JP2004256562A - Fluorine-containing compound, polymerizable fluorine-containing monomer, fluorine-containing polymer compound, resist material using them, pattern formation method, and production method for fluorine-containing compound - Google Patents
Fluorine-containing compound, polymerizable fluorine-containing monomer, fluorine-containing polymer compound, resist material using them, pattern formation method, and production method for fluorine-containing compound Download PDFInfo
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- JP2004256562A JP2004256562A JP2003045329A JP2003045329A JP2004256562A JP 2004256562 A JP2004256562 A JP 2004256562A JP 2003045329 A JP2003045329 A JP 2003045329A JP 2003045329 A JP2003045329 A JP 2003045329A JP 2004256562 A JP2004256562 A JP 2004256562A
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- Prior art keywords
- fluorine
- group
- general formula
- compound
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- 229910052731 fluorine Inorganic materials 0.000 title claims abstract description 133
- 239000011737 fluorine Substances 0.000 title claims abstract description 129
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 title claims abstract description 127
- 150000001875 compounds Chemical class 0.000 title claims abstract description 120
- 239000000178 monomer Substances 0.000 title claims abstract description 50
- 229920000642 polymer Polymers 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000007261 regionalization Effects 0.000 title claims abstract 3
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 title description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 17
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 15
- 125000003118 aryl group Chemical group 0.000 claims abstract description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 10
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims abstract description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 49
- 229960000834 vinyl ether Drugs 0.000 claims description 35
- 239000002253 acid Substances 0.000 claims description 30
- 239000002994 raw material Substances 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- 239000001257 hydrogen Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- 239000011259 mixed solution Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 8
- 125000001153 fluoro group Chemical group F* 0.000 abstract description 4
- 125000004429 atom Chemical group 0.000 abstract 1
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- 239000000243 solution Substances 0.000 description 20
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 14
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- 239000007864 aqueous solution Substances 0.000 description 12
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
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- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
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- 125000000524 functional group Chemical group 0.000 description 7
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 150000003384 small molecules Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical class [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 229940052303 ethers for general anesthesia Drugs 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229920001567 vinyl ester resin Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 150000002222 fluorine compounds Chemical class 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 2
- 238000004293 19F NMR spectroscopy Methods 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 0 CCC1C(C2)C(CC(C(F)(F)F)(C(F)(F)F)O)CC2C1*C Chemical compound CCC1C(C2)C(CC(C(F)(F)F)(C(F)(F)F)O)CC2C1*C 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 238000005698 Diels-Alder reaction Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
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- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
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- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
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- 150000002367 halogens Chemical class 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
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- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 2
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- 125000005907 alkyl ester group Chemical group 0.000 description 1
- AFVLVVWMAFSXCK-VMPITWQZSA-N alpha-cyano-4-hydroxycinnamic acid Chemical group OC(=O)C(\C#N)=C\C1=CC=C(O)C=C1 AFVLVVWMAFSXCK-VMPITWQZSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
【0001】
本発明は、分子内にカルボン酸又は特定の酸性官能基を有するフッ素系の原料化合物に対してビニルエーテル、特に脂環構造を含有したビニルエーテル、含フッ素ビニルエーテル、又はジビニルエーテルを反応させることで容易に酸不安定基を導入させた含フッ素化合物、含フッ素重合性単量体、含フッ素高分子化合物及びそれらの製造方法に関する。また、その含フッ素化合物を用いたフォトレジスト、及びパターン形成方法に関する。
【0002】
【発明の属する技術分野】
本発明は、含フッ素化合物、含フッ素重合性単量体、含フッ素高分子化合物、それらを用いたレジスト材料とパターン形成方法、及び含フッ素化合物の製造方法に関する。
【0003】
【従来の技術】
