JP2004202302A - Method and apparatus for recovering metal from printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To recover a metal from a scrap printed circuit board which is composed of plastics such as a glass fiber-reinforced epoxy resin or phenol resin and the metal, and is used in a telephone, a personal computer or a household electric appliance. <P>SOLUTION: The metal 10 is separated and recovered from the plastic 9 by cutting the scrap printed circuit board 1 in which the metal is stuck to the surface the plastic or the inside of the plastic layers, by using a rotary cutting edge 5 to make the metal 10 a spiral shaped pieces. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
[Technical field to which the present invention pertains]
The present invention relates to an apparatus for recovering a metal adhered between a printed circuit board and an interlayer thereof, and more particularly to a recovery apparatus and a method for recovering metal from a printed circuit board by cutting the printed circuit board.
[0002]
[Prior art]
2. Description of the Related Art In recent years, treatment of printed circuit boards, such as waste home appliances, waste printed boards, and waste mobile phones, which are discharged in large quantities, has become a social problem. Under such circumstances, there is a demand for the development of a technology that can recover valuable resources at low cost, and further recycles and recycles them.
[0003]
A metal is adhered to the surface of a printed circuit board or between layers, and used as a printed circuit board. When this printed circuit board is discarded, it is difficult to separate the metal and printed circuit board by conventional crushing or shearing because it is a plywood in which metal is bonded to thermosetting resin and glass fiber. Not expected. Therefore, at present, in addition to being incinerated or landfilled, recovery by dissolution and leaching of metal with an organic solvent is being studied. Further, attempts have been made to separate metal and glass fibers by a pulverizing operation (see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-10-94781 (paragraph 0005, FIG. 1)
[0005]
[Problems to be solved by the present invention]
As in the past, in the treatment of landfills and incineration, not only metals are not recovered, but also combustion gases and dust are diffused into the atmosphere by combustion, and heavy metals contained in incineration residues are dissolved in groundwater etc. over time. It is feared that secondary pollution will cause new environmental problems.
[0006]
At present, as a method of recovering metal from printed circuit boards, a solvent extraction method of dissolving a printed circuit board in an organic solvent and recovering metal is being studied as a chemical treatment method. Accompanied by the high cost, the collection cost is high.
[0007]
On the other hand, it has been attempted to separate metal and glass fiber by a crushing operation.In the crushing process, the bonding surface between the printed circuit board and the metal can be finely crushed by a processing method that uses impact, shear, compression, etc. It is impossible to peel off, and the printed board and the metal cannot always be separated.
[0008]
SUMMARY OF THE INVENTION The present inventor aims to solve the conventional problems, and relates to an apparatus and a method for recovering metal from a printed circuit board for mechanically cutting a printed circuit board. To be collected and processed.
[0009]
In the present invention, the metal is separated into plastic spiral strips so that the metal can be separated and recovered from the plastics. If there is a mixture of a metal foil and a printed circuit board that are entangled with each other, insert a separated metal spiral foil strip and plastics between two metal flat plates with rough surfaces and high resistance. Applying compressive and tensile forces, the adhesive surface between the metal and the plastics is peeled off, the metal is formed into a spiral with a strong curl, and the plastic is broken by brittle fracture and breaks into fine pieces. It is an object to realize a recovery method and a recovery device for separating and recovering the waste.
[0010]
[Means for Solving the Problems]
The present invention provides a method for cutting and recovering a metal adhered to plastics in a printed circuit board in order to solve the above-mentioned problem, wherein the printed board is helically cut by a transfer device. To a cutting device having a spiral cutting blade with the spiral cutting blade, the metal into a spiral foil strip, and the plastics into a strip of chips. The present invention provides a method for recovering metal from a printed circuit board, wherein the method separates the metal from the plastics.
