JP2005086126A - Method for manufacturing stage, hot plate, processing machine, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a stage, a hot plate, a processing machine, and an electronic device that can prevent a defect in the manufacture due to the suction of a substrate to the stage. <P>SOLUTION: This stage is a stage for sucking the substrate, and has a main body part 23 having suction holes 21 formed on a suction surface where the substrate is sucked, and porous ceramic members 22 buried in suction holes 21; and the substrate is sucked through the porous ceramic members 22 buried in the suction holes 21 so that the porous ceramic members 22 support the substrate together with the suction surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a stage, a hot plate, a processing apparatus, and an electronic apparatus manufacturing method.

  A liquid crystal display device, which is an example of an electronic device, is thin and lightweight and consumes little power. Therefore, it is used in mobile phones, personal digital assistants, personal computers, TV receivers, etc., and has a CRT (Cathode Ray Tube) display. Instead of devices, it is rapidly becoming popular. This liquid crystal display device is produced through a complicated production process, and researches for improving the yield in this production process are being actively pursued.

  The liquid crystal display device includes, for example, a liquid crystal layer between two substrates having electrodes, an alignment film, and the like. In the manufacturing process of the liquid crystal display device, for example, an alignment film temporary baking process for preliminarily drying the alignment film, a rubbing process for performing an alignment treatment (rubbing) on the alignment film surface, and a seal coating for applying a sealant pattern to the substrate There are a process, a transfer electrode application process for applying a transfer material to the substrate, a cell dividing process for dividing the substrate into several cells, and the like. In these manufacturing processes, the substrate is fixed on a stage provided in the manufacturing apparatus, and work is performed. At this time, vacuum suction is generally performed to fix the substrate on the stage. Hereinafter, the stage includes a hot plate that fixes the substrate and performs heat treatment.

  As a stage used in a conventional apparatus for manufacturing a liquid crystal display device, for example, a stage shown in FIG. 6 is known. Here, FIG. 6A is a top view and FIG. 6B is a cross-sectional view. As shown in the figure, the stage 60 has a plurality of suction holes 61. For example, the substrate is placed on the upper surface of the stage 60 and sucked by a vacuum pump or the like through the suction hole 61 from below the stage 60 to fix the substrate to the upper surface of the stage 60.

  FIG. 7 is a cross-sectional view in a state where a substrate is fixed to the upper surface of a conventional stage. As in FIG. 6, 60 is a stage, 61 is a suction hole, and 70 is a substrate. When the substrate 70 is adsorbed to the stage 60, the substrate 70 is distorted at the adsorbing portions of the substrate 70 and the adsorption holes 61 as shown in the figure.

  For this reason, for example, alignment defects occur in the rubbing process, line widths and application diameters abnormal in the seal coating process and transfer electrode coating process, and defective processes occur in various processes such as a cutting defect in the cell dividing process. There is a case to let you.

  Further, when 60 in FIG. 6 is used as a hot plate and the substrate is adsorbed and heat is applied in the same manner as described above, a temperature difference occurs in the adsorption hole 61 portion. For this reason, for example, a display defect may occur due to drying unevenness in the alignment film calcination step.

  In particular, since the thickness of the substrate has been reduced in recent years, it is easily affected by the deformation of the substrate due to adsorption.

A method for preventing display defects by providing a protective paper between the stage and the substrate is known (see Patent Document 1).
JP 2001-235736 A

  As described above, in the conventional method for manufacturing an electronic apparatus such as a liquid crystal display device using a stage, manufacturing defects such as process defects and display defects occur due to substrate deformation and uneven temperature distribution due to adsorption of the substrate to the stage. There was a problem of doing.

  The present invention has been made to solve such problems, and an object of the present invention is to prevent manufacturing defects due to adsorption of a substrate to a stage.

  A stage according to the present invention is a stage that adsorbs a substrate, and a main body portion in which a concave portion (for example, an adsorption hole) is formed on an adsorption surface that adsorbs the substrate, a porous member embedded in the concave portion, And adsorbing the substrate through the porous member embedded in the recess so that the porous member supports the substrate together with the adsorption surface. Thereby, the board | substrate deformation | transformation by adsorption | suction of a board | substrate can be prevented.

