JP2004307868A - New episulfide compound - Google Patents
New episulfide compound Download PDFInfo
- Publication number
- JP2004307868A JP2004307868A JP2004146990A JP2004146990A JP2004307868A JP 2004307868 A JP2004307868 A JP 2004307868A JP 2004146990 A JP2004146990 A JP 2004146990A JP 2004146990 A JP2004146990 A JP 2004146990A JP 2004307868 A JP2004307868 A JP 2004307868A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- acid
- bis
- episulfide
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 episulfide compound Chemical class 0.000 title claims abstract description 86
- 150000001875 compounds Chemical class 0.000 claims abstract description 88
- 239000000463 material Substances 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229910052717 sulfur Inorganic materials 0.000 claims description 14
- 125000006841 cyclic skeleton Chemical group 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 125000004434 sulfur atom Chemical group 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 3
- 125000000623 heterocyclic group Chemical group 0.000 claims description 3
- 238000001723 curing Methods 0.000 description 25
- 150000003553 thiiranes Chemical group 0.000 description 25
- 239000004593 Epoxy Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- 125000000524 functional group Chemical group 0.000 description 19
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 18
- 239000002253 acid Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000002994 raw material Substances 0.000 description 15
- 230000005484 gravity Effects 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- IYPNRTQAOXLCQW-UHFFFAOYSA-N [4-(sulfanylmethyl)phenyl]methanethiol Chemical compound SCC1=CC=C(CS)C=C1 IYPNRTQAOXLCQW-UHFFFAOYSA-N 0.000 description 9
- 150000001412 amines Chemical class 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000001294 propane Substances 0.000 description 9
- 150000007513 acids Chemical class 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 238000000921 elemental analysis Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920006295 polythiol Polymers 0.000 description 8
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 8
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 7
- 238000000862 absorption spectrum Methods 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 7
- 238000001819 mass spectrum Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005160 1H NMR spectroscopy Methods 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 150000002170 ethers Chemical class 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- JOMNTHCQHJPVAZ-UHFFFAOYSA-N 2-methylpiperazine Chemical compound CC1CNCCN1 JOMNTHCQHJPVAZ-UHFFFAOYSA-N 0.000 description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical class C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000004075 alteration Effects 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- 150000003003 phosphines Chemical class 0.000 description 4
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 4
- QWBJWKRSPJKCPG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethylsulfanylmethyl)phenyl]methylsulfanylmethyl]oxirane Chemical compound C1OC1CSCC(C=C1)=CC=C1CSCC1CO1 QWBJWKRSPJKCPG-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 235000011054 acetic acid Nutrition 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 3
- HDFRDWFLWVCOGP-UHFFFAOYSA-N carbonothioic O,S-acid Chemical class OC(S)=O HDFRDWFLWVCOGP-UHFFFAOYSA-N 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- FQUYSHZXSKYCSY-UHFFFAOYSA-N 1,4-diazepane Chemical compound C1CNCCNC1 FQUYSHZXSKYCSY-UHFFFAOYSA-N 0.000 description 2
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- ZYZXXEKBDWCGED-UHFFFAOYSA-N 1-n,2-n-diethylbutane-1,2-diamine Chemical compound CCNCC(CC)NCC ZYZXXEKBDWCGED-UHFFFAOYSA-N 0.000 description 2
- VECZPMZNUKYYOJ-UHFFFAOYSA-N 1-n,2-n-diethylpropane-1,2-diamine Chemical compound CCNCC(C)NCC VECZPMZNUKYYOJ-UHFFFAOYSA-N 0.000 description 2
- WLZRPMGWZLCLGV-UHFFFAOYSA-N 1-n,2-n-dimethylbutane-1,2-diamine Chemical compound CCC(NC)CNC WLZRPMGWZLCLGV-UHFFFAOYSA-N 0.000 description 2
- XCFLRKJSDRTWON-UHFFFAOYSA-N 1-n,3-n-diethylbutane-1,3-diamine Chemical compound CCNCCC(C)NCC XCFLRKJSDRTWON-UHFFFAOYSA-N 0.000 description 2
- DKZBLXUAJDHZQQ-UHFFFAOYSA-N 1-n,3-n-dimethylbutane-1,3-diamine Chemical compound CNCCC(C)NC DKZBLXUAJDHZQQ-UHFFFAOYSA-N 0.000 description 2
- PIPWSBOFSUJCCO-UHFFFAOYSA-N 2,2-dimethylpiperazine Chemical compound CC1(C)CNCCN1 PIPWSBOFSUJCCO-UHFFFAOYSA-N 0.000 description 2
- CEUQYYYUSUCFKP-UHFFFAOYSA-N 2,3-bis(2-sulfanylethylsulfanyl)propane-1-thiol Chemical compound SCCSCC(CS)SCCS CEUQYYYUSUCFKP-UHFFFAOYSA-N 0.000 description 2
- LOIPCSUANZPEME-UHFFFAOYSA-N 2,5-bis(2-propylsulfanylthiiran-2-yl)-1,4-dithiane Chemical compound C1SC(C2(SC2)SCCC)CSC1C1(SCCC)CS1 LOIPCSUANZPEME-UHFFFAOYSA-N 0.000 description 2
- SDMYZIQYGCCLHR-UHFFFAOYSA-N 2,5-bis(thiiran-2-ylmethylsulfanylmethyl)-1,4-dithiane Chemical compound C1SC1CSCC(SC1)CSC1CSCC1CS1 SDMYZIQYGCCLHR-UHFFFAOYSA-N 0.000 description 2
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 2
- IFNWESYYDINUHV-UHFFFAOYSA-N 2,6-dimethylpiperazine Chemical compound CC1CNCC(C)N1 IFNWESYYDINUHV-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- NQLQMVQEQFIDQB-UHFFFAOYSA-N 2-(2-sulfanylethylsulfanyl)propane-1,3-dithiol Chemical compound SCCSC(CS)CS NQLQMVQEQFIDQB-UHFFFAOYSA-N 0.000 description 2
- MXZROAOUCUVNHX-UHFFFAOYSA-N 2-Aminopropanol Chemical compound CCC(N)O MXZROAOUCUVNHX-UHFFFAOYSA-N 0.000 description 2
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 2
- XUXZELZSNNYLRE-UHFFFAOYSA-N 2-[4-(2-aminoethyl)cyclohexyl]ethanamine Chemical compound NCCC1CCC(CCN)CC1 XUXZELZSNNYLRE-UHFFFAOYSA-N 0.000 description 2
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 2
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 2
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- KRPRVQWGKLEFKN-UHFFFAOYSA-N 3-(3-aminopropoxy)propan-1-amine Chemical compound NCCCOCCCN KRPRVQWGKLEFKN-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- POTQBGGWSWSMCX-UHFFFAOYSA-N 3-[2-(3-aminopropoxy)ethoxy]propan-1-amine Chemical compound NCCCOCCOCCCN POTQBGGWSWSMCX-UHFFFAOYSA-N 0.000 description 2
- JZPGWKJWVYMINX-UHFFFAOYSA-N 3-[4-(3-aminopropyl)cyclohexyl]propan-1-amine Chemical compound NCCCC1CCC(CCCN)CC1 JZPGWKJWVYMINX-UHFFFAOYSA-N 0.000 description 2
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 2
- UVLSCMIEPPWCHZ-UHFFFAOYSA-N 3-piperazin-1-ylpropan-1-amine Chemical compound NCCCN1CCNCC1 UVLSCMIEPPWCHZ-UHFFFAOYSA-N 0.000 description 2
- SHLSSLVZXJBVHE-UHFFFAOYSA-N 3-sulfanylpropan-1-ol Chemical compound OCCCS SHLSSLVZXJBVHE-UHFFFAOYSA-N 0.000 description 2
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- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 1
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- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- FWMUJAIKEJWSSY-UHFFFAOYSA-N sulfur dichloride Chemical class ClSCl FWMUJAIKEJWSSY-UHFFFAOYSA-N 0.000 description 1
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- HIFJUMGIHIZEPX-UHFFFAOYSA-N sulfuric acid;sulfur trioxide Chemical compound O=S(=O)=O.OS(O)(=O)=O HIFJUMGIHIZEPX-UHFFFAOYSA-N 0.000 description 1
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- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- PRIFGVOVRHAALC-UHFFFAOYSA-N tert-butyl 3,3-dimethylbutaneperoxoate Chemical compound CC(C)(C)CC(=O)OOC(C)(C)C PRIFGVOVRHAALC-UHFFFAOYSA-N 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- RFTGJEJQDSTVSI-UHFFFAOYSA-N thiiran-2-ylmethanol Chemical compound OCC1CS1 RFTGJEJQDSTVSI-UHFFFAOYSA-N 0.000 description 1
- ONXYYBNZRHGVOC-UHFFFAOYSA-N thiiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CS1 ONXYYBNZRHGVOC-UHFFFAOYSA-N 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- 150000003567 thiocyanates Chemical class 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- FPZZZGJWXOHLDJ-UHFFFAOYSA-N trihexylphosphane Chemical compound CCCCCCP(CCCCCC)CCCCCC FPZZZGJWXOHLDJ-UHFFFAOYSA-N 0.000 description 1
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 description 1
- IGNTWNVBGLNYDV-UHFFFAOYSA-N triisopropylphosphine Chemical compound CC(C)P(C(C)C)C(C)C IGNTWNVBGLNYDV-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- VYNGFCUGSYEOOZ-UHFFFAOYSA-N triphenylphosphine sulfide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=S)C1=CC=CC=C1 VYNGFCUGSYEOOZ-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- LFNXCUNDYSYVJY-UHFFFAOYSA-N tris(3-methylphenyl)phosphane Chemical compound CC1=CC=CC(P(C=2C=C(C)C=CC=2)C=2C=C(C)C=CC=2)=C1 LFNXCUNDYSYVJY-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
本発明のエピスルフィド化合物は、プラスチックレンズ、プリズム 、光ファイバー、情報記録基盤、フィルター等の光学材料、中でも、眼鏡用プラスチックレンズの原料として好適に使用される。 The episulfide compound of the present invention is suitably used as a raw material for plastic lenses, prisms, optical fibers, information recording substrates, filters, and other optical materials, particularly, plastic lenses for eyeglasses.
プラスチック材料は軽量かつ靱性に富み、また染色が容易であることから、各種光学材料、特に眼鏡レンズに近年多用されている。従来技術における初期の代表的なプラスチック材料は、ジエチレングリコールビスアリルカーボネート、該ビスアリルカーボネートとジアリルフタレート、各種メタクリレート類等の化合物を重合して得られるものであった。これらは、屈折率が1.5から1.55程度でありこのためレンズの肉厚が厚くなり、結果として軽量性が失われていた。このため、高屈折率を有する材料が望まれ、屈折率を1.6あるいはこれ以上とする種々の努力がこれまでになされてきた。既にクロル、ブロム原子を含むメタクリレート化合物の重合体、ブロム原子を含むヒドロキシ化合物とイソシアネート化合物との反応により得られるウレタン構造を有する熱硬化型光学材料(特開昭58−164615号公報等)が提案されている。しかしながら、クロル、ブロム原子を含む化合物を用いた場合は比重が大となり、この場合も軽量性が損なわれる結果となった。このため、ポリチオール化合物とポリイソシアネート化合物との反応により得られるチオウレタン構造を有する熱硬化型光学材料が特公平4−58489号公報、特開平5−148340号公報に提案されている。 BACKGROUND ART Plastic materials are lightweight and rich in toughness, and are easily used for dyeing. Therefore, plastic materials are widely used in recent years for various optical materials, particularly for spectacle lenses. An early representative plastic material in the prior art was obtained by polymerizing compounds such as diethylene glycol bisallyl carbonate, the bisallyl carbonate, diallyl phthalate, and various methacrylates. These have a refractive index of about 1.5 to 1.55, so that the thickness of the lens is increased, and as a result, lightness is lost. Therefore, a material having a high refractive index is desired, and various efforts have been made to increase the refractive index to 1.6 or more. A polymer of a methacrylate compound containing a chloro or bromine atom and a thermosetting optical material having a urethane structure obtained by reacting a hydroxy compound containing a bromine atom with an isocyanate compound (JP-A-58-164615, etc.) have been proposed. Have been. However, when a compound containing a chloro or bromine atom is used, the specific gravity becomes large, and in this case also, the lightness is impaired. For this reason, thermosetting optical materials having a thiourethane structure obtained by reacting a polythiol compound with a polyisocyanate compound have been proposed in Japanese Patent Publication No. 4-58489 and Japanese Patent Application Laid-Open No. 5-148340.
またこれらのチオウレタンの原料となる新規なポリチオール化合物も種々提案されている。すなわち、特開平5−148340号公報には一分子中に硫黄原子を4個有する分岐型ポリチオール化合物が、特開平2−270859号公報には一分子中に硫黄原子を5個有する分岐型ポリチオール化合物が、特開平6−192250号公報には分子中にジチアン環構造有するポリチオール化合物が提案されている。さらには、公知のアミン系エポキシ樹脂、フェノール系エポキシ樹脂、アルコール系エポキシ樹脂、不飽和化合物系エポキシ樹脂、グリシジルエステル系エポキシ樹脂、ウレタン系エポキシ樹脂、脂環式エポキシ樹脂等エポキシ化合物のエポキシ基の一部または全部をエピスルフィド基に変換した化合物を用いたレンズ材料の製造方法が特開平3−81320号公報に提案されている。ポリチオール化合物とポリイソシアネート化合物より得られる、チオウレタン樹脂レンズは、最大1.66程度の屈折率が可能となった。しかしながら、公知のエポキシ樹脂から誘導されるエピスルフィド化合物より得られるエピスルフィド樹脂レンズは屈折率1.6程度が限界であった。いずれにしても、これら従来技術の含硫黄化合物により、より薄い肉厚、軽量化の問題はある程度解決されたが、さらに高い屈折率が望ましいことは言うまでもない。一方、光学材料に要求されるもう一つの重要な性能として色収差が少ないことが挙げられる。色収差はアッベ数が高い程良好となるため高アッベ数材料が望まれる。すなわち、高屈折率と高アッベ数の同時実現も望まれている。しかしながら、一般に、アッベ数は屈折率の上昇に伴い低下する傾向を示し、従来のジエチレングリコールビスアリルカーボネートおよび、公知のエピスルフィド化合物さらにはポリチオール化合物とポリイソシアネート化合物等の従来技術の化合物を原料とするプラスチック材料では、屈折率1.5から1.55の場合アッベ数は約50から55が、屈折率1.60の場合40、屈折率1.66の場合32程度が限界であった。一方、耐熱性の改良に関しても、多官能化合物、架橋剤の使用による改良が種々試みられてはいる。しかしながら、一般に、高屈折率発現のためには、原料硫黄化合物の分子量が大となり、このため架橋密度が低下する。また、さらに高アッベ数発現のためには、アルキル基含有量が増加し、このため原料化合物を構成する分子の剛直性が低下し、結果として、十分な耐熱性改良が得られていないのが現状である。 Also, various novel polythiol compounds serving as raw materials for these thiourethanes have been proposed. That is, JP-A-5-148340 discloses a branched polythiol compound having four sulfur atoms in one molecule, and JP-A-2-27059 discloses a branched polythiol compound having five sulfur atoms in one molecule. However, JP-A-6-192250 proposes a polythiol compound having a dithiane ring structure in the molecule. Further, the epoxy groups of known epoxy compounds such as amine-based epoxy resins, phenol-based epoxy resins, alcohol-based epoxy resins, unsaturated compound-based epoxy resins, glycidyl ester-based epoxy resins, urethane-based epoxy resins, and alicyclic epoxy resins. JP-A-3-83320 proposes a method for producing a lens material using a compound in which a part or all of the compound is converted to an episulfide group. The thiourethane resin lens obtained from the polythiol compound and the polyisocyanate compound has a maximum refractive index of about 1.66. However, an episulfide resin lens obtained from an episulfide compound derived from a known epoxy resin has a limit of a refractive index of about 1.6. In any case, the problems of thinner thickness and lighter weight have been solved to some extent by these conventional sulfur-containing compounds, but it goes without saying that a higher refractive index is desirable. On the other hand, another important performance required for the optical material is that the chromatic aberration is small. Since the chromatic aberration becomes better as the Abbe number becomes higher, a material having a higher Abbe number is desired. That is, simultaneous realization of a high refractive index and a high Abbe number is also desired. However, in general, the Abbe number shows a tendency to decrease with an increase in the refractive index, and the conventional diethylene glycol bisallyl carbonate and a known episulfide compound, and furthermore, a plastic using a conventional compound such as a polythiol compound and a polyisocyanate compound as a raw material. For materials, the Abbe number is about 50 to 55 when the refractive index is 1.5 to 1.55, and is about 40 when the refractive index is 1.60 and about 32 when the refractive index is 1.66. On the other hand, various attempts have been made to improve the heat resistance by using a polyfunctional compound and a crosslinking agent. However, in general, in order to achieve a high refractive index, the molecular weight of the raw material sulfur compound becomes large, so that the crosslink density decreases. Further, in order to achieve a higher Abbe number, the alkyl group content increases, and thus the rigidity of the molecules constituting the raw material compound decreases. As a result, sufficient improvement in heat resistance has not been obtained. It is the current situation.