フッ素系化合物は、フッ素の持つ撥水性、撥油性、低吸水性、耐熱性、耐候性、耐腐食性、透明性、感光性、低屈折率性、低誘電性などの特徴から先端材料分野を中心として幅広い応用分野で使用又は開発が続けられている。最近、フッ素系化合物の紫外線領域、特に、真空紫外波長域での透明性を応用したフォトレジスト材料など活発な研究開発が行われている。これらの応用分野において共通の高分子設計としては、できるだけ多くのフッ素を導入することで各使用波長での透明性を実現しつつ、基板への密着性、高いガラス転移点を感光性挙動とともに実現させようとするものである。例えば、テトラフルオロエチレン、環状フッ素モノマー、フッ素系スチレン、ヒドロキシ基含有のフッ素系ノルボルネン化合物、含フッ素化合物の環化重合体などにより、各波長での透明性が増大することが報告されている。また、一般に、ポリマーをフォトレジストとして使用する場合、酸発生剤を加えた化学増幅型の感光性機構を利用することが多い(例えば、非特許文献1)。その際、高分子骨格内に酸不安定基を含有させた組成が必要とされている。しかしながら、その酸不安定基としては限られた構造のものしか報告されておらず、しかもその多くは透明性を低下させてしまう。そこで、感光性効率が高く、かつ酸不安定基自体の透明性やエッチング耐性を高めた構造が必要とされている。また環状のフッ素系化合物を有することでエッチング耐性を高めようとする流れがあるが、十分ではなく、酸不安定基自体にもエッチング耐性を付与させる工夫が必要である。
【0004】
【非特許文献1】
ChulHo Park,Tsuguo Yamaoka, et al., J. Photopolym. Sci. Technol., 15, 141−144(2002)
【0005】
【発明が解決しようとする課題】
本発明は、含フッ素化合物にとって効果的な酸不安定基を提供し、さらに、酸不安定基自体に高い透明性、エッチング耐性を持たせた含フッ素化合物、含フッ素重合性単量体、含フッ素高分子化合物、それらを用いたフォトレジスト、パターン形成方法、及びこれらの含フッ素化合物の製造方法を提供するものである。
【0006】
【課題を解決するための手段】
本発明者らは、前記の課題を解決するために鋭意検討を重ねた結果、高い酸強度を有するカルボン酸や芳香族に直結したヘキサフルオロカルビノールに対してビニルエーテル系化合物を反応させた基がフッ素系高分子にとって効果的な酸不安定基として働くことを見出した。さらにフッ素、環構造などを持たせた特定のビニルエーテルを反応させることで酸不安定基自体が高い透明性、エッチング耐性を有した含フッ素化合物、重合性単量体、高分子化合物となることも発見し、本発明を完成するに至った。
【0007】
すなわち、本発明は、分子内に、フッ素および、カルボン酸基又は芳香族ヘキサフルオロカルビノール基を含有した官能基を併せ持つ化合物に対して、ビニルエーテルを反応させることで酸不安定基を付与させた特定の含フッ素化合物、含フッ素重合性単量体又は含フッ素高分子化合物、又はそれらを用いたフォトレジスト又はパターン形成方法に関する。さらにそのプロセスをパターン形成過程で使用するフォトレジストに関する。
【0008】
【発明の実施の形態】
以下、本発明の実施の形態を詳細に説明する。本発明に使用できる含フッ素原料化合物は、分子内に、フッ素を有し、かつ、一般式(3)又は一般式(4)
【化12】
(式中、R1は、水素、直鎖又は分岐状アルキル基、芳香族基、脂環基を含んでもよい炭化水素基であって、フッ素、酸素、窒素、カルボニル結合、アルコールを含んでもよい。R2は、水素、フッ素、メチル基、トリフルオロメチル基から選ばれた置換基で、同一の芳香環上に複数のR2を有してもよい。nは0又は1。)で表される官能基を併せ持った含フッ素原料化合物であれば、その構造には特に規定されず、低分子有機化合物、重合性単量体、高分子化合物のいずれでも好適に使用できる。
【0009】
本発明では一般式(3)又は(4)記載の含フッ素原料化合物にビニルエーテル類を反応させることで一般式(1)又は(2)
【化13】
(式中、R1、R3は、水素、直鎖又は分岐状アルキル基、芳香族基、脂環基を含んでもよい炭化水素基であって、フッ素、酸素、窒素、カルボニル結合、アルコールなどを含んでもよい。R2は、水素、フッ素、メチル基、トリフルオロメチル基から選ばれた置換基で、同一の芳香環上に複数のR2を有してもよい。nは0又は1。)の酸不安定基含有の含フッ素化合物を得ることができる。
【0010】
具体的に一般式(3)を含有した含フッ素原料化合物を例示するならば、フッ素を含有した化合物であって同時にカルボン酸を少なくとも1つ有した低分子化合物、重合性単量体、あるいは高分子化合物が挙げられる。例えば低分子化合物としては、RCOOH又はHOOCRCOOHの構造のものが好ましく使用できる。ここで、Rはその一部にフッ素又はフルオロアルキル基を有していれば特に制限されない。例えば、CF3COOH、HOOCCF2CF2CF2COOHや
【化14】
などの含フッ素芳香族カルボン酸類が使用できる。また、本発明では前述の含フッ素芳香族カルボン酸類は芳香族の水素還元体も使用できる。
【0011】
一般式(3)を有する重合性単量体としては、
【化15】
をはじめとして、これらの含フッ素アクリル酸とシクロペンタジエン、シクロヘキサジエン、ブタジエンなどのジエン系化合物とのディールスアルダー反応体、例えば、
【化16】
などが挙げられる。また同様な置換基を含有し、かつノルボルネン環が複数結合した多核体も使用することができる。
【0012】
一般式(3)を有する高分子化合物としては、すでに前述した一般式(3)を有する重合性単量体を重合又は共重合した高分子化合物が使用できる。その際の共重合相手としては共重合反応性を有していれば特に制限なく使用できる。すなわち本発明で使用できる共重合モノマーを例示するならば、少なくとも、オレフィン、含フッ素オレフィン、アクリル酸エステル、メタクリル酸エステル、含フッ素アクリル酸エステル、含フッ素メタクリル酸エステル、ノルボルネン化合物、含フッ素ノルボルネン化合物、スチレン系化合物、含フッ素スチレン系化合物、ビニルエーテル、含フッ素ビニルエーテル、ビニルエステル、含フッ素ビニルエステル、アリルエーテル、含フッ素アリルエーテル、ビニルシラン、無水マレイン酸などから選ばれた1種以上の単量体が好適である。
【0013】
オレフィンとしては、エチレン、プロピレンなど、フルオロオレフィンとしては、フッ化ビニル、フッ化ビニリデン、トリフルオロエチレン、クロロトリフルオロエチレン、テトラフルオロエチレン、ヘキサフルオロプロピレン、ヘキサフルオロイソブテン、オクタフルオロシクロペンテンなどが例示できる。
【0014】
また、アクリル酸エステル又はメタクリル酸エステルとしてはエステル側鎖について特に制限なく使用できるが、公知の化合物を例示するならば、メチルアクリレート又はメタクリレート、エチルアクリレート又はメタクリレート、n−プロピルアクリレート又はメタクリレート、イソプロピルアクリレート又はメタクリレート、n−ブチルアクリレート又はメタクリレート、イソブチルアクリレート又はメタクリレート、n−ヘキシルアクリレート又はメタクリレート、n−オクチルアクリレート又はメタクリレート、2−エチルヘキシルアクリレート又はメタクリレート、ラウリルアクリレート又はメタクリレート、2−ヒドロキシエチルアクリレート又はメタクリレート、2−ヒドロキシプロピルアクリレート又はメタクリレートなどのアクリル酸又はメタクリル酸のアルキルエステル、エチレングリコール、プロピレングリコール、テトラメチレングリコール基を含有したアクリレート又はメタクリレート、さらにアクリルアミド、メタクリルアミド、N−メチロールアクリルアミド、N−メチロールメタクリルアミド、ジアセトンアクリルアミドなどの不飽和アミド、アクリロニトリル、メタクリロニトリル、アルコキシシラン含有のビニルシランやアクリル酸又はメタクリル酸エステル、t−ブチルアクリレート又はメタクリレート、3−オキソシクロヘキシルアクリレート又はメタクリレート、アダマンチルアクリレート又はメタクリレート、アルキルアダマンチルアクリレート又はメタクリレート、シクロヘキシルアクリレート又はメタクリレート、トリシクロデカニルアクリレート又はメタクリレート、ラクトン環やノルボルネン環などの環構造を有したアクリレート又はメタクリレート、アクリル酸、メタクリル酸などが使用できる。さらにαシアノ基含有の上記アクリレート類化合物や類似化合物としてマレイン酸、フマル酸、無水マレイン酸などを共重合することも可能である。
【0015】
また、含フッ素アクリル酸エステル、含フッ素メタクリル酸エステルとしては、フッ素原子を有する基がアクリルのα位又はエステル部位に有したアクリル酸エステル又はメタクリル酸エステルが使用できる。例えば、α位に含フッ素アルキル基が導入された単量体としては、前述した非フッ素系のアクリル酸エステル又はメタクリル酸エステルのα位にトリフルオロメチル基、トリフルオロエチル基、ノナフルオロ−n−ブチル基などが付与された単量体である。一方、そのエステル部位がパーフルオロアルキル基、フルオロアルキル基であるフッ素アルキル基や、またエステル部位に環状構造とフッ素を共存する単位であって、その環状構造に少なくとも一部にフッ素やトリフルオロメチル基を有した含フッ素ベンゼン環、含フッ素シクロペンタン環、含フッ素シクロヘキサン環、含フッ素シクロヘプタン環等を有するアクリル酸エステル又はメタクリル酸エステルも好適に採用できる。またエステル部位が含フッ素のt−ブチルエステル基であるアクリル酸又はメタクリル酸のエステルなども使用可能である。そのような単位のうち特に代表的なものを単量体の形で例示するならば、2,2,2−トリフルオロエチルアクリレート、2,2,3,3−テトラフルオロプロピルアクリレート、1,1,1,3,3,3−ヘキサフルオロイソプロピルアクリレート、ヘプタフルオロイソプロピルアクリレート、1,1−ジヒドロヘプタフルオロ−n−ブチルアクリレート、1,1,5−トリヒドロオクタフルオロ−n−ペンチルアクリレート、1,1,2,2−テトラヒドロトリデカフルオロ−n−オクチルアクリレート、1,1,2,2−テトラヒドロヘプタデカフルオロ−n−デシルアクリレート、2,2,2−トリフルオロエチルメタクリレート、2,2,3,3−テトラフルオロプロピルメタクリレート、1,1,1,3,3,3−ヘキサフルオロイソプロピルメタクリレート、ヘプタフルオロイソプロピルメタクリレート、1,1−ジヒドロヘプタフルオロ−n−ブチルメタクリレート、1,1,5−トリヒドロオクタフルオロ−n−ペンチルメタクリレート、1,1,2,2−テトラヒドロトリデカフルオロ−n−オクチルメタクリレート、1,1,2,2−テトラヒドロヘプタデカフルオロ−n−デシルメタクリレート、パーフルオロシクロヘキシルメチルアクリレート、パーフルオロシクロヘキシルメチルメタクリレートなどが挙げられる。さらには側鎖末端にトリフルオロ又はヘキサフルオロカルビノール基が付与され酸性を有する単量体又は酸不安定基やその他の官能基で保護した単量体もその構造に制限なく移用することができる。
【0016】
ノルボルネン化合物、含フッ素ノルボルネン化合物は、一核又は複数の核構造を有するノルボルネン単量体であって、これらも特に制限なく共重合することが可能である。この際、含フッ素オレフィン、アリルアルコール、含フッ素アリルアルコール、アクリル酸、αフルオロアクリル酸、メタクリル酸、本明細書で記載したすべてのアクリル酸エステル又はメタクリル酸エステル、含フッ素アクリル酸エステル又はメタクリル酸エステルなどの不飽和化合物と、シクロペンタジエン、シクロヘキサジエンとを用いてDiels Alder付加反応を行ったノルボルネン化合物も好ましく採用される。したがって、このノルボルネンの場合も、側鎖末端にトリフルオロ又はヘキサフルオロカルビノール基を有した酸性単量体又は酸不安定基やその他の官能基で保護した単量体もその構造に制限なく使用することができる。
【0017】
さらに、スチレン系化合物、含フッ素スチレン系化合物、ビニルエーテル、含フッ素ビニルエーテル、アリルエーテル、ビニルエステル、ビニルシランなども使用することができる。ここでスチレン系化合物、含フッ素スチレン系化合物としてはスチレン、フッ素化スチレン、ヒドロキシスチレンなどの他、ヘキサフルオロカルビノールが一つ又は複数結合したスチレン系化合物、トリフルオロメチル基で水素を置換したスチレン又はヒドロキシスチレン、α位にハロゲン、アルキル基、含フッ素アルキル基が結合した上記スチレン又は含フッ素スチレン系化合物などが使用可能である。
【0018】
さらに、ビニルエーテル、含フッ素ビニルエーテルとしては、例えば、メチル基、エチル基、ヒドロキシエチル基、ヒドロキシブチル基などのヒドロキシ基を含有してもよいアルキルビニルエーテル類、シクロヘキシルビニルエーテルやその環状構造内に水素やカルボニル結合を有した環状型ビニルエーテル類、不飽和結合の水素がフッ素に置換された含フッ素ビニルエーテル類やパーフルオロビニルエーテル類なども使用できる。また、ビニルエーテルであって側鎖にヘキサフルオロカルビノール基や環構造と併用した化合物も好適に使用できる。
