JP2004207334A - Evaluating method for price of photomask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To evaluate low the ordering price of a photomask succeeding in response to a photomask delivered in preceding. <P>SOLUTION: The evaluating method for the price of a photomask comprises a step (S210) of recording the badness of a chip on the photomask when bad chip data of a chip pattern on the photomask is inputted (YES in S200); a step (S150) of evaluating the yield taking the bad chip into consideration when there is a photomask not yet manufactured (YES in S140) in a succeeding process, and of judging whether or not the evaluated yield satisfies the scheduled yield of a wafer; a step (S170) of evaluating a discount rate on the basis of unit price discount data, and whether or not the quality for every chip is required when the evaluated yield satisfies the scheduled yield of the wafer (YES in S150); and a step (S180) of evaluating an ordered unit price on the basis of a basic unit price data and the discount rate. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a system for calculating the price of a photomask ordered by a wafer maker that manufactures semiconductor devices from a wafer maker that manufactures a photomask, and more particularly to a system that calculates a low order price of a photomask.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, IC (Integrated Circuit) chips provided with circuits whose wiring patterns are changed according to specifications requested by customers have been produced by IC chip manufacturers (wafer manufacturers). Such an IC chip is manufactured using a photomask in which a light-shielding pattern is formed of a metal thin film on a synthetic quartz substrate in a photolithography process, which is one of the IC chip manufacturing processes. This photomask is manufactured by a mask maker. The information on the specifications is stored on a magnetic tape or the like and sent from a wafer maker as an orderer to a mask maker as an order receiver, or transmitted online. The mask maker generates manufacturing data for manufacturing a photomask based on the transmitted information on the specifications. On the other hand, order information such as the quantity and delivery date of photomasks is transmitted from a wafer maker as an orderer to a mask maker as an orderer by telephone or online. The mask maker generates management data including information such as a priority order required for production management, a product number, a quantity, a shipping destination, a delivery date, and the like, and information necessary for quality control, based on the order information. The created management data is sent to a photomask manufacturing line. The photomask manufacturing line manufactures a photomask based on manufacturing data generated based on specifications and management data created based on order information. The photomask is created by, for example, an electron beam exposure apparatus controlled by manufacturing data.
[0003]
Such a semiconductor circuit such as an IC chip has a three-dimensional three-dimensional structure. In manufacturing such a circuit, a three-dimensional circuit pattern is divided into several layers, and a photomask is provided for each layer. Created. It is not uncommon for the number of layers to range from 20 to 30. A mask maker orders a photomask for each layer from a wafer maker, but in that case, the circuit pattern data for all the layers is not always provided at once, but the circuit pattern is provided for each layer. In some cases, or in several layers. When the circuit pattern data is provided, the mask maker draws the circuit pattern on a glass substrate coated with a resist using an electron beam drawing apparatus or the like, and manufactures a photomask having a predetermined circuit pattern by a photolithography technique. To the wafer maker. For this reason, the wafer maker may divide the order into a plurality of times and order a photomask from the mask maker, or the delivery of the photomask may be divided into a plurality of times.
[0004]
As a system for manufacturing such an IC chip, there is a system disclosed in JP-A-2002-150049. The system disclosed in this publication is a joint development / manufacturing system for an integrated circuit for manufacturing a multi-faced mask based on mask data of a plurality of ICs provided by a customer and manufacturing an IC using the multi-faced mask. It is. The system includes a management server, and a customer terminal device managed by a customer connected to the management server via a communication line. The customer terminal device includes a mask production request circuit for requesting production of a multi-face mask through a communication line. The management server includes an order receiving circuit for receiving an order when a mask production request circuit requests the production of a multi-surface mask, and a series of management for producing the multi-surface mask based on the order received by the order circuit. And an order management circuit for executing the order.
[0005]
According to this system, when a customer develops an IC chip such as a prototype, a multi-faced mask for manufacturing a plurality of types of IC chips from one wafer is manufactured, and a plurality of types of ICs are manufactured using the mask. It is possible to do. As a result, when a multi-faced mask is jointly manufactured by a plurality of customers, the cost of manufacturing the developed IC chip mask and the cost of manufacturing the IC chip can be shared. It is possible to reduce the manufacturing cost of the IC chip.
[0006]
[Patent Document 1]
JP-A-2002-150049
[0007]
[Problems to be solved by the invention]
However, in the system disclosed in Patent Literature 1, even if the self-payment at the time of manufacturing a multi-faced mask by a plurality of customers can be calculated, the price reduction effect other than the multi-faced photomask is not exhibited. For example, if a wafer maker divides a circuit pattern and orders a photomask from a mask maker, even if it finds a defect in some chip patterns of the photomask that was ordered and delivered earlier, the subsequent photomask remains unchanged. When an order is placed, the portion corresponding to the defective chip pattern is also a normal chip pattern, and a subsequent photomask is ordered. Therefore, the order specification is over-spec, and the order price of the photomask is higher than the required specification.
[0008]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a photomask that can calculate the order price of a subsequent photomask low according to the photomask delivered in advance. The purpose is to provide a calculation method.
[0009]
[Means for Solving the Problems]
A method for calculating a price of a photomask according to the present invention includes: an inspection step of inspecting a defective chip in a wafer to which a chip pattern formed on a photomask has been transferred; and a production method of the wafer in consideration of the defective chip detected in the inspection step. A determination step of determining whether or not the plan is satisfied; and, if it is determined in the determination step that the production plan is satisfied, a chip corresponding to the defective chip so as to be lower in price than a photomask in which the defective chip is not detected. Calculating the price of the ordered photomask including the pattern.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals. Their names and functions are the same. Therefore, detailed description thereof will not be repeated. In the following, a photomask order price calculation system that calculates the price of a photomask to be ordered from a mask maker that manufactures a photomask using a server of the wafer maker will be described.
