JP2004079277A - Electric connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connector capable of stabilizing the initial connection by enlarging a contact area between an electric jointing substance and a conductive contact element and suppressing a resistance value, further, capable of stabilizing the load required at the time of connection. <P>SOLUTION: The connector comprises an insulating substrate 20 interposed between a circuit board 1 and a semiconductor package 10, and a plurality of conductive contact elements 22 penetrated and supported by being arranged in a row in the XY direction of the insulating substrate 20, conduction capably and elastically contacting with the circuit board 1, and the electrodes 2, 11 of the semiconductor package 10. Then, each conductive contact element 22 is formed so as to have an octagonal cross section by using an elastic conductive elastomer 30, and the end part periphery 23 at the top and bottom of each conductive contact element 22 is made angular and sharp-edged respectively. Since the end part periphery 23 of the conductive contact element 22 is made angular, the electrode contacting section is enlarged, thereby, the contact area between the semiconductor package 10 and the conductive contact element 22 does not become small. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrical connector for electrically connecting various electrical and electronic components such as a circuit board and a semiconductor package.
[0002]
[Prior art]
As disclosed in, for example, US Pat. No. 6,348,659B1, a conventional electrical connector includes an insulating substrate 20 interposed between a circuit board and a semiconductor package, and a penetratingly supported side by side with the insulating substrate 20, and a circuit board and a semiconductor. And a plurality of conductive contact elements 22 that contact the electrodes of the package. As shown in the above-mentioned publication and FIG. 15, each conductive contact element 22 is formed into a truncated conical shape, barrel shape, cylindrical shape, substantially octagonal cross section, or the like using conductive rubber, and has a peripheral edge at an upper end portion and a peripheral edge at both upper and lower ends. Is chamfered.
[0003]
[Problems to be solved by the invention]
The conventional electrical connector is configured as described above, and since the upper edge and the upper and lower edges of the conductive contact element 22 are rounded and chamfered, the contact area between the semiconductor package and the conductive contact element 22 is reduced. As a result, there arises a problem that the initial connection becomes unstable and the resistance value becomes high. In order to solve such a problem, it is sufficient to compress the conductive contact element 22 to increase the contact area. However, this causes a new problem that a large load is required at the time of connection.
[0004]
The present invention has been made in view of the above, and can increase the contact area between an electric joint and a conductive contact element to stabilize an initial connection or suppress a resistance value. It is an object of the present invention to provide an electrical connector capable of suppressing the occurrence of an electric signal.
[0005]
[Means for Solving the Problems]
In the present invention, in order to achieve the above object, electrically connecting a plurality of electrical joints,
It has a conductive contact element that contacts the electrode of the electrical joint, and this conductive contact element is formed using a conductive elastomer, and the peripheral edge of the conductive contact element is substantially squared to have a sharp edge. I have.
[0006]
Note that, between the plurality of electrical joints, an insulating substrate that penetrates and supports the conductive contact element is interposed, and the conductive contact element is connected between the pair of frustums respectively exposed from the insulating substrate and the pair of frustums. Integrally formed with a through connection portion penetrating the insulating substrate, the length between the pair of frustums is 0.5 to 2.2 mm, and the width of the widened portion of each frustum is 0.3 to 0.8 mm. At the same time, the width of the reduced width portion of each frustum can be set to 0.2 to 0.6 mm, and the width of the through connection portion can be set to 0.2 to 0.6 mm.
[0007]
Here, the electrical joint in the claims includes at least various types of circuit boards (eg, printed wiring boards, flexible boards, inspection boards, etc.), semiconductor packages (eg, BGA, LGA, etc.), electroacoustic components, and electronic components. Etc. are included. One or more conductive contact elements may be used depending on the number of electrical joints. The conductive contact element is appropriately formed into a truncated cone, a truncated pyramid, a polygonal truncated cone, a barrel, a cylinder, a substantially hexagonal cross section, a substantially octagonal cross section, a substantially oval cross section, or the like. The periphery of the end of the conductive contact element may be the periphery of one end or the periphery of both ends. In addition, the sharp edge means that the peripheral edge of the conductive contact element in contact with the electrode of the electrical joint is angular or that the corner R at the peripheral edge of the conductive contact element is 0.05 mm or less. It does not matter whether the insulating substrate is flexible.
[0008]
ADVANTAGE OF THE INVENTION According to this invention, an electric connector is interposed between several electrical joints, and the conductive contact element is made to be able to conduct (electrically conduct current) to the electrode of the electrical joint so that the conductive contact element can be compressed. If so, a plurality of electrical joints can be electrically connected via an electrical connector. Since it can be said that the peripheral edge of the end portion of the conductive contact element is not cut off and is approximately square, the electrode contact portion is enlarged.