【0019】
なお、アリルエーテル、ビニルエステル、ビニルシラン、無水マレイン酸についても公知の化合物であれば特に制限なく使用することが可能である。さらにアリルエーテルやビニルエステル系単量体であって、側鎖末端にトリフルオロ又はヘキサフルオロカルビノール基が付与され酸性を有する単量体又は酸不安定基やその他の官能基で保護した単量体もその構造に制限なく使用することができる。また、これらの共重合性化合物は単独使用でも2種以上の併用でもよい。
【0020】
また、本発明で使用できる一般式(3)の含フッ素高分子化合物としては、アクリル酸、メタクリル酸、アリル酢酸、ビニル酢酸、クロトン酸をはじめ分子内にカルボン酸を有するフッ素を持たない単量体とすでに説明したような含フッ素モノマーと共重合した含フッ素高分子化合物も使用できる。その場合共重合性単量体として使用できる含フッ素単量体中にはカルボン酸を持っていても持っていなくても使用することができる。
【0021】
さて、次に一般式(4)を有する含フッ素原料化合物を説明する。この場合も分子内に芳香族に直結したヘキサフルオロカルビノールを有していれば、低分子化合物、重合性単量体、高分子化合物のすべての構造が使用できる。一般式(4)の基を有する含フッ素原料化合物における低分子化合物としては、主に溶解性抑制剤等の感光性材料の溶解性を制御する添加剤としての用途で使用される。ここで使用できる低分子化合物を具体的に例示するならば、一般式(14)、(15)に示す原料化合物が使用できる。ここでR1がHでn=1の化合物を使用した場合、ビニルエーテルは2つのヘキサフルオロカルビノール基に反応し、酸発生剤が2つ入った化合物となる。
【化17】
また一般式(15)の−OH基の代わりに別のアミノ基やカルボキシル基になった化合物も適用可能である。
【0022】
一般式(4)を有する含フッ素原料化合物における重合性単量体としては一般式(16)に示す重合性不飽和結合を有する化合物が挙げられる。ここでもR1がHでn=1の化合物を使用した場合、ビニルエーテルは2つのヘキサフルオロカルビノール基に反応し、酸発生剤が2つ入った化合物となる。
【化18】
(式中、R8はビニル基、アリル基、ビニルエーテル基、アクリロイル基、メタクリロイル基などのフッ素を含んでもよい重合性不飽和結合を有する重合部位)であって、代表的な例を挙げるならば、
【化19】
などである。また、ここで挙げたメタクリル酸エステルの代わりとしてα位に、水素、フッ素、トリフルオロメチル基、シアノ基などを導入することも可能である。
【0023】
また、一般式(4)を有する含フッ素原料化合物における高分子化合物としては、一般式(4)を有する重合性単量体の重合体、共重合体が使用できる。また高分子反応で一般式(4)のユニットを導入した高分子化合物も使用できる。ここで一般式(4)を有する重合性単量体と共重合可能な単量体としては一般式(1)を有する重合性単量体との共重合相手として説明したものと同様の単量体が制限なく使用できる。
【0024】
本発明によれば、含フッ素原料化合物の重合性単量体の重合方法としては、一般的に使用される方法であれば特に制限されないが、ラジカル重合、イオン重合などが好ましく、場合により、配位アニオン重合やリビングアニオン、ラジカルリビング重合などを使用することも可能であり、重合された高分子化合物も本発明に使用できる含フッ素原料化合物に相当する。
【0025】
ここでは、より一般的なラジカル重合法を説明する。すなわち、ラジカル重合開始剤あるいはラジカル開始源の存在下で、塊状重合、溶液重合、懸濁重合又は乳化重合などの公知の重合方法により、回分式、半連続式又は連続式のいずれかの操作で行えばよい。
【0026】
ラジカル重合開始剤としては特に限定されるものではないが、例としてアゾ系化合物、過酸化物系化合物、レドックス系化合物が挙げられ、とくにアゾビスイソブチロニトリル、t−ブチルパーオキシピバレート、ジ−t−ブチルパーオキシド、i−ブチリルパーオキシド、ラウロイルパーオキサイド、スクシン酸パーオキシド、ジシンナミルパーオキシド、ジ−n−プロピルパーオキシジカーボネート、t−ブチルパーオキシアリルモノカーボネート、過酸化ベンゾイル、過酸化水素、過硫酸アンモニウム等が好ましい。また一部にフッ素を含有した重合開始剤も好適に使用できる。
【0027】
重合反応に用いる反応容器は特に限定されない。また、重合反応においては、重合溶媒を用いてもよい。重合溶媒としては、ラジカル重合を阻害しないものが好ましく、代表的なものとしては、酢酸エチル、酢酸n−ブチルなどのエステル系、アセトン、メチルイソブチルケトンなどのケトン系、トルエン、シクロヘキサンなどの炭化水素系、イソプロピルアルコール、エチレングリコールモノメチルエーテルなどのアルコール系溶剤などがある。また水、エーテル系、環状エーテル系、フロン系、フルオロカーボン系、芳香族系などの種々の溶媒を使用することも可能である。これらの溶剤は単独でもあるいは2種類以上を混合しても使用できる。また、メルカプタンのような分子量調整剤を併用してもよい。共重反応の反応温度はラジカル重合開始剤あるいはラジカル重合開始源により適宜変更され、通常は0〜200℃が好ましく、特に30〜140℃が好ましい。
【0028】
このようにして得られる本発明にかかる高分子化合物の溶液又は分散液から、媒質である有機溶媒又は水を除去する方法としては、公知の方法のいずれも利用できるが、例を挙げれば再沈殿ろ過又は減圧下での加熱留出等の方法がある。得られる本発明にかかる高分子化合物の数平均分子量としては、通常、1,000〜100,000、好ましくは3,000〜50,000の範囲が適切である。
【0029】
次に本発明の含フッ素化合物について説明する。本発明の含フッ素化合物は、すでに説明した含フッ素原料化合物に対して、ビニルエーテルを反応させることで酸不安定基を付与させた一般式(1)又は(2)記載の官能基を有した含フッ素化合物であり、低分子化合物、重合性単量体、高分子化合物が挙げられる。例えば、重合性化合物として特に好適なものを挙げるならば、下記一般式
【化20】
などで示す単量体が望ましい。
【0030】
また本発明で使用できる含フッ素化合物としての高分子化合物は前述の含フッ素化合物単量体の重合体又は共重合体の他、すでに説明した含フッ素原料化合物としての高分子化合物にビニルエーテルを反応させた高分子化合物であれば特に制限されずに使用できる。
【0031】
次いで、本発明で使用できるビニルエーテルについて説明する。本発明で使用できるビニルエーテルとしては、反応性の観点から不飽和2重結合部にフッ素を含有してはならず、水素と炭素のみからなる必要があり、その構造は下記一般式
【化21】
の化合物である。ここで、式中R6は、直鎖又は分岐状アルキル基、芳香族基、脂環基を含んでもよい炭化水素基であって、フッ素、酸素、窒素、カルボニル結合、アルコール、不飽和結合などを含んでもよい。但し、より好ましくは、R6の一部にフッ素を含有するビニルエーテルである。すなわち、具体的なビニルエーテルとしては、例えば、R6がメチル基、エチル基、ヒドロキシエチル基、ヒドロキシブチル基などのヒドロキシ基を含有してもよいアルキルビニルエーテル類、シクロヘキシルビニルエーテルやその環状構造内に水素やカルボニル結合を有したビニルエーテル類、さらに下記に示すような環状ビニルエーテル類も使用することが可能である。
【化22】
また、これらのR6の一部がフッ素で置換されたすべてのビニルエーテルも使用できる。さらにR6の一部に不飽和結合、例えばビニルエーテルを含有した場合、一般式(9)はジビニルエーテルやトリビニルエーテルなどに相当する。フォトレジスト感光性の機構として分子間の架橋反応を適用したい場合はジビニルエーテルなどの多感能ビニルエーテルが望ましい。本発明ではエッチング耐性を高める目的の場合R6に脂環構造を導入することが好適であり、透明性を高め、かつエッチング耐性を付与させる目的のためにはフッ素と脂環構造を同時に含有することが最も好ましく採用される。以上のように、上記一般式のR6として種々の構造を導入した化合物が適用できるが、含フッ素原料化合物に一般式(9)のビニルエーテルを反応した場合、R6はR3に一致する。含フッ素化合物が重合性単量体の場合の重合法はすでに説明した含フッ素原料化合物の重合と同様の方法が使用できる。
【0032】
さて、本発明で最も好適に採用されるビニルエーテルとしては、R6の少なくとも一部に一個以上の一般式(10)に示すヘキサフルオロカルビノール基やその他の酸性OH基と脂環構造を有するものが溶解速度の制御の面で使用できる。
【化23】
ここで、ビニルエーテル側鎖に適切な脂環構造とは、シクロヘキサン、ノルボルネン、多核ノルボルネン、アダマンタン構造などが挙げられ、具体的には、下記一般式記載の構造が例示できる。
【化24】
【0033】
次いで本発明で使用可能なジビニルエーテルを説明する。ジビニルエーテルとは下記一般式の構造の化合物である。
【化25】
ここで、R7は、直鎖又は分岐状アルキル基、芳香族基、脂環基を含んでもよい炭化水素基であって、フッ素、酸素、窒素、カルボニル結合、アルコールなどを含んでもよい。すなわち、R7としては特に制限なく種々の構造が適用できるが、透明性を向上させる目的で使用する場合の例を具体的に挙げるならば、
【化26】
【0034】
本発明によるレジスト材料は、酸の作用によりアルカリ性水溶液に対する溶解性が変化するネガ型、ポジ型の両方のシステムに採用できるが、本発明が効率的な酸不安定性基を導入するためのものなのでポジ型の方が好適である。すなわち最近の半導体の微細化に対応した193nmのArFエキシマレーザー及び157nmに代表される真空紫外領域のF2レーザー、又は電子線及びX線などの活性エネルギー線を使用したポジ型フォトレジスト又はそれ以外のフォトレジストとして好適である。例えば、本発明によるビニルエーテルが付加した部分は、酸の作用によりアルカリ性水溶液に対する溶解性が変化する働きを有しており、効率的にポジ型挙動を得ることが可能である。すなわち活性エネルギー線が照射される前にはアルカリ性水溶液に不溶もしくは難溶であって、活性エネルギー線を照射したことにより酸発生剤から発生した酸により加水分解されアルカリ性水溶液に対して溶解性を示すポジ型になる。
【0035】
さらに詳細に本発明の使用方法を説明する。本発明の代表的な使い方としては次の2つの方式を例示できる。第1の方式は、含フッ素原料化合物にあらかじめビニルエーテル類を反応させたフッ素化合物を合成しておき、その含フッ素化合物を有機溶媒等に溶解させ、レジスト組成物とする方法である。この場合、含フッ素化合物として重合又は共重合させた化合物を主成分とし、酸発生剤やその他の添加剤を加えることでレジスト溶液とする。そのレジスト溶液を用いて基板上に成膜し、その後プリベークを行った後、次いで活性エネルギー線を照射すると、含フッ素化合物の一部又は全部が含フッ素原料化合物に戻りアルカリ可溶性が発現する。
【0036】
一方、本発明で使用できる第2の方式は、含フッ素原料化合物とビニルエーテル類を混合した状態で有機溶媒に溶解させたものをレジスト溶液とする。この場合は、酸発生剤やその他の必要な添加剤を含フッ素原料化合物、ビニルエーテル類とともに混合しておく。次いでそのレジスト溶液を基板上に成膜した上でプリベークすると、プリベーク時の加熱処理によって含フッ素原料化合物とビニルエーテル類が膜内で化学反応し、アルカリ溶液に不溶化する。その後、活性エネルギー線を照射すると、含フッ素化合物の一部又は全部が含フッ素原料化合物に戻りアルカリ可溶性が発現する。すなわち、本発明では、レジストのパターン形成過程で含フッ素化合物を使用する場合も好ましく採用される。本発明では第1の方式又は第2の方式ともに、デバイス製造におけるフォトレジストによるレジストパターン形成方法は制限なく使用できるが、好適に行うには、まずシリコンウエーハや半導体製造基板のような支持体上に、レジスト組成物の溶液をスピンナーなどで塗布し、乾燥して感光層を形成させ、これに露光装置などにより、レーザー光を所望のマスクパターンを介して照射し、加熱する。次いでこれを現像液、例えば0.1〜10重量%テトラメチルアンモニウムヒドロキシド水溶液のようなアルカリ性水溶液などを用いて現像処理する。この形成方法でマスクパターンに忠実なパターンを得ることができる。