[0011]
<First embodiment>
Referring to FIG. 1, a photomask order price calculation system according to the present embodiment creates computer 200 of a plurality of mask manufacturers that manufacture photomasks, and photomask order data, and calculates the photomask order data by server 100. The computer includes an ordering computer 300 for transmitting to the computer 200 of the mask manufacturer of the ordering party based on the ordering price, and a server 100 connected to these computers via the network 500. Note that the ordering computer 300 may be realized by the server 100.
[0012]
The server 100 stores various data that are factors that determine the price of a photomask. Data about a defective chip on a wafer to which a chip pattern has been transferred using a photomask is input to the server 100. The server 100 stores a defective portion on the photomask based on the data of the defective chip. In ordering the subsequent photomask, the server 100 determines whether the planned yield of the wafer and the manufacturing period can be satisfied even if the defective chip is not manufactured as a product. When it is determined that the planned yield and the manufacturing period can be satisfied, the server 100 performs processing without determining the quality of the chip at the defective portion. The server 100 realizes the photomask order price calculation function of making the quality determination of the defective portion unnecessary and calculating the order price of the subsequent photomask by lowering it.
[0013]
The photomask order price calculation function in server 100 of the photomask order price calculation system according to the present embodiment is realized by executing a predetermined program by a CPU (Central Processing Unit) in a computer.
[0014]
FIG. 2 shows an external view of a computer system which is an example of the server 100 that realizes a photomask order price calculation function. Referring to FIG. 2, this computer system includes a computer 102 having an FD (Flexible Disk) drive 106 and a CD-ROM (Compact Disc-Read Only Memory) drive 108, a monitor 104, a keyboard 110, and a mouse. 112.
[0015]
FIG. 3 is a block diagram showing the configuration of the computer system. As shown in FIG. 3, the computer 102 includes a CPU (Central Processing Unit) 120, a memory 122, and a fixed disk connected to each other by a bus, in addition to the FD driving device 106 and the CD-ROM driving device 108 described above. 124 and a communication interface 128 for communicating with other computers. The FD 116 is mounted on the FD driving device 106. A CD-ROM 118 is mounted on the CD-ROM drive 108. A predetermined program corresponding to software is stored in the FD 116 and the CD-ROM 118.
[0016]
As described above, the server 100 having the photomask order price calculation function is realized by computer hardware and software executed by the CPU 120. Generally, such software is stored and distributed as a program on a recording medium such as an FD 116 or a CD-ROM 118, and is read from the recording medium by the FD driving device 106 or the CD-ROM driving device 108 and temporarily stored on a fixed disk 124. Is done. Further, the data is read from the fixed disk 124 to the memory 122 and executed by the CPU 120.
[0017]
The hardware itself of these computers is common. The computer includes a control circuit including a CPU, a storage circuit, an input circuit, an output circuit, and an OS (Operating System), and has an environment for executing a program. When the present invention is considered as a program, the essence of the present invention is a program that causes such a computer to function as a photomask order price calculation device. Therefore, the most essential part of the present invention is a program stored in a recording medium such as an FD, a CD-ROM, a memory card, and a fixed disk.
[0018]
Since the operation of the computer itself shown in FIGS. 2 and 3 is well known, detailed description thereof will not be repeated here.
[0019]
With reference to FIG. 4, the chip pass / fail data in wafer manufacturing stored in the fixed disk 124 of the server 100 will be described. As shown in FIG. 4, data indicating the quality of chip (1), the quality of chip (2),... On the wafer is stored for each process as chip quality data in wafer manufacturing.
[0020]
With reference to FIG. 5, a description will be given of chip quality determination necessity data in photomask manufacturing stored in fixed disk 124 of server 100. As shown in FIG. 5, as the chip quality determination necessity data, data representing the necessity of quality determination of chip (1), the necessity of quality determination of chip (2),... Is done. For example, when there is a defective chip (2) as in the process B shown in FIG. 4, the chip quality judgment of the chip (2) in the subsequent process C is stored as "unnecessary" as shown in FIG.
[0021]
With reference to FIG. 6, basic unit price data stored in fixed disk 124 of server 100 will be described. As shown in FIG. 6, data representing the basic unit price, element dimensional accuracy, defect standard,... Is stored for each process as the basic unit price data.
[0022]
With reference to FIG. 7, unit price discount data stored in fixed disk 124 of server 100 will be described. As shown in FIG. 7, as the unit price discount data, data representing the degree of discount, the element dimensional accuracy corresponding to the degree of discount, the defect standard, and the chip to which the standard is not applied are stored for each process. For example, a photomask including a defective chip (2) for which the chip quality determination necessity data is unnecessary in the process C is discounted by 5% as shown in FIG.
[0023]
With reference to FIG. 8, a control structure of a program executed by CPU 120 of server 100 will be described.
[0024]
In step (hereinafter, step is abbreviated as S) 100, CPU 120 determines whether or not defective chip data of the wafer on which the chip pattern has been transferred has been input. This judgment may be input by the operator from the keyboard 110 or the mouse 112, or may be input by receiving from the inspection apparatus via the communication interface 120. This inspection device is a wafer defect inspection device, a scanning electron microscope (SEM), or the like. When the defective chip data of the wafer is input (YES in S100), the process proceeds to S110. If not (NO in S100), the process returns to S100 and waits until defective chip data of the wafer is input.
