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JP2004153427A - Crystal oscillator for surface mounting - Google Patents

Crystal oscillator for surface mounting Download PDF

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Publication number
JP2004153427A
JP2004153427A JP2002314572A JP2002314572A JP2004153427A JP 2004153427 A JP2004153427 A JP 2004153427A JP 2002314572 A JP2002314572 A JP 2002314572A JP 2002314572 A JP2002314572 A JP 2002314572A JP 2004153427 A JP2004153427 A JP 2004153427A
Authority
JP
Japan
Prior art keywords
circuit pattern
column
crystal unit
mounting
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002314572A
Other languages
Japanese (ja)
Inventor
Yasuo Sakaba
泰男 酒葉
Shoichi Nishiwaki
正一 西脇
Manabu Ito
学 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2002314572A priority Critical patent/JP2004153427A/en
Publication of JP2004153427A publication Critical patent/JP2004153427A/en
Pending legal-status Critical Current

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Abstract

【目的】水晶振動子の裏面に接合する実装基板への回路パターンの形成を容易にして、生産性を高めた表面実装発振器を提供する。
【構成】水晶振動子の底面4角部に柱体を有し、前記水晶振動子の底面又は前記柱体に接続した実装基板に回路パターンが形成され、前記回路パターンに少なくともICチップを含む回路素子を配設してなる表面実装用の水晶発振器において、前記回路パターンが形成された後、前記柱体を金属として別個に接続した構成とする。前記金属は円柱とする。
【選択図】図1
An object of the present invention is to provide a surface-mounted oscillator which facilitates formation of a circuit pattern on a mounting substrate to be bonded to a back surface of a crystal unit, thereby improving productivity.
A circuit having a column at four corners of a bottom surface of a crystal unit, a circuit pattern formed on a bottom surface of the crystal unit or a mounting board connected to the column, and the circuit pattern including at least an IC chip. In the crystal oscillator for surface mounting having the elements arranged, the column is separately connected as a metal after the circuit pattern is formed. The metal is a column.
[Selection diagram] Fig. 1