  In the above-described stage, the upper surface of the porous member may be in a position that is in the same position as the suction surface of the main body. Thereby, the board | substrate deformation | transformation by adsorption | suction of a board | substrate can be prevented more reliably.

  In the above-described stage, the porous member may be formed of a porous ceramic. Thereby, the board | substrate deformation | transformation by adsorption | suction of a board | substrate can be prevented more reliably.

  A processing apparatus according to the present invention includes a stage that sucks a substrate and a processing unit that processes the substrate sucked on the stage, and the stage has a main body having a recess formed on the suction surface that sucks the substrate. And a porous member embedded in the recess, and the substrate adsorbs the substrate through the porous member embedded in the recess so that the porous member supports the substrate together with the adsorption surface. To do. Thereby, it is possible to reduce the occurrence of manufacturing defects due to substrate deformation when the substrate is adsorbed.

  A hot plate according to the present invention is a hot plate that sucks and heats a substrate, and includes a main body having a recess formed on the suction surface for sucking the substrate, and a porous member embedded in the recess. And adsorbing the substrate through a porous member embedded in the recess. Thereby, unevenness of the temperature distribution due to the adsorption of the substrate can be prevented.

  A processing apparatus according to the present invention includes a hot plate that sucks and heats a substrate, and a heating unit that superheats the substrate sucked by the hot plate, and the hot plate has a suction surface that sucks the substrate. A main body having a concave portion and a porous member embedded in the concave portion are provided, and the substrate is adsorbed through the porous member embedded in the concave portion. Thereby, it is possible to reduce the occurrence of manufacturing defects due to uneven temperature distribution when the substrate is adsorbed.

  In the manufacturing method according to the present invention, the porous member supports the substrate together with the adsorption surface through the step of placing the substrate on the stage and the porous member embedded in the concave portion of the main body of the stage. Thus, the method includes a step of adsorbing the substrate to the stage and a step of processing the substrate adsorbed to the stage. Thereby, it is possible to reduce the occurrence of manufacturing defects due to substrate deformation when the substrate is adsorbed.

  The manufacturing method according to the present invention includes a step of placing a substrate on a hot plate and a porous member embedded in a concave portion of a main body portion of the hot plate, with the suction surface supporting the substrate, A step of adsorbing the substrate to the hot plate; and a step of heating the substrate adsorbed to the hot plate by heating the main body. Occurrence of manufacturing defects due to uneven temperature distribution when the substrate is adsorbed can be reduced.

  According to the present invention, it is possible to prevent manufacturing defects due to adsorption of the substrate to the stage.

Embodiment 1 of the present invention.
First, the configuration of a manufacturing apparatus for a liquid crystal display device according to Embodiment 1 of the present invention will be described with reference to FIG. As shown in the figure, this manufacturing apparatus is composed of a gantry 1, a stage 2, a dispenser support 3, a dispenser 4, and a transport robot 5. In addition to this, a stage conveyance unit or the like may be provided. Furthermore, you may provide the element required by each manufacturing process. For example, a rubbing roller or the like in the rubbing process may be provided, or a heating unit or the like in the alignment film calcination process may be provided.

  For example, a substrate serving as a liquid crystal display device (to be described later) is transported onto the stage 2 by the transport robot 5, and the substrate is attracted to a predetermined position. Then, as will be described later, a sealer, a transfer electrode, and the like are applied to the substrate by the dispenser 4.

  Next, the configuration of the stage used in this embodiment will be described with reference to FIG. Here, FIG. 2A shows a top view and FIG. 2B shows a cross-sectional view. As shown in the figure, the stage 2 includes a main body portion 23 and a porous ceramic member 22 embedded in an adsorption hole 21 that is a concave portion of the main body portion 23. In addition, a plurality of suction holes 21 are provided in a direction perpendicular to the upper surface and the lower surface of the main body 23, and a porous ceramic member 22 is embedded in these suction holes 21.