[0025]
In S110, CPU 120 calculates the position of the defective chip on the photomask. In S120, CPU 120 determines whether or not the same chip on the photomask has a defect. If the same chip on the photomask has a defect (YES in S120), the process proceeds to S130. If not (NO in S120), this process ends.
[0026]
In S130, CPU 120 stores the same chip on the fixed mask 124 as a defect of the same chip on the photomask. At this time, data indicating a defective product is written in the chip pass / fail data in the wafer manufacturing shown in FIG.
[0027]
In S140, CPU 120 determines whether or not there is an unmanufactured photomask in a subsequent step. If there is an unmanufactured photomask in a subsequent step (YES in S140), the process proceeds to S150. Otherwise (NO at S140), this process ends.
[0028]
In S150, CPU 120 determines whether or not the planned yield of the wafer is satisfied. In this determination, it is determined whether or not the yield when a wafer is manufactured using the photomask stored as including a defective chip in S130 satisfies the planned yield of the wafer. If the planned yield of the wafer is satisfied (YES in S150), the process proceeds to S160. Otherwise (NO at S150), the process proceeds to S190.
[0029]
In S160, CPU 120 determines that quality determination for each chip in the photomask manufacturing process is unnecessary, and data indicating that quality determination is unnecessary is included in the chip quality determination necessity data in photomask manufacturing shown in FIG. Write. In S170, CPU 120 calculates a discount rate based on unit price discount data (FIG. 7) and quality determination necessity data for each chip (FIG. 5).
[0030]
At S180, CPU 120 calculates an order unit price based on the basic unit price data (FIG. 6) and the discount rate calculated at S170. At S190, CPU 120 executes an order process with the photomask manufacturer based on the order unit price calculated at S180. At this time, the server 100 performs an order process to the mask maker computer 200. The order processing may be executed by the order computer 300.
[0031]
The operation of the photomask order price calculation processing according to the present embodiment based on the above structure and flowchart will be described.
[0032]
As shown in FIG. 9, a wafer on which a chip pattern developed on a mask is transferred is manufactured, and when a defective chip is found on the wafer, defective chip data is input (YES in S100). The position of the defective chip on the photomask is calculated (S110). If the same chip on the photomask has a defect (YES in S120), it is stored as a defect of the same chip on the photomask (S130). . At this time, as shown in FIG. 4, chip pass / fail data in wafer manufacturing is stored.
[0033]
If there is an unmanufactured photomask in the subsequent process (YES in S140), and the yield when the wafer is manufactured excluding the defective chip portion satisfies the planned yield of the wafer (S150). YES), the quality determination for each chip in the photomask manufacturing process is unnecessary, and is stored in the chip quality determination necessity data in the photomask manufacturing shown in FIG. That is, as shown in FIG. 9, when it is determined that the chip pattern on the upper right end of the chip pattern on the photomask is defective, it is determined that the quality determination of the chip in that portion is unnecessary. A discount rate is calculated based on unit price discount data (FIG. 7) and necessity of quality judgment for each chip (FIG. 5) (S170), and an order unit price is calculated based on the basic unit price data (FIG. 6) and the discount rate. Is calculated (S180). At this time, the order unit price is calculated by multiplying the discount rate shown in FIG. 7 by the reference unit price shown in FIG.
[0034]
As described above, according to the photomask order price calculation system according to the present embodiment, the mask can be obtained at low cost while securing the yield required for wafer manufacturing. In order to check the wafer quality, it is possible to check even the quality on the wafer that could not be checked by the photomask inspection. As a result, the order price of the subsequent photomask can be calculated lower according to the defect of the previously delivered photomask.
[0035]
<First Embodiment Modification>
Hereinafter, a photomask order price calculation system according to a modification of the present embodiment will be described. In this modification, the basic unit price data is not set for each process, but is set only for the mask quality. For example, as shown in FIG. 10, basic unit price data is stored for each basic unit price instead of for each process, and as shown in FIG. 11, mask manufacturing specification data defining quality for each process is stored in the fixed disk 124 of the server 100. I let it.
[0036]
In this case, the same effect as in the first embodiment can be obtained.
[0037]
Further, in the first embodiment described above, it was determined whether or not the planned yield of the wafer was satisfied. However, the wafer production period data as shown in FIG. 12 is stored in advance to satisfy the planned yield of the wafer. Instead of determining whether or not to perform, it may be determined whether or not the wafer manufacturing period is satisfied. That is, if the manufacturing period when a wafer is manufactured using a photomask stored as including a defective chip satisfies the photomask manufacturing planned period of the wafer manufacturing period data shown in FIG. To S190 are executed.
[0038]
<Second embodiment>
Hereinafter, a photomask order price calculation system according to a second embodiment of the present invention will be described. The hardware configuration of the photomask ordering price calculation system according to the present embodiment is the same as the hardware configuration of the photomask ordering price calculation system according to the above-described first embodiment. Therefore, detailed description thereof will not be repeated here.
[0039]
With reference to FIG. 13, chip pass / fail data in mask manufacturing stored in fixed disk 124 of server 100 according to the present embodiment will be described. As shown in FIG. 13, data representing chip (1) pass / fail, chip (2) pass / fail,... Is stored for each process as chip pass / fail data in mask manufacturing. That is, in the fixed disk 124 of the server 100 according to the first embodiment, the chip pass / fail data in the wafer manufacturing shown in FIG. 4 is stored, but the fixed disk 124 of the server 100 according to the present embodiment 13. As shown in FIG. 13, chip pass / fail data in mask manufacturing is stored.