[0009]
Further, according to the present invention, since one or more conductive contact elements are supported on the insulating substrate, it is possible to stabilize the posture of the conductive contact elements, facilitate positioning, and the like. Further, since the length between the pair of frustums constituting the conductive contact element is in the range of 0.5 to 2.2 mm, at least low resistance can be obtained. Further, since the width of the widened portion of the frustum is in the range of 0.3 to 0.8 mm, at least a narrow pitch can be obtained. Further, since the width of the reduced width portion is in the range of 0.2 to 0.6 mm, it is possible to stabilize the resistance at a minimum. Furthermore, since the width of the through connection portion 25 is in the range of 0.2 to 0.6 mm, a reduction in resistance can be expected.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, an electric connector according to the present embodiment includes an insulating substrate interposed between a circuit board 1 and a semiconductor package 10. 20 and a plurality of conductive contact elements 22 which are arranged and penetrated side by side on the insulating substrate 20 and which resiliently and elastically contact the circuit board 1 and the electrodes 2 and 11 of the semiconductor package 10. Each conductive contact element 22 is formed of a conductive elastomer. 30 and the upper and lower end peripheral edges 23 of each conductive contact element 22 are sharpened so as to have a sharp edge having no roundness.
[0011]
The circuit board 1 includes an insulating substrate made of, for example, a laminated plate, and a plurality of conductive wiring patterns and electrodes 2 are appropriately formed inside and outside the insulating substrate. As the semiconductor package 10, as shown in FIG. 1, for example, a surface mounting area array type LGA in which a plurality of electrodes 11 are arranged in a lattice on the lower surface is used.
[0012]
The insulating substrate 20 is formed in a flexible flat rectangular shape using a predetermined material, and a plurality of through-holes 21 are regularly drilled at predetermined intervals in the XY thickness direction. Examples of the material of the insulating substrate 20 include polyimide, glass epoxy, PET, PEN, PEI, PPS, PEEK, and liquid crystal polymer. Among them, polyimide having a small coefficient of thermal expansion and excellent heat resistance is most suitable.
[0013]
As shown in FIG. 2, each conductive contact element 22 is formed in a vertically long shape with a substantially octagonal cross section by using a conductive elastomer 30, and the upper and lower end peripheral edges 23 are rounded off. It is provided integrally with the through hole 21. The conductive elastomer 30 is made of a conductive composition in which conductive particles are mixed with a predetermined insulating elastomer. As the insulating elastomer, various elastomers having fluidity before curing and having a cross-linked structure by curing (general name of those having rubber-like elasticity at around normal temperature) are used.
[0014]
Specific examples include silicone rubber, fluorine rubber, polyurethane rubber, polybutadiene rubber, polyisopropylene rubber, chloroprene rubber, polyester rubber, styrene / butadiene copolymer rubber, and natural rubber. In addition, these closed-cell foams and the like also correspond. Among these, silicone rubber, which is excellent in electrical insulation, heat resistance, compression set, workability and the like, is most suitable.
[0015]
Examples of the conductive particles include a granular or flake type. Specifically, gold, silver, copper, platinum, palladium, nickel, aluminum and other simple metals or particles of these alloys, as well as phenolic resins, epoxy resins, silicone resins, thermoplastic resins such as urethane resins and Examples thereof include particles of a thermosetting resin, a baked product thereof, or an inorganic material such as carbon, ceramics, or silica as a nucleus and the surface of which is coated with the above metal by plating, vapor deposition, sputtering, or the like. In particular, from the viewpoint of resistance and cost, it is preferable to mix the granular silver particles in the range of 400 to 600 parts by mass with respect to 100 parts by mass of the insulating elastomer material.
[0016]
Each conductive contact element 22 has a pair of truncated cones 24 protruding from the front and back surfaces of the insulating substrate 20, respectively, and a cylindrical through connection that connects the pair of truncated cones 24 and penetrates the through hole 21 of the insulating substrate 20. It is formed integrally with the part 25. The height 24H between the pair of upper and lower truncated cones 24 is preferably in the range of 0.5 to 2.2 mm, more preferably 0.8 to 1.2 mm. This is because, if it deviates from such a range, a low resistance may not be obtained, and the allowable compression range is taken into consideration.