本発明が解決しようとする課題は、薄い肉厚および低い色収差さらには高い耐熱性を同時に有する光学材料を見いだすことにある。従来技術により得られるポリチオール化合物とイソシアネート化合物により得られる硬化樹脂に代表される光学材料では、高屈折率化には限界があり、さらに、高屈折率化はアッベ数の低下をもたらし、以上の光学特性の改良は耐熱性の低下をきたし、このため、十分に高い屈折率とアッベ数のバランスが得られないことの三点にあった。 The problem to be solved by the present invention is to find an optical material which has a small thickness, low chromatic aberration and high heat resistance at the same time. In optical materials typified by a cured resin obtained by a polythiol compound and an isocyanate compound obtained by a conventional technique, there is a limit to a high refractive index, and further, a high refractive index leads to a decrease in Abbe number, and The improvement in the characteristics has led to a decrease in heat resistance, and as a result, there have been three points that a sufficiently high refractive index and Abbe number cannot be balanced.
本発明の課題は、(1)式で表される構造を2個以上有すると共に、環状骨格を有するエピスルフィド化合物および分岐アルキルスルフィド型エピスルフィド化合物により解決された。 The object of the present invention has been solved by an episulfide compound having at least two structures represented by the formula (1) and having a cyclic skeleton and a branched alkylsulfide-type episulfide compound.
(1)式で表される構造を2個以上有すると共に、環状骨格を有するエピスルフィド化合物は、具体的には、(a)環状骨格が、脂環族骨格であるエピスルフィド化合物。(b)環状骨格が、芳香族骨格であるエピスルフィド化合物。(c)環状骨格が、硫黄原子を異種原子とする複素環骨格であるエピスルフィド化合物。であり、さらにこれらの化合物は、分子内に、スルフィド、エーテル、スルフィン、ケトン、エステル等の結合を含んでも良い。
(1) An episulfide compound having two or more structures represented by the formula and having a cyclic skeleton is specifically (a) an episulfide compound in which the cyclic skeleton is an alicyclic skeleton. (B) An episulfide compound in which the cyclic skeleton is an aromatic skeleton. (C) An episulfide compound in which the cyclic skeleton is a heterocyclic skeleton having a sulfur atom as a different atom. Further, these compounds may contain a bond such as sulfide, ether, sulfine, ketone, ester or the like in the molecule.
また、分岐アルキルスルフィド型エピスルフィド化合物は、具体的には(2)式で表される化合物である。 Further, the branched alkyl sulfide-type episulfide compound is specifically a compound represented by the formula (2).
(a)の脂環族骨格を有するエピスルフィド化合物の好ましい具体的例示としては、1,3および1,4−ビス(β−エピチオプロピルチオ)シクロヘキサン、1,3および1,4−ビス(β−エピチオプロピルチオメチル)シクロヘキサン、ビス〔4−(β−エピチオプロピルチオ)シクロヘキシル〕メタン、2,2−ビス〔4−(β−エピチオプロピルチオ)シクロヘキシル〕プロパン、ビス〔4−(β−エピチオプロピルチオ)シクロヘキシル〕スルフィド、2,5−ビス(β−エピチオプロピルチオ)−1,4−ジチアン、2,5−ビス(β−エピチオプロピルチオエチルチオメチル)−1,4−ジチアン等を挙げることが出来る。 Preferred specific examples of the episulfide compound having an alicyclic skeleton of (a) include 1,3 and 1,4-bis (β-epithiopropylthio) cyclohexane, 1,3 and 1,4-bis (β -Epithiopropylthiomethyl) cyclohexane, bis [4- (β-epithiopropylthio) cyclohexyl] methane, 2,2-bis [4- (β-epithiopropylthio) cyclohexyl] propane, bis [4- ( β-epithiopropylthio) cyclohexyl] sulfide, 2,5-bis (β-epithiopropylthio) -1,4-dithiane, 2,5-bis (β-epithiopropylthioethylthiomethyl) -1, 4-dithiane and the like can be mentioned.
(b)の芳香族骨格を有するエピスルフィド化合物の好ましい具体例としては、1,3および1,4−ビス(β−エピチオプロピルチオ)ベンゼン1,3および1,4−ビス(β−エピチオプロピルチオメチル)ベンゼンビス〔4−(β−エピチオプロピルチオ)フェニル〕メタン、2,2−ビス〔4−(β−エピチオプロピルチオ)フェニル〕プロパン、ビス〔4−(β−エピチオプロピルチオ)フェニル〕スルフィド、ビス〔4−(β−エピチオプロピルチオ)フェニル〕スルフィン、4,4−ビス(β−エピチオプロピルチオ)ビフェニル等を挙げることが出来る。 Preferred specific examples of the episulfide compound having an aromatic skeleton (b) include 1,3 and 1,4-bis (β-epithiopropylthio) benzene 1,3 and 1,4-bis (β-epithio). Propylthiomethyl) benzenebis [4- (β-epithiopropylthio) phenyl] methane, 2,2-bis [4- (β-epithiopropylthio) phenyl] propane, bis [4- (β-epithio) Propylthio) phenyl] sulfide, bis [4- (β-epithiopropylthio) phenyl] sulfine, 4,4-bis (β-epithiopropylthio) biphenyl and the like.
(c)の硫黄原子を異種原子とする複素環骨格を有するエピスルフィド化合物として、(3)式で表される構造を有するエピスルフィド化合物が挙げられる。 As the episulfide compound having a heterocyclic skeleton having a sulfur atom as a different atom in (c), an episulfide compound having a structure represented by the formula (3) can be given.
(ここで、Epsは(4)式で表されるエピチオプロピル基を表し、Yは−(CH2CH2S)−を表し、Zは水素原子、炭素数1から5のアルキル基あるいは、−(CH2)mSYnEpsを表し、Uは水素原子、炭素数1から5のアルキル基を表す。mは1から5の整数を表し、nは0から4の整数を表す)
(Here, Eps represents an epithiopropyl group represented by the formula (4), Y represents-(CH2CH2S)-, Z represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or-(CH2) represents mSYnEps, U represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, m represents an integer of 1 to 5, and n represents an integer of 0 to 4)
(ここに、XはSまたはOを表し、このSの個数は三員環を構成するSとOの合計に対して平均で50%以上である。)(3)式において、nは0から4の整数を表すが、好ましくは、0から3であり、より好ましくは、0から2であり、最も好ましくは0である。mは1から5の整数を表すが、好ましくは1から4、より好ましくは1から3、最も好ましくは1である。(4)式において、XはSまたはOを表すが、このSの個数は三員環を構成するSとOの合計に対して平均でが50%以上であり、好ましくは80〜100%、より好ましくは90〜100%、、特に好ましくは95〜100%である。最も好ましくは100%である。nが4より大きい場合重合硬化して得られる光学材料の耐熱性が低下し光学材料として使用に耐えなくなる。また、nが4以下の場合であっても耐熱性的には小さいほうが有利であり、材料の柔軟性からは大きい方が有利となる。mは4および5の場合、硫黄含有量が低下し高屈折率が達成されず、さらに材料の耐熱性が低下する。mが1の場合、屈折率、耐熱性的には最も有利となる。(4)式において、X中のSの個数は三員環を構成するSとOの合計に対して平均で80%以下、特に50%以下の場合、硫黄含有量が低下し高屈折率が達成されず、化合物の反応性低下に伴い高温条件下での重合が必要となるため、材料に着色が生じる。本発明の化合物およびこれを重合硬化して得られる光学材料の性能は以上のように整数nとmおよびX中のSの割合により決定される、しかしながら、好ましい具体例等は、整数nとmを独立に上述の範囲にあてはめ決定されない。好ましい例としては、n=0〜3の範囲でかつm=1〜4の範囲である化合物が挙げられる。これらのなかでより好ましい例としては、n=0〜2の範囲で、かつm=1〜3の範囲の化合物が挙げられる。これらのなかで最も好ましい例としては、n=0で、かつm=1の化合物が挙げられる。また、UはUは水素原子、炭素数1から5のアルキル基のいずれでもかまわないが、屈折率を高く保つためには水素原子が好ましい、Zもは水素原子、炭素数1から5のアルキル基あるいは、−(CH2)mSYnEpsのいずれでもかまわないが、高耐熱性の観点からは架橋密度の高くなる−(CH2)mSYnEpsが望ましいが、材料の柔軟性とのバランスを考慮した場合水素原子が最も好ましい。
(Here, X represents S or O, and the number of S is 50% or more on average with respect to the sum of S and O constituting the three-membered ring.) In the formula (3), n is from 0 to Represents an integer of 4, preferably 0 to 3, more preferably 0 to 2, and most preferably 0. m represents an integer of 1 to 5, preferably 1 to 4, more preferably 1 to 3, and most preferably 1. In the formula (4), X represents S or O, and the number of S is 50% or more on average with respect to the total of S and O constituting the three-membered ring, preferably 80 to 100%. It is more preferably 90 to 100%, particularly preferably 95 to 100%. Most preferably, it is 100%. When n is greater than 4, the heat resistance of the optical material obtained by polymerization and curing is reduced, and the optical material cannot be used as an optical material. Further, even when n is 4 or less, a smaller heat resistance is advantageous, and a larger flexibility is advantageous from the viewpoint of material flexibility. When m is 4 or 5, the sulfur content decreases, a high refractive index is not achieved, and the heat resistance of the material further decreases. When m is 1, it is most advantageous in terms of refractive index and heat resistance. In the formula (4), when the number of S in X is 80% or less on average with respect to the sum of S and O constituting the three-membered ring, particularly when the number is 50% or less, the sulfur content decreases and the high refractive index decreases. This is not achieved, and the material needs to be polymerized under high temperature conditions as the reactivity of the compound decreases, so that the material is colored. The performance of the compound of the present invention and the optical material obtained by polymerizing and curing the compound are determined by the integers n and m and the ratio of S in X as described above. However, preferred specific examples are the integers n and m Are not independently determined in the above-mentioned range. Preferred examples include compounds in which n = 0-3 and m = 1-4. Of these, more preferred examples include compounds in the range of n = 0 to 2 and m = 1 to 3. The most preferable example among these is a compound in which n = 0 and m = 1. U may be any one of a hydrogen atom and an alkyl group having 1 to 5 carbon atoms, but is preferably a hydrogen atom in order to keep the refractive index high. Z is also a hydrogen atom and an alkyl group having 1 to 5 carbon atoms. Any of a group or-(CH2) mSYnEps may be used, but from the viewpoint of high heat resistance,-(CH2) mSYnEps, which has a high crosslinking density, is desirable. Most preferred.
これらの中で具体例のいくつかを例示的に以下に実際に示す。すなわち以下の2,5−ビス(β−エピチオプロピルチオメチル)−1,4−ジチアン、2,5−ビス(β−エピチオプロピルチオエチルチオメチル)−1,4−ジチアン 、2,5−ビス(β−エピチオプロピルチオエチル)−1,4−ジチアン、2,3、5−トリ(β−エピチオプロピルチオエチル)−1,4−ジチアン等を挙げることができる。 Among these, some of the specific examples are actually shown below by way of example. That is, the following 2,5-bis (β-epithiopropylthiomethyl) -1,4-dithiane, 2,5-bis (β-epithiopropylthioethylthiomethyl) -1,4-dithiane, 2,5 -Bis (β-epithiopropylthioethyl) -1,4-dithiane; 2,3,5-tri (β-epithiopropylthioethyl) -1,4-dithiane;
分岐アルキルスルフィド型エピスルフィド化合物の好ましい具体例としては、2−(2−β−エピチオプロピルチオエチルチオ)−1,3−ビス(β−エピチオプロピルチオ)プロパン、1,2−ビス〔(2−β−エピチオプロピルチオエチル)チオ〕−3−(β−エピチオプロピルチオ)プロパン、テトラキス(β−エピチオプロピルチオメチル)メタン、1,1,1−トリス(β−エピチオプロピルチオメチル)プロパン等が挙げられる。 Preferred specific examples of the branched alkyl sulfide type episulfide compound include 2- (2-β-epithiopropylthioethylthio) -1,3-bis (β-epithiopropylthio) propane and 1,2-bis [( 2-β-epithiopropylthioethyl) thio] -3- (β-epithiopropylthio) propane, tetrakis (β-epithiopropylthiomethyl) methane, 1,1,1-tris (β-epithiopropyl) Thiomethyl) propane and the like.
本発明の目的に叶うものであらば、本発明の硬化樹脂光学材料は(a)、(b)、(c)、分岐アルキルスルフィド型エピスルフィド化合物のいずれか単独でも、またこれらを混合共重合硬化したものであってもかまわない。 The cured resin optical material of the present invention may be any one of (a), (b) and (c), a branched alkyl sulfide-type episulfide compound, or a mixture of these, and the mixture may be cured if the object of the present invention is achieved. It may be something you did.