[0040]
FIG. 14 shows chip quality determination necessity data in photomask manufacturing, FIG. 15 shows basic unit price data, and FIG. 16 shows unit price discount data, which are stored in the fixed disk 124 of the server 100 according to the present embodiment. . The data shown in FIGS. 14 to 16 is the same as the data shown in FIGS. 5 to 7 according to the first embodiment. Therefore, detailed description thereof will not be repeated here.
[0041]
With reference to FIG. 17, a control structure of a program executed by CPU 120 of server 100 will be described. In the flowchart shown in FIG. 17, the same processes as those in the flowchart shown in FIG. 8 are denoted by the same step numbers. The processing for them is the same. Therefore, detailed description thereof will not be repeated here.
[0042]
In S200, CPU 120 determines whether or not defective chip data of the chip pattern on the photomask has been input. If the defective chip data of the chip pattern on the photomask is input (YES in S200), the process proceeds to S210. If not (NO in S200), the process returns to S200 and waits until defective chip data is input.
[0043]
In S210, CPU 120 stores the defect as a chip defect on the photomask. At this time, chip pass / fail data is stored as shown in FIG.
[0044]
The operation of the photomask order price calculation processing according to the present embodiment based on the above structure and flowchart will be described.
[0045]
As shown in FIG. 18, when a chip confirmed to be defective in the chip pattern on the photomask is input (YES in S200), the defect of the chip on the photomask becomes the chip in the mask manufacturing shown in FIG. It is stored as pass / fail data (S210). If the wafer yield calculated based on the chip quality data in the mask manufacturing shown in FIG. 13 and the chip quality determination necessity data shown in FIG. 14 satisfies the planned wafer yield (YES in S150), A discount rate is calculated (S170), and an order unit price is calculated (S180).
[0046]
As described above, according to the photomask order price calculation system according to the present embodiment, when the defective chip data of the chip pattern on the photomask instead of on the wafer is input, the planned yield of the wafer is satisfied. , The order price of the photomask can be calculated at a low price.
[0047]
<Second Embodiment Modification>
Hereinafter, a photomask order price calculation system according to a modification of the present embodiment will be described. The hardware configuration of the photomask ordering price calculation system according to this modification is the same as that of the photomask ordering price calculation system according to the above-described second embodiment. Therefore, detailed description thereof will not be repeated here.
[0048]
Referring to FIGS. 19 and 20, fixed disk 124 of server 100 stores basic unit price data and mask manufacturing specification data, similar to the above-described modification of the first embodiment. That is, also in this modified example, the basic unit price data is not stored for each process, but is stored according to the mask quality, and separately from that, the mask manufacturing specification data shown in FIG. 20 is stored for each process. Thereby, also in the present modification, the same effect as in the above-described second embodiment can be obtained.
[0049]
Further, as shown in FIG. 21, instead of storing the wafer production schedule data on the fixed disk 124 of the server 100 and determining whether or not the planned yield of the wafer is satisfied, whether or not the schedule of the photomask production schedule is satisfied is satisfied. If it is determined whether or not it is satisfied, the processing of S160 to S190 shown in FIG. 17 may be performed.
[0050]
<Third embodiment>
Hereinafter, a photomask order price calculation system according to a third embodiment of the present invention will be described. The hardware configuration of the photomask ordering price calculation system according to the present embodiment is the same as the hardware configuration of the photomask ordering price calculation system according to the above-described first embodiment. Therefore, detailed description thereof will not be repeated here.
[0051]
FIG. 22 shows chip pass / fail data in mask manufacture stored in the fixed disk 124 of the server 100, and FIG. 23 shows chip quality determination necessity data in photomask manufacture. Since the chip pass / fail data in the mask manufacturing shown in FIG. 22 is the same as the chip pass / fail data shown in FIG. 13, detailed description will not be repeated here. The chip quality determination necessity data shown in FIG. 23 is the same as the chip quality determination necessity data shown in FIG. 14 described above, and thus the detailed description will not be repeated here.
[0052]
With reference to FIG. 24, the chip replacement candidate data stored on the fixed disk 124 of the server 100 will be described. As shown in FIG. 24, data representing a mask set, a process, a replacement chip size, an element dimensional accuracy, a defect standard,... Are stored as chip replacement candidate data. This is data for selecting a chip that can replace a chip for which quality judgment is unnecessary in the chip quality judgment necessity data shown in FIG. Replacement candidates can be extracted from any mask set. The extraction condition is that the same quality is required and the chip size can be mixedly mounted on the same mask.
[0053]
FIG. 25 shows the chip replacement history data stored in the fixed disk 124 of the server 100. This stores the extracted chip (replacement mask set) in the chip replacement candidate data shown in FIG. As shown in FIG. 25, data representing a mask set, a process, a replacement chip size, a replacement chip coordinate, a replacement mask set, a replacement process,... Are stored as chip replacement history data.
[0054]
With reference to FIG. 26, a control structure of a program executed by CPU 120 of server 100 will be described. In the flowchart shown in FIG. 26, the same processes as those in the flowchart shown in FIG. 8 and the flowchart shown in FIG. 17 are denoted by the same step numbers. The processing for them is the same. Therefore, detailed description thereof will not be repeated here.
