JP2005088431A - Barrier film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a barrier film having excellent gas barrier properties for preventing the permeation of an oxygen gas or the like. <P>SOLUTION: This barrier film is composed of at least a base material film and the barrier layer provided on one side of the base material film. Further, the gas barrier layer comprises a metal oxide layer by a physicochemical vapor phase growing method, and at least two silicon oxide layers, which are formed by using at least two film-forming mixed gas compositions prepared by using at least two film-forming chambers and changing the mixing ratio of respective gas components of the film-forming mixed gas composition containing a film-forming monomer gas comprising at least one kind of an organosilicon compound, an oxygen gas and an inert gas at each of film forming chambers by a plasma chemical vapor phase growing method. Further, the respective silicon oxide layers contain a carbon atom and are different in the content of carbon. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a barrier film.

  In recent years, as a barrier material used for packaging materials, for example, a biaxially stretched polyethylene terephthalate film or a biaxially stretched nylon film or the like on one surface of a base film such as silicon oxide or aluminum oxide A transparent barrier film provided with an inorganic oxide vapor-deposited film has been developed and proposed, and the trend has attracted attention.

  For example, a transparent barrier-composite film having retort resistance, characterized in that a silicon oxide thin film is provided on the surface of a base material made of a transparent plastic film via an aluminum oxide thin film (for example, Patent Documents). 1).

  Further, an aluminum oxide vapor deposition film having a thickness of 2000 mm or less is formed on at least one surface of the transparent film, and a silicon oxide vapor deposition film having a thickness of 2000 mm or less is formed on the aluminum oxide vapor deposition film. High barrier properties, strong adhesion, and non-curling transparent vapor deposition films have also been proposed (see, for example, Patent Document 2).

  Further, in a laminated film in which a transparent gas barrier layer made of an inorganic compound is laminated on one side of a base material made of a polymer material having transparency, the transparent gas barrier layer contains a metal oxide thin film layer having a film thickness of 30 to 300 nm and carbon. A gas barrier laminate film having a transparent and printed layer has been proposed, characterized by having a laminated structure in which a silicon oxide thin film layer of 40 to 150 nm including a range of ˜40 at% and a printed layer are sequentially formed (for example, , See Patent Document 3).

  In addition, a transparent barrier film characterized by laminating at least two or more inorganic oxide thin films on a flexible plastic substrate has also been proposed (see, for example, Patent Document 4).

  Furthermore, in a packaging-required film in which an inorganic compound film is provided on at least one side of a substrate made of a transparent polymer film, the inorganic compound film is composed of at least two layers, the layer in contact with the substrate is aluminum oxide, and the surface layer is A packaging film comprising silicon oxide has also been proposed (see, for example, Patent Document 5).

In addition, a transparent barrier nylon film characterized in that a first thin film and a second thin film made of at least two kinds of inorganic oxides are laminated on one surface of a biaxially stretched nylon film substrate. Has been proposed (see, for example, Patent Document 6).
Japanese Patent No. 2682101 (Claims etc.) Japanese Patent Laid-Open No. 3-64449 (Claims etc.) Japanese Patent No. 3070404 (claims, etc.) JP-A-10-101825 (Claims etc.) JP-A-10-128901 (Claims etc.) Japanese Patent Laid-Open No. 11-105189 (Claims etc.)

  However, in the invention according to the above [Patent Document 1], the aluminum oxide thin film and the silicon oxide thin film are both laminated by physical vapor deposition, and the vapor deposited film is simply physically attached to the substrate. And the film is hard, inferior in flexibility, flexibility, etc., easily cracks due to extension, bending, etc., and often lacks barrier properties. .

  Furthermore, the aluminum oxide thin film and silicon oxide thin film described above are deformed when heat is applied due to retort treatment, etc., and lacks the ability to follow the deformation of the base material and easily generate cracks. As a result, there is a problem that the barrier property is lowered.

  Furthermore, when forming the above aluminum oxide thin film and silicon oxide thin film, sputtering, ion plating, etc., which are excellent in adhesion, are used. Since it is inferior, there also exists a problem that it cannot be used for manufacture of packaging materials, such as food packaging.

  Next, in the invention according to the above [Patent Document 2], both the silicon oxide vapor deposition film and the aluminum oxide vapor deposition film are laminated by the physical vapor deposition method as in the invention according to the above [Patent Document 1]. The deposited film is merely physically attached to the substrate, and the film is hard, inferior in flexibility, flexibility, etc., spread, bent, etc. Therefore, there is a problem that cracks are easily generated, and barrier properties are often lacking.

  In the invention according to the above [Patent Document 3], a silicon oxide thin film containing carbon atoms is formed by plasma chemical vapor deposition, and the thickness of the silicon oxide thin film is 40 nm or more. Therefore, the silicon oxide thin film composed of such a thick film easily cracks due to spreading, bending, etc., and thus has a problem that the barrier property is remarkably lacking.

  Next, in the invention according to the above [Patent Document 4] and [Patent Document 6], by providing an aluminum oxide layer as the first layer, it is possible to provide a degassing prevention property and a barrier property from the base material. However, when the silicon oxide layer is laminated by the physical vapor deposition method as the second layer, the films such as the aluminum oxide layer and the silicon oxide layer are weak in bending and spreading, and the aluminum oxide layer, Cracks and the like are generated in both silicon oxide layers, and as a result, there is a problem that barrier properties cannot be obtained.

  Further, even when a silicon oxide layer is stacked by chemical vapor deposition, the silicon oxide layer is a single layer film, and one kind of carbon, hydrogen, silicon and oxygen, or 2 It is a continuous layer containing at least a compound composed of more than one kind of element, and the compound is only continuously changing in the single layer film, and oxygen gas, water vapor, etc. are once taken into the film. In addition, there is a problem that suppressing transmission of oxygen gas, water vapor and the like is within the enemy.

  Furthermore, in the invention according to the above [Patent Document 5], since the film thickness of the aluminum oxide layer is a very thin film of 5 to 10 nm, the film itself has almost no barrier property and is laminated on the film. Only the barrier property due to the silicon oxide layer to be produced can be exhibited, and as a result, there is a problem that the barrier property is extremely inferior.

  In the conventional transparent barrier film in which an inorganic oxide thin film such as an aluminum oxide layer or a silicon oxide layer is layered as described above, and the layered inorganic oxide thin film layer is a barrier layer, a packaging material is used. As a barrier material used in the above, it is possible to prevent permeation of oxygen gas, water vapor, etc., but as a barrier film having a higher gas barrier property, it is still not a sufficiently satisfactory situation. This is the actual situation.

  Therefore, the present invention has a metal oxide layer and a silicon oxide layer that are stacked, and the multilayer film is used as a barrier layer, and has excellent adhesion between the base film and the barrier layer, and its extensibility and flexibility. Excellent in flexibility, etc. In addition, it prevents the penetration of oxygen gas, water vapor, etc. as a barrier material used for packaging materials etc. It is an object to provide a very useful barrier film that is excellent in gas barrier properties and that does not show a decrease in performance of the gas barrier properties.

  As a result of various studies to solve the above-mentioned problems, the present inventor first provided a metal oxide layer by a physical vapor deposition method on a base film, and further, the metal oxide. On the layer, at least two or more film forming chambers are used, and for each chamber, a film forming monomer gas, oxygen gas, and inert gas composed of at least one organic silicon compound is used. Using two or more film-forming mixed gas compositions prepared by changing the mixing ratio of each gas component of the film-forming mixed gas composition containing the film, and using each of the film-forming mixed gas compositions A multi-layered silicon oxide layer formed by plasma chemical vapor deposition of two or more layers is provided, a barrier layer is formed from a multilayer film of the metal oxide layer and the multi-layered silicon oxide layer, and Each silicon oxide layer constituting the barrier layer contains carbon atoms in the film, and When a barrier film having a structure in which the carbon atom content is different for each silicon oxide layer was manufactured, first, the silicon oxide layer was formed into a metal oxide layer by plasma chemical vapor deposition together with the barrier property by the metal oxide layer. By laminating multiple layers on top, the adhesion between the metal oxide layer and the silicon oxide layer is excellent and the silicon oxide layer is excellent in spreadability, flexibility, flexibility, flexibility, etc. In addition, it is possible to form a film having a very excellent high barrier property from the first layer, and further, using a plasma chemical vapor deposition apparatus comprising at least two film forming chambers, silicon oxide Since two or more layers of physical layers are continuously laminated, and each layer can form a film having a high barrier property, a gas barrier property higher than that of a single layer is obtained. Can be large By continuously forming the film, it is possible to prevent foreign matter, dust, and the like that cause cracks from entering between the film forming layers, and further, the deterioration of the barrier property is not recognized, Furthermore, since each silicon oxide layer is a discontinuous layer containing carbon atoms in the film and having different carbon atom contents for each silicon oxide layer, oxygen gas, water vapor, etc. In particular, the metal oxide layer is excellent in tight adhesion with a multi-layered silicon oxide layer excellent in spreadability, flexibility, flexibility, flexibility, and the like. A high-barrier film can be composed of a multilayer film of an oxide layer and a multi-layered silicon oxide layer. For example, as a barrier material used for packaging materials, etc., it prevents the transmission of oxygen gas, water vapor, etc. Excellent gas barrier properties and performance of the gas barrier properties The present invention has been completed by finding that a very useful barrier film with no reduction can be produced.

  That is, the present invention comprises at least a base film and a barrier layer provided on one surface of the base film, and the barrier layer is first subjected to metal oxidation by physical vapor deposition. A film-forming monomer comprising at least two or more film-forming chambers on the metal oxide layer and comprising at least one organic silicon compound in each chamber. -Using two or more film-forming mixed gas compositions prepared by changing the mixing ratio of each gas component of the gas-forming gas composition containing gas, oxygen gas, and inert gas, Each of the above-mentioned silicon oxide layers is composed of two or more layers of silicon oxide layers formed by plasma chemical vapor deposition using a mixed gas composition for a film. Contains carbon atoms and each silicon oxide layer has a carbon atom content of Relates barrier film characterized in that it consists consisting configuration.

  According to the present invention, first, on the base film, the silicon oxide layer is formed on the metal oxide layer by plasma enhanced chemical vapor deposition together with the barrier property by the metal oxide layer previously provided. By laminating the layers, the adhesion between the metal oxide layer and the silicon oxide layer is excellent, and the silicon oxide layer is excellent in spreadability, flexibility, flexibility, flexibility, and the like. From the first layer, an extremely excellent high barrier film can be formed, and a silicon oxide layer is continuously formed using a plasma chemical vapor deposition apparatus comprising at least two film forming chambers. Since two or more layers are laminated and each layer can form a film having a high barrier property, a gas barrier property higher than that of a single layer can be obtained, and By continuously forming a film that opens to the atmosphere It is possible to prevent foreign matter, dust, and the like causing the rack from entering between the film forming layers, and further, no deterioration of the barrier property is observed. Further, each silicon oxide layer is included in the film. Since it is a discontinuous layer that contains carbon atoms and has different carbon atom contents for each silicon oxide layer, it can completely block the transmission of oxygen gas, water vapor, etc. The material layer is excellent in tight adhesion with a multi-layered silicon oxide layer having excellent spreadability, flexibility, flexibility, flexibility, etc., and a multilayer film of the silicon oxide layer and the metal oxide layer, A high-barrier film can be formed by both of them, for example, as a barrier material used for packaging materials and the like, it has excellent gas barrier properties that prevent permeation of oxygen gas, water vapor, and the like, and the performance of the gas barrier properties is reduced. Extremely useful barriers Film is that it can be manufactured.

  The barrier film according to the present invention will be described below in more detail with reference to the drawings.

  1, 2, and 3 are schematic configuration diagrams showing a schematic configuration of two examples of the production apparatus of the barrier film according to the present invention, and FIG. 4 is about the barrier film according to the present invention. It is a schematic sectional drawing which shows an example of the layer structure.

  First, the production method of the barrier film according to the present invention will be described. The barrier film according to the present invention first forms a metal oxide layer by physical vapor deposition on one surface of a base film. Is.

  Thus, the method for forming the metal oxide layer constituting the barrier film according to the present invention will be described in more detail. Examples of the metal oxide layer formed by the physical vapor deposition method include a vacuum deposition method, a sputtering method, The metal oxide layer can be formed using a physical vapor deposition method (Physical Vapor Deposition method, PVD method) such as an ion plating method or an ion cluster beam method.

  In the present invention, specifically, a metal oxide is used as a raw material, and this is vaporized by heating and vapor deposition, or a metal or metal oxide is used as a raw material, and oxygen gas is supplied. It is preferable to form the metal oxide layer using an oxidation reaction vapor deposition method in which the metal oxide is deposited by oxidation, and a plasma-assisted oxidation reaction vapor deposition method in which the oxidation reaction is supported by plasma. is there.

  In the above, as a heating method of the vapor deposition material, for example, a resistance heating method, a high frequency induction heating method, an electron beam heating method (EB), or the like can be used.

