JP2005074592A - Electrodeposited wire saw and method for producing electrodeposited wire saw - Google Patents

Abstract

An electrodeposited wire saw having excellent chip dischargeability, good sharpness, less likely to cause chipping of the edge of an abrasive grain layer, and the processing accuracy of a workpiece is further improved, and a method for producing the same provide.
In an electrodeposited wire saw in which a superabrasive grain layer is provided by electrodeposition on the peripheral surface of a core wire, the superabrasive grain layer has a plurality of flat portions having substantially the same diameter and at least one end of the flat portion. In a method of manufacturing an electrodeposited wire saw having a continuous, small diameter tapered portion and an electrodeposited wire saw in which a superabrasive layer is formed by electrodeposition around the core wire, the potential of the core wire is changed in the axial direction. Thus, a method of manufacturing an electrodeposited wire saw in which the superabrasive layer is tapered.
[Selection] Figure 1

Description

  The present invention relates to an electrodeposited wire saw and a method for manufacturing an electrodeposited wire saw. More specifically, the present invention is excellent in chip evacuation and is less prone to chipping of the edge of the abrasive layer, further improving processing accuracy, precision processing of brittle materials, and inner surface polishing of ferrules. In particular, the present invention relates to an electrodeposited wire saw that is suitably used for the above-mentioned purposes, and a method of manufacturing an electrodeposited wire saw for forming an electrodeposited layer having a taper provided in the electrodeposited wire saw.

Conventionally, wire saws are used for precision processing of hard and brittle materials, such as grooving and cutting of vibrators of magnetic heads, or cutting of ceramics and silicon wafers.
On the other hand, a ferrule used as a main connector part of an optical fiber is made of, for example, a zirconia ceramic material. A fiber insertion hole is formed in the axial direction of the ferrule, and an optical fiber is inserted into the fiber insertion hole and held and fixed. Conventionally, a wire saw has been used as a tool for polishing the fiber insertion hole of the ferrule.
For wire saws used in such applications, there are methods for grooving, cutting, inner surface polishing, etc. while supplying free abrasive grains to the workpiece and the sliding part of the wire, and abrasive grains directly on the surface of the wire. There is a method using a fixed abrasive wire saw to which is fixed.
As the fixed abrasive wire saw used in the latter method, for example, an electrodeposited wire saw in which abrasive grains are fixed to a core wire by electrodeposition, and a resin bond wire saw in which abrasive grains are fixed using a polymer material as a binder are known. Resin bond wire saws tend to exfoliate the abrasive layer compared to electrodeposited wire saws, and thus have the problem of more severe wear than electrodeposited wire saws.
Electrodeposited wire saws include an electrodeposition type in which superabrasive grains are electrodeposited on the entire outer circumference of a core wire made of a high-strength wire such as a piano wire (see Patent Document 1, for example), and superabrasive grains are intermittently disposed on the outer circumference of the core wire Segment electrodeposition type (for example, refer to Patent Document 2).
However, in the electrodeposition wire saw of the whole electrodeposition type, there is a problem that the discharge of the chips is bad and the sharpness is liable to be reduced due to clogging. On the other hand, in the electrodeposition wire saw of the segment electrodeposition type, the discharge of the chips is Although it is excellent, there is a problem that the abrasive grain layer is chipped at the edge of the abrasive grain layer that acts most during processing, and as a result, the abrasive grains are easily dropped and the processing accuracy of the workpiece is inferior.
Japanese Utility Model Publication No. 58-128823 JP 10-44132 A

  Under such circumstances, the present invention is excellent in chip dischargeability, has a good sharpness, is less prone to chipping of the edge of the abrasive layer, and further improves the processing accuracy of the workpiece. Electrodeposition for forming electrodeposited wire saws suitably used for precision processing of brittle materials, inner surface polishing of ferrules, and the like, and a superabrasive layer having a taper provided on the electrodeposited wire saws by electrodeposition It is made for the purpose of providing the manufacturing method of a wire saw.

