JP2004142082A - Method and device for working plan - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten work time by selecting an optimum working system. <P>SOLUTION: When working a workpiece at a plurality of working positions scattered on the workpiece while cooperatively operating a low-speed positioning means which extensively moves a working position on the work and a high-speed positioning means which moves the working position on the work in a narrow range in a predetermined rectangle in parallel, a low-speed positioning means stop working 140 to stop the low-speed positioning means and to operate the high-speed positioning means, a low-speed positioning means non-stop working 160 to operate the high-speed positioning means while moving the low-speed positioning means, and a hybrid working 150 to jointly use the low-speed positioning means stop working and the low-speed positioning means non-stop working, are properly used. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention uses low-speed positioning means such as an XY stage that can move a machining execution location on a workpiece over a wide range, and high-speed positioning means such as a galvano scanner that can move only a narrow range within a predetermined size rectangle. In particular, the present invention relates to a machining planning method and apparatus for machining a plurality of machining positions scattered on a workpiece, and particularly to a laser drilling machine that performs a plurality of drilling processes on a printed wiring board by irradiating a laser beam. Mathematically grasps the distribution state of processing positions such as drilling in a two-dimensional plane, which is suitable for the XY stage speed, acceleration, trajectory, and operation of equipment such as the galvano scanner drilling position visit order efficiently A machining planning method capable of reducing machining time by planning, a machining method for performing machining determined by the machining planning method, a similar machining planning device, Machining apparatus including a factory planning device, the working planning method computer program for realizing the working planning device or implement, and, the computer program is recorded, a computer-readable recording medium.
[0002]
[Prior art]
In recent years, with the demand for downsizing and high-density mounting of electronic devices, multilayer printed wiring boards in which a plurality of printed wiring boards are superimposed have been provided. In such a multilayer printed wiring board, holes called through-holes or via holes are formed in these substrates in order to electrically connect the conductive layers formed on the printed wiring boards stacked one above the other. Then, by forming a conductive film inside these holes, connection between the conductive layers of each printed wiring board is made.
[0003]
The hole formed in the printed wiring board has been reduced in size with the recent miniaturization and higher functionality of the printed wiring board, and has become a diameter of 0.1 mm or less. In order to form such a small-diameter hole with high accuracy, a pulse oscillation type laser beam is used.
[0004]
A general configuration of a laser drilling machine using a conventional pulsed laser is shown in FIG. This configuration example is a first galvano scanner including a rotating mirror 23 for scanning, for example, a pulsed laser beam 20 emitted from a laser oscillator (not shown) in a predetermined direction (a direction perpendicular to the paper surface in FIG. 1). 22 and a laser beam scanned by the first galvano scanner 22 in a direction perpendicular to the paper surface in a direction perpendicular to the scanning direction by the first galvano scanner 22 (a direction parallel to the paper surface in FIG. 1). The second galvano scanner 24 including the rotating mirror 25 and a laser beam scanned in two directions by the first and second galvano scanners 22 and 24 are fixed on the XY stage 12 and the workpiece such as a substrate. An f-θ lens 26 for deflecting and irradiating in a direction perpendicular to the surface of 10 (referred to as a workpiece) is provided.
[0005]
As described above, by using the first and second galvano scanners 22 and 24, the laser beam 20 is reflected by the rotary mirrors 23 and 25 at the tip of the scanner, and the traveling direction can be arbitrarily changed. Here, since the rotary mirrors 23 and 25 are lightweight, high-speed positioning is possible.
[0006]
The laser beam deflected by the galvano scanners 22 and 24 passes through the f-θ lens 26 and is focused on the work 10. Since the f-θ lens 26 is generally expensive, its size is limited. For this reason, a beam irradiation range (generally referred to as a processing area) at a certain timing is a square of about several tens of mm square. Is smaller than the size of a general workpiece 10.
[0007]
Therefore, a wide range of positioning is possible by conveying the workpiece 10 by the XY stage 12. However, since the XY stage 12 is heavy, it takes a long time for positioning.
[0008]
In this manner, the laser drilling machine includes a galvano scanner (hereinafter also simply referred to as a scanner) that is a high-speed narrow-range positioning device and an XY stage (hereinafter also simply referred to as a stage) that is a low-speed and wide-range positioning device. By using two positioning devices, high-speed and wide-range drilling positioning is performed.
[0009]
Therefore, from the viewpoint of positioning, the operation form (control form) can be broadly classified into the following two.
[0010]
(1) Individual control of scanner and stage
That is, the entire substrate is processed by alternately performing a series of scanner scanning and laser processing in the processing area with the stage at a low speed stopped, and the transfer of the workpiece by the stage. , Called step-and-repeat. Hereinafter, it is also referred to as low-speed positioning means stop processing or stage stop processing.