【0037】
本発明組成物に用いられる光酸発生剤については特に制限はなく、化学増幅型レジストの酸発生剤として用いられるものの中から、任意のものを選択して使用することができる。このような酸発生剤の例としては、ビススルホニルジアゾメタン類、ニトロベンジル誘導体類、オニウム塩類、ハロゲン含有トリアジン化合物類、シアノ基含有オキシムスルホネート化合物類、その他のオキシムスルホネート化合物などが挙げられる。これらの酸発生剤は単独で用いてもよいし、2種以上を組み合わせて用いてもよく、また、その含有量は、高分子化合物100重量部に対して、通常0.5〜20重量部の範囲で選ばれる。この量が0.5重量部未満では像形成性が不十分であるし、20重量部を超えると均一な溶液が形成されにくく、保存安定性が低下する傾向がみられる。
【0038】
本発明の応用分野は、さらに所望により混和性のある添加物、例えば付加的樹脂、クエンチャー、可塑剤、安定剤、着色剤、界面活性剤、増粘剤、レベリング剤、消泡剤、相溶化剤、密着剤、酸化防止剤などの種々添加剤を含有させることができる。
【0039】
【実施例】
[実施例1]
下記の単量体1,2をそれぞれ67g、170gを還流冷却管、攪拌子を備えた三口フラスコに酢酸n−ブチル500gとともに混合し溶解させた。この溶液に重合開始剤としてアゾビスイソブチロニトリル(AIBN)を7g添加し、60℃のオイルバスで加熱して20時間反応させた。反応後、重合溶液を大過剰のn−ヘキサンに投入して攪拌した。生成した沈澱を濾過回収し、50℃で18時間真空乾燥した。得られた高分子1Aの組成を1H−NMRおよび19F−NMRから測定したところ、ユニット1:ユニット2=68:32であった。また分子量MwはGPC分析(標準ポリスチレン)から14,000であった。
【化27】
次いで、得られた高分子1Aの100重量部に対し、ビニルエーテルAを30重量部になるようにプロピレングリコールモノメチルエーテルに溶解し、80℃で5時間攪拌を行たところ、ユニット1の一部がユニット3に変化し、高分子1B(ユニット1:ユニット2:ユニット3=35:38:27)が得られた。
【化28】
【0040】
[実施例2]
実施例1と同様にして高分子2A(ユニット1:ユニット4:ユニット5:ユニット6=40:10:20:30)、3A(ユニット8:ユニット9=21:79)、4A(ユニット1:ユニット11:ユニット5:ユニット2=33:25:7:35)、5A(ユニット13:ユニット14:ユニット15:ユニット16=30:10:41:19)を重合し、次いでビニルエーテルB、C、Dを反応させ、下記高分子2B(ユニット1:ユニット4:ユニット5:ユニット6:ユニット7=5:10:20:30:35)、3B(ユニット8:ユニット9:ユニット10=21:37:42)、4B(ユニット1:ユニット11:ユニット5:ユニット2:ユニット12=6:25:7:35:27)、5B(ユニット13:ユニット14:ユニット15:ユニット16:ユニット17=2:10:41:19:28)を得た。
【化29】
【0041】
[実施例3]
単量体1を70gとビニルエーテルCを30gを還流冷却管、攪拌子を備えた三口フラスコに酢酸ブチル200gとともに溶解混合させ、次いで80℃で5時間反応後、未反応物及び酢酸ブチルを留去させたところ、単量体3が76g得られた。
次いで単量体3、単量体2をそれぞれ109g、110gを還流冷却管、攪拌子を備えた三口フラスコに酢酸n−ブチル500gとともに混合し溶解させた。この溶液に重合開始剤としてアゾビスイソブチロニトリル(AIBN)を7g添加し、60℃のオイルバスで加熱して20時間反応させた。反応後、重合溶液を大過剰のn−ヘキサンに投入して攪拌した。生成した沈澱を濾過回収し、50℃で18時間真空乾燥した。得られた高分子6の組成を1H−NMRおよび19F−NMRから測定したところユニット18:ユニット2が71:29であった。また分子量MwはGPC分析(標準ポリスチレン)から19,000であった。
【化30】
【0042】
[実施例4]
実施例1〜3で得られた高分子1B〜5B、高分子6をそれぞれテトラヒドロフランに溶解しスピンコート法にてCaF2基板上に成膜した。100℃で2時間乾燥した後、真空紫外吸収スペクトル計にて157nmの透過率を測定したところ、膜厚100nmに換算した光透過率が第1表に示す高い値となった。なお、高分子5Bは193nmでの透過率を測定した。
次いで高分子1B〜5B、高分子6をそれぞれ100重量部に対して、酸発生剤DPI−OTfが3重量部になるようにプロピレングリコールモノメチルエーテルに溶解し、総固形分濃度20%の溶液とし、これらの溶液を0.2ミクロンのフィルターで2回濾過を繰り返し、それぞれのレジスト溶液を得た。次にこれらを6インチのシリコンウェハー上にスピンコートし膜厚100〜200ナノメータの膜を得た後、80℃で乾燥したところ、2.38重量%テトラメチルアンモニウムヒドロキシド水溶液に不溶であった。次に高分子1B〜4B及び高分子6から製造したレジスト膜にKr2エキシマーランプ146nmを照射し、100℃で60秒加熱した後、2.38重量%テトラメチルアンモニウムヒドロキシド水溶液で現像したところ、どの系も良好なポジ型挙動が確認された。一方、高分子5Bから製造したレジスト膜にArFエキシマーレーザー193nmを照射し、100℃で60秒加熱した後、2.38重量%テトラメチルアンモニウムヒドロキシド水溶液で現像したところ、良好なポジ型挙動が確認された。結果を表1に示した。
【化31】
【0043】
[実施例5]
実施例1で得られた高分子2Aの100重量部に対して、ビニルエーテルEが25重量部になるようにプロピレングリコールモノメチルエーテルに溶解し総固形分濃度18%の溶液を得た。この溶液に酸発生剤として、DPI−OTfが4重量部になるようにプロピレングリコールモノメチルエーテルに溶解し、総固形分濃度20%の溶液とし、0.2ミクロンのフィルターで2回濾過を繰り返し、レジスト溶液を得た。次にこれらを6インチのシリコンウェハー上にスピンコートし膜厚120ナノメータの膜を得た後、室温で乾燥した後に2.38重量%テトラメチルアンモニウムヒドロキシド水溶液に溶解した。そこで、同じレジスト膜を80℃で加熱乾燥したところ、2.38重量%テトラメチルアンモニウムヒドロキシド水溶液に不溶に変化した。
次いでレジスト膜にKr2エキシマーランプ146nmを照射し、100℃で60秒加熱したところ2.38重量%テトラメチルアンモニウムヒドロキシド水溶液に溶解し、良好なポジ型挙動が確認された。結果を表1に示した。
【化32】
【表1】
[0001]
The present invention is easily performed by reacting a vinyl ether, particularly a vinyl ether containing an alicyclic structure, a fluorine-containing vinyl ether, or a divinyl ether with a fluorine-based raw material compound having a carboxylic acid or a specific acidic functional group in a molecule. The present invention relates to a fluorine-containing compound into which an acid labile group is introduced, a fluorine-containing polymerizable monomer, a fluorine-containing polymer compound, and a method for producing them. Further, the present invention relates to a photoresist using the fluorine-containing compound and a pattern forming method.
[0002]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a fluorine-containing compound, a fluorine-containing polymerizable monomer, a fluorine-containing polymer compound, a resist material and a pattern forming method using the same, and a method for producing a fluorine-containing compound.
[0003]
[Prior art]
Fluorine-based compounds are used in advanced material fields due to the characteristics of fluorine such as water repellency, oil repellency, low water absorption, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, and low dielectric properties. Mainly used or developed in a wide range of applications. In recent years, active research and development have been carried out on photoresist materials that utilize the transparency of fluorine compounds in the ultraviolet region, particularly in the vacuum ultraviolet wavelength region. A common polymer design in these application fields is to introduce as much fluorine as possible to achieve transparency at each wavelength used while achieving adhesion to the substrate and a high glass transition point together with the photosensitive behavior. It is to try to make it. For example, it is reported that transparency at each wavelength is increased by tetrafluoroethylene, a cyclic fluorine monomer, a fluorine-based styrene, a fluorine-containing norbornene compound containing a hydroxy group, a cyclized polymer of a fluorine-containing compound, and the like. In general, when a polymer is used as a photoresist, a chemical amplification type photosensitive mechanism to which an acid generator is added is often used (for example, Non-Patent Document 1). At that time, a composition containing an acid labile group in a polymer skeleton is required. However, only a limited number of acid labile groups have been reported, and many of them have reduced transparency. Therefore, there is a need for a structure having high photosensitivity and enhanced transparency and etching resistance of the acid labile group itself. In addition, although there is a trend to increase the etching resistance by having a cyclic fluorine-based compound, it is not sufficient, and a device for imparting etching resistance to the acid labile group itself is required.