As a result of intensive studies to achieve the above object, the present inventors have found that a wire saw provided with a superabrasive layer having a specific structure having a taper by electrodeposition can be adapted to the purpose, and that the taper It has been found that a superabrasive grain layer having a thickness can be formed by changing the potential of the core wire in the axial direction during electrodeposition, and the present invention has been completed based on this finding.
That is, the present invention
(1) In an electrodeposited wire saw in which a superabrasive layer is provided by electrodeposition on the peripheral surface of a core wire, the superabrasive layer is continuous with a plurality of flat portions having substantially the same diameter and at least one end of the flat portion. And an electrodeposited wire saw having a taper portion in the direction of a small diameter,
(2) The electrodeposited wire saw according to item 1, wherein the superabrasive layer has a small-diameter flat portion that is continuous with the small-diameter end of the tapered portion.
(3) The electrodeposited wire saw according to item 1 or 2, wherein the superabrasive grains in the superabrasive grain layer have a conductive coating on the surface,
(4) In a method for manufacturing an electrodeposited wire saw in which a superabrasive layer is formed on the peripheral surface of a core wire by electrodeposition, the potential of the core wire is changed in the axial direction, and the superabrasive layer is tapered. A method for producing an electrodeposited wire saw, and (5) the method for producing according to item 4, wherein the electrodeposited wire saw is the electrodeposited wire saw according to item 1 or 2.
Is to provide.

The electrodeposited wire saw of the present invention has the following effects.
(1) Since the superabrasive layer is provided intermittently in the axial direction of the core wire or in order of the large diameter portion and the small diameter portion, the chip dischargeability is good and the sharpness is excellent.
(2) Since the taper portion is provided continuously to the flat portion of the superabrasive grain layer, chipping of the abrasive grain layer can be suppressed and the abrasive grains can be prevented from falling off.
(3) Since the flat portion is provided in the superabrasive layer, the workpiece can be processed with high accuracy.
(4) By using superabrasive grains having a conductive film such as Ni or Ti, it is possible to improve the abrasive grain retention and to easily form a superabrasive grain layer having a multilayer structure.
(5) Wear of the core wire can be prevented by providing a metal plating layer between the core wire and the superabrasive grain layer.
Moreover, according to the manufacturing method of this invention, a desired taper can be easily formed in a superabrasive grain layer.

The electrodeposited wire saw of the present invention has a superabrasive layer provided by electrodeposition on the peripheral surface of a core wire, and (1) the superabrasive layer is intermittently provided in the axial direction of the core wire, The abrasive layer is continuous with at least one end of the flat portion and the flat portion, and has an electrodeposited wire saw I having a tapered portion in the direction of small diameter, and (2) the superabrasive layer is continuous in the axial direction of the core wire. And the superabrasive layer is continuous with at least one end of the flat portion and has a taper portion in a direction of a small diameter, and a small diameter end portion of the taper portion. There are two modes: an electrodeposited wire saw II having a continuous small-diameter flat part.
1 and 2 are partial side views of examples of the electrodeposited wire saw I and the electrodeposited wire saw II, respectively.
In FIG. 1, an electrodeposited wire saw I10 is provided with a superabrasive grain layer 4 having a flat portion 2 and a tapered portion 3 continuously inclined in the axial direction of the core wire ₁ at a pitch P1. It has a structure.
On the other hand, in FIG. 2, an electrodeposited wire saw II 20 has a superabrasive grain layer 14 joined to a peripheral surface of a core wire (not shown), and the superabrasive grain layer 14 is sequentially formed in the axial direction of the core wire. The large-diameter portion A and the small-diameter portion B are provided, and a tapered portion 13 that is continuously inclined to the flat portion 12 of the large-diameter portion A is provided.
The superabrasive layers 4 and 14 may be ones in which abrasive grains are fixed, or may be those in which multiple layers are fixed.

In the electrodeposited wire saws I10 and II20, the outer diameters D ₁ and D ₂ and the lengths L ₁ and L ₂ of the flat portions 2 and 12 in the superabrasive layers 4 and 14 are not particularly limited, and the electrodeposition wire saw is used. The outer diameters D ₁ and D ₂ are usually about 0.04 to 0.5 mm, preferably 0.1 to 0.3 mm, and the lengths L ₁ and L ₂ are Each is usually about 10 to 100 mm, preferably 20 to 80 mm.
Further, the angles θ ₁ and θ ₂ of the taper portions 3 and 13 in the superabrasive layers 4 and 14 are each preferably in the range of 0.01 to 5 degrees, particularly 0.01 to 1 in view of the effect of the present invention. Degree is preferred.
Further, the length P ₁ of the small-diameter portion of the superabrasive grain layer 4 in the electrodeposited wire saw I10 and the length P ₂ of the small-diameter portion B in the electrodeposited wire saw II 20 are not particularly limited, but from the viewpoint of the effect of the present invention. The thickness is usually about 10 to 1000 mm, preferably 100 to 500 mm.
Although there is no restriction | limiting in particular about the outer diameter of the small diameter part B in the electrodeposition wire saw II20, Usually, it is about 0.05-0.6 mm, Preferably it is 0.1-0.3 mm.

