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JP2005026627A - Cooling apparatus and power conversion apparatus equipped with same - Google Patents

Cooling apparatus and power conversion apparatus equipped with same Download PDF

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JP2005026627A
JP2005026627A JP2003270770A JP2003270770A JP2005026627A JP 2005026627 A JP2005026627 A JP 2005026627A JP 2003270770 A JP2003270770 A JP 2003270770A JP 2003270770 A JP2003270770 A JP 2003270770A JP 2005026627 A JP2005026627 A JP 2005026627A
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cooling
electronic component
cooling device
connecting plate
pair
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JP3969360B2 (en
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Kenichi Ohama
健一 大濱
Takeshi Hamada
健 浜田
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Inverter Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling apparatus and a power conversion apparatus equipped with the same in which an electronic component can be sufficiently cooled and positioning relative to the electronic component can be easily and accurately performed. <P>SOLUTION: A cooling apparatus 1 includes at least a pair of flat cooling tubes 4 which are disposed in parallel to hold a semiconductor module 2 as an electronic component to be cooled therebetween, each for circulating a cooling medium internally, and a pair of cooling tubes 4 are connected by a connection plate 3 which is connected to one end 42 of each of the cooling tubes 4 in the direction of width. The power conversion apparatus comprises the semiconductor module 2 as an electronic component comprising a part of a power conversion circuit, and the cooling apparatus 1 including at least the pair of cooling tubes 4 which are parallel disposed to hold the semiconductor module therebetween. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は，発熱する電子部品を冷却するための冷却装置，及びこれを備えた電力変換装置に関する。   The present invention relates to a cooling device for cooling an electronic component that generates heat, and a power conversion device including the same.

従来より，半導体チップを内蔵する半導体モジュールやコンデンサ等，発熱する電子部品の放熱を行うために，該電子部品を両面から挟持するように冷却チューブを配設した両面冷却半導体装置がある（特許文献１）。   2. Description of the Related Art Conventionally, there is a double-sided cooling semiconductor device in which a cooling tube is disposed so as to sandwich an electronic component from both sides in order to radiate heat from the electronic component that generates heat, such as a semiconductor module or a capacitor incorporating a semiconductor chip (Patent Document) 1).

該両面冷却半導体装置においては，上記半導体モジュールの一対の主面に，冷却チューブが配されており，該冷却チューブ内には，冷却媒体を流通させる。また，上記コンデンサの両面にも，上記冷却チューブが配置されている。
特開２００１−３２０００５号公報 In the double-sided cooling semiconductor device, a cooling tube is disposed on a pair of main surfaces of the semiconductor module, and a cooling medium is circulated in the cooling tube. The cooling tubes are also arranged on both sides of the capacitor.
JP 2001-320005 A

しかしながら，上記電子部品と冷却チューブとの間には，特に位置決めするための手段がない。そのため，各部品を組付ける際に，互いの位置決めを容易かつ正確に行うことができないという問題がある。これにより，電子部品と冷却チューブとの組付け作業が困難となり，また冷却不良の原因となるおそれがある。
また，上記冷却チューブは上記電子部品の一対の主面に配設されてはいるが，他の四方向については特に冷却手段がなく，冷却効率が不充分となる場合もある。 However, there is no particular positioning means between the electronic component and the cooling tube. Therefore, there is a problem that when assembling each part, it is difficult to position each other easily and accurately. This makes it difficult to assemble the electronic component and the cooling tube and may cause cooling failure.
Further, although the cooling tube is disposed on the pair of main surfaces of the electronic component, there are no cooling means in the other four directions, and the cooling efficiency may be insufficient.

本発明は，かかる従来の問題点に鑑みてなされたもので，電子部品の冷却を充分に行うことができると共に，電子部品に対する位置決めを容易かつ正確に行うことができる冷却装置及びこれを備えた電力変換装置を提供しようとするものである。   The present invention has been made in view of such conventional problems, and includes a cooling device capable of sufficiently cooling an electronic component and easily and accurately positioning the electronic component. An object of the present invention is to provide a power conversion device.

第１の発明は，冷却すべき電子部品を挟持するように並列配置されると共に内部に冷却媒体を流通させる少なくとも一対の扁平な冷却チューブを有する冷却装置であって，
上記一対の冷却チューブは，各冷却チューブの幅方向の一端に接続した連結板によって連結されていることを特徴とする冷却装置にある（請求項１）。 The first invention is a cooling device having at least a pair of flat cooling tubes that are arranged in parallel so as to sandwich an electronic component to be cooled and that circulate a cooling medium therein,
The pair of cooling tubes are connected to each other by a connecting plate connected to one end in the width direction of each cooling tube.

次に，本発明の作用効果につき説明する。
上記冷却装置においては，上記一対の冷却チューブが，その幅方向の一端において連結板によって連結されている。それ故，上記冷却装置における一対の冷却チューブによって上記電子部品を挟持するとき，該電子部品の一端を上記連結板に当接させることにより位置決めすることが可能である。これにより，電子部品と冷却装置との位置決めを容易かつ正確に行うことができる。 Next, the effects of the present invention will be described.
In the cooling device, the pair of cooling tubes are connected by a connecting plate at one end in the width direction. Therefore, when the electronic component is sandwiched between the pair of cooling tubes in the cooling device, it is possible to position the electronic component by bringing one end of the electronic component into contact with the connecting plate. Thereby, positioning of an electronic component and a cooling device can be performed easily and accurately.

