cures, whereby the base 10A becomes the color filter substrate 10.

According to the present embodiment, in each of the ejection devices 100R, 100G, and 100B, the nozzle pitch in the X-axis direction of the head group 114G is 1 / N times the nozzle pitch in the X-axis direction of the head 114. Here, N is the number of heads 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the ejection devices 100R, 100G, and 100B is higher than the nozzle line density in the X-axis direction of the head alone. Therefore, the manufacturing apparatus 1 can apply the color filter material to the portions to be discharged having various sizes simply by changing the discharge data. Furthermore, the manufacturing apparatus 1 can manufacture color filter substrates with various pitches by simply changing the ejection data.
[Example 3]

  Next, the example which applied this invention to the manufacturing apparatus of an electroluminescent display apparatus is demonstrated.

  A substrate 30A shown in FIGS. 14A and 14B is a substrate that becomes the electroluminescence display device 30 by processing by the manufacturing apparatus 2 (FIG. 15) described later. The base body 30A has a plurality of discharged portions 38R, 38G, and 38B arranged in a matrix.

  Specifically, the base body 30A includes a support substrate 32, a circuit element layer 34 formed on the support substrate 32, a plurality of pixel electrodes 36 formed on the circuit element layer 34, and a plurality of pixel electrodes 36. And a bank 40 formed therebetween. The support substrate is a substrate having optical transparency to visible light, for example, a glass substrate. Each of the plurality of pixel electrodes 36 is an electrode having optical transparency with respect to visible light, for example, an ITO (Indium-Tin Oxide) electrode. The plurality of pixel electrodes 36 are arranged in a matrix on the circuit element layer 34, and each define a pixel region. The bank 40 has a lattice shape and surrounds each of the plurality of pixel electrodes 36. The bank 40 includes an inorganic bank 40A formed on the circuit element layer 34 and an organic bank 40B positioned on the inorganic bank 40A.

  The circuit element layer 34 includes a plurality of scan electrodes extending in a predetermined direction on the support substrate 32, an insulating film 42 formed so as to cover the plurality of scan electrodes, and a plurality of scan electrodes positioned on the insulating film 42. A plurality of signal electrodes extending in a direction orthogonal to the direction in which the electrodes extend, a plurality of switching elements 44 located near the intersections of the scan electrodes and the signal electrodes, and polyimide formed so as to cover the plurality of switching elements 44 And an interlayer insulating film 45. The gate electrode 44G and the source electrode 44S of each switching element 44 are electrically connected to the corresponding scan electrode and the corresponding signal electrode, respectively. A plurality of pixel electrodes 36 are located on the interlayer insulating film 45. The interlayer insulating film 45 is provided with a through hole 44V at a portion corresponding to the drain electrode 44D of each switching element 44, and the switching element 44 and the corresponding pixel electrode 36 are connected via the through hole 44V. An electrical connection between them is formed. Each switching element 44 is located at a position corresponding to the bank 40. That is, when viewed from a direction perpendicular to the paper surface of FIG. 13B, each of the plurality of switching elements 44 is positioned so as to be covered by the bank 40.

  A recess (a part of the pixel region) defined by the pixel electrode 36 and the bank 40 of the base body 30A corresponds to the discharged portion 38R, the discharged portion 38G, and the discharged portion 38B. The discharged portion 38R is a region where the light emitting layer 211FR that emits light in the red wavelength region is to be formed, and the discharged portion 38G is formed with the light emitting layer 211FG that emits light in the green wavelength region. The ejected portion 38B is a region where the light emitting layer 211GB that emits light in the blue wavelength region is to be formed.

  The base body 30A shown in FIG. 14B is located on a virtual plane parallel to both the X-axis direction and the Y-axis direction. The row direction and the column direction of the matrix formed by the plurality of ejected portions 38R, 38G, and 38B are parallel to the X-axis direction and the Y-axis direction, respectively. In the base body 30A, the discharged portion 38R, the discharged portion 38G, and the discharged portion 38B are periodically arranged in this order in the Y-axis direction. On the other hand, the discharged parts 38R are arranged in a line at a predetermined constant interval in the X-axis direction, and the discharged parts 38G are arranged in a line at a predetermined fixed interval in the X-axis direction. Similarly, the portions to be ejected 38B are arranged in a line at a predetermined constant interval in the X-axis direction. Note that the X-axis direction and the Y-axis direction are orthogonal to each other.

  The interval LRY along the Y-axis direction between the discharged portions 38R, that is, the pitch is approximately 560 μm. This interval is the same as the interval LGY along the Y-axis direction between the discharged portions 38G, and is the same as the interval LBY along the Y-axis direction between the discharged portions 18B. Further, the planar image of the discharged portion 38R is a rectangle determined by the long side and the short side. Specifically, the length of the discharged portion 38R in the Y-axis direction is approximately 100 μm, and the length in the X-axis direction is approximately 300 μm. The discharged portion 38G and the discharged portion 38B also have the same shape and size as the discharged portion 38R. The distance between the discharged parts and the size of the discharged parts correspond to the distance and the size of the pixel areas corresponding to the same color in a high-definition television having a size of about 40 inches.

