JP2004075879A - Methacrylic resin and its use - Google Patents
Methacrylic resin and its use Download PDFInfo
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- JP2004075879A JP2004075879A JP2002239080A JP2002239080A JP2004075879A JP 2004075879 A JP2004075879 A JP 2004075879A JP 2002239080 A JP2002239080 A JP 2002239080A JP 2002239080 A JP2002239080 A JP 2002239080A JP 2004075879 A JP2004075879 A JP 2004075879A
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- Prior art keywords
- methacrylic resin
- polymerization
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- methacrylate
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- 239000000113 methacrylic resin Substances 0.000 title claims abstract description 32
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 60
- 150000001875 compounds Chemical class 0.000 claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 36
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003999 initiator Substances 0.000 claims abstract description 16
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 6
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 6
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 6
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 claims description 6
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 claims description 6
- 125000004386 diacrylate group Chemical group 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 5
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 238000005266 casting Methods 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000004342 Benzoyl peroxide Substances 0.000 description 7
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 7
- 235000019400 benzoyl peroxide Nutrition 0.000 description 7
- 238000007334 copolymerization reaction Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 239000004926 polymethyl methacrylate Substances 0.000 description 6
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 4
- 241001261506 Undaria pinnatifida Species 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical group CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 description 3
- -1 Cyclopentanyloxy Chemical group 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- AAOISIQFPPAFQO-UHFFFAOYSA-N 7:0(6Me,6Me) Chemical compound CC(C)(C)CCCCC(O)=O AAOISIQFPPAFQO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- NUIPOEWADWHGSP-UHFFFAOYSA-N 1-hydroxypropyl 2-methylprop-2-enoate Chemical compound CCC(O)OC(=O)C(C)=C NUIPOEWADWHGSP-UHFFFAOYSA-N 0.000 description 1
- PNJLSKTVCRNRBO-UHFFFAOYSA-N 1-tert-butylperoxy-2,5-dimethylhexane Chemical compound CC(C)CCC(C)COOC(C)(C)C PNJLSKTVCRNRBO-UHFFFAOYSA-N 0.000 description 1
- SZVMZLJAAGWNPG-UHFFFAOYSA-N 1-tert-butylperoxyoctane Chemical compound CCCCCCCCOOC(C)(C)C SZVMZLJAAGWNPG-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- UORHATMEXRBTGF-UHFFFAOYSA-N 2-butylperoxy-3,5,5-trimethylhexanoic acid Chemical compound CCCCOOC(C(O)=O)C(C)CC(C)(C)C UORHATMEXRBTGF-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- AQNSVANSEBPSMK-UHFFFAOYSA-N dicyclopentenyl methacrylate Chemical compound C12CC=CC2C2CC(OC(=O)C(=C)C)C1C2.C12C=CCC2C2CC(OC(=O)C(=C)C)C1C2 AQNSVANSEBPSMK-UHFFFAOYSA-N 0.000 description 1
- YMRYNEIBKUSWAJ-UHFFFAOYSA-N ditert-butyl benzene-1,3-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OOC(C)(C)C)=C1 YMRYNEIBKUSWAJ-UHFFFAOYSA-N 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerization Catalysts (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
【課題】本発明は、低吸水性、耐熱性、剛性、および耐薬品性などが向上したメタクリル系樹脂を提供することを目的としている。また、本発明は、重合時に重合反応の暴走を生じずに製造されるメタクリル系樹脂を提供することを目的としている。
【解決手段】〈1〉メチルメタクリレート、
〈2〉特定の構造で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
を含有する組成物を重合してなることを特徴とするメタクリル系樹脂。
【効果】透明性、低吸水性、耐熱性、剛性、および耐薬品性などに優れたメタクリル系樹脂を、重合反応の暴走を伴うことなく生産性よく提供することができる。また、上記特性に優れた透明部材、ディスプレイ用透明部材、自動車用透明部材を提供することができる。
【選択図】 なしAn object of the present invention is to provide a methacrylic resin having improved low water absorption, heat resistance, rigidity, and chemical resistance. Another object of the present invention is to provide a methacrylic resin produced without causing a runaway of a polymerization reaction during polymerization.
