JP2004207423A - Mounting structure and method of frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide constitution preventing a side plate from opening in a substrate in the state that the frame is fixed to the substrate. <P>SOLUTION: The frame 1 is provided integrally with a top plate 12 and a side plate 10 which are constituted by bending a metal plate. For attaching the frame 1 to the substrate 2, the frame 1 is put on the substrate 2, and the side plate 10 is arranged outside peripheral edge of the substrate 2. Against bending angle aperture capacity of the top plate 12 and the side plate 10, the frame 1 is attached to the substrate 2 in which an insertion hole 20 is formed. A connection strip 3 which fits into the insertion hole 20 is formed in the side plate 10, and comes into contact with an edge 21 positioned at the side plate 10 side of the insertion hole 20, thereby preventing the side plate 10 from opening. In a lower end of the side plate 10, a hook 4 is installed which is capable of outward elastic deformation and in contact with the lower surface of the substrate 2 in the state that the frame 1 is attached to the substrate 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure and a method for mounting a frame formed by bending a metal plate on a substrate.
[0002]
[Prior art]
In the following description, a shield plate formed by bending a tin plate as a frame body will be exemplified. The shield plate is a well-known shield plate that protects electronic components provided inside from external noise (for example, see Patent Document 1).
FIG. 5 is a perspective view showing a state where a general shield plate is attached to the substrate (2). The frame (1) is formed by projecting a pair of side plates (10) and (10) downward from the top plate (12). The side plates (10) are located outside the substrate (2), and the lower end of each side plate (10) is bent inward and soldered to the lower surface of the substrate (2).
Since the top plate (12) and the side plate (10) are formed by bending a metal plate, as shown in FIG. 6, the bent portion that is the boundary between the top plate (12) and the side plate (10) is inward. Is a compressive stress, and a tensile stress acts on the outside. For this reason, springback occurs in which the bending angle increases due to the rebound of compression and tensile stress after bending. Therefore, it is necessary to solder the lower end of the side plate (10) to the substrate (2) while pressing the both side plates (10) and (10) inward from the outside against the springback. It was bad. Further, since the side plate (10) is opened, there is a possibility that a tensile force is applied to a soldered portion between the substrate (2) and the side plate (10).
[0003]
In view of this point, the applicant has manufactured a frame (1) shown in FIG. This means that an intermediate plate (14) substantially perpendicular to both side plates (10) and (10) projects downward from the top plate (12), and the side plates (10) and (10) are inserted from both ends of the intermediate plate (14). The arm pieces (16) (16) for pressing in the direction protrude.
FIG. 8 is a plan view of the frame (1) of FIG. The arm pieces (16) and (16) are provided with a bending angle θ of less than 90 degrees with respect to the intermediate plate (14), and sandwich the side plates (10) and (10) by elastic force. This prevents springback of the side plates (10) (10). In order to form the frame body (1), the arm pieces (16) and (16) are bent with respect to the intermediate plate (14), and then the top plate (12) and the intermediate plate (14) are bent. ) (16) sandwiches the side plates (10) (10).
[0004]
[Patent Document 1]
JP-A-2002-94279 (FIG. 1)
[0005]
[Problems to be solved by the invention]
FIG. 9 is a front view of a mold for bending the arm pieces (16) (16). In order to form the arm pieces (16) and (16), the intermediate plate (14) is placed on the receiving table (5), and the intermediate plate (14) is pressed from above by the punch (50), and the bending die ( 51) Lift (51) and bend both ends of the intermediate plate (14) upward. Thus, the arm pieces (16) and (16) are formed, and thereafter, the punch (50) is raised and the intermediate plate (14) is removed from the punch (50).
However, when the bending angle θ of the arm pieces (16) and (16) with respect to the intermediate plate (14) is less than 90 degrees, the arm pieces (16) and (16) sandwich the punch (50) and separate from the punch (50). Absent. That is, as shown in FIG. 7, in a shape in which the frame body (1) is provided with a member for preventing the side plates (10) and (10) from springback, it is difficult to form the mold using a mold.
