JP2005101576A - Parts verification method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component collating method for a component mounter capable of collating components with little effort.
A component collating method for a component mounting machine 100 capable of collating components with less effort includes a position specifying step S12A for specifying a mounting position of a component tape mounted on the component mounting machine 100, and a component tape or reel. A reading step S13 for reading the component information from the IC tag 426b attached to 426, the component information and the mounting position, the component array in which the component to be mounted on the board and the position to which the component tape should be mounted are defined. A collation step S14 for collating the data.
[Selection] FIG.

Description

  The present invention relates to a component verification method for mounting an electronic component by a component mounter, and more particularly to a component verification method using an IC (Integrated Circuit) tag.

  In a component mounter that mounts electronic components on a substrate such as a printed circuit board, it is necessary to check whether or not the component mounted on the component cassette is correct before mounting. Some conventional component mounting machines collate components using information such as the name and number of components represented by barcodes (see, for example, Patent Document 1).

  The bar code is attached to a reel around which a component tape is wound. Prior to the collation of the parts, the barcode information is read by the barcode reader and then written into the memory. The memory is provided in a component cassette to which a reel is mounted. In this way, when the component mounting is started, the memory of the component cassette is scanned with the memory reader, so that the component verification can be automatically performed and a component cassette setting error can be found.

Here, the “component tape” is a plurality of components of the same component type arranged on a tape (carrier tape), and is supplied in a state of being wound around a reel (supply reel) or the like. It is mainly used to supply a relatively small size component called a chip component to a component mounter. A part supplied by the part tape is called a taping part.
Japanese Patent No. 2932670

  However, in the conventional component mounting machine, it is necessary to transfer the barcode information to the memory of the component cassette for each tape of the component type to be used prior to component verification, which is troublesome. There's a problem. Generally, since there are 20 to 50 types of component tapes used in one component mounting machine, and more than 100 types in many cases, the operator transfers all the component tapes to the memory of the component cassette. Work must be done.

  In addition, in order to perform component verification, the memory is stored in the memory by moving the memory to the vicinity of the reading unit of the component mounting machine at the start of mounting or by moving the reading unit and scanning the memory of each component cassette. Must read the information. For this reason, there is a problem that a time for performing the component collating operation is required and an operation loss occurs. At the same time, there is a problem that it is not possible to find an error in placing the parts before the scanning operation of the reading unit, that is, the equipment is operated.

  Furthermore, in the conventional component mounter, a component library must be created in advance, which causes a problem of creating a component library. The component library is a collection of information (component name, component size, component color, component shape, etc.) for all component types that can be handled by the component mounter. If the above information does not exist, the component mounter cannot perform the component mounting operation.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a component verification method for a component mounter that can verify components with less effort.
It is another object of the present invention to provide a component verification method for a component mounter that has a low operating loss during component mounting.

  It is another object of the present invention to provide a component library creation method for a component mounter that does not require the effort of creating a component library.

  In order to achieve the above object, the component collation method of the present invention includes a component taken out by a component mounter from a component holder that holds a plurality of components, and a component to be mounted on a board by the component mounter. A method for collating parts using a computer, wherein the parts holder is provided with an IC (Integrated Circuit) tag storing identification information for identifying the parts held by the parts holder. The component collating method is attached to the component mounter in a state where the component verification method includes a position specifying step for specifying the mounting position of the component holder mounted on the component mounter, and the component holder. A reading step for reading the identification information from the read IC tag, the identification information read in the reading step, and specified component information in which a component to be mounted on the board is specified With matching, characterized in that it comprises a matching step for matching the been mounting position specified by the position specifying step, and said prescribed position information position to be mounted in the component holder is specified. For example, in the position specifying step, the mounting position of the component holder is specified based on the output status of the signal output from the IC tag via the wireless communication medium.

  As a result, the identification information is read from the IC tag attached to the component holder, and the identification information is collated with the specified component information. Therefore, prior to the component collation, the identification information is attached to the supply reel. This eliminates the task of transferring the barcode information to the memory of the component cassette, and makes it possible to collate the components with little effort. Further, since the identification information is read out by wireless communication using the IC tag, it is not necessary to move the head or the component cassette, and the operation loss during component mounting can be reduced. Furthermore, since the mounting position of the component holder is specified and the mounting position is compared with the specified position information, an error in the mounting position of the component holder can be found. Here, since the mounting position of the component holder is specified based on the output status of signals such as radio waves output from the IC tag, there is no need to move the component cassette in order to specify the mounting position. Operation loss during mounting can be further reduced.

  Preferably, the component holder is a component tape, and the component verification method further includes a detection step of detecting a joint between the component tape and a component tape newly mounted on a component mounter, In the reading step, when the joint is detected in the detection step, the identification information is read from the IC tag of the new component holder, and in the collating step, the new information read in the reading step is further read. The identification information corresponding to the correct component tape is collated with the specified component information.

  As a result, when a new component tape is connected, the identification information is read from the IC tag of the new component tape and collation is performed based on the identification information, so that an error such as an incorrect component tape being connected is made. You can find and prevent this.

  In addition, the method for confirming the number of parts according to the present invention uses a computer to calculate the number of parts held by the part holder, which fluctuates when a part is taken out by a component mounter from a part holder that holds a plurality of parts. In this method, the number of components is confirmed, and the component holder is an IC (Integrated Circuit) that stores identification information for identifying the component held by the component holder and the number of components. The tag is attached to the component mounter, and the component number confirmation method includes the steps included in the component verification method according to claim A1, and the IC tag of the component holder. A number reading step for reading the number of components, and the number reading step each time the component mounter removes the component from the component holder to mount the component on the board. And decrement steps to 1 decrements the number of members read by, Number after being decremented by the decrement step, characterized in that it comprises a number of members warning step for issuing a warning when it is less than the predetermined number.

  As a result, every time a part is taken out from the part holder, the number of parts read in the number reading step is decremented, and a warning is issued when the number decreases, so the remaining parts held in the part holder The number of parts can be easily confirmed, and the parts holder can be replaced before the parts run out, and the operation loss at the time of mounting the parts can be reduced.

  In the component arrangement data creation method of the present invention, a mounting position where a component holder that holds a plurality of components is mounted on a component mounter that mounts components on a board, and the component holder is held by the component holder. A component arrangement data creation method for creating component arrangement data indicating a relationship with a component using a computer, wherein the component holder has identification information for identifying a component held by the component holder. It is mounted on the component mounter with a stored IC (Integrated Circuit) tag attached, and the component array data creation method includes a mounting position of the component holder mounted on the component mounter. A position specifying step for specifying the position, a reading step for reading the identification information from an IC tag attached to the component holder, a mounting position specified in the position specifying step, and the reading And the identification information read by the step in association, characterized in that it comprises a data generating step of generating the component arrangement data. For example, in the position specifying step, the mounting position of the component holder is specified based on the output status of the signal output from the IC tag via the wireless communication medium.

  Thus, the mounting position of the component holder is specified, and the component arrangement data is created by reading the identification information of the component held in the component holder from the IC tag. It is not necessary for the person to bother to confirm the mounting position and the identification information and create the component arrangement data simply by mounting the component arrangement data, and the component arrangement data can be created quickly and easily. Further, when the mounting position is specified based on the output status of the radio wave or the like output from the IC tag, for example, it is possible to save the trouble of moving the component cassette in order to specify the position.

  The component library creating method of the present invention is a component library creating method that uses a computer as a component library to create information related to components held in a component holder mounted on a component mounter. The holder is provided with an IC (Integrated Circuit) tag storing identification information for identifying a component housed in the component holder, and the component library creation method includes the component holder A reading step of reading the identification information from the IC tag attached to the tag, and a creation step of creating the component library so that the identification information read in the reading step is included.

  As a result, the identification information is read from the IC tag attached to the component holder and the component library is created, so that it is not necessary for the person to bother to confirm the identification information and create the component library. A parts library can be created quickly and easily.

  The component management method of the present invention is a component management method for managing a component taken out by a component mounter and mounted on a substrate from a component holder that holds a plurality of components using a computer, The component holder is provided with a first IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder, and the component management method includes: A reading step for reading the identification information from the first IC tag attached to the component holder, a mounting step for sequentially taking out the components from the component holder and mounting them on a substrate, and the identification information read in the reading step Is written to the second IC tag attached to the board in association with the component mounted in the mounting step.

  Thereby, since the identification information of the component mounted on the board is written in the second IC tag attached to the board, even if a problem occurs in the board, the information is written in the second IC tag. If the identification information is read, the cause can be easily investigated.

  The component holder of the present invention is a component holder that holds a plurality of components, and includes an IC (Integrated Circuit) tag that stores identification information for identifying the plurality of components. And

  Accordingly, since the IC tag storing the identification information is provided, the identification information can be easily read from the IC tag via the wireless communication medium. Therefore, it is not necessary to transfer the information of the barcode attached to the reel to the memory of the component cassette prior to the component verification as in the prior art, and the components can be verified with little effort. Further, it is not necessary to move the component cassette for reading the identification information, and the operation loss at the time of component mounting can be reduced.

  The present invention can be realized not only as various methods as described above, but also as various devices using steps included in such a method, or a program for causing a computer to execute each step. It can also be realized as. It goes without saying that such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a transmission medium such as the Internet.

  In the component collation method of the present invention, identification information is read from an IC tag attached to a component holder, and the identification information is collated with specified component information. This eliminates the work of transferring the barcode information attached to the reel to the memory of the component cassette, and has the effect of being able to collate the components with less effort.

(Embodiment 1)
Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.
(Component mounting system)
FIG. 1 is an external view showing the overall configuration of a component mounting system 10 according to the present invention. The component mounting system 10 includes a plurality of component mounting machines 100 and 200 constituting a production line for mounting electronic components while sending a circuit board (board) 20 from upstream to downstream, and the start of production. A component collating apparatus 300 that optimizes the mounting order of necessary electronic components based on various databases, downloads obtained NC (Numeric Control) data to the component mounting machines 100 and 200, and sets and controls them.

  The component mounter 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently or in cooperation with each other (or in an alternate operation). Each sub-equipment 110 (120) is an orthogonal robot type mounting stage, and includes two component supply units 115a and 115b composed of an array of a maximum of 48 component cassettes 114 for storing component tapes, and a maximum of 10 from these component cassettes 114. A multi mounting head 112 (10 nozzle head) having 10 suction nozzles (hereinafter also simply referred to as “nozzles”) capable of sucking and mounting individual components on the substrate 20, and moving the multi mounting head 112 An XY robot 113 to be operated, a component recognition camera 116 for two-dimensionally or three-dimensionally inspecting an adsorption state of components adsorbed by the multi-mounting head 112, a tray supply unit 117 for supplying tray components, and an IC tag IC tag reader / writer 111 for reading stored information and writing information to an IC tag Equipped with a. The IC tag is attached to a reel around which a component tape is wound. Each sub-equipment performs component mounting on the board independently of (in parallel with) the other sub-equipment.