[0011]
The present invention, in order to solve the above-mentioned problem, is a method of cutting, separating and collecting metal adhered to plastics in a printed circuit board, and the printed circuit board is transported by a transfer device to form a spiral on the surface. Feed to a cutting device having a cutting blade, with the spiral cutting blade, cut the printed circuit board into a spiral, metal into a spiral foil strip, the plastics into a strip-like Chips, the metal of the spiral foil strip and the strips of the plastics are fed between a fixed plate and a movable plate, and the movable plate is parallel to the fixed plate in front. By moving the metal and the plastics, the metal is pressed between the fixed flat plate and the movable flat plate, and the compression force and the tensile force generated at that time make the metal spiral with a strong curl, and the plastic is pressed. By fine with the box by brittle fracture, to provide a method of recovering metal the metal from the printed circuit board, characterized in that the separation from the plastics.
[0012]
It is good also as composition which blows on the above-mentioned metal and the above-mentioned plastics sent out from the above-mentioned fixed plate, and blows off the above-mentioned plastics and separates from metal.
[0013]
In order to solve the above-mentioned problems, the present invention comprises a separation device for spirally cutting metal bonded to plastics in a printed circuit board, and a separation device provided downstream of the separation device. A collecting device for separating and collecting the metal adhered to the plastics, wherein the separating device has a conveying device for conveying the printed circuit board and a spiral cutting blade on a surface for cutting the printed circuit board. A cutting device is provided, and the printed circuit board is cut, and the metal is turned into a spiral foil strip, and the plastics is turned into swarf-like chips. A movable flat plate parallel to the fixed flat plate and capable of reciprocating in the front-rear direction, wherein the metal of the spiral foil strip and the swarf chips of the plastics are movable with the fixed flat plate. The metal is further moved forward while pressing against the plate, and the compression and tension generated at that time make the metal even more helical with strong curl. A recovery device for recovering metal from a printed circuit board is provided.
[0014]
A blower that blows the metal and the plastics sent from the fixed flat plate to separate the plastics from the metal may be provided.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of a method and an apparatus for collecting metal from a printed circuit board according to the present invention will be described below based on examples with reference to the drawings.
[0016]
(Example 1)
FIG. 1 is a diagram illustrating a first embodiment of a method and an apparatus for recovering metal from a printed circuit board 1 according to the present invention. The recovery device according to the present invention has at least a separation device 2 whose overall configuration is shown in FIG. 1A, and this separation device 2 has a transport device 3 and a rotary cutting blade 5.
[0017]
The transport device 3 includes a supply-side and delivery-side fixed plate 4, an idling roller 6 provided between the supply-side and delivery-side fixed plate 4, and a drive unit along a linear transport path for transporting the printed circuit board 1. And a roller 7. A rotary cutting blade 5 is provided in the transport path of the transport device 3.
[0018]
The idling roller 6 is for rolling the printed circuit board 1 on the conveyance path, and the driving roller 7 is rotationally driven by a power source such as a motor, and is disposed on the idling roller 6 so as to face the printed circuit board 1. The roller is transported by being rotated between the idling rollers 6 and rotated.
[0019]
The rotary cutting blade 5 is disposed on the idling roller 6 so as to face the same. It has a cylindrical shape, and a helical blade 8 is formed on the surface thereof, as shown in FIG.
[0020]
The rotary cutting blade 5 is desirably a cutting blade similar to a milling machine. Kanna discs are used for surface finishing of wood, but the purpose cannot be achieved if different kinds of materials are mixed. Even with a planing machine, it is difficult to selectively spirally cut only the metal in the printed circuit board 1. That is, since the rotary cutting blade 5 needs to spirally cut the surface of the printed circuit board 1, the rotary cutting blade 5 is not a rotary blade provided with the cutting blade 5 parallel to the surface of the cylindrical body like a planer board. It is configured as a spiral rotary blade with an inclination of 20 to 35 degrees.
[0021]
A recovery method for separating and recovering the printed circuit board 1 from metal plastics is performed by using such a separation apparatus 2. The printed board 1 is placed on the supply-side fixed plate 4, transported by the idling roller 6 and the driving roller 7, and sent between the rotary cutting blade 5 and the idling roller 6. The rotary cutting blade 5 spirally cuts the surface (upper surface) of the printed circuit board 1 so as to peel it off.