本発明に使用される、(1)式で表される構造を2個以上有すると共に、環状骨格を有するエピスルフィド化合物および分岐アルキルスルフィド型エピスルフィド化合物は、(a)、(b)、(c)、分岐アルキルスルフィド型エピスルフィド化合物に対応するメルカプト基を2個以上有する(5)式の化合物と、エピクロロヒドリンに代表されるエピハロヒドリンをアルカリ存在下で反応させて、(6)式で表されるエポキシ基を有する化合物を得、ついで、該エポキシ化合物を、チオシアン酸塩、チオ尿素、トリフェニルホスフィンスルフィド、3−メチルベンゾチアゾール−2−チオン等のチア化剤と、好ましくはチオシアン酸塩、チオ尿素と反応させ製造される。 The episulfide compound having two or more structures represented by the formula (1) and having a cyclic skeleton and the branched alkylsulfide-type episulfide compound used in the present invention include (a), (b), (c), A compound of the formula (5) having two or more mercapto groups corresponding to a branched alkyl sulfide type episulfide compound is reacted with epihalohydrin represented by epichlorohydrin in the presence of an alkali, and represented by the formula (6) A compound having an epoxy group is obtained, and then the epoxy compound is treated with a thiocyanate such as thiocyanate, thiourea, triphenylphosphine sulfide, or 3-methylbenzothiazole-2-thione, and preferably with thiocyanate or thiocyanate. It is produced by reacting with urea.
〔(5)、(6)式においては、nは2以上の整数を表す。Rは炭素数1から20の環状構造を有する化合物、分岐状のアルキル基を表し、これらは、スルフィド、エーテル、スルフォン、エステル、ケトン等の結合を基内に含んでも良い。〕
[In the formulas (5) and (6), n represents an integer of 2 or more. R represents a compound having a cyclic structure having 1 to 20 carbon atoms or a branched alkyl group, and these may include a bond such as sulfide, ether, sulfone, ester, or ketone in the group. ]
(6)式で表されるエポキシ化合物の製法において、エピハロヒドリン化合物として好ましいものはエピクロロヒドリンである。また、エピハロヒドリン化合物は量論的には(5)式のメルカプタン化合物のメルカプト基数に対応するモル数を使用するが、生成物の純度、反応速度、経済性等を重視するのであれば、これ以下でもこれ以上の量を使用してもかまわない。好ましくは量論〜量論の5倍モル使用し反応する。より好ましくは量論〜量論の2.5倍モルを使用し反応する。反応は、無溶媒あるいは溶媒中のいずれでもかまわないが、溶媒を使用するときは、エピハロヒドリンあるいは(5)式のメルカプタン化合物あるいはメルカプタン化合物の金属塩のいずれかが可溶のものを使用することが望ましい。具体例としては、水、アルコール類、エーテル類、芳香族炭化水素類、ハロゲン化炭化水素類等があげられる。反応は量論以上の塩基の存在下において容易に進行する。塩基としては、ピリジン、トリエチルアミン、ジアザビシクロウンデセン等の三級アミン、アルカリまたはアルカリ土類金属の水酸化物等があげられるが、好ましいものは、アルカリまたはアルカリ土類金属の水酸化物であり、より好ましいものは、水酸化ナトリウム、水酸化カリウム等である。反応温度は通常0〜100℃で実施されるが、好ましくは0〜60℃である。反応時間は上記の各種条件下で反応が完結する時間であればかまわないが通常10時間以下が適当である。 (6) In the method for producing the epoxy compound represented by the formula, the preferred epihalohydrin compound is epichlorohydrin. The epihalohydrin compound is stoichiometrically used in the number of moles corresponding to the number of mercapto groups in the mercaptan compound of the formula (5). However, if importance is attached to the purity of the product, the reaction rate, economic efficiency, etc. However, larger amounts can be used. Preferably, the reaction is carried out using stoichiometric to 5 times the stoichiometric mole. More preferably, the reaction is carried out using stoichiometric to 2.5 times the stoichiometric mole. The reaction may be carried out without a solvent or in a solvent. When a solvent is used, epihalohydrin or a mercaptan compound of the formula (5) or a metal salt of a mercaptan compound which is soluble in the solvent may be used. desirable. Specific examples include water, alcohols, ethers, aromatic hydrocarbons, halogenated hydrocarbons, and the like. The reaction proceeds easily in the presence of a stoichiometric or more base. Examples of the base include tertiary amines such as pyridine, triethylamine and diazabicycloundecene, and hydroxides of alkali or alkaline earth metals, and preferred are hydroxides of alkali or alkaline earth metals. Yes, more preferred are sodium hydroxide, potassium hydroxide and the like. The reaction is usually carried out at a temperature of 0 to 100 ° C, preferably 0 to 60 ° C. The reaction time may be any time as long as the reaction is completed under the above-mentioned various conditions, but is usually preferably 10 hours or less.
(6)式で表されるエポキシ化合物より本発明の新規なエピスルフィド化合物を製造する方法において、チア化剤としてチオシアン酸塩を使用する場合、好ましいチオシアン酸塩は、アルカリまたはアルカリ土類金属の塩であり、より好ましいものは、チオシアン酸カリウム、チオシアン酸ナトリウムである。また、チア化剤であるチオシアン酸塩、チオ尿素は量論的にはエポキシ化合物のエポキシ基数に対応するモル数を使用するが、生成物の純度、反応速度、経済性等を重視するのであれば、これ以下でもこれ以上の量を使用してもかまわない。好ましくは量論〜量論の5倍モル使用し反応する。より好ましくは量論〜量論の2.5倍モルを使用し反応する。反応は、無溶媒あるいは溶媒中のいずれでもかまわないが、溶媒を使用するときは、チオシアン酸塩あるいはチオ尿素さらには(6)式のエポキシ化合物いずれかが可溶のものを使用することが望ましい。具体例としては、水、メタノール、エタノール等のアルコール類;ジエチルエーテル、テトラヒドロフラン、ジオキサン等のエーテル類;メチルセルソルブ、エチルセルソルブ、ブチルセルソルブ等のヒドロキシエーテル類;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;ジクロロエタン、クロロホルム、クロロベンゼン等のハロゲン化炭化水素類等があげられ、これらの併用使用、例えば、アルコール類と水の組み合わせ、エーテル類、ヒドロキシエーテル類、ハロゲン化炭化水素類、芳香族炭化水素類とアルコール類の組み合わせ等は効果的な場合がある。また、反応液中に酸および酸無水物等を重合抑制剤として添加することは、反応成績を上げる面から有効な手段である。酸および酸無水物等の具体例としては、硝酸、塩酸、硫酸、発煙硫酸、ホウ酸、ヒ酸、燐酸、青酸、酢酸、過酢酸、チオ酢酸、蓚酸、酒石酸、プロピオン酸、酪酸、コハク酸、マレイン酸、安息香酸、無水硝酸、無水硫酸、酸化ホウ素、五酸化ヒ酸、五酸化燐、無水クロム酸、無水酢酸、無水プロピオン酸、無水酪酸、無水コハク酸、無水マレイン酸、無水安息香酸、無水フタル酸、シリカゲル、シリカアルミナ、塩化アルミニウム等があげられ、これらのいくつかを併用することも可能である。添加量は通常反応液総量に対して0.001〜10wt%の範囲で用いられるが、好ましくは0.01〜1wt%である。反応温度は通常0〜100℃で実施されるが、好ましくは20〜70℃である。反応時間は上記の各種条件下で反応が完結する時間であればかまわないが通常20時間以下が適当である。反応生成物は酸性水溶液を用いた洗浄によって、得られる化合物を安定性を向上せしめることが可能である。酸性水溶液に用いる酸の具体例としては、硝酸、塩酸、硫酸、ホウ酸、ヒ酸、燐酸、青酸、酢酸、過酢酸、チオ酢酸、蓚酸、酒石酸、コハク酸、マレイン酸等があげられる。また、これらは単独でも2種類以上を混合して用いても良い。これらの酸の水溶液は通常pH6以下で効果を現すが、より効果的な範囲はpH3から0の範囲である。 (6) In the method for producing a novel episulfide compound of the present invention from the epoxy compound represented by the formula, when a thiocyanate is used as a thiocyanating agent, a preferable thiocyanate is a salt of an alkali or alkaline earth metal. And more preferred are potassium thiocyanate and sodium thiocyanate. Also, thiocyanates and thioureas, which are thiocyanating agents, stoichiometrically use the number of moles corresponding to the number of epoxy groups in the epoxy compound, but it is important to focus on the purity of the product, the reaction rate, economy, etc. However, less or more may be used. Preferably, the reaction is carried out using stoichiometric to 5 times the stoichiometric mole. More preferably, the reaction is carried out using a stoichiometric amount to 2.5 times the stoichiometric amount. The reaction may be carried out without a solvent or in a solvent. When a solvent is used, it is preferable to use one in which a thiocyanate or a thiourea or an epoxy compound of the formula (6) is soluble. . Specific examples include alcohols such as water, methanol and ethanol; ethers such as diethyl ether, tetrahydrofuran and dioxane; hydroxy ethers such as methyl cellosolve, ethyl cellosolve and butyl cellosolve; benzene, toluene, xylene and the like. Aromatic hydrocarbons; halogenated hydrocarbons such as dichloroethane, chloroform, and chlorobenzene; and the like, and their combined use, for example, combinations of alcohols and water, ethers, hydroxyethers, halogenated hydrocarbons, Combinations of aromatic hydrocarbons and alcohols may be effective. Addition of an acid, an acid anhydride or the like as a polymerization inhibitor to the reaction solution is an effective means from the viewpoint of improving the reaction results. Specific examples of acids and acid anhydrides include nitric acid, hydrochloric acid, sulfuric acid, fuming sulfuric acid, boric acid, arsenic acid, phosphoric acid, hydrocyanic acid, acetic acid, peracetic acid, thioacetic acid, oxalic acid, tartaric acid, propionic acid, butyric acid, succinic acid , Maleic acid, benzoic acid, nitric anhydride, sulfuric anhydride, boron oxide, arsenic pentoxide, phosphorus pentoxide, chromic anhydride, acetic anhydride, propionic anhydride, butyric anhydride, succinic anhydride, maleic anhydride, benzoic anhydride , Phthalic anhydride, silica gel, silica alumina, aluminum chloride, etc., and some of them can be used in combination. The addition amount is usually used in the range of 0.001 to 10% by weight based on the total amount of the reaction solution, but is preferably 0.01 to 1% by weight. The reaction is usually carried out at a temperature of 0 to 100 ° C, preferably 20 to 70 ° C. The reaction time may be any time as long as the reaction is completed under the above-mentioned various conditions, but usually is suitably 20 hours or less. The stability of the obtained compound can be improved by washing the reaction product with an acidic aqueous solution. Specific examples of the acid used in the acidic aqueous solution include nitric acid, hydrochloric acid, sulfuric acid, boric acid, arsenic acid, phosphoric acid, hydrocyanic acid, acetic acid, peracetic acid, thioacetic acid, oxalic acid, tartaric acid, succinic acid, and maleic acid. These may be used alone or in combination of two or more. Aqueous solutions of these acids usually work below pH 6, but a more effective range is between pH 3 and 0.
