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JP2004247544A - Manufacturing method of polymer ptc element - Google Patents

Manufacturing method of polymer ptc element Download PDF

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Publication number
JP2004247544A
JP2004247544A JP2003036351A JP2003036351A JP2004247544A JP 2004247544 A JP2004247544 A JP 2004247544A JP 2003036351 A JP2003036351 A JP 2003036351A JP 2003036351 A JP2003036351 A JP 2003036351A JP 2004247544 A JP2004247544 A JP 2004247544A
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Japan
Prior art keywords
ptc element
polymer ptc
shaped
metal foil
hoop
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JP2003036351A
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Japanese (ja)
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JP3917533B2 (en
Inventor
Tsukasa Kin
司 金
Takashi Kyogoku
考 京極
Hisanao Tosaka
久直 戸坂
Koichi Sato
広一 佐藤
Akio Abe
秋男 阿部
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TDK Corp
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TDK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a characteristic defect caused by thermal deterioration resulting from soldering or welding by connecting a lead terminal to a polymer PTC element main body without directly imparting heat in soldering or welding thereto in the case of connection. <P>SOLUTION: The electrode of a lead terminal 3 is bonded to a polymer PTC element main body 1 without imparting heat of soldering or welding to the polymer PTC element main body 1. Therefore, metal foil 2 that becomes the electrode is bonded and integrated to the lead terminal 3 in advance, and a mounting surface of the metal foil 2 is then bonded to the PTC element main body 1. The mounting surface of the metal foil 2 is roughened in advance. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、過電流から電池や回路を保護するため等に使用される、正の抵抗温度係数を示すポリマーPTC素子の製造方法に関するものであり、ポリマーPTC素子は携帯電話、ビデオカメラ、コンピュータ等の電池パックに繋がる回路を過電流や過熱から保護する為の電子部品として好適なものである。
【0002】
【従来の技術】
従来公知の技術としては、ポリマーPTC素子本体に設けられた電極とリード端子との間をはんだ付けした構造(下記特許文献1参照)、またポリマーPTC素子本体に設けられた電極とリード端子の間を溶接により接続する構造(下記特許文献2参照)が知られている。
【0003】
更に、ポリマーPTC素子本体に設けられた電極(金属箔)については、表面に0.1〜100μmの凹凸のある金属電極とポリマーPTC素子本体が直接物理的に接触する構造(下記特許文献3参照)、及び前記電極の凹凸(ミクロラフ)部材質をNiに限定して導電性ポリマー素子(ポリマーPTC含む)と直接物理的に接触する構造(下記特許文献4参照)が提案されている。但し、電極に凹凸を形成する工法については言及していない。
【0004】
また、ポリマーPTC素子本体の電極として、当該素子本体表面に接する面を粗面化した金属板の使用が開示されている(下記特許文献5参照)。
【0005】
【特許文献1】実開平2−146401号公報
【特許文献2】特開平2−268402号公報
【特許文献3】米国特許第4,689,475号公報
【特許文献4】米国特許第4,800,253号公報
【特許文献5】特公平5−9921号公報
【0006】
【発明が解決しようとする課題】
ポリマーPTC素子本体に設けられた電極とリード端子をはんだ付けや溶接で接続する構造の場合、はんだ付けや溶接の際のポリマーPTC素子本体への熱劣化を免れることが困難であった。そのためにポリマーPTC素子本体の特性不良を招いてしまい、歩留まりも低下するという問題が生じていた。
【0007】
本発明の第1の目的は、上記の点に鑑み、ポリマーPTC素子本体にリード端子を接続する際、はんだ付けや溶接時の熱を直接与えないで接続することで、はんだ付けや溶接による熱劣化による特性不良の発生を防止可能なポリマーPTC素子の製造方法を提供することにある。