  The “component tape” is actually a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound around a reel (supply reel) or the like. The It is mainly used to supply a relatively small size component called a chip component to a component mounter. However, in the optimization process, the “component tape” is data that specifies a set of components belonging to the same component type (a plurality of components arranged on a virtual tape). In a process called “part division”, a part group (one part tape) belonging to one part type may be divided into a plurality of part tapes. The “component type” indicates the type of electronic component such as a resistor or a capacitor. A part supplied by the part tape is called a taping part.

  Specifically, the component mounter 100 is a mounter having the functions of both a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

In other words, the component mounting machine 100 is designed to mount almost all kinds of electronic components (from 0.6 mm × 0.3 mm chip resistance to 200 mm connector as components to be mounted) A production line can be configured by arranging a required number of the component mounting machines 100.
(Component mounter configuration)
FIG. 2 is a plan view showing a main configuration of the component mounter 100 according to the present invention.

  The shuttle conveyor 118 is a moving table (component conveyor) for loading the components taken out from the tray supply unit 117 and transporting them to a predetermined position where the multi-mounting head 112 can suck them. The nozzle station 119 is a table on which replacement nozzles for accommodating various types of component types are placed.

  The two component supply units 115a and 115b constituting each sub-equipment 110 (or 120) are respectively arranged on the left and right with the component recognition camera 116 interposed therebetween. Accordingly, the multi-mounting head 112 that has picked up the components in the component supply unit 115a or 115b moves to the mounting point of the board 20 after passing through the component recognition camera 116, and performs an operation of sequentially mounting all of the sucked components. repeat. “Mounting point” refers to a coordinate point on a board on which a component is to be mounted, and components of the same component type may be mounted at different mounting points. The total number of components (mounting points) arranged on the component tape relating to the same component type matches the number of components of that component type (total number of components to be mounted).

  Here, a single operation (suction / moving / mounting) in a repetition of a series of operations of picking / moving / mounting components by the multi-mounting head 112, or a group of components mounted by such a single operation is described as “ This is called “task”. For example, according to the 10 nozzle head 112, the maximum number of components mounted by one task is 10. Here, “suction” includes all suction operations from when the head starts to pick up components until it moves. For example, 10 suction operations (up and down operation of the multi-mounted head 112). This includes not only the case of picking up these parts, but also the case of picking up 10 parts by a plurality of picking operations.

  One or two IC tag reader / writers 111 are provided in each sub-equipment 110 (or 120). The IC tag reader / writer 111 transmits a radio wave having a predetermined frequency including a read command to the IC tag, and receives a radio wave having a predetermined frequency including information stored in the IC tag from the IC tag. The position of the IC tag is specified by the direction of the radio wave received by the two IC tag reader / writers 111.

FIG. 3 is a diagram showing a circuit configuration of the IC tag reader / writer 111 and a circuit configuration of the IC tag.
The IC tag reader / writer 111 includes a modulation / demodulation unit 462 connected to an AC power source 461, a control unit 463, an interface unit 464, and an antenna 465.

  The modulation / demodulation unit 462 is a circuit that communicates with the IC tag 426b via the antenna 465. The modulation / demodulation unit 462 transmits power carrier waves to the IC tag 426b and receives information on components transmitted from the IC tag 426b. . That is, while the modulation / demodulation unit 462 receives the control code output from the control unit 463, the modulation / demodulation unit 462 generates a power carrier signal of a radio frequency (RF: Radio Frequency, for example, 13.56 MHz), and converts the signal into power It is converted into a carrier wave and transmitted from the antenna 465. In addition, the modulation / demodulation unit 462 transmits information on a component to be written to the IC tag 426b from the antenna 465.

  The control unit 463 controls transmission of the power carrier radio wave by the modulation / demodulation unit 462 and stop of the transmission, and outputs component information received by the modulation / demodulation unit 462 to the outside via the interface unit 464.

The IC tag 426b includes an antenna 471, a modulation / demodulation unit 472, a power generation unit 473, and a logic memory 474. The logic memory 474 stores component information.
The power generation unit 473 receives the power carrier radio wave transmitted from the IC tag reader / writer 111 via the antenna 471 by the electromagnetic induction method or the electromagnetic coupling method, and generates high-frequency induced power. The power generation unit 473 further rectifies the induced power, smoothes the voltage of the rectified induced power to a constant value, accumulates DC power, and the antenna 471 receives the power carrier radio wave. Meanwhile, the generated DC power is continuously supplied to the modulation / demodulation unit 472 and the logic memory 474.

  The modulation / demodulation unit 472 converts the component information stored in the logic memory 474 into a radio wave and outputs it to the outside via the antenna 471. As long as the modulation scheme matches the demodulation scheme in the modulation demodulator 462 of the IC tag reader / writer 111, an arbitrary scheme such as ASK (Amplitude Shift Keying) or FSK (Frequency-Shift Keying) can be used. it can. The modulation / demodulation unit 472 also demodulates the component information transmitted from the IC tag reader / writer 111 and writes it into the logic memory 474.

  FIG. 4 is a schematic diagram showing the positional relationship between the multi-mounting head 112 and the component cassette 114. The multi-mounting head 112 is a working head called “gang pickup system”, and can mount a maximum of ten suction nozzles 112a to 112b. At this time, a component from each of a maximum of ten component cassettes 114 can be mounted. Can be adsorbed simultaneously (by a single up-and-down motion).

  Note that only one component tape is loaded into the component cassette 114 called “single cassette”, and two component tapes are loaded into the component cassette 114 called “double cassette”. The position of the component cassette 114 (or component tape) in the component supply units 115a and 115b is referred to as “value on the Z axis” or “position on the Z axis”, and the leftmost end of the component supply unit 115a is “1”. A serial number or the like is used. Accordingly, as an important procedure for determining the mounting order for taping components, the arrangement (position on the Z-axis) of the component type (or component tape or component cassette 114 storing the component tape) is determined. . The “Z-axis” refers to a coordinate axis (or a coordinate value thereof) that specifies an arrangement position of a component cassette mounted for each component mounter (or a sub-equipment when a sub-equipment is provided).

  As shown in FIG. 5A, each component supply unit 115a, 115b, 215a, 215b can mount a maximum of 48 component tapes (the positions are Z1 to Z48, Z49 to Z96, Z97 to Z144, Z145 to Z192). Specifically, as shown in FIG. 5B, a maximum of 48 types can be provided for each component supply unit (A block to D block) by using a double cassette containing two component tapes having a tape width of 8 mm. Can be mounted. The larger the tape width (component cassette), the smaller the number of cassettes that can be mounted in one block.

  It should be noted that the left part supply units 115a and 215a (A block, C block) toward each sub-equipment are “left block”, and the right part supply units 115b and 215b (B block and D block) toward each sub-equipment. Is also called “right block”.

  FIGS. 6A and 6B are a diagram and a table showing examples of the position (Z-axis) of the component supply unit that can be sucked by the 10 nozzle head. In addition, H1-H10 in a figure points out the nozzle (position) mounted in the 10 nozzle head.

  Here, the interval between the nozzles of the 10-nozzle head corresponds to the width (21.5 mm) of one double cassette, so the Z numbers of parts picked up by one up-and-down movement are every other number (only odd numbers) (Or even number only). In addition, due to the movement restriction of the 10 nozzle head in the Z-axis direction, as shown in FIG. 6B, the nozzle that cannot adsorb to the component (Z-axis) constituting one end of each component supply unit ("-" In the figure) exists.

Next, the detailed structure of the component cassette 114 will be described with reference to FIGS.
Various chip-type electronic components 423a to 423d as shown in FIGS. 7A to 7D are stored in a storage recess 424a continuously formed at a constant interval on the carrier tape 424 shown in FIG. A cover tape 425 is attached to the upper surface and packaged, and the tape is supplied to the user in a taping form in which a predetermined quantity is wound around a supply reel 426. However, the shape of the part in which the electronic component is stored is not limited to the concave shape. The carrier tape 424 and the cover tape 425 constitute a component tape, and the component tape and the supply reel 426 function as a component holder that holds an electronic component.

  An IC tag 426b is attached to the supply reel 426. Manufacturing information such as part name, quantity, manufacturer name, manufacturing factory name, manufacturing date, lot name, etc. of taping parts, part dimensions, carrier Information such as the width of the component cassette 114 to which the tape 424 is attached and the pitch interval of the storage recesses 424a are stored. In addition to the carrier tape 424 as shown in FIG. 8, there are also an adhesive tape in which components are adhesively fixed to the tape, a paper tape, and the like.

  Such a taping electronic component 423d is used by being mounted on a component cassette 114 as shown in FIG. 9. In FIG. 9, the supply reel 426 is rotatable on a reel side plate 428 coupled to a main body frame 427. It is attached. The carrier tape 424 pulled out from the supply reel 426 is guided by a feed roller 429, and is linked to the operation of an electronic component automatic mounting device (not shown) on which the component cassette 114 is mounted. A feed lever (also not shown) moves the feed lever 430 of the component cassette 114 in the direction of the arrow Y1 in the drawing, and rotates the ratchet 432 by a fixed angle via a link 431 attached to the feed lever 430. Then, the feed roller 429 interlocked with the ratchet 432 is moved by a constant pitch (for example, a feed pitch of 2 mm or 4 mm). The carrier tape 424 may be sent out by motor driving or cylinder driving.

  Further, the carrier tape 424 is peeled off by the cover tape peeling portion 433 in front of the feed roller 429 (on the supply reel 426 side). The peeled cover tape 425 is taken up by the cover tape take-up reel 434, and the carrier tape 424 from which the cover tape 425 has been peeled off is conveyed to the electronic component take-out unit 435. A vacuum suction head (not shown) from the electronic component take-out portion 435 opened in conjunction with the ratchet 432 at the same time as the feed roller 429 transports the carrier tape 424, and the chip-type electronic housed in the housing recess 424a. The component 423d is sucked and taken out. Thereafter, the feed lever 430 is released from the pushing force by the feed lever and returns to the Y2 direction, that is, to the original position by the urging force of the tension spring 436.

When the above series of operations is repeated, the used carrier tape 424 is configured to be discharged to the outside of the component cassette 114.
The operational characteristics of the component mounter 100 are summarized as follows.
(1) Nozzle replacement When the nozzle required for the next mounting operation is not in the multi mounting head 112, the multi mounting head 112 moves to the nozzle station 119 and performs nozzle replacement. As types of nozzles, there are, for example, types S, M, and L, depending on the size of the parts that can be picked up.
(2) Component adsorption The multi-mounting head 112 moves to the component supply units 115a and 115b and adsorbs electronic components. When 10 parts cannot be picked up at the same time, a maximum of 10 parts can be picked up by moving the picking position up and down several times.
(3) Recognition Scan The multi mounting head 112 moves on the component recognition camera 116 at a constant speed, captures images of all electronic components sucked by the multi mounting head 112, and accurately detects the suction position of the components.
(4) Component mounting Electronic components are sequentially mounted on the substrate 20.