[0004]
[Non-patent document 1]
ChulHo Park, Tsuguo Yamaoka, et al. , J. et al. Photopolym. Sci. Technol. , 15, 141-144 (2002)
[0005]
[Problems to be solved by the invention]
The present invention provides a fluorine-containing compound, a fluorine-containing polymerizable monomer, and a fluorine-containing compound, which provide an acid-labile group effective for a fluorine-containing compound, and further impart high transparency and etching resistance to the acid-labile group itself. An object of the present invention is to provide a fluoropolymer compound, a photoresist using the same, a pattern forming method, and a method for producing these fluorine-containing compounds.
[0006]
[Means for Solving the Problems]
The present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, a group obtained by reacting a vinyl ether compound with carboxylic acid having high acid strength or hexafluorocarbinol directly connected to an aromatic compound was found. They have been found to work as effective acid labile groups for fluoropolymers. Further, by reacting fluorine, a specific vinyl ether having a ring structure, etc., the acid labile group itself can become a fluorine-containing compound, polymerizable monomer, or polymer compound having high transparency and etching resistance. Discovered and completed the present invention.
[0007]
That is, in the present invention, a compound having both fluorine and a functional group containing a carboxylic acid group or an aromatic hexafluorocarbinol group in the molecule is provided with an acid labile group by reacting with vinyl ether. The present invention relates to a specific fluorine-containing compound, a fluorine-containing polymerizable monomer or a fluorine-containing polymer compound, or a photoresist or a pattern forming method using the same. Further, the present invention relates to a photoresist using the process in a pattern forming process.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail. The fluorine-containing raw material compound that can be used in the present invention has fluorine in the molecule and has the general formula (3) or (4)
Embedded image
(Where R 1 Is a hydrocarbon group which may contain hydrogen, a linear or branched alkyl group, an aromatic group, or an alicyclic group, and may contain fluorine, oxygen, nitrogen, a carbonyl bond, or an alcohol. R 2 Is a substituent selected from hydrogen, fluorine, a methyl group and a trifluoromethyl group, and a plurality of R 2 May be provided. n is 0 or 1. The structure is not particularly limited as long as it is a fluorine-containing raw material compound having a functional group represented by the formula (1), and any of a low molecular organic compound, a polymerizable monomer, and a high molecular compound can be suitably used.
[0009]
In the present invention, the fluorine-containing raw material compound represented by the general formula (3) or (4) is reacted with a vinyl ether to form the compound represented by the general formula (1) or (2).
Embedded image
(Where R 1 , R 3 Is a hydrocarbon group that may contain hydrogen, a linear or branched alkyl group, an aromatic group, or an alicyclic group, and may contain fluorine, oxygen, nitrogen, a carbonyl bond, an alcohol, and the like. R 2 Is a substituent selected from hydrogen, fluorine, a methyl group and a trifluoromethyl group, and a plurality of R 2 May be provided. n is 0 or 1. ) A fluorine-containing compound containing an acid labile group can be obtained.
[0010]
Specific examples of the fluorine-containing raw material compound containing the general formula (3) include a low molecular weight compound, a polymerizable monomer, and a high molecular weight compound which are fluorine-containing compounds and have at least one carboxylic acid at the same time. Molecular compounds. For example, as the low molecular weight compound, those having a structure of RCOOH or HOOCRCOOH can be preferably used. Here, R is not particularly limited as long as it has a fluorine or fluoroalkyl group in a part thereof. For example, CF3COOH, HOOCCF2CF2CF2COOH,
Embedded image
Fluorinated aromatic carboxylic acids such as Further, in the present invention, the above-mentioned fluorine-containing aromatic carboxylic acids may also be aromatic hydrogen reduced products.
[0011]
As the polymerizable monomer having the general formula (3),
Embedded image
A Diels-Alder reactant of these fluorinated acrylic acids with diene compounds such as cyclopentadiene, cyclohexadiene and butadiene, for example,
Embedded image
And the like. A polynuclear body containing a similar substituent and having a plurality of norbornene rings bonded thereto can also be used.