  The manufacturing apparatus 2 shown in FIG. 15 is an apparatus that discharges a corresponding light emitting material to each of the discharged portions 38R, 38G, and 38B of the base body 30A of FIG. The manufacturing apparatus 2 includes a discharge device 200R for applying the light emitting material 211R to all of the discharged portions 38R, a drying device 250R for drying the light emitting material 211R on the discharged portions 38R, and a light emitting material 211G for all of the discharged portions 38G. , A drying device 250G for drying the light emitting material 211G on the discharged portion 38G, a discharging device 200B for applying the light emitting material 211B to all of the discharged portions 38B, and the light emission on the discharged portion 38B. A drying device 250B for drying the material B. The manufacturing apparatus 2 further includes a transport device 270 that transports the base body 30A in the order of the discharge device 200R, the drying device 250R, the discharge device 200G, the drying device 250G, the discharge device 200B, and the drying device 250B.

  A discharge device 200R illustrated in FIG. 16 includes a tank 201R that holds a liquid light-emitting material 211R, a tube 210R, and a discharge scanning unit 102 that is supplied with the light-emitting material 211R from the tank 201R via the tube 210R. Since the configuration of the ejection scanning unit 102 is the same as the configuration of the ejection scanning unit 102 (FIG. 1) of the first embodiment, the same reference numerals are given to the same components, and redundant description is omitted. Further, the configuration of the ejection device 200G and the configuration of the ejection device 200B are both basically the same as the configuration of the ejection device 200R. However, the configuration of the ejection device 200G is different from the configuration of the ejection device 200R in that the ejection device 200G includes a tank and a tube for the light emitting material 211G instead of the tank 201R and the tube 210R. Similarly, the configuration of the ejection device 200B is different from the configuration of the ejection device 200R in that the ejection device 200B includes a tank and a tube for the light emitting material 211B instead of the tank 201R and the tube 210R. Note that the liquid light emitting materials 211R, 211B, and 211G in this embodiment are examples of the liquid material of the present invention.

  A method for manufacturing the electroluminescence display device 30 using the manufacturing apparatus 2 will be described. First, a base 30A shown in FIG. 14 is manufactured using a known film forming technique and patterning technique.

  Next, the base 30A is made lyophilic by oxygen plasma treatment under atmospheric pressure. By this processing, the surface of the pixel electrode 36, the surface of the inorganic bank 40A, and the surface of the organic bank 40B in the respective recesses (a part of the pixel region) defined by the pixel electrode 36 and the bank 40 are made lyophilic. Present. Further, thereafter, a plasma process using tetrafluoromethane as a process gas is performed on the base 30A. By the plasma treatment using tetrafluoromethane, the surface of the organic bank 40B in each concave portion is fluorinated (treated to be liquid repellent) so that the surface of the organic bank 40B exhibits liquid repellency. Become. Note that the surface of the pixel electrode 36 and the surface of the inorganic bank 40A previously given lyophilicity by plasma treatment using tetrafluoromethane lose some lyophilicity, but still maintain lyophilicity. . As described above, the surface of the concave portion defined by the pixel electrode 36 and the bank 40 is subjected to a predetermined surface treatment, so that the surface of the concave portion becomes the discharged portions 38R, 38G, and 38B.

  Depending on the material of the pixel electrode 36, the material of the inorganic bank 40, and the material of the organic bank 40, a surface exhibiting desired lyophilicity and liquid repellency can be obtained without performing the above surface treatment. Sometimes. In such a case, even if the surface treatment is not performed, the surfaces of the recesses defined by the pixel electrodes 36 and the banks 40 are the discharged portions 38R, 38G, and 38B.

  Here, the corresponding hole transport layers 37R, 37G, and 37B may be formed on each of the plurality of pixel electrodes 36 subjected to the surface treatment. If the hole transport layers 37R, 37G, and 37B are positioned between the pixel electrode 36 and light emitting layers 211RF, 211GF, and 211BF, which will be described later, the light emission efficiency of the electroluminescence display device is increased. When a hole transport layer is provided on each of the plurality of pixel electrodes 36, the recesses defined by the hole transport layer and the bank 40 correspond to the discharged portions 38R, 38G, and 38B.

  Note that the hole transport layers 37R, 37G, and 37B can be formed by an inkjet method. In this case, the hole transport layer can be formed by applying a predetermined amount of a solution containing a material for forming the hole transport layers 37R, 37G, and 37B to each pixel region and then drying the solution.

  The substrate 30A on which the discharged portions 38R, 38G, and 38B are formed is carried to the stage 106 of the discharge device 200R by the transport device 270 and placed on the stage 106. Then, as shown in FIG. 17A, the ejection device 200R ejects the light emitting material 211R from the head 114 so that the layer of the light emitting material 211R is formed on all of the ejection target portions 38R. Specifically, the discharge device 200R applies the light emitting material 211R to the discharge target portion 38R by the discharge method described with reference to FIG. When the layer of the light emitting material 211R is formed on all of the discharge target portions 38R of the base body 30A, the transport device 270 positions the base body 30A in the drying device 250R. Then, by completely drying the light emitting material 211R on the discharged portion 38R, the light emitting layer 211FR is obtained on the discharged portion 38R.

  Next, the transport device 270 positions the base body 30A on the stage 106 of the ejection device 200G. Then, as shown in FIG. 17B, the ejection device 200G ejects the light emitting material 211G from the head 114 so that the layer of the light emitting material 211G is formed on all of the ejection target portions 38G. Specifically, the ejection device 200G applies the light emitting material 211G to the ejected portion 38G by the ejection method described with reference to FIG. When the layer of the light emitting material 211G is formed on all of the discharge target portions 38G of the base body 30A, the transport device 270 positions the base body 30A in the drying device 250G. Then, by completely drying the light emitting material G on the discharged portion 38G, the light emitting layer 211FG is obtained on the discharged portion 38G.