Description

【0001】
【発明の属する技術分野】
本発明は表面実装用の水晶発振器(以下、表面実装発振器とする)を産業上の技術分野とし、小型化を促進した表面実装発振器に関する。
【0002】
【従来の技術】
【特許文献1】特開2000−299611
【0003】
(発明の背景)表面実装発振器は小型・軽量であることから、特に携帯用の電子機器に周波数や時間の基準源として広く採用されている。近年では、ますますの小型化が進行し、さらなる開発段階にある。
【0004】
(従来技術の一例)第3図は一従来例を説明する表面実装発振器の分解組立図である。
表面実装発振器は水晶振動子1と実装基板2とからなる。水晶振動子1は積層セラミックからなる容器本体3内に図示しない水晶片を収容して金属カバー4を被せ、密閉封入してなる。容器本体3は積層セラミックからなり、底面の4角部に外部端子(未図示)を有する。外部端子は例えば水晶片と電気的に接続した一対の水晶端子を一組の対角部に、金属カバー4と接続したアース端子を他組の対角部に有する。
【0005】
実装基板2は平板2aの4角に一体的に焼成によって形成した柱体5を有する積層セラミックからなる。柱体5の先端表面には外部端子と対応した外部受け端子(未図示)を有する。そして、平板2a表面には図示しない回路パターンが形成され、水晶片とともに発振回路等を構成するICチップ6及びコンデンサ7等の回路素子を収容する。平板2aの底面4角部には実装端子を有する。そして、水晶振動子1の外部端子と実装基板2の外部受け端子とを半田等によって接続して表面実装発振器を形成する。
【0006】
あるいは、第4図に示したように水晶振動子1の容器本体3の底面4角部に柱体5を焼成によって一体的に形成して、回路パターンを形成する。柱体5の先端表面には回路パターンが接続した実装端子を有する。そして、回路パターンにICチップ6を含む回路素子を配設した構成とする。このようなものでは、実装基板2あるいは水晶振動子1の4角部に柱体5を設けるので、平板2a面積を大きくして複数の回路素子を配設できる。
【0007】
【発明が解決しようとする課題】
(従来技術の問題点)しかしながら、上記構成の表面実装発振器では実装基板2の表面あるいは水晶振動子1の底面には回路パターンを形成する必要がある。一般には、印刷によって導電体を塗布し、セラミック生地とともに一体的に焼成される。しかし、平面外形がさらに小さくなると、柱体5が障害となって回路パターンへの印刷が困難になる。そして、断線等を含めて正確な回路パターンが形成できない場合には、表面実装発振器として機能せず、生産性を低下する問題があった。
【0008】
(発明の目的)本発明は実装基板への回路パターンの形成を容易にして、生産性を高めた表面実装発振器を提供することを目的とする。
【0009】
【課題を解決するための手段】
本発明は、水晶振動子の底面4角部に柱体を有し、前記水晶振動子の底面又は前記柱体に接続した実装基板に回路パターンが形成され、前記回路パターンに少なくともICチップ6を含む回路素子を配設してなる表面実装用の水晶発振器において、前記回路パターンが形成された後、前記柱体5を金属として別個に接続した構成とする。また、金属を円柱とする。
【0010】
これにより、平面状とした水晶振動子の底面又は実装基板の表面に回路パターンを形成できるので、回路パターンの形成を容易にする。そして、柱体を金属の円柱とするので、位置ズレを防止する。以下、本発明の一実施例を防止する。
【0011】
【実施例】
第1図は本発明の一実施例を説明する表面実装発振器の図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。
表面実装発振器は前述したように底面4角部に外部端子を有する水晶振動子1の底面に柱体5を有する実装基板2を接合してなる。この実施例では実装基板2はセラミックからなる平板2aと金属からなる円柱8からなる。
【0012】
このようなものでは、先ず、平板2aの表面に印刷による回路パターンを形成した後、半田等によって金属円柱8を4角部の図示しない端子に接続する。次に、少なくともICチップ6及びコンデンサ等の回路素子を配設する。あるいは、回路素子を配設した後、金属円柱8を接続する。最後に、実装基板2の金属円柱8を水晶振動子1の底面4角部の外部端子に接合する。なお、金属円柱8を水晶振動子1の底面に接合した後、実装基板2に接続してもよい。
【0013】
このような構成であれば、実装基板自体は平板2aとするので、マスクをかけてのスクリーン印刷法による回路パターンの印刷を容易にする。したがって、表面実装発振器の生産性を向上する。また、柱体を円柱8とするので、接続する際の方向性がなく接続作業を容易にする。
【0014】
【他の事項】
上記実施例では金属円柱8は実装基板2に設けたが、水晶振動子1の容器本体3に回路素子と接続する回路パターンを形成して4角部に金属円柱8を設けてもよい。この場合でも、実施例同様に回路パターンの印刷を容易にして生産性を高められる。なお、柱体は円柱8としたが、基本的には角柱としてもよい。また、柱体は金属としたが例えば絶縁体の表面や内部に導電路を有する実質的な導通体を含む。さらには、実装基板2はセラミックとしたが、ガラスエポキシ等であってもよい。
【0015】
【発明の効果】
本発明は、水晶振動子1の底面あるいは実装基板2に回路パターンを形成して4角部に柱体を設けたので、回路パターンの形成を容易にして生産性をたかめることができる。
【図面の簡単な説明】
【図1】本発明の一実施例を説明する表面実装発振器の組立分解図である。
【図2】本発明の他の実施例を説明する表面実装発振器の組立分解図である。
【図3】従来例を説明する表面実装発振器の組立分解図である。
【図4】他の従来例を説明する表面実装発振器の組立分解図である。
【符号の説明】
1 水晶振動子、2 実装基板、3 容器本体、4 カバー、5 柱体、6 ICチップ、7 コンデンサ、8 円柱.
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a crystal oscillator for surface mounting (hereinafter, referred to as a surface mounting oscillator) as an industrial technical field, and relates to a surface mounting oscillator that has been downsized.
[0002]
[Prior art]
[Patent Document 1] JP-A-2000-296611
[0003]
BACKGROUND OF THE INVENTION Surface mount oscillators are widely used as frequency and time reference sources, especially in portable electronic equipment, because of their small size and light weight. In recent years, further miniaturization has progressed and is in a further development stage.
[0004]
(Example of Prior Art) FIG. 3 is an exploded view of a surface mount oscillator for explaining a conventional example.
The surface mount oscillator includes a crystal unit 1 and a mounting substrate 2. The crystal unit 1 is formed by enclosing a crystal piece (not shown) in a container body 3 made of a laminated ceramic, covering the metal cover 4, and hermetically sealing. The container body 3 is made of a laminated ceramic and has external terminals (not shown) at the four corners on the bottom surface. The external terminals have, for example, a pair of crystal terminals electrically connected to a crystal blank at one set of diagonal portions and an earth terminal connected to the metal cover 4 at another set of diagonal portions.
[0005]
The mounting substrate 2 is made of a laminated ceramic having pillars 5 integrally formed at four corners of the flat plate 2a by firing. An external receiving terminal (not shown) corresponding to the external terminal is provided on the front end surface of the column 5. A circuit pattern (not shown) is formed on the surface of the flat plate 2a, and accommodates a circuit element such as an IC chip 6 and a capacitor 7 constituting an oscillation circuit and the like together with the crystal blank. Mounting terminals are provided on the four corners of the bottom surface of the flat plate 2a. Then, the external terminals of the crystal unit 1 and the external receiving terminals of the mounting substrate 2 are connected by soldering or the like to form a surface mount oscillator.
[0006]
Alternatively, as shown in FIG. 4, the circuit pattern is formed by integrally forming the pillars 5 at the four corners of the bottom surface of the container body 3 of the crystal unit 1 by firing. The tip surface of the pillar 5 has a mounting terminal to which a circuit pattern is connected. Then, a circuit element including the IC chip 6 is provided in the circuit pattern. In such a case, since the pillars 5 are provided at the four corners of the mounting substrate 2 or the crystal unit 1, a plurality of circuit elements can be provided by increasing the area of the flat plate 2a.