  In the present invention, a specific example of a method for forming a metal oxide layer by physical vapor deposition will be described. FIG. 1 is a schematic configuration diagram showing an example of a take-up vacuum deposition apparatus.

  As shown in FIG. 1, the base film 4 is unwound from the unwinding roll 3 in the vacuum chamber-2 of the wind-up type vacuum deposition apparatus 1, and then the base film 4 is removed if necessary. Then, it is guided to the cooled coating drum 5 through a guide roll or the like.

  Thus, the base film 4 guided on the cooled coating drum 5 was heated with the crucible 6 by, for example, irradiating the electron beam 8 with the electron gun 7. The evaporation source 9, for example, metal aluminum or aluminum oxide is evaporated, and if necessary, oxygen gas or the like is supplied from the oxygen gas cylinder 10 disposed outside the take-up vacuum deposition apparatus 1 from the oxygen gas outlet 11. The metal oxide layer is formed by forming a vapor-deposited film of a metal oxide such as, for example, aluminum oxide through the mask 12 while supplying and supplying the same. The base film 1 on which a metal oxide layer such as aluminum oxide is formed is sent out through a guide roll or the like, if necessary, and then wound up on a take-up roll 13. On one side, it is possible to form the base film 4 forming a metal oxide layer.

  In the above, as the metal oxide layer, any thin film basically deposited in the form of a metal oxide can be used. For example, silicon (Si), aluminum (Al), magnesium (Mg), calcium ( An oxide layer of a metal such as Ca), potassium (K), tin (Sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), yttrium (Y), etc. Can be used.

  Thus, preferred examples include metal oxide layers such as silicon (Si) and aluminum (Al).

Thus, the metal oxide layer can be referred to as a metal oxide such as silicon oxide, aluminum oxide, magnesium oxide, and the notation thereof is, for example, SiO _x , AlO _x , MgO _x. MO _X (wherein, M represents a metal element, and the value of X varies depending on the metal element).

  Moreover, as a range of said X value, silicon (Si) is 0-2, aluminum (Al) is 0-1.5, magnesium (Mg) is 0-1, calcium (Ca) is 0 to 1, potassium (K) is 0 to 0.5, tin (Sn) is 0 to 2, sodium (Na) is 0 to 0.5, boron (B) is 0 to 1, 5, Titanium (Ti) can take values in the range of 0 to 2, lead (Pb) in the range of 0 to 1, zirconium (Zr) in the range of 0 to 2, and yttrium (Y) in the range of 0 to 1.5.

  In the above, when X = 0, it is a complete metal and is not transparent and cannot be used at all. The upper limit of the range of X is a completely oxidized value.

  In the present invention, generally, examples other than silicon (Si) and aluminum (Al) are scarce, silicon (Si) is 1.0 to 2.0, and aluminum (Al) is 0.5. Those with values in the range of -1.5 can be used.

  In the present invention, the film thickness of the metal oxide layer as described above varies depending on the metal used or the type of metal oxide, but is, for example, about 50 to 2000 mm, preferably about 100 to 1000 mm. It is desirable to select and form arbitrarily within the range.

  In the present invention, as the metal oxide layer, the metal to be used or the metal oxide is a metal oxide layer that is used in one kind or a mixture of two or more kinds and mixed with different materials. It can also be configured.

  Next, in the present invention, after forming a metal oxide layer by physical vapor deposition on one surface of the base film as described above, a multilayer silicon oxide layer is formed on the metal oxide layer. The barrier film according to the present invention can be produced by forming a barrier layer composed of the metal oxide layer and the multiple silicon oxide layers.

  The method for forming the multilayer silicon oxide layer constituting the barrier film according to the present invention will be described in more detail. As the multilayer silicon oxide layer, for example, a multi-layered silicon oxide layer may be formed using a chemical vapor deposition method or the like. It can be formed by forming a silicon oxide layer.

  Specifically, for example, a silicon oxide layer using a chemical vapor deposition method (Chemical Vapor Deposition method, CVD method) such as a plasma chemical vapor deposition method, a thermal chemical vapor deposition method, or a photochemical vapor deposition method. Thus, it is desirable to form a film using a low-temperature plasma chemical vapor deposition method, among others.

  In the present invention, specifically, after forming a metal oxide layer on one surface of the base film as described above, a film made of one or more organic silicon compounds is formed on the metal oxide layer. Monomer gas for raw material, inert gas such as argon gas and helium gas is used as carrier gas, oxygen gas is used as oxygen supply gas, and mixed gas for film formation from them A composition is prepared, and this can be used to form a multi-layered silicon oxide layer made of silicon oxide or the like using a low temperature plasma chemical vapor deposition method utilizing a low temperature plasma generator or the like.

  In the above, for example, a high-frequency plasma, a pulse wave plasma, a microwave plasma, or the like can be used as the low-temperature plasma generator. Thus, in the present invention, a highly active and stable plasma is obtained. For this purpose, it is desirable to use a high-frequency plasma generator.

  Specifically, the production method of the multilayer silicon oxide layer constituting the barrier film according to the present invention will be described. FIG. 2 shows the formation of the multilayer silicon oxide layer by plasma enhanced chemical vapor deposition. It is a schematic block diagram which shows the outline | summary about a low-temperature plasma chemical vapor deposition apparatus.

  In the present invention, as shown in FIG. 2, as the plasma chemical vapor deposition apparatus 21, the supply chamber 22 for supplying the base film 4 having the metal oxide layer formed on one surface thereof, the first A metal oxide layer and a multi-layered silicon oxide layer were formed on the film forming chamber 23, the second film forming chamber 24, the third film forming chamber 25, and the base film 1, and these were stacked. The basic structure consists of a winding chamber 26 for winding the barrier film according to the present invention.

  Thus, in the present invention, first, the base film 4 having a metal oxide layer formed on one surface thereof, which is wound around the unwinding roll 27, is unrolled into the first film forming chamber 23. Further, the substrate film 4 is conveyed onto the circumferential surface of the cooling / electrode drum 30 at a predetermined speed via the auxiliary roll 29.

  Next, in the present invention, a film-forming monomer gas, oxygen gas, inert gas, etc. made of one or more organic silicon compounds are supplied from the raw material volatilization supply device 31, the gas supply device 32, and the like. The film-forming mixed gas composition is introduced into the first film-forming chamber 23 through the raw material supply nozzle 33 while adjusting the film-forming mixed gas composition, and the cooling / electrode On the metal oxide layer of the base film 4 conveyed on the peripheral surface of the drum 30, plasma is generated by the glow discharge plasma 34, and this is irradiated to irradiate the first layer of silicon oxide. An oxide layer is formed.

  Next, the base film 4 in which the first silicon oxide layer is formed on the metal oxide layer in the first film forming chamber 23 is passed through the auxiliary rolls 35, 36 and the like. Then, the substrate film 4 formed by forming the metal oxide layer and the first silicon oxide layer is cooled at a predetermined speed in the same manner as described above. Transport on the surface.

  Thereafter, similarly to the above, in the present invention, the raw material volatilization supply device 38, the gas supply device 39 and the like are used to form a film-forming monomer gas, oxygen gas, inert gas, which is composed of one or more organic silicon compounds. While supplying the other, adjusting the film-forming mixed gas composition comprising them, introducing the film-forming mixed gas composition into the second film-forming chamber 24 through the raw material supply nozzle 40, and On the first silicon oxide layer of the base film 4 obtained by forming the metal oxide layer and the first silicon oxide layer transported on the circumferential surface of the cooling / electrode drum 37, a gloss is formed. -Plasma is generated by the discharge plasma 41 and irradiated to form a second silicon oxide layer made of silicon oxide or the like.

  Furthermore, in the present invention, the base film 4 in which the metal oxide layer, the first layer, and the second silicon oxide layer are formed in the second film forming chamber 24 in the same manner as described above. Is transferred to the third film forming chamber 25 through the auxiliary rolls 42, 43, etc., and then the metal oxide layer, the first layer, and the second silicon oxide layer are formed in the same manner as described above. The formed base film 4 is conveyed onto the circumferential surface of the cooling / electrode drum 44 at a predetermined speed.

  Thereafter, similarly to the above, in the present invention, the raw material volatilization supply device 45, the gas supply device 46 and the like are used to form a film-forming monomer gas composed of one or more organic silicon compounds, oxygen gas, inert gas, The above-mentioned mixed gas composition for film formation is introduced into the third film forming chamber 25 through the raw material supply nozzle 47 while supplying the other and the like, and adjusting the mixed gas composition for film formation composed of them, The second layer silicon oxide of the base film 4 formed by forming the metal oxide layer, the first layer, and the second silicon oxide layer conveyed on the cooling / electrode drum 44 peripheral surface. On the layer, plasma is generated by glow discharge plasma 48 and irradiated to form a third silicon oxide layer made of silicon oxide or the like.

  Next, in the present invention, the base film in which the metal oxide layer and the multilayer silicon oxide layer composed of the first layer, the second layer, and the third layer are formed as described above, and these layers are stacked. 4 is fed out to the winding chamber 26 through the auxiliary roll 49, and then wound up into the winding roll 50, and the metal oxide layer, the first layer, the second layer, and the third layer are wound up. It is possible to produce a barrier film according to the present invention in which a multi-layered silicon oxide layer is laminated.

  In the present invention, each of the cooling / electrode drums 30, 37, 44 disposed in each of the first, second, and third film forming chambers 23, 24, 25 has the first, second, 2 and 3 and a predetermined power is applied from a power source 51 disposed outside the third film forming chambers 23, 24, 25, and in the vicinity of each of the cooling / electrode drums 30, 37, 44. The generation of plasma is promoted by arranging magnets 52, 53, and 54.

  Although not shown, the plasma chemical vapor deposition apparatus is provided with a vacuum pump or the like, and it is needless to say that each film forming chamber can be prepared to be kept in vacuum.

  The above exemplification is an example, and it is needless to say that the present invention is not limited thereby.

  For example, in the above example, the barrier film according to the present invention in which a multilayer silicon oxide layer composed of the first layer, the second layer, and the third layer is overlaid is manufactured. Can arbitrarily prepare a film-forming chamber, for example, can form a multi-layered silicon oxide layer consisting of two layers or four or more layers, and arbitrarily form the number of layers, The present invention can be arbitrarily formed into a layered structure, and the present invention relates to the present invention in which a multilayered silicon oxide layer composed of the first layer, the second layer, and the third layer is stacked. It is not limited only to the example which manufactures a barrier film.

  Next, in the present invention, another example of a plasma chemical vapor deposition apparatus for producing a multilayer silicon oxide layer constituting the barrier film according to the present invention is illustrated as shown in FIG. In the plasma chemical vapor deposition apparatus 21 shown in FIG. 2, a film-forming monomer gas composed of one or more organic silicon compounds from the raw material volatilization supply apparatuses 31, 38, 45 and the gas supply apparatuses 32, 39, 46, etc. , Oxygen gas, inert gas, etc., and the first, second, and third film forming chambers through the raw material supply nozzles 33, 40, and 47 while adjusting the film forming mixed gas composition comprising them. Instead of introducing the above mixed gas composition for film formation into 23, 24, 25, two raw material supply nozzles are provided in one film forming chamber, that is, in the first film forming chamber 23. , Two raw material supply nozzles 3 and 33a, from the raw material volatilization supply devices 31, 31 and the gas supply devices 32, 32, etc., vapor deposition monomer gas, oxygen gas, inert gas, etc. composed of one or more organic silicon compounds The film-forming mixed gas composition is fed into the first film-forming chamber 23 from the two raw material supply nozzles 33 and 33a. Then, plasma is generated by the glow discharge plasma 34 on the base film 4 conveyed on the circumferential surface of the cooling / electrode drum 30 and irradiated with this, and a metal is applied to one surface thereof. A first silicon oxide layer made of silicon oxide or the like is formed on the metal oxide layer of the base film 4 on which the oxide layer is formed, and the second film is formed in the same manner as described above. In the chamber 24, two raw material supply nozzles 40, 40a And supply a film-forming monomer gas, oxygen gas, inert gas, etc. composed of one or more organic silicon compounds from the raw material volatilization supply devices 38, 38 and the gas supply devices 39, 39, etc. Then, while adjusting the mixed gas composition for film formation composed of them, the mixed gas composition for film formation is introduced into the second film forming chamber 24 through the two raw material supply nozzles 40 and 40a, And the base film which formed the metal oxide layer and 1st silicon oxide layer which formed the silicon oxide layer of the 1st layer conveyed on said cooling and electrode drum 37 peripheral surface into a film Plasma is generated by glow discharge plasma 41 on the first silicon oxide layer 4 and irradiated to form a second silicon oxide layer made of silicon oxide or the like, Further, in the same manner as described above, two raw material supply nodes are provided in the third film forming chamber 25. A film forming monomer gas, oxygen gas, inert gas, etc. made of one or more organic silicon compounds from the raw material volatilization supply devices 45, 45 and the gas supply devices 46, 46, etc. Etc., and adjusting the film-forming mixed gas composition comprising them, the above-mentioned film-forming mixed gas composition into the third film-forming chamber 25 through the two raw material supply nozzles 47 and 47a. The base film 4 having the metal oxide layer, the first layer, and the second silicon oxide layer formed on the peripheral surface of the cooling / electrode drum 44 is formed. Plasma is generated by glow discharge plasma 48 on the two silicon oxide layers and irradiated to form a third silicon oxide layer made of silicon oxide or the like. In the invention, the metal oxide layer and the first and second layers are as described above. Then, a third silicon oxide layer is formed into a film, and the base film 4 in which these layers are stacked is fed out to the winding chamber 26 through the auxiliary roll 49, and then wound up. Winding around a roll 50 to produce a barrier film according to the present invention in which a metal oxide layer and a multilayer silicon oxide layer composed of a first layer, a second layer, and a third layer are overlaid. It is something that can be done.

