JP2005026668A - Apparatus and method for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can detect the state of the substrate with a simple constitution. <P>SOLUTION: In the apparatus for processing the substrate, the substrate W is supported by flat surfaces of four substrate supporting parts PS disposed on the upper surface of a conveying arm bm4. Three ultrasonic distance measuring sensors TS1, TS2 and TS3 are fixed to a fixed base KD installed above the substrate W. The three ultrasonic distance measuring sensors TS1, TS2 and TS3 are disposed so that a distance to the upper surface of the substrate W near the outer periphery of the substrate W can be measured. In this case, the ultrasonic distance measuring sensors TS1, TS2 and TS3 are disposed so that measured values of the ultrasonic distance measuring sensors TS1, TS2 and TS3 become equal in the state that the substrate W is supported normally. The ultrasonic distance measuring sensors TS1, TS2 and TS3 respectively measure distances to the upper surface of the substrate W, and give the measured values to a controller CL. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate.

  A substrate processing apparatus is used to perform various processes on a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a glass substrate for an optical disk, and the like. For example, in a semiconductor device manufacturing process, a substrate processing apparatus is used in which a series of processes are unitized and a plurality of processing units are integrated in order to increase production efficiency.

  In such a substrate processing apparatus, generally, a plurality of different processes are continuously performed on a single substrate. Therefore, a substrate transport robot that transports the substrate between the processing units is provided.

  FIG. 22 is a perspective view showing an example of a conventional substrate processing apparatus 500 (see Patent Document 1).

  A substrate processing apparatus 500 in FIG. 22 is an apparatus for performing a series of processing such as coating processing, development processing, heating processing, cooling processing, and the like on the substrate W, and has a processing region A on the lower side in the paper surface of FIG. The processing area B is provided on the upper side, and the conveyance area C is provided between the processing area A and the processing area B.

  In the processing area A, a rotary coating unit (spin coater) SC for applying a processing liquid to the substrate W and a rotary developing unit (spin developer) SD for developing the substrate W are arranged. In the processing region B, a heating unit (hot plate) HP that performs heat treatment on the substrate W and a cooling unit (cooling plate) CP that performs cooling processing on the substrate W are arranged. In the transfer area C, a substrate transfer robot 60 is movably provided. Further, an indexer ID for carrying in and out the substrate is arranged on one end side of the processing areas A and B.

  The indexer ID is provided with an indexer robot 51 that transfers the substrate W between the plurality of cassettes 1 that store the substrate W and the substrate transfer robot 60 provided in the transfer area C. The delivery of the substrate W between the substrate transport robot 60 and the indexer robot 51 is performed by the delivery unit TP.

  In other words, the indexer robot 51 with the indexer ID moves in the direction of the arrow U, takes out the substrate W from the cassette 1 and passes it to the substrate transport robot 60 at the transfer unit TP. It is received from the substrate transfer robot 60 at the transfer unit TP and returned to the cassette 1.

  The substrate transfer robot 60 has a transfer arm 61 and transfers the substrate W delivered from the indexer robot 51 to a designated processing unit, or receives the substrate W received from the processing unit to another processing unit or the indexer robot 51. Transport.

Thus, in the conventional substrate processing apparatus 500, a series of processes can be performed while the substrate transport robot 60 and the indexer robot 51 transport the substrate W to each processing unit.
JP 2000-82653 A

  However, in recent years, with the increase in size of substrates, the processing units and substrate transfer apparatuses are also increasing in size. Further, as the size of the substrate increases, the production cost per substrate increases, and if the substrate is dropped or damaged due to a conveyance failure, the cost increases.

  For example, in the conventional substrate processing apparatus 500, when the substrate W is placed on the transfer arm without being supported by some of the support pins provided on the transfer arm, the substrate W is inclined. It is carried into each processing unit in the posture. In this case, defective holding of the substrate occurs in each processing unit, and an unprocessed portion of the substrate W is generated or the substrate W is damaged.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of detecting the state of a substrate with a simple configuration.

  A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus that processes a substrate, a plurality of processing units that perform processing on the substrate, a delivery position for delivering the substrate, a delivery position, and a predetermined position. A first conveying means for supporting and conveying the substrate between, a second conveying means for supporting and conveying the substrate between the delivery position and any of the plurality of processing units, and a delivery position, Detecting means for detecting an inclined state of the substrate supported by the first or second transport means with respect to a horizontal plane.

  In the substrate processing apparatus according to the present invention, the substrate is processed by a plurality of processing units. The substrate is supported and transported by the first transport means between the delivery position and the predetermined position. Further, the substrate is supported and transported between the delivery position and one of the plurality of processing units by the second transport unit. Further, at the delivery position, the detection unit detects the inclined state of the substrate supported by the first or second transport unit with respect to the horizontal plane.

  In this way, it is possible to detect the inclined state of the substrate with respect to the horizontal plane with a simple configuration at the substrate transfer position between the first transfer unit and the second transfer unit. Thereby, it is possible to prevent generation of unprocessed portions of the substrate and damage of the substrate in each processing unit.

  The detecting means may detect whether the substrate is tilted as the tilted state of the substrate supported by the first or second transport means.

  In this case, it is possible to determine an abnormality in the tilted state of the substrate. Accordingly, when the substrate state is abnormal, it is possible to perform abnormality warning, stop processing, or correct the posture (tilt state) of the substrate.

  The detection means may detect the direction of inclination of the substrate as the inclination state of the substrate supported by the first or second transport means.

  As a result, the posture of the substrate can be corrected based on the direction of inclination of the substrate. Alternatively, the response method at the time of abnormality can be changed based on the direction of inclination of the substrate.

  The detection means may detect the inclination angle of the substrate as the inclination state of the substrate supported by the first or second transport means.

  Thereby, the posture of the substrate can be corrected based on the angle of inclination of the substrate. Alternatively, the response method at the time of abnormality can be changed based on the angle of inclination of the substrate.

  A determination unit that determines that the tilt state of the substrate is abnormal when the angle detected by the detection unit is greater than or equal to a predetermined value may be further provided.

  In this case, when the substrate is tilted abnormally, it is possible to warn of the abnormality, stop the processing, or correct the posture of the substrate.

  The detection means may detect the tilt state of the substrate supported by the first or second transport means by measuring the distance to the surface of the substrate.

  In this case, the inclination state of the substrate supported by the first or second transport unit is accurately detected by measuring the distance to the surface of the substrate by the detection unit.

  The detection means may include an ultrasonic distance measuring sensor that measures a distance to the surface of the substrate. In this case, the ultrasonic wave transmitted from the ultrasonic distance measuring sensor is reflected on the surface of the substrate, and the reflected wave is received by the ultrasonic distance measuring sensor, whereby the distance to the surface of the substrate is measured. .

  Here, the ultrasonic waves are reflected on the surface of the object regardless of whether the object is transparent or opaque. Therefore, according to the ultrasonic distance measuring sensor, the distance to the surface of the substrate can be accurately measured regardless of whether the substrate is transparent or opaque. Accordingly, it is possible to accurately detect the tilt state of the substrate with respect to the horizontal plane based on the distance to the surface of the substrate.

  The detecting means may include a laser type distance measuring sensor that measures a distance to the surface of the substrate. In this case, the laser light emitted from the laser type distance measuring sensor is reflected on the surface of the substrate, and the reflected light is received by the laser type distance measuring sensor, whereby the distance to the surface of the substrate is measured.

  Here, the laser distance measuring sensor can measure the distance to the object with high resolution. Therefore, according to the laser type distance measuring sensor, the distance to the surface of the substrate can be accurately measured. Accordingly, it is possible to accurately detect the tilt state of the substrate with respect to the horizontal plane based on the distance to the surface of the substrate.

  The detection means may include a microwave distance measuring sensor that measures a distance to the surface of the substrate. In this case, the microwave transmitted from the microwave distance measuring sensor is reflected on the surface of the substrate, and the reflected wave is received by the microwave distance measuring sensor, whereby the distance to the surface of the substrate is measured. .

  Here, the microwave is reflected on the surface of the object regardless of whether the object is transparent or opaque. Therefore, according to the microwave distance measuring sensor, the distance to the surface of the substrate can be accurately measured regardless of whether the substrate is transparent or opaque. Accordingly, it is possible to accurately detect the tilt state of the substrate with respect to the horizontal plane based on the distance to the surface of the substrate.

