JP2004202498A - Laser beam machining method, encoder slit formed thereby and image display body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining method capable of machining a material layer located in the middle of a material with a high degree of accuracy into a voluntary shape and provide an encoder slit formed thereby and an image display body. <P>SOLUTION: The laser beam machining method is characterized by the feature that, toward a forming body composed of a first material layer 1 which is transparent to at least a laser beam L, a second material layer 2 provided in contact with the first material layer 1, and a third material layer 3 provided in contact with the second material layer 2, the laser beam L is irradiated from the direction of the first material layer 1 and only the second material layer 2 is formed into a voluntary shape by a high-speed evaporation of the second material layer 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing method for forming an arbitrary shape with high accuracy, and an encoder slit and an image display body formed by this method.
[0002]
[Prior art]
Various types of laser processing methods for forming an arbitrary shape by irradiating a processing material with laser light and optical elements formed thereby have been known.
[0003]
[Problems to be solved by the invention]
By the way, in the conventional processing method, processing for directly forming an arbitrary shape inside the material could not be performed.
[0004]
In the laser method, internal modification of the transparent body is performed, but this changes the properties of the transparent body itself, so the characteristics as an optical element are low (change in refractive index, reflectance, transmittance, etc.). Less is).
[0005]
The following problems have also been pointed out. That is,
(1) In the case of a material such as a metal, light is absorbed on the surface, and it is difficult to form a pattern inside.
[0006]
(2) It is necessary to process with the focused spot, and it is difficult to form an arbitrary shape at one time.
[0007]
(3) It is difficult to control the processing position in the depth direction.
[0008]
Further, in the method of cutting the wiring with the laser light, the metal is melted as heat, so that there is a problem that the pattern formation accuracy is poor and it is difficult to form the pattern by laser irradiation.
[0009]
The present invention has been made paying attention to the above circumstances, and the object of the present invention is a laser processing method capable of processing a material layer arranged in the middle of the material into an arbitrary shape with high accuracy, and this method. An encoder slit and an image display body are provided.
[0010]
[Means for Solving the Problems]
In order to solve the above problem, the laser processing method according to claim 1 includes a first material layer that is transparent to at least a laser beam and a second material that is disposed in contact with the first material layer. A structure composed of a layer and a third material layer disposed in contact with the second material layer is irradiated with laser light from the direction of the first material layer, Only the second material layer is formed into an arbitrary shape by high-speed vaporization.
[0011]
According to the laser processing system described in claim 1, the first material layer and the third material layer can protect the pattern, and the first material layer and the third material layer can prevent scattered matter during processing. Can be suppressed. In addition, plasma suppression during processing by the first material layer and the third material layer, thermal diffusion reduction by the first material layer and the third material layer, and deformation reduction of the second material layer by the first material layer and the third material layer are reduced. You can also plan.
[0012]
A laser processing method according to a second aspect is the laser processing method according to the first aspect, wherein the first material layer is a transparent material.
[0013]
According to the laser processing method described in claim 2, the same effect as the laser processing method described in claim 1 can be obtained, and the shape of the second material layer can be observed over the entire visible region. An element having an optically transparent surface and a pattern formed inside can be produced.
[0014]
According to a third aspect of the present invention, there is provided the laser processing method according to the first aspect, wherein the first and third material layers are both transparent materials.
[0015]
According to the laser processing system described in claim 3, the same effects as the laser processing system described in claim 1 can be obtained, and a transmissive optical element can be produced.
[0016]
The laser processing method according to claim 4 is the laser processing method according to any one of claims 1 to 3, wherein at least one of the first material layer and the third material layer is bonded. It is a material layer.
[0017]
According to the laser processing system described in claim 4, a material having the same effect as the laser processing system described in any one of claims 1 to 3 and having a pattern inside is provided. Can be easily added to other materials after forming the pattern. Further, by performing laser processing on the previously bonded structure, a pattern can be formed at an arbitrary position with respect to the structure.
[0018]
According to a fifth aspect of the present invention, in the laser processing method according to any one of the second to fourth aspects, the second material layer is a reflective film. .
[0019]
According to the laser processing method described in claim 5, the same effect as the laser processing method described in any one of claims 2 to 4 can be obtained, and the first material layer can be transmitted. Since the reflected light is reflected by the patterned second material layer, it can be used as a reflective optical element.