In view of this point, the applicant does not devise the shape of the frame body (1) to prevent the side plate (10) from opening, but rather uses the state in which the frame body (1) is attached to the substrate (2). The idea was to prevent the side plate (10) from opening on the substrate (2). That is, if the side plate (10) can be prevented from being opened while the frame (1) is attached to the substrate (2), the work of soldering the substrate (2) and the side plate (10) becomes easy, and No tensile force is applied to the attachment part due to the spring back of the side plate (10). If the arm pieces (16) and (16) are not provided, it is not difficult to form the frame (1).
An object of the present invention is to provide a configuration that prevents the side plate (10) from opening on the substrate (2) in a state where the frame (1) is attached to the substrate (2).
[0006]
[Means for solving the problem]
A frame (1) integrally formed with a top plate (12) and a side plate (10), which is formed by bending a metal plate, is placed on the substrate (2), and the side plate (10) of the frame (1) is mounted on the substrate. (2) The frame (1) is mounted outside the outer peripheral edge of the frame (1) on the substrate (2) in order to resist the bending angle opening force of the top plate (12) and the side plate (10).
The base plate (2) is provided with an insertion hole (20), the side plate (10) is provided with a contact piece (3) that fits into the insertion hole (20), and the contact piece (3) is provided with the insertion hole (20). ) Contacts the edge (21) to prevent the side plate (10) from opening.
The lower end of the side plate (10) is elastically deformable outward, and the hook (4) that contacts the lower surface of the substrate (2) when the frame (1) is attached to the substrate (2). Is provided.
[0007]
[Action and effect]
The contact piece (3) is in contact with the edge (21) of the insertion hole (20) to prevent the side plate (10) from opening when the frame (1) is attached to the substrate (2). . Thereby, the workability of soldering the substrate (2) and the side plate (10) is improved, and no tensile force due to the spring back of the side plate (10) is applied to the soldered portion.
Further, when the frame (1) is attached to the substrate (2), the hook (4) comes into contact with the lower surface of the substrate (2), so that the frame (1) is temporarily fixed to the substrate (2). There is no danger that it will come off the substrate (2) easily. This also improves the workability of soldering the substrate (2) and the frame (1). Since the frame (1) does not have the arm pieces (16) and (16) as compared with the conventional frame (1) shown in FIG. 7, molding with a mold does not become difficult.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a state in which the frame (1) is attached to the substrate (2). The applicant intends to form the frame (1) from a tin plate, but it may be formed from another metal plate. Various circuit components (not shown) are provided on the substrate (2), and are soldered on the lower surface of the substrate (2).
The frame body (1) includes a first top plate (12) and a second top plate (13) lower than the first top plate (12), and is formed in two steps. This is due to the height of the components provided inside the frame (1), and is not limited to the frame (1) formed in two steps.
The inner surface of the first side plate (10) extending downward from the first top plate (12) is in contact with the outer peripheral edge of the substrate (2). The second side plate (11) extending downward from the second top plate (13) also has an inner surface in contact with the outer peripheral edge of the substrate (2). From the top plates (12) and (13), the intermediate plates (14) and (14) extend downward perpendicular to the side plates (10) and (11) to prevent external noise from entering the frame (1). I'm preventing. The frame (1) is attached to the substrate (2) from above the substrate (2).
[0009]
Substantially rectangular insertion holes (20) (20) are formed on the side of the substrate (2). The end of the first side plate (10) is bent in two steps, and the contact piece (3) fitted in the insertion hole (20) protrudes downward. An opening (15) is formed at the lower end of the first side plate (10), and a hook (4) that is elastically deformable outward is provided in the opening (15). The hook (4) is formed such that its central portion in the height direction is bent inward, and two inclined surfaces (41) (41) are arranged vertically.