In the above, each film forming chamber is depressurized by a vacuum pump or the like, and the degree of vacuum is 1 × 10 ⁻¹ to 1 × 10 ⁻⁸ Torr, preferably the degree of vacuum is 1 × 10 ⁻³ to 1 × 10 ⁻⁷ Torr. It is desirable to prepare it.

  On the other hand, since a predetermined voltage is applied to each cooling / electrode drum from a power source, glow discharge plasma is generated in the vicinity of the opening of the material supply nozzle in each film forming chamber and the cooling / electrode drum, The glow discharge plasma is derived from one or more gas components in the film-forming mixed gas composition. In this state, the base film is conveyed at a constant speed, and the glow discharge plasma is used. A silicon oxide layer made of silicon oxide or the like can be formed on a substrate film on the cooling / electrode drum peripheral surface.

At this time, the degree of vacuum in each film forming chamber should be adjusted to 1 × 10 ⁻¹ to 1 × 10 ⁻⁴ Torr, preferably 1 × 10 ⁻¹ to 1 × 10 ⁻² Torr. In addition, it is desirable that the conveying speed of the base film is adjusted to about 10 to 300 m / min, preferably about 50 to 150 m / min.

  In the present invention, the degree of vacuum in each film forming chamber may be the same or different in each chamber.

  Further, in the raw material volatilization supply device, a film forming monomer gas composed of one or more organic silicon compounds as raw materials is volatilized and mixed with oxygen gas, inert gas, etc. supplied from the gas supply device, The film-forming mixed gas composition is introduced into each film-forming chamber through a raw material supply nozzle while adjusting the film-forming mixed gas composition.

  In this case, as the gas mixing ratio of each gas component of the mixed gas composition for film formation, the content of the monomer gas for film formation composed of one kind of organic silicon compound is about 1 to 40%, and the content of oxygen gas It is preferable that the amount is adjusted in the range of about 0 to 70% and the content of the inert gas is in the range of about 1 to 60%.

  Thus, in the present invention, for each film forming chamber, a film forming mixed gas composition prepared by changing the gas mixing ratio of each gas component of the film forming mixed gas composition introduced into each film forming chamber. A barrier film according to the present invention is manufactured by forming a film for each film forming chamber and overlaying a silicon oxide layer made of silicon oxide or the like.

  That is, in the present invention, the mixing ratio of each gas component of a film-forming mixed gas composition containing at least one monomer gas for forming a film, oxygen gas, and inert gas, which is composed of at least one organic silicon compound. Two or more film-forming mixed gas compositions were prepared, and the film-forming mixed gas composition was used by changing it for each film-forming chamber, and each of these film-forming mixed gas compositions was used. Two or more layers of silicon oxide layers are formed by plasma chemical vapor deposition.

  By the way, in this invention, as mixing ratio of each gas component of said film-forming mixed gas composition, as a 1st film-forming mixed gas composition, monomer gas for film forming: oxygen gas: A mixed gas composition for film formation having a gas composition ratio of inert gas = 1: 0 to 5: 1 (unit: slm, abbreviation for stand-driter-minit), and other second film formation As a mixed gas composition for film formation, a gas composition ratio of film forming monomer gas: oxygen gas: inert gas = 1: 6 to 15: 1 (unit: slm, abbreviation of stand-driter-minit). A film-forming mixed gas composition or the like can be used.

  Thus, in the present invention, the mixed gas composition for film formation as described above is arbitrarily combined, and the mixed gas composition for film formation is placed in the first, second, or third film forming chamber. The film can be formed using a mixed gas composition for film formation in which the mixing ratio of each gas component is changed.

In addition, when forming into a film using the mixed gas composition for film forming which changed the mixing ratio of each gas component of said mixed gas composition for film forming, the 1st mixed gas composition for film forming is used. Then, the amount of carbon atoms in the silicon oxide layer formed into a film tends to increase, and the C—C bond and the Si—CH ₃ bond tend to increase, thereby being highly flexible and high in water vapor. A water-repellent silicon oxide layer having a barrier property can be formed.

In the present invention, when the second mixed gas composition for film formation is used, an appropriate amount of carbon can be contained in the formed silicon oxide layer, and Si—CH ₃ bonds are also appropriate. Thus, a silicon oxide layer having high flexibility and high barrier property against oxygen can be formed.

  Thus, in the present invention, when the film forming mixed gas composition as described above is used to form a film, the order of using the film forming mixed gas composition is, for example, the first manufacturing process. In order of the mixed gas composition for a film and the second mixed gas composition for a film forming, or the first mixed gas composition for forming a film, the second mixed gas composition for forming a film, and the first film forming It is preferable that the mixed gas composition for film formation is introduced into each film forming chamber in order of the mixed gas composition to form a film.

  In the above, by using the first film-forming mixed gas composition in two chambers, it is possible to form a silicon oxide layer having high flexibility and high barrier property against water vapor. It is what you have.

Further, in the plasma chemical vapor deposition apparatus described above, the silicon oxide layer made of silicon oxide or the like is formed into a plasma source gas with oxygen gas on the base film in each film forming chamber. Since the film is formed into a thin film in the form of SiO _x while being oxidized, the silicon oxide layer made of silicon oxide or the like to be formed has a multilayered structure, and each layer is dense. It is a thin film with few gaps, spreadability, flexibility, flexibility, etc. Therefore, the barrier property of silicon oxide made of silicon oxide or the like is silicon formed by a conventional vacuum deposition method or the like. Compared to a silicon oxide layer made of an oxide or the like, the layer is much higher, and since it is made of a multilayered structure, an extremely high and sufficient barrier property can be obtained.

In the present invention, the surface of the base film is cleaned by SiO _x plasma, and polar groups, free radicals, etc. are generated on the surface of the base film, so that silicon oxide or the like is formed into a film. It has the advantage that the close adhesiveness of the silicon oxide layer which consists of and a base film becomes high.

Furthermore, the degree of vacuum at the time of forming the silicon oxide layer made of silicon oxide or the like as described above is about 1 × 10 ⁻¹ to 1 × 10 ⁻⁴ Torr, preferably 1 × 10 ⁻¹ to 1 The degree of vacuum when forming a silicon oxide layer made of silicon oxide or the like by a conventional vacuum deposition method is adjusted to 1 × 10 ⁻² Torr, and 1 × 10 ⁻⁴ to 1 × 10 ⁻⁵ Torr. Since the degree of vacuum is lower than that of the substrate, it is possible to shorten the time for setting the vacuum state at the time of replacing the base film, to easily stabilize the degree of vacuum, and to stabilize the film forming process.

Further, in the present invention, a silicon oxide layer made of silicon oxide or the like formed using a vapor deposition monomer gas made of one or more organic silicon compounds formed in each film forming chamber is an organic material. A vapor-deposited monomer gas composed of one or more types of silicon compounds reacts with oxygen gas, and the reaction product adheres tightly to one surface of the base film to form a dense thin film rich in flexibility. is intended to form, usually, the general formula SiO _X (provided that, X is a number from 0 to 2) is made of a continuous form of a thin film mainly composed of silicon oxide represented by.

Thus, the silicon oxide layer formed in each of the film forming chambers has a general formula SiO _x (where X is 1.3 to 1.9) in terms of transparency, barrier properties, and the like. It is preferable that the thin film is mainly composed of a silicon oxide represented by:

  In the above, the value of X varies depending on the molar ratio between the vapor-deposited monomer gas and oxygen gas composed of one or more organic silicon compounds, the energy of the plasma, etc. Although the transmittance is small, the film itself is yellowish and the transparency is poor.

  In the present invention, the silicon oxide layer made of silicon oxide or the like formed in each film forming chamber is mainly composed of silicon oxide, and further, one kind of carbon, hydrogen, silicon or oxygen. Or a vapor deposition film containing at least one compound composed of two or more elements by chemical bonding or the like.

  For example, when a compound having a C—H bond, a compound having a Si—H bond, or a carbon unit is in the form of graphite, diamond, fullerene, etc. A derivative may be contained by a chemical bond or the like.

Specific examples include hydrocarbons having a CH ₃ site, hydrosilica such as SiH ₃ silyl, SiH ₂ silylene, and hydroxyl derivatives such as SiH ₂ OH silanol.

  In addition to the above, it is possible to change the type, amount, and the like of the compound contained in the silicon oxide layer formed in each film forming chamber by changing the conditions of the film forming process.

  Thus, the content of the above-mentioned compound in the silicon oxide layer formed in each film forming chamber is about 0.1 to 50%, preferably about 5 to 20%. Is.

  In the above, if the content is less than 0.1%, the impact resistance, spreadability, flexibility, flexibility, flexibility, etc. of the silicon oxide layer formed in each film forming chamber are not good. It becomes sufficient, and scratches, cracks, etc. are likely to occur due to bending, etc., and it becomes difficult to stably maintain high barrier properties, and if it exceeds 50%, the barrier properties are lowered, which is not preferable. .

  Furthermore, in the present invention, in the silicon oxide layer formed in each film forming chamber, the content of the above compound is preferably increased from the surface of each silicon oxide layer in the depth direction. Thus, the impact resistance and the like can be enhanced by the above compound on the surface of each silicon oxide layer, while the content of the above compound is small at the interface with the base film. This has the advantage that the adhesiveness between the material film and the silicon oxide layer, the adhesiveness between the silicon oxide layer and the silicon oxide layer, or the like becomes strong.

  Thus, in the present invention, for the silicon oxide layer formed in each film forming chamber, for example, an X-ray photoelectron spectrometer (XPS), a secondary ion mass spectrometer (Secondary Ion) The above physical properties are confirmed by performing elemental analysis of each silicon oxide layer using a method of analysis by ion etching or the like in the depth direction using a surface analyzer such as Mass Spectroscopy (SIMS). be able to.

Moreover, in this invention, the silicon oxide layer formed into a film using said 1st mixed gas composition for film forming has 150-200 O atoms with respect to 100 Si atoms, and 50-50 C atoms. It consists 100 component proportions, further, there is IR absorption based on Si-O-Si stretching vibration between 1030cm ^-1 ~1060cm ^-1, and, based on the Si-CH ₃ stretching vibration 1274 ± 4 cm ^-1 IR It is characterized by absorption.

Thus, the above is because the silicon oxide layer contains a carbon component and contains many C—C bonds and Si—CH ₃ bonds. This shows that the peak position of the IR absorption based on is shifted toward decreasing.

  That is, it can be confirmed that the film is highly water-repellent and has a high barrier property against water vapor.

Furthermore, in this invention, the silicon oxide layer formed into a film using said 2nd mixed gas composition for film forming has 150-200 O atoms with respect to 100 Si atoms, and 50 or less C atoms. made from component ratio, further, there is IR absorption based on Si-O-Si stretching vibration between 1045cm ^-1 ~1075cm ^-1, and, IR absorption based on Si-CH ₃ stretching vibration 1274 ± 4 cm ^-1 There is a feature.

Therefore, the above-described phenomenon is caused by a peak of IR absorption based on Si—O—Si stretching vibration because the silicon oxide layer contains few carbon components and contains only Si—CH ₃ bonds. The position indicates that there is no shift.

  That is, it can be confirmed that the film is highly flexible and has a high barrier property against oxygen.

  Next, in the present invention, the total film thickness of the silicon oxide layer formed in each film forming chamber constituting the barrier layer is preferably about 60 to 4000 mm, specifically, The film thickness is preferably about 100 to 1000 mm, and in the above, it is not preferable that the film is thicker than 1000 mm, more preferably 4000 mm, because cracks are easily generated in the film. Is less than 60 mm, it is not preferable because it is difficult to achieve a barrier effect.

  In the present invention, as the film thickness of each silicon oxide layer formed in each film forming chamber constituting the barrier layer, first, as the film thickness of the silicon oxide layer constituting the first layer Is about 20 to 200 mm, preferably 30 to 100 mm, and the thickness of the silicon oxide layer constituting the second layer is about 20 to 200 mm, preferably about 30 to 100 mm. Further, the film thickness of the silicon oxide layer constituting the third layer is preferably about 20 to 200 mm, more preferably about 30 to 100 mm.

