JP2004319793A - Electronic component stem, electronic component, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stem for electronic component and an electronic component that are superior in heat radiation and strength and can be treated for corrosion prevention and be manufactured easily, and to provide their manufacturing method. <P>SOLUTION: The stem is provided with a heat sink frame 6 that a frame 8 and a heat sink 7 projecting therefrom are made integral with each other, a substrate 2 formed of resin member and a plurality of lead terminals 3, 4 and 5. The heat sink frame 6 and the lead terminals 3, 4 and 5 are made integral with the substrate 2, and the frame 8 has an exposed part 8c exposed over the substrate 2. When the exposed part 8c is viewed from the circumferential direction of the side of the substrate 2, it is arranged at a part of the entire circumference of the side of the substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a stem for an electronic component on which an electronic component is mounted, and more particularly to a stem for a semiconductor device used as a light emitting device such as a semiconductor laser device.
[0002]
[Prior art]
Various configurations have been proposed for electronic component stems in order to reduce manufacturing costs and improve heat dissipation. For example, the configuration described in Patent Literature 1 below reduces the material cost and the assembly cost by using a resin base as the base. In the configuration described in Patent Document 2 below, a heat radiating plate is arranged so as to surround a lead terminal, and a cap is brought into contact with the heat radiating plate to improve heat radiation.
[0003]
In the configuration shown in FIG. 7, the stem 100 and the block body 101 are integrated, and the stem 100 is exposed over the entire side surface of the back plate 102 that is a resin base. In this configuration, the manufacturing cost is reduced by using the back plate 102 as a resin base, and the heat dissipation is improved by joining the cap body 103 to the stem 100 exposed from the back plate 102 (see the following patent). Reference 3).
[0004]
[Patent Document 1]
JP-A-62-252154 [0005]
[Patent Document 2]
JP 2000-252575 A
[Patent Document 3]
JP-A-4-24976
[Problems to be solved by the invention]
However, in the configuration of Patent Document 1, since the base is a resin base, the heat radiation effect is smaller than that of the metal base, and it is difficult to secure the strength. Further, although the structure of Patent Document 2 improves heat dissipation, the structure of the heat dissipation plate is complicated and processing is not easy.
[0008]
In the configuration shown in FIG. 7, the stem 100 is exposed over the entire circumference of the back plate 102, which is a resin base, which is disadvantageous for downsizing, the exposed area is large, and the treatment for preventing corrosion is widespread. Was needed.
[0009]
The present invention solves the conventional problems as described above, and is excellent in both heat dissipation and strength, and is a corrosion prevention treatment and easy to manufacture. A stem for an electronic component, an electronic component, and a method of manufacturing the same The purpose is to provide.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, an electronic component stem of the present invention includes a heat sink frame in which a frame and a heat sink protruding from the frame are integrated, a base formed of a resin member, and a plurality of lead terminals. Equipped,
The heat sink frame and the plurality of lead terminals are integrated with the base,
The frame has an exposed portion exposed from the base, and when the exposed portion is viewed in a circumferential direction of a side surface of the base, the exposed portion is disposed on a part of the entire circumference of the side surface of the base. It is characterized by.
[0011]
Further, an electronic component of the present invention is an electronic component using the electronic component stem of the present invention, wherein an element of the electronic component is fixed to the heat sink.
[0012]
Next, the method for manufacturing a stem for an electronic component according to the present invention includes the step of pressing a strip-shaped plate to form a frame in which an extending portion extending in a plane direction is integrated, and a direction substantially orthogonal to the plane direction of the frame. Forming a heat sink frame formed with a heat sink protruding in the direction,
Forming a resin-molded base in which the lead terminals and the heat sink frame are integrated,
Cutting the extension to separate the substrate from the plate,
Forming the heat sink frame and the base at a predetermined interval between both end portions in a direction orthogonal to the direction of the forward feeding, of the band-shaped plate while feeding the band-shaped plate sequentially to the respective steps. Features.
[0013]
Further, a method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component including the method of manufacturing a stem for an electronic component, comprising a step of fixing an element of the electronic component to the heat sink. .