以上とは別の製法として、式(6)のエポキシ化合物に対応する式(7)の不飽和化合物を有機過酸、アルキルヒドロペルオキサイド、過酸化水素等による酸化により製造し、これを上述の方法により式(1)で表される構造を2個以上有するエピスルフィド化合物を製造する方法も挙げられる。R(−SCH2CH=CH2)n (7)〔(7)式において、Xは、塩素あるいは臭素原子を表し、R、nは式(5)と同一の意味を有する〕 As another production method, an unsaturated compound of the formula (7) corresponding to the epoxy compound of the formula (6) is produced by oxidation with an organic peracid, alkyl hydroperoxide, hydrogen peroxide or the like. There is also a method for producing an episulfide compound having two or more structures represented by the formula (1) by the method. R (-SCH2CH = CH2) n (7) [In the formula (7), X represents a chlorine or bromine atom, and R and n have the same meaning as in the formula (5)]
さらに、別法としては式(8)に示されるハロメルカプタン化合物より脱ハロゲン化水素反応により製造することも有力な方法である。ハロメルカプタンは、上述の不飽和化合物と塩化イオウ類から、容易に合成できることが知られている(例えば、F.Lautenschlaergerら,J.Org.Chem.,34,396(1969))。R(−SCH2CHSHCH2X)n (8)〔(8)式において、Xは、塩素あるいは臭素原子を表し、R、nは式(5)と同一の意味を有する〕 Further, as another method, production from a halomercaptan compound represented by the formula (8) by a dehydrohalogenation reaction is also an effective method. It is known that halomercaptans can be easily synthesized from the above-mentioned unsaturated compounds and sulfur chlorides (for example, F. Lautenschlagerger et al., J. Org. Chem., 34 , 396 (1969)). R (-SCH2CHSHCH2X) n (8) [In the formula (8), X represents a chlorine or bromine atom, and R and n have the same meaning as in the formula (5)]
本発明の新規なエピスルフィド化合物は、硬化触媒存在下あるいは不存在下に、加熱重合し光学材料等に有利な硬化樹脂を製造することができる。硬化樹脂製造に好ましい方法は硬化触媒を使用する方法であり、硬化触媒はアミン類、フォスフィン類、鉱酸類、ルイス酸類、有機酸類、ケイ酸類、四フッ化ホウ酸等が使用される。具体例としては、(1)エチルアミン、n−プロピルチオアミン、sec−プロピルアミン、n−ブチルアミン、sec−ブチルアミン、i−ブチルアミン、t−ブチルアミン、ペンチルアミン、ヘキシルアミン、ヘプチルアミン、オクチルアミン、デシルアミン、ラウリルアミン、ミスチリルアミン、1,2−ジメチルヘキシルアミン、3−ペンチルアミン、2−エチルヘキシルアミン、アリルアミン、アミノエタノール、1−アミノプロパノール、2−アミノプロパノール、アミノブタノール、アミノペンタノール、アミノヘキサノール、3−エトキシプロピルアミン、3−プロポキシプロピルアミン、3−イソプロポキシプロピルアミン、3−ブトキシプロピルアミン、3−イソブトキシプロピルアミン、3−(2−エチルヘキシロキシ)プロピルアミン、アミノシクロペンタン、アミノシクロヘキサン、アミノノルボルネン、アミノメチルシクロヘキサン、アミノベンゼン、ベンジルアミン、フェネチルアミン、α−フェニルエチルアミン、ナフチルアミン、フルフリルアミン等の1級モノアミン;エチレンジアミン、1,2−ジアミノプロパン、1,3−ジアミノプロパン、1,2−ジアミノブタン、1,3−ジアミノブタン、1,4−ジアミノブタン、1,5−ジアミノペンタン、1,6−ジアミノヘキサン、1,7−ジアミノヘプタン、1,8−ジアミノオクタン、ジメチルアミノプロピルアミン、ジエチルアミノプロピルアミン、ビス−(3−アミノプロピル)エーテル、1,2−ビス−(3−アミノプロポキシ)エタン、1,3−ビス−(3−アミノプロポキシ)−2,2’−ジメチルプロパン、アミノエチルエタノールアミン、1,2−、1,3−あるいは1,4−ビスアミノシクロヘキサン、1,3−あるいは1,4−ビスアミノメチルシクロヘキサン、1,3−あるいは1,4−ビスアミノエチルシクロヘキサン、1,3−あるいは1,4−ビスアミノプロピルシクロヘキサン、水添4,4’−ジアミノジフェニルメタン、2−あるいは4−アミノピペリジン、2−あるいは4−アミノメチルピペリジン、2−あるいは4−アミノエチルピペリジン、N−アミノエチルピペリジン、N−アミノプロピルピペリジン、N−アミノエチルモルホリン、N−アミノプロピルモルホリン、イソホロンジアミン、メンタンジアミン、1,4−ビスアミノプロピルピペラジン、o−、m−、あるいはp−フェニレンジアミン、2,4−あるいは2,6−トリレンジアミン、2,4−トルエンジアミン、m−アミノベンジルアミン、4−クロロ−o−フェニレンジアミン、テトラクロロ−p−キシリレンジアミン、4−メトキシ−6−メチル−m−フェニレンジアミン、m−、あるいはp−キシリレンジアミン、1,5−あるいは、2,6−ナフタレンジアミン、ベンジジン、4,4’−ビス(o−トルイジン)、ジアニシジン、4,4’−ジアミノジフェニルメタン、2,2−(4,4’−ジアミノジフェニル)プロパン、4,4’−ジアミノジフェニルエーテル、4,4’−チオジアニリン、4,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジトリルスルホン、メチレンビス(o−クロロアニリン)、3,9−ビス(3−アミノプロピル)2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、ジエチレントリアミン、イミノビスプロピルアミン、メチルイミノビスプロピルアミン、ビス(ヘキサメチレン)トリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン、N−アミノエチルピペラジン、N−アミノプロピルピペラジン、1,4−ビス(アミノエチルピペラジン)、1,4−ビス(アミノプロピルピペラジン)、2,6−ジアミノピリジン、ビス(3,4−ジアミノフェニル)スルホン等の1級ポリアミン;ジエチルアミン、ジプロピルアミン、ジ−n−ブチルアミン、ジ−sec−ブチルアミン、ジイソブチルアミン、ジ−n−ペンチルアミン、ジ−3−ペンチルアミン、ジヘキシルアミン、オクチルアミン、ジ(2−エチルヘキシル)アミン、メチルヘキシルアミン、ジアリルアミン、ピロリジン、ピペリジン、2−、3−、4−ピコリン、2,4−、2,6−、3,5−ルペチジン、ジフェニルアミン、N−メチルアニリン、N−エチルアニリン、ジベンジルアミン、メチルベンジルアミン、ジナフチルアミン、ピロール、インドリン、インドール、モルホリン等の2級モノアミン;N,N’−ジメチルエチレンジアミン、N,N’−ジメチル−1,2−ジアミノプロパン、N,N’−ジメチル−1,3−ジアミノプロパン、N,N’−ジメチル−1,2−ジアミノブタン、N,N’−ジメチル−1,3−ジアミノブタン、N,N’−ジメチル−1,4−ジアミノブタン、N,N’−ジメチル−1,5−ジアミノペンタン、N,N’−ジメチル−1,6−ジアミノヘキサン、N,N’−ジメチル−1,7−ジアミノヘプタン、N,N’−ジエチルエチレンジアミン、N,N’−ジエチル−1,2−ジアミノプロパン 、N,N’−ジエチル−1,3−ジアミノプロパン、N,N’−ジエチル−1,2−ジアミノブタン、N,N’−ジエチル−1,3−ジアミノブタン、N,N’−ジエチル−1,4−ジアミノブタン、N,N’−ジエチル−1,6−ジアミノヘキサン、ピペラジン、2−メチルピペラジン、2,5−あるいは2,6−ジメチルピペラジン、ホモピペラジン、1,1−ジ−(4−ピペリジル)メタン、1,2−ジ−(4−ピペリジル)エタン、1,3−ジ−(4−ピペリジル)プロパン、1,4−ジ−(4−ピペリジル)ブタン、テトラメチルグアニジン等の2級ポリアミン;トリメチルアミン、トリエチルアミン、トリ−n−プロピルアミン、トリ−iso−プロピルアミン、トリ−1,2−ジメチルプロピルアミン、トリ−3−メトキシプロピルアミン、トリ−n−ブチルアミン、トリ−iso−ブチルアミン、トリ−sec−ブチルアミン、トリ−ペンチルアミン、トリ−3−ペンチルアミン、トリ−n−ヘキシルアミン、トリ−n−オクチルアミン、トリ−2−エチルヘキシルアミン、トリドデシルアミン、トリラウリルアミン、トリシクロヘキシルアミン、ジシクロヘキシルエチルアミン、モノシクロヘキシルジエチルアミン、N,N−ジメチルヘキシルアミン、N−メチルジヘキシルアミン、N,N−ジメチルシクロヘキシルアミン、N−メチルジシクロヘキシルアミン、トリエタノールアミン、N、N−ジエチルエタノールアミン、N−エチルジエタノールアミン、トリベンジルアミン、N,N−ジメチルベンジルアミン、ジエチルベンジルアミン、トリフェニルアミン、N,N−ジメチルアミノ−p−クレゾール、N,N−ジメチルアミノメチルフェノール、2−(N,N−ジメチルアミノメチル)フェノール、N,N−ジメチルアニリン、N,N−ジエチルアニリン、ピリジン、キノリン、N−メチルモルホリン、N−メチルピペリジン、2−(2−ジメチルアミノエトキシ)−4−メチル−1,3,2−ジオキサボルナン等の3級モノアミン;テトラメチルエチレンジアミン、ピラジン、N,N’−ジメチルピペラジン、N,N’−ビス((2−ヒドロキシ)プロピル)ピペラジン、ヘキサメチレンテトラミン、N,N,N’,N’−テトラメチル−1,3−ブタンアミン、2−ジメチルアミノ−2−ヒドロキシプロパン、ジエチルアミノエタノール、N,N,N−トリス(3−ジメチルアミノプロピル)アミン、2,4,6−トリス(N,N−ジメチルアミノメチル)フェノール、ヘプタメチルイソビグアニド等の3級ポリアミン;イミダゾール、N−メチルイミダゾール、2−メチルイミダゾール、4−メチルイミダゾール、、N−エチルイミダゾール、2−エチルイミダゾール、4−エチルイミダゾール、N−ブチルイミダゾール、2−ブチルイミダゾール、N−ウンデシルイミダゾール、2−ウンデシルイミダゾール、N−フェニルイミダゾール、2−フェニルイミダゾール、N−ベンジルイミダゾール、2−ベンジルイミダゾール、1−ベンジル−2−メチルイミダゾール、N−(2’−シアノエチル)−2−メチルイミダゾール、N−(2’−シアノエチル)−2−ウンデシルイミダゾール、N−(2’−シアノエチル)−2−フェニルイミダゾール、3,3−ビス−(2−エチル−4−メチルイミダゾリル)メタン、アルキルイミダゾールとイソシアヌール酸の付加物、アルキルイミダゾールとホルムアルデヒドの縮合物等の各種イミダゾール類;1,8−ジアザビシクロ(5,4,0)ウンデセン−7、1,5−ジアザビシクロ(4,3,0)ノネン−5、6−ジブチルアミノ−1,8−ジアザビシクロ(5,4,0)ウンデセン−7等のアミジン類;以上に代表されるアミン系化合物。(2)(1)のアミン類とハロゲン、鉱酸、ルイス酸、有機酸、ケイ酸、四フッ化ホウ酸等との4級アンモニウム塩。(3)(1)のアミン類とボランおよび三フッ化ホウ素とのコンプレックス。(4)トリメチルフォスフィン、トリエチルフォスフィン、トリ−iso−プロピルフォスフィン、トリ−n−ブチルフォスフィン、トリ−n−ヘキシルフォスフィン、トリ−n−オクチルフォスフィン、トリシクロヘキシルホスフィン、トリフェニルフォスフィン、トリベンジルホスフィン、トリス(2−メチルフェニル)ホスフィン、トリス(3−メチルフェニル)ホスフィン、トリス(4−メチルフェニル)ホスフィン、トリス(ジエチルアミノ)ホスフィン、トリス(4−メチルフェニル)ホスフィン、ジメチルフェニルフォスフィン、ジエチルフェニルフォスフィン、ジシクロヘキシルフェニルホスフィン、エチルジフェニルフォスフィン、ジフェニルシクロヘキシルホスフィン、クロロジフェニルフォスフィン等のフォスフィン類。(5)塩酸、硫酸、硝酸、燐酸、炭酸等の鉱酸類およびこれらの半エステル類。(6)3フッ化硼素、3フッ化硼素のエーテラート等に代表されるルイス酸類。(7)カルボン酸に代表される有機酸類およびこれらの半エステル類。等である。これらのなかで硬化物の着色が少なく好ましいものは、1級モノアミン、2級モノアミン、3級モノアミン、3級ポリアミン、イミダゾール類、アミジン類、4級アンモニウム塩、フォスフィン類である、より好ましいものは、エピスルフィド基と反応し得る基を1個以下有する、2級モノアミン、3級モノアミン、3級ポリアミン、イミダゾール類、アミジン類、4級アンモニウム塩、フォスフィン類である。また、これらは単独でも2種類以上を混合して用いても良い。以上の硬化触媒は、ジエピスルフィド化合物1モルに対して通常0.0001モルから1.0モル使用する。 The novel episulfide compound of the present invention can be heated and polymerized in the presence or absence of a curing catalyst to produce a cured resin advantageous for optical materials and the like. A preferred method for producing a cured resin is a method using a curing catalyst. As the curing catalyst, amines, phosphines, mineral acids, Lewis acids, organic acids, silicic acids, tetrafluoroboric acid and the like are used. Specific examples include (1) ethylamine, n-propylthioamine, sec-propylamine, n-butylamine, sec-butylamine, i-butylamine, t-butylamine, pentylamine, hexylamine, heptylamine, octylamine, and decylamine. , Laurylamine, mystyrylamine, 1,2-dimethylhexylamine, 3-pentylamine, 2-ethylhexylamine, allylamine, aminoethanol, 1-aminopropanol, 2-aminopropanol, aminobutanol, aminopentanol, aminohexanol , 3-ethoxypropylamine, 3-propoxypropylamine, 3-isopropoxypropylamine, 3-butoxypropylamine, 3-isobutoxypropylamine, 3- (2-ethylhexyloxy) ) Primary monoamines such as propylamine, aminocyclopentane, aminocyclohexane, aminonorbornene, aminomethylcyclohexane, aminobenzene, benzylamine, phenethylamine, α-phenylethylamine, naphthylamine and furfurylamine; ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,2-diaminobutane, 1,3-diaminobutane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1 , 8-Diaminooctane, dimethylaminopropylamine, diethylaminopropylamine, bis- (3-aminopropyl) ether, 1,2-bis- (3-aminopropoxy) ethane, 1,3-bis- (3-aminopropoxy ) -2,2'-dimethylpropane, aminoethylethanolamine, 1,2-, 1,3- or 1,4-bisaminocyclohexane, 1,3- or 1,4-bisaminomethylcyclohexane, 1,3- Or 1,4-bisaminoethylcyclohexane, 1,3- or 1,4-bisaminopropylcyclohexane, hydrogenated 4,4'-diaminodiphenylmethane, 2- or 4-aminopiperidine, 2- or 4-aminomethylpiperidine 2- or 4-aminoethylpiperidine, N-aminoethylpiperidine, N-aminopropylpiperidine, N-aminoethylmorpholine, N-aminopropylmorpholine, isophoronediamine, menthanediamine, 1,4-bisaminopropylpiperazine, o -, M- or p-phenyl Diamine, 2,4- or 2,6-tolylenediamine, 2,4-toluenediamine, m-aminobenzylamine, 4-chloro-o-phenylenediamine, tetrachloro-p-xylylenediamine, 4-methoxy- 6-methyl-m-phenylenediamine, m- or p-xylylenediamine, 1,5- or 2,6-naphthalenediamine, benzidine, 4,4'-bis (o-toluidine), dianisidine, 4, 4'-diaminodiphenylmethane, 2,2- (4,4'-diaminodiphenyl) propane, 4,4'-diaminodiphenylether, 4,4'-thiodianiline, 4,4'-diaminodiphenylsulfone, 4,4'- Diaminoditolyl sulfone, methylenebis (o-chloroaniline), 3,9-bis (3-aminoprop ) 2,4,8,10-tetraoxaspiro [5,5] undecane, diethylenetriamine, iminobispropylamine, methyliminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylene Hexamine, N-aminoethylpiperazine, N-aminopropylpiperazine, 1,4-bis (aminoethylpiperazine), 1,4-bis (aminopropylpiperazine), 2,6-diaminopyridine, bis (3,4-diamino Primary polyamines such as phenyl) sulfone; diethylamine, dipropylamine, di-n-butylamine, di-sec-butylamine, diisobutylamine, di-n-pentylamine, di-3-pentylamine, dihexylamine, octylamine, Di (2 -Ethylhexyl) amine, methylhexylamine, diallylamine, pyrrolidine, piperidine, 2-, 3-, 4-picoline, 2,4-, 2,6-, 3,5-lupetidine, diphenylamine, N-methylaniline, N- Secondary monoamines such as ethylaniline, dibenzylamine, methylbenzylamine, dinaphthylamine, pyrrole, indoline, indole, and morpholine; N, N′-dimethylethylenediamine, N, N′-dimethyl-1,2-diaminopropane, N , N'-dimethyl-1,3-diaminopropane, N, N'-dimethyl-1,2-diaminobutane, N, N'-dimethyl-1,3-diaminobutane, N, N'-dimethyl-1, 4-diaminobutane, N, N'-dimethyl-1,5-diaminopentane, N, N'-dimethyl-1,6 Diaminohexane, N, N'-dimethyl-1,7-diaminoheptane, N, N'-diethylethylenediamine, N, N'-diethyl-1,2-diaminopropane, N, N'-diethyl-1,3- Diaminopropane, N, N'-diethyl-1,2-diaminobutane, N, N'-diethyl-1,3-diaminobutane, N, N'-diethyl-1,4-diaminobutane, N, N'- Diethyl-1,6-diaminohexane, piperazine, 2-methylpiperazine, 2,5- or 2,6-dimethylpiperazine, homopiperazine, 1,1-di- (4-piperidyl) methane, 1,2-di- Secondary polyamines such as (4-piperidyl) ethane, 1,3-di- (4-piperidyl) propane, 1,4-di- (4-piperidyl) butane, tetramethylguanidine; Tylamine, triethylamine, tri-n-propylamine, tri-iso-propylamine, tri-1,2-dimethylpropylamine, tri-3-methoxypropylamine, tri-n-butylamine, tri-iso-butylamine, tri- sec-butylamine, tri-pentylamine, tri-3-pentylamine, tri-n-hexylamine, tri-n-octylamine, tri-2-ethylhexylamine, tridodecylamine, trilaurylamine, tricyclohexylamine, dicyclohexyl Ethylamine, monocyclohexyldiethylamine, N, N-dimethylhexylamine, N-methyldihexylamine, N, N-dimethylcyclohexylamine, N-methyldicyclohexylamine, triethanolamine, N, N-di Tylethanolamine, N-ethyldiethanolamine, tribenzylamine, N, N-dimethylbenzylamine, diethylbenzylamine, triphenylamine, N, N-dimethylamino-p-cresol, N, N-dimethylaminomethylphenol, -(N, N-dimethylaminomethyl) phenol, N, N-dimethylaniline, N, N-diethylaniline, pyridine, quinoline, N-methylmorpholine, N-methylpiperidine, 2- (2-dimethylaminoethoxy)- Tertiary monoamines such as 4-methyl-1,3,2-dioxabornane; tetramethylethylenediamine, pyrazine, N, N′-dimethylpiperazine, N, N′-bis ((2-hydroxy) propyl) piperazine, hexamethylenetetramine , N, N, N ', N'-tetra Methyl-1,3-butanamine, 2-dimethylamino-2-hydroxypropane, diethylaminoethanol, N, N, N-tris (3-dimethylaminopropyl) amine, 2,4,6-tris (N, N-dimethyl Tertiary polyamines such as aminomethyl) phenol and heptamethylisobiguanide; imidazole, N-methylimidazole, 2-methylimidazole, 4-methylimidazole, N-ethylimidazole, 2-ethylimidazole, 4-ethylimidazole, N- Butylimidazole, 2-butylimidazole, N-undecylimidazole, 2-undecylimidazole, N-phenylimidazole, 2-phenylimidazole, N-benzylimidazole, 2-benzylimidazole, 1-benzyl-2-methylimidazole N- (2'-cyanoethyl) -2-methylimidazole, N- (2'-cyanoethyl) -2-undecylimidazole, N- (2'-cyanoethyl) -2-phenylimidazole, 3,3-bis- Various imidazoles such as (2-ethyl-4-methylimidazolyl) methane, adducts of alkylimidazole and isocyanuric acid, and condensates of alkylimidazole and formaldehyde; 1,8-diazabicyclo (5,4,0) undecene-7 Amidines such as 1,5-diazabicyclo (4,3,0) nonene-5,6-dibutylamino-1,8-diazabicyclo (5,4,0) undecene-7; amine compounds represented by the above . (2) Quaternary ammonium salts of the amines of (1) with halogens, mineral acids, Lewis acids, organic acids, silicic acids, tetrafluoroboric acid and the like. (3) A complex of the amines of (1) with borane and boron trifluoride. (4) trimethylphosphine, triethylphosphine, tri-iso-propylphosphine, tri-n-butylphosphine, tri-n-hexylphosphine, tri-n-octylphosphine, tricyclohexylphosphine, triphenylphosphine Fin, tribenzylphosphine, tris (2-methylphenyl) phosphine, tris (3-methylphenyl) phosphine, tris (4-methylphenyl) phosphine, tris (diethylamino) phosphine, tris (4-methylphenyl) phosphine, dimethylphenyl Phosphins such as phosphine, diethylphenylphosphine, dicyclohexylphenylphosphine, ethyldiphenylphosphine, diphenylcyclohexylphosphine, and chlorodiphenylphosphine . (5) Mineral acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and carbonic acid and half esters thereof. (6) Lewis acids represented by boron trifluoride etherate of boron trifluoride. (7) Organic acids represented by carboxylic acids and their half esters. And so on. Among these, preferred are those with less coloring of the cured product, such as primary monoamines, secondary monoamines, tertiary monoamines, tertiary polyamines, imidazoles, amidines, quaternary ammonium salts, and phosphines. , Tertiary monoamines, tertiary polyamines, imidazoles, amidines, quaternary ammonium salts, and phosphines having at most one group that can react with an episulfide group. These may be used alone or in combination of two or more. The above curing catalyst is usually used in an amount of 0.0001 mol to 1.0 mol per 1 mol of the diepisulfide compound.