また，上記連結板には，上記一対の冷却チューブの幅方向の一端が接続されているため，上記連結板も冷却される。これにより，該連結板も上記冷却チューブと同様の或いはそれに近い冷却機能を発揮しうる。そのため，上記冷却装置は，一対の冷却チューブ及び連結板によって，上記電子部品を三方向から冷却することが可能となり，冷却効率を向上させることができる。   In addition, since one end of the pair of cooling tubes in the width direction is connected to the connecting plate, the connecting plate is also cooled. Thereby, the connecting plate can also exhibit a cooling function similar to or close to that of the cooling tube. Therefore, the cooling device can cool the electronic component from three directions by a pair of cooling tubes and connecting plates, and can improve the cooling efficiency.

特に，上記連結板として伝熱特性に優れたものを用いた場合には，この連結板がより大きな冷却機能を発揮するため，冷却効率をより向上させることができる。
以上のごとく，本発明によれば，電子部品の冷却を充分に行うことができると共に，電子部品に対する位置決めを容易かつ正確に行うことができる冷却装置を提供することができる。 In particular, when a connection plate having excellent heat transfer characteristics is used, the connection plate exhibits a larger cooling function, and thus the cooling efficiency can be further improved.
As described above, according to the present invention, it is possible to provide a cooling device that can sufficiently cool an electronic component and can easily and accurately position the electronic component.

第２の発明は，電力変換回路の一部を構成する電子部品と，該電子部品を挟持するように並列配置された少なくとも一対の冷却チューブを有する冷却装置とを備えた電力変換装置であって，
上記冷却装置は，上記第１の発明にかかる冷却装置からなることを特徴とする電力変換装置にある（請求項１０）。 A second invention is a power conversion device including an electronic component constituting a part of a power conversion circuit and a cooling device having at least a pair of cooling tubes arranged in parallel so as to sandwich the electronic component. ,
The cooling device is a power conversion device comprising the cooling device according to the first aspect of the invention (claim 10).

本発明の電力変換装置は，上記冷却装置として，上述した作用効果を奏する上記第１の発明の冷却装置を備えている。そのため，上記のごとく，電子部品と冷却装置との位置決めを容易かつ正確に行うことができる。それ故，上記電力変換装置は，その製造が容易で，組付け精度に優れたものとなる。
また，上記電力変換装置においては，上記のごとく上記電子部品を三方向から冷却することも可能となり，冷却効率が向上するので，熱による電子部品の暴走等をより確実に防止することができる。 The power conversion device of the present invention includes the cooling device of the first invention that exhibits the above-described effects as the cooling device. Therefore, as described above, the electronic component and the cooling device can be positioned easily and accurately. Therefore, the power conversion device is easy to manufacture and has excellent assembly accuracy.
Further, in the power conversion device, the electronic component can be cooled from three directions as described above, and the cooling efficiency is improved, so that the runaway of the electronic component due to heat can be more reliably prevented.

以上のごとく，本発明によれば，電子部品の冷却を充分に行うことができると共に，電子部品と冷却装置との位置決めを容易かつ正確に行うことができる電力変換装置を提供することができる。   As described above, according to the present invention, it is possible to provide a power converter that can sufficiently cool an electronic component and can easily and accurately position the electronic component and the cooling device.

上記第１の発明（請求項１）においては，上記冷却チューブは，例えば，アルミニウム，銅，ステンレス等の金属からなる扁平状の長尺体とすることができる。
また，上記連結板は，上記冷却チューブに対して，例えば，接着剤による接着，ネジ止め，ろう付け，溶接，或いは両部品に形成した嵌合手段による嵌合等によって接続することができる。 In the first aspect of the present invention (invention 1), the cooling tube may be a flat long body made of a metal such as aluminum, copper, or stainless steel.
The connecting plate can be connected to the cooling tube by, for example, bonding with an adhesive, screwing, brazing, welding, or fitting by fitting means formed on both parts.

また，上記連結板は，可撓性を有することが好ましい（請求項２）。
この場合には，上記冷却チューブによって，上記電子部品を確実に挟持することができる。即ち，上記冷却装置の連結板が撓んでいない状態において，一対の上記冷却チューブの間隔を上記電子部品の厚みよりも若干大きくしておき，電子部品を組付ける際に，上記一対の冷却チューブの間隔を狭めるようにして，電子部品を挟持することができる。 The connecting plate preferably has flexibility.
In this case, the electronic component can be securely held by the cooling tube. That is, when the connecting plate of the cooling device is not bent, the distance between the pair of cooling tubes is slightly larger than the thickness of the electronic components, and when the electronic components are assembled, Electronic parts can be held in such a manner that the interval is narrowed.