  Next, the transport device 270 positions the base body 30A on the stage 106 of the ejection device 200B. Then, as shown in FIG. 17C, the ejection device 200B ejects the light emitting material 211B from the head 114 so that the layer of the light emitting material 211B is formed on all of the ejected portions 38B. Specifically, the discharge device 200B applies the light emitting material 211B to the discharge target portion 38B by the discharge method described with reference to FIG. When the layer of the light emitting material 211B is formed on all of the discharged portions 38B of the base body 30A, the transport device 270 positions the base body 30A in the drying device 250B. Then, by completely drying the light emitting material 211B on the discharged portion 38B, the light emitting layer 211FB is obtained on the discharged portion 38B.

  Next, as shown in FIG. 17D, the counter electrode 46 is provided so as to cover the light emitting layers 211FR, 211FG, 211FB and the bank 40. The counter electrode 46 functions as a cathode. Then, the electroluminescent display apparatus 30 shown in FIG.17 (d) is obtained by adhere | attaching the sealing substrate 48 and the base | substrate 30A in a mutual peripheral part. An inert gas 49 is enclosed between the sealing substrate 48 and the base body 30A.

  In the electroluminescence display device 30, light emitted from the light emitting layers 211 FR, 211 FG, and 211 FB is emitted through the pixel electrode 36, the circuit element layer 34, and the support substrate 32. The electroluminescence display device that emits light through the circuit element layer 34 in this manner is called a bottom emission type display device.

  The ejection device of the present embodiment can land two droplets at short time intervals at two landing positions adjacent to each other at a distance of the nozzle pitch GXP in the X-axis direction. Specifically, two droplets land in order on two adjacent landing positions at the shortest distance between the landing positions among the distances between the landing positions in the X-axis direction that can be set by the discharge device in one scanning period. To do. For this reason, the time for which the droplets are isolated with a minimum volume on the discharged portion is shortened. As a result, the droplets are not partially dried. In addition, the possibility that the landed droplet contacts the dried material is also reduced. Therefore, according to the ejection device of this embodiment, a uniform layer of the light emitting material can be formed on the ejection target portion. In addition, said minimum volume is corresponded to the volume (volume of luminescent material) of one droplet discharged from a nozzle.

According to the present embodiment, in each of the ejection devices 200R, 200G, and 200B, the nozzle pitch in the X-axis direction of the head group 114G is 1 / N times the nozzle pitch in the X-axis direction of the head 114. Here, N is the number of heads 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the ejection devices 200R, 200G, and 200B is higher than the nozzle line density in the X-axis direction of the head alone. Therefore, the manufacturing apparatus 2 can apply the light emitting material to the portions to be ejected of various sizes simply by changing the ejection data. Furthermore, the manufacturing apparatus 2 can manufacture electroluminescence display devices having various pitches by simply changing the ejection data.
[Example 4]

  An example in which the present invention is applied to an apparatus for manufacturing a back substrate of a plasma display device will be described.

  A substrate 50A shown in FIGS. 18A and 18B is a substrate that becomes the back substrate 50B of the plasma display device by processing by the manufacturing apparatus 3 (FIG. 19) described later. The base 50A has a plurality of discharged portions 58R, 58G, 58B arranged in a matrix.

  Specifically, the base 50A includes a support substrate 52, a plurality of address electrodes 54 formed in a stripe shape on the support substrate 52, a dielectric glass layer 56 formed so as to cover the address electrodes 54, a lattice And a partition wall 60 having a shape and defining a plurality of pixel regions. The plurality of pixel regions are located in a matrix, and each column of the matrix formed by the plurality of pixel regions corresponds to each of the plurality of address electrodes 54. Such a base 50A is formed by a known screen printing technique.

  In each pixel region of the substrate 50A, the recesses defined by the dielectric glass layer 56 and the partition wall 60 correspond to the discharged portion 58R, the discharged portion 58G, and the discharged portion 58B. The discharged portion 58R is a region where a fluorescent layer 311FR that emits light in the red wavelength region is to be formed, and the discharged portion 58G is formed with a fluorescent layer 311FG that emits light in the green wavelength region. The ejected portion 58B is a region where the fluorescent layer 311FB that emits light in the blue wavelength region is to be formed.

  The base body 50A shown in FIG. 18B is located on a virtual plane parallel to both the X-axis direction and the Y-axis direction. The row direction and the column direction of the matrix formed by the plurality of discharged portions 58R, 58G, and 58B are parallel to the X-axis direction and the Y-axis direction, respectively. In the base body 50A, the discharged portion 58R, the discharged portion 58G, and the discharged portion 58B are periodically arranged in this order in the Y-axis direction. On the other hand, the discharged parts 58R are arranged in a line at a predetermined constant interval in the X-axis direction, and the discharged parts 58G are arranged in a line at a predetermined fixed interval in the X-axis direction. Similarly, the portions to be ejected 58B are arranged in a line at predetermined intervals in the X-axis direction. Note that the X-axis direction and the Y-axis direction are orthogonal to each other.

  The interval LRY along the Y-axis direction between the discharged parts 58R, that is, the pitch is approximately 560 μm. This interval is the same as the interval LGY along the Y-axis direction between the discharged portions 58G, and is the same as the interval LBY along the Y-axis direction between the discharged portions 58B. Further, the planar image of the discharged portion 58R is a rectangle determined by the long side and the short side. Specifically, the length of the discharged portion 58R in the Y-axis direction is approximately 100 μm, and the length in the X-axis direction is approximately 300 μm. The discharged portion 58G and the discharged portion 58B also have the same shape and size as the discharged portion 58R. The distance between the discharged parts and the size of the discharged parts correspond to the distance and the size of the pixel areas corresponding to the same color in a high-definition television having a size of about 40 inches.