  The detection means calculates the spatial coordinates of at least three measurement points by measuring the distance to at least three measurement points on the surface of the substrate, and detects the tilt state of the substrate based on the calculated spatial coordinates. Good.

  In this case, distances to at least three measurement points on the surface of the substrate are measured, and spatial coordinates of at least three measurement points are calculated. Then, the tilt state of the substrate is detected based on the spatial coordinates of at least three measurement points. Thereby, it becomes possible to detect the inclination state of the substrate with respect to the horizontal plane more accurately.

  The detecting means measures in advance the distance to the surface of the substrate substantially horizontally supported by the first or second conveying means as a reference value and then reaches the surface of the substrate supported by the first or second conveying means. A distance measurement sensor that measures the distance of the substrate as a measurement value, and a determination unit that determines a tilt state of the substrate based on a difference between a reference value obtained by the distance measurement sensor and a measurement value obtained by the distance measurement sensor. But you can.

  In this case, the distance to the surface of the substrate supported by the first or second transport means is measured after the distance to the surface of the substrate supported substantially horizontally is measured in advance by the distance measuring sensor as a reference value. As measured by the distance measuring sensor, and the tilt state of the substrate is determined based on the difference between the reference value and the measured value. Therefore, it is possible to determine the tilt state of the substrate more accurately regardless of the positioning accuracy of the distance measuring sensor.

  The detection means may include three or more distance measuring sensors that measure the distance to the surface of the substrate.

  In this case, the distance to at least three points on the surface of the substrate can be measured by three or more distance measuring sensors. Accordingly, it is possible to accurately detect the presence / absence of the substrate tilt, the direction of the substrate tilt, and the angle of the substrate tilt.

  The detection means may include a distance measurement sensor that measures the distance to the surface of the substrate, and a moving means that moves the distance measurement sensor relative to the substrate.

  In this case, the distance to the surface of the substrate can be measured at any one or a plurality of positions on the substrate by moving the distance measuring sensor by the moving means. For example, by measuring the distance to the surface of the substrate at at least three positions of the substrate, it is possible to accurately detect the presence / absence of the substrate tilt, the direction of the substrate tilt, and the angle of the substrate tilt. .

  And a light projecting unit that projects light of a predetermined width in a direction along the surface of the substrate from one end side to the other end side of the substrate supported by the first or second transport unit at the delivery position. And a light receiving portion that receives the light projected by the light projecting portion on the other end side, and the inclination of the substrate supported by the first or second transport means based on the width of the light received by the light receiving portion A state may be detected.

  In this case, a part of the light projected by the light projecting unit is blocked by the substrate. Since the width of the light to be blocked differs depending on the tilt state of the substrate, the tilt state of the substrate can be detected based on the width of the light received by the light receiving unit.

  You may further provide the correction means which corrects the inclination state of the board | substrate supported by the 1st or 2nd conveyance means based on the inclination state of the board | substrate detected by the detection means.

  In this case, since the tilted state of the substrate is corrected, it is possible to continue processing the substrate.

  The correction means corrects the tilt state of the substrate supported by the first or second transport means by bringing the contact member and the substrate supported by the first or second transport means into contact with the contact member. And a control means for performing.

  In this case, the inclined state of the substrate can be easily corrected by bringing the substrate supported by the first or second transport means into contact with the contact member. In order to bring the substrate into contact with the contact member, for example, the substrate may be moved in the direction of the contact member by the first or second conveying means, or the contact member may be moved in the first or second direction. You may move to the direction of the board | substrate hold | maintained at the 2 conveyance means.

  A substrate processing method according to a second invention includes a step of processing a substrate in each of a plurality of processing units, and a step of supporting and transporting the substrate by a first transport means between a delivery position and a predetermined position. A step of supporting and transporting the substrate by the second transport unit between the transfer position and any of the plurality of processing units, and a horizontal plane of the substrate supported by the first or second transport unit at the transfer position And a step of detecting an inclined state.

  In the substrate processing method according to the present invention, the substrate is processed by a plurality of processing units. The substrate is supported and transported by the first transport means between the delivery position and the predetermined position. Further, the substrate is supported and transported between the delivery position and one of the plurality of processing units by the second transport unit. Further, at the delivery position, an inclination state of the substrate supported by the first or second transport means with respect to the horizontal plane is detected.

  In this way, it is possible to detect the inclined state of the substrate with respect to the horizontal plane with a simple configuration at the substrate transfer position between the first transfer unit and the second transfer unit. Thereby, it is possible to prevent generation of unprocessed portions of the substrate and damage of the substrate in each processing unit.

  According to the present invention, it is possible to detect the tilt state of the substrate with respect to the horizontal plane with a simple configuration at the substrate transfer position. Thereby, it is possible to prevent generation of unprocessed portions of the substrate and damage of the substrate in each processing unit.

  Hereinafter, the configuration of a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view of a substrate processing apparatus 100 according to an embodiment of the present invention. In addition, in each figure after FIG. 1, in order to clarify a positional relationship, the XYZ rectangular coordinate system is attached | subjected. In each axis, the direction in which the arrow heads is the + direction, and the opposite direction is the − direction. In addition, regarding the Z axis in FIGS. 1 to 3, 8, and 10, the direction perpendicular to the paper and toward the front is the + Z direction, and the direction perpendicular to the paper and toward the back is the −Z direction. In addition, with respect to the Y axis in FIG. 4, the direction perpendicular to the paper surface and facing forward is defined as the -Y direction, and the direction perpendicular to the paper surface and directed toward the back is defined as the + Y direction.

  A substrate processing apparatus 100 in FIG. 1 is a single-wafer type cleaning unit MP1, MP2, MP3, MP4 (hereinafter abbreviated as MP1 to MP4), which is a processing unit for cleaning a substrate W, and an indexer as a substrate transfer apparatus. A robot IR, a substrate transfer robot CR, a cassette 1 and a controller CL are included.

  As shown in FIG. 1, the substrate processing apparatus 100 has processing areas A and B, and a transfer area C between the processing areas A and B.

  In the processing area A, cleaning units MP2 and MP4 are arranged. In the processing area B, cleaning units MP1 and MP3 are also arranged.

  In the transfer area C, a substrate transfer robot CR is rotatably provided. In addition, a transfer unit TP is provided between the transfer area C and the indexer ID, and the transfer of the substrate W is performed between the indexer robot IR and the substrate transfer robot CR in the transfer unit TP. The delivery unit TP is provided with a plurality of ultrasonic distance measuring sensors (ultrasonic measuring sensors) TS1, TS2, TS3, which will be described later, and a plurality of positioning pins T1, T2, T3, T4. Yes.

  The indexer robot IR provided in the indexer ID moves in the ± Y direction, takes out the substrate W from the cassette 1 and passes it to the substrate transfer robot CR. Conversely, the substrate W subjected to a series of processes is transferred from the substrate transfer robot CR. Receive and return to cassette 1.

  The substrate transport robot CR transports the substrate W passed from the indexer robot IR to the designated cleaning units MP1 to MP4, or receives the substrate W received from the cleaning units MP1 to MP4 to the other cleaning units MP1 to MP4 or the indexer robot. Transport to IR.

  The controller CL includes a computer including a CPU (central processing unit), and operates the cleaning units MP1 to MP4 in the transfer areas A and B, the operation of the substrate transfer robot CR in the transfer area C, and the indexer robot with the indexer ID. Control IR operation.

  FIG. 2 is a plan view showing configurations of the indexer robot IR and the substrate transfer robot CR in the substrate processing apparatus 100 of FIG. 2A shows the configuration of the articulated arm of the indexer robot IR, FIG. 2B shows the configuration of the articulated arm of the substrate transfer robot CR, and FIG. 2C shows the configuration of the substrate support part PS. Show. 2A and 2B, the clockwise direction on the paper is defined as + θ direction, and the counterclockwise direction on the paper is defined as −θ direction.

  As shown in FIG. 2A, the indexer robot IR includes a pair of transfer arms am4 and cm4 for holding the substrate W, and the pair of transfer arms am4 and cm4 that are independent of the indexer robot body IRH. Forward / backward drive mechanisms am1, am2, am3 and cm1, cm2, cm3 for moving forward and backward, a rotational drive mechanism (not shown) for rotationally driving the indexer robot body IRH in the ± θ direction of the vertical axis, and an indexer robot An elevating drive mechanism (not shown) for raising and lowering the main body IRH in the ± Z direction and a ± Y direction moving mechanism (not shown) for moving the indexer robot main body IRH in the ± Y direction are provided.