このとき，可撓性を有する上記連結板が容易に撓むため，上記一対の冷却チューブを容易に電子部品に密着させることができる。また，このように一対の冷却チューブの間隔を容易に調整できるため，上記電子部品に厚みの寸法公差が多少あっても，一対の冷却チューブにより確実に挟持することができる。   At this time, since the flexible connecting plate is easily bent, the pair of cooling tubes can be easily adhered to the electronic component. In addition, since the distance between the pair of cooling tubes can be easily adjusted as described above, the electronic component can be securely held by the pair of cooling tubes even if there is some dimensional tolerance of the thickness.

また，上記連結板は，上記電子部品から発生する電磁波をシールドするシールド板よりなることが好ましい（請求項３）。
この場合には，一対の上記冷却チューブと連結板とによって，上記電磁波を，三方向についてシールドすることができる。これにより，上記連結板を配設した方向についても，電磁波の影響を受けやすい電子部品等を配設することが可能となる。
なお，上記シールド板としての連結板は，導電性材料によって形成することができる。 The connecting plate is preferably formed of a shield plate that shields electromagnetic waves generated from the electronic component.
In this case, the electromagnetic wave can be shielded in three directions by the pair of cooling tubes and the connecting plate. This makes it possible to dispose electronic components and the like that are easily affected by electromagnetic waves in the direction in which the connecting plate is disposed.
The connecting plate as the shield plate can be formed of a conductive material.

また，上記連結板は，金属板又はカーボンシートよりなることが好ましい（請求項４）。
この場合には，容易かつ確実に，電磁波のシールドを行うことができる。また，これらの部材は熱伝導性にも優れるため，電子部品の冷却効率を向上させることができる。 The connecting plate is preferably made of a metal plate or a carbon sheet.
In this case, electromagnetic wave shielding can be performed easily and reliably. Moreover, since these members are excellent also in heat conductivity, the cooling efficiency of an electronic component can be improved.

また，上記連結板は，上記電子部品の外部端子を挿通するための挿通孔を形成してなることが好ましい（請求項５）。
この場合には，上記外部端子を，上記連結板を配設した側にも突出させることができる。 The connecting plate is preferably formed with an insertion hole for inserting an external terminal of the electronic component.
In this case, the external terminal can be protruded to the side where the connecting plate is provided.

また，上記挿通孔は，少なくともその内周面が絶縁部材によって構成されていることが好ましい（請求項６）。
この場合には，上記連結板を導電性材料によって形成しても，上記電子部品の外部端子の絶縁を確保することができる。 Further, it is preferable that at least an inner peripheral surface of the insertion hole is constituted by an insulating member.
In this case, insulation of the external terminals of the electronic component can be ensured even if the connecting plate is formed of a conductive material.

また，上記連結板は，複数の上記挿通孔を独立して形成してなり，各挿通孔は上記電子部品の各外部端子をそれぞれ挿通できるよう構成されていることが好ましい（請求項７）。
この場合には，上記核電子部品を，上記冷却装置に対して，より容易かつ正確に位置決めすることができる。 In addition, it is preferable that the connecting plate is formed by independently forming a plurality of the insertion holes, and each insertion hole is configured to be able to insert each external terminal of the electronic component.
In this case, the nuclear electronic component can be positioned more easily and accurately with respect to the cooling device.

また，上記冷却装置は，上記一対の冷却チューブの間に上記電子部品を複数個並列して配設できるよう構成することができる（請求項８）。
この場合には，上記複数個の電子部品を効率よく冷却することができる。 The cooling device may be configured such that a plurality of the electronic components can be arranged in parallel between the pair of cooling tubes.
In this case, the plurality of electronic components can be efficiently cooled.

また，上記電子部品は，半導体素子を内蔵した半導体モジュール，コンデンサ，又はリアクトルとすることができる（請求項９）。
この場合には，発熱しやすい上記半導体モジュール，コンデンサ，又はリアクトルを充分に冷却することができると共に，位置決めを容易かつ正確に行うことができる。 In addition, the electronic component may be a semiconductor module, a capacitor, or a reactor incorporating a semiconductor element.
In this case, it is possible to sufficiently cool the semiconductor module, the capacitor, or the reactor that easily generates heat, and to perform positioning easily and accurately.

次に，上記第２の発明（請求項１０）において，上記電力変換装置としては，例えば，インバータ，コンバータ，電源等がある。   Next, in the second invention (invention 10), examples of the power converter include an inverter, a converter, and a power source.

本発明の実施例にかかる冷却装置及びこれを備えた電力変換装置につき，図１〜図６を用いて説明する。   A cooling device according to an embodiment of the present invention and a power conversion device including the same will be described with reference to FIGS.