By repeating the operations (1) to (4), all electronic components are mounted on the substrate 20. The operations (2) to (4) are basic operations in mounting a component by the component mounter 100, and correspond to “tasks”. That is, a maximum of 10 electronic components can be mounted on the board in one task.
(Restrictions on component mounters)
The purpose of optimizing the mounting order of components is to maximize the number of boards produced per unit time by the component mounting machine 100. Therefore, as a preferable optimization method (optimization algorithm), as can be understood from the above functional and operational characteristics of the component mounting machine 100, ten electronic components that can be efficiently mounted on the board are selected, The algorithm is such that they are simultaneously sucked from the component supply unit and are sequentially mounted by the shortest path. The component mounting order determined by such an optimization algorithm can ideally improve the productivity by about 10 times compared to the case of component mounting using only one nozzle.

  However, any component mounting machine has a limiting factor for determining the mounting order of components from the viewpoints of mechanism, cost, and operation. Therefore, practically, optimizing the mounting order of components means maximizing the number of boards produced per unit time as much as possible while complying with various restrictions.

Hereinafter, main restrictions in the component mounter 100 are listed. Note that details of the constraints are also described in the sections describing individual optimization algorithms.
(Multi-mounted head)
The multi mounting head 112 includes 10 mounting heads that perform independent suction and mounting operations in a row, and a maximum of 10 suction nozzles can be attached and detached. Up to 10 parts can be picked up at the same time by one pick up and down action.

In addition, when referring to “individual work heads (work heads that pick up one component)” constituting the multi-mount head, they are simply referred to as “mount head (or“ head ”)”.
Due to the structure in which the ten mounting heads constituting the multi mounting head 112 are arranged in a straight line, there are restrictions on the movable range of the multi mounting head 112 during component adsorption and component mounting. Specifically, as shown in FIG. 6B, when electronic components are sucked at both ends of the component supply unit (near the left end of the left block 115a and the right end of the right block 115b), the accessible mounting head is limited. Is done.

Also, when the electronic component is mounted on the substrate, the movable range of the multi mounting head 112 is limited.
(Part recognition camera)
The component mounter 100 includes a 2D camera that captures a two-dimensional image and a 3D camera that can also detect height information as the component recognition camera 116. 2D cameras include 2DS cameras and 2DL cameras depending on the size of the field of view that can be captured. The 2DS camera has a small field of view but can perform high-speed imaging, and the 2DL camera is characterized by a large field of view up to 60 × 220 mm. The 3D camera is used to three-dimensionally check whether all leads of the IC component are bent.

The recognition scanning speed when imaging an electronic component varies depending on the camera. If a part using a 2DS camera and a part using a 3D camera exist in the same task, the recognition scan needs to be performed twice at each speed.
(Parts supply section)
There are two types of electronic component packages: a method called taping for storing electronic components in a tape shape, and a method called a tray for storing them in a plate with partitions according to the size of the components.

Supply of components by taping is performed by the component supply units 115a and 115b, and supply by a tray is performed by the tray supply unit 117.
Taping of electronic parts is standardized, and taping standards from 8 mm to 72 mm exist depending on the size of the parts. By setting such a tape-shaped component (component tape) in a component cassette (tape feeder unit) corresponding to the tape width, it is possible to continuously take out the electronic components in a stable state.

  The component supply unit in which the component cassette is set is designed so that component tapes up to 12 mm wide can be mounted at 21.5 mm pitch without any gap. When the tape width is 16 mm or more, the gap is set by a necessary amount according to the tape width. In order to pick up a plurality of electronic components simultaneously (by one up-and-down movement), the pitches in the arrangement of the mounting head and the component cassette need only match. For parts with a tape width of up to 12 mm, simultaneous suction of 10 points is possible.

Note that a maximum of 48 component tapes up to a width of 12 mm can be mounted on each of the two component supply units (the left block 115a and the right block 115b) constituting the component supply unit.
(Parts cassette)
The component cassette includes a single cassette that can store only one component tape and a double cassette that can store a maximum of two component tapes. The two component tapes stored in the double cassette are limited to component tapes having the same feed pitch (2 mm or 4 mm).
(Other restrictions)
The constraints in the component mounter 100 include not only the constraints resulting from the structure of the component mounter 100 as described above, but also the following operational limitations arising from circumstances at the production site where the component mounter 100 is used. is there.
(1) Arrangement fixing For example, in order to reduce manual replacement work of component tapes, a specific component tape (or a component cassette storing it) is positioned at the component supply unit to be set (on the Z-axis). Position) may be fixed.
(2) Resource restrictions The number of component tapes that can be prepared for the same component type, the number of component cassettes that store component tapes, the number of double cassettes, the number of suction nozzles (number for each type), etc. are limited to a certain number. May be.
(Parts verification device)
The component verification device 300 is a device for verifying whether the component cassette 114 containing component tapes is correctly set in the component supply units 115a and 115b. In addition, the component verification device 300 is possible when a production target (board and components to be mounted thereon) and a production tool (component mounter with limited resources, sub-equipment) are given. The order of component mounting is also determined in order to manufacture boards in as short a time as possible (increase the number of boards that can be manufactured per unit time).

  Specifically, in order to minimize the mounting time per board, a component cassette containing any component tape is placed at which position (Z axis) of which component mounting machine (sub-equipment). The mounting machine (sub-equipment) multi-mounting head picks up as many parts as possible from the component cassette in any order and places the picked-up parts on any position (mounting point) on the board in any order. This is a device that determines on a computer (searches for an optimal solution).

At this time, it is required to strictly observe the above-described restrictions of the target component mounter (sub-equipment).
(Hardware configuration of parts verification device)
The component collation apparatus 300 is realized by a general-purpose computer system such as a personal computer executing the optimization program according to the present invention, and is not connected to the actual component mounting machine 100, but is a stand-alone simulator (component mounting). It also functions as an order optimization tool.

  FIG. 10 is a block diagram showing a hardware configuration of the component verification apparatus 300 shown in FIG. This component verification device 300 is subject to line tact (in the tact for each sub-equipment constituting the line, the maximum tact for the component mounting of the target board under various restrictions based on the specifications of each facility constituting the production line. In order to minimize the tact), the components to be mounted in each sub-equipment and the mounting order of the components in each sub-equipment are targeted for all parts given by a component-mounting CAD (Computer-Aided Design) device. It is a computer device that determines and generates optimal NC data. The “tact” is the total time required to mount the target component.

  The component verification apparatus 300 includes an arithmetic control unit 301, a display unit 302, an input unit 303, a memory unit 304, an optimization program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and component arrangement data storage. Part 308 and the like.

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the optimization program storage unit 305 to the memory unit 304 in accordance with an instruction from the user, and the execution result. The components 302 to 307 are controlled in accordance with the above. The arithmetic control unit 301 obtains information about the component cassette 114 from the component mounting machine 100 (200), creates a component library and component arrangement data from the information, and stores them in the database unit 307 and the component arrangement data storage unit 308, respectively. Store. The creation process of the component library and the component arrangement data will be described later.

  The display unit 302 is a CRT (Cathode-Ray Tube), LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. 300 is used for dialogue between the operator and the operator. A specific user interface is as described in a screen display example described later.

The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the component verification apparatus 300 and the component mounters 100 and 200.
The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301. The optimization program storage unit 305 is a hard disk or the like that stores various optimization programs that realize the functions of the component collation apparatus 300.

  A database unit 307 stores input data (mounting point data 307a, component library 307b, and mounting device information 307c) used for optimization processing by the component matching device 300, mounting point data generated by optimization, and the like. It is.

The component arrangement data storage unit 308 is a hard disk or the like that stores component arrangement data indicating the position of the component tape on the Z axis.
11 to 13 show examples of the mounting point data 307a, the component library 307b, and the mounting apparatus information 307c, respectively.

  The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 11, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 12, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). The “control data” is restriction information related to the mounting of the component (type of suction nozzle that can be used, maximum moving speed of the multi mounting head 112, etc.). The NC data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  The component library 307b is a library in which unique information about all component types that can be handled by the component mounters 100 and 200 is collected. As shown in FIG. 12, the component size and tact ( And other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 116, a maximum speed ratio of the multi-mounting head 112, and the like). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library may include information such as component colors and component shapes.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line, the above-described restrictions, and the like. As shown in FIG. 13, the unit ID indicating the equipment number and the type of the multi mounting head Head information relating to the above, nozzle information relating to types of suction nozzles that can be mounted on the multi-mounting head, cassette information relating to the maximum number of component cassettes 114, tray information relating to the number of trays stored in the tray supply unit 117, etc. Become.

  These pieces of information are data called as follows. That is, equipment option data (for each sub-equipment), resource data (number of cassettes and nozzles available for each equipment), nozzle station arrangement data (for each sub-equipment with nozzle station), initial nozzle pattern data (for each sub-equipment) Z-axis arrangement data (for each sub-equipment). Regarding the resources, the number of nozzles of each type such as SX, SA, S, etc. is 10 or more.

FIG. 14 is a diagram illustrating an example of the component arrangement data stored in the component arrangement data storage unit 308. The part arrangement data is data indicating the position on the Z-axis where the taping parts are to be arranged. The part name of the taping part, the equipment number (unit ID) in which the part cassette 114 is set, the part cassette 114 On the Z-axis (Z number). The parts cassette 114 must be arranged according to the parts arrangement data.
(Identification of Z number and joint detection)
FIG. 15 is a diagram for explaining the component supply units 115a and 115b in more detail. In the component supply units 115a and 115b, a switch 450 and a joint detection sensor 452 are provided for each Z number.

  The switch 450 is a switch (sensor) that is electrically turned on when the component cassette 114 is mounted on the component supply unit 115a (115b). Based on the output from the switch 450, the component verification device 300 can know the Z number of the component supply unit 115a (115b) in which the component cassette 114 is mounted.

The joint detection sensor 452 is a sensor that optically detects the joint of the carrier tape 424. FIG. 16 is a diagram illustrating a seam of the carrier tape. At the time of component mounting, before the end of the carrier tape 441 (424) is released, the end is connected to the start of another carrier tape 442 (424). Such connection enables component replenishment without stopping the component mounter 100 (200). At this time, a notch 446 is generated at the joint 445 between the carrier tape 441 and the carrier tape 442. The joint detection sensor 452 optically detects the cut 446. Any sensor other than the optical detection method may be used as long as it can detect the joint.
(Identification of Z number by IC tag)
FIG. 17 is a diagram for explaining a method for specifying the Z number of the carrier tape 424 by the IC tag. The two IC tag reader / writers 111 specify the position of each IC tag 426b based on the direction of radio waves received from each IC tag 426b. When the position of the IC tag 426b is specified, the Z number is specified. At that time, since the two IC tag reader / writers 111 receive the part name information from each IC tag 426b, the part name and Z number of the part cassette 114 are specified based on the information received from the IC tag 426b. The For example, if the Z number is incremented by 1 every time X increases by 10 as shown in the figure, when the position of the part A is specified as (X, Y) = (10, 4), It can be seen that the Z number of the part A is 1. In the case of a double cassette, there are two component tapes at the same Z position. However, since the X coordinate of the component is different, the component tape is located on the left side or the right side of the double cassette. Can be discriminated.