[0011]
(2) Coordinated control of scanner and stage (also called synchronous control)
This is a form in which scanner scanning and laser processing are performed while a workpiece is conveyed by a stage, and is generally called cooperative control or synchronous control. Hereinafter, it is also referred to as low-speed positioning means non-stop machining or stage non-stop machining.
[0012]
The low-speed positioning means stop processing is described in, for example, Patent Document 1, and the low-speed positioning means non-stop processing is described in Patent Document 2, Patent Document 3, and the like.
[0013]
[Patent Document 1]
Japanese Patent No. 3077539
[Patent Document 2]
Japanese Patent No. 3009740
[Patent Document 3]
JP 2000-100608 A
[0014]
One of the important performances of such laser drilling machines is processing speed, for which mathematical optimization is often applied. The applicant has already proposed Japanese Patent Application No. 2001-331550 for a machining plan based on step-and-repeat control, and Japanese Patent Application No. 2002-26189 for a machining plan based on cooperative control.
[0015]
[Problems to be solved by the invention]
However, depending on the distribution state of a plurality of processing positions scattered on the workpiece, it is possible to sufficiently increase the processing speed if only one of the processing by the step-and-repeat control or the processing by cooperative control is fixed. There was a case that could not be done.
[0016]
The present invention has been made to solve the above-mentioned conventional problems, and a first object is to make it possible to select an optimum machining state and to shorten the machining time.
[0017]
The second object of the present invention is to make it possible to realize hybrid machining that combines low-speed positioning means stop machining and low-speed positioning means non-stop machining.
[0018]
[Means for Solving the Problems]
The present invention uses a low-speed positioning means capable of moving a machining execution position on a workpiece over a wide range and a high-speed positioning means capable of moving only within a narrow range within a predetermined size rectangle, and a plurality of scattered on the workpiece. The low-speed positioning means stop processing for operating the high-speed positioning means by stopping the low-speed positioning means, and the low-speed operation for operating the high-speed positioning means while moving the low-speed positioning means. The first problem is solved by selectively using at least a part of the positioning means non-stop machining and the hybrid machining using both the low-speed positioning means stop machining and the low-speed positioning means non-stop machining.
[0019]
Further, the type of processing is selected in accordance with the state of dispersion at the processing position.
[0020]
Furthermore, when the unevenness of the arrangement of the processing positions is severe, the hybrid processing is selected.
[0021]
In addition, when the processing positions are arranged very densely, the low-speed positioning means stop processing is selected.
[0022]
If the processing positions are substantially uniform, the low-speed positioning means non-stop processing is selected.
[0023]
In addition, when machining a plurality of machining positions twice or more, the type of machining is selected according to the number of cycles.
[0024]
Further, when the number of patrols is equal to or greater than a set value, the low-speed positioning means stop machining is selected, and when it is less than the set value, the low-speed positioning means non-stop machining or hybrid machining is selected. is there.
[0025]
Further, the type of processing is selected according to the simulation result of the processing time.
[0026]
Further, the type of processing is determined for each processing rectangle.
[0027]
The present invention also uses low-speed positioning means capable of moving a machining execution position on a workpiece over a wide range and high-speed positioning means capable of moving only a narrow range within a predetermined size rectangle. A low-speed positioning means non-stop for performing a low-speed positioning means non-stop machining in which a high-speed positioning means is operated while moving the low-speed positioning means within a single processing rectangle. The processing area is divided into a low-speed positioning means stop machining area for performing low-speed positioning means stop machining for stopping the low-speed positioning means and operating the high-speed positioning means. In the low-speed positioning means non-stop machining area, the machining time within each area The processing position visiting order within the region is determined so that the operation speed of the low-speed positioning means is minimized. However, in the low speed positioning means stop working area, so as to determine a processing position visiting order with a solution of the Traveling Salesman Problem, or Hamiltonian path length minimization problem is obtained by solving the second problem.
[0028]
In addition, when the low-speed positioning means decelerates during the transition from non-stop machining to stop machining and vice versa, the earliest start time and the latest completion correspond to the area transition during the deceleration or acceleration time. The time constraint is modified.
[0029]
The present invention also uses low-speed positioning means capable of moving a machining execution position on a workpiece over a wide range and high-speed positioning means capable of moving only a narrow range within a predetermined size rectangle. A machining planning method for machining a plurality of machining positions to be performed, wherein a single processing rectangle has a density for performing non-stop machining of the low-speed positioning means that operates the high-speed positioning means while moving the low-speed positioning means. All the machining positions other than the machining position in the first machining rectangle and the machining position for performing the sparse first machining rectangle and the low-speed positioning means stop machining for stopping the low-speed positioning means and operating the high-speed positioning means In the first machining rectangle, the machining in the rectangle is performed so that the machining time in the first machining rectangle and the second machining rectangle is minimized. In addition to determining the order of placement, the operating speed of the low-speed positioning means is optimized, and in the second machining rectangle, machining is performed using a solution of the traveling salesman problem or the Hamilton path length minimization problem for each location where the machining position exists. The order of visits is determined, and the second problem is similarly solved by moving the low-speed positioning means at a high speed in a predetermined speed pattern at a place where there is no processing position.
