JP2005116803A - Airtightness testing method for electronic part and system therefor, and electronic part manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an airtightness testing method for a small and thin electronic part and a system for use with the method, and to provide an electronic part manufacturing method. <P>SOLUTION: For testing the airtightness of an electronic part 3 having a very small cavity 24 surrounding an element 22, the electronic part 3 is placed in a sealable container 11, the container 11 is evacuated for a pressure drop, a gaseous testing medium is injected into the container 11, the temperature of the electronic part 3 is lowered until the testing medium turns liquid, and the pressure inside the container 11 is returned to the atmospheric pressure. The airtightness test is conducted by inspecting the change in functional characteristics of the element 22 to occur reflecting the presence of the testing medium in its liquid state in the cavity 24 of the electronic part 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for inspecting the airtightness of an electronic component having a hollow portion, an apparatus used therefor, and a method for manufacturing such an electronic component, and more particularly, a method for inspecting the airtightness of a small and thin electronic component, and The present invention relates to an apparatus used for this and a method for manufacturing such an electronic component.

  Among electronic components used in CD players, mobile phones, etc., for example, elements used in SAW (surface acoustic wave) devices may change their electrical functional characteristics when the surface is exposed to moisture. is there. Therefore, after such an element is placed on the substrate, the element and the surface of the substrate are covered with a lid member, and a hollow portion formed between the lid member, the element, and the substrate is filled with an inert gas such as nitrogen. The lid member is soldered to the substrate and hermetically sealed so that the element does not come into contact with moisture. Here, from the viewpoint of maintaining the performance of the electronic component, it is important that the airtightness of the hollow portion, that is, the lid member and the substrate are joined without a gap.

As a conventional method for inspecting the airtightness of an electronic component, for example, there is a method disclosed in Patent Document 1. That is, the completed electronic component is placed in a vacuum vessel, and the vacuum vessel is evacuated with a pump. At this time, for the defective product having a gap between the lid member and the substrate, the inert gas filled in the hollow portion is discharged together with the air in the vacuum container.
Next, helium gas is injected into the vacuum vessel. At this time, in the case of a defective product, helium gas flows into the hollow portion. Finally, helium gas is discharged from the vacuum vessel. Then, helium gas is detected using a detector called a helium gas counter within a predetermined degree of vacuum. In the case of a defective product, helium gas remains in the hollow portion, so that helium gas is detected. Thereby, the non-defective product and the defective product of the electronic component are inspected.
JP 2000-236046 A

  However, as electronic components have become smaller and thinner with the recent improvements in integration technology, it has become difficult to inspect hermeticity with such conventional inspection methods. That is, as the electronic component to be inspected becomes smaller and thinner, the space volume of the hollow portion becomes smaller, so that the amount of helium gas that can flow into the hollow portion is reduced. As a result, when helium gas is discharged from the vacuum vessel, all of the helium gas that has flowed into the hollow portion flows out together, and there is a problem that helium gas in the hollow portion cannot be detected. Even if helium gas does not flow out, the helium gas counter requires a certain amount of gas in order to react to helium gas, so if the space volume of the hollow portion is small, it flows into the hollow portion. There was a problem that the helium gas counter did not react with the amount of helium gas. In addition, due to this difficulty in detecting helium gas, it is necessary to place electronic components one by one in the vacuum container and inspect when the space volume of the hollow part is small in the conventional inspection method. The inspection cost was high.

  The present invention has been made in view of the above problems, and an object thereof is to provide an inspection method capable of inspecting airtightness of a small and thin electronic component, an apparatus used therefor, and an electronic component manufacturing method. To do.

  In order to solve the above problems, the present invention is a method for inspecting the airtightness of an electronic component having a minute hollow portion around an element, wherein the electronic component is disposed in a sealable container, After the gas is discharged and the atmospheric pressure is lowered, a gaseous inspection medium is injected into the container, the temperature of the electronic component is lowered to a temperature at which the inspection medium liquefies, and the atmospheric pressure in the container is changed to atmospheric pressure. After returning, the airtightness is inspected by the difference in the functional characteristics of the element caused by the presence or absence of the inspection medium in the liquid state in the hollow part of the electronic component.

  Further, according to the present invention, the element of the electronic component has a difference in resistance value, capacity, or resonance frequency depending on whether or not the liquid inspection medium is attached, and the difference in resistance value, capacity, or resonance frequency of the element. It is characterized by inspecting the airtightness of the electronic component by comparing the difference in the generated functional characteristics.