上記冷却装置１は，図１〜図３に示すごとく，冷却すべき電子部品としての半導体モジュール２を挟持するように並列配置されると共に内部に冷却媒体を流通させる少なくとも一対の扁平な冷却チューブ４を有する。
上記一対の冷却チューブ４は，各冷却チューブ４の幅方向の一端４２に接続した連結板３によって連結されている。
上記冷却チューブ４は，例えば，アルミニウム等の金属からなる扁平状の長尺体であり，その長手方向に沿って冷却媒体を流通させる流路４１を，幅方向に複数本並列して形成してなる。 As shown in FIGS. 1 to 3, the cooling device 1 is arranged in parallel so as to sandwich a semiconductor module 2 as an electronic component to be cooled, and at least a pair of flat cooling tubes 4 for circulating a cooling medium therein. Have
The pair of cooling tubes 4 are connected by a connecting plate 3 connected to one end 42 in the width direction of each cooling tube 4.
The cooling tube 4 is, for example, a flat and long body made of a metal such as aluminum, and a plurality of flow paths 41 for circulating the cooling medium along the longitudinal direction thereof are formed in parallel in the width direction. Become.

また，上記連結板３は，上記冷却チューブ４に対して，接着剤により接着してある。
該連結板３は，可撓性を有すると共に，上記電子部品（半導体モジュール２）から発生する電磁波をシールドするシールド板，即ち導電性材料からなる板状体よりなる。具体的には，上記連結板３は，厚み約０．５ｍｍのアルミニウム等の金属板よりなる。なお，厚みは０．０１〜５ｍｍが好ましい。
上記連結板３は，上記半導体モジュール２の外部端子２１を挿通するための挿通孔３１を形成してなる。該挿通孔３１は，少なくともその内周面が絶縁部材３２によって構成されている。上記連結板３は，複数の上記挿通孔３１を独立して形成してなり，各挿通孔３１は上記半導体モジュール２の各外部端子２１をそれぞれ挿通できるよう構成されている。 The connecting plate 3 is adhered to the cooling tube 4 with an adhesive.
The connecting plate 3 is flexible and is made of a shield plate that shields electromagnetic waves generated from the electronic component (semiconductor module 2), that is, a plate-like body made of a conductive material. Specifically, the connecting plate 3 is made of a metal plate such as aluminum having a thickness of about 0.5 mm. The thickness is preferably 0.01 to 5 mm.
The connecting plate 3 is formed with an insertion hole 31 for inserting the external terminal 21 of the semiconductor module 2. At least the inner peripheral surface of the insertion hole 31 is constituted by an insulating member 32. The connecting plate 3 is formed by independently forming a plurality of the insertion holes 31, and each insertion hole 31 is configured to be able to insert each external terminal 21 of the semiconductor module 2.

また，図１に示すごとく，上記冷却装置１は，上記一対の冷却チューブ４の間に上記半導体モジュール２を複数個並列して配設できるよう構成されている。
また，上記冷却チューブ４を３本以上並列配置して，それらの間に形成される２列以上の間隙に，上記半導体モジュール２を配設することができる。
上記冷却装置１を備えた電力変換装置として，図１〜図３に示すごとく，電力変換回路の一部を構成する電子部品としての半導体モジュール２と，該半導体モジュール２を挟持するように並列配置された少なくとも一対の冷却チューブ４を有する冷却装置１とを備えた電力変換装置がある。 As shown in FIG. 1, the cooling device 1 is configured such that a plurality of the semiconductor modules 2 can be arranged in parallel between the pair of cooling tubes 4.
Further, three or more cooling tubes 4 can be arranged in parallel, and the semiconductor module 2 can be arranged in two or more rows formed between them.
As shown in FIGS. 1 to 3, the power conversion device including the cooling device 1 is arranged in parallel so as to sandwich the semiconductor module 2 as an electronic component constituting a part of the power conversion circuit and the semiconductor module 2. There is a power conversion device provided with a cooling device 1 having at least a pair of cooling tubes 4.

上記半導体モジュール２は，図２，図５に示すごとく，半導体素子２２を内蔵してなると共に略矩形状の本体部２６から一端に突出した２本の主電極端子と，反対側の一端から突出した複数本の制御電極端子とを，それぞれ外部端子２１，２１０として有する。そして，図１，図２に示すごとく，上記主電極端子としての外部端子２１が，上記連結板３の貫通孔３１に挿通され，上記制御電極端子としての外部端子２１０は，上記連結板３が設けられていない側の上記冷却チューブ４の幅方向の一端４３から突出している。   As shown in FIGS. 2 and 5, the semiconductor module 2 includes a semiconductor element 22 and two main electrode terminals projecting from one end of a substantially rectangular main body portion 26 and projecting from one end on the opposite side. The plurality of control electrode terminals are provided as external terminals 21 and 210, respectively. As shown in FIGS. 1 and 2, the external terminal 21 as the main electrode terminal is inserted into the through hole 31 of the connecting plate 3, and the external terminal 210 as the control electrode terminal is connected to the connecting plate 3. It protrudes from one end 43 in the width direction of the cooling tube 4 on the side where it is not provided.

上記電力変換装置の組付け方法につき説明する。
まず，図４に示すごとく，所定位置に開口部３６を形成した連結板３に，複数の冷却チューブ４を，その幅方向の一端４２において，互いに平行になるように接着する。このとき，隣り合う冷却チューブ４の間の間隔が，上記半導体モジュール２の厚みよりも若干大きめになるように配置する。 A method for assembling the power converter will be described.
First, as shown in FIG. 4, a plurality of cooling tubes 4 are bonded to a connecting plate 3 having openings 36 at predetermined positions so as to be parallel to each other at one end 42 in the width direction. At this time, it arrange | positions so that the space | interval between the adjacent cooling tubes 4 may become a little larger than the thickness of the said semiconductor module 2. FIG.