  Note that the method of specifying the position of the IC tag 426b is not limited to the direction of radio waves, and may be based on the strength of radio waves received by the two IC tag reader / writers 111 or the ratio of the strengths of radio waves. . Furthermore, when the IC tag 426b outputs a signal using electromagnetic waves, infrared rays, or the like as a wireless communication medium, the position of the IC tag 426b may be specified based on the signal output status such as the strength and direction.

  The number of IC tag readers / writers 111 is not necessarily two, and may be one as long as the position of the IC tag 426b can be determined from the strength and direction of the received radio wave.

FIG. 18 is an explanatory diagram for explaining how one IC tag reader / writer 111 specifies the position of the IC tag 426b.
For example, the component mounters 100 and 200 include one IC tag reader / writer 111 and an antenna disposed from the IC tag reader / writer 111 to the vicinity of the IC tag 426b of each component cassette 114 in the component supply units 115a and 115b. 111a.

  As described above, since the antenna 111a is close to each IC tag 426b, the IC tag reader / writer 111 can reliably receive the radio wave of the IC tag 426b. In other words, the IC tag reader / writer 111 can accurately specify the position of each IC tag 426b based on the radio wave intensity and reception direction of each IC tag 426b, which is the reception result. Further, the IC tag reader / writer 111 can accurately specify the Z number of the component cassette 114 from the position.

  Further, for each IC tag 426b, an antenna extending to the vicinity of the IC tag 426b may be laid. In this case, since each antenna corresponds to each Z number (Z = 1, 2,...), The IC tag reader / writer 111 is switched by switching and acquiring the output of each antenna. The Z number of the IC tag 426b (component cassette 114) corresponding to the antenna is specified, and the component information is acquired from the IC tag 426b.

  That is, each antenna is provided with a switch. When the switch is turned on, an output from the antenna corresponding to the switch is acquired by the IC tag reader / writer 111. The IC tag reader / writer 111 turns on only the antenna switch corresponding to Z = 1 from among the switches corresponding to each antenna, and then turns on only the antenna switch corresponding to Z = 2. By sequentially turning on the switches, the output of each antenna is switched and acquired.

As shown in FIG. 15, when the switch 450 is installed, it is detected by the switch 450 that the component cassette 114 is mounted on the component supply unit 115a (115b). Therefore, the Z number of the component cassette 114 may be specified based on the detection result of the switch 450.
(Part verification process)
FIG. 19 is a flowchart of the component matching process.

  Based on the output of the switch 450, the component verification device 300 checks whether or not the component cassette 114 containing the component tape is set in the component supply units 115a and 115b (S11A). When the component cassette 114 is newly set in the component supply units 115a and 115b (YES in S11A), the Z number of the component cassette 114 set is specified from the output of the switch 450 (S12A). Thereafter, one IC tag reader / writer 111 acquires component information from the IC tag 426b of the set component tape (S13).

  The component verification device 300 checks whether the set component tape is correct (S14). In other words, if the part name, unit ID, and Z number of the set part tape match those registered in the part arrangement data (specified part information and specified position information), it is determined that the part tape is correct. Even if the part names of the set part tapes do not match, it is determined that the part tape of a part that can be substituted for the part registered in the part arrangement data is correct. It is assumed that information regarding a replaceable part is written in advance in the IC tag 426b. Moreover, it is good also as what is previously registered into component collation data or a component library.

  If the correct component tape is not set (NO in S14), a warning is issued (S15), and then the process returns to the process of checking whether the component cassette is set (S1). If the correct component cassette is set (YES in S14), the component verification process is terminated.

  As described above, when the component cassette is set in the component supply unit before the component mounting is started, it can be checked whether or not the correct component is mounted on the component supply units 115a and 115b, and incorrect components are mounted. Can be prevented. Further, only one IC tag reader / writer 111 is required.

  In the component collation process shown in FIG. 19, the Z number of the component cassette 114 is specified based on the output of the switch 450. For this reason, in the case of a double cassette, the position of each component tape cannot be specified accurately. Further, even when a plurality of component cassettes are set simultaneously, the position of each component tape cannot be specified. Therefore, as shown in FIG. 20, the position of each component tape may be specified using an IC tag reader / writer 111.

FIG. 20 is a flowchart of a modification of the component matching process shown in FIG. The component verification device 300 checks whether or not the component cassette 114 containing the component tape is set in the component supply units 115a and 115b using the two IC tag readers / writers 111 (S11B). That is, as described with reference to FIG. 17, by checking the position of the IC tag 426b with the two IC tag reader / writers 111, the position of the component cassette 114 to which the IC tag 426b is attached is checked. When the component cassette 114 is newly set in the component supply units 115a and 115b (YES in S11B), the Z number of the component cassette 114 set by the two IC tag reader / writers 111 is specified (S12B). Since the subsequent processing is the same as that shown in FIG. 19, detailed description thereof will not be repeated here. By using two IC tag readers / writers 111, in the case of a double cassette, it is possible to check whether or not the information stored on either the left side or the right side of the cassette matches. Further, the switch 450 is not necessarily required.
(Parts verification processing when connecting part tapes)
FIG. 21 is a flowchart of the component verification process when connecting component tapes. When the remaining component tape is low, the end of the component tape is connected to the start of a new component tape, and at this time, this program is executed so that no erroneous component is connected. This program is started after the component mounting process is started, and is executed in parallel with the component mounting process program.

  Wait until the seam detection sensor 452 detects the seam of the carrier tape 424 (S21). When the seam is detected (YES in S21), the Z number of the parts cassette in which the newly connected parts tape is stored is specified. (S22). The identification of the Z number is performed based on the output of the joint detection sensor 452. Thereafter, the two IC tag reader / writers 111 acquire component information from the IC tag 426b of the component tape newly connected (S23).

  The component verification device 300 checks whether or not the component tape newly connected from the component information is correct (S24). The determination as to whether or not it is correct is the same as the part collating process (S14) in FIG. If the correct component tape is connected (YES in S24), no processing is performed, but if an incorrect component tape is connected (NO in S24), a warning is issued (S25), and then from the component tape The removal of the component is prohibited, and the component mounting process is stopped (S26).

In this way, even if an incorrect component tape is connected, the component mounting process can be stopped before the component mounting, so that the product yield can be improved.
(Manufacturing information writing process)
FIG. 22 is a flowchart of manufacturing information writing processing (component management processing).

  The manufacturing information writing process is a process of writing manufacturing information to an IC tag provided on a board when a component is mounted. This processing program is executed in parallel with the component mounting processing program. Each time a component is mounted on the board (YES in S31), the component verification apparatus 300 decrements the remaining number of mounted components by one (S32). The component verification device 300 performs processing by setting the number of components registered in the IC tag 426b when the component tape is mounted as the remaining number of components.

  Next, the component verification apparatus 300 writes the information of the mounted component on the IC tag provided on the board (S33). In addition, information regarding the component mounter 100 (200) used at the time of manufacture may be written. For example, component information related to components used when components are mounted on a board, and production information such as production management information, error information, nozzle information, and camera information. Information is written using an IC tag reader / writer 111.

  Thereafter, it is checked whether the remaining number of parts is less than a predetermined threshold value (S34). If it is less than the threshold value (YES in S34), the remaining number of parts tape is small, so the part verification The device 300 issues a warning (S35). After the warning, it is checked whether the number of remaining parts is 0 (S36). If the remaining number of parts is 0 (YES in S36), the removal of the part from the part tape is prohibited and the part mounting is stopped. (S37).

In this way, information on the manufacturing apparatus, parts, and the like can be tracked by writing information on the IC tag 426b provided on the substrate.
As described above, according to the present embodiment, component information is acquired in a non-contact manner from an IC tag attached to a supply reel, and components are collated. For this reason, parts can be collated with little effort.

Further, it is not necessary to move the component cassette for reading the component information, and the operation loss at the time of component mounting can be reduced.
Further, when a seam of the carrier tape is detected, component information is acquired from the IC tag of the newly connected component tape, and component verification is performed. For this reason, it is possible to prevent an error in joining the component tapes.

In addition, information on the mounted components is written on an IC tag provided on the board. For this reason, it can be used for investigating the cause when the product has a problem.
(Embodiment 2)
Next, a component mounting system according to Embodiment 2 of the present invention will be described. The configuration of the component mounting system according to the present embodiment is the same as that shown in the first embodiment. However, the component mounting system according to the present embodiment can perform the following component arrangement data creation processing and component library creation processing prior to component mounting.
(Part array data creation process)
FIG. 23 is a flowchart of component arrangement data creation processing.

  Prior to component mounting, component array data creation processing as shown in FIG. 23 is performed. The component collation apparatus 300 checks the Z number of the set component cassette 114 based on the information from the switch 450 of the component supply units 115a and 115b shown in FIG. 15 (S1A). Next, the component verification apparatus 300 acquires information (component name, etc.) of the IC tag 426b received by one IC tag reader / writer 111 (S2A).

  Based on the information acquired from the IC tag 426b, the component verification apparatus 300 creates component array data including a component name, a unit ID, and a Z number, and stores the component array data in the component array data storage unit 308 (S3).

  As described above, by simply setting the necessary component tapes in the component supply units 115a and 115b, it is possible to know where and what components have been set, and without creating the component array data in advance by the user, It can be generated automatically and component mounting can be performed. Further, only one IC tag reader / writer 111 is required. In particular, in the case of high-mix low-volume production, since the number of production boards of one type is small, there is no point in optimizing the arrangement of parts. There is an advantage that parts arrangement data can be created in the same order.

  In the component arrangement data creation process shown in FIG. 23, the Z number of the component cassette 114 is specified based on the output of the switch 450. For this reason, in the case of a double cassette, the position of each component tape cannot be specified accurately. Further, even when a plurality of component cassettes are set simultaneously, the position of each component tape cannot be specified. Therefore, the position of each component tape may be specified using an IC tag reader / writer 111 as shown in FIG.

FIG. 24 is a flowchart of a modification of the component arrangement data creation process shown in FIG.
Based on the information from the two IC tag readers / writers 111, the component verification device 300 checks the Z number of the set component cassette 114 (S1B). Next, the component collation apparatus 300 acquires information (component name etc.) of the IC tag 426b received by the two IC tag reader / writers 111 (S2A). At that time, the Z number of the information acquired based on the direction of the radio wave from the IC tag 426b is specified together. Thereby, it is possible to know which Z number of the component cassette 114 is the acquired information. Based on the information acquired from the IC tag 426b, the component verification apparatus 300 creates component array data including a component name, a unit ID, and a Z number, and stores the component array data in the component array data storage unit 308 (S3). In the case of a double cassette, information on whether the cassette is stored on the left side or the right side of the cassette is also written in the component arrangement data. As described above, by using the two IC tag reader / writers 111, in the case of a double cassette, information indicating whether the cassette is stored on the left side or the right side of the cassette can be included in the component arrangement data. . Further, the switch 450 is not necessarily required.
(Part library creation process)
FIG. 25 is a flowchart of the part library creation process.

