JP2004241304A - Electronic connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic connector having excellent transmission characteristics up to a high frequency band, which can be miniaturized by reducing the total number of terminals for a ground system. <P>SOLUTION: This electronic connector is structured by providing a spiral contact 7 on its center side as a terminal for a signal system, and by providing a terminal 8 for a ground system around it. Thereby, since one terminal for the signal system is electromagnetically shielded by one terminal 8 for the ground system, transmission characteristics up to the high frequency zone can be obtained. At the same time, since the number of terminals for the ground system can be reduced in comparison with the conventional connector, the connector can be miniaturized. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic connector using a spiral contact, and more particularly to an electronic connector having excellent high frequency characteristics.
[0002]
[Prior art]
Conventional connectors of this type include, for example, the inventions described in Patent Literature 1 and Patent Literature 2.
[0003]
The connectors described in Patent Literature 1 and Patent Literature 2 are provided with a plurality of pin terminals. One pin terminal constitutes a signal system or ground system terminal, and three or four ground system pin terminals are arranged around one signal system pin terminal.
[0004]
In the connector, the ground pin terminals provided around the signal pin terminals reduce crosstalk between the signal system terminals and can obtain stable transmission characteristics even for high-frequency signals. I have.
[0005]
[Patent Document 1]
Patent No. 2587316 [Patent Document 2]
JP 06-163123 A
[Problems to be solved by the invention]
However, the conventional connector has the following problems.
(1) Since a plurality of ground terminals are arranged around one signal system terminal, the total number of terminals is easily increased, and it is difficult to reduce the size of the connector itself.
(2) By arranging a plurality of ground terminals around one signal system terminal, a magnetic shield effect close to that of a coaxial cable is to be obtained. It is difficult to obtain a strong magnetic shielding effect. In particular, the frequency that can cope with crosstalk is limited to several hundred MHz, and a high frequency band of 1 GHz or more adversely affects transmission characteristics.
(3) Since the boards are connected to each other via a large connector, it is difficult to reduce the dimension in the thickness direction after the connection.
[0007]
An object of the present invention is to solve the above-mentioned conventional problems, and to provide an electronic connector that can be downsized by reducing the number of ground system terminals while the number of signal system terminals is the same. It is an object.
[0008]
Another object of the present invention is to provide an electronic connector capable of obtaining good transmission characteristics even in a high frequency band by enhancing a magnetic shielding effect.
[0009]
It is another object of the present invention to provide an electronic connector in which boards can be connected to each other in the board thickness direction so that the dimension of the board after connection can be reduced in the board thickness direction.
[0010]
[Means for Solving the Problems]
The present invention is an electronic connector provided with a signal terminal and a ground terminal on a substrate,
The terminal of the signal system is formed of a spiral contact spirally extending from a winding end portion on the outer peripheral side toward a winding start end portion on the center side, and the spiral contact is provided at a peripheral portion of one spiral contact. One ground-type terminal is provided so as to surround the terminal.
[0011]
In addition, a plurality of contact portions are provided in which the signal system terminal and the ground system terminal constitute one set.
[0012]
Further, contact portions are arranged on both surfaces of the substrate, and the contact portion on one surface and the contact portion on the other surface are connected via a conductive portion provided in the substrate.
[0013]
In the present invention, since one signal-system terminal corresponds to one ground-system terminal, the total number of terminals can be reduced as compared with the related art. Therefore, when the number of terminals of the signal system is the same, the total number of terminals can be reduced to reduce the size of the electronic connector. When the terminals are arranged within a predetermined area, the terminals of the signal system that can be arranged can be arranged. You can increase the number.
[0014]
Further, since the substrates are connected to each other by the surface, the thickness of the plate after the connection can be reduced.
[0015]
Further, since the ground terminal is magnetically shielded by surrounding the signal terminal, the range of frequencies that can cope with crosstalk can be extended from the conventional hundreds of MHz to a high frequency band of 1 GHz or more. Therefore, transmission characteristics in a high frequency band can be improved.
[0016]
In the above, it is preferable that at least the ground terminal protrudes further away from the substrate than the signal terminal.
[0017]
It is preferable that the spiral contact has a winding end portion projecting upward from the winding start end portion.