【0008】
本発明の第2の目的は、ポリマーPTC素子本体に対するリード端子の接続強度を高くして、特殊工程を必要としないで製造歩留まりを向上させ、低コストで製造可能とするポリマーPTC素子の製造方法を提供することにある。
【0009】
本発明のその他の目的や新規な特徴は後述の実施の形態において明らかにする。
【0010】
【課題を解決するための手段】
上記目的を達成するために、本願請求項1の発明に係るポリマーPTC素子の製造方法は、ポリマーPTC素子本体にはんだ付けや溶接による熱を与えずに、リード端子の電極部を前記PTC素子本体に接合することを特徴としている。
【0011】
本願請求項2の発明に係るポリマーPTC素子の製造方法は、請求項1において、前記リード端子に前記電極部となる金属箔を予め接合一体化してから、前記金属箔の装着面を前記PTC素子本体に接合することを特徴としている。
【0012】
本願請求項3の発明に係るポリマーPTC素子の製造方法は、請求項1において、前記リード端子が連なったフープ状端子を用い、該フープ状端子に電極部となる長尺の金属箔を予め接合一体化してから、前記長尺の金属箔の装着面をシート状PTC素子本体に接合し、その後、前記フープ状端子、前記長尺の金属箔及び前記シート状ポリマーPTC素子本体の不要部分を除去して個々のリード端子及びポリマーPTC素子本体に分離することを特徴としている。
【0013】
本願請求項4の発明に係るポリマーPTC素子の製造方法は、請求項2又は3において、前記金属箔の装着面に節瘤状凹凸が形成されていることを特徴としている。
【0014】
本願請求項5の発明に係るポリマーPTC素子の製造方法は、請求項1において、前記リード端子の電極部の装着面が予めメッキ処理によって節瘤状凹凸を形成させて粗面化されており、前記装着面を前記PTC素子本体に接合することを特徴としている。
【0015】
本願請求項6の発明に係るポリマーPTC素子の製造方法は、請求項1において、前記リード端子が連なったフープ状端子の電極部の装着面が予めメッキ処理によって節瘤状凹凸を形成させて粗面化されており、前記装着面をシート状PTC素子本体に接合し、その後、前記フープ状端子及び前記シート状ポリマーPTC素子本体の不要部分を除去して個々のリード端子及びポリマーPTC素子本体に分離することを特徴としている。
【0016】
【発明の実施の形態】
以下、本発明に係るポリマーPTC素子の製造方法の実施の形態を図面に従って説明する。
【0017】
図1乃至図6で本発明に係るポリマーPTC素子の製造方法の第1の実施の形態を説明する。図1は第1の実施の形態の場合の製造方法の概略を、図2はその製造方法で得られるポリマーPTC素子をそれぞれ示す。また、図3はフープ状リード端子を用いて量産する場合の工程フローを、図4乃至図6は各工程の説明をそれぞれ示す。
【0018】
まず、図1及び図2を用いて製造方法の概略について説明する。これらの図において、1はポリマーPTC素子本体、2はポリマーPTC素子本体の両面にそれぞれ接合すべき金属箔(電極部)、3はリード端子である。ここで、リード端子3は厚み0.1mm程度のNi又はNi合金等であり、金属箔2は厚み25μmで、好適な材質としてNi、Cuがあるが、Ni又はNiメッキを施したCu箔が特性上良い結果が出ている。金属箔2のポリマーPTC素子本体への装着面(電極部)は粗面化されており、より好ましくは節瘤(凹凸差5〜15μm程度で頭部に対して中間部乃至基部がくびれている形状)が多数形成されて粗面化されているものが接続強度を上げる上で望ましい。
【0019】
そして、はじめに図1(A)の手順#1で金属箔2にリード端子3をはんだ付けや溶接で接合し、その後手順#2でポリマーPTC素子本体1の両面にそれぞれリード端子3に電極部として一体化された金属箔2の装着面を熱プレスにより接合する。
【0020】
前記リード端子3とその電極部となる金属箔2のはんだ付けの温度は約200℃であり、また溶接の場合はそれより遙かに高温である。そのようなはんだ付けや溶接時の約200℃もしくはそれ以上の高い温度はポリマーPTC素子本体1に熱劣化を与え、ひいては特性不良の要因となる。その為、リード端子3と金属箔2を予めはんだ付けや溶接で接合一体化してから、リード端子3の電極部としての金属箔2とポリマーPTC素子本体1とを熱プレスにより接合する。この熱プレスにより接合する温度は約150℃であり、この温度はポリマーPTC素子本体1に熱劣化を与えない。ポリマーPTC素子本体1を約150℃で軟化させて、凹凸のある金属箔2の粗面にそのまま沿って接合させる。
【0021】
これにより、図1(B)及び図2のように、ポリマーPTC素子本体1にリード端子3の電極部となっている金属箔2を確実に接合したポリマーPTC素子が得られる。
【0022】
このように、第1の実施の形態の製造方法では、ポリマーPTC素子本体1には、はんだ付けや溶接の温度約200℃が直接加わらないため、ポリマーPTC素子本体1の熱劣化及びこれに伴う特性不良の発生を回避できる。また、前記リード端子3の電極部となる金属箔2の装着面を粗面化しておくことにより、ポリマーPTC素子本体1に対するリード端子3の接合強度を十分確保することができ、さらに前記装着面に節瘤を多数有する粗面化処理を施せば、いっそうの接合強度向上が図れる。
【0023】
次に図3のフープ状リード端子を用いて量産する場合(連続多数個取りの場合)の工程フローに基づき、ポリマーPTC素子の製造方法を具体的に説明する。
【0024】
まず、図4(A)のように、リード端子が一連となったフープ状端子30をリールで供給し、はんだ印刷機にてフープ状端子30にはんだ37を印刷するとともに、長尺の金属箔(導電部材)20をロールで供給し、フープ状端子30に位置決めして重ね合わせ、リフロー炉へ供給する。これにより、図4(B)の金属箔はんだ付け状態のフープ状端子30が作製される。フープ状端子30の材質はNi又はNi合金等であり、金属箔20はCu,Ni等が好適であるが、Ni又はNiメッキを施したCu箔が特性上良い結果がでている。また、金属箔20のシート状ポリマーPTC素子本体10への装着面は粗面化されており、好ましくは節瘤(凹凸差5〜15μm程度で頭部に対して中間部乃至基部がくびれている形状)が多数形成されている。
【0025】