  In the above, if it is 20 mm or less, its own barrier properties are not expressed, and if it exceeds 200 mm, cracks and the like are likely to occur in the film. In particular, the base film is wound during film formation. This is not preferable because cracks tend to be easily formed.

  In the above, the film thickness can be measured by a fundamental parameter method using, for example, a fluorescent X-ray analyzer (model name, RIX2000 type) manufactured by Rigaku Corporation.

  In the above, as a means for changing the film thickness of the silicon oxide layer, the volume velocity of the layer is increased, that is, a method for increasing the amount of the monomer gas for forming a film and the amount of oxygen gas. It can be performed by a method of slowing the film forming speed.

  Next, in the present invention, examples of the organosilicon compound constituting the monomer gas for film formation include 1.1.3.3-tetramethyldisiloxane, hexamethyldisiloxane, vinyltrimethylsilane, methyltrimethylsilane, Hexamethyldisilane, methylsilane, dimethylsilane, trimethylsilane, diethylsilane, propylsilane, phenylsilane, vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, octa Methylcyclotetrasiloxane, etc. can be used.

  In the present invention, among the organic silicon compounds as described above, use of 1.1.3.3-tetramethyldisiloxane or hexamethyldisiloxane as a raw material is easy to handle and formed continuous film. In view of the above characteristics and the like, it is a particularly preferable raw material.

  Moreover, in this invention, argon gas, helium gas etc. can be used as inert gas, for example.

  In the present invention, after providing a metal oxide layer by physical vapor deposition on one surface of the base film as described above, a multilayer silicon oxide layer is provided on the metal oxide layer, The barrier film according to the present invention can be produced by forming a barrier layer composed of the metal oxide layer and the multiple silicon oxide layers.

  In the present invention, the plasma chemical vapor deposition apparatus for forming a multilayered silicon oxide and the take-up vacuum deposition apparatus for forming a metal oxide layer are both connected in-line. It may also be arranged individually off-line.

  Next, in the present invention, the base film constituting the barrier film according to the present invention will be described. The base film is excellent in chemical or physical strength, and each silicon oxide layer, metal oxide layer. It is possible to use a resin film or sheet that can withstand the conditions for forming a film and the like, and that can satisfactorily maintain the film characteristics of the silicon oxide layer, metal oxide layer, etc. .

  Thus, in the present invention, the resin film or sheet specifically includes, for example, a polyolefin resin such as a polyethylene resin or a polypropylene resin, a cyclic polyolefin resin, a polystyrene resin, and acrylonitrile-styrene. Copolymer (AS resin), acrylonitrile loop tagene-styrene copolymer (ABS resin), poly (meth) acrylic resin, polycarbonate resin, polyester resin such as polyethylene terephthalate, polyethylene naphthalate, various nylons, etc. Various resin films or sheets such as polyamide resins, polyurethane resins, acetal resins, cellulose resins, and the like can be used.

  In the present invention, it is particularly preferable to use a polyester resin, a polyolefin resin, or a polyamide resin film or sheet among the above-described resin films or sheets.

  In the present invention, as the above-mentioned various resin films or sheets, for example, one or more of the above-mentioned various resins are used, extrusion method, cast molding method, T-die method, cutting method, inflation method, Using other film-forming methods, a method of forming the above-mentioned various resins alone, or a method of forming a multilayer co-extrusion film using two or more kinds of resins, Using two or more kinds of resins, by mixing and forming a film before forming a film, various resin films or sheets are manufactured, and if necessary, for example, a tenter method, or Various resin films or sheets that are stretched uniaxially or biaxially using a tubular method or the like can be used.

  In the present invention, the film thickness of various resin films or sheets is preferably about 6 to 200 μm, more preferably about 9 to 100 μm.

  It should be noted that one or more of the above-mentioned various resins are used, and in forming the film, for example, film processability, heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slipperiness Various plastic compounding agents and additives can be added for the purpose of improving and modifying mold release properties, flame retardancy, antifungal properties, electrical properties, strength, etc. Can be arbitrarily added from a very small amount to several tens of percent depending on the purpose.

  In the above, as a general additive, for example, a lubricant, a crosslinking agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a filler, a reinforcing agent, an antistatic agent, a pigment, and the like can be used. Furthermore, a modifying resin or the like can be used.

  In addition, in the present invention, the surface of various resin films or sheets is provided with a desired surface treatment layer in advance, if necessary, in order to improve close adhesion with an inorganic oxide vapor-deposited film. It is something that can be done.

  In the present invention, examples of the surface treatment layer include corona discharge treatment, ozone treatment, low temperature plasma treatment using oxygen gas or nitrogen gas, glow discharge treatment, oxidation treatment using chemicals, etc. For example, a corona treatment layer, an ozone treatment layer, a plasma treatment layer, an oxidation treatment layer, or the like can be formed and provided.

  The surface pretreatment is carried out as a method for improving the close adhesion between various resin films or sheets and the inorganic oxide vapor-deposited film. In addition, for example, a primer coat agent layer, an undercoat agent layer, an anchor coat agent layer, an adhesive layer, or a deposition anchor coat agent layer is arbitrarily formed in advance on the surface of various resin films or sheets. And it can also be set as a surface treatment layer.

  Examples of the pretreatment coating agent layer include polyester resins, polyamide resins, polyurethane resins, epoxy resins, phenol resins, (meth) acrylic resins, polyvinyl acetate resins, polyethylene, and polypropylene. A resin composition having a vehicle as a main component of a polyolefin resin or a copolymer or modified resin thereof, a cellulose resin, or the like can be used.

  As is apparent from the above description, the barrier film according to the present invention produced by forming the film as described above includes a base film 51 and one of the base film 51 as shown in FIG. The barrier layer 52 is provided on the surface of the metal oxide layer 53. The barrier layer 52 further includes a metal oxide layer 53 provided by physical vapor deposition, and at least a metal oxide layer 53 provided on the metal oxide layer 53. Two or more film-forming chambers are used, and each film-forming chamber contains at least one type of organosilicon compound monomer gas, oxygen gas, and inert gas. Two layers formed by using two or more film forming mixed gas compositions prepared by changing the mixing ratio of each gas component of the film mixed gas composition, and using each film forming mixed gas composition Multi-layered silicon oxide layers 54a and 54b by the above plasma chemical vapor deposition method. Further, each of the silicon oxide layers 54a, 54b, 54c is mainly composed of silicon oxide and is composed of one or more elements of carbon, hydrogen, silicon, and oxygen. The present invention relates to a barrier film A characterized in that it contains at least one compound, and the silicon oxide layers 53a, 53b, 53c have different contents of the above compounds.

  Thus, the barrier film according to the present invention is a method in which a silicon oxide layer is first formed on a base film by plasma chemical vapor deposition together with a barrier property by a metal oxide layer previously provided. By laminating multiple layers on the layer, the adhesion between the metal oxide layer and the silicon oxide layer is excellent, and the silicon oxide layer is easy to spread, flexible, flexible, flexible, etc. It is possible to form a film having excellent and excellent barrier properties from the first layer, and further using a plasma chemical vapor deposition apparatus comprising at least two film forming chambers. Since two or more oxide layers are continuously laminated and each layer can form a film having a high barrier property, a gas barrier property higher than that of a single layer can be obtained. Can be continuously opened to the atmosphere By forming a film, it is possible to prevent foreign matters, dust, and the like that cause cracks from entering between the film forming layers, and further, no deterioration of the barrier property is observed, and each silicon oxide layer Contains at least one compound composed mainly of silicon oxide, consisting of one or more elements of carbon, hydrogen, silicon, and oxygen, and the above-mentioned for each silicon oxide layer Since it is a discontinuous layer with different compound contents, the permeation of oxygen gas, water vapor, etc. can be completely blocked. In particular, the metal oxide layer has ductility, flexibility, flexibility, flexibility. It is excellent in close adhesiveness with a multi-layered silicon oxide layer, etc., and a multi-layer film of the silicon oxide layer and the metal oxide layer can constitute a high barrier film by both, for example, packaging As a barrier material used for materials , Is that it is possible oxygen gas may be produced very useful barrier film is not observed even decrease in its gas barrier performance is excellent in gas barrier properties to block the permeation of water vapor or the like.

  For this reason, the barrier film according to the present invention is excellent in gas barrier properties that prevent permeation of oxygen gas, water vapor, etc., as a barrier material used for packaging materials, etc. It relates to a very useful barrier film in which no decrease is observed.

  That is, in the present invention, the barrier film according to the present invention produced as described above uses this as a barrier material, and other plastic film, paper base material, metal foil or metal plate, cellophane, woven One or two or more kinds of various base materials such as cloth or non-woven fabric, glass plate, etc. are arbitrarily laminated to produce a laminated material having various forms, and thus the laminated material is used as a packaging material. , Optical member, protective sheet for solar cell module, protective film for organic EL display, protective film for film liquid crystal display, packaging material for polymer battery, aluminum packaging material, etc. It can be applied.

  As an example of the method for producing the above laminated material, for example, first, a primer agent layer is formed on the surface of the silicon oxide layer that forms the barrier layer constituting the barrier film according to the present invention. Next, a laminating adhesive layer is formed on the surface of the primer layer, and then, for example, a heat seal is passed through the primer layer and the laminating adhesive layer. By laminating a desired base material such as a plastic film constituting the conductive resin layer or the like using a dry lamination method, laminated materials having various forms can be produced.

  Alternatively, in the present invention, for example, a primer agent layer is first formed on the surface of the silicon oxide layer that forms the barrier layer constituting the barrier film according to the present invention, and then the primer agent layer is formed. An anchor coat agent layer is formed on the surface, and then various resins are melt-extruded through the primer agent layer and the anchor coat agent layer, for example, Laminating materials having various forms can be produced by laminating by using an extrusion laminating laminating method of laminating a desired base material such as a plastic film forming a rusty resin layer or the like.

  In addition, in this invention, it is the same as the above on the surface of the base film which comprises the barrier film concerning this invention. In addition, in the present invention, a desired base material can be arbitrarily laminated between the respective layers to produce a laminated material having various forms. Depending on the purpose of use, form of use, application, etc., other base materials can be arbitrarily laminated, and laminates of various forms can be designed and manufactured.

  In the present invention, when performing the above-described lamination, the surface of the silicon oxide layer forming the barrier layer constituting the barrier film according to the present invention is, for example, plasma treatment, corona discharge treatment, Other pre-treatments can be arbitrarily performed.

  Next, in the present invention, a packaging container will be described as an example of use of the above laminated material. In the present invention, for example, two sheets of the above laminated material are prepared as packaging containers. Then, the surfaces of the heat-sealable resin layer located in the innermost layer are made to face each other, and thereafter, the seal part is formed by heat-sealing the three ends of the outer periphery. In addition, a three-sided seal type soft packaging container can be manufactured by providing an opening on the upper side.

  Thus, in the present invention, although not shown, from the opening of the three-sided seal type soft packaging container manufactured above, for example, the contents such as food and drink, etc. are filled, and then the upper Heat seal the opening to form an upper seal, etc., and, if necessary, for example, boil treatment, retort treatment, etc., to produce packaged products of various forms Is something that can be done.

  In the present invention, it goes without saying that the present invention is not limited to the above-described packaging containers. Depending on the purpose, use, etc., flexible packaging bags, liquid paper containers, paper cans, etc. It goes without saying that various types of packaging containers can be manufactured.

  Next, in the present invention, the primer agent layer constituting the laminated material will be described. First, as the primer agent layer, a polyurethane resin or a polyester resin is used as a main component of the vehicle, and the polyurethane agent layer The silane coupling agent is about 0.05 to 10% by weight, preferably about 0.1 to 5% by weight, and the filler is 0.1 to 20% by weight with respect to 1 to 30% by weight of the resin or polyester resin. , Preferably in a proportion of about 1 to 10% by weight, and if necessary, additives such as stabilizers, curing agents, crosslinking agents, lubricants, ultraviolet absorbers, etc. are optionally added, and solvent Then, a diluent or the like is added and mixed well to prepare a polyurethane-based or polyester-based resin composition, and thus the polyurethane-based or polyester-based resin composition is used. For example, the barrier layer constituting the barrier film according to the present invention is formed by a roll coat, a gravure coat, a knife coat, a dip coat, a spray coat, or other coating methods. After coating on the surface of the silicon oxide layer to be formed, the coating film is dried to remove the solvent, diluent, etc., and if necessary, an aging treatment or the like is performed. The primer layer according to the invention can be formed.

In the present invention, the film thickness of the primer layer is preferably, for example, about 0.1 g / m ^{2 to} 1.0 g / m ² (dry state).

  Thus, in the present invention, the primer layer as described above forms a barrier layer constituting the barrier film according to the present invention, a heat-sealable resin layer, The barrier layer according to the present invention at the time of post-processing is improved by improving the post-processability such as laminating or bag making, for example. This prevents the generation of cracks in the silicon oxide layer constituting the conductive film.

  In the above, as the polyurethane resin constituting the polyurethane resin composition, for example, a polyurethane resin obtained by a reaction between a polyfunctional isocyanate and a hydroxyl group-containing compound can be used.