[0020]
According to a sixth aspect of the present invention, there is provided the laser processing method according to the fifth aspect, wherein the second material layer is a metal thin film of 200 nm or less.
[0021]
According to the laser processing method described in claim 6, the same effects as the laser processing method described in claim 5 can be obtained, and by using a thin film, laser processing can be performed with low energy. Deformation during processing can also be reduced. Further, since the absorption is high, the penetration length of the laser light is short, the laser energy can be injected into a narrow region, and efficient removal becomes possible.
[0022]
The laser processing method according to claim 7 is the laser processing method according to any one of claims 2 to 4, wherein the second material layer is a light absorption layer. To do.
[0023]
According to the laser processing system described in claim 7, the same effect as the laser processing system described in any one of claims 2 to 4 can be obtained, and absorption at a desired wavelength can be achieved. A reflection pattern can be formed and can be used as an optical element. Moreover, it becomes possible to function as a transmissive | pervious element by using a transparent material for a 1st and 3rd material layer.
[0024]
The laser processing system described in claim 8 is the laser processing system described in any one of claims 2 to 4, wherein the second material layer is an optically scattering film. Features.
[0025]
According to the laser processing system described in claim 8, the same effects as the laser processing system described in any one of claims 2 to 4 can be obtained, and the laser irradiation unit and the non-irradiation can be obtained. It is possible to cause an optical change in the unit and to function as an optical element.
[0026]
The laser processing system according to claim 9 is the laser processing system according to any one of claims 2 to 4, wherein the second material layer includes a dye material film, a fluorescent material film, It is either a luminescent material film or a daylight film.
[0027]
According to the laser processing system described in claim 9, the same effects as the laser processing system described in any one of claims 2 to 4 can be obtained, and the laser irradiation unit and the non-irradiation can be obtained. It is possible to cause a change in color, a change in fluorescence or light emission, and the like. Therefore, it is possible to form a display function such as forming a fine light emission pattern inside the transparent body, forming an arbitrary image, or forming an arbitrary character.
[0028]
A laser processing method according to claim 10 is the laser processing method according to any one of claims 1 to 4, wherein the second material layer is a magnetic film. To do.
[0029]
According to the laser processing system described in claim 10, the same effect as that of the laser processing system described in any one of claims 1 to 4 can be obtained, and a fine magnetic pattern can be provided inside. Can be formed.
[0030]
The laser processing method according to claim 11 is the laser processing method according to any one of claims 1 to 10, wherein the pulse width of the laser beam is 200 ns or less. .
[0031]
According to the laser processing system described in claim 11, the same effect as the laser processing system described in any one of claims 1 to 10 can be obtained, and the pulse width is short. The thermal damage at the time of removal can be reduced, and therefore high-accuracy machining with a clean edge shape of the machined portion is possible. Further, since the shape spread due to heat conduction can be reduced, miniaturization is possible. Further, in a femtosecond laser, even if a metal material with high thermal conductivity is used, the altered region can be on the order of submicrons, and distortion at the periphery of the processed portion can be further suppressed. .
[0032]
The invention described in claim 12 is an optical encoder slit formed by the laser processing method according to any one of claims 1 to 9 or claim 11, and is described in claim 13. The invention described above is a magnetic encoder slit produced by the laser processing system according to claim 10 or claim 11, and the invention described in claim 14 is any one of claims 1 to 9. An image display body formed by the laser processing method according to claim 11. Since the elements described in these claims use the processing method described in claims 1 to 11, distortion during pattern formation can be suppressed, and an image with high accuracy and less peripheral alteration can be formed. Can be a structure.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0034]
An outline of the laser processing system of the present invention is shown in FIG. The laser light L transmitted through the first material layer 1 is selectively absorbed by the second material layer 2, and the laser irradiation part P of the second material layer 2 is rapidly vaporized. This vaporization region coincides with the laser light irradiation region, and can be formed into an arbitrary shape by adjusting the laser irradiation shape. The vaporized region is atomized and rapidly diffuses into the first material layer 1 and the third material layer 3. The pattern formation of the second material layer 2 is performed by the action of forming fine holes in the second material layer 2 or forming the pores S by rapid diffusion.