  Further, the present invention is characterized in that after the temperature of the electronic component is lowered to a temperature at which the inspection medium is liquefied, the gas in the container is replaced with air or nitrogen.

  Further, the present invention is characterized in that after the gas in the container is replaced with air or nitrogen, the external surface of the electronic component is heated and dried.

  Further, the present invention is a method for inspecting the airtightness of an electronic component having a minute hollow portion around an element, wherein the electronic component is disposed in a sealable container, and the gas in the container is discharged to generate an atmospheric pressure. The test medium in a liquid state is injected into the container, the electronic component is immersed in the test medium, the test medium in the container is discharged, and the atmospheric pressure in the container is returned to atmospheric pressure. After that, the airtightness is inspected by the difference in the functional characteristics of the element resulting from the presence or absence of the inspection medium in the hollow part of the electronic component.

  Further, according to the present invention, the element of the electronic component has a difference in resistance value, capacity, or resonance frequency depending on whether or not the inspection medium is attached, and a functional characteristic resulting from a difference in resistance value, capacity, or resonance frequency of the element. By comparing these differences, the airtightness of the electronic component is inspected.

  In the present invention, the inside of the container is replaced with air or nitrogen when the inspection medium is discharged from the inside of the container.

  The present invention is also characterized in that after the inside of the container is replaced with air or nitrogen, the outer surface of the electronic component is heated and dried.

  Further, the present invention is characterized in that the main component of the inspection medium is any of hydrocarbons, alcohols, fluorine-based media, and organic chlorine-based media.

  The present invention also relates to a method of manufacturing an electronic component having a minute hollow portion around an element, wherein the element is arranged on a substrate, or the element is arranged on the substrate, and the element is covered with a cover member so as to be hollow. Forming a portion, filling the hollow portion with an inert gas and hermetically sealing it to make a device to be inspected, placing the device to be inspected in a sealable container, and discharging the gas in the container to reduce the atmospheric pressure. Thereafter, a test medium in a gaseous state is injected into the container, the temperature of the object to be inspected is lowered to a temperature at which the inspection medium is liquefied, and the air pressure in the container is returned to the atmospheric pressure. The airtightness is inspected based on the difference in the functional characteristics of the element caused by the presence or absence of the above-described inspection medium in the liquid state in the hollow portion, and the completed electronic component is obtained as a good inspection.

  The present invention is also an inspection apparatus for inspecting the airtightness of an electronic component having a minute hollow portion around an element, and is a container that can be sealed and temperature-adjusted and in which the electronic component can be disposed. A pump connected to the container; a test medium supply unit connected to the container for supplying a gaseous test medium into the container; a measuring unit for measuring functional characteristics of the element of the electronic component; and the container It has a control unit that controls and controls the pump, the inspection medium supply unit, and the measurement unit as well as measuring and controlling the temperature and pressure inside, and the control unit is in a state where the electronic component is arranged in the container, Operate the pump to discharge the gas in the container to lower the atmospheric pressure, operate the inspection medium supply unit after the inside of the container reaches a predetermined atmospheric pressure, and inject the inspection medium into the container, The temperature in the container is changed to the inspection medium. Is lowered to the temperature at which the liquid is liquefied, and the atmospheric pressure in the container is returned to atmospheric pressure, and then the measurement unit is operated to measure the functional characteristics of the element of the electronic component, and the liquid inspection medium in the hollow part is measured. It is characterized in that the airtightness is inspected based on the difference in the functional characteristics of the element resulting from the presence or absence.

  Further, the present invention is characterized in that the control unit measures the functional characteristics of the element of the electronic component by the measurement unit outside the container.

  Further, the present invention is characterized in that the control unit measures the functional characteristics of the element of the electronic component by the measurement unit in the container.

  According to the present invention, even in a small and thin electronic component having a small space volume in the hollow portion, the liquid state inspection medium reliably remains in the hollow portion, so that it is possible to reliably perform the airtightness inspection. . Further, even if a small amount of the inspection medium remains in the hollow portion, if the inspection medium adheres to the element, the functional characteristics are surely affected, so that the airtightness inspection can be surely performed. Furthermore, since the airtightness is inspected by measuring the functional characteristics of the electronic components, a plurality of electronic components can be inspected at a time.