[0012]
As the polymer compound having the general formula (3), a polymer compound obtained by polymerizing or copolymerizing the polymerizable monomer having the general formula (3) described above can be used. In this case, the copolymerization partner can be used without particular limitation as long as it has copolymerization reactivity. That is, if the copolymerizable monomer that can be used in the present invention is exemplified, at least, olefin, fluorinated olefin, acrylate, methacrylate, fluorinated acrylate, fluorinated methacrylate, norbornene compound, fluorinated norbornene compound At least one monomer selected from styrene-based compounds, fluorinated styrene-based compounds, vinyl ethers, fluorinated vinyl ethers, vinyl esters, fluorinated vinyl esters, allyl ethers, fluorinated allyl ethers, vinyl silanes, maleic anhydride and the like Is preferred.
[0013]
Examples of the olefin include ethylene and propylene, and examples of the fluoroolefin include vinyl fluoride, vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, tetrafluoroethylene, hexafluoropropylene, hexafluoroisobutene, and octafluorocyclopentene. .
[0014]
The acrylic acid ester or methacrylic acid ester can be used without particular limitation on the ester side chain, but if a known compound is exemplified, methyl acrylate or methacrylate, ethyl acrylate or methacrylate, n-propyl acrylate or methacrylate, isopropyl acrylate Or methacrylate, n-butyl acrylate or methacrylate, isobutyl acrylate or methacrylate, n-hexyl acrylate or methacrylate, n-octyl acrylate or methacrylate, 2-ethylhexyl acrylate or methacrylate, lauryl acrylate or methacrylate, 2-hydroxyethyl acrylate or methacrylate, 2 -Hydroxypropyl acrylate or methacrylate, etc. Unsaturation such as alkyl ester of acrylic acid or methacrylic acid, acrylate or methacrylate containing ethylene glycol, propylene glycol or tetramethylene glycol group, further acrylamide, methacrylamide, N-methylolacrylamide, N-methylolmethacrylamide, diacetoneacrylamide Amide, acrylonitrile, methacrylonitrile, alkoxysilane-containing vinylsilane or acrylic acid or methacrylic acid ester, t-butyl acrylate or methacrylate, 3-oxocyclohexyl acrylate or methacrylate, adamantyl acrylate or methacrylate, alkyl adamantyl acrylate or methacrylate, cyclohexyl acrylate or Methacrylate, tricyclode Alkenyl acrylate or methacrylate, acrylate or methacrylate having a ring structure such as lactone ring or norbornene ring, acrylic acid, methacrylic acid, and the like. It is also possible to copolymerize maleic acid, fumaric acid, maleic anhydride and the like as the above-mentioned acrylate compounds containing α-cyano group or similar compounds.
[0015]
Further, as the fluorinated acrylate or fluorinated methacrylate, an acrylate or a methacrylate in which a group having a fluorine atom has an α-position or an ester site in the acryl can be used. For example, as the monomer having a fluorine-containing alkyl group introduced at the α-position, a trifluoromethyl group, a trifluoroethyl group, a nonafluoro-n- It is a monomer having a butyl group or the like. On the other hand, the ester moiety is a perfluoroalkyl group, a fluoroalkyl group that is a fluoroalkyl group, or a unit in which a cyclic structure and fluorine coexist in the ester moiety, and at least a part of the cyclic structure has fluorine or trifluoromethyl. Acrylic or methacrylic esters having a fluorinated benzene ring, a fluorinated cyclopentane ring, a fluorinated cyclohexane ring, a fluorinated cycloheptane ring or the like having a group can also be suitably employed. Further, an ester of acrylic acid or methacrylic acid in which the ester moiety is a fluorine-containing t-butyl ester group can be used. If a particularly typical example of such a unit is exemplified in the form of a monomer, 2,2,2-trifluoroethyl acrylate, 2,2,3,3-tetrafluoropropyl acrylate, 1,1 , 1,3,3,3-hexafluoroisopropyl acrylate, heptafluoroisopropyl acrylate, 1,1-dihydroheptafluoro-n-butyl acrylate, 1,1,5-trihydrooctafluoro-n-pentyl acrylate, 1,2,2-tetrahydrotridecafluoro-n-octyl acrylate, 1,1,2,2-tetrahydroheptadecafluoro-n-decyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3 1,3-tetrafluoropropyl methacrylate, 1,1,1,3,3,3-hexafluoro Isopropyl methacrylate, heptafluoroisopropyl methacrylate, 1,1-dihydroheptafluoro-n-butyl methacrylate, 1,1,5-trihydrooctafluoro-n-pentyl methacrylate, 1,1,2,2-tetrahydrotridecafluoro- Examples include n-octyl methacrylate, 1,1,2,2-tetrahydroheptadecafluoro-n-decyl methacrylate, perfluorocyclohexylmethyl acrylate, and perfluorocyclohexylmethyl methacrylate. Further, a monomer having an acidic side or a monomer protected by an acid labile group or another functional group to which a trifluoro or hexafluorocarbinol group is provided at a side chain terminal may be transferred without limitation to its structure. it can.
[0016]
The norbornene compound and the fluorine-containing norbornene compound are norbornene monomers having a mononuclear structure or a plurality of core structures, and these can be copolymerized without any particular limitation. At this time, fluorine-containing olefin, allyl alcohol, fluorine-containing allyl alcohol, acrylic acid, α-fluoroacrylic acid, methacrylic acid, all acrylic acid esters or methacrylic acid esters described in this specification, fluorine-containing acrylic acid ester or methacrylic acid Norbornene compounds obtained by performing a Diels Alder addition reaction using an unsaturated compound such as an ester and cyclopentadiene or cyclohexadiene are also preferably employed. Therefore, in the case of this norbornene, an acidic monomer having a trifluoro or hexafluorocarbinol group at a side chain terminal or a monomer protected with an acid labile group or another functional group can be used without limitation in its structure. can do.
[0017]
Further, styrene compounds, fluorinated styrene compounds, vinyl ethers, fluorinated vinyl ethers, allyl ethers, vinyl esters, vinyl silanes and the like can also be used. Here, styrene compounds, fluorine-containing styrene compounds include styrene, fluorinated styrene, hydroxystyrene, and the like, styrene compounds in which one or more hexafluorocarbinol are bonded, styrene in which hydrogen is substituted by a trifluoromethyl group. Alternatively, hydroxystyrene, the above-mentioned styrene or a fluorine-containing styrene-based compound having a halogen, an alkyl group, or a fluorine-containing alkyl group bonded at the α-position can be used.
[0018]
Further, as vinyl ethers and fluorine-containing vinyl ethers, for example, alkyl vinyl ethers which may contain a hydroxy group such as methyl group, ethyl group, hydroxyethyl group, hydroxybutyl group, cyclohexyl vinyl ether and hydrogen or carbonyl in its cyclic structure Cyclic vinyl ethers having a bond, fluorinated vinyl ethers in which the hydrogen of the unsaturated bond is replaced by fluorine, perfluorovinyl ethers, and the like can also be used. Further, a compound which is a vinyl ether and used in combination with a hexafluorocarbinol group or a ring structure in a side chain can also be suitably used.
[0019]
In addition, allyl ether, vinyl ester, vinyl silane, and maleic anhydride can be used without particular limitation as long as they are known compounds. Further, an allyl ether or vinyl ester monomer having a trifluoro or hexafluorocarbinol group at the side chain terminal and having an acidic monomer or a monomer protected by an acid labile group or other functional group The body can also be used without limitation in its structure. These copolymerizable compounds may be used alone or in combination of two or more.
[0020]
Examples of the fluorine-containing polymer compound represented by the general formula (3) that can be used in the present invention include acrylic acid, methacrylic acid, allyl acetic acid, vinyl acetic acid, crotonic acid and other monomers having no fluorine having a carboxylic acid in the molecule. A fluorine-containing polymer compound obtained by copolymerizing the polymer with a fluorine-containing monomer as described above can also be used. In that case, the fluorinated monomer that can be used as a copolymerizable monomer may be used with or without a carboxylic acid.
[0021]
Now, the fluorine-containing raw material compound having the general formula (4) will be described. Also in this case, all the structures of the low molecular weight compound, the polymerizable monomer, and the high molecular weight compound can be used as long as hexafluorocarbinol directly connected to the aromatic is included in the molecule. The low molecular weight compound in the fluorine-containing raw material compound having the group represented by the general formula (4) is mainly used as an additive for controlling the solubility of a photosensitive material such as a solubility inhibitor. If the low molecular weight compound that can be used here is specifically exemplified, the raw material compounds represented by the general formulas (14) and (15) can be used. Where R 1 Is H and n = 1, the vinyl ether reacts with two hexafluorocarbinol groups to form a compound containing two acid generators.