[0035]
FIG. 2 shows a processing result of an Al (50 nm) thin film actually disposed between the PET film (about 20 μm) and the acrylic adhesive layer. The dark part of the figure is the laser irradiation part P, and the width of the irradiation part P is about 5 μm. Thus, it can be seen that the portion irradiated with the laser light L is selectively processed with high accuracy.
[0036]
FIG. 3 shows a cross-sectional shape measurement result after processing. As shown here, it can be seen that holes S are formed in the laser irradiation part P, and an Al thin film pattern is formed. Depending on the laser irradiation conditions, these vacancies S are hardly seen, but in this case, it is considered that the pattern of the irradiated portion P is formed because Al is finely divided during vaporization. Thus, it became clear that the second material layer 2 is formed with high accuracy by the irradiation laser light L being transmitted through the transparent body and absorbed by the second material layer 2.
[0037]
Based on the above, specific examples of the present invention will be described below.
[0038]
First, in order to perform high-precision processing inside the transparent body, in the first embodiment, the first material layer 1 transparent to the laser beam, the second material layer 2 to be processed, and the third material layer 3 of the substrate. And the intermediate second material layer 2 is processed. In this way, since the pattern processed by the first and third material layers 1 and 3 is not exposed, damage due to contact of the pattern and alteration by the atmosphere or other gases can be prevented.
[0039]
On the other hand, in the laser processing method in the case where the first or third material layers 1 and 3 are not provided, a workpiece is scattered during laser processing, and dirt and shape deterioration occur. However, in the system of the present embodiment, these scattered objects are trapped inside, so that these adverse effects can be avoided.
[0040]
Further, in the laser processing method, surroundings are altered due to generation of plasma during processing or energy loss due to absorption of irradiation laser light by the plasma occurs. However, in the method of this embodiment, these can be avoided.
[0041]
Further, since the first and third material layers 1 and 3 are in contact with each other, it becomes possible to suppress thermal diffusion in the second material layer 2, thereby expanding the pattern from the laser irradiation part P to the outside. It becomes possible to suppress deformation.
[0042]
In addition, depending on the material and laser irradiation conditions, the material may show deformation that curls during thermal diffusion, but it is possible to suppress such deformation by bringing the first and third materials 1 and 3 into contact with each other. It becomes.
[0043]
As described above, according to the present embodiment, the pattern protection can be achieved by the first material layer 1 and the third material layer 3, and the first material layer and the third material layers 1 and 3 can be scattered during processing. Things can be suppressed. Further, plasma suppression during processing by the first material layer and the third material layer 1, 3, thermal diffusion reduction by the first material layer and the third material layer 1, 3, the first material layer and the third material layer 1, 3 It is also possible to reduce deformation of the second material layer 2 due to the above.
[0044]
Further, in order to perform processing of an optical device transparent to a desired wavelength, in the second embodiment, a material transparent to a laser processing wavelength and other desired wavelengths is used as the first material layer 1. The shape processing of the second material layer 2 under the first material layer 1 is performed. For example, the second material layer 2 is arranged under a transparent material such as PET or PC transparent to the visible region, and the second material layer 2 is patterned. Thereby, the shape of the second material layer 2 can be observed over the entire visible region. For example, by arranging a sensor pattern on the second material layer 2, the pattern can be sensed with a light source in the visible range. As a result, it is possible to produce an element having an optically transparent surface and a pattern formed inside.
[0045]
Further, in order to process a transmissive optical device and form a transmission pattern, in the third embodiment, both the first and third material layers 1 and 3 are made of a material having a high transmittance with respect to a desired wavelength. Pattern processing of the two-material layer 2 is performed. At this time, the laser irradiation part P can transmit with respect to a desired wavelength, whereby a transmissive optical element can be formed. For example, a transmissive optical mask or slit can be created by forming a pattern in a transparent material.
[0046]
In addition, in the fourth embodiment, the first or third material layer 1, the intermediate layer processing of the material having the adhesive layer, the processing after bonding to the material, and the addition of optical characteristics to other materials are possible. Adhesive material is used for the third material layer arranged in contact with 3 or these material layers. This can be realized, for example, by adding a pressure-sensitive adhesive to the second material layer 2 or applying an acrylic adhesive. Thereby, it becomes easy to add a material having a pattern inside to another material after forming the pattern. Further, by performing laser processing on the previously bonded structure, a pattern can be formed at an arbitrary position with respect to the structure. For example, by adding a transparent encoder slit created by this method, an encoder can be created on a moving body at low cost and easily.