  Further, according to the present invention, since the gas in the container is replaced with air after the inspection medium is liquefied, the surface of the electronic component can be dried, and the airtightness inspection of the electronic component can be accurately performed.

  Further, according to the present invention, since the electronic component is heated and dried, the external surface is surely dried, and the airtightness of the electronic component can be more accurately inspected.

  Further, according to the present invention, by using hydrocarbons or the like as an inspection medium, it is possible to perform an airtight inspection without affecting the surface of the electronic component or the terminal. Moreover, since the permeability is good, it easily flows into the hollow portion. Further, since it is stable and liquid at normal temperature and pressure, the airtightness test can be performed under normal temperature and pressure.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a first embodiment will be described. FIG. 1 is a schematic view of an inspection apparatus according to the first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of an electronic component according to the first embodiment of the present invention.
As shown in FIG. 1, an inspection apparatus 1 used for inspecting the airtightness of an electronic component 3 has a chamber 11 which is a container that can be sealed and in which the electronic component 3 can be placed. The chamber 11 has heating / cooling means such as a heater and a cooler. A pump 12 is connected to the chamber 11 via a valve 12a. Further, a mixer 13 is connected to the chamber 11 via a valve 13a, and an inspection medium cylinder 14 and a stable gas cylinder 15 are connected to the mixer 13 via valves 14a and 15a, respectively. The mixer 13 includes a mixing unit such as a fan and a heating unit such as a heater. The inspection apparatus 1 has a measuring instrument (not shown) outside the inspection apparatus 1. The measuring instrument measures the electrical functional characteristics of the electronic component 3.

In the inspection medium cylinder 14, an inspection medium used for the airtightness inspection of the electrical component 2 is stored in a liquid state. Properties desired for this inspection medium include: 1. It does not affect the external surface and terminals of the electronic component 3. 2. Good permeability and stable liquid state at inspection temperature and atmospheric pressure (preferably normal temperature and normal pressure). The vaporization temperature is not less than the inspection temperature (preferably normal temperature) and not more than the melting temperature of solder (approximately 200 to 250 ° C.). Specific media satisfying this property include media mainly composed of hydrocarbons such as toluene, alcohols such as isopropyl alcohol, fluorine-based liquids such as hydrogen fluoride, and organic chlorine-based liquids. More specifically, there may be mentioned fluorinate which is a fluorine-based inert liquid. The inspection medium may be stored in the inspection medium cylinder 14 in a gas state.
On the other hand, an inert stable gas such as nitrogen is stored in the stable gas cylinder 15.

The electronic component 3 that performs the airtightness inspection with the inspection apparatus 1 is such that, for example, an SAW device or the like changes the electrical functional characteristics when the surface of the element is exposed to moisture. As shown in FIG. 2, the electronic component 3 is configured by disposing an element 22 on a substrate 21 and attaching a lid member 23 to the substrate 21 so as to cover the element 22. The hollow portion 24 formed between the lid member 23 and the substrate 21 and the element 22 is filled with an inert gas such as nitrogen, and the lid member 23 is soldered to the substrate 21 to hermetically seal the hollow portion 24. To do. This is to prevent the element 22 from being exposed to moisture. In the inspection apparatus 1, the airtightness of the hollow portion 24, that is, whether the lid member 23 is attached to the substrate 21 without a gap is inspected. What has a gap does not maintain airtightness and becomes a defective product. As a standard of the airtightness of the electronic component 3, it is sufficient that the airtightness of about 1 × 10 ^{−8 to} 5 × 10 ⁻⁸ atm · cc / sec is maintained.
Here, in the manufacturing stage of the electronic component 3, the hollow portion 24 is filled with the inert gas. However, by attaching the lid member 23 to the substrate 21 in the space filled with the inert gas, the hollow portion 24 is filled. 24 can be filled with an inert gas, which eliminates the need for a filling process.
In addition, the electronic component 3 to be inspected is not limited to the one having such a configuration, and any electronic component having an airtight hollow portion such as an airtight hollow portion between the substrate and the element can be used. Any configuration can be tested.