[0030]
The present invention also provides a processing method for performing the processing determined by the processing planning method.
[0031]
The present invention also provides a computer program for carrying out the above-described processing planning method or processing method.
[0032]
The present invention also uses low-speed positioning means capable of moving a machining execution position on a workpiece over a wide range and high-speed positioning means capable of moving only a narrow range within a predetermined size rectangle. A machining planning apparatus for machining a plurality of machining positions, wherein the low-speed positioning means is stopped and the high-speed positioning means is operated, and the high-speed positioning means is operated while moving the low-speed positioning means. The first problem is solved by providing means for selectively using at least a part of the low-speed positioning means non-stop machining and the hybrid machining using both the low-speed positioning means stop machining and the low-speed positioning means non-stop machining. It is.
[0033]
The present invention also uses low-speed positioning means capable of moving a machining execution position on a workpiece over a wide range and high-speed positioning means capable of moving only a narrow range within a predetermined size rectangle. A low-speed positioning means non-stop for performing low-speed positioning means non-stop machining in which a high-speed positioning means is operated while moving the low-speed positioning means in a single processing rectangle. In the processing area, the low-speed positioning means stopping the low-speed positioning means to operate the high-speed positioning means, the low-speed positioning means stopping machining area, the low-speed positioning means non-stop machining area, The processing position visit order in the region is determined so that the processing time is minimized, and the operation of the low-speed positioning means is performed. Means for optimizing the degree, and in the low-speed positioning means stop machining area, means for determining the machining position visit order using a solution of the traveling salesman problem or the Hamilton path length minimization problem, This solves the second problem.
[0034]
In addition, a plurality of processes scattered on the workpiece using low-speed positioning means capable of moving the machining execution location on the workpiece over a wide range and high-speed positioning means capable of moving only within a narrow range within a predetermined size rectangle. A processing plan apparatus for processing a position, wherein a single processing rectangle has a uniformly low density for performing non-stop processing of a low-speed positioning unit that operates a high-speed positioning unit while moving the low-speed positioning unit. All the machining positions other than the machining position in the first machining rectangle and the places without the machining positions for performing the first machining rectangle and the low-speed positioning means stop machining for stopping the low-speed positioning means and operating the high-speed positioning means. In the first machining rectangle, the processing position in the rectangle is minimized so that the machining time in the first machining rectangle and the second machining rectangle is minimized. A means for optimizing the operation speed of the low-speed positioning means and a solution for the traveling salesman problem or the Hamilton path length minimization problem are used for each part having a processing position in the second processing rectangle while determining a visiting order. The second problem is also solved by providing a means for determining the processing visit order.
[0035]
The present invention also provides a machining apparatus including the machining planning apparatus.
[0036]
Moreover, the computer program for implement | achieving the said process planning apparatus or a processing apparatus is provided.
[0037]
The present invention also provides a computer-readable recording medium in which the computer program is recorded.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention applied when processing is performed by a laser drilling machine equipped with an XY stage and a galvano scanner will be described in detail with reference to the drawings.
[0039]
In the present embodiment, as shown in FIG. 2, a laser drilling machine 30 and a machining data file group 42 stored in an external memory such as a hard disk or a flexible disk for the laser drilling machine 30 to process, A machining data conversion program (Prg) 44 for converting the machining data file group 42, for example, machining data 46 stored in an internal memory, for example, an operation model file 48 recorded in an external memory, and for reading the operation model file 48 An operation model file reading program (Prg) 50, for example, operation model data 52 stored in an internal memory, a processing plan program (Prg) 54 according to the present invention, and a processing control program (Prg) 56 for controlling the laser drilling machine 30. Including a personal computer that can communicate with the laser drilling machine 30 (P ) And a 40.
[0040]
In FIG. 2, the machining control program 56 for controlling machining and the machining plan program 54 for planning machining are stored in the same PC 40 and the machining plan is processed online, but these may be separate. That is, the machining plan program 54 can be executed offline.
[0041]
In the present embodiment, the laser drilling machine 30 that can communicate with the PC 40 is controlled by the processing control program 56 according to the processing data 46 and performs processing. The machining data 46 is usually obtained by converting a machining data file group 42 in an external memory such as a hard disk or a flexible disk with the machining data conversion program 44. The machining data 46 is updated by the machining planning program 54 in order to move the laser drilling machine 30 efficiently. The machining plan program 54 uses an operation model 52 that models the operation of internal devices (galvano scanner and XY stage). Since the behavior model 52 is not normally resident in the internal memory, the behavior model file 48 in the external memory is obtained by reading using the behavior model file reading program 50.