A guide piece (40) extends downward from the lower end of the hook (4). The guide piece (40) is located substantially in the same plane as the first side plate (10), and the distance L from the guide piece (40) to the contact piece (3) is equal to the distance from the outer peripheral edge of the substrate (2). It is equal to the distance L1 between the insertion hole (20) and the edge (21) on the side plate (10) side (see FIG. 2A). The contact piece (3) and the hook (4) are similarly provided on the second side plate (11). However, for convenience of explanation, the contact piece (3) of the first side plate (10) and the hook (3) are provided. (4) will be described.
[0010]
(Attaching the frame to the board)
2A and 2B are cross-sectional views showing a procedure for attaching the frame body (1) to the substrate (2), and FIG. 1 is viewed from the direction B. A chamfer C is formed on the lower surface side of the substrate (2).
First, the frame (1) is arranged above the substrate (2). The frame (1) is lowered while pushing the first side plate (10) slightly inward by hand against the springback, and the guide piece (40) is brought into contact with the outer peripheral edge of the substrate (2). The frame (1) is lowered, and the lower end of the hook (4) is brought into contact with the upper surface of the substrate (2) as shown in FIG. In this state, the lower end of the contact piece (3) fits into the insertion hole (20) and comes into contact with the edge (21) of the insertion hole (20) on the side plate (10) side.
[0011]
When the frame (1) is further lowered, the lower inclined surface (41) comes into contact with the upper surface of the substrate (2), and the hook (4) is once elastically deformed outward. When the hook (4) passes through the board (2), the hook (4) is elastically restored and hooks on the chamfer C of the board (2) as shown in FIG. 2 (b). The frame (1) is temporarily fixed to the substrate (2) to prevent the frame (1) from slipping upward.
The contact piece (3) is kept in contact with the edge (21) of the insertion hole (20). As described above, the distance L from the guide piece (40) to the contact piece (3) is equal to the distance L1 from the outer peripheral edge of the substrate (2) to the edge (21) of the insertion hole (20). Since (40) and the first side plate (10) are located in the same plane, the first side plate (10) is in contact with the outer peripheral edge of the substrate (2).
Even if the hand is released from the frame body (1), the first side plate (10) is prevented from being opened because the contact piece (3) is in contact with the edge (21). In this state, the outer peripheral edge of the lower surface of the substrate (2) and the lower end of the first side plate (10) are soldered.
[0012]
The frame (1) is temporarily fixed to the substrate (2) by the hook (4), and there is no possibility that the frame (1) is accidentally detached from the substrate (2). This improves the workability of soldering the substrate (2) and the frame (1).
When the frame body (1) is attached to the substrate (2), the first side plate (10) is prevented from opening due to the contact piece (3) contacting the edge (21). Thereby, the work of soldering the substrate (2) and the first side plate (10) becomes easy, and no tensile force due to the spring back of the first side plate (10) is applied to the soldered portion.
Further, since the first side plate (10) is in contact with the outer peripheral edge of the substrate (2), even when an impact load is applied to the frame (1) from the outside after soldering, a part of the impact load is It can be received at the outer periphery of (2). That is, the load applied to the soldered portion between the first side plate (10) and the substrate (2) is reduced. Thereby, the soldering portion between the first side plate (10) and the board (2) can be made hard to come off, and the reliability of the soldering portion can be improved.
Since the frame (1) does not have the arm pieces (16) and (16) as compared with the conventional frame (1) shown in FIG. 7, molding with a mold does not become difficult.
[0013]
Since the first side plate (10) is opened by springback, even if the guide piece (40) is applied to the outer peripheral edge of the substrate (2) and the frame (1) is lowered, the contact piece (3) is The lower end may not fit in the insertion hole (20). As a countermeasure, a guide piece (30) inclined downward from the lower end of the contact piece (3) toward the inside may be provided as shown by a dashed line in FIG. 2 (b).
Further, as shown in FIG. 3, the shape of the hook (4) may be an arc with the bulge directed inward. In this case, the chamfer C of the substrate (2) is unnecessary. Further, the hook (4) is hooked on the outer peripheral edge of the substrate (2). However, as shown in FIG. 4, a through hole (22) is opened in the substrate (2), and the through hole (22) is formed. A hook (4) may be hooked around the periphery.