[0007]
[Problems to be solved by the invention]
(Problems of the prior art) However, in the surface mount oscillator having the above configuration, it is necessary to form a circuit pattern on the surface of the mounting substrate 2 or the bottom surface of the crystal unit 1. Generally, a conductor is applied by printing and is integrally fired together with a ceramic material. However, when the planar outer shape is further reduced, the pillar 5 becomes an obstacle, and printing on the circuit pattern becomes difficult. Then, when an accurate circuit pattern including a disconnection or the like cannot be formed, the circuit does not function as a surface mount oscillator, and there is a problem that productivity is reduced.
[0008]
(Object of the Invention) It is an object of the present invention to provide a surface mount oscillator which facilitates formation of a circuit pattern on a mounting board and improves productivity.
[0009]
[Means for Solving the Problems]
The present invention has a column at the four corners of the bottom surface of the crystal unit, and a circuit pattern is formed on the bottom surface of the crystal unit or a mounting board connected to the column, and at least the IC chip 6 is attached to the circuit pattern. In a crystal oscillator for surface mounting having a circuit element including the same, after the circuit pattern is formed, the column 5 is separately connected as a metal. The metal is a cylinder.
[0010]
Thus, a circuit pattern can be formed on the bottom surface of the flat crystal resonator or the surface of the mounting substrate, so that the circuit pattern can be easily formed. Since the column is made of a metal cylinder, positional deviation is prevented. Hereinafter, an embodiment of the present invention will be described.
[0011]
【Example】
FIG. 1 is a diagram of a surface mount oscillator illustrating an embodiment of the present invention. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified or omitted.
As described above, the surface mount oscillator is formed by bonding the mounting substrate 2 having the column 5 to the bottom surface of the crystal unit 1 having the external terminals at the four corners of the bottom surface. In this embodiment, the mounting substrate 2 includes a flat plate 2a made of ceramic and a column 8 made of metal.
[0012]
In such a device, first, after forming a circuit pattern by printing on the surface of the flat plate 2a, the metal cylinder 8 is connected to terminals (not shown) at the four corners by soldering or the like. Next, at least a circuit element such as an IC chip 6 and a capacitor is provided. Alternatively, after disposing the circuit elements, the metal cylinder 8 is connected. Finally, the metal cylinder 8 of the mounting substrate 2 is joined to the external terminals at the four corners of the bottom surface of the crystal unit 1. The metal column 8 may be connected to the mounting substrate 2 after joining to the bottom surface of the crystal unit 1.
[0013]
With such a configuration, since the mounting substrate itself is the flat plate 2a, it is easy to print a circuit pattern by a screen printing method using a mask. Therefore, the productivity of the surface mount oscillator is improved. In addition, since the column body is the column 8, there is no directivity in connection and the connection work is facilitated.
[0014]
[Other matters]
In the above embodiment, the metal cylinder 8 is provided on the mounting substrate 2. However, the metal cylinder 8 may be provided at the four corners by forming a circuit pattern to be connected to the circuit element on the container body 3 of the crystal unit 1. Also in this case, the printing of the circuit pattern is facilitated similarly to the embodiment, and the productivity can be improved. In addition, although the column was a column 8, it may be basically a prism. Further, although the pillar is made of metal, it includes a substantial conductor having a conductive path on the surface or inside of the insulator, for example. Further, although the mounting substrate 2 is made of ceramic, it may be made of glass epoxy or the like.
[0015]
【The invention's effect】
In the present invention, since a circuit pattern is formed on the bottom surface of the crystal unit 1 or on the mounting substrate 2 and the pillars are provided at the four corners, the circuit pattern can be easily formed and the productivity can be enhanced.
[Brief description of the drawings]
FIG. 1 is an exploded view of a surface mount oscillator illustrating one embodiment of the present invention.
FIG. 2 is an exploded view of a surface mount oscillator illustrating another embodiment of the present invention.
FIG. 3 is an exploded view of a surface mount oscillator illustrating a conventional example.
FIG. 4 is an exploded view of a surface mount oscillator illustrating another conventional example.
[Explanation of symbols]
1. Quartz crystal resonator, 2 mounting board, 3 container body, 4 cover, 5 pillars, 6 IC chip, 7 capacitor, 8 cylinders.