[0018]
In the above configuration, when the electronic connector is connected to the board, the ground system is connected first, and then the signal system is connected, so that it is possible to suppress generation of noise at the time of connection.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
1 is a perspective view showing an embodiment of the electronic connector of the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, FIG. 3 is an enlarged plan view showing terminals in the electronic connector, and FIG. FIG. 5 is a cross-sectional view of the terminal taken along line BB in FIG. 3, FIG. 6 is a cross-sectional view of the terminal taken along line CC in FIG. 3, and FIG. 7 shows the first and second embodiments. FIG. 2 is a partial cross-sectional view showing a relationship between an electronic connector and a board, wherein A shows a state before connection and B shows a state after connection. In FIG. 1, the upper substrate is omitted.
[0020]
The electronic connector 1 of the present invention connects two opposing substrates as shown in FIGS. 1 and 2. The electronic connector 1 has a configuration in which a plurality of signal terminals and ground terminals (see FIG. 3 and the like) are arranged in a thin insulating substrate 2. In FIG. 1, the signal system terminals and the ground system terminals are schematically illustrated by circular hatching. On both surfaces of the insulating substrate 2, hooking projections 2a, 2a, 2a, 2a and hooking projections 2b, 2b, 2b, 2b projecting in the vertical direction are formed.
[0021]
As shown in FIGS. 1 and 2, the lower surface of the substrate 10 provided on the lower side of the drawing is a mounting surface (front surface) 10A on which various electronic components 12 are mounted, and the upper surface of the substrate 10 is connected to the electronic connector 1. Connection surface (back surface) 10B to be used. In the upper substrate 11 shown in FIG. 2, the upper surface in the drawing is a mounting surface (front surface) 11A on which various electronic components 12 are mounted, and the lower surface in the drawing is a back surface 11B connected to the electronic connector 1 (connection surface). is there.
[0022]
On the connection surface 10B of the substrate 10 and the connection surface 11B of the substrate 11, a connection region 13 to be connected to the electronic connector 1 is printed. The connection region 13 has a plurality of signal lines 13a surrounded by white lines and a ground line 13b indicated by hatching. The distal end of the signal line 13a is a circular connection portion 13a1, and the portion surrounding the connection portion 13a1 of the signal line 13a through a predetermined gap is the connection portion 13b1 of the ground line 13b. The connection portions 13b1 of the ground line 13b are all connected so as to have the same potential. The connection portions 13a1 of the plurality of signal lines 13a and the connection portions 13b1 of the corresponding ground lines 13b in the connection region 13 correspond to signal terminals and ground terminals of the electronic connector 1 described later.
[0023]
At the outer edge of the connection region 13, there are formed locking holes 10a, 10a, 10a, 10a penetrating the lower substrate 10. Then, by inserting the latching projections 2b, 2b, 2b, 2b of the electronic connector 1 into the latching holes 10a, 10a, 10a, 10a of the lower substrate 10, the electronic connector 1 and the lower substrate 10 are connected. Connected. Similarly, hook holes 11a, 11a, 11a, 11a are formed in the upper board 11, and the hook protrusions 2a, 2a, 2a, 2a of the electronic connector 1 are connected to the hook holes of the upper board 11. 11a, 11a, 11a, 11a, the electronic connector 1 and the upper substrate 11 are connected. Then, the lower substrate 10 and the upper substrate 11 are connected via the electronic connector 1.
[0024]
Hereinafter, the configuration of the electronic connector 1 will be described.
As shown in FIG. 1, a plurality of through holes 3 are arranged in a matrix (also referred to as a grid or a grid) on an insulating substrate 2 of an electronic connector 1. As shown in FIG. 3, substantially arc-shaped through holes 4 are formed symmetrically around each through hole 3. As shown in FIG. 5 and FIG. 6, step portions 3a are formed on both front and back surfaces of the through hole 3. Also, stepped portions 4a, 4a are formed symmetrically on the front and rear surfaces on the outer peripheral side of the through holes 4, 4, respectively. Copper-plated conductive portions 5 and 6, 6 are formed on the inner peripheral surface of the through hole 3 and the inner peripheral surface on the outer peripheral side of the through holes 4, 4. At the upper end and the lower end of the conductive portion 5 and the conductive portions 6, 6, the stepped portion 3a of the through hole 3 and the stepped portions 4a, 4a of the through holes 4, 4 are exposed to the front and back surfaces of the insulating substrate 2. The connection part 5a and the connection parts 6a, 6a are formed. The symmetrically formed connecting portion 6a and the connecting portion 6a are connected at a connecting connecting portion 6b formed therebetween.