  The advance / retreat drive mechanisms am1, am2, am3 and cm1, cm2, cm3 are multi-joint arm types, and can advance and retract them horizontally while maintaining the posture of the pair of transfer arms am4, cm4. One transfer arm am4 is advanced and retracted above the other transfer arm cm4. In an initial state in which both the pair of transfer arms am4 and cm4 are retracted above the indexer robot body IRH, The transport arms am4 and cm4 overlap each other vertically.

  The indexer robot main body IRH drives the advance / retreat drive mechanisms am1, am2, am3 and cm1, cm2, cm3 in accordance with the instructions of the controller CL described above. The forward / backward drive mechanisms am1, am2, am3 and cm1, cm2, cm3 have a drive device including a motor, a wire, a pulley, and the like for reciprocating the pair of transport arms am4, cm4. With such a mechanism, the pair of transfer arms am4 and cm4 can be reciprocated in the ± X directions by being directly applied with a driving force.

  Thereby, the transfer arms am4 and cm4 of the indexer robot IR can move in the ± Z direction while supporting the substrate W, and can rotate and extend and contract in the ± θ direction.

  In addition, a plurality of substrate support portions PS to be described later are attached to the upper surface of the transfer arms am4, cm4. In the present embodiment, four substrate support portions PS are attached substantially evenly along the outer periphery of the substrate W placed on the upper surface of the transfer arms am4, cm4. The substrate W is supported by the four substrate support portions PS.

  Note that the number of substrate support parts PS is not limited to four as long as the number can stably support the substrate W.

  Next, as shown in FIG. 2B, the substrate transfer robot CR includes a pair of transfer arms bm4 and dm4 for holding the substrate W, and the pair of transfer arms bm4 and dm4. Forward / backward drive mechanisms bm1, bm2, bm3 and dm1, dm2, dm3 for independently moving forward and backward, and a rotary drive mechanism (not shown) for rotationally driving the substrate transport robot body CRH in the ± θ direction of the vertical axis. And an elevating drive mechanism (not shown) for elevating the substrate transfer robot main body CRH in the ± Z directions.

  The advance / retreat drive mechanisms bm1, bm2, bm3 and dm1, dm2, dm3 are multi-joint arm types, and can advance and retreat them in the horizontal direction while maintaining the posture of the pair of transfer arms bm4, dm4. One transfer arm bm4 is advanced and retracted above the other transfer arm dm4, and in an initial state where both the pair of transfer arms bm4 and dm4 are retracted above the substrate transfer robot body CRH, These transfer arms bm4 and dm4 overlap one above the other.

  The substrate transfer robot main body CRH drives the advance / retreat drive mechanisms bm1, bm2, bm3 and dm1, dm2, dm3 in accordance with the instruction of the controller CL described above. The advance / retreat drive mechanisms bm1, bm2, bm3 and dm1, dm2, dm3 have a drive device including a motor, a wire, a pulley, and the like for reciprocating the pair of transport arms bm4, dm4. With such a mechanism, the pair of transfer arms bm4 and dm4 can be reciprocated in the ± X directions by being directly applied with a driving force.

  Accordingly, the transfer arms bm4 and dm4 of the substrate transfer robot CR can move in the ± Z direction while supporting the substrate W, can be rotated in the ± θ direction, and can be expanded and contracted.

  In addition, a plurality of substrate support portions PS described later are attached to the upper surfaces of the transfer arms bm4 and dm4 of the substrate transfer robot CR. In the present embodiment, four substrate support portions PS are attached almost evenly along the outer periphery of the substrate W placed on the upper surfaces of the transfer arms bm4, dm4. The substrate W is supported by the four substrate support portions PS.

  Note that the number of substrate support parts PS is not limited to four as long as the number can stably support the substrate W.

  In the present embodiment, since the indexer robot IR and the substrate transfer robot CR are of the double arm type having a pair of transfer arms am4, cm4 and bm4, dm4, respectively, the substrate W processed by one transfer arm am4, bm4. And the unprocessed substrate W is transferred by the other transfer arm cm4, dm4. Thereby, it is possible to prevent the particles adhering to the unprocessed substrate W from being transferred to the processed substrate W. In addition, since the processed substrate W is held by the upper transfer arms am4 and bm4, particles dropped from the unprocessed substrate W do not reattach to the processed substrate W.

  In the above embodiment, an example has been described in which both the indexer robot IR and the substrate transfer robot CR are of the double arm type having a pair of transfer arms am4, cm4 and bm4, dm4, respectively. Either one or both of the robot IR and the substrate transfer robot CR may be a single arm type having only one transfer arm.

  In the following explanation, only one transfer arm am4 of the indexer robot IR and one transfer arm bm4 of the substrate transfer robot CR out of the pair of transfer arms am4, cm4 and bm4, dm4 of the indexer robot IR and the substrate transfer robot CR. Will be described with reference to FIG.

  Next, as shown in FIG. 2C, the substrate support part PS is composed of a substrate support stand PSD having a plane PS1, PS2, PS3, PS4 and a substrate support bar PSB.

  The planes PS1 and PS3 of the substrate support base PSD are formed in parallel to the horizontal XY plane, and the planes PS2 and PS4 are formed to be inclined at a predetermined angle from the XY plane. Note that the plane PS2 has a steeper slope than the plane PS4. Further, when the horizontal plane PS3 is formed sufficiently wide in the direction toward the plane PS4, the inclined plane P4 does not need to be provided.

  By arranging the plurality of substrate support portions PS on the upper surfaces of the transfer arms am4 and bm4 so that the planes PS2 and PS4 face the center of the substrate W, a taper shape is formed by the plurality of planes PS2 and PS4. The normal support state of the substrate W is a state in which the lower surface of the substrate W is supported by the plane PS3 of the plurality of substrate support parts PS.

  When the peripheral edge on one side of the substrate W is supported by the plane PS2 of one substrate support part PS, and the peripheral edge on the other side of the substrate W is supported by the plane PS3 or the plane PS4 of another substrate support part PS. The periphery of the substrate W can be easily moved on the plane PS3 by the tapered shape of the plane PS2.

  Next, operations of the indexer robot IR and the substrate transfer robot CR will be described.

  FIG. 3 is a plan view for explaining the transfer operation of the substrate W in the transfer unit TP of the indexer robot IR and the substrate transfer robot CR, and FIG. 4 is a substrate in the transfer unit TP of the indexer robot IR and the substrate transfer robot CR. It is a side view for demonstrating the delivery operation | movement of W.

  3A and 4A show a state where the substrate W is supported by the indexer robot IR, and FIGS. 3B and 4B show the substrate W from the indexer robot IR to the substrate transfer robot CR. FIG. 3C and FIG. 4C show a state in which the substrate W is supported by the substrate transport robot CR. The ultrasonic distance measuring sensors TS1, TS2, TS3, the fixing base KD and the positioning pins T1, T2, T3, T4 shown in FIG. 4 will be described later.

  First, as shown in FIGS. 3A and 4A, the indexer robot IR supports the substrate W by the substrate support part PS of the transport arm am4.

  As shown in FIG. 4A, a peripheral wall WL having an opening is formed between the indexer robot IR and the transfer portion TP. A shutter SH is provided at the opening of the peripheral wall WL so as to be freely opened and closed. The shutter SH is opened and closed by the cylinder SL based on an instruction from the controller CL.

  As shown in FIG. 4A, the transfer arm bm4 of the substrate transfer robot CR before receiving the substrate W is positioned relatively downward with respect to the transfer arm am4 of the indexer robot IR.

  As shown in FIG. 4B, the controller CL opens the shutter SH by the cylinder SL. Subsequently, the indexer robot IR advances the transfer arm am4 that supports the substrate W to the transfer unit TP. As indicated by the dotted line, the substrate transfer robot CR causes the transfer arm bm4 to enter the transfer section TP through the opening of the peripheral wall WL.