また、本発明の新規なエピスルフィド化合物はエピスルフィド基と反応可能な官能基を2個以上有する化合物あるいは、これらの官能基1個以上と他の単独重合可能な官能基を1個以上有する化合物さらには、エピスルフィド基と反応可能でかつ単独重合も可能な官能基を1個有する化合物と硬化重合して光学材料を製造することもできる。これらのエピスルフィド基と反応可能な官能基を2個以上有する化合物としては、エポキシ化合物、公知のエピスルフィド化合物、多価カルボン酸、多価カルボン酸無水物、メルカプトカルボン酸、ポリメルカプタン、メルカプトアルコール、メルカプトフェノール、ポリフェノール、アミン類、アミド類等があげられる。一方、エピスルフィド基と反応可能な官能基1個以上と他の単独重合可能な官能基を1個以上有する化合物としては、ビニル、芳香族ビニル、メタクリル、アクリル、アリル等の不飽和基を有するエポキシ化合物、エピスルフィド化合物、カルボン酸、カルボン酸無水物、メルカプトカルボン酸、メルカプタン類、フェノール類、アミン類、アミド類等があげられる。 In addition, the novel episulfide compound of the present invention is a compound having two or more functional groups capable of reacting with an episulfide group, or a compound having one or more of these functional groups and one or more other homopolymerizable functional groups. An optical material can also be produced by curing and polymerizing with a compound having one functional group capable of reacting with an episulfide group and capable of being homopolymerized. Compounds having two or more functional groups capable of reacting with these episulfide groups include epoxy compounds, known episulfide compounds, polycarboxylic acids, polycarboxylic anhydrides, mercaptocarboxylic acids, polymercaptans, mercapto alcohols, mercapto alcohols Phenol, polyphenol, amines, amides and the like can be mentioned. On the other hand, compounds having at least one functional group capable of reacting with an episulfide group and at least one other functional group capable of being homopolymerized include epoxy having an unsaturated group such as vinyl, aromatic vinyl, methacryl, acryl, and allyl. Examples include compounds, episulfide compounds, carboxylic acids, carboxylic anhydrides, mercaptocarboxylic acids, mercaptans, phenols, amines, amides and the like.
以下にエピスルフィド基と反応可能な官能基を2個以上有する化合物の具体例を示す。 Specific examples of the compound having two or more functional groups capable of reacting with the episulfide group are shown below.
エポキシ化合物の具体例としては、ヒドロキノン、カテコール、レゾルシン、ビスフェノールA、ビスフェノールF、ビスフェノールスルフォン、ビスフェノールエーテル、ビスフェノールスルフィド、ビスフェノールスルフィド、ハロゲン化ビスフェノルA、ノボラック樹脂等の多価フェノール化合物とエピハロヒドリンの縮合により製造されるフェノール系エポキシ化合物;エチレングリコール、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール、プロピレングリコール、ジプロピレングリコール、ポリプロピレングリコール、1、3−プロパンジオール、1、4−ブタンジオール、1、6−ヘキサンジオール、ネオペンチルグリコール、グリセリン、トリメチロールプロパントリメタクリレート、ペンタエリスリトール、1、3−および1、4−シクロヘキサンジオール、1、3−および1、4−シクロヘキサンジメタノール、水添ビスフェノールA、ビスフェノールA・エチレンオキサイド付加物、ビスフェノールA・プロピレンオキサイド付加物等の多価アルコール化合物とエピハロヒドリンの縮合により製造されるアルコール系エポキシ化合物;アジピン酸、セバチン酸、ドデカンジカルボン酸、ダイマー酸、フタル酸、イソ、テレフタル酸、テトラヒドロフタル酸、メチルテトラヒドロフタル酸、ヘキサヒドロフタル酸、ヘット酸、ナジック酸、マレイン酸、コハク酸、フマル酸、トリメリット酸、ベンゼンテトラカルボン酸、ベンゾフェノンテトラカルボン酸、ナフタリンジカルボン酸、ジフェニルジカルボン酸等の多価カルボン酸化合物とエピハロヒドリンの縮合により製造されるグリシジルエステル系エポキシ化合物;エチレンジアミン、1,2−ジアミノプロパン、1,3−ジアミノプロパン、1,2−ジアミノブタン、1,3−ジアミノブタン、1,4−ジアミノブタン、1,5−ジアミノペンタン、1,6−ジアミノヘキサン、1,7−ジアミノヘプタン、1,8−ジアミノオクタン、ビス−(3−アミノプロピル)エーテル、1,2−ビス−(3−アミノプロポキシ)エタン、1,3−ビス−(3−アミノプロポキシ)−2,2’−ジメチルプロパン、1,2−、1,3−あるいは1,4−ビスアミノシクロヘキサン、1,3−あるいは1,4−ビスアミノメチルシクロヘキサン、1,3−あるいは1,4−ビスアミノエチルシクロヘキサン、1,3−あるいは1,4−ビスアミノプロピルシクロヘキサン、水添4,4’−ジアミノジフェニルメタン、イソホロンジアミン、1,4−ビスアミノプロピルピペラジン、m−、あるいはp−フェニレンジアミン、2,4−あるいは2,6−トリレンジアミン、m−、あるいはp−キシリレンジアミン、1,5−あるいは、2,6−ナフタレンジアミン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルエーテル、2,2−ビス(4,4’−ジアミノジフェニル)プロパン等の一級ジアミン、N,N’−ジメチルエチレンジアミン、N,N’−ジメチル−1,2−ジアミノプロパン、N,N’−ジメチル−1,3−ジアミノプロパン、N,N’−ジメチル−1,2 −ジアミノブタン、N,N’−ジメチル−1,3−ジアミノブタン、N,N’−ジメチル−1,4−ジアミノブタン、N,N’−ジメチル−1,5−ジアミノペンタン、N,N’−ジメチル−1,6−ジアミノヘキサン、N,N’−ジメチル−1,7−ジアミノヘプタン、N,N’−ジエチルエチレンジアミン、N,N’−ジエチル−1,2−ジアミノプロパン、N,N’−ジエチル−1,3−ジアミノプロパン、N,N’−ジエチル−1,2−ジアミノブタン、N,N’−ジエチル−1,3−ジアミノブタン、N,N’−ジエチル−1,4−ジアミノブタン、N,N’−ジエチル−1,6−ジアミノヘキサン、ピペラジン、2−メチルピペラジン、2,5−あるいは2,6−ジメチルピペラジン、ホモピペラジン、1,1−ジ−(4−ピペリジル)−メタン、1,2−ジ−(4−ピペリジル)−エタン、1,3−ジ−(4−ピペリジル)−プロパン、1,4−ジ−(4−ピペリジル)−ブタン等の二級ジアミンとエピハロヒドリンの縮合により製造されるアミン系エポキシ化合物;3、4−エポキシシクロヘキシルメチル−3、4−エポキシシクロヘキサンカルボキシレート、ビニルシクリヘキサンジオキサイド、2−(3、4−エポキシシクロヘキシル)−5、5−スピロ−3、4−エポキシシクロヘキサン−メタ−ジオキサン、ビス(3、4−エポキシシクロヘキシル)アジペート等の脂環式エポキシ化合物;シクロペンタジエンエポキシド、エポキシ化大豆油、エポキシ化ポリブタジエン、ビニルシクロヘキセンエポキシド等の不飽和化合物のエポキシ化により製造されるエポキシ化合物;上述の多価アルコール、フェノール化合物とジイソシアネートおよびグリシドール等から製造されるウレタン系エポキシ化合物等をあげることができる。 Specific examples of epoxy compounds include hydroquinone, catechol, resorcinol, bisphenol A, bisphenol F, bisphenol sulfone, bisphenol ether, bisphenol sulfide, bisphenol sulfide, halogenated bisphenol A, and condensation of epihalohydrin with a polyhydric phenol compound such as a novolak resin. Phenolic epoxy compounds produced; ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol , Neopentyl glycol, glycerin, trimethylolpropane trimethacrylate, pentaerythri Litol, 1,3- and 1,4-cyclohexanediol, 1,3- and 1,4-cyclohexanedimethanol, hydrogenated bisphenol A, bisphenol A / ethylene oxide adduct, bisphenol A / propylene oxide adduct, etc. Alcohol-based epoxy compounds produced by condensation of a polyhydric alcohol compound and epihalohydrin; adipic acid, sebacic acid, dodecanedicarboxylic acid, dimer acid, phthalic acid, iso, terephthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, hexahydrophthalic acid Polyvalent carboxylic acid compounds such as, hetonic acid, nadic acid, maleic acid, succinic acid, fumaric acid, trimellitic acid, benzenetetracarboxylic acid, benzophenonetetracarboxylic acid, naphthalenedicarboxylic acid, and diphenyldicarboxylic acid Glycidyl ester-based epoxy compound produced by the condensation of ethylene and epihalohydrin; ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,2-diaminobutane, 1,3-diaminobutane, 1,4-diaminobutane , 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, bis- (3-aminopropyl) ether, 1,2-bis- (3-aminopropoxy ) Ethane, 1,3-bis- (3-aminopropoxy) -2,2′-dimethylpropane, 1,2-, 1,3- or 1,4-bisaminocyclohexane, 1,3- or 1,4 -Bisaminomethylcyclohexane, 1,3- or 1,4-bisaminoethylcyclohexane, 1,3- or 1, 4-bisaminopropylcyclohexane, hydrogenated 4,4'-diaminodiphenylmethane, isophoronediamine, 1,4-bisaminopropylpiperazine, m- or p-phenylenediamine, 2,4- or 2,6-tolylenediamine , M- or p-xylylenediamine, 1,5- or 2,6-naphthalenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylether, 2,2-bis (4,4 ' Primary diamines such as -diaminodiphenyl) propane, N, N'-dimethylethylenediamine, N, N'-dimethyl-1,2-diaminopropane, N, N'-dimethyl-1,3-diaminopropane, N, N ' -Dimethyl-1,2-diaminobutane, N, N′-dimethyl-1,3-diaminobutane, N, N '-Dimethyl-1,4-diaminobutane, N, N'-dimethyl-1,5-diaminopentane, N, N'-dimethyl-1,6-diaminohexane, N, N'-dimethyl-1,7- Diaminoheptane, N, N'-diethylethylenediamine, N, N'-diethyl-1,2-diaminopropane, N, N'-diethyl-1,3-diaminopropane, N, N'-diethyl-1,2- Diaminobutane, N, N'-diethyl-1,3-diaminobutane, N, N'-diethyl-1,4-diaminobutane, N, N'-diethyl-1,6-diaminohexane, piperazine, 2-methyl Piperazine, 2,5- or 2,6-dimethylpiperazine, homopiperazine, 1,1-di- (4-piperidyl) -methane, 1,2-di- (4-piperidyl) -ethane, 1,3-di Amine-based epoxy compounds produced by condensation of a secondary diamine such as (4-piperidyl) -propane, 1,4-di- (4-piperidyl) -butane and epihalohydrin; 3,4-epoxycyclohexylmethyl-3,4 -Epoxycyclohexanecarboxylate, vinylcyclohexanedioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro-3,4-epoxycyclohexane-meta-dioxane, bis (3,4-epoxycyclohexyl) adipate Epoxy compounds produced by epoxidation of unsaturated compounds such as cyclopentadiene epoxide, epoxidized soybean oil, epoxidized polybutadiene, and vinylcyclohexene epoxide; the above-mentioned polyhydric alcohols, phenol compounds and diisocyanate Urethane-based epoxy compounds produced from bets and glycidol and the like.
