JP2004311917A - Light emitting element storage package and light emitting device - Google Patents

Abstract

An object of the present invention is to efficiently reflect light emitted from a light-emitting element, and to efficiently converge and emit the light to the outside.
The light emitting element housing package has a concave portion for accommodating the light emitting device on an upper surface of an insulating base, a mounting portion on which the light emitting element is mounted on a bottom surface of the concave portion, and a light emitting device. 3 is formed so that the wiring layer 5b to which the three electrodes are electrically connected is formed, and the concave portion 4 is inclined such that the inner peripheral surface extends outward from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1. The metal frame 8 is fitted, and the frame 8 is provided with a tilt angle changing portion 8a such that the upper side of the inner peripheral surface has a larger tilt angle than the lower side.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a display device or the like using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Reference 1). As shown in FIG. 1, the conventional package is formed by laminating a plurality of ceramic layers and has a concave portion 14 formed on the upper surface. It is mainly composed of a base 11 provided with a mounting portion 12 made of a conductor layer, and a pair of wiring layers 15 formed on the lower surface of the base 11 from the mounting portion 12 of the base 11 and its periphery.
[0003]
The light emitting element 13 is mounted and fixed on the mounting portion 12 to which one end of the one wiring layer 15 is electrically connected via a conductive adhesive, solder or the like, and the electrode of the light emitting element 13 is connected to the other wiring. The light emitting device is manufactured by electrically connecting the conductor 15 with the bonding wire 16 and then filling the concave portion 14 of the base 11 with a transparent resin (not shown) and sealing the light emitting element 13. .
[0004]
In order to reflect the light of the light emitting element 13 on the inner peripheral surface of the concave portion 14 and emit the light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the concave portion 14. The metal layer 17 made of a metallized layer on the surface may be applied.
[0005]
The above package is manufactured by the ceramic green sheet laminating method as follows. First, a ceramic green sheet (hereinafter, also referred to as a green sheet) for forming the mounting portion 12 (below the mounting portion 12) of the base 11 and a green sheet for forming the concave portion 14 of the base 11 are prepared. Through holes for forming the wiring conductors 15 and the recesses 14 are formed in these green sheets by a punching method.
[0006]
Next, a conductor paste for forming a wiring layer 15 made of a metallized layer is printed and applied by a screen printing method or the like on the through-holes and predetermined portions of the laminate A of the green sheets for forming the mounting portion 12, and the concave portions are formed. When a metallized layer is applied to the inner peripheral surface of the metal layer 14, a conductive paste for forming the metal layer 17 is printed and applied to the inner surface of the through hole of the green sheet laminate B for forming the concave portion 14 by a screen printing method or the like.
[0007]
Next, the laminates A and B are overlapped and bonded to form a laminate for forming the base 11, which is cut into a predetermined size to form a molded body, fired at a high temperature (about 1600 ° C.) and sintered. Make up with the body. Thereafter, a package is manufactured by applying a plating metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring layer 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
[0008]
[Patent Document 1]
JP-A-2002-232017
[Problems to be solved by the invention]
However, in the above-mentioned conventional package, the conductive paste is printed and applied to the inner peripheral surface of the concave portion 14 by a screen printing method to form the metal layer 17. The thickness of the metal layer 17 is likely to be different between the upper side and the lower side of the peripheral surface, and it is difficult to form the metal layer 17 at a desired uniform angle on the inner peripheral surface of the concave portion 14. . In addition, there is a problem that the surface roughness of the metal layer 17 tends to vary. Therefore, there is a problem that the light emitted from the light emitting element 13 is efficiently reflected and it is difficult to uniformly radiate the light to the outside.
[0010]
In addition, since the angle of the inner peripheral surface of the concave portion 14 is formed at a constant angle, the package is easy to increase in size, and a region for reflecting the light emitted by the light emitting element 13 in a substantially constant direction (in the optical axis direction). There is a problem that it is difficult to radiate the light by widening the area which is substantially parallel light on the orthogonal plane.
[0011]
Therefore, the present invention has been completed in view of the above-described conventional problems, the purpose is to reflect the light emitted by the light emitting element satisfactorily, and can radiate uniformly and efficiently to the outside, An object of the present invention is to provide a small-sized package for housing a light-emitting element and a light-emitting device, which can emit light with a large area reflected in a substantially constant direction and can thereby achieve extremely high luminous efficiency.