[0047]
In order to form a reflective element, in the fifth embodiment, the second material layer 2 is a reflective material. Thereby, the light transmitted through the first material layer 1 is reflected by the second material layer 2 formed with a pattern, and can be used as a reflective optical element. As the reflective material, a metal, a ceramic film, a reflective particle-dispersed polymer, or the like can be used.
[0048]
In addition, in the sixth embodiment, a metal film having a thickness of 200 nm or less is used as the reflective film in the fifth embodiment so that an inexpensive and stable film can be obtained and a high reflectance can be realized in the visible range. This can be easily created by sputtering, vapor deposition or the like. The metal film usually has a high reflectivity from the near infrared region to the ultraviolet region, and the reflection can be increased with a very thin film. By using a thin film, laser processing can be performed with low energy, and deformation during processing can be reduced. Further, since the absorption is high, the penetration length of the laser light is short, the laser energy can be injected into a narrow region, and efficient removal becomes possible.
[0049]
In the seventh embodiment, a material having high absorption at a desired wavelength is used for the second material layer 2 in order to form an absorption type or transmission type optical element. Thereby, an absorption / reflection pattern at a desired wavelength can be formed and can be used as an optical element. Moreover, it becomes possible to function as a transmissive | pervious element by using a transparent material for the 1st and 3rd material layers 1 and 3. FIG.
[0050]
In the eighth embodiment, the second material layer 2 is a scattering material layer (optically scattering film). This can be realized by using a material having a rough surface or fine particles. As a result, an optical change can be made between the laser irradiation part and the non-irradiation part, and it can function as an optical element.
[0051]
Further, in the ninth embodiment, in order to perform light control pattern formation, arbitrary display pattern formation, image and character pattern creation, the second material layer 2 includes a dye material film, a fluorescent material film, a light emitting material film, and a livestock film. Is used. As a result, it is possible to cause a change in color between the laser irradiation part and the non-irradiation part, a change in fluorescence or light emission, and the like. Therefore, it is possible to form a display function such as forming a fine light emission pattern inside the transparent body, forming an arbitrary image, or forming an arbitrary character.
[0052]
In the tenth embodiment, a magnetic material is used for the second material layer 2 in order to perform magnetic pattern formation and magnetic head processing. This can be realized with an iron-based thin film or the like. Thereby, a fine magnetic pattern can be formed inside.
[0053]
In addition, in order to form the protective layer stably, partially form the protective layer, or to form slits at once, or to form at high speed, in the eleventh embodiment, as the processing laser light, Using a short pulse laser with a pulse width of 200 ns or less, the reflective material layer is removed and moved by laser ablation. As the laser having a pulse width of 200 ns or less, an excimer laser, a Q-Switch Nd: YAG laser, a harmonic laser thereof, a Ti: sapphire laser having a pulse width of up to several hundred femtoseconds, or the like can be used.
[0054]
When these lasers are irradiated on the surface of the reflective film, it is known that the material layer is removed at high speed by absorption of the film. Since the pulse width is short, thermal damage at the time of removal can be reduced, and therefore high-precision machining with a clean edge shape of the machined portion is possible. Further, since the shape spread due to heat conduction can be reduced, miniaturization is possible. Further, in a femtosecond laser, even if a metal material with high thermal conductivity is used, the altered region can be on the order of submicrons, and distortion at the periphery of the processed portion can be further suppressed. .
[0055]
FIG. 4 shows a schematic diagram of the processing optical system. For example, the laser beam L output from the laser device 10 using the third harmonic of an Nd: YAG laser is a mirror 12, a magnifying optical element 14, a shaping optical element 16, a cylindrical lens 18, and a condensing optical element. A (condensing lens) 20 is shaped into a line and irradiated onto the surface of the reflecting layer of the rotating body 22 that is a workpiece. A continuous slit pattern can be formed on the surface of the rotating body 22 by continuously moving the surface position while controlling the irradiation timing of the laser beam L and the position of the workpiece.