公知のエピスルフィド化合物の具体例としては、以上のエポキシ化合物のエポキシ基の一部あるいは全てをエピスルフィド化して得られるエピスルフィド化合物をあげることができる。 Specific examples of known episulfide compounds include episulfide compounds obtained by episulfide-forming some or all of the epoxy groups of the above epoxy compounds.
多価カルボン酸、多価カルボン酸無水物、ポリフェノール、アミン類、等の具体例としては上述のエポキシ化合物のところで説明したエピハロヒドリンと反応させる相手の原料として上述したものをあげることができる。 Specific examples of polycarboxylic acids, polycarboxylic anhydrides, polyphenols, amines, and the like include those mentioned above as the raw materials to be reacted with epihalohydrin described in the above epoxy compound.
ポリメルカプタンとしては、具体的には、1,2−ジメルカプトエタン、1,3−ジメルカプトプロパン、1,4−ジメルカプトブタン、1,6−ジメルカプトヘキサン、ビス(2−メルカプトエチル)スルフィド、1,2−〔ビス(2−メルカプトエチルチオ)〕エタン等の直鎖状ジメルカプタン化合物;2−メルカプトメチル−1,3−ジメルカプトプロパン、2−メルカプトメチル−1,4−ジメルカプトブタン、2−(2−メルカプトエチルチオ)−1,3−ジメルカプトプロパン、1,2−ビス〔(2−メルカプトエチルチオ)〕−3−メルカプトプロパン、1,1,1−トリス(メルカプトメチル)プロパン、テトラキスメルカプトメチルメタン等の分岐状脂肪族ポリメルカプタン化合物;エチレングリコールジチオグリコレート、エチレングリコールジチオプロピオネート、1,4−ブタンジオールジチオグリコレート、1,4−ブタンジオールジチオプロピオネート、トリメチロールプロパントリス(β−チオグリコレート)、トリメチロールプロパントリス(β−チオプロピオネート)、ペンタエリスリトールテトラキス(β−チオグリコレート)、ペンタエリスリトールテトラキス、(β−チオプロピオネート)等の含エステル脂肪族ポリメルカプタン化合物;1,4−ジメルカプトシクロヘキサン、1,3−ジメルカプトシクロヘキサン、1,4−ジメルカプトメチルシクロヘキサン、1,3−ジメルカプトメチルシクロヘキサン、2,5−ジメルカプトメチル−1,4−ジチアン、2,5−ジメルカプトエチル−1,4−ジチアン、2,5−ジメルカプトメチル−1−チアン、2,5−ジメルカプトエチル−1−チアン等脂肪族環状ジメルカプタン化合物等をあげることができる。メルカプトアルコールの具体例としては、2−メルカプトエタノール、3−メルカプト−1−プロパノール、1−メルカプト−2−プロパノール、4−メルカプト−1−ブタノール、3−メルカプト−2−ブタノール、3−メルカプト−1,2−プロパンジオール、2−メルカプト−1,3−プロパンジオール、1,3−ジメルカプト−2−プロパノール、2,3−ジメルカプト−1−プロパノール、1−メルカプトメチル−1,1−ジメチロールプロパン、1,1−ビス(メルカプトメチル)−1−メチロールプロパン、メルカプトメチルトリス(ヒドロキシメチル)メタン、ビス(メルカプトメチル)ビス(ヒドロキシメチル)メタン、トリス(メルカプトメチル)ヒドロキシメチルメタン、2−(2−メルカプトエチルチオ)エタノール等を挙げることができる。メルカプトフェノールの具体例としては、4−メルカプトフェノール、2−メルカプトハイドロキノン、4−ヒドロキシ−4, −メルカプトビフェニル等を挙げることができる。メルカプトカルボン酸の具体例としては、チオグリコール酸、2−チオプロピオン酸、3−チオプロピオン酸、チオ乳酸、メルカプトコハク酸、チオリンゴ酸、N−(2−メルカプトプロピオニル)グリシン、2−メルカプト安息香酸、2−メルカプトニコチン酸、3,3−ジチオイソ楽酸等を挙げることができる。 Specific examples of the polymercaptan include 1,2-dimercaptoethane, 1,3-dimercaptopropane, 1,4-dimercaptobutane, 1,6-dimercaptohexane, and bis (2-mercaptoethyl) sulfide Linear dimercaptan compounds such as 1,1,2- [bis (2-mercaptoethylthio)] ethane; 2-mercaptomethyl-1,3-dimercaptopropane, 2-mercaptomethyl-1,4-dimercaptobutane , 2- (2-mercaptoethylthio) -1,3-dimercaptopropane, 1,2-bis [(2-mercaptoethylthio)]-3-mercaptopropane, 1,1,1-tris (mercaptomethyl) Branched aliphatic polymercaptan compounds such as propane and tetrakismercaptomethylmethane; ethylene glycol dithioglycolate , Ethylene glycol dithiopropionate, 1,4-butanediol dithioglycolate, 1,4-butanediol dithiopropionate, trimethylolpropane tris (β-thioglycolate), trimethylolpropane tris (β-thiopro Ester-containing aliphatic polymercaptan compounds such as pionate), pentaerythritol tetrakis (β-thioglycolate), pentaerythritol tetrakis, (β-thiopropionate); 1,4-dimercaptocyclohexane, 1,3-di Mercaptocyclohexane, 1,4-dimercaptomethylcyclohexane, 1,3-dimercaptomethylcyclohexane, 2,5-dimercaptomethyl-1,4-dithiane, 2,5-dimercaptoethyl-1,4-dithiane, , 5-dimercaptomethy And aliphatic cyclic dimercaptan compounds such as ru-1-thiane and 2,5-dimercaptoethyl-1-thiane. Specific examples of mercapto alcohol include 2-mercaptoethanol, 3-mercapto-1-propanol, 1-mercapto-2-propanol, 4-mercapto-1-butanol, 3-mercapto-2-butanol, and 3-mercapto-1 , 2-propanediol, 2-mercapto-1,3-propanediol, 1,3-dimercapto-2-propanol, 2,3-dimercapto-1-propanol, 1-mercaptomethyl-1,1-dimethylolpropane, 1,1-bis (mercaptomethyl) -1-methylolpropane, mercaptomethyltris (hydroxymethyl) methane, bis (mercaptomethyl) bis (hydroxymethyl) methane, tris (mercaptomethyl) hydroxymethylmethane, 2- (2- Mercaptoethylthio) ethanol And the like can be given. Specific examples of mercaptophenol include 4-mercaptophenol, 2-mercaptohydroquinone, 4-hydroxy-4, -mercaptobiphenyl and the like. Specific examples of mercaptocarboxylic acid include thioglycolic acid, 2-thiopropionic acid, 3-thiopropionic acid, thiolactic acid, mercaptosuccinic acid, thiomalic acid, N- (2-mercaptopropionyl) glycine, 2-mercaptobenzoic acid , 2-mercaptonicotinic acid, 3,3-dithioisomeric acid and the like.
また、以下にエピスルフィド基と反応可能な官能基1個以上と他の単独重合可能な官能基を1個以上有する化合物の代表的具体例を示す。不飽和基を有するエポキシ化合物としては、ビニルフェニルグリシジルエーテル、ビニルベンジルグリシジルエーテル、グリシジルメタクリレート、グリシジルアクリレート、アリルグリシジルエーテル等をあげることができる。不飽和基を有するエピスルフィド化合物としては上記の不飽和基を有するエポキシ化合物のエポキシ基をエピスルフィド化した化合物、例えば、ビニルフェニルチオグリシジルエーテル、ビニルベンジルチオグリシジルエーテル、チオグリシジルメタクリレート、チオグリシジルアクリレート、アリルチオグリシジルエーテル等をあげることができる。 In addition, representative specific examples of compounds having at least one functional group capable of reacting with an episulfide group and at least one other functional group capable of being homopolymerized are shown below. Examples of the epoxy compound having an unsaturated group include vinylphenyl glycidyl ether, vinylbenzyl glycidyl ether, glycidyl methacrylate, glycidyl acrylate, and allyl glycidyl ether. As the episulfide compound having an unsaturated group, a compound obtained by episulfide-forming an epoxy group of the epoxy compound having an unsaturated group described above, for example, vinylphenylthioglycidyl ether, vinylbenzylthioglycidyl ether, thioglycidyl methacrylate, thioglycidyl acrylate, Ali And luthioglycidyl ether.
不飽和基を有するカルボン酸化合物としては、アクリル酸、メタクリル酸、マレイン酸、無水マレイン酸、フマル酸等のα、β−不飽和カルボン酸類をあげることができる。また、不飽和基を有するアミド類としては、以上のα、β−不飽和カルボン酸類のアミドをあげることができる。 Examples of the carboxylic acid compound having an unsaturated group include α, β-unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, and fumaric acid. Examples of the amide having an unsaturated group include amides of the above α, β-unsaturated carboxylic acids.
また、エピスルフィド基と反応可能でかつ単独重合も可能な官能基を1個有する化合物の好ましい具体例としてはエポキシ基あるいはエピスルフィド基を1個有する化合物をあげることができる。より具体的には、エチレンオキサイド、プロピレオキサイド等のモノエポキシ化合物類、酢酸、プロピオン酸、安息香酸等のモノカルボン酸のグリシジルエステル類、メチルグリシジルエーテル、エチルグリシジルエーテル、プロピルグリシジルエーテル、ブチルグリシジルエーテル等のグリシジルエーテル類あるいは、エチレンスルフィド、プロピレンスルフィド等のモノエピスルフィド化合物、上述のモノカルボン酸とチオグリシドール(1、2−エピチオ−3−ヒドロキシプロパン)から誘導される構造を有するチオグリシジルエステル類、メチルチオグリシジルエーテル(1、2−エピチオプロピルオキシメタン)、エチルチオグリシジルエーテル、プロピルチオグリシジルエーテル、ブチルチオグリシジルエーテル等のチオグリシジルエーテル類をあげることができる。これらの中でより好ましいものはエピスルフィド基を1個有する化合物である。 Preferred specific examples of the compound having one functional group capable of reacting with an episulfide group and capable of homopolymerization include a compound having one epoxy group or one episulfide group. More specifically, monoepoxy compounds such as ethylene oxide and propylene oxide, glycidyl esters of monocarboxylic acids such as acetic acid, propionic acid and benzoic acid, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether and butyl glycidyl Glycidyl ethers such as ethers, monoepisulfide compounds such as ethylene sulfide and propylene sulfide, and thioglycidyl esters having a structure derived from the above-mentioned monocarboxylic acid and thioglycidol (1,2-epithio-3-hydroxypropane) Thioglycidyl ethers (1,2-epithiopropyloxymethane), ethylthioglycidyl ether, propylthioglycidyl ether, butylthioglycidyl ether, etc. It is possible to increase the ethers. Among these, a compound having one episulfide group is more preferable.
本発明の新規な脂肪族環状エピスルフィド化合物のエピスルフィド基と反応可能な官能基を2個以上有する化合物あるいは、これらの官能基1個以上と他の単独重合可能な官能基を1個以上有する化合物さらには、エピスルフィド基と反応可能でかつ単独重合も可能な官能基を1個有する化合物とは、硬化重合触媒の存在下、硬化重合し硬化樹脂を製造することができる。硬化触媒は、前述のアミン類、ホスフィン類、酸類等が使用される。具体例としては、前述のものがここでも使用される。 A compound having two or more functional groups capable of reacting with an episulfide group of the novel aliphatic cyclic episulfide compound of the present invention, or a compound having one or more of these functional groups and one or more other homopolymerizable functional groups, Is a compound having one functional group capable of reacting with an episulfide group and capable of being homopolymerized, and can be cured and polymerized in the presence of a curing polymerization catalyst to produce a cured resin. As the curing catalyst, the above-mentioned amines, phosphines, acids and the like are used. As specific examples, those described above are also used here.