そして、裁断機によって金属箔付きフープ状端子を所定長さ(短冊)に切断し(シート状ポリマーPTC素子本体10の長さに合致させ)、その後、図4(C)のように金属箔付きフープ状端子30上(金属箔20の装着面上)にシート状ポリマーPTC素子本体10を位置決めしセット(載置)する。それから、図5(A)のように、下側の金属箔付きフープ状端子30上に位置決め載置されたシート状ポリマーPTC素子本体10の上に、上側の金属箔付きフープ状端子30を位置決め載置する(金属箔20の装着面をシート状ポリマーPTC素子本体10に対接させる。)。図5(B)のように上下の金属箔付きフープ状端子30間にシート状ポリマーPTC素子本体10を位置決めして挟んだ状態で貼り合わせ金型(治具)40に配置する。つまり、その貼り合わせ金型40の下金型41と上金型42間に上下の金属箔付きフープ状端子30及びシート状ポリマーPTC素子本体10の三者を配置し金型41,42を合わせ、図5(C)のように貼り合わせ金型40を熱プレスする。
【0026】
その結果、図6(A)のように上下の金属箔付きフープ状端子30間にシート状ポリマーPTC素子本体10が接合一体化された部品連50が得られる。この部品連50は徐冷後、電子ビーム照射によりEB架橋処理を行う。そして、この部品連50に対して図6(B)のように個々のリード端子3間の不要部分をプレスにて打ち抜き(シート状ポリマーPTC素子本体10を個別のポリマーPTC素子本体1に分離し)、さらに図6(C)のようにフープ状端子30の不要な耳部分31を切り離す。これにより、図6(D)に示した単品のポリマーPTC素子の製品形状が得られる。
【0027】
図7乃至図13で本発明に係るポリマーPTC素子の製造方法の第2の実施の形態を説明する。図7及び図8は第2の実施の形態の場合の製造方法の概略を示す。また、図9はフープ状リード端子を用いて量産する場合の工程フローを、図10乃至図12は各工程の説明をそれぞれ示し、図13はリード端子の粗面化した状態及びポリマーPTC素子本体との接合状態を示す。
【0028】
まず、図7及び図8を用いて製造方法の概略について説明する。これらの図において、1はポリマーPTC素子本体、3はポリマーPTC素子本体の両面にそれぞれ接合すべきリード端子である。ここで、リード端子3はNi又はNi合金等であるが、ポリマーPTC素子本体1への接合部分となる電極部35の装着面にはNi、Cu等の電気メッキ又は化学メッキにより粗面化処理が一体的に施されている。この粗面化処理は、図13(A)のように、節瘤36(凹凸差5〜15μm程度で頭部に対して中間部乃至基部がくびれている形状)がメッキ表面自体に多数形成されているものが望ましい。例えば電気メッキによる節瘤形成は、メッキ電流をパルス状に流すことにより得られる。電気メッキ又は化学メッキでリード端子3の電極部35に析出させる金属はとくにNiが特性上良い結果が出ている。
【0029】
そして、図7(A)のように、リード端子3の粗面化処理後の電極部35(装着面)を、ポリマーPTC素子本体1の両面にそれぞれ対接させ、熱プレスにより接合する。この熱プレスにより接合する温度は約150℃であり、この温度はポリマーPTC素子本体1に熱劣化を与えない。ポリマーPTC素子本体1を約150℃で軟化させて、図13(B)のように節瘤36が多数形成されて凹凸のある電極部35の装着面にそのまま沿って接合させる。
【0030】
これにより、図7(B)のように、ポリマーPTC素子本体1にリード端子3の電極部35を確実に接合したポリマーPTC素子が得られる。
【0031】
このように、第2の実施の形態の製造方法においても、リード端子のはんだ付けや溶接の工程を無くすことで、ポリマーPTC素子本体1の熱劣化及びこれに伴う特性不良の発生を回避できる。また、前記リード端子3とその電極部35の装着面を粗面化しておくことにより、ポリマーPTC素子本体1に対するリード端子3の接合強度を十分確保することができ、さらに前記装着面に多数の節瘤を有する粗面化処理を施せば、いっそうの接合強度向上が図れる。
【0032】
次に図9の電極部を粗面化したフープ状リード端子を用いて量産する場合(連続多数個取りの場合)の工程フローに基づき、ポリマーPTC素子の製造方法を具体的に説明する。
【0033】
まず、図10(A)のように、リード端子が一連となったフープ状端子30(但し、図13(A)のように電気メッキ又は化学メッキにより多数の節瘤(凹凸差5〜15μm程度)が一体に形成されて電極部が粗面化処理されたもの)をリールで供給し、裁断機によってフープ状端子を所定長さ(短冊)に切断する。これはシート状ポリマーPTC素子本体10の長さに合致させるためである。フープ状端子30の材質はNi又はNi合金等であり、電極部の装着面の粗面化処理のための電気メッキ又は化学メッキはCu,Ni等が好適であるが、Niが特性上良い結果がでている。
【0034】
その後、図10(B)のように粗面化処理したフープ状端子30上(電極部の粗面化した装着面上)にシート状ポリマーPTC素子本体10を位置決めしセット(載置)する。それから、図11(A)のように、下側のフープ状端子30上に位置決め載置されたシート状ポリマーPTC素子本体10の上に、上側の粗面化処理したフープ状端子30を位置決め載置する(電極部の装着面をシート状ポリマーPTC素子本体10にそれぞれ対接させる。)。図11(B)のように上下の粗面化処理されたフープ状端子30間にシート状ポリマーPTC素子本体10を位置決めして挟んだ状態で貼り合わせ金型40に配置する。つまり、その貼り合わせ金型40の下金型41と上金型42間に上下の粗面化処理したフープ状端子30及びシート状ポリマーPTC素子本体10の三者を配置し金型41,42を合わせ、図11(C)のように貼り合わせ金型40を熱プレスする。
【0035】
その結果、図12(A)のように上下のフープ状端子30間にシート状ポリマーPTC素子本体10が接合一体化された部品連50が得られる。この部品連50は徐冷後、電子ビーム照射によりEB架橋処理を行う。そして、この部品連50に対して図12(B)のように個々のリード端子3間の不要部分をプレスにて打ち抜き(シート状ポリマーPTC素子本体10を個別のポリマーPTC素子本体1に分離し)、さらに図12(C)のようにフープ状端子30の不要な耳部分31を切り離す。これにより、図12(D)のポリマーPTC素子の製品形状が得られる。
【0036】
以上本発明の実施の形態について説明してきたが、本発明はこれに限定されることなく請求項の記載の範囲内において各種の変形、変更が可能なことは当業者には自明であろう。