[0022]
By mechanically cutting the surface of the printed circuit board 1 with the rotary cutting blade 5, the plastics 9 and the metal 10 are peeled off, respectively. Depends on cutting conditions such as rotation speed, feed speed, and cutting depth. Therefore, by controlling these cutting conditions, it is possible to control the state of each of the plastics 9 and the metal 10 after cutting, that is, the state of the chips.
[0023]
In the method for collecting metal from the printed circuit board 1 according to the present invention, the surface of the printed circuit board 1 is cut by the rotary cutting blade 5, the metal 10 is cut into a spiral foil strip, and the plastics 9 is stripped. Cut as chip-shaped chips. In this way, the small chips of the plastics 9 are removed by, for example, a sieve, and only the spiral foil strip of the metal 10 can be easily collected.
[0024]
Experimental example 1:
An experimental example of the first embodiment will be described. The printed board has plastics (thickness 1.6 mm) and a thin copper plate (thickness 0.01 mm) adhered to the surface of the board. The printed circuit board was cut at a rotation speed of a spiral rotary blade of 140 rpm, a cutting speed of 2 mm / s, and a cutting depth of 0.4 mm.
[0025]
As a result, the metal is spirally cut and can be easily separated from plastics. FIG. 3 shows experimental results showing a state in which the metal recovery rate changes by changing the feed speed and the cutting depth of the rotary cutting blade. According to FIG. 3, the feed speed of the rotary cutting blade is shown. By changing the cutting depth and the cutting depth, the metal recovery rate can be increased.
[0026]
Comparative Example 1:
In Example 1, the rotary cutting blade was changed to a non-helical cutting blade and the rotation speed, feed rate, and cutting depth were cut under the same conditions, but the same size of about several millimeters in a state where the metal and plastics were bonded. However, almost no separated state was observed.
[0027]
(Example 2)
The second embodiment is a collection method including a separation device for more reliably separating the helical foil strip of the metal 10 and the small chips of the plastics 9 cut by the separation device 2 of the first embodiment. And a recovery device. FIG. 2 relates to a sorting apparatus 11 used in the second embodiment.
[0028]
As shown in FIG. 2, the separation device 11 includes a raw material supply hopper 12 and a raw material supplied from the raw material supply hopper 12 (specifically, a helical foil strip of the metal 10 cut by the separation device 2). A fixed flat plate 13 for receiving strips of plastics 9), a movable flat plate 14 disposed on and in parallel with the fixed flat plate 13 so as to face the fixed flat plate 13, and a movable flat plate 14 disposed below a feed end of the fixed flat plate 13. The apparatus is provided with a container 15 for separating plastics and metal, and a blower 16 arranged toward the sending end of the fixed flat plate 13.
[0029]
The movable flat plate 14 is configured to be driven and movable in parallel with the fixed flat plate 13 in the longitudinal direction. The fixed flat plate 13 and the movable flat plate 14 are each formed with a file-shaped rough knurl 17 as shown in an enlarged view of a main part on inner surfaces opposed to each other, and the surface is rough, and the metal cut by the separation device 2 is a raw material. The resistance between the 10 spiral foil strips and the strips of plastics 9 is large.
[0030]
The fixed flat plate 13 and the movable flat plate 14 are arranged at an angle of about 25 to 30 degrees downward from the supply side on the raw material hopper 12 side toward the delivery side. Thereby, the chips to be processed fall while being processed naturally. The movable flat plate 14 reciprocates with respect to the fixed flat plate in a front-rear direction (left-right direction in FIG. 2) with a width of about 20 cm.
[0031]
Regarding the reciprocating operation of the movable flat plate 14, when moving forward (in the direction of arrow F in FIG. 2), the material can be moved while pressing the raw material against the fixed flat plate 13, and when moving backward (in the direction of arrow B). Has a configuration (for example, using a well-known movable mechanism such as a cam mechanism, a link mechanism, and a hydraulic mechanism) after moving in a direction (arrow S direction) away from the fixed flat plate 13. When the movable flat plate 14 moves forward, it is desirable to apply a load of, for example, about 300 to 600 g per 1 g of the raw material.