  A manufacturing apparatus 3 shown in FIG. 19 is an apparatus that discharges a corresponding fluorescent material to each of the discharged portions 58R, 58G, and 58B of the base body 50A of FIG. The manufacturing apparatus 3 includes a discharge device 300R that applies the fluorescent material 311R to all of the discharged portions 58R, a drying device 350R that dries the fluorescent material 311R on the discharged portions 58R, and a fluorescent material 311G for all of the discharged portions 58G. , A drying device 350G for drying the fluorescent material 311G on the discharged portion 58G, a discharging device 300B for applying the fluorescent material 311B to all of the discharged portions 58B, and a fluorescent light on the discharged portion 58B. And a drying device 350B that dries the material 311B. The manufacturing apparatus 3 further includes a transport device 370 that transports the base body 50A in the order of the discharge device 300R, the drying device 350R, the discharge device 300G, the drying device 350G, the discharge device 300B, and the drying device 350B.

  A discharge device 300R illustrated in FIG. 20 includes a tank 301R that holds a liquid fluorescent material 311R, a tube 310R, and a discharge scanning unit 102 that is supplied with a color filter material from the tank 301R via the tube 310R. Since the configuration of the ejection scanning unit 102 has been described in the first embodiment, a duplicate description is omitted.

  Both the configuration of the ejection device 300G and the configuration of the ejection device 300B are basically the same as the configuration of the ejection device 300R. However, the configuration of the ejection device 300G is different from the configuration of the ejection device 300R in that the ejection device 300G includes a tank and a tube for the fluorescent material 311G instead of the tank 301R and the tube 310R. Similarly, the configuration of the ejection device 300B is different from the configuration of the ejection device 300R in that the ejection device 300B includes a tank and a tube for the fluorescent material 311B instead of the tank 301R and the tube 310R. Note that the liquid fluorescent materials 311R, 311B, and 311G in this embodiment are a kind of liquid light-emitting material, and are examples of the liquid material of the present invention.

  A method for manufacturing a plasma display device using the manufacturing apparatus 3 will be described. First, a plurality of address electrodes 54, a dielectric glass layer 56, and a partition wall 60 are formed on a support substrate 52 by a known screen printing technique to obtain a base body 50A shown in FIG.

  Next, the base 50A is made lyophilic by oxygen plasma treatment under atmospheric pressure. By this treatment, the surface of the partition wall 60 and the surface of the dielectric glass layer 56 in the respective recesses (a part of the pixel region) defined by the partition wall 60 and the dielectric glass layer 56 exhibit lyophilic properties. Becomes the discharged portions 58R, 58G, and 58B. Depending on the material, a surface having a desired lyophilic property may be obtained without performing the surface treatment as described above. In such a case, even if the surface treatment is not performed, the surfaces of the recesses defined by the partition wall 60 and the dielectric glass layer 56 are the discharged portions 58R, 58G, and 58B.

  The base 50A on which the discharged portions 58R, 58G, and 58B are formed is carried to the stage 106 of the discharge device 300R by the transfer device 370 and placed on the stage 106. Then, as illustrated in FIG. 21A, the ejection device 300R ejects the fluorescent material 311R from the head 114 so that the fluorescent material 311R layer is formed on the entire ejection target 58R. Specifically, the discharge device 300R applies the fluorescent material 311R to the discharged portion 58R by the discharge method described with reference to FIG. When the fluorescent material 311R layer is formed on all of the discharged portions 58R of the base body 50A, the transport device 370 positions the base body 50A in the drying device 350R. Then, the fluorescent material 311R on the discharged portion 58R is completely dried to obtain the fluorescent layer 311FR on the discharged portion 58R.

  Next, the transport device 370 positions the base body 50A on the stage 106 of the ejection device 300G. Then, as shown in FIG. 21B, the ejection device 300G ejects the fluorescent material 311G from the head 114 so that the fluorescent material 311G layer is formed on the entire ejection target 58G. Specifically, the ejection device 300G applies the fluorescent material 311G to the ejection target 58G by the ejection method described with reference to FIG. When the fluorescent material 311G layer is formed on all of the discharged portions 58G of the base body 50A, the transport device 370 positions the base body 50A in the drying device 350G. Then, the fluorescent material 311G on the discharged portion 58G is completely dried to obtain the fluorescent layer 311FG on the discharged portion 58G.

  Next, the transport device 370 positions the base body 50A on the stage 106 of the ejection device 300B. Then, as shown in FIG. 21C, the ejection device 300B ejects the fluorescent material 311B from the head 114 so that the fluorescent material 311B layer is formed on the entire ejection target 58B. Specifically, the discharge device 300B applies the fluorescent material 311B to the discharged portion 58B by the discharge method described with reference to FIG. When the fluorescent material B layer is formed on all of the discharged portions 58B of the base body 50A, the transport device 370 positions the base body 50A in the drying device 350B. Then, the fluorescent material 311B on the discharged portion 58B is completely dried to obtain the fluorescent layer 311FB on the discharged portion 58B.

  Through the above steps, the substrate 50A becomes the back substrate 50B of the plasma display device.