  Next, an airtightness inspection method for the electronic component 3 using the inspection apparatus 1 will be described. First, the electronic component 3 that is an object to be inspected is placed in the chamber 11. Then, the valve 12a is opened and the pump 12 is operated to discharge the air in the chamber 11. At this time, if there is a gap between the substrate 21 and the lid member 23 of the electronic component 3 and the airtightness of the hollow portion 24 is not maintained, the inert gas filled in the hollow portion 24 is discharged together. The

  After the air in the chamber 11 is exhausted and the air pressure in the chamber 11 is sufficiently lowered, the pump 12 is stopped and the valve 12a is closed, and the valves 14a and 15a of the inspection medium cylinder 14 and the stable gas cylinder 15 are opened. The mixer 13 is activated. In the mixer 13, the inspection medium and the stable gas that flow in are mixed while being heated to create an air-fuel mixture. At this time, the inspection medium is vaporized by heating, and the flow rates of the inspection medium and the stable gas are adjusted in the valves 14a and 15a so that the inspection medium is saturated with respect to the stable gas. In this way, an air-fuel mixture in which the inspection medium is saturated is generated in the stable gas.

  Then, the air-fuel mixture generated by opening the valve 13 a is caused to flow into the chamber 11. At this time, if there is a gap between the substrate 21 of the electronic component 3 arranged in the chamber 11 and the lid member 23 and the airtightness of the hollow portion 24 is not maintained, the hollow portion 24 from which the inert gas has been discharged is provided. The air-fuel mixture flows into the. The inflow of the air-fuel mixture into the hollow portion 24 becomes more reliable when pressure or heat is applied to the air-fuel mixture.

After the air-fuel mixture flows into the chamber 11, the temperature in the chamber 11 is lowered to a temperature at which the inspection medium liquefies. Thereby, if the air-fuel mixture flows into the hollow part 24 of the electronic component 3, the liquefied inspection medium adheres to the element 22.
When the temperature in the chamber 11 is lowered to a predetermined temperature, the valve 14a of the inspection medium cylinder 14 is closed, and the air-fuel mixture in the chamber 11 is gradually replaced with a stable gas. Alternatively, the air-fuel mixture is gradually replaced with air by operating the pump 12. Thereby, while returning the atmospheric pressure in the chamber 11 to atmospheric pressure, the external surface of the electronic component 3 can be dried. In addition, after the replacement of the gas in the chamber 11 is finished, if the liquefied inspection medium is still attached to the outer surface of the electronic component 3, the electronic component 3 is heated for a short time to dry the outer surface.

  When the replacement of the gas in the chamber 11 is completed, the electronic component 3 is taken out of the chamber 11 and the electrical functional characteristics of the element 22 of the electronic component 3 are measured by a measuring instrument. The functional characteristics to be measured vary depending on the electronic component 3. For example, in the case of a SAW device, the resonance frequency is a measurement item. When the airtightness of the hollow portion 24 of the electronic component 3 is not maintained and a liquefied inspection medium is attached to the surface of the element 22, the resistance value, capacitance, and resonance frequency of the element 22 are affected by the inspection medium. Etc. change. From this, the airtightness of the hollow portion 24 is maintained by comparing the representative value of the measurement item of the electronic component 3 that is kept airtight and the value of the measurement item of the electronic component 3 that is the object of inspection. It is possible to find an electronic component 3 that is not leaning.

  According to such an inspection method, even if it is a small and thin electronic component having a small space volume in the hollow portion 24, the inspection medium reliably remains in the hollow portion 24, so that the airtightness inspection is surely performed. Is possible. Further, even if a small amount of the inspection medium remains in the hollow portion 24, if the inspection medium adheres to the element 22, the functional characteristics are surely affected, so that the airtightness inspection can be reliably performed. . Furthermore, since the airtightness is inspected by measuring the functional characteristics of the electronic component 3, a plurality of electronic components 3 can be inspected at a time.

In the present embodiment, the test medium is mixed with a stable gas such as nitrogen to generate an air-fuel mixture. However, the air-fuel mixture is mixed with air and the test medium to saturate the test medium with air. You may make it produce | generate. Alternatively, only the pure inspection medium may be allowed to flow into the chamber 11 without being mixed with the stable gas.
In the present embodiment, the inspection medium is vaporized in the mixer 13, but the liquid inspection medium may be heated and vaporized in the chamber 11. Further, although the description here is based on the assumption that each operation is performed by a human, the inspection apparatus 1 is provided with a control unit to measure and control the temperature and pressure in the chamber 11, as well as the pump 12, the mixer 13, and each cylinder. 14, 15 may control the measuring instrument to automate each operation. Furthermore, although the inspection apparatus 1 has a measuring instrument outside the chamber 11 here, the electronic component 3 is arranged on the measuring instrument as a configuration having the measuring instrument in the chamber 11. The functional characteristics of the electronic component 3 may be measured in the inside.