[0017]
Each of the truncated cones 24 has a diameter 24A (width) of the enlarged diameter portion in the range of 0.3 to 0.8 mm, more preferably 0.7 mm, and a diameter 24M (width) of the flat reduced diameter portion. The range is 0.2 to 0.6 mm, preferably 0.5 mm. The reason why the diameter 24A of the enlarged diameter portion is in the range of 0.3 to 0.8 mm is that if it is out of this range, a narrow pitch cannot be obtained, and the bonding strength of the insulating substrate 20 and the conductive contact element 22 is taken into consideration. It is. The reason why the diameter 24M of the reduced diameter portion is in the range of 0.2 to 0.6 mm is based on the reason that if the diameter is within this range, the resistance can be reduced and stabilized, and a narrow pitch can be secured. Further, the diameter of the through hole 21, in other words, the diameter (width) of the through connection portion 25 is preferably 0.2 to 0.6 mm, more preferably 0.5 mm. This takes into account the reduction in resistance and the bonding strength between the insulating substrate 20 and the conductive contact element 22.
[0018]
When manufacturing such an electrical connector, first, a plurality of through holes 21 are formed in the insulating substrate 20, and a conductive elastomer 30 made of conductive silicone rubber is superimposed on the insulating substrate 20 and set in the mold 40. (See FIG. 3). When the preparation is completed in this way, the mold 40 is clamped and pressurized and heated (see FIG. 4) to manufacture an electrical connector in which the insulating substrate 20 and the conductive contact element 22 are integrated. When the mold is opened, the electrical connector can be taken out and used (see FIG. 5).
[0019]
In the above-described configuration, the upper and lower ends of the plurality of conductive contact elements 22 are electrically connected to the circuit board 1 and the electrodes 2 and 11 of the semiconductor package 10 by interposing an electrical connector between the circuit board 1 and the semiconductor package 10. When the plurality of conductive contact elements 22 are compressed by pressing the semiconductor package 10 downwardly by elastic contact, the circuit board 1 and the semiconductor package 10 can be electrically conductively connected via an electrical connector (see FIG. 1). ).
[0020]
According to the above configuration, since the peripheral edges of the upper and lower ends of the conductive contact element 22 are angular as shown in FIG. 2, the electrode contact portion expands as the end face area of the conductive contact element 22 increases, and the conductive contact between the semiconductor package 10 and the semiconductor package 10 increases. The contact area of the contact element 22 does not decrease. Therefore, it is possible to stabilize the initial connection and suppress an increase in the resistance value. Further, since it is not necessary to expand the contact area by compressing the conductive contact element 22, a large load is not required at the time of connection.
[0021]
Next, FIG. 6 shows a second embodiment of the present invention. In this case, columnar straight portions 26 are integrally formed on both upper and lower ends of each conductive contact element 22, respectively. . The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and it is clear that the height of the conductive contact element 22 can be increased while maintaining the enlarged electrode contact portion.
[0022]
Next, FIG. 7 shows a third embodiment of the present invention. In this case, each of the conductive contact elements 22 is formed into a straight, large-diameter cylindrical shape. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and that the shape of the conductive contact element 22 can be diversified.
[0023]
Next, FIG. 8 shows a fourth embodiment of the present invention. In this case, each conductive contact element 22 is formed into a straight, reduced-diameter cylindrical shape. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those in the above embodiment can be expected, and that the shape of the conductive contact element 22 can be diversified.
[0024]
Next, FIG. 9 shows a fifth embodiment of the present invention. In this case, each conductive contact element 22 is formed by a pair of short truncated cones 24 protruding from the front and back surfaces of the insulating substrate 20, respectively. The pair of truncated cones 24 are connected to each other, and are integrally formed from a cylindrical long and long penetrating connection part 25 penetrating the through hole 21 of the insulating substrate 20. And have the same diameter. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as those of the above embodiment can be expected, and that the shape of the conductive contact element 22 can be complicated.
[0025]
Next, FIG. 10 shows a sixth embodiment of the present invention. In this case, the peripheral surface of the truncated cone 24 is partially depressed and curved. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, the same operation and effect as those in the above embodiment can be expected, and the shape of the conductive contact element 22 can be complicated.
[0026]
【Example】
The electrical connector of the embodiment in which the upper and lower end edges of the conductive contact element are each sharpened by making them angular, and the electrical connectors of Comparative Examples 1 and 2 in which the upper and lower end edges of the conductive contact element are respectively rounded, are prepared. Using these, the circuit board and the semiconductor package were electrically conductively connected, and the load and resistance thereof were examined.
[0027]
As shown in FIG. 11, an electrical connector comprises an insulating substrate made of polyimide having a thickness of 0.1 mm, and a plurality of conductive contact elements arranged and supported through the insulating substrate. The conductive elastomer is formed by blending granular silver particles with silicone rubber, and the corner R at the upper and lower edges of each conductive contact element is set to 0.01 mm to form a sharp edge (in FIGS. 11 and 14, sharp edges are formed). Edge product). The height between a pair of truncated cones forming each conductive contact element was 1.0 mm. Further, the diameter of the enlarged diameter portion of each truncated cone was set to 0.7 mm, and the diameter of the reduced diameter portion was set to 0.5 mm. Further, the diameter of the through hole was 0.5 mm.