  Specifically, for example, aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, polymethylene polyphenylene polyisocyanate, hexamethylene diisocyanate, xylylene diisocyanate One obtained by reacting a polyfunctional isocyanate such as an aliphatic polyisocyanate such as a salt with a hydroxyl group-containing compound such as a polyether polyol, a polyester polyol, a polyacrylate polyol, or the like. A liquid or two-component curable polyurethane resin can be used.

  Thus, in the present invention, by using the polyurethane-based resin as described above, the close adhesion between the silicon oxide layer and the heat-sealable resin layer is improved and the primer layer is elongated. For example, it improves the suitability of post-processing such as laminating or bag-making, and prevents the silicon oxide layer from cracking during post-processing.

  In the above, the polyester resin constituting the polyester resin composition includes, for example, one or more aromatic saturated dicarboxylic acids having a benzene nucleus such as terephthalic acid as a basic skeleton, A thermoplastic polyester resin produced by polycondensation with one or more valent alcohols can be used. In the above, examples of the aromatic saturated dicarboxylic acid having a benzene nucleus as a basic skeleton include terephthalic acid, isophthalic acid, phthalic acid, diphenyl ether-4, 4-dicarboxylic acid, and the like.

  In the above, saturated divalent alcohols include ethylene glycol, propylene glycol, trimethylene glycol, tetramethylene glycol, diethylene glycol, polyethylene glycol, polypropylene glycol, Polytetramethylene glycol, hexamethylene glycol, dodecamethylene glycol, aliphatic glycols such as neopentyl glycol, alicyclic glycols such as cyclohexanedimethanol, 2.2- Bis (4'-β-hydroxyethoxyphenyl) propane, naphthalene diol, other aromatic geo- and the like can be used.

  In the present invention, specific examples of the polyester resin include thermoplastic polyethylene terephthalate resin produced by polycondensation of terephthalic acid and ethylene glycol, terephthalic acid and tetramethylene glycol. Polybutylene terephthalate resin produced by polycondensation with styrene, thermoplastic polycyclohexanedimethylene terephthalate resin produced by polycondensation of terephthalic acid and 1,4-cyclohexanedimethanol, terephthalic acid Polyethylene terephthalate resin produced by copolycondensation of phthalic acid, isophthalic acid and ethylene glycol, produced by copolycondensation of terephthalic acid, ethylene glycol and 1,4-cyclohexanedimethanol Thermoplastic polyethylene terephthalate resin, terephthalic acid and isophthalic acid And ethylene glycol - le and propylene glycol - thermoplastic polyethylene terephthalate produced by co-polycondensation of Le - DOO resins, polyester polyol - can be used Le resin, other like.

  In the present invention, the saturated aromatic dicarboxylic acid having a benzene nucleus as a basic skeleton as described above, for example, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, One or more aliphatic saturated dicarboxylic acids such as sebacic acid and dodecanoic acid can be added and copolycondensed, and the amount used is an aromatic saturated dicarboxylic acid having a benzene nucleus as a basic skeleton, It is preferable to add 1 to 10% by weight.

  Thus, in the present invention, by using the polyester resin as described above, the tight adhesion and the like are improved and the elongation of the primer layer is improved, for example, laminating, or The suitability for post-processing such as bag making processing is improved, and the occurrence of cracks and the like in the silicon oxide layer during post-processing is prevented.

  Next, in the above, as the silane coupling agent constituting the polyurethane-based or polyester-based resin composition, organic functional silane monomers having binary reactivity can be used, for example, γ-chloropropyl Trimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyl-tris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- Glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyl Dimethoxysilane, γ One or more of ureidopropyltriethoxysilane, bis (β-hydroxyethyl) -γ-aminopropyltriethoxysilane, an aqueous solution of γ-aminopropylsilicone, and the like can be used.

  In the silane coupling agent as described above, a functional group at one end of the molecule, usually chloro, alkoxy, or acetoxy group, is hydrolyzed to form a silanol group (SiOH), which is oxidized by silicon. The metal oxide layer or the active group on the film surface of the silicon oxide layer, for example, a functional group such as a hydroxyl group causes a reaction such as a dehydration condensation reaction to cause a silicon oxide layer. A silane coupling agent is modified with a covalent bond or the like on the film surface of the film, and a strong bond is formed on the film surface of the silicon oxide layer of the silanol group itself by adsorption or hydrogen bond.

  On the other hand, an organic functional group such as vinyl, methacryloxy, amino, epoxy, or mercapto at the other end of the silane coupling agent is formed on the thin film of the silane coupling agent. -Reacts with substances constituting the adhesive layer, anchor coating layer, other layers, etc. to form a strong bond, and further, the above-mentioned printed pattern layer, laminating adhesive layer, The heat-sealable resin layer is firmly and tightly bonded through the anchor coating agent layer and the like to increase the laminating strength. Thus, in the present invention, the laminating strength is increased. It is possible to form a high-strength laminated structure.

  In the present invention, the inorganic property and organic property of the silane coupling agent are utilized, and the heat-dissipation is effected through the silicon oxide layer and the printed pattern layer, the adhesive layer or the anchor coating agent layer. It improves the tight adhesion with the rusty resin layer, thereby increasing the laminating strength and the like.

  Next, in the present invention, examples of the filler constituting the polyurethane-based or polyester-based resin composition include calcium carbonate, barium sulfate, alumina white, silica, talc, glass frit, resin powder, and the like. Can be used.

  Thus, the above-mentioned filler adjusts the viscosity of the polyurethane-based or polyester-based resin composition liquid, improves its coating suitability, and is a silane coupling with a polyurethane-based or polyester-based resin as a binder resin. It binds via an agent to improve the cohesive strength of the coating film.

  Next, in the present invention, the laminating adhesive layer constituting the laminated material will be described. Examples of the laminating adhesive layer constituting the laminating adhesive layer include a polyvinyl acetate adhesive and acrylic acid. Homopolymers such as ethyl, butyl, 2-ethylhexyl ester, etc., or polyacrylic acid ester adhesives comprising these and copolymers of methyl methacrylate, acrylonitrile, styrene, etc., cyanoacrylate adhesives, ethylene Ethylene copolymer adhesives, cellulose adhesives, polyester adhesives, polyamide adhesives, polyimides, and the like, and copolymers of vinyl acetate, ethyl acrylate, acrylic acid, methacrylic acid and other monomers -Based adhesive, amino resin-based adhesive made of urea resin or melamine resin, phenolic resin-based adhesive Epoxy adhesive, polyurethane adhesive, reactive (meth) acrylic adhesive, chloroprene rubber, nitrile rubber, rubber adhesive made of styrene-butadiene rubber, silicone adhesive, alkali metal silicate It is possible to use an inorganic adhesive made of low-melting glass or the like, and other adhesives.

  The composition system of the above-mentioned adhesive may be any composition form such as an aqueous type, a solution type, an emulsion type, and a dispersion type, and the properties thereof are film / sheet type, powder type, solid type, etc. Any form may be used, and the bonding mechanism may be any form such as a chemical reaction type, a solvent volatilization type, a heat melting type, and a hot pressure type.

Thus, the above adhesive can be applied by, for example, a roll coating method, a gravure roll coating method, a kiss coating method, a coating method or the like, or a printing method. The coating amount is preferably about 0.1 to 10 g / m ² (dry state).

  Next, in the present invention, the anchor coat agent layer constituting the laminated material will be described. As the anchor coat agent constituting the anchor coat agent layer, for example, alkyl titanate or the like is used. Various aqueous or oil-based anchor coating agents such as organic titanium, isocyanate, polyethyleneimine, polyptadiene, etc. can be used.

The above-mentioned anchor coating agent can be coated using a coating method such as a roll coat, a gravure roll coat, a kiss coat, and the like. The amount is preferably 0.1 to 5 g / m ² (dry state).

Examples of the melt-extruded resin layer in the melt-extrusion laminating method include, for example, polyethylene resins, polypropylene resins, acid-modified polyethylene resins, acid-modified polypropylene resins, ethylene-acrylic acid or methacrylic acid copolymers, saps. 1 of thermoplastic resins such as phosphorus resin, ethylene-vinyl acetate copolymer, polyvinyl acetate resin, ethylene-acrylic acid ester or methacrylic acid ester copolymer, polystyrene resin, polyvinyl chloride resin, etc. Species or two or more can be used.
In the melt extrusion lamination method described above, in order to obtain stronger adhesive strength, for example, lamination can be performed via an anchor coating agent layer such as the above-described anchor coating agent.

Next, in the present invention, as a base material such as a plastic film for forming the innermost layer of the laminated material, for example, a heat-seal resin film or sheet that can be melted by heat and fused to each other is used. Specifically, for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear (linear) low density polyethylene, ethylene-α-olefin polymerized using a metallocene catalyst Copolymer, polypropylene, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer Polymer, ethylene-propylene copolymer, methylpentene polymer, polybutene polymer, polyethylene or polypropylene Polyolefin resins such as pyrene modified with unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, polyvinyl acetate resins, poly (meta ) A film or sheet of a resin such as an acrylic resin, a polyvinyl chloride resin, or the like can be used.
Thus, the above film or sheet can be used in the state of a coating film made of a composition containing the resin.
The thickness of the film or film or sheet is preferably about 5 μm to 300 μm, more preferably about 10 μm to 100 μm.

Furthermore, in the present invention, as a base material such as a plastic film constituting the above laminated material, for example, as a basic material of the laminated material, excellent properties in mechanical, physical, chemical, etc. In particular, a resin film or sheet having strength, toughness, and heat resistance can be used. Specifically, for example, polyester resin, polyamide resin, polyaramid Films, sheets, etc. of tough resins such as resin, polyolefin resin, polycarbonate resin, polystyrene resin, polyacetal resin, fluorine resin, etc. can be used. .
Thus, as the resin film or sheet, any of an unstretched film or a stretched film stretched in a uniaxial direction or a biaxial direction can be used.
The thickness of the film is about 5 μm to 100 μm, preferably about 10 μm to 50 μm.
In the present invention, the base film as described above is subjected to surface printing or back printing by a normal printing method with a desired printing pattern such as letters, figures, symbols, patterns, patterns, etc., for example. May be.

Next, in the present invention, as the base material constituting the laminated material, for example, various paper base materials constituting the paper layer can be used. Specifically, in the present invention, Materials include formability, bending resistance, rigidity, etc., for example, strong sized bleached or unbleached paper base, or pure white roll paper, kraft paper, paperboard, processed paper Paper base materials such as, etc., etc. can be used.
In the above, as the paper substrate constituting the paper layer, it is desirable to use a material having a basis weight of about 80 to 600 g / m ² , preferably a basis weight of about 100 to 450 g / m ² .
Of course, in the present invention, the paper base material constituting the paper layer and various resin films or sheets as the base film mentioned above can be used in combination.

Furthermore, in the present invention, examples of the material constituting the laminated material include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, and ethylene having barrier properties such as water vapor and water. -Resin film or sheet such as propylene copolymer, or polyvinylidene chloride, polyvinyl alcohol, saponified ethylene-vinyl acetate copolymer, nylon MXD6 resin having barrier properties against oxygen, water vapor, etc. Films or sheets of the above-mentioned resins, colorants such as pigments to the resin, and other various colored resin films or sheets having light-shielding properties obtained by kneading into a film by adding desired additives. Can be used.
These materials can be used alone or in combination. The thickness of the film or sheet is arbitrary, but is usually about 5 μm to 300 μm, more preferably about 10 μm to 100 μm.

In the present invention, usually, when the above laminated material is applied to various applications, it is subjected to severe conditions both physically and chemically. Various requirements such as deformation prevention strength, drop impact strength, pinhole resistance, heat resistance, sealing performance, quality maintenance, workability, hygiene, etc. are required. Can be used by arbitrarily selecting a material that satisfies the above-mentioned conditions. Specifically, for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene , Ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ionomer resin, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid or methacrylic acid copolymer, methyl Pentene polymer, polybutene resin, polyvinyl chloride resin, polyvinyl acetate resin, polyvinylidene chloride resin, vinyl chloride-vinylidene chloride copolymer, poly (meth) acrylic resin, polyacrylonitrile resin, polystyrene Resin, acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyester resin, polyamide resin, polycarbonate resin, polyvinyl alcohol Resin, saponified ethylene-vinyl acetate copolymer, fluorine resin, diene resin, polyacetal resin, polyurethane resin, nitrocellulose, etc. You can select and use.
In addition, for example, a film such as cellophane, a synthetic paper, or the like can be used. In the present invention, the above-described film or sheet may be any of unstretched, uniaxially or biaxially stretched.
The thickness is arbitrary, but can be selected from a range of several μm to 300 μm.
Furthermore, in the present invention, the film or sheet may be a film having any property such as extrusion film formation, inflation film formation, and coating film.