[0056]
FIG. 5 shows the processing result of the Al reflective film inside the transparent film actually obtained. By irradiating the Al reflective film with a nanosecond laser whose intensity is adjusted, the Al film absorbs energy and bonds are dissociated. Due to this energy, Al diffuses inside the polymer, or becomes a fine particle of several hundred nm or less that cannot be detected optically, resulting in loss of reflection characteristics at the irradiated part, and an optical pattern is formed. It is expected to be.
[0057]
FIG. 6 shows the light reflectance characteristics of the formed slit. In this way, it is possible to measure a change in reflectance that allows light detection even inside the material. Even when the reflection film is directly processed, the reflection intensity at the irradiated portion is reduced by the diffusion and ablation action of the reflection film in the atmosphere, and it is possible to obtain reflection optical characteristics equivalent to or better than the internal processing.
[0058]
Regarding the material change in the laser irradiation part, the light absorption layer selectively absorbs energy by laser irradiation and is generally thermally relaxed in the order of picoseconds to several tens of picoseconds, and the material is heated to a high temperature. At that time, especially by using pulsed laser light, unlike a high temperature by conduction, a rapid temperature change and a high temperature are possible. This indicates that a temperature that cannot be achieved by conduction from a heat source, such as tens of thousands of Kelvin in the order of picoseconds, can be achieved. Moreover, since it is a laser beam, it becomes possible to concentrate energy in arbitrary positions, such as condensing or forming a light irradiation pattern.
[0059]
At this time, particularly when the temperature of the material is increased instantaneously (for example, about several tens of nanoseconds) with a pulse laser beam or the like, the material vaporizes before the heat conduction into the absorption layer proceeds. Thereby, as compared with the case of gradually evaporating at a high temperature, the deviation from the irradiation region is reduced, heat alteration can be suppressed, and the material can be patterned into a shape close to the laser irradiation shape. Such laser vaporization is a reaction in an unsteady state, and is a very high temperature and rapid reaction. In general, in laser processing, the reaction state changes depending on the pulse width, and the influence on vaporization and material changes. In the eleventh embodiment, the effect of the short pulse laser can be obtained.
[0060]
In addition, the optical encoder slit and the magnetic encoder slit can be formed inside the transparent body by the processing method described above.
[0061]
In the twelfth embodiment, an optical pattern, a reflection pattern, a color image, an image, and characters are formed inside the transparent body using the processing method described above (for example, a reflective sheet, a colored film, Characters, transparent sheets on which images are formed, optical elements such as sheet-like hologram elements, and the like). In a normal system, it is necessary to add a transparent layer or laminate after forming a pattern, and in that case, there is a possibility of deformation in the process. On the other hand, in this method, since distortion during pattern formation can be suppressed, it is possible to obtain a structure in which an image with high accuracy and little peripheral alteration is formed.
[0062]
【The invention's effect】
According to the laser processing system described in claim 1, pattern protection can be achieved by the first material layer and the third material layer, and scattered matter during processing is suppressed by the first material layer and the third material layer. can do. In addition, plasma suppression during processing by the first material layer and the third material layer, thermal diffusion reduction by the first material layer and the third material layer, and deformation reduction of the second material layer by the first material layer and the third material layer are reduced. You can also plan.
[0063]
According to the laser processing method described in claim 2, the same effect as the laser processing method described in claim 1 can be obtained, and the shape of the second material layer can be observed over the entire visible region, An element having an optically transparent surface and a pattern formed therein can be produced.
[0064]
According to the laser processing system described in claim 3, the same effects as the laser processing system described in claim 1 can be obtained, and a transmissive optical element can be produced.
[0065]
According to the laser processing system described in claim 4, the same effect as the laser processing system described in any one of claims 1 to 3 can be obtained, and a material having a pattern inside can be obtained. After pattern formation, it becomes easy to add to other materials. Further, by performing laser processing on the previously bonded structure, a pattern can be formed at an arbitrary position with respect to the structure.
[0066]
According to the laser processing system described in claim 5, the same effect as the laser processing system described in any one of claims 2 to 4 is obtained, and the first material layer is transmitted. Since the light is reflected by the patterned second material layer, it can be used as a reflective optical element.