SOLUTION: <1> Methyl methacrylate,
<2> a compound selected from the group of compounds represented by the specific structure,
<3> radical initiator,
A methacrylic resin obtained by polymerizing a composition containing
[Effect] A methacrylic resin excellent in transparency, low water absorption, heat resistance, rigidity, chemical resistance and the like can be provided with high productivity without runaway of a polymerization reaction. Further, it is possible to provide a transparent member, a transparent member for a display, and a transparent member for an automobile which are excellent in the above characteristics.
[Selection diagram] None
Description
【0001】
【発明の属する技術分野】
本発明は、メタクリル系樹脂およびメタクリル系樹脂から形成された透明部材、より詳しくは、メチルメタクリレート(MMA)と特定の化合物を共重合させてなるメタクリル系樹脂に関する。
【0002】
【従来の技術】
メタクリル樹脂(PMMA)は、グレージング材・ランプ・メーターカバーなどの車輌分野、光学レンズ・光学フィルター・プリンターカバーなどの弱電分野、パチンコ/ゲーム周辺部品などの雑貨分野の成形材料として、店舗用看板・大型水槽などの看板・ディスプレイ分野、カーポート・バスタブなどの建材分野、液晶用導光板・自動販売機前面板などの弱電・工業部品分野、照明カバーなどの照明器具分野の板材料として広く用いられている。
これにあって、PMMAの耐熱性や剛性、および耐薬品性や吸水性などの物性に対する改善要求が強いが、吸水性に関しては吸水率が高いと成形品が寸法変化や屈折率変化、或いは耐熱性変化などを来たすのでその回避が吸水性改善要求の声は根強いものがある。
そこで、PMMAの吸水性および耐熱性を改善する樹脂としてメチルメタクリレートとスチレンモノマーをランダム共重合してなるMS樹脂が注目されるに至っているが、この樹脂は脆いという欠点に加え、射出成形や押出し成形などの成形材料としては用いられるが板材料としては用いられないなど、自ずと用途展開が限定されている。
【0003】
【発明の解決しようとする課題】
本発明は、低吸水性メタクリル系樹脂を提供することを目的とし、より好ましくは、耐熱性、剛性、および耐薬品性をも向上したメタクリル系樹脂を提供することを目的としている。
【0004】
【課題を解決するための手段】
本発明のメタクリル系樹脂は、
▲1▼〈1〉メチルメタクリレート、
〈2〉下記一般式(1)(化7)〜(5)(化11)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
を含有する組成物を重合してなることを特徴とするメタクリル系樹脂
【0005】
【化7】
【0006】
(式中、R1は水素原子またはメチル基を表す。またn=0〜3の整数を表す。)
【0007】
【化8】
【0008】
(式中、R2は水素原子またはメチル基を表す。またn=0〜3の整数を表す。)
【0009】
【化9】
【0010】
(式中、R3、R4はそれぞれ独立に、水素原子またはメチル基を表す。)
【0011】
【化10】
【0012】
(式中、R5は水素原子、またはメチル基を表す。)
【0013】
【化11】
【0014】
(式中、R6は水素原子、またはメチル基を表す。)
▲2▼〈1〉メチルメタクリレート、
〈2〉一般式(1)〜(5)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
〈4〉下記一般式(6)(化12)で表される化合物、
を含有する組成物を重合してなることを特徴とするメタクリル系樹脂
【0015】
【化12】
【0016】
(式中、R7は水素原子、またはメチル基を表す)