  Subsequently, the substrate transfer robot CR moves the transfer arm bm4 upward. Thereby, the substrate W supported by the transport arm am4 of the indexer robot IR is supported by the transport arm bm4 of the substrate transport robot CR. At this time, as shown in a plan view in FIG. 3B, in the transfer section TP, the transfer arm am4 of the indexer robot IR and the transfer arm bm4 of the substrate transfer robot CR are in a plane position where their shapes do not interfere with each other. Therefore, even if the transport arm bm4 and the transport arm am4 move up and down relatively, they do not interfere with each other.

  In this case, the substrate W is supported by the four substrate support portions PS provided on the upper surface of the transport arm bm4. The transport arm am4 of the indexer robot IR moves backward from the transfer unit TP.

  Next, the posture of the substrate W supported by the transport arm bm4 of the substrate transport robot CR is detected by the ultrasonic distance measuring sensors TS1, TS2, TS3 and the control unit CL. In accordance with the detection result of the posture of the substrate W by the ultrasonic distance measuring sensors TS1, TS2, TS3, the control unit CL instructs the operation of the substrate transport robot CR. The substrate transport robot CR corrects the posture of the substrate W by the positioning pins T1 to T4 based on an instruction from the controller CL. A method for detecting the posture of the substrate W by the ultrasonic distance measuring sensors TS1, TS2, and TS3 and a method for correcting the posture of the substrate W by the positioning pins T1 to T4 will be described later.

  Subsequently, when it is determined that the detection result of the posture of the substrate W is good, the substrate transfer robot CR supports the transfer arm that supports the substrate W, as shown in FIGS. 3C and 4C. bm4 is retracted from the delivery unit TP. Thereafter, the controller CL closes the shutter SH with the cylinder SL.

  Next, detection of the posture of the substrate W by the ultrasonic distance measuring sensors TS1, TS2, TS3 and correction of the posture of the substrate W by the positioning pins T1 to T4 will be described.

  FIG. 5 or FIG. 6 is a perspective view showing a method for detecting the posture of the substrate W using the ultrasonic distance measuring sensors TS1, TS2, TS3, and FIG. 5 shows that the substrate W is normally supported by the transfer arm bm4. FIG. 6 shows a case where the substrate W is supported on the transport arm bm4 in an inclined posture.

  Here, the ultrasonic distance measuring sensor transmits ultrasonic waves to the object, receives the ultrasonic waves reflected by the object, and measures the time from transmission to reception of the ultrasonic waves to measure the distance to the object. Measure. According to the ultrasonic distance measuring sensor, not only an opaque body but also a distance to an object made of a transparent body can be accurately measured. Therefore, unlike the optical length sensor or the like, the ultrasonic distance measuring sensor can accurately measure the distance to the upper surface of the substrate W regardless of whether the substrate is translucent or not.

  In FIG. 5, the substrate W is normally supported by the plane PS3 of the four substrate support portions PS disposed on the upper surface of the transport arm bm4. In this case, the measured values (D1, D2, D3) of the ultrasonic distance measuring sensors TS1, TS2, TS3 are all within a predetermined allowable range. Thereby, the control unit CL determines that the substrate W is normally supported.

  Further, the three ultrasonic distance measuring sensors TS1, TS2, TS3 are fixed to a fixing table KD installed above the substrate W. The three ultrasonic distance measuring sensors TS1, TS2, TS3 are arranged so as to measure the distance to the upper surface of the substrate W in the vicinity of the outer peripheral portion of the substrate W. In this case, the ultrasonic distance measuring sensors TS1, TS2, TS3 so that the measured values D1, D2, D3 of the ultrasonic distance measuring sensors TS1, TS2, TS3 are equal in a state where the substrate W is normally supported. Is positioned.

  The ultrasonic distance measuring sensors TS1, TS2, TS3 each measure the distance to the upper surface of the substrate W, and give the measured values D1, D2, D3 to the controller CL.

  The control unit CL determines the tilt direction and tilt of the substrate W based on the measurement value D1 of the ultrasonic distance measurement sensor TS1, the measurement value D2 of the ultrasonic distance measurement sensor TS2, and the measurement value D3 of the ultrasonic distance measurement sensor TS3. Calculate the angle.

  Here, FIG. 7 is an explanatory diagram of a method of calculating the tilt direction and tilt angle of the substrate W.

  First, a vector obtained by projecting an upward normal vector A1 on the surface of the substrate W vertically downward with respect to the surface of the substrate W is set as an inclination vector V of the substrate W. The tilt direction H of the substrate W is a vector direction formed by projecting the tilt vector V onto the XY plane (horizontal plane W ′), and the tilt angle θ1 of the substrate W is the tilt vector V and the XY plane. It is an angle formed with (horizontal plane W ′). Then, spatial coordinates of three measurement points on the surface of the substrate W measured by the ultrasonic distance measuring sensors TS1, TS2, TS3 (hereinafter referred to as measurement coordinates. X and Y coordinates are known, and Z coordinates are measured values D1 to D3. Each of these values is obtained, and a plane equation including the surface of the substrate W is derived from these three measurement coordinates. From the plane equation, the normal vector A1, the inclination vector V, the inclination direction H, and the inclination angle θ1 of the substrate W are calculated.

  Next, the controller CL determines whether or not the calculated tilt angle θ1 of the substrate W is within a predetermined allowable range (for example, the tilt angle θ1 of the substrate W with respect to the horizontal is less than 1 degree), and the predetermined allowable If it is within the range, it is determined that the substrate W is normally supported by the transfer arm bm4, and if the inclination angle θ1 is outside the predetermined allowable range (for example, 1 degree or more), the substrate W is transferred in an inclined posture. It is determined that the arm bm4 is supported.

  Here, as shown in FIG. 5, the respective distances (reference values DR1, DR2, DR3) to the upper surface of the substrate W that is normally (substantially horizontally) supported by the transfer arm bm4 are measured in advance. The respective measured distances (measured values D1, D2, D3) to the upper surface are measured, and the difference between the reference value and the measured distance (difference distances DR1-D1, DR2-D2, DR3-D3) is calculated, and these differences are calculated. The tilt posture of the substrate W may be determined based on the distances DR1-D1, DR2-D2, DR3-D3. In this way, it is not necessary to precisely position the ultrasonic distance measuring sensors TS1, TS2, TS3 with respect to the vertical position as in the above embodiment. For this reason, it is possible to determine the posture of the substrate W more accurately regardless of the mounting position accuracy of the ultrasonic distance measuring sensors TS1, TS2, TS3.

  On the other hand, in FIG. 6, the substrate W is supported by the plane PS1 and the inclined plane PS4 of the four substrate support portions PS arranged on the upper surface of the transport arm bm4 (see FIGS. 2B and 2C). ). In this case, the calculated inclination angle θ1 of the substrate W is set to be outside a predetermined allowable range.

  Next, the operation of the transfer arm bm4 of the substrate transfer robot CR when the control unit CL determines that the substrate W is supported in an inclined posture will be described.

  FIG. 8 is a perspective view showing a method of correcting the tilt posture of the substrate W, and FIG. 9 is a plan view showing a process of correcting the tilt posture of the substrate W.

  9A shows an example in which the substrate W is supported in an inclined posture, FIG. 9B shows an example in which the inclined posture of the substrate W in FIG. 9A is corrected, and FIG. Another example in which the substrate W is supported in an inclined posture is shown, and FIG. 9D shows another example in which the inclined posture of the substrate W in FIG. 9C is corrected.

  First, when it is determined by the controller CL that the substrate W is supported in an inclined posture, as shown in FIG. 8, the substrate transport robot CR places the transport arm bm4 supporting the substrate W in the delivery unit TP. The positioning pins T1 to T4 which are erected are translated downward to a position lower than the upper end portions.

  Next, in FIG. 9A, the peripheral edge on the front side (−X direction) of the substrate W is on the plane PS1 of the two substrate support portions PS provided at the tips of the transfer arm bm4. The peripheral edge on the rear side (+ X direction) is on the upper surface of the transfer arm bm4. In such a case, the controller CL obtains the inclination vector V of the substrate W from the measurement values D1 to D3 given from the ultrasonic distance measuring sensors TS1, TS2, TS3, and further, the inclination direction H (in this case, the + X direction). , And it is determined that the front side is inclined high and the rear side is inclined low with the substrate W shifted to the front side.

  In this case, the control unit CL instructs the substrate transport robot CR to correct the substrate posture by bringing the front peripheral edge of the substrate W in the tilted posture from the tilt direction H into contact with the two positioning pins T1 and T3. That is, the controller CL moves the transport arm bm4 holding the substrate W in the direction (−X direction) opposite to the inclination direction H (+ X direction) of the substrate W, and moves the transport arm bm4 to the positioning pins T1 and T3. Move closer.