【0037】
【発明の効果】
以上説明したように、本発明に係るポリマーPTC素子の製造方法によれば、リード端子の電極部となる金属箔を予めリード端子にはんだ付けや溶接で一体化しておくことにより、あるいはリード端子の電極部となる表面を予め電気メッキや化学メッキ処理によって粗面化しておくことにより、ポリマーPTC素子本体にはんだ付けや溶接による熱を与えずに済み、更に、熱劣化による特性不良を無くすことができる。
【0038】
また、前記金属箔の粗面化、前記リード端子の電極部の粗面化処理において多数の節瘤を形成して粗面化する場合、リード端子のポリマーPTC素子本体への接合強度のいっそうの向上を図ることができる。
【0039】
さらに、生産効率と歩留まりの向上が図れて低コストで製造可能な利点がある。
【図面の簡単な説明】
【図1】本発明に係るポリマーPTC素子の製造方法の第1の実施の形態であって、製造方法の概略を示す説明図である。
【図2】第1の実施の形態で得られるポリマーPTC素子の製品形状を示す斜視図である。
【図3】第1の実施の形態においてフープ状端子を用いて製造する場合の工程フロー図である。
【図4】図3の工程フローにおいて、フープ状端子の供給からシート状ポリマーPTC素子本体の載置までの工程を示す説明図である。
【図5】図3の工程フローにおいて、上下のフープ状端子間へのシート状ポリマーPTC素子本体の載置から熱プレスまでの工程を示す説明図である。
【図6】図3の工程フローにおいて、上下のフープ状端子間にシート状ポリマーPTC素子本体を挟んで接合した部品連の不要部の分離処理の工程乃至製品形状完成までを示す説明図である。
【図7】本発明の第2の実施の形態であって、製造方法の概略を示す説明図である。
【図8】同じく分解斜視図である。
【図9】第2の実施の形態においてフープ状端子を用いて製造する場合の工程フロー図である。
【図10】図9の工程フローにおいて、フープ状端子の供給からシート状ポリマーPTC素子本体の載置までの工程を示す説明図である。
【図11】図9の工程フローにおいて、上下のフープ状端子間へのシート状ポリマーPTC素子本体の載置から熱プレスまでの工程を示す説明図である。
【図12】図9の工程フローにおいて、上下のフープ状端子間にシート状ポリマーPTC素子本体を挟んで接合した部品連の不要部の分離処理の工程乃至製品形状完成までを示す説明図である。
【図13】フープ状端子の電極部の粗面化状態、及びポリマーPTC素子本体と電極部との接合状態を示す断面図である。
【符号の説明】
1 ポリマーPTC素子本体
2,20 金属箔
3 リード端子
10 シート状ポリマーPTC素子本体
30 フープ状端子
35 電極部
36 節瘤
40 貼り合わせ金型
50 部品連
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for producing a polymer PTC element having a positive temperature coefficient of resistance, which is used for protecting a battery or a circuit from overcurrent, and the polymer PTC element is used for a mobile phone, a video camera, a computer, and the like. It is suitable as an electronic component for protecting a circuit connected to the battery pack from overcurrent and overheating.
[0002]
[Prior art]
Conventionally known techniques include a structure in which an electrode provided on a polymer PTC element body and a lead terminal are soldered (see Patent Document 1 below), and a method in which an electrode provided on a polymer PTC element body and a lead terminal are soldered. (See Patent Literature 2 below) is known.
[0003]
Further, as for the electrode (metal foil) provided on the polymer PTC element main body, a structure in which the metal electrode having the unevenness of 0.1 to 100 μm on the surface is in direct physical contact with the polymer PTC element main body (see Patent Document 3 below) ), And a structure in which the material of the electrode irregularities (microrough) is limited to Ni and directly in physical contact with a conductive polymer element (including polymer PTC) (see Patent Document 4 below). However, it does not mention a method for forming irregularities on the electrode.
[0004]
Further, as an electrode of a polymer PTC element main body, use of a metal plate whose surface in contact with the surface of the element main body is roughened is disclosed (see Patent Document 5 below).