  Next, as shown in FIG. 22, the plasma display device 50 is obtained by bonding the back substrate 50B and the front substrate 50C together by a known method. The front substrate 50C is a dielectric glass formed so as to cover the glass substrate 68, the display electrode 66A and the display scan electrode 66B patterned in parallel with each other on the glass substrate 68, and the display electrode 66A and the display scan electrode 66B. A layer 64 and a MgO protective layer 62 formed on the dielectric glass layer 64. The back substrate 50B and the front substrate 50C are aligned so that the address electrodes 54 of the back substrate 50B and the display electrodes 66A and the display scan electrodes 66B of the front substrate 50C are orthogonal to each other. A discharge gas 69 is sealed at a predetermined pressure in a cell (pixel region) surrounded by each partition wall 60.

  The ejection device of the present embodiment can land two droplets at short time intervals at two landing positions adjacent to each other at a distance of the nozzle pitch GXP in the X-axis direction. Specifically, two droplets land in order on two adjacent landing positions at the shortest distance between the landing positions among the distances between the landing positions in the X-axis direction that can be set by the discharge device in one scanning period. To do. For this reason, the time for which the droplets are isolated with a minimum volume on the discharged portion is shortened. As a result, the droplets are not partially dried. In addition, the possibility that the landed droplet contacts the dried material is also reduced. Therefore, according to the ejection device of the present embodiment, a uniform layer of the fluorescent material can be formed on the ejection target portion. In addition, said minimum volume is corresponded to the volume (volume of fluorescent material) of one droplet discharged from a nozzle.

According to the present embodiment, in each of the ejection devices 300R, 300G, and 300B, the nozzle pitch in the X-axis direction of the head group 114G is 1 / N times the nozzle pitch in the X-axis direction of the head 114. Here, N is the number of heads 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the ejection devices 300R, 300G, and 300B is higher than the nozzle line density in the X-axis direction of the head alone. Therefore, the manufacturing apparatus 3 can apply the fluorescent material to the portions to be ejected of various sizes simply by changing the ejection data. Furthermore, the manufacturing apparatus 3 can manufacture plasma display devices having various pitches only by changing the ejection data.
[Example 5]

  Next, an example in which the present invention is applied to an apparatus for manufacturing an image display device including an electron-emitting device will be described.

  A substrate 70A shown in FIGS. 23A and 23B is a substrate that becomes an electron source substrate 70B of the image display device by processing by the manufacturing apparatus 3 (FIG. 24) described later. The base body 70A has a plurality of discharged portions 78 arranged in a matrix.

  Specifically, the base body 70A includes a base body 72, a sodium diffusion prevention layer 74 located on the base body 72, a plurality of element electrodes 76A and 76B located on the sodium diffusion prevention layer 74, and a plurality of element electrodes 76A. And a plurality of metal wirings 79B positioned on the plurality of element electrodes 76B. Each of the plurality of metal wirings 79A has a shape extending in the Y-axis direction. On the other hand, each of the plurality of metal wirings 79B has a shape extending in the X-axis direction. Since the insulating film 75 is formed between the metal wiring 79A and the metal wiring 79B, the metal wiring 79A and the metal wiring 79B are electrically insulated.

  A portion including the pair of element electrode 76A and element electrode 76B corresponds to one pixel region. The pair of element electrode 76A and element electrode 76B are opposed to each other on the sodium diffusion preventing layer 74 with a predetermined distance therebetween. The element electrode 76A corresponding to a certain pixel region is electrically connected to the corresponding metal wiring 79A. The element electrode 76B corresponding to the pixel region is electrically connected to the corresponding metal wiring 79B. In the present specification, a portion where the base 72 and the sodium diffusion preventing layer 74 are combined may be referred to as a support substrate.

  In each pixel region of the base body 70A, a part of the element electrode 76A, a part of the element electrode 76B, and the sodium diffusion prevention layer 74 exposed between the element electrode 76A and the element electrode 76B are discharged parts 78. Corresponding to More specifically, the discharged portion 78 is a region where the conductive thin film 411F (FIG. 26) is to be formed. The conductive thin film 411F includes a part of the element electrode 76A and a part of the element electrode 76B. , So as to cover the gap between the device electrodes 76A and 76B. As shown by a dotted line in FIG. 23B, the planar shape of the discharged portion 78 in the present embodiment is circular. As described above, the planar shape of the discharged portion of the present invention may be a circle determined by the X coordinate range and the Y coordinate range.

  The base 70A shown in FIG. 23B is located on a virtual plane parallel to both the X-axis direction and the Y-axis direction. The row direction and the column direction of the matrix formed by the plurality of discharged portions 78 are parallel to the X-axis direction and the Y-axis direction, respectively. That is, in the base body 70A, the plurality of discharged portions 78 are arranged in the X-axis direction and the Y-axis direction. Note that the X-axis direction and the Y-axis direction are orthogonal to each other.

  The interval LRY along the Y-axis direction between the discharged parts 78, that is, the pitch is approximately 190 μm. Further, the length of the discharged portion 78R in the X-axis direction (the length of the X coordinate range) is approximately 100 μm, and the length in the Y-axis direction (the length of the Y coordinate range) is also approximately 100 μm. The interval between the discharged portions 78 and the size of the discharged portions correspond to the interval and size of pixel regions in a high-definition television having a size of about 40 inches.

  The manufacturing apparatus 4 shown in FIG. 24 is an apparatus that discharges the conductive thin film material 411 to each of the discharged portions 78 of the base body 70A of FIG. Specifically, the manufacturing apparatus 4 includes a discharge device 400 that applies the conductive thin film material 411 to all of the discharged portions 78, and a drying device 450 that dries the conductive thin film material 411 on the discharged portions 78. I have. The manufacturing apparatus 4 further includes a transport device 470 that transports the base body 70A in the order of the discharge device 400 and the drying device 450.