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
The electronic component stem and the electronic component of the present invention are provided with a heat sink frame in which a frame and a heat sink are integrated with a frame exposed on a part of the entire periphery of the side surface of the base, and thus have excellent heat dissipation and strength. Also, the corrosion prevention treatment and the manufacture are easy.
[0015]
According to the method for manufacturing an electronic component stem and the method for manufacturing an electronic component of the present invention, since the electronic component stem can be continuously produced, the productivity is excellent and the manufacturing cost can be reduced.
[0016]
In the stem for an electronic component of the present invention, the frame may include an annular portion and an extending portion extending from the annular portion, and the extending portion may be exposed from the base. preferable. According to this configuration, the annular member is arranged over the entire circumferential direction of the base, which is advantageous for securing strength.
[0017]
Further, it is preferable that the heat sink is a plate-like member, and the plate-like member protrudes in a direction substantially orthogonal to a plane portion of the annular portion. According to this configuration, since the heat sink is a plate-shaped member, processing such as press processing is easy.
[0018]
Further, it is preferable that the exposed portion and the side surface of the base are substantially on the same plane. According to this configuration, the range of the corrosion prevention treatment can be reduced, which is advantageous for miniaturization.
[0019]
Preferably, the method of manufacturing an electronic component according to the present invention further includes a step of mounting a cap on a side of the stem for the electronic component where the heat sink is located.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0020]
(Embodiment 1)
FIG. 1A is a perspective view of an electronic component stem (hereinafter, referred to as “stem”) according to an embodiment of the present invention. In the stem 1, the base 2 forms a stem body. The base 2 is a resin mold which is a resin molded product. The three lead terminals 3, 4, 5 are integrated with the base 2.
[0021]
FIG. 1 (b) shows a perspective view of the internal structure of the stem shown in FIG. 1 (a). The heat sink frame 6 is formed by integrating a frame 8 with a heat sink 7 which is a plate-shaped member. The frame 8 has an annular member 8a and an extending portion 8b extending outward in the radial direction of the annular member 8a. The lead terminal 5 is joined to the annular member 8a.
[0022]
The semiconductor element 9 is fixed to the heat sink 7 in the manufacturing process of the stem 1 or after the stem 1 is completed. The heat sink 7 has a role of radiating and transferring the heat generated by the semiconductor element 9. For this reason, the heat sink frame 6 is formed of aluminum, copper, a copper alloy, or the like having both excellent electrical conductivity and heat dissipation.
[0023]
The heat sink frame 6 can be formed by, for example, press working. In this case, a basic shape is formed by punching, and of the basic shape, a plate-like member corresponding to the heat sink 7 is bent so as to protrude in a direction substantially orthogonal to the plane portion of the annular member 8a. Will be.
[0024]
FIG. 1C shows a cross-sectional view of the stem 1 shown in FIG. In the heat sink frame 6, the annular member 8 a is disposed inside the base 2 integrally with the base 2, and the heat sink 7 is exposed from the upper surface of the base 2. Here, as shown in FIG. 1B, the extending portion 8b extends radially outward of the annular member 8a, and the distal end surface of the extending portion 8b is shown in FIG. 1A. Thus, the exposed portion 8c is exposed on the side surface of the base 2. More specifically, when the exposed portion 8c is viewed in the circumferential direction of the side surface of the base 2, the exposed portion 8c is not disposed all around the side surface of the base 2, It is partly arranged.
[0025]
By providing the exposed portion 8c, the heat radiation effect of the stem 1 can be enhanced. Specifically, part of the heat transmitted from the semiconductor element 9 to the heat sink 7 is radiated from the heat sink 7. Although the heat from the heat sink 7 is also transmitted to the base 2, the base 2, which is a resin mold, has low heat dissipation, and the base 2 itself cannot exert a sufficient heat dissipation effect. In the present embodiment, the heat transmitted to the heat sink 7 is also transmitted to the extending portion 8b via the annular member 8a, and is radiated from the exposed portion 8c facing the outside air, thereby improving heat radiation. Since the exposed portion 8c is disposed on the side surface of the base 2, even when a cap is attached so as to cover the upper surface of the base 2, a sufficient heat radiation effect can be exerted (see FIG. 6).