  In the stage 2, the substrate is fixed by suction in the above-described manufacturing apparatus, and each manufacturing process is performed. For example, a pipe connected to a vacuum pump (not shown) is provided on the lower surface of the stage 2, and a substrate placed on the upper surface of the stage 2 is sucked from below the stage 2 by a vacuum pump through the porous ceramic member 22. Then, the substrate is fixed to the upper surface of the stage 2. Further, the upper surface of the stage 2 is a flat surface in order to fix the entire substrate uniformly. For example, the width of the upper surface and the lower surface of the stage 2 is wider than the substrate to be adsorbed and the thickness is about 5 mm, but the size is not limited to this. The main body portion 23 may be any material such as metal that is hard enough to withstand vacuum adsorption, and the material thereof is not limited. Further, the main body portion 23 is formed of a nonporous material instead of a porous material, whereby the substrate is sucked through the porous ceramic member 22.

  A plurality of suction holes 21 are provided so as to suck and fix the entire substrate. The number of the suction holes 21 is not limited and may be an arbitrary number. For example, the number of the suction holes 21 is 6 × 8 or 15 × 20 when expressed in length × width. The diameter of the suction hole 21 is not particularly limited, but is, for example, 1 mm or 3 mm. The suction hole 21 may be any recess that can be vacuum-sucked, and the shape and the like are not limited. For example, the suction hole 21 may be a through-hole that is perpendicular to the upper surface and the lower surface of the main body 23 and has a round cross-sectional shape as shown in the figure, or may be formed as a suction groove by providing a groove on the upper surface of the main body 23. Good. The shape of the suction groove may be, for example, a mouth shape, a rice field shape, a grid shape, or the like as viewed from the upper surface of the main body 23. Although the width | variety of an adsorption | suction groove | channel is not specifically limited, For example, it is 2 mm or 3 mm. Further, in the case of the suction groove, suction may be performed from a side surface instead of the lower surface of the stage 2 by a vacuum pump.

  Since the porous ceramic member 22 fixes the substrate by vacuum suction as described above, the porous ceramic member 22 is embedded in the suction hole 21 so that the upper surface thereof is in the same position as the upper surface of the main body portion 23. Further, when the stage 2 is a hot plate, the porous ceramic member 22 does not have to be in contact with the adsorbed substrate if the uneven temperature distribution does not occur on the adsorbed substrate. The position of the lower surface of the porous ceramic member 22 is not particularly limited, and may be, for example, the lower surface of the main body portion 23 and a claw position, or may protrude or dent. Further, the porous ceramic member 22 may be of a material having good air permeability capable of passing the air pressure by suction of the vacuum pump like a filter and having a hardness capable of withstanding the adsorption of the substrate. For example, alumina, silica, silicon nitride and the like are not limited thereto, but may be a porous metal or the like. The size and number of pores inside the porous ceramic member 22 are not particularly limited, but are preferably such that the force for vacuum-adsorbing the substrate is not affected. In addition, when the stage 2 is a hot plate, in addition to the above, it is necessary to withstand applied heat.

  FIG. 3 is a cross-sectional view in a state where the substrate is fixed to the upper surface of the stage used in the present embodiment. As in FIG. 2, 2 is a stage, 21 is an adsorption hole, 22 is a porous ceramic, 23 is a main body, and 30 is a substrate. The substrate 30 may be an electrode substrate described later or a color filter substrate. When the substrate 30 is attracted to the stage 2, as shown in the figure, the substrate 30 is in close contact with and fixed to the upper surface of the main body 23 and the porous ceramic member 22 without distortion.

  As described above, when the substrate is adsorbed on the upper surface of the stage 2, the substrate 30 is supported by the upper surface of the porous ceramic member 22, whereby the deformation of the substrate 30 can be prevented. Further, when the stage 2 is a hot plate, the porous ceramic member 22 transfers heat to the lower surface of the substrate 30 together with the main body portion 23, so that it is possible to prevent uneven temperature distribution that becomes a problem when the suction holes are formed.

  Next, the configuration of the liquid crystal display device manufactured according to the present embodiment will be described with reference to FIG. Here, a TFT liquid crystal display device will be described as an example. As shown in the figure, the liquid crystal display device 400 includes an electrode substrate 410, a color filter substrate 420, and a liquid crystal 430 filled between the electrode substrate 410 and the color filter substrate 420. The electrode substrate 410 has a display electrode 412, an electrode terminal 414, and an alignment film 413 on one surface of the glass substrate 411, and a polarizing plate 414 on the other surface. have. The color filter substrate 420 includes a common electrode 422 and an alignment film 423 on one surface of the glass substrate 421, a polarizing plate 424 on the other surface, and further includes a color filter and the like (not shown). . The electrode substrate 410 and the color filter substrate 420 are bonded to each other with a sealant 431 so as to form a predetermined gap by the spacer 433. The electrode terminal 414 and the common electrode 422 are electrically connected by a transfer electrode 432. Furthermore, the liquid crystal display device 400 further includes a driver for driving (not shown), a backlight unit serving as a light source, and the like.