[0005]
[Patent Document 1] Japanese Utility Model Laid-Open No. 2-146401 [Patent Document 2] Japanese Patent Application Laid-Open No. 2-268402 [Patent Document 3] U.S. Pat. No. 4,689,475 [Patent Document 4] U.S. Pat. [Patent Document 5] Japanese Patent Publication No. 5-9921 [0006]
[Problems to be solved by the invention]
In the case of a structure in which the electrodes provided on the polymer PTC element body and the lead terminals are connected by soldering or welding, it has been difficult to avoid thermal degradation to the polymer PTC element body during soldering or welding. As a result, the characteristics of the polymer PTC element main body are inferior and the yield is reduced.
[0007]
In view of the above, a first object of the present invention is to connect a lead terminal to a polymer PTC element body without directly applying heat at the time of soldering or welding, so that heat generated by soldering or welding can be obtained. An object of the present invention is to provide a method for manufacturing a polymer PTC element capable of preventing occurrence of characteristic failure due to deterioration.
[0008]
A second object of the present invention is to provide a method of manufacturing a polymer PTC element, in which the connection strength of a lead terminal to a polymer PTC element body is increased, the manufacturing yield is improved without requiring a special process, and the manufacturing can be performed at low cost. Is to provide.
[0009]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a polymer PTC element according to the invention of claim 1 of the present application comprises the steps of: connecting a lead terminal electrode portion to the PTC element body without applying heat by soldering or welding to the polymer PTC element body. It is characterized by being joined to.
[0011]
The method for manufacturing a polymer PTC element according to the invention of claim 2 of the present application is the method according to claim 1, wherein a metal foil serving as the electrode portion is previously joined and integrated with the lead terminal, and then the mounting surface of the metal foil is connected to the PTC element. It is characterized by being joined to the main body.
[0012]
The method for manufacturing a polymer PTC element according to the invention of claim 3 of the present application is the method according to claim 1, wherein a hoop-shaped terminal in which the lead terminals are connected is used, and a long metal foil serving as an electrode portion is bonded to the hoop-shaped terminal in advance. After being integrated, the mounting surface of the long metal foil is joined to the sheet-like PTC element main body, and thereafter, unnecessary portions of the hoop-shaped terminal, the long metal foil and the sheet-like polymer PTC element main body are removed. Then, each lead terminal and the polymer PTC element main body are separated.
[0013]
A method for manufacturing a polymer PTC element according to the invention of claim 4 of the present application is characterized in that, in claim 2 or 3, a nodular irregularity is formed on the mounting surface of the metal foil.
[0014]
In the method for manufacturing a polymer PTC element according to claim 5 of the present invention, in claim 1, the mounting surface of the electrode portion of the lead terminal is roughened by forming nodular irregularities in advance by plating. The mounting surface is joined to the PTC element body.
[0015]
The method of manufacturing a polymer PTC element according to claim 6 of the present invention is characterized in that, in claim 1, the mounting surface of the electrode portion of the hoop-shaped terminal to which the lead terminal is connected is formed by forming a nodular unevenness by plating in advance. The mounting surface is bonded to the sheet-shaped PTC element body, and then unnecessary portions of the hoop-shaped terminal and the sheet-shaped polymer PTC element body are removed to separate lead terminals and the polymer PTC element body. It is characterized by being separated.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a method for manufacturing a polymer PTC element according to the present invention will be described with reference to the drawings.
[0017]
A first embodiment of a method for manufacturing a polymer PTC element according to the present invention will be described with reference to FIGS. FIG. 1 shows an outline of a manufacturing method in the case of the first embodiment, and FIG. 2 shows a polymer PTC element obtained by the manufacturing method. FIG. 3 shows a process flow in the case of mass production using a hoop-shaped lead terminal, and FIGS. 4 to 6 show the description of each process.
[0018]
First, the outline of the manufacturing method will be described with reference to FIGS. In these figures, 1 is a polymer PTC element main body, 2 is a metal foil (electrode portion) to be bonded to both surfaces of the polymer PTC element main body, and 3 is a lead terminal. Here, the lead terminal 3 is made of Ni or Ni alloy or the like having a thickness of about 0.1 mm, and the metal foil 2 has a thickness of 25 μm. Suitable materials include Ni and Cu. Good results are obtained in characteristics. The mounting surface (electrode portion) of the metal foil 2 on the main body of the polymer PTC element is roughened, and more preferably a nodule (difference of unevenness is about 5 to 15 μm, and the middle part to the base part is narrowed with respect to the head. It is desirable that a large number of shapes) are formed and roughened to increase the connection strength.
[0019]
First, in step # 1 of FIG. 1A, the lead terminals 3 are joined to the metal foil 2 by soldering or welding. Then, in step # 2, the lead terminals 3 are formed on both surfaces of the polymer PTC element body 1 as electrode portions respectively. The mounting surface of the integrated metal foil 2 is joined by hot pressing.
[0020]
The soldering temperature of the lead terminal 3 and the metal foil 2 serving as the electrode portion is about 200 ° C., and much higher in the case of welding. Such a high temperature of about 200 ° C. or more at the time of soldering or welding gives thermal deterioration to the polymer PTC element main body 1 and eventually causes poor characteristics. Therefore, after the lead terminal 3 and the metal foil 2 are joined and integrated in advance by soldering or welding, the metal foil 2 as an electrode part of the lead terminal 3 and the polymer PTC element main body 1 are joined by hot pressing. The joining temperature by this hot press is about 150 ° C., and this temperature does not cause thermal degradation to the polymer PTC element body 1. The polymer PTC element main body 1 is softened at about 150 ° C., and is bonded along the rough surface of the metal foil 2 having irregularities as it is.