  Prior to component mounting, component library creation processing as shown in FIG. 25 is performed. The component verification device 300 checks the Z number of the set component cassette 114 based on the information from the switch 450 of the component supply units 115a and 115b shown in FIG. 15 (S16). Next, the component collation apparatus 300 acquires information (component name etc.) of the IC tag 426b received by the two IC tag reader / writers 111 (S17). At that time, the Z number of the information acquired based on the direction of the radio wave from the IC tag 426b is specified together. Thereby, it is possible to know which Z number of the component cassette 114 is the acquired information.

The component collation apparatus 300 creates a component library as shown in FIG. 12 from the component information acquired from the IC tag 426b (S18).
As described above, since the component library is automatically created, it is possible to reduce the time required for the user to create the component library.

  As described above, according to the present embodiment, in addition to the operations and effects described in the first embodiment, the Z number of information acquired based on the strength of radio waves received from the IC tag is specified. For this reason, it is not necessary to move the component cassette in order to specify the Z number. As a result, component arrangement data can also be created at high speed.

Also, the library information of the parts stored in the IC tag is read, and the parts library is automatically created. For this reason, a parts library can be created without taking time and effort.
(Embodiment 3)
In the component mounting system 10 according to the first embodiment, data is read from the IC tag attached to the reel and the manufacturing information writing process (component management process) is performed. However, the component mounting system according to the present embodiment uses a component tape. The data is read from the IC tag attached to the head of the manufacturing information and the manufacturing information writing process is performed.

Such a component mounting system in the present embodiment will be described with reference to the drawings.
FIG. 26 is a configuration diagram showing the configuration of the component mounting system in the present embodiment.

  This component mounting system includes component mounters 500 and 600 for mounting the electronic component 3 on the printed circuit board 2, and a control device 700 for controlling these component mounters 500 and 600, and is mounted on the printed circuit board 2. In addition, the individual electronic components 3 are reliably managed.

  The component mounters 500 and 600 each include a component supply unit 502 in which a plurality of reels 501 are disposed. Then, the component mounters 500 and 600 pull out the component tape 503 from the reel 501 in the component supply unit 502, take out the electronic component 3 stored in the component tape 503, and electronically place it on the printed circuit board 2 that has been loaded. The component 3 is mounted.

  Here, a tape IC tag 504 is attached to the component tape 503, and the tape IC tag 504 stores in advance component data 505 indicating the contents related to the electronic component 3 accommodated in the component tape 503. doing.

  Further, a board IC tag 506 is attached on the printed circuit board 2, and the board IC tag 506 stores management data 507 including contents indicating the electronic component 3 mounted on the board 2 and a mounting operation result. It has an area for storing.

  Such IC tags 504 and 506 for tape and substrate use non-contact communication by using so-called RFID (Radio Frequency Identification) technology, and store or store information by the communication. Or send information.

  That is, the component mounters 500 and 600 according to the present embodiment read the component data 505 of the electronic component 3 stored in the component tape 503 from the tape IC tag 504, and performed the mounting operation when the mounting operation is completed. The contents related to the mounted electronic component 3 and the contents indicating the mounting operation result are written as management data 507 in the IC tag 506 for the printed circuit board 2. Furthermore, the component mounters 500 and 600 in the present embodiment change the mounting operation according to the content of the read component data 505.

  In addition, the control device 700 acquires management data 507 written to the board IC tag 506 by the component mounters 500 and 600 from the component mounters 500 and 600 and stores them collectively.

FIG. 27 is an explanatory diagram for explaining a component tape 503 in the present embodiment.
The component tape 503 in this embodiment is wound around a reel 501, a carrier tape 503b on which the electronic component 3 is placed, a cover tape 503a attached to the carrier tape 503b, and the above-described IC tag for tape. 504.

  The carrier tape 503b is made of a thin resin molded product, paper, or the like, and the plurality of electronic components 3 are stored in storage recesses 503c formed on the carrier tape 503b at substantially equal intervals.

  The cover tape 503a is made of, for example, a light-transmitting synthetic resin, and is affixed to the carrier tape 503b so that the electronic component 3 is not detached from the storage recess 503c of the carrier tape 503b, that is, closes each storage recess 503c. .

  The tape IC tag 504 is attached to the tip of the carrier tape 503b, and the component data 505 stored therein includes information indicating the lot or manufacturer of the electronic component 3.

  Such a tape IC tag 504 is attached in advance to the carrier tape 503b, and after the electronic component 3 is placed and stored on the carrier tape 503b, the component data 505 corresponding to the electronic component 3 is used for the tape. It is written in the IC tag 504.

  For example, as shown in FIG. 27, the component data 505 includes a serial number column A1 in which the serial number of each electronic component 3 stored in the component tape 503 is stored, and the electronic component 3 stored in the component tape 503. A lot number column A2 for storing the lot number, a component name column A3 for storing the component name of the electronic component 3, a vendor column A4 for storing a vendor code indicating the manufacturer of the electronic component 3, A shape column A5 in which contents indicating the shape of the electronic component 3 are stored, a manufacturing column A6 in which the date of manufacture of the electronic component 3 is stored, and the electronic component 3 is opened after being sealed after manufacturing The opening column A7 for storing the date and time stored, the number column A8 for storing the number of electronic components 3 stored in the component tape 503, and the interval (pitch) between the stored electronic components 3 ) There is a pitch column A9 stored.

  Specifically, “ser0001,..., Ser0500” indicating the serial number of each electronic component 3 is stored in the serial number column A1, and the lot number “lot0002” of the electronic component 3 is stored in the lot number column A2. The name column A3 stores the component name “1005CR” of the electronic component 3, and the vendor column A4 stores the vendor code “ven0003” indicating the manufacturer of the electronic component 3. The serial numbers of the electronic components 3 described above are stored in the order of arrangement of the electronic components 3 on the component tape 503, for example.

Further, the width “10 mm”, the depth “5 mm”, and the height “2 mm” of the electronic component 3 are stored in the shape column A5.
Further, the date of manufacture of the electronic component 3 “January 31, 2002” is stored in the manufacture column A6, and the date “February 1, 2003” when the electronic component 3 was opened is stored in the opening column A7. ”Is stored, the number“ 500 ”of electronic components 3 stored in the component tape 503 is stored in the number column A8, and the pitch“ 10 mm ”of the electronic components 3 is stored in the pitch column A9. .

  When such a component tape 503 is replaced, the tip of a new replacement component tape 503 is joined to the end of the component tape 503 pulled out by the component mounters 500 and 600.

FIG. 28A and FIG. 28B are explanatory diagrams for explaining a state where the tip of the replacement component tape 503 is joined to the end of the component tape 503.
As shown in FIG. 28A, the connecting tape 4 for joining is attached to the end and the tip of the component tape 503. In other words, when joining the component tape 503, the worker abuts the end of the component tape 503 drawn out to the component mounters 500 and 600 and the front end of the replacement component tape 503, and connects to the abutted portion. Adhere tape 4.

  Further, as shown in FIG. 28 (b), two hooks 5b provided at the tip of the replacement component tape 503 are attached to the two U-shaped locking portions 5a provided at the end of the component tape 503. The two component tapes 503 may be joined together by hooking them individually.

When the component tapes 503 are thus joined together, the tape IC tag 504 is positioned at the joint.
That is, the component mounters 500 and 600 of the present embodiment always monitor the drawing portion of the component tape 503 during the mounting operation. When the tape IC tag 504 is detected, the tape IC tag 504 removes it. It is recognized that a replacement part tape 503 is joined from the worn part, that is, the part tape 503 has been replaced.

FIG. 29 is a block diagram showing an internal configuration of the component mounter 500 in the present embodiment. The component mounter 600 also has the same configuration as the component mounter 500.
The component mounter 500 includes a component lead unit 511, a head 512, a head drive unit 513, a board RW unit 514, a data storage unit 515, a communication unit 516, and a control unit 517 that controls these components. And.

  The component lead unit 511 detects the tape IC tag 504 attached to the component tape 503, performs non-contact communication with the tape IC tag 504, and stores the component data 505 stored in the tape IC tag 504. read.

The head 512 sucks the electronic component 3 stored in the component tape 503 and places it on the printed circuit board 2.
The head driving unit 513 drives the head 512 according to the control from the control unit 517.

  The board RW unit 514 performs non-contact communication with the board IC tag 506 mounted on the printed board 2 and reads the management data 507 stored in the board IC tag 506 or newly updated management. Data 507 is written into the substrate IC tag 506.

The data storage unit 515 stores management data 507 and component data 505 in accordance with control from the control unit 517.
The communication unit 516 transmits management data 507 and component data 505 stored in the data storage unit 515 to the control device 700 according to control from the control unit 517.

  Here, the management data 507 includes work result information 507a indicating the work result of each facility (component mounting machine or the like) that has performed the mounting operation on the printed circuit board 2, and the electronic component 3 mounted in each facility. Mounting component information 507b indicating the contents related to.

FIG. 30 is an information content display diagram showing the contents of the work result information 507a.
The work result information 507a includes a board ID (for example, “PB01ID”) assigned to identify the printed board 2 and a lot number (for example, “PB01Rt”) of the printed board 2.

  Furthermore, the work result information 507a stores a facility name column B1 in which the name of the facility that performed the work on the printed circuit board 2 (equipment name), and the date and time when the printed circuit board 2 was inserted into the facility. The input date and time field B2, the tact field B3 in which the time (tact) required for the work in the facility is stored, and the PG field B4 in which the name of the program executed by the facility on the printed circuit board 2 is stored. When an error occurs during the execution of the program, there are an error column B5 in which contents related to the error are stored, and an index column B6 in which an index indicating the mounted component information 507b related to the work of the facility is stored. Here, by including an index in the work result information 507a, the work result information 507a is associated with the mounting component information 507b for each facility.

  For example, the equipment name “CM402” of the component mounting machine 500 is stored in the equipment name column B1, and the date and time “2003/01/06 11 when the printed circuit board 2 is inserted into the component mounting machine 500 is stored in the input date and time column B2. : 16: 34 ”is stored, the time“ 35 seconds ”required for the mounting work by the component mounting machine 500 is stored in the tact column B3, and the printed circuit board 2 is stored in the PG column B4 by the component mounting machine 500. The name “PTEST” of the program executed for the electronic component 3 is stored in the index field B6, and the index “Idx01” of the mounting component information 507b related to the electronic component 3 mounted by the component mounting machine 500 is stored. In the error column B5, for example, an error occurrence date “2003/01/06 11:16:55” generated when the program is executed, an error code “MC0005” of the error, and an error are generated. The stored step “100” is stored.

FIG. 31 is an information content display diagram for displaying the contents of the mounted component information 507b.
The mounting component information 507b is assigned the above-mentioned index for each facility, and each mounting component information 507b is identified by the index.