[0012]
[Means for Solving the Problems]
In the light emitting element housing package of the present invention, a concave portion for housing the light emitting element is provided on the upper surface of the insulating base, and the mounting portion on which the light emitting element is mounted and the electrode of the light emitting element are electrically connected to the bottom surface of the concave portion. Wherein the recess is inclined such that an inner peripheral surface extends outward from a bottom surface of the recess toward an upper surface of the insulating base. Metal frame is fitted, and the frame is provided with a tilt angle changing portion such that the upper side of the inner peripheral surface has a larger tilt angle than the lower side. In the light-emitting element housing package of the present invention, the concave portion provided on the upper surface of the insulating base is a metal frame in which the inner peripheral surface is inclined so as to spread outward from the bottom surface of the concave portion toward the upper surface of the insulating substrate. The body is fitted and the frame is Since the inclination angle changing portion is provided such that the upper side of the surface has a larger inclination angle than the lower side, it is possible to radiate the light from the light emitting element with a wider area for reflecting the light in a substantially constant direction. At the same time, the light of the light emitting element can be reflected well on the inner peripheral surface of the metal frame without being affected by the surface condition of the inner peripheral surface of the concave portion, and can be efficiently condensed and emitted to the outside. A small light emitting element storage package can be obtained.
[0013]
In the light-emitting element housing package according to the present invention, preferably, the frame is made of any one of aluminum, silver, gold, palladium and platinum.
[0014]
In the light-emitting element housing package of the present invention, preferably, the frame is made of any one of aluminum, silver, gold, palladium, and platinum, so that the light of the light-emitting element can be reflected more favorably by the frame. The light can be efficiently and externally condensed and emitted.
[0015]
In the light-emitting element housing package according to the present invention, preferably, the frame has a metal layer made of any one of aluminum, silver, gold, palladium and platinum adhered to the surface.
[0016]
In the light-emitting element housing package according to the present invention, preferably, the frame has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium, and platinum. The light can be reflected better by the applied metal layer, and can be emitted to the outside efficiently and more condensed.
[0017]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on the mounting portion and having an electrode electrically connected to the wiring layer, and a transparent resin covering the light-emitting element. It is characterized by having.
[0018]
With the above structure, the light emitting device of the present invention has high luminous efficiency and high performance, which can reflect the light of the light emitting element satisfactorily, and can efficiently collect and emit the light to the outside.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of an embodiment of the package of the present invention, and FIG. 2 is a plan view of the package of FIG. In these figures, 1 is an insulating base, 2 is a mounting portion of the light emitting element 3, 3 is a light emitting element, and 4 is a recess for accommodating the light emitting element 3.
[0020]
In the package of the present invention, a concave portion 4 for accommodating the light emitting element 3 is provided on the upper surface of the insulating base 1, and the mounting portion 2 on which the light emitting element 3 is mounted on the bottom surface of the concave portion 4 and the electrode of the light emitting element are electrically connected. The concave portion 4 is formed of a metal whose inner peripheral surface is inclined so as to spread outward from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1. The frame body 8 is fitted therein, and the frame body 8 is provided with a tilt angle changing portion 8a such that the upper side of the inner peripheral surface has a larger tilt angle than the lower side.
[0021]
The insulating substrate 1 according to the present invention is made of ceramic or resin, and when made of ceramic, for example, aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, glass ceramic sintered body, etc. It has a rectangular parallelepiped box shape formed by laminating a plurality of insulating layers made of ceramics, and a concave portion 4 for accommodating the light emitting element 3 is formed at the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is mixed with an appropriate organic binder, a solvent, and the like to form a slurry. A green sheet (green ceramic sheet) is obtained by forming the sheet into a sheet shape by a well-known doctor blade method, a calendar roll method, or the like. Thereafter, a through hole for the recess 4 is formed in the green sheet by punching, and the light emitting element is formed. A plurality of green sheets for mounting 3 and a plurality of green sheets for recesses 4 are laminated, fired at a high temperature (about 1600 ° C.), and integrated.
[0022]
A mounting portion 2 for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag), or the like. Consists of a metallized layer of metal powder.