Embedded image
Further, a compound having another amino group or carboxyl group in place of the -OH group in the general formula (15) is also applicable.
[0022]
Examples of the polymerizable monomer in the fluorine-containing raw material compound having the general formula (4) include a compound having a polymerizable unsaturated bond represented by the general formula (16). Again R 1 Is H and n = 1, the vinyl ether reacts with two hexafluorocarbinol groups to form a compound containing two acid generators.
Embedded image
(Where R 8 Is a polymerization site having a polymerizable unsaturated bond which may contain fluorine, such as a vinyl group, an allyl group, a vinyl ether group, an acryloyl group, and a methacryloyl group).
Embedded image
And so on. It is also possible to introduce hydrogen, fluorine, a trifluoromethyl group, a cyano group, or the like at the α-position instead of the methacrylic acid ester mentioned here.
[0023]
Further, as the polymer compound in the fluorine-containing raw material compound having the general formula (4), a polymer or a copolymer of a polymerizable monomer having the general formula (4) can be used. Further, a polymer compound into which the unit of the general formula (4) is introduced by a polymer reaction can also be used. Here, as the monomer copolymerizable with the polymerizable monomer having the general formula (4), the same monomer as described as a copolymer partner with the polymerizable monomer having the general formula (1) may be used. The body can be used without restriction.
[0024]
According to the present invention, the method of polymerizing the polymerizable monomer of the fluorine-containing raw material compound is not particularly limited as long as it is a commonly used method, but radical polymerization, ionic polymerization and the like are preferable, and in some cases, It is also possible to use coordination anion polymerization, living anion, radical living polymerization, and the like, and the polymerized polymer compound also corresponds to the fluorine-containing raw material compound that can be used in the present invention.
[0025]
Here, a more general radical polymerization method will be described. That is, in the presence of a radical polymerization initiator or a radical initiation source, by a known polymerization method such as bulk polymerization, solution polymerization, suspension polymerization, or emulsion polymerization, batch operation, semi-continuous operation, or continuous operation. Just do it.
[0026]
The radical polymerization initiator is not particularly limited, but examples thereof include azo compounds, peroxide compounds, and redox compounds, particularly azobisisobutyronitrile, t-butyl peroxypivalate, Di-t-butyl peroxide, i-butyryl peroxide, lauroyl peroxide, succinic peroxide, disinnamyl peroxide, di-n-propylperoxydicarbonate, t-butylperoxyallyl monocarbonate, benzoyl peroxide, Hydrogen peroxide, ammonium persulfate and the like are preferred. Further, a polymerization initiator partially containing fluorine can also be suitably used.
[0027]
The reaction vessel used for the polymerization reaction is not particularly limited. In the polymerization reaction, a polymerization solvent may be used. As the polymerization solvent, those that do not inhibit radical polymerization are preferable, and typical examples are ethyl acetate, ester-based such as n-butyl acetate, acetone, ketone-based such as methyl isobutyl ketone, and hydrocarbons such as toluene and cyclohexane. And alcohol solvents such as isopropyl alcohol and ethylene glycol monomethyl ether. It is also possible to use various solvents such as water, ethers, cyclic ethers, chlorofluorocarbons, fluorocarbons and aromatics. These solvents can be used alone or in combination of two or more. Further, a molecular weight modifier such as mercaptan may be used in combination. The reaction temperature of the co-polymerization reaction is appropriately changed depending on the radical polymerization initiator or the radical polymerization initiation source, and is usually preferably from 0 to 200 ° C, particularly preferably from 30 to 140 ° C.
[0028]
As a method for removing the organic solvent or water as a medium from the solution or dispersion of the polymer compound according to the present invention thus obtained, any known method can be used. There are methods such as filtration or heat distillation under reduced pressure. The number average molecular weight of the obtained polymer compound of the present invention is usually in the range of 1,000 to 100,000, preferably 3,000 to 50,000.
[0029]
Next, the fluorine-containing compound of the present invention will be described. The fluorine-containing compound of the present invention has a functional group according to the general formula (1) or (2) in which an acid labile group is imparted by reacting a vinyl ether with the above-described fluorine-containing raw material compound. It is a fluorine compound and includes a low molecular compound, a polymerizable monomer, and a high molecular compound. For example, if a particularly suitable polymerizable compound is mentioned, the following general formula
Embedded image
And the like.
[0030]
Further, the polymer compound as a fluorine-containing compound that can be used in the present invention is, in addition to the above-described polymer or copolymer of the fluorine-containing compound monomer, a vinyl compound reacted with the polymer compound as the fluorine-containing raw material compound already described. Any high molecular compound can be used without particular limitation.
[0031]
Next, the vinyl ether that can be used in the present invention will be described. The vinyl ether that can be used in the present invention must not contain fluorine in the unsaturated double bond part from the viewpoint of reactivity, and must be composed of only hydrogen and carbon.
Embedded image
Is a compound of Where R 6 Is a hydrocarbon group which may contain a linear or branched alkyl group, an aromatic group, or an alicyclic group, and may contain fluorine, oxygen, nitrogen, a carbonyl bond, an alcohol, an unsaturated bond, or the like. However, more preferably, R 6 Is a vinyl ether containing fluorine partially. That is, specific vinyl ethers include, for example, R 6 Alkyl vinyl ethers which may contain a hydroxy group such as methyl group, ethyl group, hydroxyethyl group, hydroxybutyl group, cyclohexyl vinyl ether or vinyl ethers having hydrogen or carbonyl bond in the cyclic structure thereof, further shown below Such cyclic vinyl ethers can also be used.
Embedded image
In addition, these R 6 All vinyl ethers in which a part of is substituted by fluorine can be used. Further R 6 When an unsaturated bond, for example, a vinyl ether is contained in a part of the above, general formula (9) corresponds to divinyl ether, trivinyl ether or the like. When it is desired to apply a cross-linking reaction between molecules as a photoresist photosensitive mechanism, a multifunctional vinyl ether such as divinyl ether is desirable. In the present invention, if the purpose is to increase the etching resistance, R 6 It is preferable to introduce an alicyclic structure into the polymer, and it is most preferable to simultaneously contain fluorine and an alicyclic structure for the purpose of increasing transparency and imparting etching resistance. As described above, R in the above general formula 6 Compounds having various structures introduced therein can be applied. When a vinyl ether of the general formula (9) is reacted with a fluorine-containing raw material compound, R 6 Is R 3 Matches. When the fluorine-containing compound is a polymerizable monomer, a polymerization method similar to the polymerization of the fluorine-containing raw material compound described above can be used.
[0032]
The vinyl ether most preferably employed in the present invention includes R 6 A compound having at least a portion of at least one hexafluorocarbinol group represented by the general formula (10) or another acidic OH group and an alicyclic structure can be used for controlling the dissolution rate.
Embedded image
Here, examples of the alicyclic structure suitable for the vinyl ether side chain include cyclohexane, norbornene, polynuclear norbornene, and adamantane structure, and specific examples thereof include structures represented by the following general formulas.
Embedded image
[0033]
Next, the divinyl ether usable in the present invention will be described. Divinyl ether is a compound having a structure represented by the following general formula.
Embedded image
Where R 7 Is a hydrocarbon group that may contain a linear or branched alkyl group, an aromatic group, or an alicyclic group, and may contain fluorine, oxygen, nitrogen, a carbonyl bond, an alcohol, and the like. That is, R 7 Various structures can be applied without particular limitation, but if specific examples are used for the purpose of improving transparency,
Embedded image
[0034]
The resist material according to the present invention can be used for both negative type and positive type systems in which the solubility in an alkaline aqueous solution changes due to the action of an acid. However, since the present invention is for introducing an efficient acid labile group, Positive types are preferred. That is, a 193 nm ArF excimer laser corresponding to recent miniaturization of semiconductors and F in the vacuum ultraviolet region represented by 157 nm. 2 It is suitable as a positive photoresist using a laser or an active energy ray such as an electron beam and an X-ray or other photoresist. For example, the portion to which the vinyl ether according to the present invention is added has a function of changing the solubility in an alkaline aqueous solution due to the action of an acid, and thus it is possible to efficiently obtain a positive behavior. That is, it is insoluble or hardly soluble in an alkaline aqueous solution before being irradiated with an active energy ray, and is hydrolyzed by an acid generated from an acid generator by irradiating with an active energy ray, and shows solubility in an alkaline aqueous solution. Become a positive type.
