JP2004186326A - Installation structure of shielding case for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and reliably fix an electronic component stored in a shielding case, and to reduce the size and mounting area of the shielding case. <P>SOLUTION: By bending claw sections 23a-23d of the shielding case 12 and fitting them into concave sections 13a-13d of an infrared communication module 11, the infrared communication module 11 stored in the shielding case 12 can be easily and reliably fixed. When the claw sections 23a and 23d are fitted into the concave sections 13a and 13d, they are brought into contact with conductor patterns 16a and 16d connected to an earth point of the infrared communication module 11, thus connecting the shielding case 12 to the earth point of the infrared communication module 11. Since the claw sections 23a and 23d of the shielding case 12 are bent inwards, the mounting area of the shielding case 12 does not spread exceptionally. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a shield case mounting structure for electronic components.
[0002]
[Prior art]
As a shield case of an electronic component, for example, there is a shield case described in Patent Document 1. Here, the infrared communication module 101 is accommodated in a shield case 102 as shown in FIG. The infrared communication module 101 is sealed with a mold resin 103, and has two lenses 104 for transmitting and receiving optical signals on its upper surface. The shield case 102 is a housing whose bottom is open and has an upper plate 105 and side plates 106, 107, 108, and 109. Two holes 105a are formed in the upper plate 105, and hold-down portions 107a and 109a are provided in the side plates 107 and 109, respectively.
[0003]
After the adhesive 110 is applied to the back surface of the upper plate 105 of the shield case 102, the infrared communication module 101 is housed in the shield case 102 as shown in FIG. It is made to protrude from each hole 105a of the upper plate 105 of the shield case 102. After that, the infrared communication module 101 and the shield case 102 are heated in an oven to cure the adhesive 110.
[0004]
[Patent Document 1]
JP-A-2001-185751
[Problems to be solved by the invention]
However, when the infrared communication module 101 and the shield case 102 are fixed by using an adhesive as in the above-described conventional case, variations in the amount and position of application of the adhesive, the heating temperature and the heating for curing the adhesive, and the like. Adhesive strength was not stabilized due to variations in time. In addition, the number of steps is large, such as application of an adhesive, mounting of a shield case, and curing of the adhesive, so that the cost cannot be reduced.
[0006]
Further, since the respective hold-down portions 107a and 109a of the shield case 102 are provided, the size of the shield case 102 is increased. Further, as shown in FIG. 6B, not only the respective conductor patterns 111 for soldering the respective terminals of the infrared communication module 101 but also the respective hold-down portions of the shield case 102 are mounted on the mounting board of the infrared communication module 101. Since each conductor pattern 112 for soldering 107a and 109a is provided, the mounting area of the shield case 102 indicated by a dotted line is widened.
[0007]
In view of the above, the present invention has been made in view of the above-described conventional problems, and can easily and reliably fix an electronic component housed in a shield case, and can reduce the size of the shield case and the mounting area. It is an object of the present invention to provide a shield case mounting structure for an electronic component capable of performing the following.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a shield case mounting structure for an electronic component according to the present invention includes a plurality of cuts formed in an edge of the shield case, a claw portion formed between the cuts, and a concave portion formed in an outer peripheral edge of a bottom of the electronic component. Is formed, and the claw portion of the shield case accommodating the electronic component is bent, and the claw portion is fitted into the concave portion on the outer peripheral edge of the bottom of the electronic component.
[0009]
According to the present invention having such a configuration, the claw portion of the shield case accommodating the electronic component is bent, and the claw portion is fitted into the recess at the outer peripheral edge of the bottom of the electronic component. Thus, the electronic components housed in the shield case can be easily and reliably fixed.
[0010]
Further, in the present invention, the conductor pattern is formed in the concave portion on the outer peripheral edge of the bottom of the electronic component, the conductor pattern is connected to the ground point of the electronic component, and the claws of the shield case are brought into contact with the conductor pattern.