[0023]
Further, the insulating base 1 is provided with wiring layers 5a and 5b formed on the lower surface of the insulating base 1 from the mounting portion 2 and the periphery thereof. The wiring layers 5a and 5b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5b via the bonding wire 6. Then, the wiring layers 5 a and 5 b on the lower surface of the base 1 are electrically connected to the respective electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and a driving signal are supplied to the light emitting element 3. . Further, the light emitting element 3 may be connected to the mounting section 2 and the wiring layer 5b by flip chip mounting.
[0024]
The wiring layers 5a and 5b are formed by applying a metal paste obtained by adding and mixing an appropriate organic solvent and a solvent to a metal powder such as W or Mo onto a green sheet serving as the substrate 1 in a predetermined pattern by a screen printing method in advance. By doing so, it is formed at a predetermined position on the base 1.
[0025]
It is preferable that a metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, be applied to the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. In addition, it is possible to effectively prevent the wiring layers 5a and 5b and the mounting portion 2 from being oxidized and corroded, to fix the mounting portion 2 to the light emitting element 3 and to join the wiring layer 5b and the bonding wire 6 to the wiring layers 5a and 5b. And the connection with the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method. More preferably, they are sequentially applied by an electroless plating method.
[0026]
In the present invention, the recess 4 is fitted with a metal frame 8 whose inner peripheral surface is inclined so as to expand outward from the bottom surface of the recess 4 toward the upper surface of the insulating base 1. The body 8 is provided with a tilt angle changing portion 8a so that the upper side of the inner peripheral surface has a larger tilt angle than the lower side. This allows the light of the light emitting element 3 to be emitted in a wide area in which the light of the light emitting element 3 is reflected in a substantially constant direction, and allows the light of the light emitting element 3 to be transmitted to the metal without being affected by the surface condition of the inner peripheral surface of the recess 4. It is possible to obtain a small package that can be reflected well on the inner peripheral surface of the frame 8 made of the same and efficiently condensed and emitted to the outside. The frame 8 may be fitted to the inner peripheral surface of the concave portion 4 with a resin adhesive, or a metallized layer for bonding may be formed on the inner peripheral surface of the concave portion 4 and brazed by Ag brazing or the like. They may be joined. Further, after the light emitting element 3 is accommodated in the concave portion 4 and the electrical connection is made via the bonding wire 6 or the like, the inner peripheral surface of the frame 8 is covered together with the light emitting element 3 by the transparent resin sealed in the concave portion 4. And the frame 8 may be fitted in the recess 4.
[0027]
The arithmetic mean roughness Ra of the inner peripheral surface of the through hole of the frame 8 is preferably 1 to 3 μm. When the thickness is less than 1 μm, it is difficult to uniformly reflect the light of the light emitting element 3 accommodated in the recess 4, and the intensity of the reflected light tends to be uneven. When the thickness exceeds 3 μm, the light of the light emitting element 3 housed in the concave portion 4 is scattered, and it becomes difficult to converge the reflected light to the outside with a high reflectance and radiate it.
[0028]
The recess 4 into which the frame 8 is fitted may have a circular cross section, an oval shape, an elliptical shape, a square shape, or the like. Also, as shown in the cross-sectional view of the package of FIG. 3, the inner peripheral surface of the concave portion 4 and the outer peripheral surface of the frame body 8 are extended from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1 by 5 to 15. It is preferable to incline so as to have a slight angle of about ° (θ ₃ : about 85 to 95 °). In this case, a shape abnormality such as slight deformation or warpage occurs on the inner peripheral surface or upper end of the concave portion 4. Even if this is done, the frame 8 can be easily inserted into the recess 4 without being significantly affected by this deformation, warping, or the like.
[0029]
Further, as shown in the cross-sectional view of the package in FIG. 4, an extended portion may be formed at the upper end of the frame 8 so as to be bent outward so as to extend to the upper surface of the insulating base 1. In this case, The position where the frame body 8 is fitted into the concave portion 4 in the vertical direction can be accurately positioned. Further, a gap can be formed between the lower surface of the frame 8 and the bottom of the concave portion 4, and the frame 8 comes into contact with the mounting portion 2 and the wiring layers 5a and 5b to cause a short circuit or the like. Can be prevented. Also, by forming the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the concave portion 4 at the gap, the area where these portions are formed can be widened. Further, the transparent resin covering the light emitting element 3 enters the gap, so that the transparent resin can be firmly adhered to the recess 4.