[0035]
The use of the present invention will be described in more detail. The following two methods can be exemplified as typical uses of the present invention. The first method is a method of synthesizing a fluorine compound in which a vinyl ether is reacted with a fluorine-containing raw material compound in advance, and dissolving the fluorine-containing compound in an organic solvent or the like to obtain a resist composition. In this case, a resist solution is obtained by adding a polymerized or copolymerized compound as a main component as a fluorine-containing compound and adding an acid generator and other additives. When a film is formed on a substrate using the resist solution and then prebaked, and then irradiated with active energy rays, part or all of the fluorine-containing compound returns to the fluorine-containing raw material compound, and alkali solubility is expressed.
[0036]
On the other hand, in a second method which can be used in the present invention, a solution obtained by dissolving a fluorine-containing raw material compound and vinyl ethers in an organic solvent in a mixed state is used as a resist solution. In this case, the acid generator and other necessary additives are mixed together with the fluorine-containing raw material compound and vinyl ethers. Next, when the resist solution is formed on a substrate and then prebaked, the fluorine-containing raw material compound and vinyl ethers undergo a chemical reaction in the film due to heat treatment during the prebaking, and become insoluble in an alkaline solution. Thereafter, when irradiation with active energy rays is performed, part or all of the fluorine-containing compound returns to the fluorine-containing raw material compound, and alkali solubility is expressed. That is, in the present invention, the case where a fluorine-containing compound is used in the process of forming a resist pattern is also preferably employed. In the present invention, in either the first method or the second method, a method of forming a resist pattern by using a photoresist in device manufacture can be used without any limitation. Then, a solution of the resist composition is applied by a spinner or the like, and dried to form a photosensitive layer. The photosensitive layer is irradiated with laser light through a desired mask pattern by an exposure device or the like, and heated. Next, this is developed using a developing solution, for example, an alkaline aqueous solution such as a 0.1 to 10% by weight aqueous solution of tetramethylammonium hydroxide. With this forming method, a pattern faithful to the mask pattern can be obtained.
[0037]
The photoacid generator used in the composition of the present invention is not particularly limited, and any one can be selected from those used as acid generators for chemically amplified resists. Examples of such an acid generator include bissulfonyldiazomethanes, nitrobenzyl derivatives, onium salts, halogen-containing triazine compounds, cyano group-containing oxime sulfonate compounds, and other oxime sulfonate compounds. These acid generators may be used alone or in combination of two or more, and the content is usually 0.5 to 20 parts by weight with respect to 100 parts by weight of the polymer compound. Is selected in the range. If the amount is less than 0.5 part by weight, the image forming property is insufficient, and if it exceeds 20 parts by weight, a uniform solution is hardly formed, and the storage stability tends to decrease.
[0038]
The fields of application of the present invention are furthermore additives which are optionally miscible, such as additional resins, quencher, plasticizers, stabilizers, colorants, surfactants, thickeners, leveling agents, defoamers, Various additives such as a solubilizer, an adhesive, and an antioxidant can be contained.
[0039]
【Example】
[Example 1]
67 g and 170 g of the following monomers 1 and 2 were mixed and dissolved together with 500 g of n-butyl acetate in a three-necked flask equipped with a reflux condenser and a stirrer. To this solution was added 7 g of azobisisobutyronitrile (AIBN) as a polymerization initiator, and the mixture was heated in an oil bath at 60 ° C. and reacted for 20 hours. After the reaction, the polymerization solution was poured into a large excess of n-hexane and stirred. The resulting precipitate was collected by filtration and vacuum dried at 50 ° C. for 18 hours. When the composition of the obtained polymer 1A was measured from 1H-NMR and 19F-NMR, it was unit 1: unit 2 = 68: 32. The molecular weight Mw was 14,000 from GPC analysis (standard polystyrene).
Embedded image
Next, with respect to 100 parts by weight of the obtained polymer 1A, vinyl ether A was dissolved in propylene glycol monomethyl ether so as to become 30 parts by weight, and the mixture was stirred at 80 ° C. for 5 hours. The unit was changed to unit 3, and polymer 1B (unit 1: unit 2: unit 3 = 35: 38: 27) was obtained.
Embedded image
[0040]
[Example 2]
Polymer 2A (unit 1: unit 4: unit 5: unit 6 = 40: 10: 20: 30), 3A (unit 8: unit 9 = 21: 79), 4A (unit 1: Unit 11: Unit 5: Unit 2 = 33: 25: 7: 35), 5A (Unit 13: Unit 14: Unit 15: Unit 16 = 30: 10: 41: 19), and then vinyl ether B, C, D is reacted, and the following polymer 2B (unit 1: unit 4: unit 5: unit 6: unit 7 = 5: 10: 20: 30: 35), 3B (unit 8: unit 9: unit 10 = 21: 37) : 42), 4B (unit 1: unit 11: unit 5, unit 2: unit 12 = 6: 25: 7: 35: 27), 5B (unit 13: unit 1) : Unit 15: Unit 16: Unit 17 = 2: 10: 41: 19:28) was obtained.
Embedded image
[0041]
[Example 3]
70 g of monomer 1 and 30 g of vinyl ether C were dissolved and mixed together with 200 g of butyl acetate in a three-necked flask equipped with a reflux condenser and a stirrer, and then reacted at 80 ° C. for 5 hours. Then, unreacted substances and butyl acetate were distilled off. As a result, 76 g of monomer 3 was obtained.
Next, 109 g and 110 g of monomer 3 and monomer 2 were mixed and dissolved together with 500 g of n-butyl acetate in a three-necked flask equipped with a reflux condenser and a stirrer. To this solution was added 7 g of azobisisobutyronitrile (AIBN) as a polymerization initiator, and the mixture was heated in an oil bath at 60 ° C. and reacted for 20 hours. After the reaction, the polymerization solution was poured into a large excess of n-hexane and stirred. The resulting precipitate was collected by filtration and vacuum dried at 50 ° C. for 18 hours. When the composition of the obtained polymer 6 was measured by 1H-NMR and 19F-NMR, the ratio of unit 18: unit 2 was 71:29. The molecular weight Mw was 19,000 from GPC analysis (standard polystyrene).
Embedded image
[0042]
[Example 4]
Polymers 1B to 5B and Polymer 6 obtained in Examples 1 to 3 were each dissolved in tetrahydrofuran and formed into a film on a CaF 2 substrate by spin coating. After drying at 100 ° C. for 2 hours, the transmittance at 157 nm was measured by a vacuum ultraviolet absorption spectrometer, and the light transmittance converted to a film thickness of 100 nm was a high value shown in Table 1. The transmittance of the polymer 5B at 193 nm was measured.
Next, Polymers 1B to 5B and Polymer 6 are dissolved in propylene glycol monomethyl ether so that the acid generator DPI-OTf becomes 3 parts by weight with respect to 100 parts by weight of each, to obtain a solution having a total solid content of 20%. These solutions were repeatedly filtered through a 0.2-micron filter twice to obtain respective resist solutions. Next, these were spin-coated on a 6-inch silicon wafer to obtain a film having a thickness of 100 to 200 nanometers, and then dried at 80 ° C., which was insoluble in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide. . Next, the resist film produced from Polymers 1B to 4B and Polymer 6 was irradiated with a Kr2 excimer lamp of 146 nm, heated at 100 ° C. for 60 seconds, and then developed with a 2.38% by weight aqueous solution of tetramethylammonium hydroxide. Good positive behavior was confirmed in all systems. On the other hand, the resist film manufactured from polymer 5B was irradiated with 193 nm of ArF excimer laser, heated at 100 ° C. for 60 seconds, and then developed with a 2.38% by weight aqueous solution of tetramethylammonium hydroxide. confirmed. The results are shown in Table 1.
Embedded image
[0043]
[Example 5]
Vinyl ether E was dissolved in propylene glycol monomethyl ether so as to be 25 parts by weight with respect to 100 parts by weight of polymer 2A obtained in Example 1 to obtain a solution having a total solid content of 18%. In this solution, as an acid generator, DPI-OTf was dissolved in propylene glycol monomethyl ether so as to be 4 parts by weight to obtain a solution having a total solid concentration of 20%, and filtration was repeated twice with a 0.2-micron filter. A resist solution was obtained. Next, these were spin-coated on a 6-inch silicon wafer to obtain a film having a thickness of 120 nanometers, dried at room temperature and then dissolved in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide. Then, when the same resist film was heated and dried at 80 ° C., it turned insoluble in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide.
Then, the resist film was irradiated with a Kr2 excimer lamp of 146 nm and heated at 100 ° C. for 60 seconds. The resist film was dissolved in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide, and favorable positive type behavior was confirmed. The results are shown in Table 1.
Embedded image
[Table 1]
Claims (17)
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