The core wire used in the electrodeposited wire saw of the present invention is not particularly limited as long as it can be plated and has strength and elastic modulus that can withstand the tension between the guide rolls. Examples thereof include steel wires such as piano wires, metal wires such as tungsten wires and molybdenum wires. There is no restriction | limiting in particular in the diameter of the core wire used for this invention, Although it can select suitably according to the shape and property of a to-be-processed object, it is preferable that it is normally 0.04-0.5 mm, 0.1- More preferably, it is 0.3 mm.
Examples of the superabrasive grains constituting the superabrasive grain layer include diamond abrasive grains and cBN (cubic boron nitride) abrasive grains conventionally used in electrodeposited wire saws. There is no restriction | limiting in particular about the particle size of this superabrasive grain, Although it can select suitably according to a use, Generally the superabrasive grain of the range of 5-100 micrometers is used. In the present invention, a superabrasive grain having a conductive film made of nickel, titanium, copper or the like can be used. By using superabrasive grains having such a conductive film, the abrasive grain holding power can be improved and a superabrasive grain layer having a multilayer structure can be easily formed.

The plating metal constituting the electrodeposition layer is not particularly limited as long as it can fix superabrasive grains. For example, copper, chromium, nickel, etc. can be used. In particular, nickel is preferable.
In the electrodeposition wire saw of the present invention, it is preferable to provide a base plating layer between the core wire and the electrodeposition layer. By providing such a base plating layer, wear of the core wire can be suppressed. As the base plating layer, a chromium plating layer or a nickel plating layer is preferable. Moreover, although there is no restriction | limiting in particular about the thickness, Usually, about 1-50 micrometers, Preferably it is 5-20 micrometers.
The electrodeposited wire saw of the present invention having such a structure has good chip evacuation, excellent sharpness, chipping of the abrasive layer can be suppressed, and abrasive grains can be prevented from falling off, and the workpiece is processed. An object can be processed with high accuracy.

Next, the manufacturing method of the electrodeposition wire saw of this invention is demonstrated.
In the method of manufacturing an electrodeposited wire saw according to the present invention, when an electrodeposited wire saw is manufactured by forming a superabrasive grain layer by electrodeposition on the peripheral surface of the core wire, the potential of the core wire is changed in the axial direction to A taper is provided in the abrasive layer.
In the plating process and the electrodeposition process, it is generally known that the formation of the plating film and the electrodeposition start from a place where the distance between the electrodes is close. The present invention has been made paying attention to this phenomenon.
FIG. 3 is an explanatory view showing an example of a method for producing an electrodeposited wire saw according to the present invention. In the present invention, for example, as shown in FIG. 3, the inner surface of a cylindrical anode 22 such as Ni in a plating bath 21 is shown. By making the taper shape, it is possible to use a method in which the distance from the core wire 23 arranged substantially at the center of the cylindrical anode 22 is continuously changed to taper the growth of plating. In FIG. 3, reference numerals 24 and 25 are shielding cylinders, and 26 is a superabrasive grain layer having a taper.
As another method, a method of providing a non-conductive shielding cylinder having a plurality of current-carrying holes whose number and area are changed in the axial direction can be used between a cylindrical anode such as Ni and a core wire. .
There are two methods for producing the electrodeposited wire saw of the present invention. The first method is to first form a base plating layer having a taper on the core wire by the method of the present invention, and then to normal electrodeposition. In this method, a superabrasive grain layer in which superabrasive grains are fixed is formed on the underlying plating layer. On the other hand, the second method is a method in which a superabrasive layer having a taper and having superabrasive grains directly fixed thereto is formed by the method of the present invention without providing a base plating layer on the core wire. When the first and second methods are compared, the first method is preferable from the viewpoint of suppressing wear of the core wire.