[0067]
According to the laser processing method described in claim 6, the same effect as the laser processing method described in claim 5 can be obtained, and by using a thin film, laser processing can be performed with low energy. Time deformation can also be reduced. Further, since the absorption is high, the penetration length of the laser light is short, the laser energy can be injected into a narrow region, and efficient removal becomes possible.
[0068]
According to the laser processing system described in claim 7, the same effect as the laser processing system described in any one of claims 2 to 4 can be obtained, and absorption / absorption at a desired wavelength can be obtained. A reflection pattern can be formed and used as an optical element. Moreover, it becomes possible to function as a transmissive | pervious element by using a transparent material for a 1st and 3rd material layer.
[0069]
According to the laser processing system described in claim 8, the same effects as the laser processing system described in any one of claims 2 to 4 can be obtained, and the laser irradiation unit and the non-irradiation unit Thus, an optical change can be made to function as an optical element.
[0070]
According to the laser processing system described in claim 9, the same effects as the laser processing system described in any one of claims 2 to 4 can be obtained, and the laser irradiation unit and the non-irradiation unit Can cause color change, fluorescence or light emission change, and the like. Therefore, it is possible to form a display function such as forming a fine light emission pattern inside the transparent body, forming an arbitrary image, or forming an arbitrary character.
[0071]
According to the laser processing system described in claim 10, the same effect as the laser processing system described in any one of claims 1 to 4 can be obtained, and a fine magnetic pattern can be provided inside. It becomes possible to form.
[0072]
According to the laser processing method described in claim 11, the same effect as the laser processing method described in any one of claims 1 to 10 can be obtained, and the pulse width is short. Thermal damage at the time of removal can be reduced, and therefore high-accuracy machining with a clean edge shape of the machined portion is possible. Further, since the shape spread due to heat conduction can be reduced, miniaturization is possible. Further, in a femtosecond laser, even if a metal material with high thermal conductivity is used, the altered region can be on the order of submicrons, and distortion at the periphery of the processed portion can be further suppressed. .
[0073]
According to the invention described in claims 12 to 14, since the processing method described in claims 1 to 11 is used, distortion at the time of pattern formation can be suppressed, and peripheral alteration can be performed with high accuracy. A structure in which a small number of images are formed can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of laser internal processing in a laser processing system according to an embodiment of the present invention.
FIG. 2 is a diagram showing a laser internal processing result.
FIG. 3 is a diagram showing a measurement result of a laser internal machining cross section.
FIG. 4 is a schematic diagram of a processing apparatus.
FIG. 5 is a schematic diagram of a microscopic image of a machining slit.
FIG. 6 is a graph showing the measurement result of reflectance.
[Explanation of symbols]
1 First material layer
2 Second material layer
3 Third material layer
L Laser light

Claims (14)

A first material layer that is at least transparent to laser light; a second material layer disposed in contact with the first material layer; and a third material layer disposed in contact with the second material layer; A structure constituted by: irradiating laser light from the direction of the first material layer, and forming only the second material layer in an arbitrary shape by high-speed vaporization of the second material layer. Laser processing method. 2. The laser processing method according to claim 1, wherein the first material layer is a transparent material. 2. The laser processing method according to claim 1, wherein both the first and third material layers are transparent materials. 4. The laser processing method according to claim 1, wherein at least one of the first material layer and the third material layer is an adhesive material layer. 5. The laser processing method according to claim 2, wherein the second material layer is a reflective film. 6. The laser processing method according to claim 5, wherein the second material layer is a metal thin film of 200 nm or less. The laser processing method according to claim 2, wherein the second material layer is a light absorption layer. The laser processing method according to claim 2, wherein the second material layer is a film that optically scatters. The laser processing system according to any one of claims 2 to 4, wherein the second material layer is any one of a dye material film, a fluorescent material film, a light emitting material film, and a daylight film. . The laser processing method according to claim 1, wherein the second material layer is a magnetic film. The laser processing method according to any one of claims 1 to 10, wherein a pulse width of the laser light is 200 ns or less. An optical encoder slit produced by the laser processing method according to any one of claims 1 to 9. A magnetic encoder slit produced by the laser processing method according to claim 10. The image display body formed by the laser processing system of any one of Claim 1 thru | or 9.

Images