  Thus, in the present invention, when performing the above-mentioned lamination, if necessary, pretreatment such as corona treatment and ozone treatment can be applied to the film, and for example, isocyanate (urethane) Type), polyethyleneimine type, polybutadiene type, organic titanium type anchor coating agent, or polyurethane type, polyacrylic type, polyester type, epoxy type, polyvinyl acetate type, cellulose type, etc. -Known pretreatments such as adhesives for coating, anchor coating agents, adhesives, and the like can be used.

In the present invention, a desired printed pattern layer can be formed between any of the layers constituting the laminated material.
Thus, the printed pattern layer is mainly composed of one or more ordinary ink vehicles, and if necessary, a plasticizer, a stabilizer, an antioxidant, a light stabilizer, an ultraviolet ray, and the like. One or more additives such as an absorbent, a curing agent, a crosslinking agent, a lubricant, an antistatic agent, a filler, and the like are arbitrarily added, and a colorant such as a dye / pigment is added, and a solvent is added. The ink composition is prepared by sufficiently kneading with a diluent, and then the ink composition is used. For example, gravure printing, offset printing, letterpress printing, screen printing, transfer printing, flexographic printing, etc. The printing pattern layer according to the present invention can be formed by printing a desired printing pattern composed of characters, figures, symbols, patterns, etc. on the above-described coating thin film using a printing method such as .

In the present invention, as the primer layer provided on the surface of the metal oxide layer such as aluminum oxide, in addition to the primer layer made of the polyurethane-based or polyester-based resin composition described above, for example, , Polyamide resins, epoxy resins, phenol resins, (meth) acrylic resins, polyvinyl acetate resins, polyolefin resins such as polyethylene aly polypropylene, or copolymers or modified resins thereof, cellulose systems The primer layer can be formed using a resin composition containing resin, etc. as the main component of the vehicle.
In the present invention, for example, a primer coating layer is formed by coating using a coating method such as roll coating, gravure rolling coating, kiss coating, etc. Therefore, the coating amount is preferably about 0.1 to 10 g / m ² (dry state).

Next, in the present invention, a description will be given of a bag making or box making method for manufacturing a packaging container using the above-described laminated material. For example, when the packaging container is a flexible packaging bag made of a plastic film or the like Using the laminated material manufactured by the method as described above, facing the heat-sealable film of the inner layer facing each other, folding them up or stacking the two sheets, The bag body can be configured by heat sealing the portion to provide a seal portion.
Thus, as a bag-making method, the above-mentioned laminated material is folded with the inner layer faces facing each other, or the two sheets are overlapped, and the peripheral edge of the outer periphery is, for example, a side sheet. Seal type, two-sided seal type, three-sided seal type, four-sided seal type, envelope-sealed seal type, jointed seal type (pillar seal type), pleated seal type The various types of packaging containers according to the present invention can be manufactured by heat sealing in the form of a heat sealing such as a flat bottom sealing type, a square bottom sealing type, or the like.
In addition, for example, a self-supporting packaging bag (standing pouch) or the like can be manufactured, and in the present invention, a tube container or the like can also be manufactured using the above-described laminated material.
In the above, as the heat seal method, for example, a bar seal, a rotary roll seal, a belt seal, an impulse seal, a high frequency seal, an ultrasonic seal and the like are known. It can be done by the method.
In the present invention, a spout such as a one-piece type, a two-piece type, or the like, or a zipper for opening and closing can be arbitrarily attached to the packaging container as described above.

Next, in the case of a liquid-filled paper container including a paper base material as a packaging container, for example, as a laminated material, a laminated material in which a paper base material is laminated is manufactured, and a blank plate for manufacturing a desired paper container is prepared from this. After that, the body, bottom, head, etc. can be boxed by using the blank plate, and for example, a brick type, flat type or gable top type liquid paper container can be manufactured. .
Further, the shape can be any of a rectangular container, a cylindrical paper can such as a round shape, and the like.

In the present invention, the packaging container produced as described above is used for filling and packaging various foods, chemicals such as adhesives and adhesives, cosmetics, pharmaceuticals, miscellaneous goods such as chemical warmers, and other items. It is what is used.
Thus, in the present invention, in particular, for example, a liquid sachet for filling and packaging soy sauce, sauce, soup, etc., a sachet for filling and packaging rice cake, a soft packaging bag for filling and packaging fresh confectionery, etc. It is useful as a packaging container for filling and packaging foods and beverages such as soft packaging bags for filling and packaging boiled or retort foods.

Hereinafter, the present invention will be described in more detail with reference to examples.
First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the 12 μm-thick biaxially stretched polyethylene terephthalate film as the base film on which the metal oxide layer is formed as described above is applied to a plasma chemical vapor deposition apparatus comprising three chambers as shown in FIG. Installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, hexamethyldisiloxane (hereinafter referred to as HMDSO), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas and inert gas helium supplied from the gas supply device. The raw material gas was used.
As a raw material gas used in the first film forming chamber, the mixing ratio of the raw material gases is set to HMDSO: O ₂ : He = 1: 0: 1 (unit: slm, standard driter-minit), and the second As a raw material gas used in the film forming chamber, the mixing ratio of the raw material gases was HMDSO: O ₂ : He = 1: 10: 1 (unit: slm).
The third film forming chamber was not used.
Using the raw material gas as described above, the raw material gas was introduced into the first film forming chamber and the second film forming chamber, respectively, and then the above-mentioned biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared. Electric power is applied while being conveyed at a line speed of 200 m / min, and the film thickness of the first layer is 65 mm and the film thickness of the second layer on the metal oxide layer of the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. A two-layered silicon oxide layer consisting of 65 mm and a total film thickness of 130 mm was formed into a barrier film according to the present invention. .

First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the 12 μm-thick biaxially stretched polyethylene terephthalate film as the base film on which the metal oxide layer is formed as described above is applied to a plasma chemical vapor deposition apparatus comprising three chambers as shown in FIG. Installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, hexamethyldisiloxane (hereinafter referred to as HMDSO), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas and inert gas helium supplied from the gas supply device. The raw material gas was used.
As a raw material gas used in the first film forming chamber, the mixing ratio of the raw material gases is set to HMDSO: O ₂ : He = 1: 0: 1 (unit: slm, standard driter-minit), and the second As a raw material gas used in the film forming chamber, the mixing ratio of the raw material gases is HMDSO: O ₂ : He = 1: 10: 1 (unit: slm), and further, as a raw material gas used in the third film forming chamber The mixing ratio of the raw material gases was HMDSO: O ₂ : He = 1: 0: 1 (unit: slm).
Using the source gas as described above, the source gas is introduced into the first film-forming chamber, the second film-forming chamber, and the third film-forming chamber, respectively. While the biaxially stretched polyethylene terephthalate film is conveyed at a line speed of 300 m / min, electric power is applied to form a first layer film on the metal oxide layer of the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. A three-layer silicon oxide layer having a thickness of 45 mm, a second layer thickness of 40 mm, a third layer thickness of 45 mm, and a total film thickness of 130 mm was formed to produce a barrier film according to the present invention.

In the above Example 2, as a raw material gas used in the first film forming chamber, the mixing ratio of the raw material gases is set to HMDSO: O ₂ : He = 1: 10: 1 (unit: slm, standard-driter-minute). In addition, as a source gas used in the second film forming chamber, the mixing ratio of the source gases is set to HMDSO: O ₂ : He = 1: 0: 1 (unit: slm). As the raw material gas used in the chamber, the mixing ratio of the raw material gases is HMDSO: O ₂ : He = 1: 8: 1 (unit: slm), and the others are exactly the same as in Example 2 above, A barrier film according to the present invention was produced in the same manner as in Example 2.

  In Example 2 above, tetramethoxysilane (hereinafter referred to as TMOS) is used in place of HMDSO, which is an organosilicon compound constituting the source gas, and the others are exactly the same as in Example 2 above. A barrier film according to the present invention was produced in the same manner as in Example 2 above.

  In Example 2 above, tetraethoxysilane (hereinafter referred to as TEOS) is used instead of HMDSO, which is an organosilicon compound that constitutes the raw material gas, and the others are exactly the same as in Example 2 above. A barrier film according to the present invention was produced in the same manner as in Example 2 above.

  In Example 2 above, tetramethoxysilane (hereinafter referred to as TMOS) is used in place of HMDSO, which is an organosilicon compound constituting the source gas in the second film forming chamber, and the others are the same as in the above Example. In the same manner as in Example 2, a barrier film according to the present invention was produced in the same manner as in Example 2 above.

  In Example 2 described above, tetramethoxysilane (hereinafter referred to as TMOS) is used in place of HMDSO, which is an organosilicon compound constituting the source gas in the second film forming chamber, and the second film forming is performed. Tetraethoxysilane (hereinafter referred to as TEOS) is used in place of HMDSO, which is an organosilicon compound that constitutes the source gas in the chamber, and the others are exactly the same as in Example 2 above. Similarly, a barrier film according to the present invention was produced.

First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the flow rate at which the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film on which the metal oxide layer is formed as described above is introduced into each chamber as shown in FIG. 3 can be independently controlled. A plasma chemical vapor deposition apparatus equipped with two supply pipes was installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas supplied from the gas supply device and helium, which is an inert gas, did.
Next, a raw material gas having a gas mixture ratio shown in Table 1 below is used, and the raw material gas is introduced into the first film forming chamber and the second film forming chamber from two supply pipes that can be independently controlled. Next, while conveying the above biaxially stretched polyethylene terephthalate film having a thickness of 12 μm at a line speed of 200 m / min, electric power was applied to the metal oxide of the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. A barrier film according to the present invention is manufactured by forming a two-layered silicon oxide layer having a thickness of 65 mm of the first layer, a thickness of 60 mm of the second layer, and a total thickness of 125 mm on the layer. did.

(Table 1)
┌───┬───────────────────────────┐┐ │ │ Supply pipe 1 of the first chamber │ │ ├────── ──────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├─────── ────┼───────────────┤ │ │ HMDSO │ 0.5: 5: 0.5 │ │ Room 1 ├────────── ─┴───────────────┤ │ │ Supply pipe 2 in the first chamber │ │ ├ ───────────┬───────── ───────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼─────────── ─────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴── ────────────┤ │ │ Supply pipe 1 of the second chamber │ │ ├ ───────────┬────────────── ──┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼──────────────── │ │ │ HMDSO │ 0.5: 5: 0.5 │ │ Room 2 ────────────┴───────────────┤ │ │ Supply pipe 2 of the second chamber │ │ ├ ───────────┬───────────────┤ │ │ Film forming monomer gas │ Gas mixing ratio (Unit: slm) │ │ ├ ───────────┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴───────────────┤ │Room 3│ Not used │ └───┴───────────────────────────┘

First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the flow rate at which the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film on which the metal oxide layer is formed as described above is introduced into each chamber as shown in FIG. 3 can be independently controlled. A plasma chemical vapor deposition apparatus equipped with two supply pipes was installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas supplied from the gas supply device and helium, which is an inert gas, did.
Next, a raw material gas having a gas mixture ratio shown in Table 2 below is used, and the raw material gas is respectively supplied to the first film forming chamber, the second film forming chamber, and the third film forming chamber. Introduced from two supply pipes that can be controlled independently, then, while feeding the above-mentioned 12 μm-thick biaxially stretched polyethylene terephthalate film at a line speed of 300 m / min, electric power was applied to the biaxially-stretched 12 μm thick On the metal oxide layer of the polyethylene terephthalate film, a three-layer silicon oxide layer comprising a first layer thickness of 45 mm, a second layer thickness of 40 mm, a third layer thickness of 45 mm, and a total thickness of 130 mm The physical layer was formed into a film to produce a barrier film according to the present invention.

(Table 2)
┌───┬───────────────────────────┐┐ │ │ Supply pipe 1 of the first chamber │ │ ├────── ──────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├─────── ────┼───────────────┤ │ │ HMDSO │ 0.5: 5: 0.5 │ │ Room 1 ├────────── ─┴───────────────┤ │ │ Supply pipe 2 in the first chamber │ │ ├ ───────────┬───────── ───────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼─────────── ─────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴── ────────────┤ │ │ Supply pipe 1 of the second chamber │ │ ├ ───────────┬────────────── ──┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼──────────────── │ │ │ HMDSO │ 0.5: 5: 0.5 │ │ Room 2 ────────────┴───────────────┤ │ │ Supply pipe 2 of the second chamber │ │ ├ ───────────┬───────────────┤ │ │ Film forming monomer gas │ Gas mixing ratio (Unit: slm) │ │ ├ ───────────┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴───────────────┤ │ │ 3rd Supply pipe 1 │ │ ├───────────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├ ───────────┼───────────────┤ │ │ HMDSO │ 0.5: 5: 0.5 │ │Third Muroru───────────┴───────────────┤ │ │ Supply pipe 2 of the third chamber │ │ ├──────── ───┬───────────────┤ │ │ Film forming monomer gas │ Gas mixing ratio (unit: slm) │ │ ├ ─────────── ─┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ └───┴───────────┴─ ──────────────┘

First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the flow rate at which the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film on which the metal oxide layer is formed as described above is introduced into each chamber as shown in FIG. 3 can be independently controlled. A plasma chemical vapor deposition apparatus equipped with two supply pipes was installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane) and TMOS (tetramethoxysilane) which are organic silicon compounds which are raw materials are volatilized in a raw material volatilization supply device, and oxygen gas and inert gas helium which are supplied from the gas supply device. And mixed to obtain a raw material gas.
Next, a raw material gas having a gas mixture ratio shown in Table 3 below is used, and the raw material gas is respectively supplied to the first film forming chamber, the second film forming chamber, and the third film forming chamber. Introduced from two supply pipes that can be controlled independently, then, while feeding the above-mentioned 12 μm-thick biaxially stretched polyethylene terephthalate film at a line speed of 300 m / min, electric power was applied to the biaxially-stretched 12 μm thick On the metal oxide layer of the polyethylene terephthalate film, a three-layered silicon oxide layer comprising a first layer thickness of 45 mm, a second layer thickness of 45 mm, a third layer thickness of 40 mm, and a total thickness of 130 mm The physical layer was formed into a film to produce a barrier film according to the present invention.