[0026]
Further, the presence of the heat sink frame 6 not only improves the heat dissipation, but also improves the mechanical strength of the stem 1. In particular, in the configuration in which the ring-shaped annular member 8a is provided as in the present embodiment, the annular member 8a is arranged over the entire circumferential direction of the base 2, which is advantageous for securing strength. Further, the heat resistance is also improved, and the reliability against the temperature rise during use is increased.
[0027]
If the heat sink frame 6 improves the mechanical strength and heat resistance, there is an advantage that the choice of the material for the resin mold of the base 2 is increased. That is, even if the strength and heat resistance of the base 2 are reduced by providing the heat sink frame 6, if this is supplemented by the heat sink frame 6, the overall strength and heat resistance of the base 2 can be secured. You can do so.
[0028]
For example, in some cases, the material of the resin mold may be replaced with a thermosetting resin and a thermoplastic resin that is inexpensive may be used. Examples of the thermosetting resin include an epoxy resin, and examples of the thermoplastic resin include ABS (acrylonitrile butadiene styrene), PPS (polyphenylene sulfide), PEEK (polyether ether ketone), and LCP (liquid crystal polyester). is there.
[0029]
Here, when the stem 1 according to the present embodiment is compared with the conventional example shown in FIG. 7, the configuration shown in FIG. 7 is such that the stem 100 is formed over the entire periphery of the back plate 102 which is a resin base. Since it is exposed, the exposed area becomes large, and a wide range of corrosion prevention treatment such as rust prevention is required. In the stem according to the present embodiment, the exposed portion 8c of the extension portion is a part of the entire periphery of the side surface of the base 2, so that the range of the corrosion prevention treatment can be significantly reduced. In particular, if the exposed portion 8c is made substantially the same as the outer peripheral side surface of the base 2, the range of the corrosion prevention treatment can be further reduced. In addition, since it does not expand in the radial direction of the base 2, it is advantageous in reducing the size of the stem 1.
[0030]
Further, in the configuration of FIG. 7, since the cap 103 is joined to the stem 100, when the stem 100 and the cap 103 are welded, the material of the stem 100 is limited to a weldable iron material or the like. Become. On the other hand, the stem 11 according to the present embodiment has a high degree of freedom in material selection because the extension does not join the cap, and as described above, both the electrical conductivity and the heat dissipation Copper or the like which is excellent in quality. If a copper material that is more advantageous in corrosion resistance than an iron material is used, it becomes possible to eliminate the need for a corrosion prevention treatment of an exposed portion.
[0031]
(Embodiment 2)
Hereinafter, an embodiment of a method for manufacturing a stem will be described with reference to FIGS. FIG. 2 shows an overall view of the manufacturing process of the stem. In the process shown in FIG. 2, each of the first pressing process 10, the forming process 20, and the second pressing process 30 is continuous. That is, the band-shaped plate 13 unwound from the unwind reel 12 installed on the reel stand is sequentially fed to each step, and is wound on the take-up reel 15 installed on the reel stand while being processed in each step. Go.
[0032]
Hereinafter, description will be made in the order of steps. In the first press step 10, a press machine 11 presses a plate 13 unwound from an unwind reel 12. When the plate 13 is wound around the unwinding reel 12, the plate 13 is a flat band-shaped member, and is pressed into a predetermined shape by the press machine 11.
[0033]
FIG. 3 shows a perspective view of the plate 13 after the press working. The plate 13, which is a flat band-shaped member, is subjected to press working to form a heat sink frame 14 in which a frame 15 and a plate-shaped heat sink 16 are integrated, leaving both ends 13 a. The frame 15 is formed by integrating an annular portion 15a and an extending portion 15b that extends outward in the radial direction of the annular portion 15a, that is, outward in the surface direction.
[0034]
The heat sink 16 is bent so as to project in a direction substantially perpendicular to the plane portion of the annular portion 15a. Since the plates 13 are sequentially and continuously sent to the press 11 in the direction of arrow a, the shapes shown in FIG. 3 are sequentially formed at positions separated by a predetermined interval for each press working.