[0042]
The present invention relates to the machining planning program 54.
[0043]
Hereinafter, the present invention relates to the selection of low-speed positioning means stop machining (here, stage stop machining), low-speed positioning means non-stop machining (here stage non-stop machining), selection of hybrid machining, and a specific planning method for hybrid machining. Separately described. In addition, regarding stage stop processing, according to Japanese Patent Application No. 2001-331550 which the applicant has already proposed, stage non-stop processing can comply with Japanese Patent Application No. 2002-26189.
[0044]
First, a method for selecting a method will be described.
[0045]
The selection of the method is preferably determined according to the sprayed state of the holes. The basis for this is briefly described below.
[0046]
An example of a case where the processing plan for stage non-stop processing is difficult is a substrate with severe unevenness of density. In Japanese Patent Application No. 2002-26189, in a substrate with high density, in the processing rectangle dividing step, the density does not appear in the stage traveling direction in the rectangle, or in the acceleration / deceleration pattern determination step, The method of increasing the speed of was taken. However, the former is technically difficult, and there are cases in which the sparse / dense pattern is random and cannot be applied. In general, the latter is generally performed at a constant speed during acceleration / deceleration. It was not sufficient in that it was difficult compared to applying during operation. As a method to cope with such a situation, it is considered that stage non-stop machining is good for sparse places, but stage stop machining is good for dense places.
[0047]
A major feature of stage non-stop machining is that the operation time of the stage without machining in stage stationary machining can be reduced almost as it is. However, if the holes in the substrate are uniformly extremely dense, the ratio of the time of laser irradiation and scanner scanning is larger than the ratio of the movement time of the stage with respect to the total processing time even when the stage is stopped. Therefore, even if the stage moving time is completely reduced by using stage non-stop machining, the effect is small. Therefore, if the holes in the substrate are uniformly extremely dense, it is not high-speed, but it should be processed by stage stop processing that is generally considered to be more accurate than stage non-stop processing. .
[0048]
Therefore, in the present invention, the stage non-stop machining is added to the stage non-stop machining machining plan shown in FIG. 2 of Japanese Patent Application No. 2002-26189, as shown in FIG. For the rectangle, the process proceeds to step 112 in FIG. 2 of Japanese Patent Application No. 2002-26189, and a machining plan for stage non-stop machining is performed. On the other hand, for a rectangle for which stage stop processing is selected, the process proceeds to step 140, and a processing plan for stage stop processing described in, for example, Japanese Patent Application No. 2001-331550 is performed. For the rectangle for which hybrid processing is selected in step 130, a processing plan for hybrid processing described in this specification is performed in step 150.
[0049]
For example, as shown in FIG. 4, the processing method in step 130 can be selected in accordance with the state of spraying holes in the processing rectangle.
[0050]
That is, first, in step 132, a cumulative frequency graph (C) as shown in FIG. 5 (corresponding to FIG. 19 of Japanese Patent Application No. 2002-26189) is created so that the hole distribution state in the processing rectangle can be recognized. . If it can be determined in step 134 that there is uneven density, the hybrid processing in step 150 is selected, and if it can be determined in step 136 that the surface is uniformly sufficiently dense, stage stop processing is selected in step 140. In other cases, stage 160 non-stop machining is selected in step 160.
[0051]
The cumulative frequency graph created in step 132 can be used to determine the density unevenness. That is, if the cumulative frequency graph is linear, it can be determined that there is no unevenness of density, and if it is vice versa, it can be determined that it is present.
[0052]
In Japanese Patent Application No. 2002-26189, the processing rectangle dividing step is applied to the entire area of the substrate. However, the method shown in FIG. 6 (corresponding to FIG. 24 of Japanese Patent Application No. 2002-26189) is also a sparse and dense area. Since it is a nonuniformity identification method, it is also possible to apply this to a processing rectangle.
[0053]
Further, whether the density is sufficiently dense may be determined by setting a threshold value in advance and simply determining whether the density (= number of holes / area) exceeds the threshold value.
[0054]
Note that the selection of the method is not limited to that based on the spraying state, and for example, determination based on the number of cycles of so-called cycle machining is also possible. In other words, a plurality of holes are not circulated only once, but may be processed to pierce more than once, but a threshold value is set for the number of circulations, and as shown in FIG. If it is determined in 138 that the number of circulations is equal to or greater than the threshold, stage stop machining can be adopted in step 140, and if it is less than the threshold, stage non-stop machining or hybrid machining can be adopted in step 170. This is a method based on the fact that stage stop processing is suitable when the ratio of laser irradiation and scanner scanning time is larger than the ratio of stage operation time with respect to the total processing time due to the large number of cycles. It is.