  In this case, as shown in FIG. 9B, the front peripheral edge of the substrate W supported on the front end side of the transport arm bm4 abuts on the positioning pins T1 and T3. As a result, the peripheral edge on the front side of the substrate W moves from the plane PS1 of the substrate support part PS to the plane PS3, and the peripheral edge on the rear side of the substrate W moves to the plane PS3 via the plane PS4 inclined from the upper surface of the transfer arm bm4. To do. As a result, the inclined posture of the substrate W is corrected horizontally.

  On the other hand, in FIG. 9C, the peripheral edge on the front side (−X direction) of the substrate W is on the upper surface of the transfer arm bm4, and the peripheral edge on the rear side (+ X direction) of the substrate W is on the rear end of the transfer arm bm4. It is on the plane PS1 of the two substrate support portions PS provided. In this case, the controller CL obtains the inclination vector V of the substrate W from the measurement values D1 to D3 given from the ultrasonic distance measuring sensors TS1, TS2, TS3, and further, the inclination direction H (in this case, just the −X direction). , And it is determined that the front side is low and the rear side is inclined high with the substrate W shifted to the rear side.

  In this case, the controller CL causes the substrate transport robot CR to correct the posture of the substrate W by bringing the peripheral edge on the rear side of the substrate W in the tilted posture from the tilt direction H into contact with the two positioning pins T2 and T4. Instruct. That is, the controller CL moves the transport arm bm4 holding the substrate W in the direction (+ X direction) opposite to the inclination direction H (−X direction) of the substrate W, and moves the transport arm bm4 to the positioning pins T2 and T4. Move closer.

  In this case, as shown in FIG. 9D, the rear peripheral edge of the substrate W supported on the rear end side of the transport arm bm4 contacts the positioning pins T2 and T4. As a result, the peripheral edge on the front side of the substrate W moves from the upper surface of the transfer arm bm4 to the flat surface PS3 via the flat surface PS4 of the substrate support part PS, and the peripheral edge on the rear side of the substrate W is flat from the flat surface PS1 of the substrate support part PS. Move to PS3. As a result, the inclined posture of the substrate W is corrected horizontally.

  Subsequently, the substrate transport robot CR raises the transport arm bm4 upward and detects the posture of the substrate W again using the ultrasonic distance measuring sensors TS1, TS2, TS3. The controller CL calculates the tilt angle θ1 of the substrate W based on the measured values D1 to D3 by the ultrasonic distance measuring sensors TS1, TS2, TS3, determines whether the substrate W is in the tilted posture, If it is determined that the posture is determined, the operation shown in FIGS. 8 and 9 is again instructed to the substrate transport robot CR.

  On the other hand, when it is determined that the substrate W is not in the inclined posture, the control unit CL instructs the substrate transport robot CR to carry the substrate W into each of the cleaning units MP1 to MP4 in FIG.

  As described above, in the substrate processing apparatus 100 according to the present embodiment, the distance to the upper surface of the substrate W can be accurately measured using the ultrasonic distance measuring sensors TS1, TS2, TS3. And the control part CL can determine the inclination attitude | position of the board | substrate W correctly and easily based on the measured values D1-D3 given from ultrasonic distance measuring sensor TS1, TS2, TS3.

  In addition, the control unit CL of the substrate processing apparatus 100 first determines whether or not the holding of the substrate W is defective based on the tilt angle θ1 of the substrate W, and if so, the tilting direction H of the substrate W is determined. Based on the above, the inclined posture of the substrate W can be easily corrected by bringing the inclined substrate W into contact with the positioning pins T1 to T4 by an optimum method. As a result, it is possible to prevent the substrate W from being dropped or damaged and the occurrence of an unprocessed portion of the substrate W. As a result, an increase in cost can be suppressed.

  FIG. 10 is a perspective view showing another example of a method for detecting the posture of the substrate W by the ultrasonic distance measuring sensor TSR.

  As shown in FIG. 10, the motor M is fixed above the transfer portion TP, and a fixed rotating plate KB is attached to the rotating shaft of the motor M. An ultrasonic distance measuring sensor TSR is attached in the vicinity of the outer peripheral portion of the fixed rotating plate KB. When the rotation axis of the motor M rotates in the ± θ direction (rotation direction about the vertical axis Z), the fixed rotation plate KB rotates, and the ultrasonic distance measuring sensor TSR attached to the fixed rotation plate KB It rotates and moves above the vicinity of the outer periphery of the substrate W.

  In this case, when the ultrasonic distance measuring sensor TSR is rotating over the vicinity of the outer peripheral portion of the substrate W, the control unit CL (for example, the ultrasonic distance measuring sensor TSR is in the + θ direction). The ultrasonic distance measuring sensor TSR is instructed to measure three or more distances to the upper surface of the substrate W in the vicinity of the outer peripheral portion of the substrate W (every 30 degrees). The ultrasonic distance measuring sensor TSR measures three or more distances to the upper surface of the substrate W in accordance with an instruction from the controller CL.

  Further, the control unit CL can measure the distance to the upper surface of the substrate W at an arbitrary plurality of positions on the outer peripheral portion of the substrate W. As a result, the controller CL can more accurately determine the tilt direction H and the tilt angle θ1. Therefore, the control unit CL can more optimally determine whether the substrate W is tilted or correct the tilted posture of the substrate W using the positioning pins T1 to T4.

  Furthermore, in this case, since it is not necessary to arrange a plurality of ultrasonic distance measuring sensors, the number of parts and the number of assembly steps can be reduced, and the overall cost can be reduced.

  In the present embodiment, the cleaning units MP1 to MP4 correspond to a plurality of processing units, the transfer unit TP corresponds to a transfer position, the ultrasonic distance measuring sensors TS1, TS2, TS3 correspond to detection means, and the indexer The robot IR, the transfer arm am4 and the substrate support part PS correspond to the first transfer means, the substrate transfer robot CR, the transfer arm bm4 and the substrate support part PS correspond to the second transfer means, and the positioning pins T1, T2, T3 and T4 correspond to the correcting means and the contact member, the optical length measuring sensors LS1, LS2, LS3 and LSR correspond to the light projecting part and the light receiving part, the motor M corresponds to the moving means, and the control part CL The cleaning unit corresponds to the control unit and the determination unit, and the cleaning unit corresponds to the processing unit.

(Another example of the method for detecting the posture of the substrate W)
11 is a perspective view showing another example of a method for detecting the attitude of the substrate W in the substrate processing apparatus 100 of FIG. 1, and FIG. 12 is a plan view showing another example of a method for detecting the attitude of the substrate W. is there.

  11 and 12, laser type distance measuring sensors (laser type displacement sensors) TS11, TS12, and TS13 are provided instead of the ultrasonic type distance measuring sensors TS1, TS2, and TS3 shown in FIGS. Yes. The laser type distance measuring sensors TS11, TS12, TS13 are fixed to a fixed base KD installed above the transfer section TP in FIG. 1, as in the examples of FIGS. These laser type distance measuring sensors TS11, TS12, TS13 are arranged so that the distance to the upper surface of the substrate W in the vicinity of the outer peripheral portion of the substrate W can be measured. In this case, the laser distance measuring sensors TS11, TS12, and TS13 are positioned so that the measured values D1, D2, and D3 of the laser distance measuring sensors TS11, TS12, and TS13 are equal while the substrate W is normally supported. Has been.

  Laser type distance measuring sensors TS11, TS12, and TS13 each measure the distance to the upper surface of the substrate W, and give the measured values D1, D2, and D3 to the controller CL of FIG.

  The controller CL calculates the tilt direction and tilt angle of the substrate W based on the measured value D1 of the laser distance measuring sensor TS11, the measured value D2 of the laser distance measuring sensor TS12, and the measured value D3 of the laser distance measuring sensor TS13. To do.

  The calculation method of the inclination direction and the inclination angle of the substrate W is the same as the method described with reference to FIGS. The method for correcting the tilt posture of the substrate W is the same as the method described with reference to FIGS.

  In this example, the laser type distance measuring sensors TS11, TS12, TS13 correspond to detection means.

