JP2004194401A - Panel cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a Peltier panel cooling device for a panel having cooling performance significantly exceeding a conventional limit. <P>SOLUTION: This panel cooling device is the one which utilizes a Peltier element 3. Heat sinks 5, 6 with the Peltier element 3 on radiating side and heat absorbing side are of water-cooled construction, which improves cooling performance more significantly than conventional types. Cooling water is fed into a heat absorbing radiator 13 connected with the heat absorbing heat sink 6 to cool air in the panel with a cooling fan 15. Various types of modes, such as on-side installation type, on-ceiling installation type, and separately arranged type, are available. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel cooling device using a Peltier device.
[0002]
[Prior art]
[Patent Document 1] Japanese Unexamined Utility Model Application Publication No. 3-43739
The use of a Peltier element having a simple structure for cooling the inside of an electric / electronic equipment storage panel such as a switchboard, a distribution panel, or a communication panel has been conventionally known as shown in Patent Document 1 described above. I have. In this case, since the object to be cooled is the air inside the panel, it is usual to increase the cooling effect by flowing the air inside the panel using a fan to the heat sink on the heat absorption side of the Peltier element.
[0004]
The heat sink on the heat radiation side is also usually air-cooled, but in Patent Document 1 described above, the heat sink on the heat radiation side has a water-cooled structure to improve the heat radiation effect. This is because the amount of heat accompanying the work of the Peltier element itself is generated on the heat radiation side in addition to the amount of heat absorption, so that the amount of heat radiation needs to be larger than the amount of heat absorption.
[0005]
However, even with such a contrivance, the cooling capacity of the panel cooling device using the Peltier element has a certain limit, and the cooling capacity is mainly small. The reason is that it is not easy to improve the capability of the heat sink on the heat absorption side more than the present. That is, even if only the heat sink is unnecessarily increased in size relative to the size of the Peltier element, the heat resistance between the heat sink and the Peltier element is constant, so that it does not lead to an increase in the heat absorbing ability. For this reason, a compressor-type cooling device using a refrigerant is generally used when the amount of heat generated in the panel is large.
[0006]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems and to provide a Peltier-type panel cooling device having a cooling capacity far exceeding the conventional limit.
[0007]
[Means for Solving the Problems]
The board cooling device of the present invention made to solve the above-mentioned problem is a board cooling device using a Peltier element, wherein both the heat dissipation side and the heat sink on the heat dissipation side of the Peltier element have a water cooling structure, and the radiator heats the heat. It is characterized by being exchanged. In addition, it is preferable to arrange | position a cooling-water circulation pump which circulates cooling water to an endothermic radiator outside a board rather than the partition which divides a board inside ventilation path. Further, a pipe connection portion of a cooling water circulation path on the heat absorption side can be provided on the surface of the box of the panel cooling device.
[0008]
The cooling device for a board of the present invention is a conventional Peltier cooling device in which the heat sink on the heat dissipation side and the heat sink on the heat absorption side of the Peltier element both have a water-cooled structure and heat is exchanged by a radiator. Greatly exceeds the capacity limit of the above, and can have a large cooling capacity of up to 1000 W. In addition, since the heat sink has a water-cooled structure, the size of the device can be reduced. In addition, since a refrigerant such as chlorofluorocarbon is not required, the environment is not polluted at the time of disposal. Hereinafter, preferred embodiments of the present invention will be described.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
The panel cooling device according to the first embodiment is used by being attached to a side surface of a panel, and FIG. 1 is a configuration diagram of the apparatus. Reference numeral 1 denotes a box of the cooling device, and reference numeral 2 denotes a partition for partitioning an in-panel air ventilation path therein. A Peltier unit 3 having a Peltier element 4 is attached to the partition 2. Since the Peltier unit 3 is arranged on the inner partition wall in this manner, there is no problem in removing the side plate of the box 1 at the time of internal maintenance.
[0010]
In the Peltier unit 3 used in the present invention, as shown in FIG. 2, both the heat sink 5 on the heat radiation side and the heat sink 6 on the heat absorption side sandwiching the Peltier element 4 in a sandwich shape have a water cooling structure. In FIG. 2A, there is one heat sink 5 on the heat radiation side and one heat sink 6 on the heat absorption side, and water as a working fluid flows inside. However, as shown in (B), the number of heat sinks 5 on the heat radiation side may be two or two or more as shown in (C). In the structure (C), the cooling water can flow in a zigzag shape as shown in the figure. Since the water-cooled heat sink is compact, it can be stacked in this manner, and a small and large cooling capacity can be obtained.