[0055]
In S300, CPU 120 selects a replaceable chip including another mask set. At this time, the chip replacement candidate data shown in FIG. 24 is used. In S310, CPU 120 performs a mixed mounting process of the selected replacement chip on the mask set. At this time, the chip replacement history data shown in FIG. 25 is stored. In S320, CPU 120 executes an order process with a photomask manufacturer with a mask set on which the replacement chip is mounted. At this time, the order price of the photomask at the time of ordering with the photomask manufacturer is lower than that of a photomask having no defective chips.
[0056]
The operation of the photomask order price calculation system according to the present embodiment based on the above structure and flowchart will be described.
[0057]
As shown in FIG. 27, when the defective chip data of the chip pattern on the photomask is input (YES in S200), the defective chip data is stored in the chip pass / fail data shown in FIG. 22 as a defect of the chip on the photomask. Is performed (S210). In the subsequent process, there is an unmanufactured photomask (YES in S140), which satisfies the planned yield of the wafer (YES in S150), it is determined that the quality determination of the defective chip is unnecessary, and the quality determination shown in FIG. It is stored in the necessity data (S160). A replaceable chip is selected based on the chip replacement candidate data in order to replace a defective chip portion for which it is determined that quality determination is unnecessary with another chip (S300). The process is executed with the selected replacement chip mixedly mounted on the mask set (S310).
[0058]
As shown in FIG. 27, when a defective chip is present at the upper right end on the photomask, a chip of another mask set is mixedly processed, and each mask set is transferred by blinding another mask set, Produce good chips.
[0059]
As described above, according to the photomask order price calculation system according to the present embodiment, a defective chip on a photomask is replaced with a chip of another mask set, and an order process is performed with a photomask manufacturer. At this time, the order price when ordering with a photomask manufacturer is set lower than a photomask having no defective chip.
[0060]
<Third Embodiment Modification>
Hereinafter, a photomask order price calculation system according to a modification of the third embodiment will be described.
[0061]
In this modification, the processing for determining whether or not the planned yield of the wafer is satisfied in the above-described third embodiment is replaced with a processing for determining whether or not the manufacturing period of the wafer is satisfied. It is.
[0062]
The fixed disk 124 of the server 100 stores wafer manufacturing period data shown in FIG. As shown in FIG. 28, data representing a mask set, a process, a planned use date of a photomask, a photomask order date, a photomask delivery date, and a photomask production plan date are stored as wafer production period data. As described above, the wafer manufacturing period data is stored on the fixed disk 124, and the processes of S160 to S320 may be executed when the photomask manufacturing planned period is satisfied instead of the process of S150 shown in FIG. Good.
[0063]
Further, the selection of the masks that can be combined may be performed not by the server 100 but by the mask maker computer 200.
[0064]
<Fourth embodiment>
Hereinafter, a photomask order price calculation system according to a fourth embodiment of the present invention will be described. The hardware configuration of the photomask ordering price calculation system according to the present embodiment is the same as the hardware configuration of the photomask ordering price calculation system according to the above-described first embodiment. Therefore, detailed description thereof will not be repeated here.
[0065]
FIG. 29 shows chip pass / fail data stored in the fixed disk 124 of the server 100 in photomask manufacturing. As shown in FIG. 29, data indicating chip (1) pass / fail, chip (2) pass / fail, chip (3) pass / fail, chip (4),... Is done.
[0066]
FIG. 30 shows the chip quality judgment group data in the photomask manufacturing stored in the fixed disk 124 of the server 100. As shown in FIG. 30, chip (1) necessity group, chip (2) necessity group, chip (3) necessity group, chip (4) necessity group, .., Data indicating whether or not quality determination is possible are stored.
[0067]
As shown in FIG. 29, when there is a chip of poor quality, a chip to be hidden by blind at the time of wafer production is obtained based on FIG. At this time, if there is a defect that extends over a plurality of chips on the photomask and cannot be completely hidden by blinds at the time of wafer production, it is determined to be defective and the processing described later is not executed. For example, as shown in FIG. 35, chip (1) and chip (2) are simultaneously hidden by blinds. Similarly, chip (3) and chip (4) are blindly hidden at the same time. If the chips (1) and (3) have defects, all the chips are hidden by blinds, so that they are determined to be defective and the photomask order price calculation processing is not executed.
[0068]
FIG. 31 shows the basic unit price data stored in the fixed disk 124 of the server 100, FIG. 32 shows the unit price discount data, and FIG. 33 shows the wafer production period data. The basic unit price data shown in FIG. 31 is the same as FIG. 6, the unit price discount data shown in FIG. 32 is the same as FIG. 7, and the wafer manufacturing period data shown in FIG. 33 is the same as FIG. Absent.
[0069]
With reference to FIG. 34, a control structure of a program executed by CPU 120 of server 100 will be described. In the flowchart shown in FIG. 34, the same processes as those in the flowchart shown in FIG. 17 are denoted by the same step numbers. The processing for them is the same. Therefore, detailed description thereof will not be repeated here.
[0070]
In S400, CPU 120 creates a chip arrangement including a defective chip on the photomask. At S410, CPU 120 determines whether or not the blind processing of the defective chip is possible and the wafer planning period is satisfied. This determination is made based on the chip pass / fail data shown in FIG. 29 and the chip quality determination group data shown in FIG. 30, and also based on the wafer production schedule data shown in FIG. If it is determined that the blind processing of the defective chip is possible and the wafer planning period is satisfied (YES in S410), the process proceeds to S420. If not (NO in S410), this process ends.
[0071]
In S420, CPU 120 executes an order processing with a photomask manufacturer.