  FIG. 13 is a schematic diagram for explaining the configuration and operation principle of the laser type distance measuring sensor TS11 of FIGS. The configuration and operation principle of the laser distance measurement sensors TS12 and TS13 are the same as the configuration and operation principle of the laser distance measurement sensor TS11 in FIG.

  As shown in FIG. 13, the laser type distance measuring sensor TS11 includes a laser light source 401 and a CCD (charge coupled device) 402. The laser beam emitted from the laser light source 401 is applied to the object OB. Reflected light from the object OB is received by the light receiving surface of the CCD 402 through the light receiving lens 403. In the laser distance measuring sensor TS11, the distance to the object OB can be measured with a high resolution (for example, 0.1 μm) by the triangular distance measuring method.

  As shown by the solid line arrow in FIG. 13, when the object OB is close to the laser distance measuring sensor TS11, the angle θ1 formed by the light incident on the object OB and the light incident on the CCD 402 is large. Become. On the other hand, as shown by a dotted arrow in FIG. 13, when the object OB is at a position far from the laser type distance measuring sensor TS11, an angle θ2 formed between the incident light on the object OB and the incident light on the CCD 402. Becomes smaller. Thereby, the position of the light spot formed on the light receiving surface of the CCD 402 changes depending on the distance from the laser type distance measuring sensor TS11 to the object OB. This laser type distance measuring sensor TS11 outputs a voltage signal proportional to the distance to the object OB by detecting the position of the light spot on the light receiving surface of the CCD 402. Therefore, the distance to the object OB can be measured based on the voltage signal output from the laser distance measuring sensor TS11.

  In this example, the distance to the upper surface of the substrate W can be accurately measured using the laser distance measuring sensors TS11, TS12, TS13. And the control part CL can determine the inclination attitude | position of the board | substrate W correctly and easily based on the measured values D1-D3 given from laser type distance measuring sensor TS11, TS12, TS13.

  Also in this case, the controller CL first determines whether or not the holding of the substrate W is defective based on the tilt angle of the substrate W, and if it is defective, based on the tilt direction of the substrate W, The inclined posture of the substrate W can be easily corrected by bringing the inclined substrate W into contact with the positioning pins T1 to T4 in FIG. 8 by an optimum method.

  In the example shown in FIG. 10, a laser distance measuring sensor TS11 may be used instead of the ultrasonic distance measuring sensor TSR.

  Also in this case, the distance to the upper surface of the substrate W at any of a plurality of positions on the outer peripheral portion of the substrate W can be measured by the laser type distance measuring sensor TS11. Thereby, the control part CL can determine the inclination direction and inclination angle of the board | substrate W more correctly. Therefore, the control unit CL can determine whether or not the tilting posture of the substrate W is more optimal, and can correct the tilting posture of the substrate W using the positioning pins T1 to T4 in FIG.

(Another example of the method for detecting the posture of the substrate W)
14 is a perspective view showing still another example of the method for detecting the posture of the substrate W in the substrate processing apparatus 100 of FIG. 1, and FIG. 15 is a plan view showing still another example of the method for detecting the posture of the substrate W. FIG.

  In the example of FIGS. 14 and 15, instead of the ultrasonic distance measuring sensors TS1, TS2, TS3 of FIGS. 5 and 6, microwave distance measuring sensors (microwave displacement sensors) TS21, TS22, TS23 are provided. It has been. The microwave distance measuring sensors TS21, TS22, TS23 are fixed to a fixed base KD installed above the delivery unit TP, as in the examples of FIGS. These microwave distance measuring sensors TS21, TS22, TS23 are arranged so as to be able to measure the distance to the upper surface of the substrate W in the vicinity of the outer peripheral portion of the substrate W. In this case, the microwave distance measuring sensors TS21, TS22, TS23 are set so that the measured values D1, D2, D3 of the microwave distance measuring sensors TS21, TS22, TS23 are equal while the substrate W is normally supported. Is positioned.

  The microwave distance measuring sensors TS21, TS22, TS23 each measure the distance to the upper surface of the substrate W, and give the measured values D1, D2, D3 to the control unit CL.

  The control unit CL determines the tilt direction and tilt of the substrate W based on the measurement value D1 of the microwave distance measurement sensor TS21, the measurement value D2 of the microwave distance measurement sensor TS22, and the measurement value D3 of the microwave distance measurement sensor TS23. Calculate the angle.

  The calculation method of the inclination direction and the inclination angle of the substrate W is the same as the method described with reference to FIGS. The method for correcting the tilt posture of the substrate W is the same as the method described with reference to FIGS.

  In this example, the microwave distance measuring sensors TS21, TS22, TS23 correspond to the detecting means.

  The microwave distance measuring sensor transmits a radio wave of a microwave band such as an X band to an object, receives a radio wave reflected by the object, and a distance to the object based on a time difference from transmission to reception. Measure.

  This microwave distance measuring sensor outputs a voltage signal proportional to the distance to the object. Therefore, the distance to the object can be measured based on the voltage signal output from the microwave distance measuring sensor. According to the microwave distance measuring sensor, not only an opaque body but also a distance to an object made of a transparent body can be accurately measured.

  In this example, the distance to the upper surface of the substrate W can be accurately measured using the microwave distance measuring sensors TS21, TS22, TS23. And the control part CL can determine the inclination attitude | position of the board | substrate W correctly and easily based on the measured values D1-D3 given from the microwave type distance measuring sensors TS21, TS22, TS23.

  Also in this case, the controller CL first determines whether or not the holding of the substrate W is defective based on the tilt angle of the substrate W, and if it is defective, based on the tilt direction of the substrate W, The inclined posture of the substrate W can be easily corrected by bringing the inclined substrate W into contact with the positioning pins T1 to T4 in FIG. 8 by an optimum method.

  In the example shown in FIG. 10, a microwave distance measuring sensor TS21 may be used instead of the ultrasonic distance measuring sensor TSR.

  Also in this case, the distance to the upper surface of the substrate W can be measured at a plurality of arbitrary positions on the outer peripheral portion of the substrate W by the microwave distance measuring sensor TS21. Thereby, the control part CL can determine the inclination direction and inclination angle of the board | substrate W more correctly. Therefore, the control unit CL can determine whether or not the tilting posture of the substrate W is more optimal, and can correct the tilting posture of the substrate W using the positioning pins T1 to T4 in FIG.

(Second Embodiment)
FIG. 16 is a plan view of a substrate processing apparatus 100a according to the second embodiment. The configuration of the substrate processing apparatus 100a in FIG. 16 is different from the configuration of the substrate processing apparatus 100 in FIG. 1 in the following points.

  The configuration of the substrate processing apparatus 100a in FIG. 16 includes two pairs of optical length measuring sensors LS1 and LS2 such as lasers instead of the ultrasonic distance measuring sensors TS1, TS2 and TS3 and the fixed base KD of the substrate processing apparatus 100. Prepare.

  In the second embodiment, the posture of the substrate W is detected using two pairs of optical length measuring sensors LS1, LS2 instead of the ultrasonic distance measuring sensors TS1, TS2, TS3 of the first embodiment. To do. Here, the optical length measuring sensor LS1 includes a light projecting unit ST1 and a light receiving unit SR1, and the optical length measuring sensor LS2 includes a light projecting unit ST2 and a light receiving unit SR2. Hereinafter, a method for detecting the posture of the substrate W by the optical length measuring sensors LS1 and LS2 will be described.

  17 and 18 are perspective views showing a method for detecting the posture of the substrate W using the optical length sensors LS1 and LS2, and FIG. 17 shows a case where the substrate W is normally supported by the transfer arm bm4. FIG. 18 shows a case where the substrate W is supported on the transport arm bm4 in an inclined posture.

  19 and 20 are cross-sectional views showing a method for detecting the posture of the substrate W using the optical length sensors LS1 and LS2, and FIG. 19 shows the substrate W normally supported by the transfer arm bm4. FIG. 20 shows a case where the substrate W is supported on the transport arm bm4 in an inclined posture. FIGS. 19 and 20A show the detection state of the substrate W by the optical length measurement sensor LS1, and FIGS. 19B and 20B show the detection state of the substrate W by the optical length measurement sensor LS2.

  As shown in FIGS. 17 and 18, the optical length measuring sensors LS <b> 1 and LS <b> 2 are arranged so that the light beams projected from the light projecting unit are substantially orthogonal at the substantial center of the substrate W.