Claims (2)

水晶振動子の底面4角部に柱体を有し、前記水晶振動子の底面又は前記柱体に接続した実装基板に回路パターンが形成され、前記回路パターンに少なくともICチップを含む回路素子を配設してなる表面実装用の水晶発振器において、前記回路パターンが形成された後、前記柱体を金属として別個に接続したことを特徴とする水晶発振器。A column is formed at the four corners of the bottom surface of the crystal unit, and a circuit pattern is formed on the bottom surface of the crystal unit or a mounting substrate connected to the column, and a circuit element including at least an IC chip is arranged in the circuit pattern. In the crystal oscillator for surface mounting provided, after the circuit pattern is formed, the column body is separately connected as a metal. 前記金属は円柱である請求項1の表面実装用の水晶発振器。2. The crystal oscillator for surface mounting according to claim 1, wherein the metal is a cylinder.
JP2002314572A 2002-10-29 2002-10-29 Crystal oscillator for surface mounting Pending JP2004153427A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publications (1)

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Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288743A (en) * 2006-04-20 2007-11-01 Hokuriku Electric Ind Co Ltd Crystal oscillator
JP2008193637A (en) * 2007-02-08 2008-08-21 Epson Toyocom Corp Multilayer electronic device and manufacturing method thereof
JP2008300913A (en) * 2007-05-29 2008-12-11 Epson Toyocom Corp Piezoelectric device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288743A (en) * 2006-04-20 2007-11-01 Hokuriku Electric Ind Co Ltd Crystal oscillator
JP2008193637A (en) * 2007-02-08 2008-08-21 Epson Toyocom Corp Multilayer electronic device and manufacturing method thereof
JP2008300913A (en) * 2007-05-29 2008-12-11 Epson Toyocom Corp Piezoelectric device

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