[0072]
At S430, CPU 120 determines whether or not the wafer planning work period is satisfied. If the wafer plan term is satisfied (YES in S430), the process proceeds to S440. Otherwise (NO at S430), this process ends.
[0073]
In S440, CPU 120 calculates a photomask price based on the position of the defective chip. At this time, the price of the ordered photomask is calculated by multiplying the discount rate calculated based on the unit price discount data shown in FIG. 32 by the basic unit price data shown in FIG.
[0074]
At S450, CPU 120 instructs the photomask manufacturer to ship. The operation of the photomask order price calculation system according to the present embodiment based on the above structure and flowchart will be described. If the blind processing of the defective chip on the photomask is possible and the wafer planning period is satisfied (YES in S410), a photomask ordering process is performed with a photomask manufacturer (S420). At this time, whether or not the blind processing is possible is determined based on the chip quality data shown in FIG. 29 and the chip quality determination group data shown in FIG. As shown in FIG. 35, even when a plurality of chips are defective, if the chip quality determination group is the same, it is determined that the blind processing is possible. In addition, it is determined whether or not the wafer planning time is satisfied based on the wafer manufacturing time data shown in FIG.
[0075]
A photomask is ordered from a photomask manufacturer (S420), and when defective chip data of the delivered chip pattern on the photomask is input (YES in S200), it is stored as a defective chip on the photomask. (S210).
[0076]
Since the chip on the delivered photomask has a defect, it is determined again whether or not the wafer planning period is satisfied (S430). If the wafer planning period is satisfied (YES in S430), a discount rate is calculated based on the unit price discount data shown in FIG. 32, and the calculated discount rate is multiplied by the basic unit price data shown in FIG. , The order price is calculated (S440).
[0077]
As shown in FIG. 35, it is assumed that when the chip (2) on the photomask is a defective chip, the chip (3) is detected as a defective chip in a subsequent process. When a photomask including the defective chip (2) is used, a good chip can be manufactured by blinding the upper half at the time of transfer. When a photomask including the defective chip (3) is used in the subsequent process, only a good chip can be manufactured by applying a blind to the lower half at the time of transfer.
[0078]
As described above, according to the photomask order price calculation system according to the present embodiment, conventionally, a photomask that cannot be shipped as a defective mask can be used by blinding and satisfy the wafer planning period, Can be shipped. At this time, the order price can be kept low.
[0079]
<Fourth Embodiment Modification>
Hereinafter, a photomask order price calculation system according to a modification of the fourth embodiment of the present invention will be described. As shown in FIG. 36, the basic unit price data stored in the fixed disk 124 of the server 100 according to the present modification is not set for each process, but is set for a photomask standard. In this case, the specifications of the photomask in each step of the photomask shown in FIG. 37 are stored.
[0080]
In this modification, the same effects as those of the photomask order price calculation system according to the fourth embodiment can be obtained.
[0081]
<Fifth embodiment>
Hereinafter, a photomask order price calculation system according to a fifth embodiment of the present invention will be described. The hardware configuration of the photomask ordering price calculation system according to the present embodiment is the same as the hardware configuration of the photomask ordering price calculation system according to the above-described first embodiment. Therefore, a detailed description of them will not be repeated here.
[0082]
FIG. 38 shows chip pass / fail data in photomask production stored in the fixed disk 124 of the server 100, and FIG. 39 shows chip quality judgment group data in mask production. The chip quality data shown in FIG. 38 is the same as that in FIG. 29 described above, and the chip quality determination group data shown in FIG. 39 is the same as that in FIG. 30 described above. Therefore, detailed description thereof will not be repeated.
[0083]
FIG. 40 shows the chip arrangement data of the photomask stored in the fixed disk 124 of the server 100. As shown in FIG. 40, chip (1) necessity, chip (2) necessity, chip (3) necessity, chip (4) necessity,... The data is stored. Based on the quality judgment in the photomask manufacturing, the chip pass / fail data is stored as shown in FIG. 38. If the above can be achieved, the wafer manufacturing process is performed by hiding with a blind. At this time, if it is possible to omit the chips that have been blinded to the wafer manufacturing schedule in the subsequent process, the chip arrangement on the photomask is reduced according to the grouping registered in FIG. 39, and the chip arrangement shown in FIG. Store as data.
[0084]
FIG. 41 shows basic unit price data stored in the fixed disk 124 of the server 100. Since the basic unit price data shown in FIG. 41 is the same as the basic unit price data shown in FIG. 6, detailed description thereof will not be repeated.
[0085]
FIG. 42 shows unit price discount data stored in the fixed disk 124 of the server 100. Unit price discount data (1) shown in FIG. 42 is the same as unit price discount data shown in FIG. 7, and therefore, detailed description thereof will not be repeated here. As unit price discount data (2) shown in FIG. 42, data representing a discount rate and a drawing area ratio is stored for each process. For example, in the process A, a discount rate of 5% discount is stored when the drawing area ratio is 50%.
[0086]
FIG. 43 shows wafer production schedule data stored in the fixed disk 124 of the server 100. Since the wafer manufacturing period data shown in FIG. 43 is the same as the wafer period data shown in FIG. 12, detailed description thereof will not be repeated.
[0087]
With reference to FIG. 44, a control structure of a program executed by CPU 120 of server 100 will be described. In the flowchart shown in FIG. 44, the same processes as those in the flowchart shown in FIG. 17 and the flowchart shown in FIG. 34 are denoted by the same step numbers. The processing is the same. Therefore, detailed description thereof will not be repeated here.