[0055]
Alternatively, for each processing rectangle, the processing time can be simulated for all three methods of stage stop processing, stage non-stop processing, and hybrid processing, and the method with the fastest processing can be adopted as the processing method for the rectangle.
[0056]
Further, manual setting is possible instead of automatic selection of the method by the machining plan program 54. That is, in the man-machine interface of the machining plan program 54, any one of the three machinings can be selected, and the machining plan party can adopt any of the three. Here, in the case of a substrate that has no meaning unless it is a stage stop process or a stage non-stop process even though the party has adopted, for example, a hybrid process (for example, there is not much density in the direction of stage movement in a rectangle) In some cases, for example, a warning may be generated and one of these may be adopted.
[0057]
Next, a hybrid machining planning method in each machining rectangle will be described.
[0058]
As shown in FIG. 8, the hybrid machining in each machining rectangle is a method of performing stage non-stop machining for a sparse part and stage stop machining for a dense part after identifying the density in the rectangle (transverse hybrid machining and Or, as shown in FIG. 9, after identifying the sparse / dense in the rectangle, a uniformly sparse processed rectangle obtained as a result of extracting the same number of holes as the other sparse parts from the dense part The process rectangle is divided into the remaining hole and the processing rectangle with no hole, and the stage non-stop processing is performed on the sparse processing rectangle, and the stage stop processing is performed on the processing rectangle with the remaining hole (referred to as overlap hybrid processing). ) Can be performed. Here, in FIGS. 8 and 9, the stage movement is horizontal, and the rectangular processing area that is the scanning range is laterally moved in the direction opposite to the stage movement.
[0059]
Hereinafter, each hybrid processing method will be described in detail.
[0060]
(1) Lateral hybrid machining
FIG. 10 shows the transition of the upper and lower limits of the machining area in the horizontal hybrid machining and the transition of the Y coordinate of the point to be machined in time series. 10 and 14, the machining area transition movement direction is + or -Y, the horizontal axis is time, and the vertical axis is the position in the Y direction. Here, it should be noted that the processing area transition direction on the substrate is opposite to the stage moving direction.
[0061]
As shown in FIG. 10, machining is performed while the stage is operating at a high speed and constant speed at a sparse location (stage non-stop machining), and the stage is temporarily stopped at a dense location. During acceleration / deceleration, no machining is performed in this embodiment. Here, a broken line A indicates a time series of area upper and lower limit transitions in the conventional case (particularly when the machining speed is constant). In the past, the stage speed was limited to a dense place and efficient planning was difficult, but in the case of the present invention, the sparse place and the dense place were separated, so the stop was done at the dense place. The time loss that occurs is compensated by the high-speed stage operation at a sparse location, and high-speed machining is possible.
[0062]
In order to realize such processing, a processing plan is performed as follows. That is, as shown in FIG. 11, first, the region where the stage non-stop machining is performed is divided into the region where the stage non-stop machining is performed (step 200), and then the region where the stage non-stop machining is performed is described in Japanese Patent Application No. 2002-26189. As described in Japanese Patent Application No. 2001-331550, the drilling position visiting order and the low-speed positioning means (stage) operation speed optimization step (step 204) in each processed rectangle are performed, and the stage stop processing is performed, as described in Japanese Patent Application No. 2001-331550. The drilling order is optimized using the solution of the salesman problem or the Hamilton path length minimization problem (step 208).
[0063]
Next, the process 200 divided into the area for performing stage non-stop machining (hereinafter referred to as stage non-stop machining area) and the area for performing stage stop machining (referred to as stage stop machining area) will be described in detail. In this step 200, the arrangement of the stage stop machining area is first determined, and the remaining area is set as the stage non-stop machining area.
[0064]
Specifically, a dense sequence is identified in a process as shown in FIG. 12 (corresponding to FIG. 54 of Japanese Patent Application No. 2002-26189), and a rectangle (which may be a plurality) including the sequence (a set of holes) is stage-stopped. This is an area.
[0065]
Or let the rectangle containing the area | region where the frequency of the frequency graph in alignment with the process area transition direction obtained in the process of calculating | requiring the cumulative frequency graph shown in FIG. 5 exceeds a regulation value be a stage stop process area | region.
[0066]
Each stage stop processing area is covered with a minimum number of squares (processing areas). Here, the minimum number is an integer part of {(w−α) / D} +1 (α is a sufficiently small positive number) in the case of a stage stop processing region whose side length in the area transition direction is w. is there. Alternatively, strictly speaking, the method proposed by the applicant in Japanese Patent Application No. 2002-10460 can be used. In addition, how to cover may be arbitrary.
[0067]
Here, it is necessary to take time to decelerate at the stage of transition from the stage non-stop state to the stage stop state and vice versa, and it is necessary to note that the area changes during the deceleration or acceleration time. is there. On the other hand, the drilling position visiting order and the low speed positioning means operating speed optimization process described in Japanese Patent Application No. 2002-26189 are applied as modified as shown in FIG.