(Table 3)
┌───┬───────────────────────────┐┐ │ │ Supply pipe 1 of the first chamber │ │ ├────── ──────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├─────── ────┼───────────────┤ │ │ TMOS │ 0.5: 2.5: 0.5 │ │Room 1 ├──────── ───┴───────────────┤ │ │ Supply pipe 2 in the first chamber │ │ ├ ───────────┬─────── ─────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼───────── ───────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴─ ─────────────┤ │ │ Supply pipe 1 of the second chamber │ │ ├ ───────────┬───────────── ───┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼─────────────── ─┤ │ │ TMOS │ 0.5: 2.5: 0.5 │ │Room 2 ────────────┴─────────────── │ │ │ Supply pipe 2 of the second chamber │ │ ├───────────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├ ────────────┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0 .5 │ ├───┼───────────┴───────────────┤ │ │ Three-room supply pipe 1 │ │ ├ ───────────┬───────────────┤ │ │ Film-forming monomer gas │ Gas mixing ratio ( Unit: slm) │ │ ├ ├───────────┼───────────────┤┤ │ │ TMOS │ 0.5: 2.5: 0.5 │ │ Room 3 ├───────────┴───────────────┤ │ │ Supply pipe 2 of room 3 │ │ ├──── ───────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├────── ─────┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ └───┴───────── ──┴───────────────┘

First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the flow rate at which the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film on which the metal oxide layer is formed as described above is introduced into each chamber as shown in FIG. 3 can be independently controlled. A plasma chemical vapor deposition apparatus equipped with two supply pipes was installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), TMOS (tetramethoxysilane) and TEOS (tetraethoxysilane), which are organic silicon compounds as raw materials, are volatilized in a raw material volatilization supply device, and oxygen gas supplied from the gas supply device The raw material gas was mixed with helium, which is an inert gas.
Next, a raw material gas having a gas mixing ratio shown in Table 4 below is used, and the raw material gas is respectively supplied to the first film forming chamber, the second film forming chamber, and the third film forming chamber. Introduced from two supply pipes that can be controlled independently, then, while feeding the above-mentioned 12 μm-thick biaxially stretched polyethylene terephthalate film at a line speed of 300 m / min, electric power was applied to the biaxially-stretched 12 μm thick On the metal oxide layer of the polyethylene terephthalate film, a three-layer silicon oxide layer comprising a first layer thickness of 45 mm, a second layer thickness of 40 mm, a third layer thickness of 45 mm, and a total thickness of 130 mm The physical layer was formed into a film to produce a barrier film according to the present invention.

(Table 4)
┌───┬───────────────────────────┐┐ │ │ Supply pipe 1 of the first chamber │ │ ├────── ──────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├─────── ────┼───────────────┤ │ │ TMOS │ 0.5: 2.5: 0.5 │ │Room 1 ├──────── ───┴───────────────┤ │ │ Supply pipe 2 in the first chamber │ │ ├ ───────────┬─────── ─────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼───────── ───────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ ├───┼───────────┴─ ─────────────┤ │ │ Supply pipe 1 of the second chamber │ │ ├ ───────────┬───────────── ───┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├───────────┼─────────────── ─┤ │ │ TEOS │ 0.5: 2.5: 0.5 │ │ Room 2 ├───────────┴─────────────── │ │ │ Supply pipe 2 of the second chamber │ │ ├───────────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit: slm) │ │ ├ ───────────┼───────────────┤ │ │ TEOS │ 0.5: 0: 0 .5 │ ├───┼───────────┴───────────────┤ │ │ Supply pipe 1 │ │ ├ ───────────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixing ratio (unit : Slm) │ │ ├ ───────────┼───────────────┤ │ │ TMOS │ 0.5: 2.5: 0.5 │ │Room 3 ├───────────┴───────────────┤ │ │ Supply pipe 2 of room 3 │ │ ├───── ──────┬───────────────┤ │ │ Monomer gas for film formation │ Gas mixture ratio (unit: slm) │ │ ├─────── ────┼───────────────┤ │ │ HMDSO │ 0.5: 0: 0.5 │ └───┴────────── ─┴───────────────┘

  In Example 2 above, instead of using a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film, a biaxially stretched nylon 6 film having a thickness of 15 μm was used as the base film. Produced a barrier film according to the present invention in the same manner as in Example 2 described above.

  In Example 2 above, instead of using a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film, a biaxially stretched polypropylene film having a thickness of 20 μm was used as the base film. A barrier film according to the present invention was produced in the same manner as in Example 2 above, in the same manner as in Example 2 above.

  In Example 9 above, instead of using a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film, a biaxially stretched nylon 6 film having a thickness of 15 μm was used as the base film. Produced a barrier film according to the present invention in the same manner as in Example 9 described above.

  In Example 9 above, instead of using a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film, a biaxially stretched polypropylene film having a thickness of 20 μm was used as the base film. In the same manner as in Example 9, the barrier film according to the present invention was produced in the same manner as in Example 9.

(Comparative Example 1)
First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the 12 μm-thick biaxially stretched polyethylene terephthalate film as the base film on which the metal oxide layer is formed as described above is applied to a plasma chemical vapor deposition apparatus comprising three chambers as shown in FIG. Installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas supplied from the gas supply device and helium, which is an inert gas, did.
As a raw material gas used in the first film forming chamber, the mixing ratio of the raw material gases was set to HMDSO: O ₂ : He = 1: 10: 1 (unit: slm, standard-driter-minit).
The second film forming chamber and the third film forming chamber were not used.
Using the source gas as described above, each of the source gases is introduced into the first film forming chamber, and then the above-mentioned biaxially stretched polyethylene terephthalate film having a thickness of 12 μm is conveyed at a line speed of 100 m / min. Then, power was applied to form a single silicon oxide layer having a thickness of 130 mm on the metal oxide layer of the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. Manufactured.

(Comparative Example 2)
First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the 12 μm-thick biaxially stretched polyethylene terephthalate film as the base film on which the metal oxide layer is formed as described above is applied to a plasma chemical vapor deposition apparatus comprising three chambers as shown in FIG. Installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas supplied from the gas supply device and helium, which is an inert gas, did.
For the source gas used in the first film forming chamber and the source gas used in the second film forming chamber, the mixing ratio of the source gases is set to HMDSO: O ₂ : He = 1: 10: 1 (unit: slm).
The third film forming chamber was not used.
Using the raw material gas as described above, the raw material gas is introduced into the first and second film forming chambers respectively, and then the above-mentioned biaxially stretched polyethylene terephthalate film having a thickness of 12 μm is converted to a line speed of 100 m / min. A power is applied while being transported at a thickness of 125 μm on a metal oxide layer of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. An adhesive film was produced.

(Comparative Example 3)
First, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was prepared as a base film, and this was attached to a vacuum deposition apparatus (PVD apparatus) consisting of one chamber shown in FIG.
Next, the pressure in the chamber was reduced, and the aluminum filled in the crucible was irradiated with an electron beam with an electron gun to heat and evaporate the aluminum.
On the other hand, one of the corona-treated surfaces of the biaxially stretched polyethylene terephthalate film is introduced while introducing oxygen gas from the gas outlet and transporting the biaxially stretched polyethylene terephthalate film at a speed of 400 m / min. On top of this, a metal oxide layer made of aluminum oxide having a thickness of 150 mm was laminated.
Next, the 12 μm-thick biaxially stretched polyethylene terephthalate film as the base film on which the metal oxide layer is formed as described above is applied to a plasma chemical vapor deposition apparatus comprising three chambers as shown in FIG. Installed.
Next, the pressure in the chamber of the plasma chemical vapor deposition apparatus was reduced.
On the other hand, HMDSO (hexamethyldisiloxane), which is an organic silicon compound as a raw material, is volatilized in a raw material volatilization supply device and mixed with oxygen gas supplied from the gas supply device and helium, which is an inert gas, did.
The raw material gas used in the first film-forming chamber, the raw material gas used in the second film-forming chamber, and the raw material gas used in the third film-forming chamber together have a mixing ratio of the raw material gases of HMDSO: O. ₂ : He = 1: 10: 1 (unit: slm).
Using the source gas as described above, the source gas is introduced into the first film-forming chamber, the second film-forming chamber, and the third film-forming chamber, respectively. While the biaxially stretched polyethylene terephthalate film is conveyed at a line speed of 300 m / min, electric power is applied to form a first layer film on the metal oxide layer of the biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. A three-layer silicon oxide layer having a thickness of 45 mm, a second layer thickness of 45 mm, a third layer thickness of 45 mm, and a total film thickness of 135 mm was formed into a barrier film.

(Comparative Example 4)
In the above comparative example 1, instead of using a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm as the base film, a biaxially stretched nylon 6 film having a thickness of 15 μm was used as the base film. Produced a barrier film in the same manner as in Comparative Example 1 in the same manner as in Comparative Example 1 above.

(Comparative Example 5)
In Comparative Example 1 above, instead of using a 12 μm thick biaxially stretched polyethylene terephthalate film as the base film, a 20 μm thick biaxially stretched polypropylene film was used as the base film. A barrier film was produced in the same manner as in Comparative Example 1 in the same manner as in Comparative Example 1 above.

(Experimental example 1)
For the barrier films produced in Examples 1 to 15 and Comparative Examples 1 to 5, oxygen permeability and water vapor permeability were measured.
(1). Measurement of Oxygen Permeability This is for a barrier film under the conditions of a temperature of 23 ° C. and a humidity of 90% RH on a measuring instrument manufactured by Mocon, USA [model name, OX-TRAN 2/20]. Measured.
(2). Measurement of water vapor permeability This is for a barrier film under the conditions of a temperature of 40 ° C. and a humidity of 90% RH on a measuring instrument manufactured by Mocon, USA [model name, Permatran 3/31]. Measured.
The measurement results are shown in Table 5 below.

(Table 5)
┌─────┬────────────────┐ │ │ Barrier film │ │ ├───────┬────────┤ │ Oxygen permeability │ Water vapor permeability │ ├─────┼───────┼────────┤ │Example 1 │ 0.6 │ 1.1 │ ├─── ──┼───────┼────────┤ │Example 2 │ 0.5 │ 0.5 │ ├─────┼───────┼── ──────┤ │Example 3 │ 0.3 │ 0.8 │ ├─────┼───────┼────────┤ │Example 4 │ 0 .3 │ 0.8 │ ├─────┼───────┼────────┤ │Example 5 │ 0.7 │ 1.0 │ ├───── ┼───────┼────────┤ │Example 6 │ 0.3 │ 0.5 │ ├─────┼───────┼─── ─────┤ │Example 7 │ 0.4 │ 0.3 │ ├─────┼───────┼────────┤ │Example 8 │ 0. 2 │ 0.3 │ ├─────┼───────┼────────┤ │Example 9 │ 0.3 │ 0.4 │ ├─────┼ ───────┼────────┤ │Example 10│ 0.2 │ 0.4 │ ├─────┼───────┼───── ───┤ │Example 11│ 0.2 │ 0.3 │ ├─────┼───────┼────────┤ │Example 12│ 1.0 │ 3.2 │ ├─────┼───────┼────────┤ │Example 13│ 4.2 │ 0.9 │ ├─────┼── ─────┼────────┤ │Example 14│ 0.9 │ 3.0 │ ├─────┼───────┼─────── ─┤ │ Example 15│4.0│0.8││├─────┼───────┼────────┤ │Comparative Example 1 │ 2.9 │ 3.1 │ ├ ─────┼───────┼────────┤ │Comparative Example 2 │ 2.4 │ 3.2 │ ├─────┼─────── ┼────────┤ │Comparative Example 3 │ 2.1 │ 2.7 │ ├─────┼───────┼────────┤ │Comparative Example 4 │ 4.5 │ 8.6 │ ├─────┼───────┼────────┤ │Comparative Example 5 │ 11.5 │ 2.6 │ └── ───┴───────┴────────┘ In Table 5 above, the unit of oxygen permeability is [cc / m ² / day ・ 23 ℃ ・ 90% RH] Yes, the unit of water vapor permeability is [g / m ² / day · 40 ° C. · 90% RH].