[0032]
In the case of recovering metal from the printed circuit board 1 according to the second embodiment, first, the surface of the printed circuit board 1 is cut using the separation device 2 of the first embodiment, and the spiral foil strip of the metal 10 and the plastic strip are removed. 9 are formed, and the mixed raw material is supplied from a raw material supply hopper 12 onto a fixed flat plate 13 of a sorting apparatus 11 shown in FIG. Then, the raw material is sent between the fixed flat plate 13 and the movable flat plate 14 by its own weight.
[0033]
Then, when the movable flat plate 14 moves forward in parallel while sandwiching and pressing chips against the fixed flat plate 13, the metal plate 10 acts to wind the raw material by the knurls 17 on the inner surfaces of the fixed flat plate 13 and the movable flat plate 14. The helical foil strip has a stronger curl spiral state (the helical state becomes stronger), and the strip-like chips of the plastics 9 become finer.
[0034]
As described above, the metal foil strip is pressed between the fixed flat plate 13 and the movable flat plate 14, and the metal foil strip is in a spiral state with a strong curl. It is transported toward the tip on the fixed flat plate 13. Then, it is dropped and discharged at the distal end outlets (right ends in FIG. 1) of the fixed flat plate 13 and the movable flat plate 14.
[0035]
At this time, air is blown from the front by the blower 16 to the foil strip of the metal 10 and the fine strip of the plastics 9 whose helical state has become stronger. Then, the fine strips of the plastics 9 are blown backward, and the foil strips of the metal 10 in which the helical state is strengthened are not blown off, so that they are separated into the respective compartments of the sorting container. As a result, the metal and the fine plastics can be separated from each other.
[0036]
Experimental Example 2:
Even if the waste printed circuit board of FIG. 4A is separated by the separation device of the first embodiment, as shown in FIG. 4B, the metal and the plastics are entangled and the separation is impossible. Was. When the material in this state was separated by the separation device 11 shown in Example 2, metal and plastic could be separated as shown in FIG. 4C.
[0037]
Comparative Example 2:
The sample of Comparative Example 1 was processed by the separation device 11 of Example 2 because it was not cut into a long spiral, but it was impossible to give a rotation amount to the sample with a unidirectional force, and the sample was separated. Could not be confirmed.
[0038]
From the experimental example 2 and the comparative example 2, the separation by the separation device 11 of the embodiment 2 is extremely effective for the metal that is cut long as a spiral foil strip using the separation device 2 of the embodiment 1. Was confirmed.
[0039]
Experimental example 3:
FIG. 5 is a view for explaining Experimental Example 3 of the present invention relating to processing of a waste copper substrate. In this experimental example 3, the waste copper substrate of FIG. 5A was separated by the separation device of Example 1, and as shown in FIG. Things were showing. When the material in this state was separated by the separation device 11 shown in Example 2, as shown in FIG. 5C, it could be separated into copper and plastics.
[0040]
As mentioned above, the method and the recovery apparatus for recovering metal from the printed circuit board according to the present invention have been described according to the embodiments. It goes without saying that there are various embodiments.
[0041]
【The invention's effect】
As described above, according to the present invention, the following effects are produced.
(1) The recovery method of the present invention does not require complicated steps such as coarse pulverization, medium pulverization, fine pulverization, heavy liquid separation, etc. as in the conventional method, and also requires a great deal of energy and large equipment. With a simple cutting process, plastics and metal can be easily separated from the printed circuit board by a simple sieve or wind power.
[0042]
(2) Conventionally, processing of a printed circuit board requires complicated steps and chemical processing, resulting in high costs. By applying the present invention, low-cost and large-scale treatment for waste disposal is expected, so that contribution to recycling technology can be expected. Furthermore, since no chemical treatment or combustion is required, the burden on the environment is reduced.