[0011]
In this case, the claw portion of the shield case can be fitted into the concave portion on the outer peripheral edge of the bottom of the electronic component, and at the same time, the shield case can be connected to the ground point of the electronic component.
[0012]
Further, in the present invention, an infrared communication module is applied as an electronic component, and the shield case is mounted on the mounting board so that the optical axis of the infrared communication module is perpendicular or horizontal to the mounting board.
[0013]
Thereby, the infrared communication module is directed in an appropriate direction with respect to the mounting board.
[0014]
In the present invention, the claws of the shield case are soldered to the conductor patterns of the mounting board.
[0015]
If the claws of the shield case are soldered to the mounting board of the electronic component in this manner, the shield case and the electronic component can be securely fixed to the mounting board. Therefore, unlike the conventional case, it is not necessary to provide a hold-down portion in the shield case, and the size of the shield case can be reduced and the mounting area of electronic components can be reduced.
[0016]
Further, in the present invention, a multilayer substrate is applied as a substrate of the electronic component, and a concave portion is formed on an outer peripheral edge of a bottom of the electronic component by cutting out a substrate outside the multilayer substrate. Then, a conductor pattern is formed on the other substrate in contact with the outer substrate at a portion where the outer substrate of the multilayer substrate is cut, and the conductor pattern is connected to a ground point of the multilayer substrate, and a claw of the shield case is formed. The part is in contact with the conductor pattern.
[0017]
When a multilayer substrate is used in this way, a recess can be formed in the outer peripheral edge of the bottom of the electronic component by notching the substrate outside the multilayer substrate. In addition, if a conductor pattern is formed on another substrate in contact with the outer substrate at a portion where the outer substrate of the multilayer substrate is cut off, and the conductor pattern is connected to a ground point of the multilayer substrate, a shield is provided. The shield case can be connected to the ground point of the multilayer substrate at the same time as the claw portion of the case is fitted into the recess at the outer peripheral edge of the bottom of the electronic component.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0019]
FIGS. 1A and 1B are perspective views showing an electronic component and a shield case in one embodiment of a shield case mounting structure of the present invention.
[0020]
In the present embodiment, an infrared communication module 11 is applied as an electronic component, and the infrared communication module 11 is housed in a shield case 12. The infrared communication module 11 is sealed with a mold resin 13, has terminals 14 on its bottom surface, and has two lenses 15 (shown in FIG. 3) for transmitting and receiving optical signals on its upper surface. . Four concave portions 13a, 13b, 13c, 13d are formed on the outer peripheral edge of the bottom of the mold resin 13 by counterbore processing. In the two concave portions 13a and 13d, respective conductor patterns 16a and 16d are formed. These conductor patterns 16a and 16d are connected to a ground point of a circuit built in the infrared communication module 11.
[0021]
The shield case 12 is a housing whose bottom is open, and has an upper plate 17 and side plates 18, 19, 20, 21. Two holes 17a are formed in the upper plate 17, and a plurality of sets of cuts 22 are made in each of the side plates 19, 20, 21 to form four trapezoidal claws 23a, 23b, 23c, 23d.
[0022]
FIG. 2 is a perspective view showing a state where the infrared communication module 11 is housed in the shield case 12. FIGS. 3A, 3B, and 3C are a bottom view, a front view, and a side view showing a state in which the infrared communication module 11 is housed in the shield case 12. FIG.
[0023]
As is clear from FIGS. 2 and 3, the infrared communication module 11 is accommodated in the shield case 12, and each lens 15 of the infrared communication module 11 is projected from each hole 17 a of the upper plate 17 of the shield case 12. Then, the claws 23a, 23b, 23c, 23d of the shield case 12 are bent and fitted into the recesses 13a, 13b, 13c, 13d of the infrared communication module 11, and the two claws 23a, 23d are connected to the recesses 13a, 13d. To the conductor patterns 16a and 16d.