[0025]
As shown in FIGS. 3 to 7, spiral contacts (contact portions) 7, which form signal terminals, are formed on the upper and lower surfaces of the through holes 3. It is provided so as to cover. As shown in FIG. 3, the spiral contact 7 has a substantially ring-shaped base 7a on the outer peripheral side, and a spiral end 7c on the distal end side from a winding start end 7b provided on the base 7a side. , And the winding end 7 c is located at the center of the through hole 3. As shown in FIGS. 4 to 7, the spiral contacts 7, 7 provided above and below the through hole 3 have a convex shape in a direction away from the insulating substrate 2 from the winding start end 7b to the winding end 7c. ing. Therefore, the spiral contacts 7, 7 are elastically deformable in the vertical direction (Z direction).
[0026]
On the other hand, a ground terminal 8 is provided on the outer periphery of the spiral contact 7. As shown in FIG. 3, the ground terminal 8 has a substantially horseshoe shape, and a base end 8a is integrally provided on the Y2 side in the drawing. The ground terminal 8 has its base end 8a fixed to the connection connection portion 6b provided on the insulating substrate 2 by means of a conductive adhesive or soldering. Contact portions 8b, 8b extend from the base end 8a of the ground terminal 8 symmetrically to the left and right corresponding to the through holes 4, 4. As shown in FIGS. 4 to 7, the base end 8a of the ground terminal 8 is a fixed end, and the contact portions 8b and 8b are free ends. The ground terminal 8 is deformed in a direction away from the insulating substrate 2 from the base end 8a on the fixed end to the contact portions 8b, 8b on the free end. However, the tip portions of the contact portions 8b, 8b are bent and deformed in the direction toward the insulating substrate 2. That is, the ground terminal 8 has a shape like a stag (insect) horn, and the base 8a is a fixed part, and the contact parts 8b, 8b are elastic in the vertical direction (Z direction) in the figure. Deformable.
[0027]
5 and 6, the lower side of the insulating substrate 2 shows the first embodiment, and the upper side shows the second embodiment. As shown in FIGS. 5 and 6, in the lower first embodiment, the height dimension H1 of the winding end 7c, which is the vertex in the height direction of the spiral contact 7, and the contact portion 8b of the ground terminal 8 , 8b with the height H2 of the apex is H1 ≒ H2. On the other hand, in the second embodiment on the upper side, the relationship between the heights H1 and H2 is set so that H1 <H2.
[0028]
Hereinafter, an operation when the electronic connector 1 is connected to the substrates 10 and 11 will be described.
[0029]
As shown in FIG. 7A, in each connection region 13 of the substrates 10 and 11 corresponding to the first and second embodiments, a signal line is provided at a position on the center side corresponding to the spiral contact 7 which is a signal terminal. A connection portion 13a1 of the ground line 13b is provided at a position corresponding to the ground terminal 8 around the connection portion 13a1 of the ground line 13b. In the lower substrate 10, the thickness h2 of the connection portion 13b1 of the ground line 13b is formed so as to protrude in the direction away from the insulating substrate 2 more than the thickness h1 of the connection portion 13a1 of the signal line 13a ( h1 <h2). On the other hand, in the upper substrate 11, the thickness of the connection portion 13a1 of the signal line 13a in the connection region 13 and the thickness of the connection portion 13b1 of the ground line 13b are substantially the same.
[0030]
Therefore, at the moment when the board 10 and the board 11 are mounted on both the upper and lower surfaces of the electronic connector 1, the connecting portion 13 b 1 of the ground line 13 b on the board 10 and the ground-type terminal on the electronic connector 1 are first provided on the lower board 10. 8 are connected to the contact portions 8b, 8b, and then the connection portion 13a1 of the signal line 13a on the substrate 10 is connected to the winding end 7c of the spiral contact 7 on the electronic connector 1 side.