▲3▼一般式(1)〜(5)で表される化合物群から選ばれた化合物が、
ジシクロペンタニルアクリレート、ジシクロペンタニルメタクリレート、ジシクロペンテニルアクリレート、2−(ジシクロペンテニルオキシ)エチルアクリレート、2−(ジシクロペンテニルオキシ)エチルメタクリレート、ジメチロール−トリシクロデカンジアクリレート、イソボルニルアクリレート、イソボルニルメタクリレート、シクロヘキシルアクリレート、シクロヘキシルメタクリレートのいずれかである▲1▼〜▲2▼記載のメタクリル系樹脂
▲4▼ラジカル開始剤が、
(a)10時間半減期温度50〜75℃の有機過酸化物、
(b)10時間半減期温度95〜120℃の有機過酸化物
からそれぞれ少なくとも1種を併用することを特徴とする▲1▼〜▲3▼記載のメタクリル系樹脂
▲5▼重合温度が40〜170℃である▲1▼〜▲4▼記載のメタクリル系樹脂
▲6▼▲1▼〜▲5▼記載のメタクリル系樹脂を成形してなる透明部材、自動車用透明部材、ディスプレイ用透明部材
からなる。
【0017】
【発明の実施の形態】
以下、本発明について具体的に説明する。
メタクリル系樹脂
本発明のメタクリル系樹脂は、
〈1〉メチルメタクリレート、
〈2〉前記一般式(1)〜(5)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
を含有する組成物であり、より好ましくは、
〈1〉メチルメタクリレート、
〈2〉前記一般式(1)〜(5)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
〈4〉前記一般式(6)で表される化合物、
を含有する組成物を共重合してなる。
【0018】
前記一般式(1)〜(5)で表される化合物群から選ばれる化合物としては、具体例として以下の化合物が挙げられる。
一般式(1)の化合物としては、ジシクロペンタニルアクリレート、ジシクロペンタニルメタクリレート、2−(ジシクロペンタニルオキシ)エチルアクリレート、2−(ジシクロペンタニルオキシ)エチルメタクリレート、2−(ジシクロペンタニルオキシ)エチル−2’−(アクリロイルオキシ)エチルエーテル、2−(ジシクロペンタニルオキシ)エチル−2’−(メタクリロイルオキシ)エチルエーテル、2−{2−(ジシクロペンタニルオキシ)エチルオキシ}−1−{2’−(アクリロイルオキシ)エチルオキシ}エタン、2−{2−(ジシクロペンタニルオキシ)エチルオキシ}−1−{2’−(メタクリロイルオキシ)エチルオキシ}エタン等が挙げられる。
【0019】
一般式(2)の化合物としては、ジシクロペンテニルアクリレート、ジシクロペンテニルメタクリレート、2−(ジシクロペンテニルオキシ)エチルアクリレート、2−(ジシクロペンテニルオキシ)エチルメタクリレート、2−(ジシクロペンテニルオキシ)エチル−2’−(アクリロイルオキシ)エチルエーテル、2−(ジシクロペンテニルオキシ)エチル−2’−(メタクリロイルオキシ)エチルエーテル、2−{2−(ジシクロペンテニルオキシ)エチルオキシ}−1−{2’−(アクリロイルオキシ)エチルオキシ}エタン、2−{2−(ジシクロペンテニルオキシ)エチルオキシ}−1−{2’−(メタクリロイルオキシ)エチルオキシ}エタン等が挙げられる。
【0020】
一般式(3)の化合物としては、ジメチロール−トリシクロデカンジアクリレート、ジメチロール−トリシクロデカンジメタクリレート等が挙げられる。
【0021】
一般式(4)の化合物としては、イソボルニルアクリレート、イソボルニルメタクリレート等が挙げられる。
【0022】
一般式(5)の化合物としては、シクロヘキシルアクリレート、シクロヘキシルメタクリレート等が挙げられる。
【0023】
また、一般式(1)〜(5)で表される化合物群から選ばれる化合物で特に好ましいのは、ジシクロペンタニルアクリレート、ジシクロペンタニルメタクリレート、ジシクロペンテニルアクリレート、2−(ジシクロペンテニルオキシ)エチルアクリレート、2−(ジシクロペンテニルオキシ)エチルメタクリレート、ジメチロール−トリシクロデカンジアクリレート、イソボルニルアクリレート、イソボルニルメタクリレート、シクロヘキシルアクリレート、およびシクロヘキシルメタクリレートである。
【0024】
なお、前記一般式(6)で表される化合物とは、具体的には、N−(3−イソプロペニル−α,α−ジメチルベンジル)−2−メタクリロイルオキシエチルカルバメート、N−(3−イソプロペニル−α,α−ジメチルベンジル)−1−メタクリロイルオキシプロパン−2−イルカルバメートである。