  In FIG. 17, the substrate W is normally supported substantially horizontally by the plane PS3 of the four substrate support portions PS disposed on the upper surface of the transfer arm bm4. In this case, as shown in FIG. 19A, the length of the region where the light beam L1 is projected almost in parallel from the light projecting unit ST1 of the optical length measuring sensor LS1 and is shielded by the substrate W is the optical length measuring. It is measured by the light receiving part SR1 of the sensor LS1. The light receiving part SR1 of the optical length measurement sensor LS1 gives the measured value SD1 to the control part CL based on the difference between the light projection light quantity and the light reception light quantity.

  Similarly, as shown in FIG. 19B, the length of the region shielded by the substrate W is measured by the light receiving portion SR2 of the optical length measuring sensor LS2. The light receiving unit SR2 of the optical length measuring sensor LS2 gives the measurement value SD2 to the control unit CL based on the difference between the light projection light amount and the light reception light amount.

  The controller CL calculates the tilt angle θ1 of the substrate W based on the measured values SD1 and SD2 given from the light receiving part SR1 of the optical length measuring sensor LS1 and the light receiving part SR2 of the optical length measuring sensor LS2. The controller CL determines whether or not the calculated inclination angle θ1 of the substrate W is within a predetermined allowable range. In the case of FIG. 17, since the inclination angle θ1 of the substrate W is within a predetermined allowable range, it is determined that the substrate W is normally supported by the transfer arm bm4.

  On the other hand, in FIG. 18, the substrate W is supported by the plane PS1 and the inclined plane PS4 of the four substrate support portions PS arranged on the upper surface of the transfer arm bm4 (see FIGS. 2B and 2C). ). In this case, as shown in FIG. 20A, since the substrate W is in an inclined posture, the light beam L1 projected from the light projecting unit ST1 of the optical length measurement sensor LS1 is shielded more than the original thickness of the substrate W. Is done. The light receiving unit SR1 of the optical length measuring sensor LS1 gives the measurement value SD3 to the control unit CL based on the difference between the light projection light amount and the light reception light amount.

  Similarly, as shown in FIG. 20B, the light receiving unit SR2 of the optical length measurement sensor LS2 gives a measurement value SD4 to the control unit CL based on the difference between the light projection light amount and the light reception light amount.

  The controller CL calculates the tilt angle θ1 of the substrate W based on the measured values SD3 and SD4 given from the light receiving part SR1 of the optical length measuring sensor LS1 and the light receiving part SR2 of the optical length measuring sensor. The controller CL determines whether or not the calculated inclination angle θ1 of the substrate W is within a predetermined allowable range. In the case of FIG. 18, since the inclination angle θ1 of the substrate W is outside the predetermined allowable range, it is determined that the substrate W is supported by the transfer arm bm4 in an inclined posture.

  When the measurement value SD4 is larger than the measurement value SD3, the controller CL causes the substrate W to tilt more greatly in the direction along the optical length measurement sensor LS2 than in the direction along the optical length measurement sensor LS1. Can be determined.

  Further, when the measurement value SD3 and the measurement value SD4 are the same, the controller CL causes the substrate W to be greatly inclined between the direction along the optical length measurement sensor LS1 and the direction along the optical length measurement sensor LS2. Can be determined.

  When the controller CL determines that the substrate W is supported by the transfer arm bm4 in an inclined posture, the controller CL moves the transfer arm bm4 of the substrate transfer robot CR in the ± X direction, and sets the substrate on all the positioning pins T1 to T4. The periphery of W is contacted in order. Thereby, the inclined posture of the substrate W can be corrected.

  When the substrate W is normally (substantially horizontally) supported by the transfer arm bm4, the measured values of the optical length sensors LS1 and LS2 are measured as the reference values SDR1 and SDR2, and the reference value and the measurement are measured. A difference (difference values SDR1-SD3, SDR2-SD4) from the values SD3, SD4 may be calculated, and the tilt angle θ1 may be calculated based on these difference values SDR1-SD3, SDR2-SD4.

  As described above, in the substrate processing apparatus 100a according to the second embodiment, the tilt posture of the substrate W can be detected using the optical length measurement sensors LS1 and LS2. And the control part CL can determine the inclination attitude | position of the board | substrate W based on measured value SD1, SD2, SD3, SD4 given from the optical length measuring sensors LS1, LS2.

  Further, the control unit CL of the substrate processing apparatus 100 detects the tilt posture of the substrate W from the tilt angle θ1 of the substrate W, and applies the tilted posture substrate W to the positioning pins T1 to T4 by an optimum method based on the detection result. The substrate transport robot CR can be controlled so as to correct the tilted posture of the substrate W normally by making contact. As a result, it is possible to prevent the substrate W from being dropped or damaged and the occurrence of an unprocessed portion of the substrate W. As a result, an increase in cost can be suppressed.

  In the present embodiment, the tilted posture of the substrate W is detected using a transmission optical length sensor composed of a light receiving unit and a light projecting unit. However, the present invention is not limited to this, and any other detection method can be used. You may use the sensor which has. For example, a reflective optical length sensor or the like may be used.

  FIG. 21 is a schematic plan view showing another arrangement example of the optical length measuring sensor.

  FIG. 21A shows a method of detecting the tilt posture of the substrate W by arranging three pairs of optical length measurement sensors, and FIG. 21B shows the substrate W rotated by rotating the optical length measurement sensor. A method for detecting the posture of the camera will be described.

  In the example of FIG. 21A, in order to more accurately detect the tilt posture of the substrate W, an optical length sensor LS3 is further provided in the two pairs of optical length sensors LS1 and LS2.

  In this case, three measurement values are given to the controller CL from the optical length measurement sensors LS1, LS2, and LS3. As a result, the controller CL can more accurately determine the inclination angle θ1 based on these three measured values.

  In FIG. 21B, the motor M2 is fixed above the transfer portion TP, and the fixed rotating plate KB2 is attached to the rotating shaft of the motor M2. The light projecting unit STR and the light receiving unit SRR of the optical length measuring sensor LSR are attached in the vicinity of the outer peripheral portion of the fixed rotating plate KB. When the rotation axis of the motor M2 rotates in the ± θ direction (rotation direction about the vertical axis Z), the fixed rotation plate KB2 rotates, and the optical length measurement sensor LSR attached to the fixed rotation plate KB2 is the substrate. Rotate around the outer periphery of W.

  In this case, when the optical length measurement sensor LSR is rotating around the outer peripheral portion of the substrate W, the control unit CL rotates at a predetermined timing (for example, the optical length measurement sensor LSR rotates 120 degrees in the + θ direction). The optical length measuring sensor LSR is instructed to give measurement values at arbitrary plural positions. The optical length measurement sensor LSR gives measurement values at a plurality of arbitrary positions of the substrate W to the control unit CL in accordance with an instruction from the control unit CL.

  As a result, the controller CL can determine the inclination angle θ1 more accurately.

  Further, in the configuration shown in FIG. 21B, it is not necessary to arrange a plurality of optical length measuring sensors, so that it is possible to prevent light interference that may occur between the plurality of optical length measuring sensors. In addition, the number of parts and assembly man-hours can be reduced, and the overall cost can be reduced.

  In the second embodiment, the cleaning units MP1 to MP4 correspond to a plurality of processing units, the transfer unit TP corresponds to a transfer position, the ultrasonic distance measuring sensors TS1, TS2, TS3 are detection means, ultrasonic waves The indexer robot IR, the transfer arm am4, and the substrate support unit PS correspond to the first transfer unit, and the substrate transfer robot CR, the transfer arm bm4, and the substrate support unit PS correspond to the second transfer unit. The positioning pins T1, T2, T3, T4 correspond to the correcting means and the contact member, the optical length measuring sensors LS1, LS2, LS3, LSR correspond to one or a plurality of length measuring means, and the motor M2 moves. The control unit CL corresponds to the control unit, and the cleaning unit corresponds to the processing unit.

(Other)
In the above-described first embodiment, the case where the tilt posture of the substrate W is corrected based on the tilt direction H of the substrate W has been described. However, the present invention is not limited to this, and the second embodiment is also the second embodiment. Similarly to the embodiment, when the control unit CL determines that the substrate W is in the inclined posture, the peripheral edge of the substrate W is brought into contact with all of the positioning pins T1 to T4 in order to incline the substrate W. May be modified.