また，図５に示すごとく，上記開口部３６に，貫通孔３１をそれぞれ２個ずつ有する絶縁部材３２を嵌め込む。上記開口部３６及び貫通孔３１は，挿嵌させる半導体モジュール２の外部端子２１の大きさや配置に対応して形成してある。
ここで，本例では，後述する連結板３の撓みをスムーズに実現できるように開口部３６のうち上記冷却チューブ４に平行な辺部のみにおいて連結板３と絶縁部材３２とを接合する。 Further, as shown in FIG. 5, insulating members 32 each having two through holes 31 are fitted into the openings 36. The opening 36 and the through hole 31 are formed corresponding to the size and arrangement of the external terminals 21 of the semiconductor module 2 to be inserted.
Here, in this example, the connecting plate 3 and the insulating member 32 are joined only at the side portion parallel to the cooling tube 4 in the opening 36 so that the bending of the connecting plate 3 described later can be smoothly realized.

次いで，図５，図６に示すごとく，隣り合う冷却チューブ４の間に上記半導体モジュール２を配設する。このとき，該半導体モジュール２の外部端子２１を，上記連結板３の貫通孔３１に挿嵌させる。また，上記半導体モジュール２の本体部２６における主電極端子側の一端２６１を上記連結板３に当接させる。
次いで，図６，図１に示すごとく，上記冷却チューブ４と上記半導体モジュール２との積層方向に押圧力Ｆを加えることにより，上記冷却チューブ４と半導体モジュール２とを密着させる。このとき，上記連結板３は，図１〜図３に示すごとく，連結部分３５において撓む。
なお，冷却チューブ４と半導体モジュール２との間にはシリコングリスを介在させてもよい。 Next, as shown in FIGS. 5 and 6, the semiconductor module 2 is disposed between the adjacent cooling tubes 4. At this time, the external terminal 21 of the semiconductor module 2 is inserted into the through hole 31 of the connecting plate 3. Further, one end 261 on the main electrode terminal side of the main body portion 26 of the semiconductor module 2 is brought into contact with the connecting plate 3.
Next, as shown in FIGS. 6 and 1, the cooling tube 4 and the semiconductor module 2 are brought into close contact with each other by applying a pressing force F in the stacking direction of the cooling tube 4 and the semiconductor module 2. At this time, the connecting plate 3 bends at the connecting portion 35 as shown in FIGS.
Note that silicon grease may be interposed between the cooling tube 4 and the semiconductor module 2.

また，本例では，絶縁部材３２を可撓性の小さい材料により構成してあるため，絶縁部材３２そのものは殆ど撓まないが，上述したごとく開口部３６に対する絶縁部材３２の接合部位を限定したことにより，上記連結部材３の連結部分３５は，冷却チューブ４に垂直な方向について絶縁部材３２に拘束されずに自由に撓む。図１〜図３においては，説明のため，上記連結部分３５の変形を極端に大きくしてあるが，実際にはわずかな撓みとなる。   Further, in this example, since the insulating member 32 is made of a material with low flexibility, the insulating member 32 itself hardly bends, but the joint portion of the insulating member 32 to the opening 36 is limited as described above. Thus, the connecting portion 35 of the connecting member 3 is freely bent without being constrained by the insulating member 32 in the direction perpendicular to the cooling tube 4. In FIG. 1 to FIG. 3, for the sake of explanation, the deformation of the connecting portion 35 is extremely large, but in reality it is slightly bent.

次に，本例の作用効果につき説明する。
上記冷却装置１においては，図１〜図３に示すごとく，上記一対の冷却チューブ４が，その幅方向の一端４２において連結板３によって連結されている。それ故，上記冷却装置１における一対の冷却チューブ４によって上記半導体モジュール２を挟持するとき，該半導体モジュール２の一端２６１を上記連結板３に当接させることにより位置決めすることが可能である。これにより，半導体モジュール２と冷却装置１との位置決めを容易かつ正確に行うことができる。 Next, the effect of this example will be described.
In the cooling device 1, as shown in FIGS. 1 to 3, the pair of cooling tubes 4 are connected by a connecting plate 3 at one end 42 in the width direction. Therefore, when the semiconductor module 2 is sandwiched between the pair of cooling tubes 4 in the cooling device 1, it is possible to position the semiconductor module 2 by bringing the end 261 into contact with the connecting plate 3. Thereby, positioning of the semiconductor module 2 and the cooling device 1 can be performed easily and accurately.

また，上記連結板３には，上記一対の冷却チューブ４の一端４２が接続されているため，上記連結板３も冷却される。これにより，該連結板３も上記冷却チューブ４と同様の或いはそれに近い冷却機能を発揮しうる。そのため，上記冷却装置１は，一対の冷却チューブ４及び連結板３によって，上記半導体モジュール２を三方向から冷却することが可能となり，冷却効率を向上させることができる。   In addition, since one end 42 of the pair of cooling tubes 4 is connected to the connecting plate 3, the connecting plate 3 is also cooled. Thereby, the connecting plate 3 can also exhibit a cooling function similar to or close to that of the cooling tube 4. Therefore, the cooling device 1 can cool the semiconductor module 2 from three directions by the pair of cooling tubes 4 and the connecting plate 3 and can improve the cooling efficiency.