[0030]
Further, as shown in the cross-sectional view of the package of FIG. 5, a portion lower than the light emitting portion of the light emitting element 3 on the inner peripheral surface of the frame 8 may be formed so as to be orthogonal to the upper surface of the insulating base 1. In this case, the area of the bottom surface of the concave portion 4 increases, and the occurrence of a short circuit or the like due to the contact between the frame 8 and the mounting portion 2 and the wiring layer 5b can be prevented.
[0031]
In addition, a step is formed at the lower end of the inner peripheral surface of the concave portion 4 and is thicker than the thickness of the mounting portion 2 and the wiring layer 5b and protrudes toward the light emitting element 3, and the frame 8 is placed on the bottom surface of the step. You may do so. In this case, since the lower surface of the frame 8 is at a position higher than the mounting portion 2 and the wiring layer 5b formed on the bottom surface of the concave portion 4, the frame 8, the mounting portion 2 and the wiring layer 5b come into contact with each other and short-circuit. Can be prevented, and the lower surface of the frame 8 is joined to the step of the concave portion 4, so that the frame 8 can be firmly fitted. Further, as shown in the cross-sectional view of the package of FIG. 6, when the step extending from the inner peripheral surface of the recess 4 is made smaller than the width of the lower surface of the frame 8, the lower surface of the frame 8 Since the transparent resin that covers the light emitting element 3 enters into the gaps between the gaps, the transparent resin can be firmly adhered to the recesses 4.
[0032]
In the package of the present invention, the cross-sectional shape of the through hole of the frame 8 can be various shapes such as a circular shape, an elliptical shape, an elliptical shape, a square shape, and a polygonal shape. The light of the light emitting element 3 housed in the recess 4 can be uniformly reflected by the inner peripheral surface of the frame 8 and radiated uniformly and efficiently outside the wide area.
[0033]
In FIG. 2, a frame body 8 having a circular cross-sectional shape of the through hole is fitted to the inner peripheral surface of the concave portion 4 having a circular cross-sectional shape. The cross-sectional shape of the through hole of the body 8 may be different. As shown in the plan view of the package of FIG. 7, a frame 8 having a circular cross-sectional shape of a through hole may be fitted into the concave portion 4 having a rectangular cross-sectional shape. As shown in the figure, a frame 8 having a rectangular cross-sectional shape of the through hole may be fitted into the concave portion 4 having a rectangular cross-sectional shape.
[0034]
When one change portion 8a is formed in the frame 8, the inclination angle of the recess 4 below the change portion 8 a of the frame 8 with respect to the bottom surface is 35 to 70 °, and the change portion 8 a of the frame is formed. The inclination angle of the recess 4 above the bottom surface with respect to the bottom surface is preferably 40 to 90 °.
[0035]
If the inclination angle below the changing portion 8a of the frame body 8 exceeds 70 °, it tends to be difficult to satisfactorily reflect the light of the light emitting element 3 housed in the concave portion 4 to the outside. If the angle is less than 35 °, the size of the frame 8 increases, and the size of the package increases.
[0036]
If the angle of inclination above the changing portion 8a of the frame is less than 40 °, the size of the frame 8 increases, and the size of the package increases. When the angle exceeds 90 °, the upper side of the inner peripheral surface of the frame 8 covers the recess 4, so that it is difficult for the light emitting element to emit the light of 3 to the outside.
[0037]
Further, in order to reflect the light of the light emitting element 3 on the inner peripheral surface of the concave portion 4 and efficiently radiate the light to the outside, the changing portion 8 a is located above the upper surface of the light emitting element 3 mounted on the mounting section 2. Preferably, there is. Further, when the number of the changing portions 8a is large, there may be a portion where the inclination angle of the inner peripheral surface of the frame 8 is the same above and below the changing portion 8a. Further, it is preferable that a portion having an inclination angle of 70 ° or less with respect to the bottom surface of the concave portion 4 is formed from a lower end portion of the frame 8 to a position above the upper surface of the light emitting element 3.