[0021]
As a result, as shown in FIGS. 1B and 2, a polymer PTC element in which the metal foil 2 serving as the electrode portion of the lead terminal 3 is securely bonded to the polymer PTC element main body 1 is obtained.
[0022]
As described above, in the manufacturing method according to the first embodiment, since the temperature of about 200 ° C. for soldering or welding is not directly applied to the polymer PTC element main body 1, the thermal deterioration of the polymer PTC element main body 1 and the accompanying The occurrence of characteristic defects can be avoided. Also, by roughening the mounting surface of the metal foil 2 which will be the electrode part of the lead terminal 3, the bonding strength of the lead terminal 3 to the polymer PTC element main body 1 can be sufficiently ensured. If a roughening treatment having a large number of nodules is performed on the surface, further improvement in bonding strength can be achieved.
[0023]
Next, a method for manufacturing a polymer PTC element will be specifically described based on a process flow in the case of mass production using the hoop-shaped lead terminal of FIG.
[0024]
First, as shown in FIG. 4A, a hoop-shaped terminal 30 having a series of lead terminals is supplied by a reel, solder 37 is printed on the hoop-shaped terminal 30 by a solder printing machine, and a long metal foil is used. The (conductive member) 20 is supplied by a roll, is positioned on the hoop-shaped terminal 30, is superposed, and is supplied to a reflow furnace. As a result, the hoop-shaped terminal 30 in the metal foil soldered state shown in FIG. 4B is manufactured. The material of the hoop-shaped terminal 30 is Ni or a Ni alloy or the like, and the metal foil 20 is preferably Cu, Ni, or the like. However, a Cu foil plated with Ni or Ni has a good characteristic. The mounting surface of the metal foil 20 on the sheet-shaped polymer PTC element main body 10 is roughened, and is preferably a nodule (difference of unevenness is about 5 to 15 μm, and a middle part or a base part is narrowed with respect to a head part). Many shapes) are formed.
[0025]
Then, the hoop-shaped terminal with a metal foil is cut into a predetermined length (strip) by a cutting machine (to match the length of the sheet-shaped polymer PTC element body 10), and then, as shown in FIG. The sheet-shaped polymer PTC element body 10 is positioned and set (placed) on the hoop-shaped terminal 30 (on the mounting surface of the metal foil 20). Then, as shown in FIG. 5A, the upper hoop-shaped terminal 30 with a metal foil is positioned on the sheet-shaped polymer PTC element body 10 positioned and mounted on the lower hoop-shaped terminal 30 with a metal foil. It is placed (the mounting surface of the metal foil 20 is brought into contact with the sheet-shaped polymer PTC element body 10). As shown in FIG. 5B, the sheet-shaped polymer PTC element main body 10 is positioned between the upper and lower hoop-shaped terminals 30 with metal foil, and is placed in a bonding mold (jig) 40 in a state of being sandwiched therebetween. That is, the upper and lower hoop-shaped terminals 30 with metal foil and the sheet-shaped polymer PTC element body 10 are arranged between the lower mold 41 and the upper mold 42 of the bonding mold 40, and the molds 41 and 42 are joined. Then, the bonding mold 40 is hot-pressed as shown in FIG.
[0026]
As a result, as shown in FIG. 6 (A), a component chain 50 in which the sheet-shaped polymer PTC element main body 10 is integrally joined between the upper and lower hoop-shaped terminals 30 with metal foil is obtained. After the components 50 are gradually cooled, EB crosslinking is performed by electron beam irradiation. Unnecessary portions between the individual lead terminals 3 are punched out of the component string 50 by pressing as shown in FIG. 6B (the sheet-shaped polymer PTC element body 10 is separated into individual polymer PTC element bodies 1). 6) Then, unnecessary ear portions 31 of the hoop-shaped terminal 30 are cut off as shown in FIG. Thus, the product shape of the single polymer PTC element shown in FIG. 6D is obtained.
[0027]
A second embodiment of the method for producing a polymer PTC element according to the present invention will be described with reference to FIGS. 7 and 8 show an outline of a manufacturing method in the case of the second embodiment. FIG. 9 shows a process flow in the case of mass production using a hoop-shaped lead terminal, FIGS. 10 to 12 show the description of each process, respectively, and FIG. 13 shows a state in which the lead terminal is roughened and the polymer PTC element body. This shows the state of bonding with.
[0028]
First, an outline of the manufacturing method will be described with reference to FIGS. In these figures, 1 is a polymer PTC element main body, and 3 is a lead terminal to be bonded to both surfaces of the polymer PTC element main body, respectively. Here, the lead terminal 3 is made of Ni or a Ni alloy or the like, but the mounting surface of the electrode portion 35 which is a bonding portion to the polymer PTC element main body 1 is roughened by electroplating or chemical plating of Ni, Cu or the like. Has been integrated. In this roughening treatment, as shown in FIG. 13 (A), a large number of nodules 36 (a shape in which the middle part or base part is constricted with respect to the head with an unevenness of about 5 to 15 μm) are formed on the plating surface itself. Is desirable. For example, formation of a nodule by electroplating is obtained by flowing a plating current in a pulsed manner. Ni, which is a metal deposited on the electrode portion 35 of the lead terminal 3 by electroplating or chemical plating, has a particularly good characteristic.