  25 includes a tank 401 that holds a liquid conductive thin film material 411, a tube 410, and a discharge scanning unit 102 that is supplied with the conductive thin film material 411 from the tank 401R via the tube 410. Is provided. Since the description of the discharge scanning unit 102 has been described in the first embodiment, a description thereof will be omitted. In this embodiment, the liquid conductive thin film material 411 is an organic palladium solution. The liquid conductive thin film material 411 in this embodiment is an example of the liquid material of the present invention.

A method for manufacturing an image display apparatus using the manufacturing apparatus 4 will be described. First, a sodium diffusion prevention layer 74 containing SiO ₂ as a main component is formed on a base 72 made of soda glass or the like. Specifically, the sodium diffusion preventing layer 74 is obtained by forming a 1 μm thick SiO ₂ film on the substrate 72 by sputtering. Next, a titanium layer having a thickness of 5 nm is formed on the sodium diffusion preventing layer 74 by sputtering or vacuum deposition. Then, using the photolithography technique and the etching technique, a plurality of pairs of the element electrode 76A and the element electrode 76B that are located at a predetermined distance from the titanium layer are formed.

  Thereafter, using a screen printing technique, Ag paste is applied onto the sodium diffusion prevention layer 74 and the plurality of element electrodes 76A and baked, thereby forming a plurality of metal wirings 79A extending in the Y-axis direction. Next, the insulating film 75 is formed by applying a glass paste to a part of each metal wiring 79A and baking it using a screen printing technique. Then, a plurality of metal wirings 79B extending in the X-axis direction are formed by applying an Ag paste on the sodium diffusion preventing layer 74 and the plurality of element electrodes 76B and baking using a screen printing technique. When the metal wiring 79B is manufactured, an Ag paste is applied so that the metal wiring 79B intersects the metal wiring 79A with the insulating film 75 interposed therebetween. The base body 70A shown in FIG. 23 is obtained by the process as described above.

  Next, the substrate 70A is made lyophilic by oxygen plasma treatment under atmospheric pressure. By this treatment, a part of the surface of the element electrode 76A, a part of the surface of the element electrode 76B, and the surface of the support substrate exposed between the element electrode 76A and the element electrode 76B are made lyophilic. These surfaces become the discharged parts 78. Depending on the material, a surface having a desired lyophilic property may be obtained without performing the surface treatment as described above. In such a case, even if the surface treatment is not performed, a part of the surface of the element electrode 76A, a part of the surface of the element electrode 76B, and the sodium exposed between the element electrode 76A and the element electrode 76B. The surface of the diffusion preventing layer 74 becomes the discharged portion 78.

  The base body 70 </ b> A on which the portion to be ejected 78 is formed is transported to the stage 106 of the ejection device 400 by the transport device 470 and placed on the stage 106. 26, the discharge device 400 discharges the conductive thin film material 411 from the head 114 so that the conductive thin film 411F is formed on all of the discharged portions 78. Specifically, the discharge device 400 applies the conductive thin film material 411 to the discharged portion 78 by the discharge method described with reference to FIG. In the present embodiment, the control unit 112 gives a signal to the head 114 so that the diameter of the droplets of the conductive thin film material 411 landed on the discharged portion 78 is in the range of 60 μm to 80 μm. When the layer of the conductive thin film material 411 is formed on all of the discharged portions 78 of the base body 70A, the transfer device 470 positions the base body 70A in the drying device 450. Then, the conductive thin film material 411 on the discharged portion 78 is completely dried, so that the conductive thin film 411F containing palladium oxide as a main component is obtained on the discharged portion 78. As described above, in each pixel region, the conductivity covering a part of the element electrode 76A, a part of the element electrode 76B, and the sodium diffusion preventing layer 74 exposed between the element electrode 76A and the element electrode 76B. A thin film 411F is formed.

  Next, an electron emission portion 411D is formed in a part of the conductive thin film 411F by applying a predetermined pulse voltage between the element electrode 76A and the element electrode 76B. Note that it is preferable to apply a voltage between the element electrode 76A and the element electrode 76B under an organic atmosphere and under vacuum conditions, respectively. This is because the electron emission efficiency from the electron emission portion 411D is further increased. The element electrode 76A, the corresponding element electrode 76B, and the conductive thin film 411F provided with the electron emission portion 411D are electron emission elements. Each electron-emitting device corresponds to each pixel region.

  Through the above steps, the base body 70A becomes the electron source substrate 70B as shown in FIG.

  Next, as shown in FIG. 28, the electron source substrate 70B and the front substrate 70C are bonded together by a known method to obtain the image display device 70. The front substrate 70 </ b> C includes a glass substrate 82, a plurality of fluorescent portions 84 positioned in a matrix on the glass substrate 82, and a metal plate 86 that covers the plurality of fluorescent portions 84. The metal plate 86 functions as an electrode for accelerating the electron beam from the electron emission portion 411D. The electron source substrate 70B and the front substrate 70C are aligned such that each of the plurality of electron-emitting devices faces each of the plurality of fluorescent portions 84. Further, a vacuum state is maintained between the electron source substrate 70B and the front substrate 70C.