  As is clear from the results shown in Table 5 above, the barrier film according to the present invention was excellent in oxygen permeability and water vapor permeability.

(Experimental example 2)
For the barrier films produced in Examples 1 to 15 and Comparative Examples 1 to 5, using a glow discharge plasma generator on the surface of the outermost silicon oxide constituting the barrier layer, Power: 9 kw, oxygen gas (O ₂ ): argon gas (Ar) = 7.0: 2.5 (unit: slm) mixed gas pressure: 6 × 10 ⁻⁵ Torr, processing speed: 420 m Oxygen / argon mixed gas plasma treatment was performed at / min to form a plasma treated surface in which the surface tension of the silicon oxide layer was improved by 54 dyne / cm or more.
Next, an epoxy-based silane coupling agent (8.0 wt%) and an anti-blocking agent (1.0 wt%) are added to the polyurethane resin initial condensate on the plasma-treated surface formed above. Then, a primer composition obtained by sufficiently kneading is used, and this is coated by a gravure roll coating method so that the film thickness becomes 0.4 g / m ² (dry state). An agent layer was formed.
Further, a two-component curing type polyurethane laminating adhesive is used on the surface of the primer layer formed as described above, and this is applied to a film thickness of 4.0 g / m ² (by gravure roll coating method). The adhesive layer for laminating was formed by coating so as to be in a dry state.
Next, on the surface of the laminating adhesive layer formed as described above, a linear low density polyethylene film having a thickness of 50 μm is overlapped with its corona-treated surface facing each other, and then both are laminated with dry laminating. The laminated material was manufactured by laminating.
Next, the oxygen permeability and water vapor permeability of the above laminated material were measured in the same manner as in Experimental Example 1.
(1). Measurement of Oxygen Permeability This is for a laminated material under the conditions of a temperature of 23 ° C. and a humidity of 90% RH, using a measuring instrument manufactured by Mocon, USA (model name: OX-TRAN 2/20). It was measured.
(2). Measurement of water vapor transmission rate This is the measurement of the laminate material under the conditions of a temperature of 40 ° C. and a humidity of 90% RH, manufactured by MOCON, USA [model name, PERMATRAN 3/31]. It was measured.
The measurement results are shown in Table 6 below.

(Table 6)
┌─────┬────────────────┐ │ │ Layered material │ │ ├───────┬────────┤ │ │ Oxygen permeability │ Water vapor permeability │ ├─────┼───────┼────────┤ │Example 1 │ 0.5 │ 0.6 │ ├─── ──┼───────┼────────┤ │Example 2 │ 0.4 │ 0.3 │ ├─────┼───────┼── ──────┤ │Example 3 │ 0.3 │ 0.5 │ ├─────┼───────┼────────┤ │Example 4 │ 0 .2 │ 0.6 │ ├─────┼───────┼────────┤ │Example 5 │ 0.6 │ 0.8 │ ├ ───── ┼───────┼────────┤ │Example 6 │ 0.3 │ 0.4 │ ├─────┼───────┼──── ─── │ │Example 7 │ 0.3 │ 0.3 │ ├─────┼───────┼────────┤ │Example 8 │ 0.1 │ 0.2 │ ├─────┼───────┼────────┤ │Example 9 │ 0.2 │ 0.2 │ ├─────┼───── ──┼────────┤ │Example 10│ 0.1 │ 0.2 │ ├────┼┼───────┼────────┤ │ Example 11│0.2│0.2││├────┼───────┼────────┤ │Example 12│0.7 │ 1.5 │ ├ ─────┼───────┼────────┤ │Example 13│ 3.0 │ 0.6 │ ├─────┼─────── ┼────────┤ │Example 14│ 0.7 │ 1.4 │ ├─────┼───────┼────────┤ │Example 1 │ 2.7 │ 0.5 │ ├─────┼───────┼────────┤ │Comparative Example 1 │ 2.7 │ 2.4 │ ─── ──┼───────┼────────┤ │Comparative Example 2 │ 2.2 │ 2.5 │ ├─────┼───────┼── ──────┤ │Comparative Example 3 │1.9 │ 2.4 │ ├─────┼───────┼────────┤ │Comparative Example 4 │ 3 .9 │ 5.5 │ ├─────┼───────┼────────┤ │Comparative Example 5 │ 10.4 │ 2.5 │ └───── ┴───────┴────────┘ In Table 6 above, the unit of oxygen permeability is [cc / m ² / day · 23 ° C · 90% RH] The unit of transmittance is [g / m ² / day · 40 ° C. · 90% RH].

  As is clear from the results shown in Table 6 above, the laminated material using the barrier film according to the present invention was excellent in oxygen permeability and water vapor permeability.

(Experimental example 3)
In the barrier film produced in Example 2 and Comparative Example 1 above, after forming a silicon oxide layer on one surface of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm, the silicon oxide The change of the component in the depth direction of the layer was measured.
Note that the silicon oxide layer was not formed on the metal oxide layer made of aluminum oxide.
Next, the 12 μm thick biaxially stretched polyethylene terephthalate film on which the silicon oxide layer is formed is deepened from the surface of the silicon oxide layer using an X-ray photoelectron spectrometer (XPS). Elemental analysis was performed in the direction, and the silicon, oxygen, and carbon contents detected at that time were measured and evaluated.
The results are shown in Table 7 below.
Further, in the barrier film produced in Example 2 and Comparative Example 1, a silicon oxide layer was formed on one surface of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm, and then the silicon oxide Measurement of IR absorption peak position based on Si—O—Si stretching vibration and IR absorption peak strength based on Si—CH ₃ stretching vibration of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm. did.
Note that the silicon oxide layer was not formed on the metal oxide layer made of aluminum oxide.
This is a 12-μm thick biaxially stretched polyethylene terephthalate film on which a silicon oxide layer is formed, equipped with a multiple reflection measuring device (manufactured by JASCO Corporation, model name, ATR-300 / H). It measured with the conversion type | mold infrared spectrophotometer (The JASCO Corporation make, model name, Herschel FT / IR-610).
The infrared absorption spectrum was measured at an incident angle of 45 degrees using a germanium crystal as a prism.
The results are shown in Table 7 below.

(Table 7)
┌───────┬──────────┬─────────┬──────┐ │ │ Si: O: C │Si-O-Si Pi-│Si-CH ₃ │ │ │ │ Position (cm ^-1 ) │ Absorption Strength│ ├─┬─────┼──────────┼───────── ─┼──────┤ │Real │1 layer │ │ │ │ │ │ (surface) │100: 160: 90│1038 │0.028 │ │Example ├─────┼─── ───────┼─────────┼──────┤ │2│2 layers │100: 185: 13│ 1065 │0.010 │ │ │──── ─┼──────────┼─────────┼──────┤ │ │3 layers │ │ │ │ │ │ (base material side) │100: 170 : 85│ 1040 │0.027 │ ├─┼─────┼──────────┼─ ───────┼──────┤ │ Ratio │1 layer │ │ │ │ │Comparison (surface) │100: 180: 17│ 1060 │0.012 │ │Example ├─── ──┼──────────┼─────────┼──────┤ │1│2 layers │100: 185: 15│ 1065 │0.011 │ │ ├─────┼──────────┼─────────┼──────┤ │ │3 layers │ │ │ │ │ │ (base material Side) │100: 188: 15│1065 │0.012 │ └─┴─────┴──────────┴─────────┴────── ─┘

From the results shown in Table 7 above, regarding the barrier film produced in Example 2 and Comparative Example 1, the change in the constituent components in the depth direction of the silicon oxide layer constituting the barrier layer, and The IR absorption peak position based on the Si—O—Si stretching vibration and the IR absorption peak intensity based on the Si—CH ₃ stretching vibration were as described above.

  In the present invention, a metal oxide layer and a silicon oxide layer are layered, the layered film is a barrier layer, and has excellent adhesion between the base film and the barrier layer, and its extensibility, flexibility, Excellent in flexibility, etc. Furthermore, it prevents the penetration of oxygen gas, water vapor, etc. as a barrier material used for packaging materials, etc. without entering foreign substances, dust, etc. that cause cracks The present invention relates to a very useful barrier film that is excellent in gas barrier properties and also has no deterioration in performance of the gas barrier properties. Therefore, the barrier film uses this as a barrier material, and other Laminations of various forms, optionally laminated with one or more of various substrates such as plastic film, paper substrate, metal foil or metal plate, cellophane, woven or nonwoven fabric, glass plate, etc. Made of wood The laminated material is, for example, a packaging material, an optical member, a protective sheet for a solar cell module, a protective film for an organic EL display, a protective film for a film liquid crystal display, a packaging material for a polymer battery, or It can be applied to various uses such as aluminum packaging materials and others.

It is a schematic block diagram which shows the schematic structure of an example of the manufacturing apparatus about the barrier film concerning this invention. It is a schematic block diagram which shows the schematic structure of an example of the manufacturing apparatus about the barrier film concerning this invention. It is a schematic block diagram which shows the schematic structure of an example of the manufacturing apparatus about the barrier film concerning this invention. It is a schematic sectional drawing which shows an example of the layer structure about the barrier film concerning this invention.

Explanation of symbols

A Barrier film 51 Base film 52 Barrier layer 53 Metal oxide layer 54a Silicon oxide layer 54b Silicon oxide layer 54c Silicon oxide layer

Claims (12)

It comprises at least a base film and a barrier layer provided on one surface of the base film, and the barrier layer is first provided with a metal oxide layer formed by physical vapor deposition, A film forming chamber comprising at least two chambers on the metal oxide layer, and a film forming monomer gas comprising at least one organosilicon compound for each chamber, oxygen gas, And two or more film-forming mixed gas compositions prepared by changing the mixing ratio of each gas component of the film-forming mixed gas composition containing an inert gas, and each film-forming mixed gas composition Each of the above-mentioned silicon oxide layers contains carbon atoms in the film, in which two or more layers of silicon oxide layers formed by plasma chemical vapor deposition are used. In addition, each silicon oxide layer must have a different carbon atom content. Barrier film characterized in. The barrier film according to claim 1, wherein the base film is a biaxially stretched polyester resin film, a biaxially stretched polyamide resin film, or a biaxially stretched polyolefin resin film. 3. The barrier film according to claim 1, wherein the metal oxide layer is made of an aluminum oxide vapor-deposited film. Organosilicon compounds are 1.1.3.3-tetramethyldisiloxane, hexamethyldisiloxane, vinyltrimethylsilane, methyltrimethylsilane, hexamethyldisilane, methylsilane, dimethylsilane, trimethylsilane, diethylsilane, propylsilane, phenyl The above-mentioned, characterized by comprising one or more of silane, vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, or octamethylcyclotetrasiloxane The barrier film as described in any one of Claims 1-3. The barrier film according to any one of claims 1 to 4, wherein the inert gas comprises argon gas or helium gas. 1 is a gas mixture of a gas composition monomer gas: oxygen gas: inert gas = 1: 0 to 5: 1 (unit: slm, abbreviation of standard-driter-minit). It consists of composition ratios, The barrier film as described in any one of Claims 1-5 characterized by the above-mentioned. The film forming mixed gas composition 2 is a gas of monomer gas for film formation: oxygen gas: inert gas = 1: 6 to 15: 1 (unit: slm, abbreviation of standard-driter-minit). It consists of composition ratios, The barrier film as described in any one of said Claims 1-6 characterized by the above-mentioned. The silicon oxide layer has a component ratio of 150 to 200 O atoms and 50 to 100 C atoms with respect to 100 Si atoms, and further Si—O—Si stretching vibration between 1030 cm ^{−1 to} 1060 cm ^−1. The barrier film according to claim 6, wherein the barrier film has IR absorption based on Si and has IR absorption based on Si—CH ₃ stretching vibration at 1274 ± 4 cm ⁻¹ . The silicon oxide layer has a component ratio of 150 to 200 O atoms and 50 or less C atoms to 100 Si atoms, and further exhibits Si—O—Si stretching vibration between 1045 cm ^{−1 to} 1075 cm ^−1. The barrier film according to claim 7, wherein the barrier film has IR absorption based on IR absorption based on Si—CH ₃ stretching vibration at 1274 ± 4 cm ⁻¹ . The silicon oxide layer is a silicon oxide layer prepared by forming a first layer with a thickness of 30 to 300 mm and a second layer with a thickness of 30 to 300 mm, or a first layer with a thickness of 20 to 200 mm, a second layer. The barrier film according to any one of claims 1 to 9, which comprises a silicon oxide layer formed by preparing a film of 20 to 200 mm and a third layer of 20 to 200 mm. The silicon oxide layer contains carbon atoms in the film, and the carbon content in the film increases in the depth direction from the film surface. 10. The barrier film described in any one of 10 above. The barrier film according to any one of claims 1 to 11, wherein the plasma chemical vapor deposition method comprises a low temperature plasma chemical vapor deposition method.

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