[0029]
Then, as shown in FIG. 7A, the electrode portions 35 (mounting surfaces) after the surface roughening treatment of the lead terminals 3 are respectively brought into contact with both surfaces of the polymer PTC element body 1 and joined by hot pressing. The joining temperature by this hot press is about 150 ° C., and this temperature does not cause thermal degradation to the polymer PTC element body 1. The polymer PTC element main body 1 is softened at about 150 ° C., and a large number of nodes 36 are formed as shown in FIG.
[0030]
Thereby, as shown in FIG. 7B, a polymer PTC element in which the electrode portion 35 of the lead terminal 3 is securely joined to the polymer PTC element main body 1 is obtained.
[0031]
Thus, also in the manufacturing method of the second embodiment, by eliminating the steps of soldering and welding the lead terminals, it is possible to avoid the thermal degradation of the polymer PTC element main body 1 and the occurrence of the characteristic failure associated therewith. Further, by roughening the mounting surface of the lead terminal 3 and its electrode portion 35, the bonding strength of the lead terminal 3 to the polymer PTC element main body 1 can be sufficiently ensured. If the surface roughening treatment with nodules is performed, the joint strength can be further improved.
[0032]
Next, a method for manufacturing a polymer PTC element will be specifically described based on a process flow in the case where mass production is performed using a hoop-shaped lead terminal having roughened electrode portions in FIG.
[0033]
First, as shown in FIG. 10A, a hoop-shaped terminal 30 having a series of lead terminals (however, as shown in FIG. 13A, a large number of nodules (an unevenness of about 5 to 15 μm by electroplating or chemical plating). ) Are integrally formed and the electrode part is subjected to a surface roughening treatment), and the hoop-shaped terminal is cut into a predetermined length (strip) by a cutting machine. This is to match the length of the sheet-shaped polymer PTC element body 10. The material of the hoop-shaped terminal 30 is Ni or a Ni alloy or the like, and Cu or Ni is suitable for the electroplating or chemical plating for roughening the mounting surface of the electrode portion. Is out.
[0034]
Thereafter, the sheet-shaped polymer PTC element main body 10 is positioned and set (placed) on the hoop-shaped terminal 30 (on the roughened mounting surface of the electrode portion) as shown in FIG. 10B. Then, as shown in FIG. 11A, the upper roughened hoop-shaped terminal 30 is positioned and mounted on the sheet-shaped polymer PTC element main body 10 positioned and mounted on the lower hoop-shaped terminal 30. (The mounting surfaces of the electrode portions are brought into contact with the sheet-shaped polymer PTC element body 10, respectively.) As shown in FIG. 11 (B), the sheet-shaped polymer PTC element main body 10 is positioned between the hoop-shaped terminals 30 which have been subjected to the upper and lower surface roughening treatment, and is placed on the bonding mold 40 in a state of being sandwiched therebetween. That is, the three members of the hoop-shaped terminal 30 and the sheet-shaped polymer PTC element main body 10 that have been subjected to the upper and lower surface roughening treatment are arranged between the lower mold 41 and the upper mold 42 of the bonding mold 40 and the molds 41 and 42 are arranged. And the bonding mold 40 is hot-pressed as shown in FIG.
[0035]
As a result, as shown in FIG. 12 (A), a component chain 50 in which the sheet-shaped polymer PTC element main body 10 is joined and integrated between the upper and lower hoop-shaped terminals 30 is obtained. After the components 50 are gradually cooled, EB crosslinking is performed by electron beam irradiation. Unnecessary portions between the individual lead terminals 3 are punched out by pressing with respect to the component string 50 as shown in FIG. 12B (the sheet-shaped polymer PTC element body 10 is separated into individual polymer PTC element bodies 1). 12) Then, unnecessary ear portions 31 of the hoop-shaped terminal 30 are cut off as shown in FIG. Thereby, the product shape of the polymer PTC element of FIG. 12D is obtained.
[0036]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims.
[0037]
【The invention's effect】
As described above, according to the method of manufacturing a polymer PTC element according to the present invention, the metal foil to be the electrode portion of the lead terminal is previously integrated with the lead terminal by soldering or welding, or By pre-roughening the surface to be the electrode part by electroplating or chemical plating, it is not necessary to apply heat by soldering or welding to the polymer PTC element body, and it is possible to eliminate characteristic defects due to thermal deterioration. it can.
[0038]
Further, in the case where the metal foil is roughened and a large number of nodules are formed and roughened in the roughening process of the electrode portion of the lead terminal, the bonding strength of the lead terminal to the polymer PTC element body is further increased. Improvement can be achieved.
[0039]
Further, there is an advantage that the production efficiency and the yield can be improved and the production can be performed at low cost.
[Brief description of the drawings]
FIG. 1 is a first embodiment of a method for producing a polymer PTC element according to the present invention, and is an explanatory view schematically showing the production method.
FIG. 2 is a perspective view showing a product shape of a polymer PTC element obtained in the first embodiment.
FIG. 3 is a process flow chart in the case of manufacturing using a hoop-shaped terminal in the first embodiment.
