[go: up one dir, main page]

JP2004335693A5 - - Google Patents

Download PDF

Info

Publication number
JP2004335693A5
JP2004335693A5 JP2003128917A JP2003128917A JP2004335693A5 JP 2004335693 A5 JP2004335693 A5 JP 2004335693A5 JP 2003128917 A JP2003128917 A JP 2003128917A JP 2003128917 A JP2003128917 A JP 2003128917A JP 2004335693 A5 JP2004335693 A5 JP 2004335693A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003128917A
Other languages
Japanese (ja)
Other versions
JP4532846B2 (en
JP2004335693A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2003128917A external-priority patent/JP4532846B2/en
Priority to JP2003128917A priority Critical patent/JP4532846B2/en
Priority to TW093111750A priority patent/TWI259514B/en
Priority to KR1020057020457A priority patent/KR100725141B1/en
Priority to CNA2007101812355A priority patent/CN101145509A/en
Priority to CNB2004800006869A priority patent/CN100358104C/en
Priority to EP04730068A priority patent/EP1620880A4/en
Priority to PCT/JP2004/006178 priority patent/WO2004100233A1/en
Publication of JP2004335693A publication Critical patent/JP2004335693A/en
Priority to US11/039,285 priority patent/US20050124137A1/en
Publication of JP2004335693A5 publication Critical patent/JP2004335693A5/ja
Publication of JP4532846B2 publication Critical patent/JP4532846B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003128917A 2003-05-07 2003-05-07 Manufacturing method of semiconductor substrate Expired - Fee Related JP4532846B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2003128917A JP4532846B2 (en) 2003-05-07 2003-05-07 Manufacturing method of semiconductor substrate
TW093111750A TWI259514B (en) 2003-05-07 2004-04-27 Semiconductor substrate and manufacturing method therefor
PCT/JP2004/006178 WO2004100233A1 (en) 2003-05-07 2004-04-28 Semiconductor substrate and manufacturing method therefor
CNA2007101812355A CN101145509A (en) 2003-05-07 2004-04-28 Semiconductor substrate and manufacturing method therefor
CNB2004800006869A CN100358104C (en) 2003-05-07 2004-04-28 Semiconductor substrate and manufacturing method therefor
EP04730068A EP1620880A4 (en) 2003-05-07 2004-04-28 Semiconductor substrate and manufacturing method therefor
KR1020057020457A KR100725141B1 (en) 2003-05-07 2004-04-28 Semiconductor substrate and manufacturing method thereof
US11/039,285 US20050124137A1 (en) 2003-05-07 2005-01-19 Semiconductor substrate and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003128917A JP4532846B2 (en) 2003-05-07 2003-05-07 Manufacturing method of semiconductor substrate

Publications (3)

Publication Number Publication Date
JP2004335693A JP2004335693A (en) 2004-11-25
JP2004335693A5 true JP2004335693A5 (en) 2006-06-08
JP4532846B2 JP4532846B2 (en) 2010-08-25

Family

ID=33432059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003128917A Expired - Fee Related JP4532846B2 (en) 2003-05-07 2003-05-07 Manufacturing method of semiconductor substrate

Country Status (6)

Country Link
EP (1) EP1620880A4 (en)
JP (1) JP4532846B2 (en)
KR (1) KR100725141B1 (en)
CN (2) CN101145509A (en)
TW (1) TWI259514B (en)
WO (1) WO2004100233A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5128781B2 (en) * 2006-03-13 2013-01-23 信越化学工業株式会社 Manufacturing method of substrate for photoelectric conversion element
CN108231695A (en) * 2016-12-15 2018-06-29 上海新微技术研发中心有限公司 Composite substrate and method for manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794409A (en) * 1993-09-20 1995-04-07 Fujitsu Ltd Method for forming III-V compound semiconductor thin film
JP3879173B2 (en) * 1996-03-25 2007-02-07 住友電気工業株式会社 Compound semiconductor vapor deposition method
JP3697106B2 (en) * 1998-05-15 2005-09-21 キヤノン株式会社 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor thin film
FR2784795B1 (en) * 1998-10-16 2000-12-01 Commissariat Energie Atomique STRUCTURE COMPRISING A THIN LAYER OF MATERIAL COMPOSED OF CONDUCTIVE ZONES AND INSULATING ZONES AND METHOD FOR MANUFACTURING SUCH A STRUCTURE
WO2002015244A2 (en) * 2000-08-16 2002-02-21 Massachusetts Institute Of Technology Process for producing semiconductor article using graded expitaxial growth

Similar Documents

Publication Publication Date Title
CY2013029I1 (en)
BE2013C075I2 (en)
BE2013C069I2 (en)
BE2013C067I2 (en)
BE2013C036I2 (en)
BE2011C030I2 (en)
JP2003299662A5 (en)
JP2004003477A5 (en)
BE2013C034I2 (en)
JP2003235800A5 (en)
JP2004221348A5 (en)
JP2004193125A5 (en)
BE2012C053I2 (en)
JP2004003470A5 (en)
JP2004080733A5 (en)
JP2004088093A5 (en)
JP2004000543A5 (en)
JP2004157960A5 (en)
JP2004224137A5 (en)
JP2004335693A5 (en)
AU2003207750A1 (en)
AU2002324323A1 (en)
AU2002327042A1 (en)
AU2002353888A1 (en)
AU2003210772A1 (en)