  The first embodiment of the present invention has been described above. In the first embodiment, the inspection medium is vaporized and used. However, it is possible to inspect the airtightness of electronic components even with a liquid inspection medium. Hereinafter, a second embodiment using a liquid inspection medium will be described. FIG. 3 is a schematic view of an inspection apparatus according to the second embodiment of the present invention.

As shown in FIG. 3, the inspection apparatus 2 used in the present embodiment has substantially the same configuration as the inspection apparatus 2 used in the first embodiment. However, in the present embodiment, since it is not necessary to mix the inspection medium and the stable gas, the mixer 13 and the stable gas cylinder 15 are not included in the configuration of the inspection apparatus 2. An inspection medium cylinder 14 containing a liquid inspection medium is directly connected to the chamber 11.
Since the electronic component 3 to be inspected is the same as that in the first embodiment, description thereof is omitted.

  Hereinafter, a method for inspecting the airtightness of the electronic component 3 in the present embodiment will be described. First, the completed electronic component 3 is placed in the chamber 11. Then, the valve 12a is opened and the pump 12 is operated to discharge the air in the chamber 11. At this time, if there is a gap between the substrate 21 and the lid member 23 of the electronic component 3, the inert gas filled in the hollow portion 24 is discharged together.

  After the air in the chamber 11 is exhausted and the air pressure in the chamber 11 is sufficiently lowered, the pump 12 is stopped, the valve 12a is closed, the valve 14a of the inspection medium cylinder 14 is opened, and the liquid inspection medium is placed in the chamber. 11 is injected. The inspection medium is injected until the electronic component 3 is completely immersed. At this time, if there is a gap between the substrate 21 of the electronic component 3 and the lid member 23, the inspection medium flows into the hollow portion 24 from which the inert gas has been discharged. The inflow of the inspection medium into the hollow portion 24 becomes more reliable when pressure or heat is applied to the inspection medium.

  Next, the inspection medium in the chamber 11 is discharged, gradually replaced with air, and the inside of the chamber 11 is returned to atmospheric pressure. After the inspection medium in the chamber 11 is discharged, if the external surface of the electronic component 3 is wet with the inspection medium, the electronic component 3 is heated for a short time to dry the external surface.

  When the inside of the chamber 11 is replaced with air, the electrical functional characteristics of the element 22 of the electronic component 3 are measured by the measuring instrument as in the first embodiment. When the airtightness of the hollow part 24 of the electronic component 3 is not maintained and the inspection medium flows into the hollow part 24 and adheres to the surface of the element 22, the resistance value of the element 22 is affected by the influence of the inspection medium. , Capacitance, resonance frequency, etc. change. From this, the airtightness of the hollow portion 24 is maintained by comparing the representative value of the measurement item of the electronic component 3 that is kept airtight and the value of the measurement item of the electronic component 3 that is the object of inspection. It is possible to find an electronic component 3 that is not leaning.

  The embodiment of the present invention has been described above. The above-described inspection of the electronic component 3 is usually performed as a final stage process of manufacturing the electronic component 3.

It is a schematic diagram of an inspection device in a first embodiment of the present invention. It is a schematic sectional drawing of the electronic component in 1st embodiment of this invention. It is the schematic of the inspection apparatus in 2nd embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 2 Inspection apparatus 3 Electronic component 11 Chamber 12 Pump 13 Mixer 14 Inspection medium cylinder 15 Stable gas cylinder 21 Board | substrate 22 Element 23 Lid member 24 Hollow part

Claims (13)