さらに、不飽和基を有する化合物を使用する際には、重合促進剤として、ラジカル重合開始剤を使用する事は好ましい方法である。ラジカル重合開始剤とは、加熱あるいは紫外線や電子線によってラジカルを生成するものであれば良く、例えば、クミルパーオキシネオデカノエート、ジイソプロピルパーオキシジカーボネート、ジアリルパーオキシジカーボネート、ジ−n−プロピルパーオキシジカーボネート、ジミリスチルパーオキシジカーボネート、クミルパーオキシネオヘキサノエート、ter−ヘキシルパーオキシネオデカノエート、ter−ブチルパーオキシネオデカノエート、ter−ヘキシルパーオキシネオヘキサノエート、ter−ブチルパーオキシネオヘキサノエート、2,4−ジクロロベンゾイルパーオキサイド、ベンゾイルパーオキサイド、ジクミルパーオキサイド、ジ−ter−ブチルパーオキサイド等のパーオキサイド類;クメンヒドロパーオキサイド、ter−ブチルヒドロパーオキサイド等のヒドロパーオキサイド類;2,2’−アゾビス(4−メトキシ−2,4−ジメチルバレロニトリル)、2,2’−アゾビス(2−シクロプロピルプロピオニトリル)、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、2,2’−アゾビスイソブチロニトリル、2,2’−アゾビス(2−メチルブチロニトリル)、1,1’−アゾビス(シクロヘキサン−1−カルボニトリル)、1−〔(1−シアノ−1−メチルエチル)アゾ〕ホルムアミド、2−フェニルアゾ−4−トキシ−2,4−ジメチル−バレロニトリル2、2’−アゾビス(2−メチルプロパン)、2、2’−アゾビス(2、4、4−トリメチルペンタン)等のアゾ系化合物等の公知の熱重合触媒、ベンゾフェノン、ベンゾインベンゾインメチルエーテル等の公知の光重合触媒が挙げられる。これらのなかで好ましいものは、パーオキサイド類、ヒドロパーオキサイド類、アゾ系化合物であり、より好ましいものは、パーオキサイド類、アゾ系化合物であり、最も好ましいものは、2,2’−アゾビス(4−メトキシ−2,4−ジメチルバレロニトリル)、2,2’−アゾビス(2−シクロプロピルプロピオニトリル)、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、2,2’−アゾビスイソブチロニトリル、2,2’−アゾビス(2−メチルブチロニトリル)、1,1’−アゾビス(シクロヘキサン−1−カルボニトリル)、1−〔(1−シアノ−1−メチルエチル)アゾ〕ホルムアミド、2−フェニルアゾ−4−メトキシ−2,4−ジメチル−バレロニトリル、2、2’−アゾビス(2−メチルプロパン)2、2’−アゾビス、(2、4、4−トリメチルペンタン)等のアゾ系化合物である。またこれらは、全て混合使用することができる。ラジカル重合開始剤の配合量は、組成物の成分や硬化方法によって変化するので一慨には決められないが、通常は組成物総量に対して0.01wt%〜5.0wt%、好ましくは0.1wt%〜2.0wt%の範囲である。 Further, when a compound having an unsaturated group is used, it is preferable to use a radical polymerization initiator as a polymerization accelerator. The radical polymerization initiator is not particularly limited as long as it generates a radical by heating or ultraviolet light or an electron beam. For example, cumyl peroxy neodecanoate, diisopropyl peroxy dicarbonate, diallyl peroxy dicarbonate, di-n- Propyl peroxy dicarbonate, dimyristyl peroxy dicarbonate, cumyl peroxy neohexanoate, ter-hexyl peroxy neodecanoate, ter-butyl peroxy neodecanoate, ter-hexyl peroxy neodecanoate Peroxides such as tert-butylperoxyneohexanoate, 2,4-dichlorobenzoyl peroxide, benzoyl peroxide, dicumyl peroxide, di-tert-butyl peroxide; cumene hydroperoxide Hydroperoxides such as side and tert-butyl hydroperoxide; 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2-cyclopropylpropionitrile) 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobisisobutyronitrile, 2,2'-azobis (2-methylbutyronitrile), 1,1'-azobis (Cyclohexane-1-carbonitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2-phenylazo-4-tox-2,4-dimethyl-valeronitrile 2,2′-azobis (2 -Methylpropane), a known thermal polymerization catalyst such as an azo compound such as 2,2′-azobis (2,4,4-trimethylpentane), benzophenone, Known photopolymerization catalysts such zone in benzoin methyl ether. Of these, preferred are peroxides, hydroperoxides and azo compounds, more preferred are peroxides and azo compounds, and most preferred are 2,2′-azobis ( 4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2-cyclopropylpropionitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'- Azobisisobutyronitrile, 2,2'-azobis (2-methylbutyronitrile), 1,1'-azobis (cyclohexane-1-carbonitrile), 1-[(1-cyano-1-methylethyl) Azo] formamide, 2-phenylazo-4-methoxy-2,4-dimethyl-valeronitrile, 2,2'-azobis (2-methylpropane) 2,2 ' Azobis, azo compounds such as (2,4,4-trimethylpentane). These can all be mixed and used. Although the amount of the radical polymerization initiator varies depending on the components of the composition and the curing method, it cannot be generally determined, but is usually 0.01 wt% to 5.0 wt%, preferably 0 wt%, relative to the total amount of the composition. 0.1 wt% to 2.0 wt%.
また、本発明の新規な脂肪族環状エピスルフィド化合物を重合硬化して硬化樹脂得るに際し、公知の酸化防止剤、紫外線吸収剤等の添加剤を加えて、得られる材料の実用性をより向上せしめることはもちろん可能である。また公知の外部および/または内部離型剤を使用または添加して、得られる硬化材料の型からの離型性を向上せしめることも可能である。ここに言う内部離型剤とは、フッ素系ノニオン界面活性剤、シリコン系ノニオン界面活性剤、アルキル第4級アンモニウム塩、燐酸エステル、酸性燐酸エステル、オキシアルキレン型酸性燐酸エステル、酸性燐酸エステルのアルカリ金属塩、オキシアルキレン型酸性燐酸エステルのアルカリ金属塩、、高級脂肪酸の金属塩、高級脂肪酸エステル、パラフィン、ワックス、高級脂肪族アミド、高級脂肪族アルコール、ポリシロキサン類、脂肪族アミンエチレンオキシド付加物等があげられる。 In addition, when the novel aliphatic cyclic episulfide compound of the present invention is polymerized and cured to obtain a cured resin, known additives such as an antioxidant and an ultraviolet absorber are added to further improve the practicality of the obtained material. Is of course possible. It is also possible to use or add known external and / or internal release agents to improve the releasability of the resulting cured material from the mold. The term "internal release agent" as used herein means a fluorine-based nonionic surfactant, a silicon-based nonionic surfactant, an alkyl quaternary ammonium salt, a phosphoric ester, an acidic phosphate, an oxyalkylene-type acidic phosphate, or an alkali of an acidic phosphate. Metal salts, alkali metal salts of oxyalkylene type acidic phosphates, metal salts of higher fatty acids, higher fatty acid esters, paraffins, waxes, higher fatty amides, higher fatty alcohols, polysiloxanes, aliphatic amine ethylene oxide adducts, etc. Is raised.
本発明の新規な脂肪族環状エピスルフィド化合物を重合硬化して硬化樹脂を得るに際し、原料となる、エピスルフィド化合物さらには所望に応じて前述の硬化触媒、不飽和基を有するエピスルフィド基と反応可能な例えばグリシジルメタクリレート、チオグリシジルメタクリレート(グリシジルメタクリレートのエポキシ基をエピスルフィド化したもの)等を併用する場合、ラジカル重合開始剤、ラジカル重合可能な単量体、さらには離型剤、酸化防止剤、紫外線吸収剤等の添加剤混合後、次の様にして重合硬化してレンズ等の光学材料とされる。即ち、混合後の原料をガラスや金属製の型に注入し、加熱によって重合硬化反応を進めた後、型から外し製造される。硬化時間は0.1〜100時間、通常1〜48時間であり、硬化温度は−10〜160℃、通常−10〜140℃である。また、硬化終了後、材料を50から150℃の温度で10分から5時間程度アニール処理を行う事は、本発明の光学材料の歪を除くために好ましい処理である。さらに必要に応じてハードコート、反射防止、防曇性付与等表面処理を行うことができる。本発明の硬化樹脂光学材料の製造方法は、さらに詳しく述べるならば以下の通りである。前述の様に、主原料および副原料を混合後、型に注入硬化して製造されるが、主原料であるジエピスルフィド化合物と所望により使用されるエピスルフィド基と反応可能な官能基を2個以上有する化合物あるいは、これらの官能基1個以上と他の単独重合可能な官能基を1個以上有する化合物、エピスルフィド基と反応可能でかつ単独重合も可能な官能基を1個有する化合物さらには所望に応じて使用される、硬化触媒、ラジカル重合開始剤、さらには離型剤、安定剤等は、全て同一容器内で同時に攪拌下に混合しても、各原料を段階的に添加混合しても、数成分を別々に混合後さらに同一容器内で再混合しても良い。混合にあたり、設定温度、これに要する時間等は基本的には各成分が十分に混合される条件であればよいが、過剰の温度、時間は各原料、添加剤間の好ましくない反応が起こり、さらには粘度の上昇を来たし注型操作を困難にする等適当ではない。混合温度は−10℃から100℃程度の範囲で行われるべきであり、好ましい温度範囲は−10℃から50℃、さらにに好ましいのは、−5℃から30℃である。混合時間は、1分から5時間、好ましくは5分から2時間、さらに好ましくは5分から30分、最も好ましいのは5分から15分程度である。各原料、添加剤の混合前、混合時あるいは混合後に、減圧下に脱ガス操作を行う事は、後の注型重合硬化中の気泡発生を防止する点からは好ましい方法である。この時の減圧度は0.1mmHgから700mmHg程度で行うが、好ましいのは10mmHgから300mmHgである。さらに、型に注入に際して、ミクロフィルター等で不純物等を濾過し除去することは本発明の光学材料の品質をさらに高める上からも好ましい。 When polymerizing and curing the novel aliphatic cyclic episulfide compound of the present invention to obtain a cured resin, the raw material, the episulfide compound and, if desired, the above-mentioned curing catalyst, capable of reacting with an episulfide group having an unsaturated group, for example, When using glycidyl methacrylate, thioglycidyl methacrylate (episulfide of glycidyl methacrylate), a radical polymerization initiator, a radically polymerizable monomer, a mold release agent, an antioxidant, an ultraviolet absorber After the addition of the additives, the composition is polymerized and cured in the following manner to obtain an optical material such as a lens. That is, the raw material after mixing is poured into a glass or metal mold, the polymerization and curing reaction is advanced by heating, and then the mold is removed from the mold. The curing time is from 0.1 to 100 hours, usually from 1 to 48 hours, and the curing temperature is from -10 to 160C, usually from -10 to 140C. After the curing is completed, annealing the material at a temperature of 50 to 150 ° C. for about 10 minutes to 5 hours is a preferable treatment for removing the distortion of the optical material of the present invention. Further, if necessary, a surface treatment such as hard coating, antireflection, imparting anti-fogging property can be performed. The method for producing the cured resin optical material of the present invention will be described below in more detail. As described above, the main raw material and the auxiliary raw material are mixed and then injection-hardened into a mold. The die raw material is a main raw material and two or more functional groups capable of reacting with an episulfide group used as desired. Or a compound having at least one of these functional groups and at least one other functional group capable of homopolymerization, a compound having one functional group capable of reacting with an episulfide group and capable of homopolymerization, and further desirably. Depending on the curing catalyst, radical polymerization initiator, further mold release agent, stabilizer, etc., all may be mixed under stirring simultaneously in the same container, or each material may be added and mixed stepwise. After several components are separately mixed, they may be mixed again in the same container. Upon mixing, the set temperature, the time required for the mixing, etc. may be basically any conditions under which each component is sufficiently mixed, but an excessive temperature and time may cause an undesired reaction between each raw material and additive, Further, it is not appropriate because the viscosity increases and the casting operation becomes difficult. The mixing temperature should be in the range of about -10 ° C to 100 ° C, the preferred temperature range is -10 ° C to 50 ° C, more preferably -5 ° C to 30 ° C. The mixing time is 1 minute to 5 hours, preferably 5 minutes to 2 hours, more preferably 5 minutes to 30 minutes, and most preferably about 5 minutes to 15 minutes. Performing a degassing operation under reduced pressure before, during or after mixing of the raw materials and additives is a preferable method from the viewpoint of preventing the formation of bubbles during the subsequent casting and curing. At this time, the degree of pressure reduction is from about 0.1 mmHg to 700 mmHg, preferably from 10 mmHg to 300 mmHg. Further, it is preferable to remove impurities and the like by filtering them with a micro filter or the like at the time of injection into the mold from the viewpoint of further improving the quality of the optical material of the present invention.
本発明の新規なエピスルフィド化合物により、従来技術の化合物を原料とする限り困難であった十分に高い屈折率と、良好な屈折率とアッベ数のバランスを有する樹脂光学材料が可能となった。すなわち本発明の新規な化合物により樹脂光学材料の軽量化、薄肉化および色収差の低減化が格段に進歩することとなった。また、本発明の新規な硬化樹脂材料は、耐熱性、強度にも優れ各種用途に使用できる。 The novel episulfide compound of the present invention has made it possible to obtain a resin optical material having a sufficiently high refractive index and a good balance between the refractive index and the Abbe number, which were difficult as long as the compound of the prior art was used as a raw material. That is, the novel compound of the present invention has made remarkable progress in reducing the weight, thickness, and reducing chromatic aberration of the resin optical material. Further, the novel cured resin material of the present invention has excellent heat resistance and strength and can be used for various applications.
以下、実施例により本発明を具体的に説明するが、本発明はこれらに限定されるものではない。なお、得られた重合物の性能測定は以下の測定法で行った。屈折率、アッベ数:アッベ屈折計を用い、25℃で測定した。比重:電子比重計を用いて25℃で測定し、常法により補正した。耐熱性:ビカット軟化点が120℃以上のものを○、120℃未満80℃以上のものを△、80℃未満のものを×とした。強度:オートグラフを用いた3点曲げ試験測定において、歪が0.1以上のものを○、0.1未満0.05以上のものを△、0.05未満のものを×とした。 Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto. In addition, the performance of the obtained polymer was measured by the following measurement method. Refractive index, Abbe number: Measured at 25 ° C. using an Abbe refractometer. Specific gravity: Measured at 25 ° C. using an electronic hydrometer and corrected by a conventional method. Heat resistance: A sample having a Vicat softening point of 120 ° C. or higher was rated as ○, a sample having a Vicat softening point of less than 120 ° C. and 80 ° C. or higher was rated △, and a sample having a Vicat softening point lower than 80 ° C. was rated X. Strength: In a three-point bending test measurement using an autograph, those with a strain of 0.1 or more were rated as ○, those with less than 0.1 and 0.05 or more as Δ, and those with less than 0.05 as x.
実施例1
1,4−ビス(メルカプトメチル)ベンゼン170.3gとエピクロルヒドリン185.1gを液温を10℃まで冷却し、水酸化ナトリム水溶液0.4gを水4mlに溶かした水溶液とメタノール40mlを加え、この温度で1時間攪拌した。その後、水酸化ナトリウム80.0gを水80mlに溶かした水溶液を、液温0〜10℃前後に保ちながら滴下し、この温度で3時間攪拌した。反応混合物に水200mlを加え、トルエン300mlで抽出し、トルエン層を硫酸ナトリウムで乾燥させ、溶媒を留去し、無色透明液体の1,4−ビス(グリシジルチオメチル)ベンゼンを275.8g(理論量の97%)得た。次いで、攪拌器、温度計、窒素導入管を装着したフラスコに、1,4−ビス(グリシジルチオメチル)ベンゼン142.2gとチオ尿素304.2gと無水酢酸11.3gとさらに溶媒としてトルエン1Lおよびメタノール1Lを仕込み、30℃で9時間反応した。反応後トルエンで抽出し、1%硫酸水溶液で洗浄、水洗後過剰の溶媒を留去したところ、141.5gの生成物を得た。元素分析、質量分析、NMR分析、IR分析から、生成物は1,4−ビス(β−エピチオプロピルチオメチル)ベンゼンと判明した(収率90%)。
元素分析値: (分析値) (計算値)
C 53.30% 53.46%
H 5.91% 5.77%
S 40.50% 40.78%
マススペクトル(EI):M+ 314(理論分子量314)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)
1H−NMR:7.2ppm(t,1H)7.0ppm(m,3H)3.6ppm(m,2H)3.1ppm(m,2H)3.0ppm(m,2H)2.7ppm(m,2H)2.6ppm(m,2H)2.2ppm(m,2H)さらに、本化合物100重量部に、N,N−ジエチルエタノールアミンを0.5重量部配合し、これを厚さ2mmに調節した2枚のガラス板からなるモールド中に注入し、80℃で5時間重合硬化し、光学材料を得た。得られた材料の屈折率、アッベ数および比重を測定し、結果を表1に示した。
Example 1
170.3 g of 1,4-bis (mercaptomethyl) benzene and 185.1 g of epichlorohydrin were cooled to 10 ° C., and an aqueous solution obtained by dissolving 0.4 g of an aqueous sodium hydroxide solution in 4 ml of water and 40 ml of methanol were added. For 1 hour. Thereafter, an aqueous solution in which 80.0 g of sodium hydroxide was dissolved in 80 ml of water was added dropwise while maintaining the liquid temperature at about 0 to 10 ° C, and the mixture was stirred at this temperature for 3 hours. 200 ml of water was added to the reaction mixture, extracted with 300 ml of toluene, the toluene layer was dried over sodium sulfate, the solvent was distilled off, and 275.8 g of 1,4-bis (glycidylthiomethyl) benzene as a colorless and transparent liquid (theoretical). 97% of the amount). Next, 142.2 g of 1,4-bis (glycidylthiomethyl) benzene, 304.2 g of thiourea, 11.3 g of acetic anhydride, and 1 L of toluene as a solvent were placed in a flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube. 1 L of methanol was charged and reacted at 30 ° C. for 9 hours. After the reaction, the mixture was extracted with toluene, washed with a 1% aqueous sulfuric acid solution, washed with water, and the excess solvent was distilled off to obtain 141.5 g of a product. The product was found to be 1,4-bis (β-epithiopropylthiomethyl) benzene from elemental analysis, mass analysis, NMR analysis and IR analysis (yield 90%).