By using such a method of the present invention, the above-described electrodeposited wire saw I and electrodeposited wire saw II of the present invention can be efficiently produced.
For example, a core wire (cathode) previously degreased as necessary is immersed in a base plating bath such as a nickel plating bath having the above-described function, and the base plating process is performed while moving intermittently. At this time, when the movement is stopped, current is applied to both poles, and the application of the current is stopped during the movement, so that the base plating layer having a taper shape as shown in FIG. Formed. Further, by intermittently moving the core wire while applying the current, a base plating layer having a taper shape as shown in FIG. 2 is formed.
Next, the core wire on which the base plating layer is formed has a taper having the structure shown in FIGS. 1 and 2 by electrodepositing superabrasive grains by a normal method using a plating bath containing abrasive grains. Electrodeposited wire saws I and II can be obtained.

  In addition, a core wire (cathode) that has been degreased in advance is immersed in a plating bath such as a nickel plating bath containing superabrasive grains having the above-described functions, and electrodeposition is performed while intermittently moving. Apply. At this time, the electrodeposition wire saw I having a taper structure shown in FIG. 1 can be obtained by applying a current to both electrodes while the movement is stopped and stopping the application of the current during the movement. Moreover, the electrodeposition wire saw II having a taper having the structure shown in FIG. 2 can be obtained by intermittently moving the core wire while applying the current.

EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by this example.
Example 1
After degreasing a long piano wire with a diameter of 0.1 mm, the distance to reach the piano wire of nickel metal ions is different in the direction of the axis. The material is in contact with the material) and the cathode (piano wire), and the piano wire is moved intermittently, and the piano wire has a flat surface in the axial direction and a tapered portion that is continuously inclined in the axial direction. A base plating layer having a shape as shown in FIG. 2 having a large diameter portion and a small diameter portion in order was formed.
Next, one diamond abrasive grain was fixed in a nickel sulfamate plating bath to which nickel-coated diamond abrasive grains having a particle diameter of 10/20 μm were added, to produce a diamond wire saw having the structure shown in FIG.
In FIG. 2, L ₂ = 100 mm, D ₂ = 0.15 mm, θ ₂ = 0.05 degrees, P ₂ = 400 mm, and d ₂ = 0.12 mm.
Using this diamond wire saw, a ferrule inner surface polishing test was performed by the following method. As a result, 11 ferrules could be internally processed.

  The electrodeposited wire saw of the present invention is excellent in chip evacuation, is less prone to chipping of the edge of the abrasive layer, further improves processing accuracy, precision processing of brittle materials, and inner surface polishing of ferrules For example, it can be suitably used.

It is a partial side view which shows an example of the electrodeposition wire saw of this invention. It is a partial side view which shows another example of the electrodeposition wire saw of this invention. It is explanatory drawing which shows an example of the manufacturing method of the electrodeposition wire saw of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Core wire 2,12 Flat part 3,13 Tapered part 4,14 Superabrasive grain layer 10,20 Electrodeposited wire saw 21 Plating bath 22 Cylindrical anode 23 Core wire 24,25 Shielding cylinder 26 Tapered superabrasive grain layer A Large diameter Part B Small diameter part

Claims (5)

  In an electrodeposited wire saw in which a superabrasive layer is provided by electrodeposition on the peripheral surface of the core wire, the superabrasive layer is continuous with a plurality of flat portions having substantially the same diameter and at least one end of the flat portion, and has a small diameter. An electrodeposited wire saw having a taper portion in the direction to be.   The electrodeposited wire saw according to claim 1, wherein the superabrasive layer has a small-diameter flat portion continuous with the small-diameter end of the tapered portion.   The electrodeposited wire saw according to claim 1 or 2, wherein the superabrasive grains in the superabrasive grain layer have a conductive coating on the surface.   In the method of manufacturing an electrodeposited wire saw in which a superabrasive layer is formed on the peripheral surface of a core wire by electrodeposition, the electric potential of the core wire is changed in the axial direction, and the superabrasive layer is tapered. A method for producing a wire saw.   The manufacturing method according to claim 4, wherein the electrodeposited wire saw is the electrodeposited wire saw according to claim 1 or 2.

Images