[0024]
Since the claws 23a to 23d of the shield case 12 are bent and fitted into the recesses 13a to 13d of the infrared communication module 11, the infrared communication module 11 accommodated in the shield case 12 is easily and securely fixed. can do.
[0025]
Also, since the conductor patterns 16a, 16d connected to the ground point of the infrared communication module 11 are formed in the recesses 13a, 13d, the claw portions 23a, 23d and the conductor patterns 16a, 16d of the recesses 13a, 13d are formed. , The shield case 12 can be connected to the ground point of the infrared communication module 11.
[0026]
FIG. 6A shows a pattern of a mounting board on which the infrared communication module 11 and the shield case 12 are mounted. In this mounting board, each conductor pattern 24 to be soldered to each terminal 14 on the bottom surface of the infrared communication module 11 and each conductor pattern 25 to be soldered to each claw 23a, 23d of the shield case 12 are formed. . Therefore, when the infrared communication module 11 and the shield case 12 are mounted on the mounting board, the direction of each lens 15 of the infrared communication module 11, that is, the direction of the optical axis is perpendicular to the mounting board.
[0027]
Each conductor pattern 25 is connected to a ground point on the mounting board. Therefore, when the claws 23a and 23d of the shield case 12 are soldered to the conductor patterns 25, the ground points of the shield case 12 and the infrared communication module 11 are connected to the ground point of the mounting board.
[0028]
Further, since the claws 23a and 23d of the shield case 12 are bent inward, the respective conductor patterns 25 are accommodated inside the respective side plates 18 to 21 of the shield case 12, and the mounting area indicated by the dotted line of the shield case 12 is exceptional. Never spread.
[0029]
On the other hand, in the mounting substrate on which the conventional infrared communication module and the shield case are mounted as shown in FIG. 6B, since each hold-down portion of the shield case is bent outward, it is necessary to solder each hold-down portion. Are located outside the respective side plates of the shield case, and the mounting area indicated by the dotted line of the shield case is increased.
[0030]
FIG. 4 shows a modification of the infrared communication module. The infrared communication module 11A includes the multilayer substrate 31, and the recesses 32a, 32b, 32c, and 32d are formed by cutting out a plurality of portions of the outer substrate 31a of the multilayer substrate 31. In addition, conductor patterns 33a and 33d are formed on the inner substrate 31b of the multilayer substrate 31 at the positions of the recesses 32a and 32d. These conductor patterns 33a and 33d are connected to a ground point of a circuit built in the infrared communication module 11A.
[0031]
Similarly to the infrared communication module 11, the infrared communication module 11A is also housed in the shield case 12, and is fixed by fitting the claws 23a to 23d of the shield case 12 into the recesses 32a to 32d of the infrared communication module 11A. Is done. At the same time, the two claws 23a and 23d come into contact with the conductor patterns 33a and 33d of the recesses 32a and 32d, and the shield case 12 is connected to the ground point of the infrared communication module 11A.
[0032]
Even when the infrared communication module 11A is mounted on the mounting board, the direction of the optical axis of the infrared communication module 11A is perpendicular to the mounting board, similarly to the infrared communication module 11. In addition, the ground point of the infrared communication module 11 is connected to the ground point of the mounting board together with the claws 23a and 23d of the shield case 12, and the claws 23a and 23d of the shield case 12 are further bent inward. The mounting area of the case 12 is not particularly widened.
[0033]
Note that the present invention is not limited to the above-described embodiment, and can be variously modified. For example, the shape, number, position, and the like of the concave portion of the infrared communication module and the claw portion of the shield case may be appropriately changed. Further, the structures of the infrared communication module and the shield case may be changed so that the optical axis of the infrared communication module is horizontal to the mounting board. Further, the present invention can be applied not only to the infrared communication module, but also to any kind of electronic components housed in the shield case.