[0043]
According to the present invention, a metal in a printed circuit board and an epoxy resin or a phenol resin reinforced with glass fiber are simultaneously cut as a spiral foil strip. In this case, the metal has malleability and ductility. Spiral without breaking. Since epoxy resin and phenol resin reinforced with glass fiber are woven, they are easily broken even if they are cut in a spiral shape, so that the metal can be easily separated and recovered by utilizing this property.
[0044]
In the current situation where the processing of printed circuit boards, such as waste home appliances, waste printed circuit boards, and waste mobile phones, which are discharged in large quantities, is becoming a social problem, it will be possible to recover valuable resources at low cost. Contribute to the field of recycling technology.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a configuration of a first exemplary embodiment of the present invention.
FIG. 2 is a diagram illustrating a configuration of a second exemplary embodiment of the present invention.
FIG. 3 is a diagram for explaining experimental results of Experimental Example 1 of the present invention.
FIG. 4 is a diagram illustrating a second embodiment of the present invention.
FIG. 5 is a diagram illustrating Experimental Example 3 of the present invention.
[Explanation of symbols]
1 Printed circuit board
2 Separation device
3 Transport device
4 Sending side fixed plate
5 Rotary cutting blade
6 Idling rollers
7 Drive roller
8 Spiral blade
9 Plastics
10 Metal
11 Sorting device
12 Material supply hopper
13 fixed plate
14 movable plate
15 Sorting container
16 Blower
17 Giza

Claims (5)

A method of cutting and collecting metal bonded to plastics in a printed circuit board,
The printed circuit board is fed by a transfer device to a cutting device having a helical cutting blade on the surface, and the helical cutting blade is used to cut the printed circuit board into a spiral, thereby forming a metal spiral. A method of recovering metal from a printed circuit board, wherein the metal is separated from the plastics by forming the foil strip and the plastics into small chips. It is a method to cut, separate and collect the metal adhered to the plastics in the printed circuit board,
The printed circuit board is fed by a transfer device to a cutting device having a helical cutting blade on the surface, and the helical cutting blade is used to cut the printed circuit board into a spiral, thereby forming a metal spiral. Along with making a foil strip, the above-mentioned plastics is turned into small chips,
The metal of the spiral foil strip and the swarf-like chips of the plastics are fed between a fixed flat plate and a movable flat plate, and the movable flat plate is moved in front of and parallel to the fixed flat plate. The metal and the plastics are pressed between the fixed flat plate and the movable flat plate, and the compression force and the tensile force generated at that time make the metal strong curling spiral and the plastics are brittle. A method of recovering metal from a printed circuit board, wherein the metal is separated from the plastics by breaking the metal to be fine. 3. The method for recovering metal from a printed circuit board according to claim 2, wherein air is blown to said metal and said plastics sent out from said fixed flat plate, and said plastics is blown off to separate from said metal. A separating device for spirally cutting the metal adhered to the plastics in the printed circuit board; and a separating device provided downstream of the separating device, separating the metal adhered to the plastics in the printed circuit board. A collecting device for collecting
The separation device includes a transfer device for transferring the printed circuit board, and a cutting device having a helical cutting blade on a surface for cutting the printed circuit board. Along with making it into a foil strip, the above-mentioned plastics is made into strip-shaped chips,
The sorting apparatus includes a fixed flat plate, and a movable flat plate parallel to the fixed flat plate and reciprocally reciprocable in the front-rear direction.The metal of the helical foil strip and the sliver-shaped chips of the plastics are removed. The metal plate is moved forward while pressing between the fixed flat plate and the movable flat plate, and the metal is further curled by the compressive and tensile forces generated at that time. A recovery device for recovering metal from a printed circuit board, which is configured to be brittlely broken and made fine. 5. The method for recovering metal from a printed circuit board according to claim 4, further comprising a blower for blowing the metal and the plastics sent from the fixed flat plate to separate the plastics from the metal.

Images