また，上記連結板３は，可撓性を有するため，上記冷却チューブ４によって，上記半導体モジュール２を確実に挟持することができる。即ち，上記冷却装置１の連結板３が撓んでいない状態において，図６に示すごとく，一対の上記冷却チューブ４の間隔を上記半導体モジュール２の厚みよりも若干大きくしておき，半導体モジュール２を組付ける際に，上記一対の冷却チューブの間隔を狭めるようにして，半導体モジュール２を挟持することができる。
このとき，可撓性を有する上記連結板３が容易に撓むため，上記一対の冷却チューブ４を容易に半導体モジュール２に密着させることができる。また，このように一対の冷却チューブ４の間隔を容易に調整できるため，上記半導体モジュール２に厚みの寸法公差が多少あっても，一対の冷却チューブ４により確実に挟持することができる。 Further, since the connecting plate 3 has flexibility, the semiconductor module 2 can be securely held by the cooling tube 4. That is, in the state where the connecting plate 3 of the cooling device 1 is not bent, the distance between the pair of cooling tubes 4 is slightly larger than the thickness of the semiconductor module 2 as shown in FIG. When assembling, the semiconductor module 2 can be sandwiched so as to narrow the interval between the pair of cooling tubes.
At this time, since the flexible connecting plate 3 is easily bent, the pair of cooling tubes 4 can be easily adhered to the semiconductor module 2. In addition, since the distance between the pair of cooling tubes 4 can be easily adjusted as described above, the semiconductor module 2 can be securely held by the pair of cooling tubes 4 even if there is some dimensional tolerance of the thickness.

また，上記連結板は，上記半導体モジュール２から発生する電磁波をシールドするシールド板（導電性材料からなる板状体）よりなるため，一対の上記冷却チューブ４と連結板３とによって，上記電磁波を，三方向についてシールドすることができる。これにより，上記連結板３を配設した方向についても，電磁波の影響を受けやすい電子部品等を配設することが可能となる。
また，上記連結板３は金属板よりなるため，容易かつ確実に，電磁波のシールドを行うことができる。また，これらの部材は熱伝導性にも優れるため，半導体モジュール２の冷却効率を向上させることができる。
また，上記連結板３は上記挿通孔３１を形成してなるため，上記外部端子２１を，上記連結板３を配設した側にも突出させることができる。 In addition, since the connecting plate is made of a shield plate (a plate-like body made of a conductive material) that shields electromagnetic waves generated from the semiconductor module 2, the pair of cooling tubes 4 and the connecting plate 3 allows the electromagnetic waves to be transmitted. , Can be shielded in three directions. As a result, electronic components and the like that are easily affected by electromagnetic waves can be disposed in the direction in which the connecting plate 3 is disposed.
Further, since the connecting plate 3 is made of a metal plate, electromagnetic wave shielding can be performed easily and reliably. Moreover, since these members are also excellent in thermal conductivity, the cooling efficiency of the semiconductor module 2 can be improved.
Further, since the connecting plate 3 is formed with the insertion hole 31, the external terminal 21 can be protruded to the side where the connecting plate 3 is provided.

また，上記挿通孔３１は，少なくともその内周面を絶縁部材３２によって構成しているため，上記半導体モジュール２の外部端子２１の絶縁を確保することができる。   Further, since the insertion hole 31 has at least an inner peripheral surface constituted by the insulating member 32, insulation of the external terminal 21 of the semiconductor module 2 can be ensured.

また，上記連結板３は，複数の上記挿通孔３１を独立して形成してなり，各挿通孔は上記半導体モジュール２の各外部端子２１をそれぞれ挿通できるよう構成されている。そのため，上記核半導体モジュール２を，上記冷却装置１に対して，より容易かつ正確に位置決めすることができる。
また，図１に示すごとく，上記冷却装置１は，上記一対の冷却チューブ４の間に上記半導体モジュール２を複数個並列して配設できるよう構成してあるため，上記複数個の半導体モジュール２を効率よく冷却することができる。
また，本例の冷却装置１は，発熱しやすい上記半導体モジュール２の冷却に用いられるため，その機能を充分に発揮することができる。 In addition, the connecting plate 3 is formed with a plurality of the insertion holes 31 independently, and each insertion hole is configured to be able to insert each external terminal 21 of the semiconductor module 2. Therefore, the nuclear semiconductor module 2 can be positioned more easily and accurately with respect to the cooling device 1.
As shown in FIG. 1, the cooling device 1 is configured such that a plurality of the semiconductor modules 2 can be arranged in parallel between the pair of cooling tubes 4. Can be efficiently cooled.
Further, since the cooling device 1 of the present example is used for cooling the semiconductor module 2 that easily generates heat, its function can be sufficiently exerted.