[0035]
When the processing in the first pressing step 10 is completed, the process proceeds to the forming step 20. In the molding step 20, the molding machine 17 forms a resin mold as a base. The lead terminals 19 are supplied into the molding die of the molding machine 17 by the parts feeder 18. With the lead terminals 19 arranged at predetermined positions, the resin material is supplied into the molding die. FIG. 4 is a perspective view showing a state after completion of molding. The lead terminal 19, the heat sink 16, and the extension 15b are integrated with the base 21 which is a resin mold, and the annular part 15a is also integrated inside the base 21.
[0036]
Although not shown in the drawing, a lead is formed near the heat sink 16 in the flat portion of the annular portion 15a in a state before the resin mold is formed by a welding machine arranged between the pressing step 10 and the forming step 20. The terminal 22 is joined (see the lead terminal 5 in FIG. 1C).
[0037]
When the molding step 20 is completed, the process proceeds to the second pressing step 30. In the second pressing step 30, the extension portion 15b is cut by the press machine 21, and the base body 21 is separated from both end portions 13a. FIG. 5 is a perspective view showing a state in which the base 21 is separated, and a part of the extension portion 15b cut by the cut surface 15c is left at both end portions 13a.
[0038]
The plate 13 from which the base 21 has been separated is taken up by the take-up reel 15, and the stem 27 separated from the plate 13 is carried out of the press machine 21. These stems 27 will be aligned on a pallet by an alignment machine (not shown) in an alignment step 40.
[0039]
Although not shown, a semiconductor element bonding step may be provided after the molding step, and the semiconductor element may be bonded to the heat sink 16 using a bonding machine. Further, the semiconductor element bonding step may be omitted, and the bonding of the semiconductor elements may be performed after the stem 27 is once manufactured.
[0040]
When a semiconductor element is joined before the production of the stem 27, a semiconductor element joining step is provided in the manufacturing process of the stem. Therefore, the stem 27 obtained through the second pressing step 30 is half-mounted on the heat sink 16. The conductive elements are joined. That is, this manufacturing method is also a method for manufacturing the stem 27 and a method for manufacturing an electronic component in which the semiconductor element is joined to the stem 27.
[0041]
In the manufacturing method according to the present embodiment, the electronic component stem is produced while sequentially feeding the band-shaped plate 13 to each step. Therefore, each step is continuous via the plate 13, and the electronic component stem is continuously connected. It has excellent productivity and reduces manufacturing costs.
[0042]
(Embodiment 3)
Embodiment 3 relates to an electronic component using a stem. FIG. 6 is a sectional view of a semiconductor laser device using the stem 1 according to the first embodiment. The semiconductor laser device 23 shown in this figure is obtained by adding the components described below after manufacturing the stem 1 by the manufacturing method described in the second embodiment.
[0043]
A semiconductor laser element 9 is fixed to a heat sink 7 of the stem 1. The semiconductor laser element 9 and the lead terminals 3 and 4 are joined by thin metal wires by wire bonding. A light receiving element 24 is mounted on the stem 1 in addition to the semiconductor laser element 9 as a light emitting element.
[0044]
After the mounting of the additional components on the upper surface of the stem 1 is completed, the cap 25 is mounted on the upper surface of the stem 1 to complete the semiconductor laser device 23. The light transmission plate 26 may be joined to the opening 25a of the cap 25 in some cases. Even if the cap 25 is attached, the exposed portion 8c of the heat sink frame 8 is still in contact with the outside air, so that the heat dissipation is not hindered.
[0045]
Although the description has been given of the example of the semiconductor laser device, the stem of the present invention may be used by mounting an element of another electronic component. Since the stem of the present invention is excellent in heat radiation effect, it is particularly suitable for mounting a high output light emitting element, and may be used as a stem for a high output light emitting diode, for example.
[0046]
Further, in each of the above embodiments, the example of the shape of the frame portion of the heat sink frame has been described as being annular, but the present invention is not limited to this. For example, the outer peripheral shape may be polygonal. In addition, if the heat sink portion and the extension portion are connected, an effect of improving heat dissipation can be exhibited, and the frame portion may be, for example, substantially U-shaped, substantially V-shaped, substantially U-shaped, or semi-annular. It may be.