[0068]
13A is a conceptual diagram of deceleration at the stage of transition from the stage non-stop state to the stage stop state and vice versa. Here, it is assumed that the area proceeds from left to right (X is a positive direction). The position of the right end (X coordinate) of the stage non-stop machining area is represented by MAX, and the position of the left end is represented by MIN. When machining is not performed during acceleration / deceleration, as shown in the middle stage (B) of FIG. 13 during deceleration, an area within the distance L required for deceleration from the end position MAX of the stage non-stop machining area (deceleration area and In this case, the processing must be completed before the left end of the area reaches the position MAX-L. Further, as shown in the lower part (C) of FIG. 13, the right edge of the area is located at an area within the area L ′ necessary for acceleration (referred to as an acceleration area) from the end position MIN of the stage non-stop machining area. Processing cannot be performed until the position reaches MIN + L ′.
[0069]
These restrictions are reflected in the earliest start time and latest completion time proposed in Japanese Patent Application No. 2002-26189. According to Japanese Patent Application No. 2002-26189, the earliest start time at the point where the distance from the MIN is x is x / V, and the latest completion time is (x + D) / V. Here, the machining start time (time when the right end of the area coincides with the machining rectangle) is 0, the stage speed is V, and the size of the machining area or a value slightly smaller than that is D.
[0070]
In the present invention, the latest completion time at the point where the distance from the point MIN in the deceleration region is x is (x + D−L) / V, and the distance from the point MIN in the deceleration region is x. The earliest start time at is (x + L ′) / V. With this modification alone, the drilling position visiting order and the low-speed positioning means operating speed optimization are executed in the same manner as in Japanese Patent Application No. 2002-26189.
[0071]
Here, it is known that the distances L and L ′ necessary for acceleration / deceleration are about several mm in the assumed apparatus. Although it is only a guide, if the time required to start up at a constant acceleration up to a speed of 200 mm / sec is 0.05 seconds, the distance traveled is (1/2) × 200 × 0.05 = 5 mm. Since this is smaller than the size D of the processing area, D−L <0, that is, the earliest start time> the latest completion time (processing plan impossible) is never reached.
[0072]
(2) Overlapping hybrid processing
FIG. 14 shows the upper and lower limit transitions of the machining area in the overlapping hybrid machining and the Y coordinate transition of the point to be machined in time series. As shown in FIG. 14, one processing rectangle is divided into a processing rectangle with uniform density (first processing rectangle in claims, hereinafter referred to as a uniform rectangle) and a processing rectangle with the remaining points (a plurality of processing rectangles in stage stop processing). (The second processing rectangle in the claims, hereinafter referred to as the remaining rectangle).
[0073]
The actual machining method is, for example, that a uniform rectangle is first machined by non-stop machining, then U-turns to advance the stage in the opposite direction to the stage non-stop machining, and there is a hole in the remaining rectangle It is possible to perform stage stop processing sequentially at the place to do. In addition, the movement between the locations where the holes exist is performed with a predetermined speed pattern as in normal step-and-repeat.
[0074]
In the case of this embodiment, the time during which machining cannot be performed, such as stage U-turn or acceleration / deceleration, is time loss, but uniform rectangular machining is extremely fast, so overall it is faster than conventional machining. . As in the horizontal hybrid machining, the machining plan for non-stop machining can be in accordance with Japanese Patent Application No. 2002-26189, and the machining plan for stage stationary machining can be in accordance with Japanese Patent Application No. 2001-331550.
[0075]
Note that the step of separating the points included in the uniform rectangle from the remaining points includes the step of determining the arrangement of the stage stop machining area already described, and the point in the stage stop machining area as a uniform rectangle or a remaining point. It is divided into a process of determining which of the rectangles it belongs to.
[0076]
Of these, in the step of determining whether the points in the stage stop machining area belong to the uniform rectangle or the remaining rectangle, the frequency graph is used to determine the density of the other areas from the stage stop machining area. The equivalent number of holes may belong to the uniform rectangle and the rest may belong to the remaining rectangle. Specifically, it may be thinned out at random from the location corresponding to the stage stop processing region of the frequency graph.
[0077]
In the above-described embodiment, the high-speed positioning unit is a scanner and the low-speed positioning unit is a stage. However, the types and combinations of the positioning units are not limited to this. A screen cut system or a flash cut system in which a linear motor XY stage and a high-speed machining head are combined as proposed in Japanese Patent Application Laid-Open No. 2000-334637 may be used.