For example, the mounting component information 507 b of the index “Idx01” includes the component name and serial number of each electronic component 3 mounted by the component mounter 500.
That is, the mounting component information 507b includes a position column C1 in which the position on the printed circuit board 2 is stored, a component name column C2 in which the component name of the electronic component 3 mounted at the position is stored, and the electronic component. The serial number column C3 in which the serial number 3 is stored, the lot number column C4 in which the lot number of the electronic component 3 is stored, and the location where the reel 501 of the electronic component 3 is disposed (position of the Z axis) Is stored in the Z-axis column C5.

  For example, the position column C1 stores the position “X1, Y1” of the mounted electronic component 3 on the printed circuit board 2, and the component name column C2 stores the component name “1005CR” of the electronic component 3. The serial number column C3 stores the serial number “ser0001” of the electronic component 3, the lot number column C4 stores the lot number “lot0002” of the electronic component 3, and the Z-axis column C5 stores the electronic component. The Z-axis position “10” where the three reels 501 were arranged is stored. The Z-axis refers to the arrangement direction of a plurality of reels 501 arranged in the component supply unit 502 of the component mounter 500.

  When the printed circuit board 2 is inserted, the control unit 517 of the component mounter 500 according to the present embodiment controls the circuit board RW unit 514 from the substrate IC tag 506 attached to the printed circuit board 2. The management data 507 is read and temporarily stored in the data storage unit 515. When the mounting operation for the printed circuit board 2 is completed, the control unit 517 overwrites the management data 507 stored in the data storage unit 515 with the mounting operation result, and controls the substrate RW unit 514 again. The overwritten (updated) management data 507 is written in the substrate IC tag 506.

  Further, the control unit 517 of the component mounter 500 according to the present embodiment determines whether or not the tape IC tag 504 is attached to the component tape 503 that has been drawn based on the communication result of the component lead unit 511. When it is determined that the tape IC tag 504 is attached, it is recognized that the component tape 503 has been replaced from the portion of the tape IC tag 504. Thereafter, the control unit 517 controls the component lead unit 511 to read the component data 505 stored in the tape IC tag 504 and store the component data 505 in the data storage unit 515.

  Then, when updating the management data 507, the control unit 517 reads the component data 505 corresponding to the mounted electronic component 3 from the data storage unit 515, and the content is the component name of the mounting component information 507b of the management data 507. Stored in the column C2 and the serial number column C3. Specifically, since a plurality of reels 501 are mounted on the component mounter 500, each component data 505 read from the tape IC tag 504 attached to the component tape 503 of those reels 501 is And stored in the data storage unit 515 in association with the Z-axis position of the reel 501. Then, when mounting each electronic component 3, the control unit 517 of the component mounting machine 500 stores the Z-axis position of the reel 501 from which each electronic component 3 is taken out, and stores the mounting component information 507 b in the management data 507. When updating, the component data 505 associated with the stored Z-axis position is read from the data storage unit 515. The control unit 517 writes each content such as the component name and serial number included in the read component data 505 in the corresponding part of the mounted component information 507b.

  As a result, the IC tag 506 for a board attached to the printed circuit board 2 has a serial number, a lot number, and a mounting number for each electronic component 3 mounted on the printed circuit board 2 for each facility as shown in FIG. Points (positions mounted on the printed circuit board 2) and the like are indicated.

  Here, when the control unit 517 determines that the tape IC tag 504 is attached to the component tape 503, the control unit 517 determines between the detection position of the tape IC tag 504 (reading position of the component data 505) and the head 512. The electronic component 3 attracted to the head 512 recognizes that the electronic component 3 of the replaced component tape 503 is switched after the component tape 503 is fed N times. Then, the control unit 517 determines whether or not the shape of the electronic component 3 is different before and after the replacement of the component tape 503 based on the component data 505 read by the component lead unit 511, and if the shape of the electronic component 3 is different. When the determination is made, the head driving unit 513 is controlled so that the suction mode of the head 512 changes according to the shape of the electronic component 3 accommodated in the replaced component tape 503 after the N times of feeding.

  For example, when the control unit 517 determines that the height of the electronic component 3 has decreased, the control unit 517 controls the head driving unit 513 so that the suction portion of the head 512 is decreased according to the height. Thereby, it can mount reliably and safely, without damaging the electronic component 3. FIG.

  The control unit 517 controls the head driving unit 513 so as to stop the suction operation of the head 512, for example, when it is determined that the functions of the electronic component 3 are different. Thereby, erroneous mounting of the electronic component 3 can be prevented.

FIG. 32 is a flowchart showing the operation of the component mounter 500 in the present embodiment.
First, the component mounter 500 reads the component data 505 from the tape IC tag 504 attached to the component tape 503 (step S100), and further receives the management data 507 from the substrate IC tag 506 of the printed circuit board 2 that has been input. Reading (step S101), the component data 505 and management data 507 are stored.

Next, the component mounting machine 500 starts mounting the electronic component 3 accommodated in the printed circuit board 2 while pulling out the component tape 503 (step S102).
Here, the component mounter 500 monitors the part from which the component tape 503 is pulled out, and another tape IC tag 504 different from the tape IC tag 504 from which the component data 505 is read out in step S100. Through the communication, it is determined whether or not the component tape 503 has been replaced (step S104).

  When it is determined that the component tape 503 has been replaced (Y in step S104), the component mounter 500 reads and stores the component data 505 from the tape IC tag 504 (step S106), and the replaced component tape 503. The contents relating to the electronic component 3 housed in the device, for example, the shape is specified (step S108).

  Then, the component mounter 500 feeds the component tape 503 a predetermined number of times, and when the electronic component 3 of the replaced component tape 503 reaches the suction position of the head 512, the component mounter 500 responds to the shape of the electronic component 3 and the like. The height of the head 512 is adjusted (step S110). After adjusting the head 512, the component mounting machine 500 picks up the electronic component 3 with the head 512 and mounts it on the printed circuit board 2 (step S112).

  Further, after mounting the electronic component 3 in step S112 or determining that the component tape 503 has not been replaced in step S104 (N in step S104), the component mounter 500 prints all the electronic components 3 It is determined whether or not it is mounted on the substrate 2 (step S114).

  When it is determined that all the electronic components 3 are not mounted (N in step S114), the component mounter 500 repeatedly executes the operation from step S102 again, and when it is determined that all the electronic components 3 are mounted. (Y in step S114), the stored management data 507 is updated, and the updated management data 507 is written in the board IC tag 506 on the printed board 2 (step S116).

  As described above, the component tape 503 according to the present embodiment includes the tape IC tag 504 at the tip portion, so that the component mounter 500 can easily detect the joint of the component tape 503, and the Since the tape IC tag 504 stores the component data 505, the component mounter 500 can easily read the component data 505 at the timing when the component tape 503 is switched. As a result, the worker can improve the work efficiency without performing the work of reading the barcode attached to the reel with the barcode reader when the component tapes are joined together as in the conventional example. .

  In addition, the component mounters 500 and 600 according to the present embodiment include the component lead unit 511 that communicates with the tape IC tag 504, thereby detecting a joint of the component tape 503 and newly connecting the component tape 503. The contents related to the electronic component 3 housed in the tape can be easily grasped from the component data 505 stored in the tape IC tag 504. Furthermore, the component mounters 500 and 600 according to the present embodiment include a board RW unit 514 that communicates with the board IC tag 506 attached on the printed board 2, and the contents relating to the electronic component 3 mounted on the printed board 2. Then, based on the contents grasped from the component data 505, the data is written in the board IC tag 506 on the printed board 2. Thus, for example, even if the component tapes 503 are joined together and the lots of the electronic components 3 housed in the joined component tapes 503 are different, the board IC tag 506 is mounted on the printed board 2. Since the contents related to all the electronic components are stored as management data 507, the lot of each electronic component 3 mounted on the printed circuit board 2 can be specified based on the management data 507. As a result, each electronic component 3 mounted on the printed circuit board 2 can be reliably managed.

  In addition, since the printed circuit board 2 in the present embodiment includes the substrate IC tag 506, the result of the mounting operation and the contents related to the mounted electronic component 3 are written to the substrate IC tag 506 as needed, and the printed circuit board 2 The contents can be managed every two. That is, when managing the contents of the electronic component 3 mounted by pasting a barcode on the printed circuit board 2, when the electronic component 3 is further mounted on the printed circuit board 2, the barcode is rewritten. Since this is not possible, the barcode must be replaced. In the present embodiment, by providing the substrate IC tag 506, the electronic component 3 can be easily managed without requiring such troublesome work.

Further, in the component mounting system according to the present embodiment, since the control device 700 communicates with each of the component mounting machines 500 and 600 and possesses the management data 507 in a lump, an operator has to bother to print each printed circuit board 2. Without reading the management data 507 from the IC tag 506, the contents related to the electronic component 3 mounted on each printed circuit board 2 and the contents indicating the work result can be managed in an integrated manner.
(Modification 1)
Next, a modified example of the printed circuit board in the present embodiment will be described.

FIG. 33 is a front view of a printed circuit board according to this modification.
As shown in FIG. 33, the printed circuit board 2a according to this modification is a multi-sided board in which a plurality of child boards 2b are generated by being divided, and each of the child boards 2b includes The substrate IC tags 506 are attached one by one.

  Specifically, a plurality of grooves 9 penetrating from the front surface to the back surface are formed in the printed circuit board 2a, and the above-described child substrate 2b is formed from a portion surrounded by each groove 9 on the printed circuit board 2a. . A substrate IC tag 506 is attached to the corner of each of the sub-substrates 2b.

  In general, printed circuit boards for multi-sided processing are put into a component mounting machine for each board, and electronic components are mounted. After all mounting operations are completed, they are divided and distributed to the market as divided child boards. To do. Here, if only one board IC tag 506 is attached to the printed board as in the above embodiment, the electronic components cannot be managed for each sub board. End up.

Therefore, the multi-sided printed circuit board 2a according to the present modification can manage the mounted electronic component 3 for each child board 2b by providing the board IC tag 506 for each child board 2b.
(Modification 2)
Next, a modification of the component tape in the present embodiment will be described.

FIG. 34 is a front view of a component tape according to this modification.
A component tape 503e according to this modification includes a plurality of tape IC tags 504.
That is, the carrier tape 503b of the component tape 503e is attached with the tape IC tag 504 at the tip as in the above embodiment, and the tape IC tag 504 also at a position between the electronic components 3 to be housed. Is attached.

  The IC tag for tape 504 at the front end stores component data corresponding to the electronic component 3 at the rear (end side), and the second IC tag for tape 504 from the front end is the other one at the rear. Component data corresponding to the electronic component 3 is stored. That is, each tape IC tag 504 records component data corresponding to one electronic component 3 located behind it.

  In this way, by providing the component tape 503e with a plurality of IC tags 504 for tape corresponding to each electronic component 3, the contents such as the component name and lot number of each electronic component 3 stored in the component tape 503e are different. Even in such a case, the contents can be reliably associated with each electronic component 3.

Since the tape IC tag 504 corresponding to the electronic component 3 is attached to the front (front end side) of each electronic component 3, the component tape 503e is joined to the end of the component tape 503e in use from the middle. be able to. That is, when the component tape 503e is cut at the above-mentioned part, if the tape IC tag 504 is cut so that it remains at the new tip after the cutting, the component tape 503e is cut into a new one after cutting. It can be connected from the tip. Thereby, the usability of the component tape 503e can be improved.
(Modification 3)
Next, a modification regarding the update timing of the management data 507 in the present embodiment will be described.