[0038]
Further, the frame 8 may be formed by a plurality of frame members with the change portion 8a as a boundary. For example, when one change portion 8a is formed in the frame 8, the frame 8 may be formed by a cross-sectional view of the package of FIG. As shown, two frame members 8b and 8c having different inclination angles of the inner peripheral surface may be formed by laminating. Further, as shown in the cross-sectional view of the package in FIG. 10, the width of the lower surface of the upper frame member 8c is made smaller than the width of the upper surface of the lower frame member 8b. However, the upper frame member 8c may be prevented from protruding to the light emitting element 3 side from the lower frame member 8b. Thus, the light of the light emitting element 3 can be prevented from being blocked or reflected on the lower surface of the projecting frame member 8c, so that the light can be uniformly and efficiently condensed and emitted to the outside.
[0039]
Further, it is preferable that the frame body 8 has a higher light reflectivity at the upper side than at the lower side of the changing section 8a above the light emitting section. That is, light is more likely to be weaker on the upper side than on the lower side since the upper side is farther from the light emitting section than the changing section 8a. Therefore, the upper surface can be made higher in reflectance than the lower surface by polishing the upper surface or forming a metal layer having a higher reflectance. When the frame 8 is composed of a plurality of frame members, the upper frame member may have higher reflectivity than the lower frame member.
[0040]
Further, since the frame 8 is preferably made of any one of aluminum, silver, gold, palladium and platinum, the light of the light emitting element 3 can be reflected more favorably by the frame 8 and efficiently and externally. It is possible to radiate the light more focused. In particular, the frame body 8 is preferably made of aluminum. In this case, the frame body 8 is hardly oxidized and corroded, and the fluctuation of the light reflectance due to the fluctuation of the light wavelength of the light emitting element 3 is reduced. Can be used.
[0041]
Further, as the frame 8, aluminum (coefficient of thermal expansion of about 23.5 × 10 ⁻⁶ / ° C.), silver (coefficient of thermal expansion of about 19.1 × 10 ⁻⁶ / ° C.), gold (coefficient of thermal expansion of about 14 .1 × 10 ⁻⁶ / ° C.), palladium (coefficient of thermal expansion of about 11.8 × 10 ⁻⁶ / ° C.) or platinum (coefficient of thermal expansion of about 8.8 × 10 ⁻⁶ / ° C.) A metal plate having a coefficient of thermal expansion between the insulating base 1 and the frame 8 may be interposed between the insulating base 1 and the frame 8. For example, when the insulating base 1 is made of alumina ceramics (coefficient of thermal expansion of about 7 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / ° C.) or the like, it is generated due to a difference in the thermal expansion coefficient between the insulating base 1 and the frame 8. Fe-Ni-Co alloy (coefficient of thermal expansion of about 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.) between the insulating substrate 1 and the frame 8 to reduce the thermal stress (Thermal coefficient of thermal expansion is about 6 × 10 ^{−6 to} 11 × 10 ⁻⁶ / ° C.). Accordingly, thermal stress generated due to a difference in thermal expansion coefficient between the insulating base 1 and the frame 8 can be reduced, and peeling of the frame 8 can be effectively prevented.
[0042]
The frame 8 may be an alloy containing aluminum, silver, gold, palladium or platinum as a main component.
[0043]
Further, the frame 8 in the present invention preferably has a metal layer 8d made of any of aluminum, silver, gold, palladium or platinum adhered to the surface, and the light of the light emitting element 3 is applied to the frame 8. The light can be satisfactorily reflected by the attached metal layer 8d, and can be efficiently and externally condensed and emitted. As shown in FIG. 11, such a frame 8 has a metal layer 8d made of any of aluminum, silver, gold, palladium or platinum adhered to the inner peripheral surface of the frame 8. In particular, the metal layer 8d is preferably made of aluminum, and is unlikely to cause problems such as oxidation corrosion and migration, and the change in the light reflectance due to the change in the light wavelength of the light emitting element 3 is reduced. Can be used.
[0044]
Further, it is preferable that the frame 8 be made of a material having a thermal expansion coefficient close to that of the insulating base 1. For example, the insulating base 1 is made of alumina ceramics (coefficient of thermal expansion of about 7 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / ° C.), and the frame 8 is made of Fe—Ni having a thermal expansion coefficient close to that of the insulating base 1. If a -Co alloy (coefficient of thermal expansion of about 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.) or the like is used, peeling of the frame body 8 can be effectively prevented. When the metal layer 8d is attached to such a frame 8, the frame 8 can be firmly fitted to the insulating base 1, and the light-emitting element 3 can have high reflectance with respect to light.