[0034]
【The invention's effect】
As described above, according to the present invention, the claws of the shield case accommodating the electronic component are bent, and the claws are fitted into the recesses on the outer peripheral edge of the bottom of the electronic component. Thus, the electronic components housed in the shield case can be easily and reliably fixed. Further, since no adhesive is used unlike the conventional case, the number of steps is small, and the cost can be reduced. In addition, reliability can be improved without occurrence of defective appearance due to protrusion of the adhesive.
[0035]
In addition, since the conductor pattern is formed in the recess at the bottom outer peripheral edge of the electronic component and the conductor pattern is connected to the ground point of the electronic component, the claw portion of the shield case is fitted into the recess at the bottom outer peripheral edge of the electronic component. At the same time, the shield case can be connected to the ground point of the electronic component.
[0036]
Further, since the claws of the shield case are soldered to the mounting board of the electronic component, the shield case and the electronic component can be securely fixed to the mounting board. For this reason, it is not necessary to provide a hold-down portion in the shield case as in the conventional case, and it is possible to achieve a reduction in the size of the shield case and a reduction in the mounting area of the electronic components. Can be achieved.
[Brief description of the drawings]
FIGS. 1A and 1B are perspective views showing an electronic component and a shield case in one embodiment of a shield case mounting structure of the present invention.
FIG. 2 is a perspective view showing a state where the infrared communication module and the shield case of FIG. 1 are assembled.
FIGS. 3A, 3B, and 3C are a bottom view, a front view, and a side view showing a state where the infrared communication module and the shield case are assembled.
FIG. 4 is a perspective view showing a modification of the infrared communication module of FIG. 1;
FIG. 5A is a perspective view showing a conventional infrared communication module and a shield case, and FIG. 5B is a perspective view showing a state where the infrared communication module is housed in a shield case.
6A is a plan view showing a conductor pattern of a mounting board of the infrared communication module and the shield case of FIG. 1, and FIG. 6B is a plan view showing a conductor pattern of a mounting board of the infrared communication module and the shield case of FIG. FIG.
[Explanation of symbols]
11, 11A Infrared communication module 12 Shield case 13 Mold resin 13a, 13b, 13c, 13d, 32a, 32b, 32c, 32d Recess 14 Terminal 15 Lens 16a, 16d, 24, 25, 33a, 33d Conductive pattern 17 Upper plate 18, 19, 20, 21 Side plate 22 Cuts 23a, 23b, 23c, 23d Claw portion 31 Multilayer substrate

Claims (6)

A plurality of cuts are made in the edge of the shield case, claw portions are formed between the cuts, a concave portion is formed in the outer peripheral edge of the bottom of the electronic component, and the claw portion of the shield case containing the electronic component is bent to form a claw portion. The electronic component is mounted in a recess at the outer peripheral edge of the bottom of the electronic component. 2. The electronic device according to claim 1, wherein the conductive pattern is formed in a concave portion on the outer peripheral edge of the bottom of the electronic component, the conductive pattern is connected to a ground point of the electronic component, and a claw portion of the shield case is brought into contact with the conductive pattern. The mounting structure of the electronic component shield case. The electronic device according to claim 1, wherein an infrared communication module is applied as the electronic component, and a shield case is mounted on the mounting substrate such that an optical axis of the infrared communication module is perpendicular or horizontal to the mounting substrate. Shield case mounting structure for parts. 2. The structure according to claim 1, wherein the claws of the shield case are soldered to the conductor pattern of the mounting board. 2. The mounting of a shield case for an electronic component according to claim 1, wherein a multilayer substrate is applied as a substrate of the electronic component, and a concave portion is formed on an outer peripheral edge of a bottom of the electronic component by cutting out a substrate outside the multilayer substrate. Construction. A conductor pattern is formed on the other substrate in contact with the outer substrate at a portion where the outer substrate of the multilayer substrate is cut out, the conductor pattern is connected to a ground point of the multilayer substrate, and a claw portion of the shield case is formed. 6. The structure according to claim 5, wherein the conductive case is in contact with the conductive pattern.

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