[0031]
On the other hand, also on the upper substrate 11, first, the connection portion 13b1 of the ground line 13b on the substrate 11 side and the contact portions 8b, 8b of the ground terminal 8 on the electronic connector 1 side are connected. The connection portion 13a1 of the signal line 13a is connected to the winding end 7c of the spiral contact 7 on the electronic connector 1 side.
[0032]
That is, in the first and second embodiments, the ground system is connected first, and then the signal system is connected. Therefore, it is possible to suppress generation of noise when the terminals come into contact with each other, and it is possible to improve the S / N ratio.
[0033]
When the substrates 10 and 11 are mounted on both sides of the electronic connector 1 as shown in FIG. 2, each spiral contact 7 is elastically deformed into a substantially planar shape on both sides of the electronic connector 1 as shown in FIG. 7B. The contact portions 8b, 8b of the ground terminals 8 are also elastically deformed and accommodated in the through holes 4, 4. In this state, the spiral contact 7 presses the connection portion 13a1 of the signal line 13a and the contact portion 8b of the ground terminal 8 by the elastic force of each spiral contact 7 itself and each of the contact portions 8b, 8b itself. , 8b press the connecting portion 13b1 of the ground line 13b. Therefore, the connection between each spiral contact 7 and the connection portion 13a1 of each signal line 13a and the connection between the contact portions 8b and 8b of each ground-type terminal 8 and the connection portion 13b1 of each ground line 13b are securely connected. And problems such as poor contact hardly occur.
[0034]
Moreover, in the electronic connector 1, a signal terminal provided on the center side can be surrounded by a ground terminal provided on the outer periphery thereof. Therefore, since the ground terminal can electromagnetically shield the signal terminal, noise that easily overlaps with the signal terminal can be cut off. Therefore, also in this respect, it is possible to improve the S / N ratio. Since a sufficient magnetic shielding effect can be exhibited similarly to the case where the ground terminal is a coaxial cable, crosstalk does not occur even in a high frequency band of 1 GHz or more, and excellent transmission characteristics can be obtained. It becomes.
[0035]
The connection portion 13a1 of the signal line 13a of the lower board 10 and the connection portion 13a1 of the signal line 13a of the upper board 11 are connected to the spiral contacts 7, 7 provided above and below the electronic connector 1, respectively. The through holes 3 are connected to each other via the conductive portions 5 formed on the inner peripheral surface. Similarly, the connection portion 13b1 of the ground line 13b of the lower substrate 10 and the connection portion 13b1 of the ground line 13b of the upper substrate 11 are contact portions of the ground terminals 8, 8 provided above and below the electronic connector 1. 8b, 8b and conductive portions 6, 6 provided in through holes 4, 4 therebetween. That is, the electronic connector 1 functions as a relay connector for connecting two substrates.
[0036]
FIG. 8 is a cross-sectional view showing an electronic connector and a substrate as a third embodiment, wherein A shows a state before connection, and B shows a state after connection.
[0037]
In FIG. 8, a third embodiment is shown between the upper substrate 11 and the spiral contact 7 on the upper surface side of the electronic connector 1. The space between the lower substrate 10 and the spiral contact 7 on the lower surface of the electronic connector 1 is the same as in the first embodiment.
[0038]
As shown in FIG. 8A, the spiral contact 17 provided at the opening end above the through hole 3 of the electronic connector 1 has a planar shape, and the spiral contact 7 in the first and second embodiments. Are different from each other in that they are not convex. However, the configuration of the ground terminal 8 provided therearound is the same.
[0039]
On the other hand, the connection portion 13a1 of the signal line 13a in the connection region 13 of the upper substrate 11 is provided with a spherical contact 13c that protrudes downward from the connection surface 11B of the substrate in the figure and that has a rounded tip. ing. The spherical contact 13c is a BGA (Ball Grid Array) or a CGA (Cone Grid Array), and FIG. 8A shows a case of the CGA. The height h3 of the spherical contact 13c protrudes greatly below the thickness h4 of the ground line 13b (h3> h4). However, the height H2 of the apexes of the contact portions 8b of the ground terminal 8 is larger than the height h3 of the spherical contact 13c (H2> h3).