[0045]
Further, the metal layer 8d may be attached only to the surface (inner peripheral surface) of the frame 8 on the light emitting element 3 side, or may be attached to the entire surface of the frame 8.
[0046]
The metal layer 8d may be an alloy layer containing aluminum, silver, gold, palladium, or platinum as a main component.
[0047]
The light emitting device of the present invention includes a package of the present invention, a light emitting element 3 mounted on the mounting portion 2 and having an electrode electrically connected to the wiring layer 5b, and a transparent resin such as a silicone resin covering the light emitting element 3. Is provided. Accordingly, the light from the light emitting element 3 can be satisfactorily reflected, efficiently condensed and emitted to the outside, and can be emitted with high luminous efficiency. The transparent resin covering the light emitting element 3 may cover only the light emitting element 3 and its surroundings, or may be filled in the recess 4 to cover the light emitting element 3.
[0048]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package of FIG. 13, the light emitting element 3 is directly mounted on the bottom surface of the concave portion 4 without forming the mounting portion 2 as a conductor layer, and the electrodes of the light emitting element 3 are electrically connected to the periphery thereof. May be formed. In this case, the light emitting element 3 is mounted on the mounting section 2, and the electrodes of the light emitting element 3 are electrically connected to the wiring layers 5a and 5b via the bonding wires 6a and 6b. Further, a plurality of light emitting elements 3 may be mounted, or a plurality of wiring layers may be formed.
[0049]
【The invention's effect】
In the light-emitting element housing package of the present invention, the concave portion is fitted with a metal frame that is inclined such that the inner peripheral surface extends outward from the bottom surface of the concave portion toward the upper surface of the insulating base. Since the body is provided with a change portion of the inclination angle such that the upper side of the inner peripheral surface has a larger inclination angle than the lower side, the area for reflecting the light of the light emitting element in a substantially constant direction is widened. While being able to radiate, the light of the light emitting element is well reflected by the inner peripheral surface of the metal frame without being affected by the surface condition of the inner peripheral surface of the concave portion, and is efficiently concentrated more to the outside. A small light-emitting element housing package that can emit light can be obtained.
[0050]
In the light-emitting element housing package of the present invention, preferably, the frame is made of any one of aluminum, silver, gold, palladium, and platinum, so that the light of the light-emitting element can be reflected more favorably by the frame. The light can be efficiently and externally condensed and emitted.
[0051]
In the light-emitting element housing package according to the present invention, preferably, the frame has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium, and platinum. The light can be reflected better by the applied metal layer, and can be emitted to the outside efficiently and more condensed.
[0052]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on a mounting portion and having an electrode electrically connected to a wiring layer, and a transparent resin covering the light-emitting element. Accordingly, the light from the light-emitting element can be reflected well, and can be efficiently condensed and emitted to the outside.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a plan view of the light emitting element housing package of FIG. 1;
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 6 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 7 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 8 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 9 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 10 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 11 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 12 is a cross-sectional view of a conventional light emitting element storage package.
FIG. 13 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
[Explanation of symbols]
1: Insulating base 2: Mounting part 3: Light emitting element 4: Depressions 5a, 5b: Wiring layer 8: Frame 8a: Change part

Claims (4)

A concave portion for accommodating the light emitting element is provided on the upper surface of the insulating base, and a mounting portion on which the light emitting element is mounted and a wiring layer for electrically connecting the electrode of the light emitting element are formed on the bottom surface of the concave portion. Wherein the recess is fitted with a metal frame whose inner peripheral surface is inclined so as to expand outward from the bottom surface of the recess toward the upper surface of the insulating base. The frame body is provided with a change portion of the inclination angle such that the upper side of the inner peripheral surface has a larger inclination angle than the lower side. The light emitting element storage package according to claim 1, wherein the frame is made of one of aluminum, silver, gold, palladium, and platinum. 3. The package for housing a light-emitting element according to claim 1, wherein a metal layer made of any one of aluminum, silver, gold, palladium and platinum is adhered to a surface of the frame. A light-emitting element storage package according to any one of claims 1 to 3, a light-emitting element mounted on the mounting portion and having an electrode electrically connected to the wiring layer, and a transparent covering the light-emitting element. A light-emitting device comprising: a resin.

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