[0078]
Further, the application target is not limited to the laser drilling machine that performs point-like processing, but a laser cutting machine that performs linear processing, a two-head laser processing machine described in JP-A-11-149317, or a laser beam. General processing machines using a processing means (for example, a drilling device using a mechanical drill) that can speed up positioning by simultaneously driving two or more positioning devices, It is obvious that the present invention can be similarly applied to a marking device and an exposure device.
[0079]
【The invention's effect】
According to the present invention, it is possible to plan for efficient machining in the preliminary stage of machining, and to shorten the machining time.
[Brief description of the drawings]
FIG. 1 is a front view showing a main part configuration of a laser drilling machine as an example to which the present invention is applied
FIG. 2 is a block diagram illustrating the configuration of an embodiment of an online configuration in which the present invention is implemented.
FIG. 3 is a flowchart showing overall processing steps in an embodiment of the present invention.
FIG. 4 is a flowchart showing an example of a processing method selection step.
5 is a diagram showing an example of a cumulative frequency graph used in the process of FIG.
FIG. 6 is a conceptual diagram of sparse / dense hierarchization of drilling positions, which is also used in another example of the processing method selection step.
FIG. 7 is a flowchart showing still another example of the processing method selection step.
FIG. 8 is a conceptual diagram of horizontal hybrid machining within each machining rectangle used in the embodiment.
FIG. 9 is also a conceptual diagram of overlapping hybrid machining
FIG. 10 is a time series diagram of the horizontal hybrid machining.
FIG. 11 is a flowchart showing a machining plan of the horizontal hybrid machining.
FIG. 12 is a flowchart showing a process for identifying a dense sequence in the machining plan.
FIG. 13 is a diagram showing the irradiation possible time in the acceleration / deceleration area.
FIG. 14 is a time series diagram of the overlapping hybrid machining.
[Explanation of symbols]
10 ... Processing object (workpiece)
12 ... XY stage
20 ... Laser beam
22, 24 ... Galvano scanner
23, 25 ... Rotating mirror
26 ... f-θ lens
30 ... Laser drilling machine
40 ... PC
42 ... Processing data file group
44 ... machining data conversion program
46 ... Processing data
48 ... Action model file
50 ... Operation model reading program
52. Action model data
54 ... Machining plan program
56 ... Machining control program

Claims (29)

The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A machining planning method for machining a plurality of machining positions,
Low-speed positioning means stop processing for stopping the low-speed positioning means and operating the high-speed positioning means;
Low speed positioning means non-stop machining that operates the high speed positioning means while moving the low speed positioning means,
Hybrid machining using both the low-speed positioning means stop machining and the low-speed positioning means non-stop machining;
A machining planning method characterized by using at least a part of the process. The machining planning method according to claim 1, wherein the type of machining is selected according to a dispersion state of machining positions. The machining planning method according to claim 2, wherein the hybrid machining is selected when unevenness in the arrangement of the machining positions is severe. 3. The machining planning method according to claim 2, wherein when the machining positions are arranged very densely, the low-speed positioning means stop machining is selected. 3. The machining planning method according to claim 2, wherein when the machining positions are substantially uniform, the low-speed positioning means non-stop machining is selected. The machining planning method according to claim 1, wherein when machining a plurality of machining positions twice or more, the type of machining is selected according to the number of circulations. The low-speed positioning means stop machining is selected when the number of patrols is equal to or greater than a set value, and the low-speed positioning means non-stop machining or hybrid machining is selected when it is less than the set value. 6. The processing plan method according to 6. 2. The machining planning method according to claim 1, wherein the type of machining is selected according to a simulation result of machining time. 9. The machining planning method according to claim 1, wherein the type of machining is determined for each machining rectangle. The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A machining planning method for machining a plurality of machining positions,
The low-speed positioning means non-stop machining area for performing the non-stop machining of the low-speed positioning means for operating the high-speed positioning means while moving the low-speed positioning means within one machining rectangle, and operating the high-speed positioning means by stopping the low-speed positioning means It is divided into the low speed positioning means stop machining area that performs the low speed positioning means stop machining.