  In the present embodiment, the management data 507 is updated after all the electronic components 3 are mounted on the printed circuit board 2 in each component mounting machine. However, in this modification, the tape of the replaced component tape 503 is used. At the timing when the component data 505 is read from the IC tag 504 and stored in the data storage unit 515, the mounted component information 507b of the management data 507 is updated. Furthermore, when the printed circuit board 2 is loaded into the component mounting machine, the management data 507 is read from the IC tag 506 for the printed circuit board 2 and stored in the data storage unit 515, and is already stored in the data storage unit 515. The mounted component information 507b of the management data 507 is updated using the component data 505 that has been recorded.

  That is, when the printed circuit board 2 is inserted, the component mounter already takes out the electronic component 3 from the component tape 503 at any Z-axis position with respect to the printed circuit board 2 and mounts the electronic component at any position. I recognize that. As a result, when the printed circuit board 2 is inserted and the management data 507 is read, the component mounter reads the contents of the component data 505 stored in association with the Z-axis position into the mounted component information of the management data 507. Write in each column of 507b to update the mounted component information 507b.

  Here, since the number of electronic components 3 is included in the component data 505, the component mounter grasps the remaining amount of the electronic components 3 by counting the number of the extracted electronic components 3. As a result, when it is determined that the remaining amount of the electronic component 3 is smaller than the number of electronic components 3 to be mounted on one printed circuit board 2, the contents of the mounted component information 507b are updated by the remaining amount. Then, at the timing when the component data 505 is read from the tape IC tag 504 of the replaced component tape 503 and stored in the data storage unit 515, the remaining data to be mounted based on the content of the read component data 505. For the electronic component 3, the mounting component information 507b of the management data 507 is updated.

  When an electronic component 3 adsorption error or mounting error occurs during the mounting process, the remaining amount of the electronic component 3 grasped by the component mounting machine may differ from the actual remaining amount. The machine detects the occurrence of such an error and corrects the remaining amount ascertained.

Further, the mounting component information 507b of the management data 507 may be updated at any time when each electronic component 3 is mounted on the printed circuit board 2.
For example, the component mounter takes out the electronic component 3 from the component tape 503 at a predetermined Z-axis position, and stores the electronic component 3 in association with the predetermined Z-axis position when the electronic component 3 is mounted on the printed circuit board 2. The contents of the component data 505 being written are written in each column of the mounting component information 507b of the management data 507, and the mounting component information 507b is updated. When the component mounter detects the tape IC tag 504 of the replaced component tape 503, the component mounter grasps the Z-axis position of the component tape 503, and already stores the component tape 503 in association with the Z-axis position. The data 505 is deleted, and new component data 505 is read from the tape IC tag 504 of the replaced component tape 503 and stored in association with the Z-axis position. After that, the component mounter writes the contents of the new component data 505 in each column of the mounted component information 507b of the management data 507 at the mounting timing, and updates the mounted component information 507b.

As mentioned above, although this invention was demonstrated using Embodiment 1-3 and the modification, this invention is not limited to these.
For example, in Embodiments 1 and 2, the IC tag is attached to the reel, and in Embodiment 3 and its modification, the IC tag is attached to the tip of the component tape, but the IC tag may be attached to other parts. good.

FIG. 35 is an explanatory diagram for explaining another method of attaching the IC tag 426b.
In this attachment method, a slide member 509 made of, for example, a resin molded product is slidably attached to the component tape. The IC tag 426b is attached to the slide member 509.

  The IC tag 426b attached in this way can always stay at a fixed position with respect to the component mounting machines 100 and 200 even when the component tapes are sequentially pulled out for component mounting. . For example, the slide member 509 is locked to a predetermined part of the component mounting machines 100 and 200, so that the slide member 509 stays at a fixed position while sliding with respect to the component tapes sequentially pulled out.

  As a result, the IC tag reader / writer 111 of the component mounters 100 and 200 can read component information from the IC tag 426b on the component tape even during component mounting.

  The component mounters 100 and 200 can write the remaining number of electronic components 423d included in the component tape into the IC tag 426b using the IC tag reader / writer 111. Thus, even if the component tape 503 in use is removed from the component mounters 100 and 200 together with the supply reel 426, the slide member 509 is attached to the component tape, and is attached to the slide member 509. The remaining number of electronic components 423d is written in the IC tag 426b. As a result, the worker can reliably manage the remaining number of electronic components 3 included in the component tape removed in the middle without recounting.

  In the first and second embodiments, the IC tag 426b is attached to the supply reel 426. However, if the IC tag 426b is not the supply reel 426, but holds the group of electronic components 423a to 423d, the tray or bulk The IC tag 426b may be attached to a stick or the like.

FIG. 36 is a diagram illustrating a state where the IC tag 426b is attached to the tray.
The tray 117a supports the group of electronic components 423a to 423d so that they are arranged on a plane. A plurality of such trays 117a are accommodated in the tray supply section 117 so as to overlap each other with a gap therebetween.

  The IC tag 426b is attached to each tray 117a. The two IC tag reader / writers 111 determine the position of the IC tag 426b, that is, the position of each IC tag 426b in the overlapping direction of each tray 117a, based on the reception result of the radio wave from the IC tag 426b attached to each tray 117a. Identify. As a result, the two IC tag reader / writers 111 can specify the position or number of each tray 117a, as with the Z number described above.

FIG. 37 is a diagram illustrating a state in which the IC tag 426b is attached to the stick.
The stick 177b is an elongate container made of, for example, a resin molded product, and stores a group of electronic components 423a to 423d so that they are arranged in a line without any gap. Such a plurality of sticks 117b are attached to the component mounters 100 and 200 in a line in such a manner that their longitudinal directions are along the vertical direction.

  The IC tag 426b is attached to each stick 117b. The two IC tag reader / writers 111 determine the position of the IC tag 426b, that is, the position of each IC tag 426b in the arrangement direction of each stick 117b, based on the reception result of the radio wave from the IC tag 426b attached to each stick 117b. Identify. As a result, the two IC tag reader / writers 111 can specify the position or number of each stick 117b in the same manner as the Z number described above.

  Further, as long as it is a component holder that holds a group of electronic components, the IC tag 426b may be attached to the component cassette (feeder) 114 in addition to a stick, a bulk (bulk cassette), a tray, a component tape, a reel, or the like.

  In the first and second embodiments, the component mounter 100 using the component cassette 114 has been described. However, there is a component mounter of a type in which the component tape is not stored in the component cassette 114. Such a component mounting machine is provided with a mechanism for feeding a tape to the component supply unit, and by setting the component tape in the tape feeding mechanism, the component tape can be intermittently fed to supply the component.

  In the first and second embodiments described above, the component verification apparatus 300 performs component verification. However, the component mounter 100 or 200 may have the function of the component verification apparatus 300. In this case, the component mounters 100 and 200 collate the component information read from the IC tag 426b, the Z number of the component tape, and the component arrangement data. The work is taken out and mounted on the board.

  In the third embodiment and the modification, the component data 505 is written in the tape IC tag 504 attached to the carrier tape 503b in advance. However, after the component data 505 is written in the tape IC tag 504, the component data The tape IC tag 504 in which 505 is written may be attached to the component tape 503. In this case, the component tape 503 can be easily joined from any part (on the way). That is, when the replacement component tape 503 is joined to the end of the component tape 503 in use from the middle, the replacement component tape 503 is cut at the middle portion, and at the tip of the new component tape 503, The tape IC tag 504 in which the component data 505 is written is attached.

In the third embodiment and the modification, the tape IC tag 504 is attached to the component tape 503. However, for example, a two-dimensional barcode may be attached.
Furthermore, in the third embodiment and the modified example, the component name, serial number, and lot number are stored in the mounting component information 507b of the management data 507, but the vendor code, shape, and manufacturing date included in the component data 505 are also included. It goes without saying that the date, date of opening, etc. may be stored. By storing these, the electronic component 3 mounted on the printed circuit board 2 can be managed by a vendor code, an opening date, and the like.

  Furthermore, in the second modification of the third embodiment, a plurality of tape IC tags 504 are provided in the component tape 503e. However, other tape IC tags 504 other than the tape IC tag 504 arranged at the head may be used, for example. It may be replaced with a barcode. In this case, the first tape IC tag 504 stores only the contents related to the first electronic component 3 stored in the component tape 503e as the component data 505, and the bar codes corresponding to the other electronic components 3 are Only the contents different from the component data 505 are shown. In general, the amount of information contained in a barcode is small compared to an IC tag, but the production cost of the component tape 503e can be reduced by representing only the differences with the barcode.

  The present invention can be applied to a component mounting system or the like that can perform a plurality of types of component mounting at a time.

1 is an external view showing a configuration of an entire component mounting system according to a first embodiment of the present invention. It is a top view which shows the main structures of the component mounting machine in a component mounting system same as the above. It is a figure which shows the circuit structure of an IC tag reader / writer same as the above and an IC tag. It is a schematic diagram which shows the positional relationship of the working head and component cassette of a component mounting machine same as the above. (A) is a figure which shows the structural example of a total of four component supply parts which each of the two mounting units with which the component mounting machine same as the above has, (b) is the number of mounted various component cassettes in the same configuration as above It is a table | surface figure which shows the position on a Z-axis. (A) is a figure which shows the example of the position (Z-axis) of the component supply part which 10 nozzle head same as the above can adsorb | suck, (b) is a table | surface figure for demonstrating a position same as the above. (A) is a figure which shows the example of the chip-type electronic component used as mounting object same as the above, (b) is a figure which shows the other example of the chip-type electronic component same as the above, (c), It is a figure which shows the further another example of a chip-type electronic component same as the above, (d) is a figure which shows the further another example of a chip-type electronic component same as the above. It is a figure which shows the example of the carrier tape which accommodated the components same as the above, and its supply reel. It is a figure which shows the example of the components cassette with which the taping electronic component same as the above was mounted | worn. It is a block diagram which shows the hardware constitutions of a component collation apparatus same as the above. It is a figure which shows the example of the content of mounting point data same as the above. It is a figure which shows the example of the content of a component library same as the above. It is a figure which shows the example of the content of mounting apparatus information same as the above. It is a figure which shows an example of the components arrangement | sequence data stored in the components arrangement | sequence data storage part same as the above. It is a figure for demonstrating in detail the structure of a component supply part same as the above. It is a figure which shows the joint line of a carrier tape same as the above. It is a figure for demonstrating the method of specifying Z number of a carrier tape from IC tag same as the above. It is explanatory drawing for demonstrating a mode that one IC tag reader / writer same as the above discriminate | determines the position of an IC tag. It is a flowchart of a component collation process same as the above. It is a flowchart of the modification of a component collation process same as the above. It is a flowchart of the component collation process at the time of component tape joining same as the above. It is a flowchart of a manufacturing information write process same as the above. It is a flowchart of the part arrangement data creation processing in the second embodiment according to the present invention. It is a flowchart of the modification of a component arrangement | sequence data creation process same as the above. It is a flowchart of a component library creation process same as the above. It is a block diagram which shows the structure of the component mounting system in 3rd Embodiment which concerns on this invention. It is explanatory drawing for demonstrating a component tape same as the above. (A) is explanatory drawing for demonstrating an example of the state with which the front-end | tip of the component tape for replacement | exchange was joined with the terminal end of the component tape same as the above, (b) It is explanatory drawing for demonstrating the other example of the state with which the front-end | tip of this component tape was joined. It is a block diagram which shows the internal structure of a component mounting machine same as the above. It is an information content display figure which shows the content of work result information same as the above. It is an information content display figure which displays the content of the mounting component information same as the above. It is a flowchart which shows operation | movement of a component mounting machine same as the above. It is a front view of the printed circuit board concerning a modification same as the above. It is a front view of the component tape which concerns on a modification same as the above. It is explanatory drawing for demonstrating the other attachment method of an IC tag. It is a figure which shows a mode that the IC tag was attached to the tray. It is a figure which shows a mode that the IC tag was attached to the stick.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 20 Circuit board 100 Component mounting machine 110 Front sub-equipment 111 IC tag reader / writer 112 Multi mounting head 112a-112b Adsorption nozzle 113 XY robot 114 Component cassette 115a, 115b Component supply part 116 Component recognition camera 117 Tray supply part 118 Shuttle conveyor 119 Nozzle station 120 Sub-equipment 300 Component verification device 301 Operation control unit 302 Display unit 303 Input unit 304 Memory unit 305 Optimization program storage unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component library 307c Mounting Device information 308 Component arrangement data storage unit 423d Taping electronic component 424, 441, 442 Carrier tape 424a Storage recess 425 Cover tape 426 Supply reel 426b IC tag 427 Main body frame 428 Reel side plate 429 Feed roller 430 Feed lever 431 Link 432 Ratchet 433 Cover tape stripping part 434 Cover tape take-up reel 435 Electronic component take-out part 436 Tension spring 445 Seam 450 Switch 452 Seam detection sensor