[0011]
In the embodiment shown in FIG. 1, a Peltier unit 3 having the structure shown in FIG. 1C is shown. The heat sink 5 on the heat radiation side is connected to a heat radiation radiator 9 via a circulation pump 7 on the heat radiation side and a heat radiation tank 8, and the cooling water radiates heat generated on the heat radiation side of the Peltier unit 3 while circulating through this path. The radiator 9 is moved to the radiator 9 and is discharged to the outside by being put on the airflow by the heat radiation fan 10.
[0012]
On the other hand, in this embodiment, the heat-absorbing side adopts a double circulation structure, and the cooling water flowing through the heat-absorbing side heat sink 6 is cooled by the circulation pump 11 on the heat-absorbing side through the cooling tank 12 first. Further, another cooling water circulation path including another heat absorption side circulation pump 14 is formed between the cooling tank 12 and the heat absorption radiator 13. Cooling fan 15 arranged on the back of heat-absorbing radiator 13 blows cool air into the panel to cool the panel. Thus, when a separate heat absorbing circulating pump 14 is used in a separate type, which will be described later, the size of the circulating pump 14 can be increased. If a heat storage material is put in the cooling tank 12, even if the operations of the Peltier element 4 and the circulation pumps 7 and 11 are stopped, the cooling can be performed for a certain time only by the operation of the circulation pump 14. In addition, if the operation of the circulation pump 14 is stopped and the Peltier element 4 and the circulation pumps 7 and 11 are operated with a small amount of power to cool the hydraulic fluid in the cooling tank 12, the hydraulic fluid is efficiently cooled. Can be. Thereafter, if the circulating pump 14 is operated, cooling can be performed for a certain period of time without operating the Peltier element 4 and the circulating pumps 7 and 11, and if the Peltier element 4 and the circulating pumps 7 and 11 are operated together, temporary cooling is performed. Ability can be increased.
[0013]
As described above, in the present invention, since the heat sinks 5 and 6 on the heat radiation side and the heat absorption side of the Peltier element 4 are both water-cooled, the heat absorption capacity of the heat sink 5 on the heat absorption side can be greatly increased as compared with the conventional air-cooled heat sink. Can be. For this reason, the cooling capacity of the panel cooling device can be easily increased to about the same level as that of the compressor type, although the small capacity has conventionally been mainly used. In this embodiment, the heat radiation tank 8 and the cooling tank 12 are provided, but these tanks can be omitted. In cold regions, it is preferable to mix antifreeze into cooling water.
[0014]
FIG. 3 et seq. Shows a more specific structure. 3 is a perspective view of the side-mounted type cooling device for a panel as viewed from the outside of the panel, FIG. 4 is a perspective view of the panel mounting surface 16 side, FIG. 5 is a plan view, and FIG. FIG. FIG. 7 is a side view with the side cover 17 removed.
[0015]
As shown in FIG. 5, FIG. 6, and FIG. 7, the partition wall 2 that partitions the air passage in the panel is sandwiched between an upper partition plate 21 and a lower partition plate 18 to form a panel inner space 24 in the box 1. As shown in FIG. 6, a Peltier unit 3 is arranged at the center of the partition 2. A radiating tank 8 and a cooling tank 12 are arranged at the bottom of the box 1 via appropriate heat insulating means. Further, a circulating pump 11 on the heat absorbing side and a circulating pump 7 on the radiating side are arranged at the lower part of the box 1. Is provided with a lower partition plate 18 so that a space 24 inside the panel in the box is reduced. Since the heat absorption side circulating pump 11 is disposed outside the panel than the partition wall 2 that partitions the air passage in the panel, in other words, it is disposed outside the panel inside space 24 in the box 1, The risk of water entering inside the panel in which the electrical and electronic equipment causing the intrusion of water causes a failure is reduced. In addition, the heat generated by the operation of the pump can be cut off from the heat absorption side, and maintenance can be easily performed.
[0016]
Then, a power supply / control unit 22 is disposed above the upper partition plate 21 in the box 1. This is because even if a water leak occurs, there is no possibility that the power supply / control unit 22 is exposed to water, and the heat generated by the power supply does not affect the heat absorption. As described above, the partition wall 2 for partitioning the ventilation passage in the panel has a structure sandwiched between the upper partition plate 21 and the lower partition plate 18, so that the panel inner space 24 can be a minimum closed space adapted to the fan and the radiator. The loss is small by ventilating the air. Also, the upper and lower spaces can be used effectively.