  In the liquid crystal display device 400, for example, when an electrical signal is input from a driver for driving, a driving voltage is applied to the display electrode 412 and the common electrode 422, and the molecular direction of the liquid crystal 430 is changed in accordance with the driving voltage. The light emitted from the light source is transmitted or blocked to the outside through the electrode substrate 410, the liquid crystal 430, and the color filter substrate 420, whereby an image or the like is displayed on the liquid crystal display device 400.

  The liquid crystal display device 400 is an example and may have other configurations. The operation mode of the liquid crystal display device 400 may be a TN (twisted nematic) mode, an STN (supper twisted nematic) mode, a ferroelectric liquid crystal mode, or the like, and the driving method may be a simple matrix, an active matrix, or the like.

  Next, the manufacturing method of the liquid crystal display device according to the present embodiment will be described with reference to the flowchart shown in FIG. Display electrodes 412, switching elements, and electrode terminals 414 are formed on one surface of the glass substrate 411 using a photolithography method or the like, and similarly, color filters and a common electrode 422 are formed on one surface of the glass substrate 421. After that, S501 is performed.

  First, in the substrate cleaning step, the electrode substrate 410 on which the display electrodes 412 are formed is cleaned (S501). Next, in the alignment film application step, an alignment film 413 is applied to one surface of the electrode substrate 410 (S502). This step is performed, for example, by applying an alignment film AL3046 manufactured by JSR by a printing method. In the alignment film calcination step, the alignment film 413 is preliminarily dried (S503). This step is performed, for example, by fixing the electrode substrate 410 on the hot plate as the stage 2 and drying the solvent at 80 °. Further, in the alignment film main firing step, the alignment film 413 is completely dried (S504). This step is performed by, for example, main baking in a 230 ° oven. Thereafter, in the rubbing step, the alignment film 413 is rubbed to align the alignment film 413 (S505). This step is performed, for example, by fixing the electrode substrate 410 on the stage 2 and rubbing a rubbing roller.

  Similarly to S501 to S505, the color filter substrate 420 on which the common electrode 422 is formed is subjected to cleaning, application of the alignment film 423, temporary baking, main baking, and rubbing.

  In the seal application process, the seal material 431 is applied to one surface of the electrode substrate 410 or the color filter substrate 420 (S506). In this step, for example, the electrode substrate 410 or the color filter substrate 420 is fixed on the stage 2, and a thermosetting resin such as an epoxy adhesive or an ultraviolet curable resin is used in the dispenser 4 so as to form a liquid crystal injection port. This is done by applying. Next, in the transfer electrode application step, the transfer electrode 432 is applied to one surface of the electrode substrate 410 or the color filter substrate 420 (S507). This step is performed, for example, by fixing the electrode substrate 410 or the color filter substrate 420 on the stage 2 and applying a conductive paste by the dispenser 4. In the spacer spraying step, the spacer 433 is sprayed on one surface of the electrode substrate 410 or the color filter substrate 420 (S508). This step is performed, for example, by dispersing the spacers by a wet method or a dry method. Thereafter, in the bonding step, the electrode substrate 410 and the color filter substrate 420 are bonded together (S509).

  In the seal curing step, the seal material 431 is completely cured with the electrode substrate 410 and the color filter substrate 420 bonded together (S510). This step is performed, for example, by applying heat according to the material of the sealing material 431 or irradiating ultraviolet rays. Next, in the cell dividing step, the bonded substrates are disassembled into individual cells (S511). This step is performed, for example, by fixing and cutting the substrate bonded to the stage 2. In the liquid crystal injection step, liquid crystal is injected from the liquid crystal injection port (S512). This step is performed, for example, by filling a liquid crystal ZNL-4792 manufactured by Merck by vacuum injection from a liquid crystal injection port. Further, in the sealing step, the liquid crystal inlet is sealed (S513). This step is performed, for example, by sealing with a photocurable resin and irradiating with light. Thereafter, in the polarizing plate attaching step, polarizing plates 414 and 424 are attached to the cells (S514). This step is performed by, for example, fixing and attaching a cell on the stage 2.