Elemental analysis value : (Analysis value) (Calculated value)
C 53.30% 53.46%
H 5.91% 5.77%
S 40.50% 40.78%
Mass spectrum (EI): M @ + 314 (theoretical molecular weight: 314)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring)
1 H-NMR : 7.2 ppm (t, 1H) 7.0 ppm (m, 3H) 3.6 ppm (m, 2H) 3.1 ppm (m, 2H) 3.0 ppm (m, 2H) 2.7 ppm (m , 2H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H) Further, 100 parts by weight of the present compound was mixed with 0.5 part by weight of N, N-diethylethanolamine, and this was added to a thickness of 2 mm. The mixture was poured into a mold composed of two adjusted glass plates and polymerized and cured at 80 ° C. for 5 hours to obtain an optical material. The refractive index, Abbe number and specific gravity of the obtained material were measured, and the results are shown in Table 1.
実施例2
実施例1において、1,4−ビス(メルカプトメチル)ベンゼンの代わりに、1,4−ビス(メルカプトメチル)シクロヘキサンを使用する以外は、実施例1を繰り返し、2,5−ビス(β−エピチオプロピルチオメチル)シクロヘキサンを総収率80%で得た。
元素分析値: (分析値) (計算値)
C 52.34% 52.45%
H 7.66% 7.55%
S 39.90% 40.01%
マススペクトル(EI):M+ ・ 320(理論分子量320)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)
1H−NMR:3.2−2.9ppm(m,10H)2.7ppm(m,2H)2.6ppm(m,2H)2.2ppm(m,2H)3.0ppm(m,2H)1.9〜0.9ppm(m,8H)2.6ppm(m,2H)2.2ppm(m,2H)
Example 2
Example 1 was repeated, except that 1,4-bis (mercaptomethyl) cyclohexane was used instead of 1,4-bis (mercaptomethyl) benzene. Thiopropylthiomethyl) cyclohexane was obtained in a total yield of 80%.
Elemental analysis value : (Analysis value) (Calculated value)
C 52.34% 52.45%
H 7.66% 7.55%
S 39.90% 40.01%
Mass spectrum (EI): M + · 320 (theoretical molecular weight: 320)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring)
1 H-NMR : 3.2-2.9 ppm (m, 10H) 2.7 ppm (m, 2H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H) 3.0 ppm (m, 2H) 1 0.9 to 0.9 ppm (m, 8H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H)
実施例3(式(2)においてZ=H、U=H、m=1、n=0)実施例1において、1,4−ビス(メルカプトメチル)ベンゼンの代わりに、2,5−ビス(メルカプトメチル)−1,4−ジチアンを使用する以外は、実施例1を繰り返し、2,5−ビス(β−エピチオプロピルチオメチル)−1,4−ジチアンを総収率82%で得た。
元素分析値: (分析値) (計算値)
C 40.33% 40.41%
H 5.77% 5.65%
S 53.79% 53.94%
マススペクトル(EI):M+・356(理論分子量356)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)
1H−NMR:3.2−2.9ppm(m,14H)2.7ppm(m,2H)2.6ppm(m,2H)2.2ppm(m,2H)重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。
Example 3 (Z = H, U = H, m = 1, n = 0 in the formula (2)) In Example 1, instead of 1,4-bis (mercaptomethyl) benzene, 2,5-bis ( Example 1 was repeated except that mercaptomethyl) -1,4-dithiane was used to obtain 2,5-bis (β-epithiopropylthiomethyl) -1,4-dithiane in a total yield of 82%. .
Elemental analysis value : (Analysis value) (Calculated value)
C 40.33% 40.41%
H 5.77% 5.65%
S 53.79% 53.94%
Mass spectrum (EI): M + · 356 (theoretical molecular weight: 356)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring)
1 H-NMR : 3.2-2.9 ppm (m, 14H) 2.7 ppm (m, 2H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H) The refractive index, Abbe number and specific gravity were measured, and the results are shown in Table 1.
実施例4(式(2)においてZ=H、U=H、m=2、n=0)実施例1において1,4−ビス(メルカプトメチル)ベンゼンの代わりに2,5−ビス(メルカプトエチル)−1,4−ジチアンを使用する以外は実施例1を繰り返し、2,5−ビス(β−エピチオプロピルチオエチル)− 1,4−ジチアンを総収率85%で得た。
元素分析値: (分析値) (計算値)
C 43.55% 43.71%
H 6.39% 6.29%
S 49.81% 50.01%
マススペクトル(EI):M+ ・ 384(理論分子量384)
赤外吸収スペクトル:620cm- 1 (エピスルフィド環の伸縮振動)
1 H−NMR:3.2−2.9ppm(m,14H)2.7ppm(m,2H)2.6ppm(m,2H)2.2ppm(m,2H)2.0ppm(m,4H)重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。
Example 4 (Z = H, U = H, m = 2, n = 0 in the formula (2)) In Example 1, 2,5-bis (mercaptoethyl) was used instead of 1,4-bis (mercaptomethyl) benzene. ) Example 1 was repeated except that -1,4-dithiane was used, and 2,5-bis (β-epithiopropylthioethyl) -1,4-dithiane was obtained in a total yield of 85%.
Elemental analysis value : (Analysis value) (Calculated value)
C 43.55% 43.71%
H 6.39% 6.29%
S 49.81% 50.01%
Mass spectrum (EI): M @ + .384 (theoretical molecular weight: 384)
Infrared absorption spectrum : 620 cm-1 (stretching vibration of episulfide ring)
1 H-NMR : 3.2-2.9 ppm (m, 14H) 2.7 ppm (m, 2H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H) 2.0 ppm (m, 4H) After curing, the refractive index, Abbe number, and specific gravity of the obtained material were measured, and the results are shown in Table 1.
実施例5(式(2)においてZ=H、U=H、m=1、n=1)実施例1において1,4−ビス(メルカプトメチル)ベンゼンの代わりに2,5−ビス(メルカプトエチルチオメチル)−1,4−ジチアンを使用する以外は実施例1を繰り返し、2,5−ビス(β−エピチオプロピルチオエチルチオメチル)−1,4−ジチアンを総収率87%で得た。
元素分析値: (分析値) (計算値)
C 40.19% 40.29%
H 6.05% 5.92%
S 43.70% 53.79%
マススペクトル(EI):M+・476(理論分子量476)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)
1H−NMR:3.2−2.8ppm(m,22H)2.7ppm(m,2H)2.6ppm(m,2H)2.2ppm(m,2H)重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。
Example 5 (Z = H, U = H, m = 1, n = 1 in the formula (2)) In Example 1, 2,5-bis (mercaptoethyl) was used instead of 1,4-bis (mercaptomethyl) benzene. Example 1 was repeated except that thiomethyl) -1,4-dithiane was used to obtain 2,5-bis (β-epithiopropylthioethylthiomethyl) -1,4-dithiane in a total yield of 87%. Was.
Elemental analysis value : (Analysis value) (Calculated value)
C 40.19% 40.29%
H 6.05% 5.92%
S 43.70% 53.79%
Mass spectrum (EI): M@+.476 (theoretical molecular weight: 476)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring)
1 H-NMR : 3.2-2.8 ppm (m, 22H) 2.7 ppm (m, 2H) 2.6 ppm (m, 2H) 2.2 ppm (m, 2H) The refractive index, Abbe number and specific gravity were measured, and the results are shown in Table 1.
実施例6(式(2)においてZ=CH2SEps、U=H、m=1、n=0)実施例1において1,4−ビス(メルカプトメチル)ベンゼンの代わりに2,3,5,6−テトラキス(メルカプトメチル)−1,4−ジチアンを使用する以外は実施例1を繰り返し、2,3,5,6−テトラキス(β−エピチオプロピルチオメチル)−1,4−ジチアンを総収率82%で得た。
元素分析値: (分析値) (計算値)
C 40.39% 40.50%
H 5.55% 5.44%
S 53.99% 54.06%
マススペクトル(EI):M+・592(理論分子量592)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)
1H−NMR:3.3−2.9ppm(m,20H)2.7ppm(m,4H)2.6ppm(m,4H)2.2ppm(m,4H)重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。
Example 6 (in the formula (2), Z = CH2SEps, U = H, m = 1, n = 0) In Example 1, instead of 1,4-bis (mercaptomethyl) benzene, 2,3,5,6- Example 1 was repeated except that tetrakis (mercaptomethyl) -1,4-dithiane was used to obtain 2,3,5,6-tetrakis (β-epithiopropylthiomethyl) -1,4-dithiane in total yield. Obtained at 82%.
Elemental analysis value : (Analysis value) (Calculated value)
C 40.39% 40.50%
H 5.55% 5.44%
S 53.99% 54.06%
Mass spectrum (EI): M + .592 (theoretical molecular weight 592)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring)
1 H-NMR : 3.3-2.9 ppm (m, 20H) 2.7 ppm (m, 4H) 2.6 ppm (m, 4H) 2.2 ppm (m, 4H) The refractive index, Abbe number and specific gravity were measured, and the results are shown in Table 1.
実施例7実施例1において1,4−ビス(メルカプトメチル)ベンゼンの代わりに2−(2−メルカプトエチルチオ)−1,3−ジメルカプトプロパンを使用する以外は実施例1を繰り返し、2−(2−β−エピチオプロピルチオ)プロパンを総収率85%で得た。 元素分析値: (分析値) (計算値)
C 45.15% 40.34%
H 5.99% 5.80%
S 53.69% 53.85%
マススペクトル(EI):M+・416(理論分子量416)
赤外吸収スペクトル:620cm-1(エピスルフィド環の伸縮振動)重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。
Example 7 Example 1 was repeated except that 2- (2-mercaptoethylthio) -1,3-dimercaptopropane was used in place of 1,4-bis (mercaptomethyl) benzene. (2-β-epithiopropylthio) propane was obtained in a total yield of 85%. Elemental analysis value : (Analysis value) (Calculated value)
C 45.15% 40.34%
H 5.99% 5.80%
S 53.69% 53.85%
Mass spectrum (EI): M + · 416 (theoretical molecular weight: 416)
Infrared absorption spectrum : 620 cm -1 (stretching vibration of episulfide ring) After polymerization and curing, the refractive index, Abbe number and specific gravity of the obtained material were measured, and the results are shown in Table 1.
比較例1実施例1において、1,4−ビス(メルカプトメチル)ベンゼンの代わりに2,5−ビス(ヒドロキシメチル)−1,4−ジオキサンを使用する以外は実施例1を繰り返し、2,5−ビス(β−エピチオプロピルオキシメチル)−1,4−ジオキサンを総収率52%で得た。重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。 Comparative Example 1 Example 1 was repeated except that 2,5-bis (hydroxymethyl) -1,4-dioxane was used instead of 1,4-bis (mercaptomethyl) benzene. -Bis (β-epithiopropyloxymethyl) -1,4-dioxane was obtained in a total yield of 52%. After the polymerization and curing, the refractive index, Abbe number, and specific gravity of the obtained material were measured, and the results are shown in Table 1.
比較例2実施例1において、1,4−ビス(メルカプトメチル)ベンゼンの代わりに2,5−ビス(ヒドロキシエチルオキシメチル)−1,4−ジオキサンを使用する以外は実施例1を繰り返し、2,5−ビス(β−エピチオプロピルオキシエチルオキシメチル)−1,4−ジオキサンを総収率55%で得た。重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を、表1に示した。 Comparative Example 2 Example 1 was repeated except that 2,5-bis (hydroxyethyloxymethyl) -1,4-dioxane was used in place of 1,4-bis (mercaptomethyl) benzene. , 5-Bis (β-epithiopropyloxyethyloxymethyl) -1,4-dioxane was obtained in a total yield of 55%. After the polymerization and curing, the refractive index, Abbe number, and specific gravity of the obtained material were measured, and the results are shown in Table 1.
比較例3実施例1において、1,4−ビス(グリシジルチオメチル)ベンゼン162.3グラムに対してチオ尿素を50グラム使用する以外は実施例1を繰り返した。得られた生成物は、NMRスペクトルより式(1)のZ=H、U=H、m=1、n=0であり、式(2)のX中のSの個数は三員環を構成するSとOの合計に対して平均で30%であった。重合硬化後、得られた材料の屈折率、アッベ数および比重を測定し結果を表1に示した。 Comparative Example 3 Example 1 was repeated, except that 50 g of thiourea was used for 162.3 g of 1,4-bis (glycidylthiomethyl) benzene. From the NMR spectrum, the obtained product has Z = H, U = H, m = 1, and n = 0 in the formula (1), and the number of S in X in the formula (2) forms a three-membered ring. The average was 30% of the total of S and O. After the polymerization and curing, the refractive index, Abbe number and specific gravity of the obtained material were measured, and the results are shown in Table 1.
比較例41,8−ジメルカプト−4−メルカプトメチル−3,6−ジチアオクタン48重量部とメタキシリレンジイソシアネート52重量部の混合物に硬化触媒としてジブチルスズクロライドを混合物100重量部に対して0.1重量部配合後、均一液とし、さらに10mmHgの減圧下十分に脱気を行った。ついでモールドに注入後、オーブン中で80℃、20時間重合硬化した。得られた材料の屈折率、アッベ数および比重を測定し結果を表1に示した。 Comparative Example 4 Dibutyltin chloride was used as a curing catalyst in a mixture of 48 parts by weight of 1,8-dimercapto-4-mercaptomethyl-3,6-dithiaoctane and 52 parts by weight of metaxylylene diisocyanate in an amount of 0.1 part by weight based on 100 parts by weight of the mixture. After blending, the mixture was made a homogeneous liquid, and further degassed sufficiently under a reduced pressure of 10 mmHg. Then, after pouring into the mold, polymerization curing was performed at 80 ° C. for 20 hours in an oven. The refractive index, Abbe number and specific gravity of the obtained material were measured, and the results are shown in Table 1.
Claims (7)
(式中、XはSまたはOを表し、このSの個数は3員環を構成するSとOの合計に対して平均で50%以上である。)
(In the formula, X represents S or O, and the number of S is 50% or more on average with respect to the total of S and O constituting the three-membered ring.)
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