  Note that the image display device 70 including the above-described electron-emitting device may be referred to as SED (Surface-Conduction Electron-Emitter Display) or FED (Field Emission Display). In this specification, a liquid crystal display device, an electroluminescence display device, a plasma display device, an image display device using an electron-emitting device, and the like may be referred to as “electro-optical devices”. Here, the “electro-optical device” used in the present specification utilizes a change in optical characteristics (so-called electro-optical effect) such as a change in birefringence, a change in optical rotation, or a change in light scattering. The present invention is not limited to a device, and refers to any device that emits, transmits, or reflects light in response to application of a signal voltage.

  According to the present embodiment, in the ejection device 400, the nozzle pitch in the X-axis direction of the head group 114G is 1 / N times as long as the nozzle pitch in the X-axis direction of the head 114. Here, N is the number of heads 114 included in the head group 114G. For this reason, the nozzle line density in the X-axis direction of the ejection device 400 is higher than the nozzle line density in the X-axis direction of the single head. Therefore, the manufacturing apparatus 4 can apply the conductive thin film material to the parts to be ejected of various sizes only by changing the ejection data. Furthermore, the manufacturing apparatus 4 can manufacture electron source substrates with various pitches only by changing the ejection data.

FIG. 3 is a schematic diagram illustrating a discharge device according to the first embodiment. FIG. 3 is a schematic diagram illustrating a carriage according to the first exemplary embodiment. FIG. 3 is a schematic diagram illustrating a head of Example 1. (A) And (b) is a schematic diagram which shows the discharge part of the head of Example 1. FIG. FIG. 3 is a schematic diagram showing a relative positional relationship of heads in the head group of Embodiment 1. FIG. 3 is a schematic diagram illustrating a control unit according to the first embodiment. FIG. 4A is a schematic diagram illustrating a head driving unit according to the first exemplary embodiment, and FIG. (A) And (b) is a schematic diagram which shows the order of the discharge of the droplet from the head group of Example 1. FIG. FIG. 6 is a schematic diagram showing a base body of Example 2. FIG. 6 is a schematic diagram showing a manufacturing apparatus of Example 2. FIG. 6 is a schematic diagram illustrating a discharge device according to a second embodiment. FIG. 6 is a schematic diagram illustrating a discharge method according to a second embodiment. FIG. 6 is a schematic diagram showing a manufacturing method of Example 2. (A) And (b) is a schematic diagram which shows the base | substrate of Example 3. FIG. FIG. 6 is a schematic diagram showing a manufacturing apparatus of Example 3. FIG. 6 is a schematic diagram illustrating a discharge device according to a third embodiment. FIG. 6 is a schematic diagram showing a manufacturing method of Example 3. (A) And (b) is a schematic diagram which shows the base | substrate of Example 4. FIG. FIG. 6 is a schematic diagram showing a manufacturing apparatus of Example 4. FIG. 9 is a schematic diagram illustrating a discharge device according to a fourth embodiment. FIG. 6 is a schematic diagram showing a manufacturing method of Example 4. FIG. 6 is a schematic diagram showing a manufacturing method of Example 4. (A) And (b) is a schematic diagram which shows the base | substrate of Example 5. FIG. FIG. 6 is a schematic diagram showing a manufacturing apparatus of Example 5. FIG. 9 is a schematic diagram illustrating a discharge device according to a fifth embodiment. FIG. 6 is a schematic diagram showing a manufacturing method of Example 5. FIG. 6 is a schematic diagram showing a manufacturing method of Example 5. FIG. 6 is a schematic diagram showing a manufacturing method of Example 5. The schematic diagram which shows a scanning range.

Explanation of symbols

1, 2, 3, 4 ... manufacturing equipment, 1 A, 1 B, 2 A, 2 B, 3 A, 3 B, 4 A, 4 B ... discharge nozzle array, 10 A, 30 A, 50 A, 70 A: base, 100, 100 R, 100 G, 100 B, 100 C 200R, 200G, 200B, 300R, 300G, 300B, 400 ... discharge device, 102 ... discharge scanning unit, 103 ... carriage, 104 ... first position control device, 106 ... stage, 108 ... second position control device, 111 ... Liquid material, 111R / 111G / 111B: Color filter material, 114/1141/1142/1143/1144 ... Head, 112 ... Control unit, 114G ... Head group, 116A / 116B ... Nozzle array, 118 ... Nozzle, 118R ... Standard Nozzle, 124 ... vibrator, 124C ... piezo element, 124A / 124B ... electrode, 127 ... discharge 208, head drive unit, 203 ... drive signal generation unit, AS ... analog switch, DS ... drive signal, 204 ... processing unit, SC ... selection signal, ES ... discharge signal, 10A / 30A / 50A, 70A ... base body DESCRIPTION OF SYMBOLS 10 ... Color filter board | substrate, 18R * 18G * 18B * 38R * 38G * 38B * 58R * 58G * 58B * 78 ... to-be-discharged part, 111FR * 111FG * 111FB ... filter layer, 134 ... scanning range, 30 ... electroluminescence display device 50B ... Back substrate of plasma display device, 50 ... Plasma display device

Claims (9)