[0040]
Therefore, when the electronic connector 1 is to be mounted on the board 11, first, the contact portions 8 b and 8 b of the ground terminal 8 on the side of the electronic connector 1 come into contact with the connection portion 13 b 1 of the ground line 13 b on the board 11, and then The spherical contact 13c on the board 11 contacts the planar spiral contact 17 on the electronic connector 1 side. Therefore, also in this embodiment, since the ground system is connected first, and then the signal system is connected, it is possible to prevent the generation of noise as in the first and second embodiments, and to achieve excellent transmission efficiency. It is possible to obtain.
[0041]
Then, as shown in FIG. 8B, when the electronic connector 1 is completely loaded on the substrate 11, the spiral contact 17 is deformed so as to embrace the spherical contact 13c. The spherical contact 13c is connected.
[0042]
In the electronic connector 1, since the boards can be connected to each other in a plane, the total thickness of the board after the connection can be reduced.
[0043]
Also, it is only necessary to provide a one-to-one ground system terminal with respect to a signal system terminal, and it is not necessary to surround the signal system terminal with a plurality of ground system terminals as in the related art. Therefore, the number of terminals can be significantly reduced, and the connector can be downsized.
[0044]
5 to 7 of the above embodiment, the lower surface side of the electronic connector is the first embodiment, the upper surface side is the second embodiment, and in FIG. 8, the lower surface side is the first embodiment. Although the third embodiment is shown on the upper surface side, the present invention is not limited to this. Both surfaces of the electronic connector are only the first embodiment, only the second embodiment, or the third embodiment. The second embodiment may be configured by only the second embodiment, or may be a combination of the second embodiment and the third embodiment.
[0045]
In the above embodiment, the case where the electronic connector is a relay connector for connecting two substrates has been described. However, for example, an electronic connector may be used for a card for electronic money and a motherboard provided in an apparatus such as an ATM machine. It may be connected. In this case, when the card is inserted into the ATM machine, it functions as a relay connector for connecting a connection terminal provided in the plane of the card to the motherboard.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an electronic connector that can be reduced in size by reducing the number of terminals of the ground system.
[0047]
Further, since the magnetic shield effect is enhanced, good transmission characteristics can be obtained even in a high frequency band.
[0048]
Further, the size in the thickness direction between the substrates after connection can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an electronic connector of the present invention;
FIG. 2 is a sectional view taken along line AA of FIG. 1;
FIG. 3 is an enlarged plan view showing terminals in the electronic connector;
FIG. 4 is an enlarged perspective view of a terminal;
FIG. 5 is a sectional view of the terminal taken along line BB in FIG. 3;
FIG. 6 is a sectional view of the terminal taken along line CC of FIG. 3;
FIGS. 7A and 7B are partial cross-sectional views showing a relationship between an electronic connector and a board as a first embodiment and a second embodiment, where A is a state before connection, B is a state after connection,
FIG. 8 is a cross-sectional view showing an electronic connector and a board as a third embodiment, where A is a state before connection, and B is a state after connection.
1 electronic connector 2 insulating board (board)
2a, 2b Hanging projection 3 Through hole 4 Through hole 5, 6 Conductive part 7 Spiral contact (terminal of signal system)
7a Base 7b Winding start end 7c Winding end 8 Ground terminal 8b Contact portion 10, 11 Substrate 10A, 11A Mounting surface 10B, 11B Connection surface 13 Connection region 13a Signal line 13a1 Signal line connection portion 13b Ground line 13b1 Connection of ground line Part 13c Spherical contact 17 Spiral contact (terminal for signal system)

Claims (5)

An electronic connector having a signal terminal and a ground terminal provided on a substrate,
The terminal of the signal system is formed of a spiral contact extending spirally from the winding end on the outer peripheral side toward the winding start end on the center side. An electronic connector, wherein one ground-type terminal is provided so as to surround it. 2. The electronic connector according to claim 1, wherein a plurality of contact portions are provided, each of which includes the signal system terminal and the ground system terminal. The contact portion is disposed on both surfaces of the substrate, and the contact portion on one surface and the contact portion on the other surface are connected via a conductive portion provided in the substrate. Electronic connectors. 4. The electronic connector according to claim 1, wherein at least the ground-based terminals protrude further away from the substrate than the signal-based terminals. The electronic connector according to any one of claims 1 to 4, wherein a winding end portion of the spiral contact protrudes above a winding start end.

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