[0017]
If the suction port of the pump is lower than the water level of the tank, an inexpensive non-self-contained pump can be used. However, since a non-self-contained pump cannot operate if air is mixed in the circulation path, it is preferable to provide an air vent hose (not shown) in the tank. In addition, it is preferable to provide a water injection port on the surface of the box 1 so that it can be shipped empty from the factory and used after pouring water after installation. By doing so, there is no water when the product is shipped, so it can be transported lightly and there is no danger of water leakage.
[0018]
As shown in FIGS. 4 and 5, the heat absorbing radiator 13 is disposed at a position near the mounting surface 16 to the board, and the cooling fan 15 sucks air in the board from the opening 19 shown in FIG. After cooling with the radiator 13, it is circulated in the panel. In order to give the heat radiation radiator 9 a larger heat radiation capability, two units are installed in parallel so that the capacity is about twice as large as the heat absorption side as shown in FIGS. Dissipates heat to the outside. The outside air intake 20 for that purpose is formed on the two side surfaces of the box 1 as shown in FIG. 5, so that a large amount of air can be easily taken in. Further, the heat radiation radiator 9 and the heat absorption radiator 13 are both vertically long and narrow, so that the installation space of the box 1 is reduced.
[0019]
FIG. 8 shows a second embodiment of a ceiling-mounted type. The device configuration is almost the same as that of the above-described embodiment, and the corresponding portions are denoted by the same reference numerals and description thereof is omitted. FIG. 9 shows a specific device configuration.
[0020]
FIG. 10 shows a panel cooling device according to the third embodiment. In the first and second embodiments, the whole is housed in a single box 1, but in the third embodiment, the endothermic radiator 13 is replaced with other parts. And the box 1 is attached to a board and the box 1 is a separate type. On the surface of the box 1, a pipe connection portion 23 of a cooling water circulation path on the heat absorption side is provided. In this case, a plurality of panels can be cooled by using a plurality of heat absorbing radiators 13. Usually, the cooling operation of the two panels is performed, and if necessary, the supply of the cooling water to one of the endothermic radiators 13 is stopped, so that the operation can be switched so that the remaining panels are intensively cooled. it can.
[0021]
【The invention's effect】
As described above, since the heat sink on the heat dissipation side and the heat sink on the heat absorption side of the Peltier element are both water-cooled and exchange heat with the radiator as described above, the cooling capacity for the heat sink on the heat absorption side is limited. It is possible to provide a cooling capacity that greatly exceeds the conventional capacity. In addition, since the heat sink has a water-cooled structure, the size of the device can be reduced, and unlike the cooling device of the refrigerant type, no refrigerant such as chlorofluorocarbon is required, so that the environment is not polluted even when the device is discarded.
[Brief description of the drawings]
FIG. 1 is a device configuration diagram of a first embodiment.
FIG. 2 is a structural diagram of a Peltier unit.
FIG. 3 is a perspective view of the cooling device for a panel as viewed from the outside of the panel.
FIG. 4 is a perspective view of the cooling device for a panel as viewed from a surface on which the panel is attached to the panel.
FIG. 5 is a plan view of the panel cooling device.
FIG. 6 is a front view with a side cover removed.
FIG. 7 is a side view with a side cover removed.
FIG. 8 is a device configuration diagram showing a second embodiment.
FIG. 9 is a sectional view showing a specific device configuration.
FIG. 10 is a device configuration diagram of a third embodiment.
[Explanation of symbols]
1 Box 2 Partition wall 3 Peltier unit 4 Peltier element 5 Heat sink 6 Heat sink 7 Heat sink 7 Circulation pump 8 Heat sink 9 Heat dissipation radiator 10 Heat dissipation fan 11 Circulation pump 12 Cooling tank 13 Heat absorption radiator 14 Circulation pump 15 Cooling fan 16 Mounting surface 17 Side cover 18 Lower partition plate 19 Opening 20 Outside air intake 21 Upper partition plate 22 Power supply / control unit 23 Pipe connection unit 24 Inside space of panel

Claims (3)

A cooling device for a board using a Peltier element, wherein both the heat sink on the heat radiation side and the heat sink on the heat absorbing side of the Peltier element have a water cooling structure, and heat is exchanged by a radiator. 2. The cooling device for a panel according to claim 1, wherein a circulation pump for circulating the cooling water through the endothermic radiator is disposed outside the panel from a partition partitioning a ventilation path inside the panel. The panel cooling device according to claim 1, wherein a pipe connection portion of a cooling water circulation path on the heat absorption side is provided on a surface of the box of the panel cooling device.

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