[0088]
In S500, CPU 120 determines whether or not a chip defect has been accepted in the previous process. If a chip defect is accepted in the previous process (YES in S500), the process proceeds to S510. If not (NO in S500), this process ends.
[0089]
At S510, CPU 120 determines whether or not the wafer planning period is satisfied even if chips are reduced in a subsequent process. If the wafer planning period is satisfied even if the number of chips is reduced in the subsequent process (YES in S510), the process proceeds to S520. If not (NO in S510), this process ends.
[0090]
In S520, CPU 120 stores the chip arrangement in which the number of defective chips has been reduced. At this time, the chip arrangement data of the photomask shown in FIG. 40 is stored. In S530, CPU 120 calculates a photomask price based on the chip drawing area. At this time, the discount rate is calculated based on the drawing area ratio with reference to the unit price discount data (2) shown in FIG. The order price of the photomask is calculated based on the calculated discount rate and the basic unit price data shown in FIG. In S540, CPU 120 executes a photomask ordering process with the photomask manufacturer.
[0091]
The operation of the photomask order price calculation system according to the present embodiment based on the above structure and flowchart will be described.
[0092]
As shown in FIG. 45, when the defective chip is blinded at the time of transfer of the photomask, and the wafer planning period is satisfied (YES in S430), shipping is instructed to the photomask manufacturer (S450). If the chip failure in the previous process is accepted (S500) and the wafer planning period is satisfied even if the chips are reduced in the subsequent process (YES in S510), the chip arrangement in which the defective chips have been reduced is stored (S510). S520). At this time, as shown in FIG. 45, a chip arrangement in which a defective chip portion is reduced to reduce a drawing area ratio is set. Since the discount rate is set as the drawing area ratio decreases, the photomask ordering price can be calculated lower.
[0093]
<Fifth Embodiment Modification>
Hereinafter, a photomask order price calculation system according to a modification of the fifth embodiment will be described.
[0094]
In the photomask order price calculation system according to this modification, the basic unit price data is not set for each process as shown in FIG. 46, but is set for the standard of the photomask. At this time, as shown in FIG. 47, the specifications of the photomask are set for each step of the photomask. As described above, even if the price of the photomask is set not for each process but for the standard of the photomask, the same effect as that of the photomask order price calculation system according to the above-described fifth embodiment can be obtained.
[0095]
The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of a photomask order price calculation system according to an embodiment of the present invention.
FIG. 2 is an external view of a computer that realizes the server shown in FIG.
FIG. 3 is a control block diagram of the computer shown in FIG.
FIG. 4 is a diagram showing chip pass / fail data in wafer manufacture stored in the server according to the first embodiment of the present invention.
FIG. 5 is a view showing chip quality determination necessity data in photomask manufacturing stored in the server according to the first embodiment of the present invention.
FIG. 6 is a diagram showing basic unit price data of a photomask stored in a server according to the first embodiment of the present invention.
FIG. 7 is a diagram showing unit price discount data of a photomask stored in a server according to the first embodiment of the present invention.
FIG. 8 is a flowchart illustrating a control structure of a program executed by the server according to the first embodiment of the present invention.
FIG. 9 is a conceptual diagram of processing executed by the server according to the first embodiment of the present invention.
FIG. 10 is a diagram showing basic unit price data of a photomask stored in a server according to a modification of the first embodiment of the present invention.
FIG. 11 is a diagram showing mask manufacturing specification data stored in a server according to a modification of the first embodiment of the present invention.
FIG. 12 is a diagram showing wafer manufacturing period data stored in a server according to a modification of the first embodiment of the present invention.
FIG. 13 is a diagram illustrating chip pass / fail data stored in a server according to the second embodiment of the present invention in mask manufacturing.
FIG. 14 is a diagram showing chip quality determination necessity data in photomask production stored in the server according to the second embodiment of the present invention.
FIG. 15 is a diagram showing basic unit price data of a photomask stored in a server according to a second embodiment of the present invention.
FIG. 16 is a diagram showing unit price discount data of a photomask stored in a server according to the second embodiment of the present invention.
FIG. 17 is a flowchart illustrating a control structure of a program executed by a server according to the second embodiment of the present invention.
FIG. 18 is a conceptual diagram of a process executed by a server according to the second embodiment of the present invention.
FIG. 19 is a diagram showing basic unit price data of a photomask stored in a server according to a modification of the second embodiment of the present invention.
FIG. 20 is a diagram showing mask manufacturing specification data stored in a server according to a modification of the second embodiment of the present invention.
FIG. 21 is a diagram showing wafer manufacturing period data stored in a server according to a modification of the second embodiment of the present invention.
FIG. 22 is a view showing chip pass / fail data stored in a server according to the third embodiment of the present invention in mask manufacturing.
FIG. 23 is a diagram showing chip quality determination necessity data in photomask production stored in the server according to the third embodiment of the present invention.
FIG. 24 is a diagram illustrating chip replacement candidate data stored in the server according to the third embodiment of the present invention.
FIG. 25 is a diagram showing chip replacement history data stored in the server according to the third embodiment of the present invention.
FIG. 26 is a flowchart illustrating a control structure of a program executed by a server according to the third embodiment of the present invention.
FIG. 27 is a conceptual diagram of a process executed by a server according to the third embodiment of the present invention.
FIG. 28 is a diagram showing wafer manufacturing period data stored in a server according to a modification of the third embodiment of the present invention.
FIG. 29 is a diagram illustrating chip pass / fail data stored in a photomask manufacturing process stored in a server according to the fourth embodiment of the present invention.