A method for inspecting the airtightness of an electronic component having a minute hollow portion around an element,
After placing the electronic component in a sealable container and discharging the gas in the container to lower the atmospheric pressure, the test medium in a gaseous state is injected into the container, and the electrons are heated to a temperature at which the test medium liquefies. Reduce the temperature of the parts,
After the atmospheric pressure in the container is returned to atmospheric pressure, airtightness is inspected by the difference in functional characteristics of the element resulting from the presence or absence of the inspection medium in a liquid state in the hollow part of the electronic component. Airtightness inspection method.   The element of the electronic component has a difference in resistance value, capacity, or resonance frequency depending on whether or not the liquid inspection medium is attached, and a difference in functional characteristics caused by a difference in resistance value, capacity, or resonance frequency of the element. 2. The method for inspecting the airtightness of the electronic component according to claim 1, wherein the airtightness of the electronic component is inspected by comparing the above.   3. The method for airtightness inspection of an electronic component according to claim 1 or 2, wherein after the temperature of the electronic component is lowered to a temperature at which the inspection medium is liquefied, the gas in the container is replaced with air or nitrogen. .   4. The method of claim 3, wherein after the gas in the container is replaced with air or nitrogen, the outer surface of the electronic component is heated and dried. A method for inspecting the airtightness of an electronic component having a minute hollow portion around an element,
After placing the electronic component in a sealable container and discharging the gas in the container to lower the atmospheric pressure, a liquid inspection medium is injected into the container to immerse the electronic component in the inspection medium. After that, discharge the inspection medium in the container,
After returning the atmospheric pressure in the container to atmospheric pressure, the airtightness inspection of the electronic component is characterized by inspecting the airtightness by the difference in functional characteristics of the element resulting from the presence or absence of the inspection medium in the hollow part of the electronic component Method.   The element of the electronic component has a difference in resistance value, capacitance, or resonance frequency depending on whether or not the inspection medium is attached, and the difference in functional characteristics resulting from the difference in resistance value, capacitance, or resonance frequency of the element is compared. 6. The method of inspecting the airtightness of the electronic component according to claim 5, wherein the airtightness of the electronic component is inspected.   7. The method for airtightness inspection of an electronic component according to claim 5, wherein when the inspection medium is discharged from the container, the inside of the container is replaced with air or nitrogen.   8. The method for airtightness inspection of an electronic component according to claim 7, wherein after the inside of the container is replaced with air or nitrogen, the outer surface of the electronic component is heated and dried.   9. The airtightness inspection of an electronic component according to claim 1, wherein a main component of the inspection medium is any one of hydrocarbons, alcohol, a fluorine-based medium, and an organic chlorine-based medium. Method. A method of manufacturing an electronic component having a minute hollow portion around an element,
An element is arranged on the substrate, or an element is arranged on the substrate, and a cover member is placed on the element to form a hollow portion, and the hollow portion is filled with an inert gas and hermetically sealed to form an object to be inspected.
After the object to be inspected is placed in a sealable container and the gas in the container is discharged to lower the atmospheric pressure, the gaseous inspection medium is injected into the container, and the temperature of the inspection medium is liquefied. Lower the temperature of the object under test,
After returning the atmospheric pressure in the container to atmospheric pressure, the airtightness is inspected by the difference in the functional characteristics of the element caused by the presence or absence of the inspection medium in the liquid state in the hollow portion of the object to be inspected, and a good inspection is completed. A method for manufacturing an electronic component, characterized in that the electronic component is made. An inspection apparatus for inspecting the air tightness of an electronic component having a minute hollow portion around an element,
A container that can be sealed and temperature-adjustable, and in which the electronic component can be placed, a pump connected to the container, and an inspection medium that is connected to the container and supplies a gaseous inspection medium into the container A supply unit, a measurement unit that measures the functional characteristics of the element of the electronic component, and a control unit that measures and controls the temperature and pressure in the container and controls the pump, the inspection medium supply unit, and the measurement unit. And
The control unit operates the pump in a state where the electronic component is disposed in the container to discharge the gas in the container to reduce the atmospheric pressure, and after the inside of the container has reached a predetermined atmospheric pressure. The inspection medium supply unit is operated to inject the inspection medium into the container, the temperature in the container is lowered to a temperature at which the inspection medium is liquefied, and the atmospheric pressure in the container is returned to atmospheric pressure, An inspection characterized by operating the measurement unit to measure the functional characteristics of the element of the electronic component and inspecting the airtightness by the difference in the functional characteristic of the element resulting from the presence or absence of the inspection medium in the liquid state in the hollow part apparatus.   The inspection apparatus according to claim 11, wherein the control unit measures a functional characteristic of an element of the electronic component by the measurement unit outside the container.   12. The inspection apparatus according to claim 11, wherein the control unit measures functional characteristics of the element of the electronic component in the container by the measurement unit.

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