Stage,
N heads that are relatively movable in the Y-axis direction with respect to the stage, and N heads that are adjacent in the Y-axis direction;
A discharge device comprising:
Each of the N heads has a plurality of discharge nozzle rows extending in the X-axis direction orthogonal to the Y-axis direction and adjacent to the Y-axis direction,
The N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads is the first length,
The first head and the second head are any two adjacent to the Y-axis direction among the N heads,
The position of the discharge nozzle row located closest to the second head in the first head is relative to the position of the discharge nozzle row located closest to the first head in the second head. Shifted in the X-axis direction by the first length,
N is a natural number of 2 or more.
Discharge device. The discharge device according to claim 1,
The plurality of ejection nozzle rows are arranged in each of the N heads such that the nozzle pitch in the X-axis direction of each of the N heads becomes the second length,
The first length is approximately 1 / N times the second length;
Discharge device. The discharge device according to claim 1,
The plurality of discharge nozzle rows include a first discharge nozzle row and a second discharge nozzle row.
Discharge device. The discharge device according to claim 3, wherein
In each of the first discharge nozzle row and the second discharge nozzle row, a plurality of discharge nozzles are arranged in the X-axis direction at a pitch substantially twice the second length,
The X coordinate of the first nozzle of the first discharge nozzle row and the X coordinate of the first nozzle of the second discharge nozzle row are substantially shifted by the second length.
Discharge device. An ejection apparatus including N heads adjacent to each other in the Y-axis direction, wherein the N heads include a plurality of ejection nozzle rows extending in the X-axis direction perpendicular to the Y-axis direction and adjacent to the Y-axis direction. Of the liquid material using the ejection device in which the N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads has the first length. Application method comprising:
(A) placing a substrate having an ejected portion on a stage;
The position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. A step (B) of shifting the N heads relative to the substrate in the Y-axis direction after shifting the length by 1 in the X-axis direction, wherein the first head and the second head Step (B), which is any two of the N heads adjacent to each other in the Y-axis direction,
When the discharge nozzles included in the plurality of discharge nozzle rows enter the region corresponding to the discharge target portion in the step (B), a liquid material is discharged from the discharge nozzle to the discharge target portion. Step (C), and
N is a natural number of 2 or more.
Application method of liquid material. An ejection apparatus including N heads adjacent to each other in the Y-axis direction, wherein the N heads include a plurality of ejection nozzle rows extending in the X-axis direction perpendicular to the Y-axis direction and adjacent to the Y-axis direction. Of the color filter substrate using the ejection device in which the N heads are arranged such that the nozzle pitch in the X-axis direction of the entire N heads has the first length. A manufacturing method comprising:
(A) placing a substrate having an ejected portion on a stage;
The position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. A step (B) of shifting the N heads relative to the substrate in the Y-axis direction after shifting the length by 1 in the X-axis direction, wherein the first head and the second head Step (B), which is any two of the N heads adjacent to each other in the Y-axis direction,
When the discharge nozzles included in the plurality of discharge nozzle rows enter the region corresponding to the discharge target portion by the step (B), a liquid color filter material is applied from the discharge nozzle to the discharge target portion. Discharging (C), and
N is a natural number of 2 or more.
A method for manufacturing a color filter substrate. An ejection apparatus including N heads adjacent to each other in the Y-axis direction, wherein the N heads include a plurality of ejection nozzle rows extending in the X-axis direction perpendicular to the Y-axis direction and adjacent to the Y-axis direction. Of the electroluminescence display device using the ejection device in which the N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads has a first length. A manufacturing method comprising:
(A) placing a substrate having an ejected portion on a stage;
The position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. A step (B) of shifting the N heads relative to the substrate in the Y-axis direction after shifting the length by 1 in the X-axis direction, wherein the first head and the second head Step (B), which is any two of the N heads adjacent to each other in the Y-axis direction,
When the discharge nozzles included in the plurality of discharge nozzle rows enter the region corresponding to the discharge target portion in the step (B), a liquid luminescent material is discharged from the discharge nozzle to the discharge target portion. And (C)
N is a natural number of 2 or more.
A method for manufacturing an electroluminescence display device. An ejection apparatus including N heads adjacent to each other in the Y-axis direction, wherein the N heads include a plurality of ejection nozzle rows extending in the X-axis direction perpendicular to the Y-axis direction and adjacent to the Y-axis direction. Of the plasma display device using the discharge device in which the N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads has a first length. A manufacturing method comprising:
(A) placing a substrate having an ejected portion on a stage;
The position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. A step (B) of shifting the N heads relative to the substrate in the Y-axis direction after shifting the length by 1 in the X-axis direction, wherein the first head and the second head Step (B), which is any two of the N heads adjacent to each other in the Y-axis direction,
When the discharge nozzles included in the plurality of discharge nozzle rows have entered the region corresponding to the discharge target portion by the step (B), a liquid fluorescent material is discharged from the discharge nozzle to the discharge target portion. And (C)
N is a natural number of 2 or more.
A method for manufacturing a plasma display device. An ejection apparatus including N heads adjacent to each other in the Y-axis direction, wherein the N heads include a plurality of ejection nozzle rows extending in the X-axis direction perpendicular to the Y-axis direction and adjacent to the Y-axis direction. And a discharge manufacturing apparatus using the ejection device in which the N heads are arranged so that the nozzle pitch in the X-axis direction of the entire N heads has a first length. There,
(A) placing a substrate having an ejected portion on a stage;
The position of the discharge nozzle row located closest to the second head in the first head is set to the position of the discharge nozzle row located closest to the first head in the second head. A step (B) of shifting the N heads relative to the substrate in the Y-axis direction after shifting the length by 1 in the X-axis direction, wherein the first head and the second head Step (B), which is any two of the N heads adjacent to each other in the Y-axis direction,
When the discharge nozzles included in the plurality of discharge nozzle rows enter the region corresponding to the discharge target portion in the step (B), liquid wiring material is discharged from the discharge nozzle to the discharge target portion. And (C)
N is a natural number of 2 or more.
Wiring manufacturing method.

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