  In the first embodiment, the inclined posture of the substrate W is corrected by bringing the inclined substrate W into contact with the positioning pins T1 to T4. However, the present invention is not limited to this. Alternatively, the posture of the substrate W may be corrected by a method using the transport arm am4 of the indexer robot IR. First, the substrate W held in an inclined posture on the transfer arm bm4 of the substrate transfer robot CR is temporarily held by the transfer arm am4 of the indexer robot IR. Then, based on the tilted state (tilt direction H and tilt angle θ1) of the substrate W obtained by the ultrasonic distance measuring sensors TS1, TS2, TS3, the relative position in the horizontal direction between the transport arm am4 and the transport arm bm4 is determined. The substrate W may be transferred again from the transfer arm am4 of the indexer robot IR to the transfer arm bm4 of the substrate transfer robot CR.

  When the transfer arm bm4 does not support the substrate W, the distance to the transfer arm bm4 of the substrate transfer robot CR is measured using the ultrasonic distance measuring sensors TS1, TS2, TS3, so that the transfer arm bm4 The operation may be adjusted.

  In the above-described embodiment, when the inclination direction H of the substrate W is the −X direction and the + X direction, the substrate W is brought into contact with the positioning pins T1 to T4 to correct the posture of the substrate W. In consideration of the case where the inclination direction H of the substrate W is close to the −Y direction and the + Y direction, two to four positioning pins are provided in the ± Y direction when viewed from the substrate W in FIG. The substrate W may be brought into contact.

  Furthermore, in the above-described embodiment, a plurality of single-wafer cleaning units MP1 to MP4 are disposed as processing units in the processing areas A and B. However, the present invention is not limited to this, and any processing unit, for example, Hot plate that performs heat treatment, cooling plate that performs cooling processing, rotary developing device (spin developer) that performs development processing, rotary coating unit (spin coater) that performs resist coating processing, resist stripping unit that performs resist stripping processing Various processing units such as a polymer removal unit for removing a polymer such as an organic metal may be arbitrarily combined.

  The present invention can be used for processing various substrates.

It is a top view of the substrate processing apparatus concerning an embodiment of the invention. It is a top view which shows the structure of the indexer robot and substrate conveyance robot in the substrate processing apparatus of FIG. It is a top view for demonstrating the board | substrate delivery operation | movement in the delivery part of an indexer robot and a board | substrate conveyance robot. It is a side view for demonstrating the board | substrate delivery operation | movement in the delivery part of an indexer robot and a board | substrate conveyance robot. It is a perspective view which shows the method of detecting the attitude | position of a board | substrate using an ultrasonic distance measuring sensor. It is a perspective view which shows the method of detecting the attitude | position of a board | substrate using an ultrasonic distance measuring sensor. It is explanatory drawing of the method of calculating the inclination direction and inclination angle of a board | substrate. It is a perspective view which shows the method of correcting the inclination attitude | position of a board | substrate. It is a top view which shows the process which corrects the inclination attitude | position of a board | substrate. It is a perspective view which shows the other example of the method of detecting the attitude | position of a board | substrate with an ultrasonic distance measuring sensor. It is a perspective view which shows the other example of the method of detecting the attitude | position of a board | substrate in the substrate processing apparatus of FIG. It is a top view which shows the other example of the method of detecting the attitude | position of a board | substrate. It is a schematic diagram for demonstrating the structure and operating principle of the laser type distance measuring sensor of FIG. 11 and FIG. FIG. 10 is a perspective view showing still another example of a method for detecting the posture of a substrate in the substrate processing apparatus of FIG. 1. It is a top view which shows the further another example of the method of detecting the attitude | position of a board | substrate. It is a top view of the substrate processing apparatus concerning a 2nd embodiment. It is a perspective view which shows the detection method of the attitude | position of a board | substrate using an optical length measuring sensor. It is a perspective view which shows the detection method of the attitude | position of a board | substrate using an optical length measuring sensor. It is sectional drawing which shows the detection method of the attitude | position of a board | substrate using an optical length measuring sensor. It is sectional drawing which shows the detection method of the attitude | position of a board | substrate using an optical length measuring sensor. It is a typical top view which shows the other example of arrangement | positioning of an optical length measuring sensor. It is a perspective view which shows an example of the conventional substrate processing apparatus.

Explanation of symbols

1 cassette 100 substrate processing apparatus W substrate MP1, MP2, MP3, MP4 single wafer cleaning unit IR indexer robot CR substrate transport robot CL control unit IRH indexer robot main body am1, am2, am3, bm1, bm2, bm3 transport arm PS substrate Support part R1, R2, R3, R4 Rotation drive part CRH Substrate transport robot body TS1, TS2, TS3 Ultrasonic distance measurement sensor TS11, TS12, TS13 Laser distance measurement sensor TS21, TS22, TS23 Microwave distance measurement sensor LS1 , LS2, LS3, LSR Optical length measuring sensor bm4 Substrate horseshoe-shaped transfer arm TP Transfer section SL Cylinder SH Shutter T1, T2, T3, T4 Positioning pins PS1, PS2, PS3, PS4 Planar PSD Board support base PSB substrate support rod

Claims (15)

A substrate processing apparatus for processing a substrate,
A plurality of processing units for processing the substrate;
A delivery position for board delivery,
First transport means for supporting and transporting the substrate between the delivery position and a predetermined position;
A second transport means for supporting and transporting the substrate between the delivery position and any of the plurality of processing units;
A substrate processing apparatus comprising: a detecting unit that is provided at the transfer position and detects an inclined state of the substrate with respect to a horizontal plane supported by the first or second transport unit. The substrate processing apparatus according to claim 1, wherein the detection unit detects whether the substrate is tilted as the tilted state of the substrate supported by the first or second transport unit. The substrate processing apparatus according to claim 1, wherein the detection unit detects a direction of inclination of the substrate as an inclination state of the substrate supported by the first or second transport unit. The substrate processing apparatus according to claim 1, wherein the detection unit detects an inclination angle of the substrate as an inclination state of the substrate supported by the first or second transport unit. . The substrate processing apparatus according to claim 4, further comprising a determination unit that determines that the tilt state of the substrate is abnormal when the angle detected by the detection unit is equal to or greater than a predetermined value. 6. The detection unit according to claim 1, wherein the detection unit detects a tilt state of the substrate supported by the first or second transport unit by measuring a distance to the surface of the substrate. The substrate processing apparatus as described. The substrate processing apparatus according to claim 1, wherein the detection unit includes an ultrasonic distance measuring sensor that measures a distance to the surface of the substrate. The substrate processing apparatus according to claim 1, wherein the detection unit includes a laser-type distance measuring sensor that measures a distance to the surface of the substrate. The substrate processing apparatus according to claim 1, wherein the detection unit includes a microwave distance measuring sensor that measures a distance to the surface of the substrate. The substrate processing apparatus according to claim 6, wherein the detection unit includes three or more distance measurement sensors that measure a distance to the surface of the substrate. The detection means includes
A distance measuring sensor for measuring the distance to the surface of the substrate;
The substrate processing apparatus according to claim 6, further comprising a moving unit that moves the distance measuring sensor relative to the substrate. The detection means includes
A light projecting unit that projects light of a predetermined width in a direction along the surface of the substrate from one end side to the other end side of the substrate supported by the first or second transport unit at the delivery position;
A light receiving unit that receives the light projected by the light projecting unit on the other end side,
6. The substrate according to claim 1, wherein an inclination state of the substrate supported by the first or second transport unit is detected based on a width of light received by the light receiving unit. Processing equipment. 13. The apparatus according to claim 1, further comprising a correcting unit that corrects the tilt state of the substrate supported by the first or second transport unit based on the tilt state of the substrate detected by the detecting unit. The substrate processing apparatus in any one of. The correcting means is
A contact member;
Control means for correcting the inclination state of the substrate supported by the first or second transport means by bringing the substrate supported by the first or second transport means into contact with the contact member. The substrate processing apparatus according to claim 13. A process of processing the substrate in each of the plurality of processing units;
A step of supporting and transporting the substrate by the first transport means between the delivery position and the predetermined position;
A step of supporting and transporting the substrate by a second transport means between the delivery position and any of the plurality of processing units;
And a step of detecting an inclined state of the substrate supported by the first or second transport means with respect to a horizontal plane at the delivery position.

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