[0028]
Comparative Example 1
As shown in FIG. 12, the electrical connector was basically configured in the same manner as in the embodiment, and the roundness was formed by setting the R of the corners at the upper and lower end edges of each conductive contact element to 0.12 mm (FIG. 12, In FIG. 14, it is called R0.12 product).
Comparative Example 2
As shown in FIG. 13, the electrical connector was basically constructed in the same manner as in the embodiment, and the roundness was formed by setting R at both upper and lower ends of each conductive contact element to 0.35 mm (R0 in FIGS. 13 and 14). .35 products).
[0029]
The circuit board and the semiconductor package were electrically connected to each other using the electrical connectors of Examples and Comparative Examples 1 and 2, and the load and resistance were measured. The results shown in FIG. 14 were obtained. From these results, it was confirmed that the electrical connector of the example had a stable resistance with a small load compared to the electrical connectors of Comparative Examples 1 and 2.
[0030]
【The invention's effect】
As described above, according to the present invention, there is an effect that the contact area between the electric joint and the conductive contact element can be enlarged to stabilize the initial connection and to suppress the resistance value. Further, the load required for connection can be suppressed.
[Brief description of the drawings]
FIG. 1 is an overall explanatory view showing an embodiment of an electric connector according to the present invention.
FIG. 2 is a schematic explanatory view showing a conductive contact element in an embodiment of the electric connector according to the present invention.
FIG. 3 is a schematic explanatory view showing a state in which conductive silicone rubber is overlaid on an insulating substrate and set in a mold in the embodiment of the electrical connector according to the present invention.
FIG. 4 is a schematic explanatory view showing a state in which the mold of FIG.
FIG. 5 is a schematic explanatory view showing a state in which an electric connector in which an insulating substrate and a conductive contact element are integrated is taken out of a mold.
FIG. 6 is a schematic explanatory view showing a conductive contact element in a second embodiment of the electrical connector according to the present invention.
FIG. 7 is a schematic explanatory view showing a conductive contact element in a third embodiment of the electrical connector according to the present invention.
FIG. 8 is a schematic explanatory view showing a conductive contact element in a fourth embodiment of the electrical connector according to the present invention.
FIG. 9 is a schematic explanatory view showing a conductive contact element in a fifth embodiment of the electrical connector according to the present invention.
FIG. 10 is a schematic explanatory view showing a conductive contact element in a sixth embodiment of the electrical connector according to the present invention.
FIG. 11 is a schematic explanatory view showing an embodiment of the electric connector according to the present invention.
FIG. 12 is a schematic explanatory view showing Comparative Example 1 of the electrical connector according to the present invention.
FIG. 13 is a schematic explanatory view showing Comparative Example 2 of the electrical connector according to the present invention.
FIG. 14 is a graph showing the results of measuring the load and resistance using the electrical connectors of the example and comparative examples 1 and 2.
FIG. 15 is an explanatory diagram showing a conductive contact element of a conventional electrical connector.
[Explanation of symbols]
1 circuit board (electrical joint)
2 electrode 10 Semiconductor package (electrical joint)
DESCRIPTION OF SYMBOLS 11 Electrode 20 Insulating substrate 22 Conductive contact element 23 Edge periphery 24 Truncated cone
24A Diameter of the widened part of the truncated cone (width of the widened part of the frustum)
24H Height between a pair of frustums (length between a pair of frustums)
24M Diameter of reduced diameter part of truncated cone (width of reduced diameter part of frustum)
25 feed-through connector 30 conductive elastomer

Claims (2)

An electrical connector for electrically connecting a plurality of electrical joints,
It has a conductive contact element that contacts the electrode of the electrical joint, and this conductive contact element is formed using a conductive elastomer, and the peripheral edge of the conductive contact element is substantially squared to have a sharp edge. Electrical connector. An insulating substrate that penetrates and supports the conductive contact element is interposed between the plurality of electrical joints,
The conductive contact element is integrally formed from a pair of frustums exposed from the insulating substrate and a through connection portion that connects the pair of frustums and penetrates the insulating substrate, and reduces the length between the pair of frustums. 0.5 to 2.2 mm, the width of the widened portion of each frustum is 0.3 to 0.8 mm, and the width of the narrowed portion of each frustum is 0.2 to 0.6 mm. The electrical connector according to claim 1, wherein the width of the portion is 0.2 to 0.6 mm.

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