In the low-speed positioning means non-stop machining area, the machining position visiting order in the area is determined so that the machining time in each area is minimized, and the operation speed of the low-speed positioning means is optimized,
A machining planning method for hybrid machining, wherein in the low-speed positioning means stop machining area, a machining position visiting order is determined using a solution of a traveling salesman problem or a Hamilton path length minimization problem. At the time of deceleration in the transition from non-stop machining to stop machining of the low-speed positioning means and vice versa, the earliest start time and the latest completion time correspond to the transition of the area during the deceleration or acceleration time. The machining planning method for hybrid machining according to claim 10, wherein the constraint is corrected. The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A machining planning method for machining a plurality of machining positions,
A first processing rectangle with a uniformly sparse density for stopping a single processing rectangle for non-stop processing of the low-speed positioning means for operating the high-speed positioning means while moving the low-speed positioning means, and stopping the low-speed positioning means The low-speed positioning means for operating the high-speed positioning means to divide into a second machining rectangle including all machining positions other than the machining position in the first machining rectangle and a part having no machining position,
In the first processing rectangle, the processing position visiting order in the rectangle is determined so that the processing time in the first processing rectangle and the second processing rectangle is minimized, and the operation speed of the low-speed positioning means is optimized,
In the second machining rectangle, the order of machining visits is determined by using the solution of the traveling salesman problem or the Hamilton path length minimization problem for each part having a machining position. A machining planning method of hybrid machining characterized by moving at high speed in a pattern. A machining method comprising performing the machining determined by the machining planning method according to claim 1. A computer program for carrying out the machining planning method according to claim 1 or the machining method according to claim 12. The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A processing planning device for processing a plurality of processing positions,
Low-speed positioning means stop processing for stopping the low-speed positioning means and operating the high-speed positioning means;
Low speed positioning means non-stop machining that operates the high speed positioning means while moving the low speed positioning means,
Hybrid machining using both the low-speed positioning means stop machining and the low-speed positioning means non-stop machining;
A processing planning apparatus comprising means for selectively using at least a part of the processing plan. The processing plan apparatus according to claim 15, wherein the means for selectively selecting the type of processing is selected in accordance with a distribution state of processing positions. The machining planning apparatus according to claim 16, wherein the means for selectively using the hybrid machining is selected when the unevenness of the arrangement of machining positions is severe. 17. The machining planning apparatus according to claim 16, wherein the means for selectively using the low-speed positioning means stops machining when the arrangement of machining positions is extremely dense. 17. The machining planning apparatus according to claim 16, wherein the means for selectively using the low-speed positioning means non-stop machining is selected when the arrangement of machining positions is substantially uniform. 16. The machining according to claim 15, wherein when machining a plurality of machining positions twice or more, the means to be used selects the type of machining according to the number of cycles. Planning equipment. When the number of times of circulation is equal to or greater than a set value, the selectively using means selects the low-speed positioning means stop machining, and when it is less than the set value, selects the low-speed positioning means non-stop machining or hybrid machining The processing planning apparatus according to claim 20, wherein The processing plan apparatus according to claim 14, wherein the means for selectively selecting the type of processing is selected according to a simulation result of processing time. The processing plan apparatus according to any one of claims 15 to 22, wherein the means for selectively determining the type of processing for each processing rectangle. The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A processing planning device for processing a plurality of processing positions,
The low-speed positioning means non-stop machining area for performing the non-stop machining of the low-speed positioning means for operating the high-speed positioning means while moving the low-speed positioning means within one machining rectangle, and operating the high-speed positioning means by stopping the low-speed positioning means Processing low-speed positioning means to make the means to divide into stop processing area,
In the low-speed positioning means non-stop machining area, the machining position visiting order in the area is determined so as to minimize the machining time in each area, and the operation speed of the low-speed positioning means is optimized,
In the low-speed positioning means stop machining area, means for determining a machining position visit order using a solution of the traveling salesman problem or the Hamilton path length minimization problem;
A machining planning apparatus for hybrid machining, characterized by comprising: At the time of deceleration in the transition from non-stop machining to stop machining of the low-speed positioning means and vice versa, the earliest start time and the latest completion time correspond to the transition of the area during the deceleration or acceleration time. 25. The processing plan apparatus for hybrid processing according to claim 24, wherein the constraint is corrected. The low-speed positioning means that can move the machining execution location on the workpiece in a wide range and the high-speed positioning means that can move only a narrow range within a predetermined rectangle are scattered on the workpiece while operating in parallel and in parallel. A processing planning device for processing a plurality of processing positions,
A first processing rectangle with a uniformly sparse density for stopping a single processing rectangle for non-stop processing of the low-speed positioning means for operating the high-speed positioning means while moving the low-speed positioning means, and stopping the low-speed positioning means Means for dividing the second machining rectangle including all the machining positions other than the machining position in the first machining rectangle and the position without the machining position, for performing the low-speed positioning means stop machining for operating the high-speed positioning means;
In the first processing rectangle, means for determining the processing position visiting order in the rectangle so as to minimize the processing time in the first processing rectangle and the second processing rectangle and optimizing the operation speed of the low-speed positioning means When,
In the second processing rectangle, the processing visit order is determined using the solution of the traveling salesman problem or the Hamilton path length minimization problem for each position to the processing position, and the low-speed positioning means is used for a position without the processing position. A way to get up to speed with speed patterns,
A machining planning apparatus for hybrid machining, characterized by comprising: 27. A machining apparatus comprising the machining planning apparatus according to claim 15. A computer program for realizing the machining planning device according to any one of claims 15 to 26 or the machining device according to claim 27. A computer-readable recording medium on which the computer program according to claim 14 or 28 is recorded.

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