FIG. 4 is an explanatory view showing steps from supply of a hoop-shaped terminal to mounting of a sheet-shaped polymer PTC element main body in the process flow of FIG. 3;
FIG. 5 is an explanatory view showing a process from mounting of the sheet-shaped polymer PTC element main body between upper and lower hoop-shaped terminals to hot pressing in the process flow of FIG. 3;
FIG. 6 is an explanatory view showing a process of separating unnecessary parts of a series of parts joined by sandwiching a sheet-shaped polymer PTC element body between upper and lower hoop-shaped terminals in the process flow of FIG. 3 to completion of a product shape. .
FIG. 7 is an explanatory view showing an outline of a manufacturing method according to a second embodiment of the present invention.
FIG. 8 is an exploded perspective view of the same.
FIG. 9 is a process flow chart in the case of manufacturing using a hoop-shaped terminal in the second embodiment.
FIG. 10 is an explanatory view showing steps from supply of a hoop-shaped terminal to mounting of a sheet-shaped polymer PTC element main body in the process flow of FIG. 9;
11 is an explanatory diagram showing a process from placing the sheet-shaped polymer PTC element body between upper and lower hoop-shaped terminals to hot pressing in the process flow of FIG. 9;
FIG. 12 is an explanatory diagram showing a process of separating unnecessary parts of a series of parts joined by sandwiching a sheet-shaped polymer PTC element body between upper and lower hoop-shaped terminals in the process flow of FIG. 9 to completion of a product shape. .
FIG. 13 is a cross-sectional view showing a roughened state of the electrode portion of the hoop-shaped terminal and a joined state of the polymer PTC element body and the electrode portion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polymer PTC element main body 2, 20 Metal foil 3 Lead terminal 10 Sheet-shaped polymer PTC element main body 30 Hoop-shaped terminal 35 Electrode part 36 Nodule 40 Bonding mold 50 Parts connection

Claims (6)

ポリマーPTC素子本体にはんだ付けや溶接による熱を与えずに、リード端子の電極部を前記PTC素子本体に接合することを特徴とするポリマーPTC素子の製造方法。A method for manufacturing a polymer PTC element, comprising joining an electrode portion of a lead terminal to the PTC element body without applying heat by soldering or welding to the polymer PTC element body. 前記リード端子に前記電極部となる金属箔を予め接合一体化してから、前記金属箔の装着面を前記PTC素子本体に接合する請求項1記載のポリマーPTC素子の製造方法。2. The method for manufacturing a polymer PTC element according to claim 1, wherein a metal foil serving as the electrode portion is bonded and integrated in advance to the lead terminal, and then a mounting surface of the metal foil is bonded to the PTC element body. 前記リード端子が連なったフープ状端子を用い、該フープ状端子に電極部となる長尺の金属箔を予め接合一体化してから、前記長尺の金属箔の装着面をシート状PTC素子本体に接合し、その後、前記フープ状端子、前記長尺の金属箔及び前記シート状ポリマーPTC素子本体の不要部分を除去して個々のリード端子及びポリマーPTC素子本体に分離する請求項1記載のポリマーPTC素子の製造方法。Using a hoop-shaped terminal in which the lead terminals are connected, a long metal foil serving as an electrode portion is bonded and integrated in advance to the hoop-shaped terminal, and then the mounting surface of the long metal foil is attached to the sheet-shaped PTC element body. 2. The polymer PTC according to claim 1, wherein the polymer PTC is joined, and thereafter, unnecessary portions of the hoop-shaped terminal, the long metal foil and the sheet-shaped polymer PTC element body are removed to separate the lead terminal and the polymer PTC element body. Device manufacturing method. 前記金属箔の装着面に節瘤状凹凸が形成されている請求項2又は3記載のポリマーPTC素子の製造方法。4. The method for producing a polymer PTC element according to claim 2, wherein nodular irregularities are formed on the mounting surface of the metal foil. 前記リード端子の電極部の装着面が予めメッキ処理によって節瘤状凹凸を形成させて粗面化されており、前記装着面を前記PTC素子本体に接合する請求項1記載のポリマーPTC素子の製造方法。2. The manufacturing method of a polymer PTC element according to claim 1, wherein the mounting surface of the electrode portion of the lead terminal is roughened in advance by forming nodular irregularities by plating, and the mounting surface is joined to the PTC element body. Method. 前記リード端子が連なったフープ状端子の電極部の装着面が予めメッキ処理によって節瘤状凹凸を形成させて粗面化されており、前記装着面をシート状PTC素子本体に接合し、その後、前記フープ状端子及び前記シート状ポリマーPTC素子本体の不要部分を除去して個々のリード端子及びポリマーPTC素子本体に分離する請求項1記載のポリマーPTC素子の製造方法。The mounting surface of the electrode portion of the hoop-shaped terminal in which the lead terminals are connected is roughened by forming nodular irregularities by plating in advance, and the mounting surface is joined to the sheet-like PTC element main body. 2. The method of manufacturing a polymer PTC element according to claim 1, wherein unnecessary parts of the hoop-shaped terminal and the sheet-shaped polymer PTC element main body are removed and separated into individual lead terminals and the polymer PTC element main body.
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JP2009533880A (en) * 2006-04-14 2009-09-17 ブアンズ・インコーポレイテッド Conductive polymer electronic device capable of surface mounting and manufacturing method thereof
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