FIG. 30 is a diagram illustrating chip quality determination group data in photomask manufacturing stored in a server according to the fourth embodiment of the present invention.
FIG. 31 is a diagram showing basic unit price data of a photomask stored in a server according to a fourth embodiment of the present invention.
FIG. 32 is a diagram showing unit price discount data of a photomask stored in the server according to the fourth embodiment of the present invention.
FIG. 33 is a diagram showing wafer manufacturing period data stored in the server according to the fourth embodiment of the present invention.
FIG. 34 is a flowchart illustrating a control structure of a program executed by a server according to the fourth embodiment of the present invention.
FIG. 35 is a conceptual diagram of a process executed by a server according to the fourth embodiment of the present invention.
FIG. 36 is a diagram showing basic unit price data of a photomask stored in a server according to a modification of the fourth embodiment of the present invention.
FIG. 37 is a diagram showing mask manufacturing specification data stored in a server according to a modification of the fourth embodiment of the present invention.
FIG. 38 is a diagram illustrating chip pass / fail data stored in the photomask manufacturing process stored in the server according to the fifth embodiment of the present invention.
FIG. 39 is a diagram showing chip quality judgment group data in photomask manufacturing stored in the server according to the fifth embodiment of the present invention.
FIG. 40 is a diagram showing a chip arrangement of a photomask stored in the server according to the fifth embodiment of the present invention.
FIG. 41 is a diagram showing basic unit price data of a photomask stored in a server according to the fifth embodiment of the present invention.
FIG. 42 is a diagram showing unit price discount data of a photomask stored in the server according to the fifth embodiment of the present invention.
FIG. 43 is a diagram showing wafer manufacturing period data stored in the server according to the fifth embodiment of the present invention.
FIG. 44 is a flowchart showing a control structure of a program executed by a server according to the fifth embodiment of the present invention.
FIG. 45 is a conceptual diagram of a process executed by a server according to the fifth embodiment of the present invention.
FIG. 46 is a diagram showing basic unit price data of a photomask stored in a server according to a modification of the fifth embodiment of the present invention.
FIG. 47 is a diagram showing mask manufacturing specification data stored in a server according to a modification of the fifth embodiment of the present invention.
[Explanation of symbols]
Reference Signs List 100 server, 102 computer, 104 monitor, 106 FD drive, 108 CD-ROM drive, 110 keyboard, 112 mouse, 116 FD, 118 CD-ROM, 120 CPU, 122 memory, 124 fixed disk, 128 communication interface, 200 Computer for mask makers, 300 computers for ordering, 500 networks.

Claims (8)

An inspection step of inspecting a defective chip in a wafer to which a chip pattern formed on a photomask has been transferred,
Considering the defective chip detected in the inspection step, a determining step of determining whether or not a wafer production plan is satisfied,
If it is determined in the determining step that the production plan is satisfied, the price of the ordered photomask including the chip pattern corresponding to the defective chip is calculated so as to be lower than the price of the photomask in which the defective chip is not detected. And calculating the price of the photomask. An inspection step of inspecting a defective chip in the chip pattern formed on the photomask,
Considering the defective chip detected in the inspection step, a determining step of determining whether or not a wafer production plan is satisfied,
When it is determined in the determining step that the production plan is satisfied, a calculating step of calculating the price of the ordered photomask including the pattern of the defective chip so as to be lower than the price of the photomask in which the defective chip is not detected. And a price calculation method for a photomask. An inspection step of inspecting a defective chip in the chip pattern formed on the photomask,
Considering the defective chip detected in the inspection step, a determining step of determining whether or not a wafer production plan is satisfied,
When determining that the production plan is satisfied in the determining step, calculating a replacement chip that can be mounted on the photomask in which the defective chip is detected, and calculating a mask set of the ordered photomask;
Calculating a price of the photomask to be ordered based on the mixed loading state. An inspection step of inspecting a defective chip in the chip pattern formed on the photomask,
Blind processing of the defective chip detected in the inspection step, a determining step of determining whether or not a wafer production plan is satisfied,
When it is determined in the determining step that the production plan is satisfied, a calculating step of calculating the price of the ordered photomask including the pattern of the defective chip so as to be lower than the price of the photomask in which the defective chip is not detected. And a price calculation method for a photomask. An inspection step of inspecting a defective chip in the chip pattern formed on the photomask,
Blind processing of the defective chip detected in the inspection step, a determining step of determining whether or not a wafer production plan is satisfied,
When it is determined that the production plan is satisfied in the determining step, only a chip that does not include the defective chip to be subjected to blind processing is arranged, and a mask set of a photomask to be ordered is calculated;
Calculating a price of a photomask to be ordered based on a drawing area of only a chip that does not include the defective chip to be subjected to blind processing so as to be lower than a price of a photomask in which the defective chip is not detected. , Photomask price calculation method. The determining step includes:
Calculating a chip allowed as a defective chip on a mask based on a planned yield of the wafer included in the production plan;
The photomask according to claim 1, further comprising: determining whether the planned yield is satisfied based on the permitted chip and the defective chip detected in the inspection step. Price calculation method. The determining step includes:
A step of calculating a chip allowed as a defective chip on a mask based on a planned work period of the wafer included in the production plan;
The photomask according to any one of claims 1 to 5, further comprising a step of determining whether or not the planned construction period is satisfied, based on the allowable chip and the defective chip detected in the inspection step. Price calculation method. The calculating step includes calculating a price of a photomask based on a reference price of a photomask in which the defective chip is not detected and a discount rate based on the detected defective chip. The price calculation method of the photomask according to any one of the above.

Images