Claims (26)

A component collation method for collating, using a computer, a component taken out by a component mounter from a component holder that holds a plurality of components, and a component to be mounted on a board by the component mounter,
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The component verification method is:
A position specifying step for specifying a mounting position of the component holder mounted on the component mounter;
A reading step of reading the identification information from an IC tag attached to the component holder;
The identification information read in the reading step is compared with the specified component information in which the component to be mounted on the board is specified, the mounting position specified in the position specifying step, and the component holder And a collating step of collating with specified position information in which a position to be mounted is specified. In the location step,
The component verification method according to claim 1, wherein the mounting position of the component holder is specified based on an output state of a signal output from an IC tag via a wireless communication medium. The component holder is a component tape,
The component verification method further includes:
A detection step of detecting a joint between the component tape and a component tape newly mounted on the component mounter;
In the reading step,
When a seam is detected in the detection step, the identification information is read from the IC tag of the new component tape,
In the matching step,
The component verification method according to claim 2, wherein identification information corresponding to the new component tape read in the reading step is compared with the specified component information. The two component holders are mounted on the component mounter in a state of being stored in a component cassette,
In the positioning step,
The positional relationship of the two component holders in the component cassette is specified by specifying the position of each IC tag based on the communication status of the IC tags attached to the two component holders, respectively. The method for collating parts according to claim 2. The IC tag further stores substitute information for identifying a substitute part replaceable with a part held by the part holder,
In the reading step,
Read the alternative information from an IC tag attached to the component holder,
In the matching step,
The component verification method according to claim 1, wherein the identification information and the substitute information read in the reading step are compared with the specified component information. In the matching step,
When collating the substitute information and the specified part information,
The part collating method according to claim 5, wherein at least one of a name, a shape, and a characteristic value of a substitute part indicated by the substitute information is collated with the content indicated by the specified part information. The component verification method further includes:
As a result of the collation in the collation step, when the identification information and the specified component information do not match, a warning step of issuing a warning that informs that the wrong component holder is mounted is included. The component verification method according to claim 1. A plurality of parts to which the component holder of the component mounter can be mounted are provided with sensors for detecting the mounting of the component holder,
In the location step,
The component verification method according to claim 1, wherein a mounting position of the component holder is specified based on detection results of the plurality of sensors. A component number confirmation method for confirming the number of components held by the component holder, which is changed by taking out a component by a component mounter from a component holder that holds a plurality of components, using a computer,
The component holder is mounted with an identification information for identifying the component held by the component holder and an IC (Integrated Circuit) tag storing the number of components. Installed in the machine,
The number of parts confirmation method is as follows:
Each step included in the component verification method according to claim 1;
A number reading step for reading the number of parts from the IC tag of the parts holder;
A decrementing step of decrementing the number read in the number reading step by one each time the component mounting machine takes out the component from the component holder in order to mount the component on the board;
A component number confirming method, comprising: a number warning step for issuing a warning when the number after the decrement in the decrement step is less than a predetermined number. The method for checking the number of parts further includes:
Including a stop step of stopping the operation of mounting the component on the board by prohibiting the operation of taking out the component from the component holder when the number after the decrement in the decrement step becomes zero. The number-of-components confirmation method according to claim 9. A component arrangement data indicating a relationship between a mounting position at which a component holder for holding a plurality of components is mounted and a component held by the component holder with respect to a component mounter for mounting the component on the board, A component array data creation method created using
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The component arrangement data creation method includes:
A position specifying step for specifying a mounting position of the component holder mounted on the component mounter;
A reading step of reading the identification information from an IC tag attached to the component holder;
A component arrangement data creation method comprising: a data creation step of creating the component arrangement data by associating the mounting position identified in the position identification step with the identification information read in the reading step . A component library creation method for creating information on a component held by a component holder mounted on a component mounter using a computer as a component library,
The component holder is attached with an IC (Integrated Circuit) tag storing identification information for identifying a component stored in the component holder,
The part library creation method is:
A reading step of reading the identification information from an IC tag attached to the component holder;
And a creation step of creating the component library so that the identification information read in the reading step is included. In the reading step,
The component library creating method according to claim 12, wherein the content indicating at least one of the name, size, color, and shape of the component is read as the identification information. A component management method for managing a component taken out by a component mounter and mounted on a substrate from a component holder that holds a plurality of components using a computer,
The component holder is provided with a first IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder,
The component management method includes:
A reading step of reading the identification information from a first IC tag attached to the component holder;
A mounting step of sequentially removing components from the component holder and mounting them on a substrate;
And a writing step of writing the identification information read in the reading step into the second IC tag attached to the substrate in association with the component mounted in the mounting step. Method. A component holder for holding a plurality of components,
A component holder comprising an IC (Integrated Circuit) tag storing identification information for identifying the plurality of components. The component holder according to claim 15, wherein the IC tag further stores the number of the plurality of components. The component holder according to claim 16, wherein the IC tag further stores sizes of the plurality of components. The IC tag further includes manufacturing time of the plurality of parts, information indicating a manufacturing factory, information indicating a lot, part specification, serial number, information indicating a manufacturer, information indicating a shape, and the part being sealed. The component holder according to claim 17, wherein at least one of the date opened from the date is stored. A component verification device for verifying a component taken out by a component mounter from a component holder that holds a plurality of components and a component to be mounted on a board by the component mounter,
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The component verification device
Position specifying means for specifying the mounting position of the component holder mounted on the component mounter;
Reading means for reading the identification information from an IC tag attached to the component holder;
The identification information read by the reading unit and the specified component information that specifies the component to be mounted on the board are collated, the mounting position specified by the position specifying unit, and the component holder And a collating means for collating with specified position information in which a position to be mounted is specified. A component number confirmation device for confirming the number of components held by the component holder, which varies when components are taken out by a component mounter from a component holder that holds a plurality of components,
The component holder is mounted with an identification information for identifying the component held by the component holder and an IC (Integrated Circuit) tag storing the number of components. Installed in the machine,
The number of parts confirmation device is
The component verification device according to claim 19,
Number reading means for reading the number of parts from the IC tag of the parts holder;
Decrementing means for decrementing the number read in the number reading step by one each time the component mounter removes the component from the component holder in order to mount the component on the board;
A component number confirmation device comprising: a number warning unit that issues a warning when the number after the decrement by the decrement unit becomes less than a predetermined number. For a component mounter that mounts components on a board, component arrangement data indicating the relationship between a mounting position where a component holder that holds a plurality of components is mounted and a component that is held by the component holder is created. A component arrangement data creation device,
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The component arrangement data creation device includes:
Position specifying means for specifying the mounting position of the component holder mounted on the component mounter;
Reading means for reading the identification information from an IC tag attached to the component holder;
A component arrangement data creation device comprising: data creation means for creating the component arrangement data by associating the mounting position specified by the position specification means with the identification information read by the reading means . A component library creation device that creates information on a component held by a component holder mounted on a component mounter as a component library,
The component holder is attached with an IC (Integrated Circuit) tag storing identification information for identifying a component stored in the component holder,
The parts library creation device includes:
Reading means for reading the identification information from an IC tag attached to the component holder;
A component library creating apparatus comprising: a creating unit that creates the component library so that the identification information read by the reading unit is included. A component mounter that takes out the component from a component holder that holds a plurality of components and mounts the component on a substrate,
The component holder is provided with a first IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder,
The component mounter is
Reading means for reading the identification information from a first IC tag attached to the component holder;
Mounting means for sequentially taking out components from the component holder and mounting them on a substrate;
Writing means for writing the identification information read by the reading means to the second IC tag attached to the substrate in association with the component mounted by the mounting means. Machine. A component mounter that takes out the component from a component holder that holds a plurality of components and mounts the component on a substrate,
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The component mounter is
Position specifying means for specifying the mounting position of the component holder mounted on the component mounter;
Reading means for reading the identification information from an IC tag attached to the component holder;
The identification information read by the reading unit and the specified component information that specifies the component to be mounted on the board are collated, the mounting position specified by the position specifying unit, and the component holder Collating means for collating the specified position information in which the position to be mounted is specified;
As a result of collation by the collating means, when the identification information and the specified part information match, and when the mounting position and the specified position information match, the part held by the part holder is taken out, and the part A component mounting machine comprising: a mounting means for mounting on a board. A program for collating a component taken out by a component mounter from a component holder that holds a plurality of components with a component to be mounted on a board by the component mounter,
The component holder is mounted on the component mounter with an IC (Integrated Circuit) tag storing identification information for identifying the component held by the component holder. ,
The program is
A position specifying step for specifying a mounting position of the component holder mounted on the component mounter;
A reading step of reading the identification information from an IC tag attached to the component holder;
The identification information read in the reading step is compared with the specified component information in which the component to be mounted on the board is specified, the mounting position specified in the position specifying step, and the component holder A program for causing a computer to execute a collating step of collating with a specified position information in which a position where to be mounted is specified. A storage medium for storing the program according to claim 25.

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