以上のごとく，本例によれば，半導体モジュールの冷却を充分に行うことができると共に，半導体モジュールに対する位置決めを容易かつ正確に行うことができる冷却装置，及びこれを備えた電力変換装置を提供することができる。   As described above, according to the present example, a cooling device that can sufficiently cool a semiconductor module and that can be easily and accurately positioned with respect to the semiconductor module, and a power conversion device including the same are provided. be able to.

本例は，図７に示すごとく，連結板３と冷却チューブ４とを，両部品に形成した嵌合手段による嵌合によって接続した冷却装置１の例である。   This example is an example of the cooling device 1 in which the connecting plate 3 and the cooling tube 4 are connected by fitting by fitting means formed on both parts, as shown in FIG.

上記嵌合手段は，上記冷却チューブ４に設けた，開口側の狭い溝部４４と，該溝部４４にスライドさせて嵌合させることができる，上記連結板３に設けた凸条部３４とによって構成されている。
その他は，実施例１と同様である。
この場合には，上記冷却チューブ４と連結板３とを容易かつ確実に接続することができる。 The fitting means is constituted by a narrow groove portion 44 on the opening side provided in the cooling tube 4 and a ridge 34 provided on the connecting plate 3 that can be slid and fitted into the groove portion 44. Has been.
Others are the same as in the first embodiment.
In this case, the cooling tube 4 and the connecting plate 3 can be connected easily and reliably.

その他，実施例１と同様の作用効果を有する。
また，上記連結板３と冷却チューブ４との接続には，上述した以外にも，例えば，ネジ止め，ろう付け，溶接等種々の手段を用いることができる。 In addition, the same effects as those of the first embodiment are obtained.
In addition to the above, various means such as screwing, brazing, and welding can be used to connect the connecting plate 3 and the cooling tube 4.

本例は，図８に示すごとく，冷却すべき電子部品として，コンデンサ２０を冷却チューブ４の間に挟持する冷却装置１の例である。   This example is an example of a cooling device 1 that sandwiches a capacitor 20 between cooling tubes 4 as electronic components to be cooled, as shown in FIG.

該冷却装置１は，上記コンデンサ２０を，その外部端子２１を連結板３の貫通孔３１に挿通して冷却チューブ４の間に配置し，該冷却チューブ４によって挟持することができるよう構成してある。そして，実施例１の場合と同様に，上記コンデンサ２０の外部端子２１が突出した側の一端２６１は，上記連結板３に当接させることができ，また，該連結板３の連結部分３５は容易に撓ませることができる。
その他は，実施例１と同様である。 The cooling device 1 is configured such that the capacitor 20 can be sandwiched between the cooling tubes 4 by inserting the external terminals 21 through the through holes 31 of the connecting plate 3 and placing them between the cooling tubes 4. is there. As in the first embodiment, one end 261 of the capacitor 20 on the side from which the external terminal 21 protrudes can be brought into contact with the connecting plate 3, and the connecting portion 35 of the connecting plate 3 is Can be easily bent.
Others are the same as in the first embodiment.

本例によれば，コンデンサ２０の冷却を充分に行うことができると共に，コンデンサ２０に対する位置決めを容易かつ正確に行うことができる冷却装置１，及びこれを備えた電力変換装置を提供することができる。
その他，実施例１と同様の作用効果を有する。
また，本発明にかかる冷却装置によって冷却する電子部品として，半導体モジュール，回路モジュール，電源モジュール，コンデンサ以外にも，例えば，リアクトル，セラミックヒータ等他の電子部品を配置することができる。 According to this example, it is possible to provide the cooling device 1 that can sufficiently cool the capacitor 20 and can easily and accurately position the capacitor 20, and a power conversion device including the same. .
In addition, the same effects as those of the first embodiment are obtained.
In addition to the semiconductor module, the circuit module, the power supply module, and the capacitor, other electronic components such as a reactor and a ceramic heater can be arranged as electronic components to be cooled by the cooling device according to the present invention.

また，上記連結板としては，金属板以外にも，例えば，カーボンシート，金属繊維等からなるメッシュ状のシート，金属板等に塗装を施してなるシート，金属板に異種の金属をメッキしたメッキ品，絶縁板に導電物を塗布・貼り付けしたものや絶縁材に導電物を混入したもの等によって構成することができる。   In addition to the metal plate, the connecting plate is, for example, a carbon sheet, a mesh sheet made of metal fibers, a sheet obtained by coating a metal plate, or a metal plate plated with a different metal. It can be constituted by a product, an insulating plate coated with a conductive material, an insulating material mixed with a conductive material, or the like.

さらに，連結板は外部端子の片側に取り付け，電子部品を挿入した後，反対側にも連結板を配置することで，四方向から冷却・電磁シールド可能となることは言うまでもない。
また，数枚に分離された連結板でも同じ効果が得られる。 Furthermore, it goes without saying that the connecting plate is attached to one side of the external terminal, the electronic component is inserted, and the connecting plate is also arranged on the opposite side, so that cooling and electromagnetic shielding can be performed from four directions.
In addition, the same effect can be obtained by connecting plates separated into several sheets.