  In this way, the liquid crystal display device 400 is obtained. As described above, due to the use of stage 2 in the alignment film calcination process, rubbing process, sealing process, transfer electrode coating process, cell dividing process, and polarizing plate pasting process, it is caused by deformation due to substrate adsorption or uneven temperature distribution. It is possible to obtain a liquid crystal display device 400 having a high-quality image free from process defects and display defects.

  As described above, in the stage 2, the porous ceramic member 22 is embedded in the adsorption hole 21, and the adsorbed substrate is supported by the porous ceramic member 22. Very little deformation. For this reason, defects such as coating unevenness due to deformation of the substrate do not occur when an alignment process is performed on the substrate or when a sealing material or the like is applied.

  Also, when the stage 2 is a hot plate, unlike the conventional case where the suction hole portion is hollow, the substrate and the stage can be in contact with each other at the suction portion, so that the difference in temperature distribution is small. For this reason, display defects do not occur even in a temperature sensitive process such as preliminary drying of the alignment film.

Other Embodiments of the Invention
In the above example, the liquid crystal cell assembling process in the manufacturing process of the liquid crystal display device has been mainly described. However, the present invention is not limited to this. Good.

  In the above example, the method for manufacturing a liquid crystal display device has been described. However, the present invention is not limited to this, and a method for manufacturing a plasma display device, an organic EL display device, a semiconductor, or the like may be used.

It is a block diagram of the manufacturing apparatus of the liquid crystal display device concerning this invention. It is a block diagram of the stage concerning this invention. It is a figure which shows the state which adsorb | sucked the board | substrate to the stage concerning this invention. It is a block diagram of the liquid crystal display device concerning this invention. 3 is a flowchart showing a method for manufacturing a liquid crystal display device according to the present invention. It is a block diagram of the conventional stage. It is a figure which shows the state which adsorb | sucked the board | substrate to the conventional stage.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Stand 2 Stage 3 Dispenser support part 4 Dispenser 5 Transfer robot 21 Adsorption hole 22 Porous ceramic 23 Main-body part

Claims (8)

A stage for adsorbing a substrate,
A main body having a recess formed in an adsorption surface for adsorbing the substrate;
A porous member embedded in the recess,
A stage that adsorbs the substrate through the porous member embedded in the recess so that the porous member supports the substrate together with the adsorption surface.   2. The stage according to claim 1, wherein the upper surface of the porous member is in an icicle position with respect to the adsorption surface of the main body portion.   The stage according to claim 1 or 2, wherein the porous member is formed of a porous ceramic. A stage for adsorbing the substrate;
Processing means for processing the substrate adsorbed on the stage,
The stage is
A main body having a recess formed in an adsorption surface for adsorbing the substrate;
A porous member embedded in the recess,
Adsorbing the substrate through the porous member embedded in the recess so that the porous member supports the substrate together with the adsorption surface;
Processing equipment. A hot plate for adsorbing and heating a substrate,
A main body having a recess formed in an adsorption surface for adsorbing the substrate;
A porous member embedded in the recess,
Adsorbing the substrate through a porous member embedded in the recess;
Hot plate. A hot plate that adsorbs and heats the substrate;
Heating means for heating the substrate adsorbed on the hot plate,
The hot plate is
A main body having a recess formed in an adsorption surface for adsorbing the substrate;
A porous member embedded in the recess,
Adsorbing the substrate through a porous member embedded in the recess;
Processing equipment. Installing the substrate on the stage;
A step of adsorbing the substrate to the stage while the porous member supports the substrate together with the adsorption surface through the porous member embedded in the recess of the main body of the stage;
Processing the substrate adsorbed on the stage;
A method for manufacturing an electronic device. Installing the substrate on a hot plate;
A step of adsorbing the substrate to the hot plate with the adsorption surface supporting the substrate via a porous member embedded in a recess of the main body of the hot plate;
Heating the substrate adsorbed on the hot plate by heating the body portion; and
A method for manufacturing an electronic device.

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