[0047]
In addition, although the example in which the extending portion integrated with the frame portion is two has been described, the present invention is not limited to this, and may be appropriately determined according to a required heat radiation effect.
[0048]
Further, although the example in which the exposed portion of the heat sink frame on the side surface of the base is substantially flush with the outer peripheral side surface of the base has been described, the exposed portion may be projected from the outer peripheral side surface. In this case, it is disadvantageous for miniaturization, but the projection amount can be slightly suppressed unless the cap is joined to the exposed portion.
[0049]
【The invention's effect】
As described above, according to the electronic component stem and the electronic component of the present invention, since the heat sink frame in which the frame exposed on a part of the entire periphery of the side surface of the base and the heat sink are provided, the heat dissipation is improved. , And strength, and the corrosion prevention treatment and the manufacture are easy.
[0050]
Further, according to the method for manufacturing an electronic component stem and the method for manufacturing an electronic component of the present invention, since the electronic component stem can be continuously produced, the productivity is excellent and the manufacturing cost can be reduced.
[Brief description of the drawings]
1A is a perspective view of an electronic component stem according to an embodiment of the present invention, FIG. 1B is a perspective view of the electronic component stem shown in FIG. 1A, FIG. FIG. 2 is a sectional view of an electronic component stem according to an embodiment of the present invention. FIG. 3 is a perspective view of a plate after a first pressing step according to an embodiment of the present invention. FIG. 4 is a perspective view of a substrate after a forming step according to one embodiment of the present invention. FIG. 5 is a perspective view of a plate after a second pressing step according to one embodiment of the present invention. FIG. 7 is a perspective view of an electronic component using the stem according to one embodiment. FIG. 7 is a perspective view showing an example of a conventional electronic component stem.
1, 27 Electronic component stem 2, 21 Base 3, 4, 5, 19, 22 Lead terminal 6, 14 Heat sink frame 7, 16 Heat sink 8, 15 Frame 8b, 15b Extension 8c Exposed portion 9 Semiconductor element 10 First Press process 20 forming process 30 second press process forming process 40 alignment process

Claims (9)

A heat sink frame in which a frame and a heat sink protruding from the frame are integrated, a base formed of a resin member, and a plurality of lead terminals,
The heat sink frame and the plurality of lead terminals are integrated with the base,
The frame has an exposed portion exposed from the base, and when the exposed portion is viewed in a circumferential direction of a side surface of the base, the exposed portion is disposed on a part of the entire circumference of the side surface of the base. A stem for electronic components, characterized by: The electronic component stem according to claim 1, wherein the frame has an annular portion and an extending portion extending from the annular portion, and the extending portion is exposed from the base. 3. The electronic component stem according to claim 2, wherein the heat sink is a plate-shaped member, and the plate-shaped member protrudes in a direction substantially orthogonal to a plane portion of the annular portion. 2. The electronic component stem according to claim 1, wherein the exposed portion and a side surface of the base are substantially flush with each other. An electronic component using the electronic component stem according to claim 1, wherein an element of the electronic component is fixed to the heat sink. The electronic component according to claim 5, wherein a cap is further mounted on a side of the base where the heat sink is located. The band-shaped plate is pressed to form a heat sink frame in which a frame in which the extending portions extending in the surface direction are integrated, and a heat sink projecting in a direction substantially perpendicular to the surface direction of the frame are formed. Process and
Forming a resin-molded base in which the lead terminals and the heat sink frame are integrated,
Cutting the extension portion to separate the substrate from the plate,
Forming the heat sink frame and the base at a predetermined interval between both end portions in a direction orthogonal to the direction of the forward feeding, of the band-shaped plate while feeding the band-shaped plate sequentially to the respective steps. A method for manufacturing a stem for electronic components, which is a feature of the present invention. A method for manufacturing an electronic component, comprising the method for manufacturing an electronic component stem according to claim 7, further comprising a step of fixing an element of the electronic component to the heat sink. The method for manufacturing an electronic component according to claim 8, further comprising: attaching a cap to the side of the electronic component stem where the heat sink is located.

Images