実施例１における，半導体モジュールを配置した冷却装置の斜視図。The perspective view of the cooling device which has arrange | positioned the semiconductor module in Example 1. FIG. 図１のＡ−Ａ線矢視断面図。FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. 図１のＢ−Ｂ線矢視断面図。FIG. 3 is a cross-sectional view taken along line B-B in FIG. 1. 実施例１における，連結板に冷却チューブを接続する前の状態を示す斜視図。The perspective view which shows the state before connecting a cooling tube to a connection board in Example 1. FIG. 実施例１における，冷却装置に半導体モジュールを配置する前の状態を示す斜視図。The perspective view which shows the state before arrange | positioning a semiconductor module in the cooling device in Example 1. FIG. 実施例１における，冷却装置に配置した半導体モジュールを冷却チューブによって挟持する前の状態を示す斜視図。The perspective view which shows the state before clamping the semiconductor module arrange | positioned in the cooling device in Example 1 with a cooling tube. 実施例２における，半導体モジュールを配置した冷却装置の断面図。Sectional drawing of the cooling device which has arrange | positioned the semiconductor module in Example 2. FIG. 実施例３における，コンデンサを冷却装置に配置する前の状態を示す斜視図。The perspective view which shows the state in Example 3 before arrange | positioning a capacitor | condenser in a cooling device.

符号の説明Explanation of symbols

１．．．冷却装置，
２．．．半導体モジュール，
２１．．．外部端子，
３．．．連結板，
３１．．．貫通孔，
４．．．冷却チューブ， 1. . . Cooling system,
2. . . Semiconductor module,
21. . . External terminal,
3. . . Connecting plate,
31. . . Through hole,
4). . . Cooling tube,

Claims (10)

冷却すべき電子部品を挟持するように並列配置されると共に内部に冷却媒体を流通させる少なくとも一対の扁平な冷却チューブを有する冷却装置であって，
上記一対の冷却チューブは，各冷却チューブの幅方向の一端に接続した連結板によって連結されていることを特徴とする冷却装置。 A cooling device having at least a pair of flat cooling tubes arranged in parallel so as to sandwich an electronic component to be cooled and circulating a cooling medium therein,
The pair of cooling tubes are connected by a connecting plate connected to one end in the width direction of each cooling tube. 請求項１において，上記連結板は，可撓性を有することを特徴とする冷却装置。   2. The cooling device according to claim 1, wherein the connecting plate has flexibility. 請求項１又は２において，上記連結板は，上記電子部品から発生する電磁波をシールドするシールド板よりなることを特徴とする冷却装置。   3. The cooling device according to claim 1, wherein the connecting plate is a shield plate that shields electromagnetic waves generated from the electronic component. 請求項３において，上記連結板は，金属板又はカーボンシートよりなることを特徴とする冷却装置。   4. The cooling device according to claim 3, wherein the connecting plate is made of a metal plate or a carbon sheet. 請求項１〜４のいずれか１項において，上記連結板は，上記電子部品の外部端子を挿通するための挿通孔を形成してなることを特徴とする冷却装置。   5. The cooling device according to claim 1, wherein the connecting plate is formed with an insertion hole for inserting an external terminal of the electronic component. 請求項５において，上記挿通孔は，少なくともその内周面が絶縁部材によって構成されていることを特徴とする冷却装置。   6. The cooling device according to claim 5, wherein at least an inner peripheral surface of the insertion hole is configured by an insulating member. 請求項５又は６において，上記連結板は，複数の上記挿通孔を独立して形成してなり，各挿通孔は上記電子部品の各外部端子をそれぞれ挿通できるよう構成されていることを特徴とする冷却装置。   The connection plate according to claim 5 or 6, wherein the connection plate is formed by independently forming a plurality of the insertion holes, and each insertion hole is configured to be inserted through each external terminal of the electronic component. Cooling system. 請求項１〜７のいずれか１項において，上記冷却装置は，上記一対の冷却チューブの間に上記電子部品を複数個並列して配設できるよう構成されていることを特徴とする冷却装置。   8. The cooling device according to claim 1, wherein the cooling device is configured such that a plurality of the electronic components can be arranged in parallel between the pair of cooling tubes. 9. 請求項１〜８のいずれか１項において，上記電子部品は，半導体素子を内蔵した半導体モジュール，コンデンサ，又はリアクトルであることを特徴とする冷却装置。   9. The cooling device according to claim 1, wherein the electronic component is a semiconductor module, a capacitor, or a reactor in which a semiconductor element is incorporated. 電力変換回路の一部を構成する電子部品と，該電子部品を挟持するように並列配置された少なくとも一対の冷却チューブを有する冷却装置とを備えた電力変換装置であって，
上記冷却装置は，請求項１〜９のいずれか１項に記載の冷却装置からなることを特徴とする電力変換装置。 A power conversion device comprising: an electronic component constituting a part of a power conversion circuit; and a cooling device having at least a pair of cooling tubes arranged in parallel so as to sandwich the electronic component,
The said cooling device consists of the cooling device of any one of Claims 1-9, The power converter device characterized by the above-mentioned.
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