[0014]
The description of the above embodiments is intended to explain the present invention, and should not be construed as limiting the invention described in the claims or reducing the scope thereof. Further, the configuration of each part of the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made within the technical scope described in the claims.
In this example, the shield plate is illustrated as the frame (1), but the side plate (10) may be any frame that is opened by springback, and may be, for example, the frame (1) that supports a power transformer. Further, although the frame (1) is soldered to the substrate (2), it may be screwed instead.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a state in which a frame is attached to a substrate.
FIGS. 2A and 2B are cross-sectional views illustrating a procedure for attaching a frame to a substrate.
FIG. 3 is a sectional view showing another embodiment.
FIG. 4 is a sectional view showing another embodiment.
FIG. 5 is a perspective view showing a state in which a conventional frame is attached to a substrate.
FIG. 6 is a diagram showing a stress state at a bent portion of the frame.
FIG. 7 is a perspective view showing a state in which another conventional frame is attached to a substrate.
FIG. 8 is a plan view of the frame of FIG. 7;
FIG. 9 is a front view of a mold for bending an arm piece of the frame body of FIG. 7;
[Explanation of symbols]
(1) Frame
(2) Substrate
(3) Contact piece
(4) Hook
(10) First side plate
(12) First top plate
(20) Insertion hole
(21) Edge
(22) Through-hole

Claims (5)

A frame (1) integrally formed with a top plate (12) and a side plate (10), which is formed by bending a metal plate, is placed on the substrate (2), and the side plate (10) of the frame (1) is mounted on the substrate. (2) The frame (1) is mounted outside the outer peripheral edge of the frame (1) on the substrate (2) in order to resist the bending angle opening force of the top plate (12) and the side plate (10).
The base plate (2) has an insertion hole (20), and the side plate (10) is provided with a contact piece (3) that fits into the insertion hole (20).
A frame mounting structure wherein the contact piece (3) is in contact with the edge (21) of the insertion hole (20) to prevent the side plate (10) from opening. With the contact piece (3) in contact with the edge (21) of the insertion hole (20), the side plate (10) is provided with a through hole (22) formed in the outer peripheral edge of the substrate (2) or the substrate (2). The frame mounting structure according to claim 1, wherein the frame is attached to an inner peripheral edge of the frame. The frame (1) is attached to the substrate (2) from above the substrate (2), and is elastically deformable outward at the lower end of the side plate (10). 3. The frame mounting structure according to claim 1, wherein a hook (4) is provided in contact with a lower surface of the substrate (2) in a state where the frame is mounted on the frame. The frame mounting structure according to claim 3, wherein the lower end of the contact piece (3) fits into the insertion hole (20) when the lower end of the hook (4) is in contact with the upper surface of the substrate (2). . A frame (1) integrally formed with a top plate (12) and a side plate (10), which is formed by bending a metal plate, is placed on the substrate (2), and the side plate (10) of the frame (1) is mounted on the substrate. (2) a method of mounting the frame (1) to the substrate (2) by disposing the frame (1) against the bending angle opening force of the top plate (12) and the side plate (10);
The base plate (2) has an insertion hole (20), the side plate (10) is provided with a contact piece (3) that fits into the insertion hole (20), and the lower end of the side plate (10) has an outer portion. A hook (4) that is elastically deformable in the direction, is provided with a hook (4) that is in contact with the lower surface of the substrate (2), and arranges the frame (1) above the substrate (2);
The frame (1) is lowered, and the contact piece (3) is brought into contact with the edge (21) of the insertion hole (20) to prevent the side plate (10) from opening and to attach the hook (4) to the substrate. Contacting the upper surface of (2);
A method of mounting a frame, further comprising lowering the frame (1) to elastically deform the hook (4), and then hooking the hook on the lower surface of the substrate (2).

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