【0025】
これら一般式(1)〜(5)で表される化合物群から選ばれた化合物をラジカル開始剤の存在下でMMAと共重合することにより低吸水性のPMMAをなす。更に、一般式(1)〜(5)で表される化合物群から選ばれた化合物に一般式(6)で表される化合物を含有させた組成物をラジカル開始剤の存在下でMMAと共重合することにより、低吸水性は勿論のこと、耐熱性、剛性、および耐薬品性などの物性も向上したPMMAをなす。
【0026】
ここで、MMAとの使用割合は、低吸水性をはじめとする諸物性の向上を十分かつ効果的に発揮せしめるために、MMA100重量部に対し、一般式(1)〜(5)で表される化合物群から選ばれた化合物は5〜50重量部の範囲であることが好ましい。
尚、一般式(1)〜(5)で表される化合物群からは2種以上の化合物を選択して用いてもよいが、その場合の使用割合はMMA100重量部に対し、一般式(1)〜(5)で表される化合物の総量が5〜50重量部の範囲であることが好ましい。
【0027】
一方、一般式(6)で表される化合物を併用する場合のMMAとの使用割合は、MMA100重量部に対し、一般式(6)で表される化合物は5〜50重量部の範囲が好ましい。また、この場合には一般式(6)で表される化合物の重量部≧一般式(1)〜(5)で表される化合物群から選ばれた化合物の重量部であることがより好ましい。
【0028】
本発明ではラジカル開始剤としては特に制限されるものではないが、
(a)10時間半減期温度50〜75℃の有機過酸化物
(b)10時間半減期温度95〜120℃の有機過酸化物
から、それぞれ少なくとも1種を併用するとより好ましい。
【0029】
(a)10時間半減期温度50〜75℃の有機過酸化物(有機過酸化物(a))としては、2,4−ジクロロベンゾイルパーオキサイド、t−ブチルパーオキシピバレート、3,5,5−トリメチルヘキサノイルパーオキサイド、オクタノイルパーオキサイド、デカノイルパーオキサイド、ラウロイルパーオキサイド、サクシニックアシッドパーオキサイド、アセチルパーオキサイド、t−ブチルパーオキシ−2−エチルヘキサノエイト、m−トルオイルパーオキサイド、ベンゾイルパーオキサイドなどが挙げられる。
また、(b)10時間半減期温度が95〜120℃の有機過酸化物(以下、有機過酸化物(b))としては、t−ブチルパーオキシマレイックアシッド、t−ブチルパーオキシラウレート、t−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート、シクロヘキサノンパーオキサイド、t−ブチルパーオキシイソプロピルカーボネート、2,5−ジメチル−2,5−ジ(ベンゾイルパーオキシ)ヘキサン、2,2−ビス(t−ブチルパーオキシ)オクタン、t−ブチルパーオキシアセテート、2,2−ビス(t−ブチルパーオキシ)ブタン、t−ブチルパーオキシベンゾエート、n−ブチル−4,4−ビス(t−ブチルパーオキシ)バレレート、ジ−t−ブチル−ジパーオキシイソフタレート、メチルエチルケトンパーオキサイド、ジクミルパーオキサイド、2,5−ジメチル(t−ブチルパーオキシ)ヘキサン、t−ブチルクミルパーオキサイドなどが挙げられる。
【0030】
有機過酸化物(a)と、有機過酸化物(b)との使用割合は、有機過酸化物(a)≧有機過酸化物(b)であるとより好ましい。また、有機過酸化物(b)は、10時間半減期温度が95〜110℃であるのがさらにより好ましい。
【0031】
共重合に際し、ラジカル開始剤として、有機過酸化物(a)と有機過酸化物(b)とを併用すると、10時間半減期温度50〜75℃の有機過酸化物(a)がまず作用して重合が開始し初期重合が進み、そして、ある段階で、10時間半減期温度95〜120℃の有機過酸化物(b)が作用して更に重合が進むと共に架橋が進行すると考えられる。このため、ラジカル開始剤として、有機過酸化物(a)と有機過酸化物(b)とを併用することにより、共重合反応がマイルドに進行し、重合反応の暴走を回避しやすい。
ラジカル開始剤の使用量は、共重合に供される組成物に対して、ラジカル開始剤の総量が0.01〜5重量%の範囲となる量であることが好ましい。
【0032】
なお、本発明のメタクリル系樹脂を製造するに際しては、他の重合性モノマーを適宜加えてもよい。
【0033】
このようにして調製した組成物は脱気を施して共重合に備える。
共重合はどのような方法で行ってもよく、例えば注型重合では、次のように行うことができる。尚、注型重合するに当たっては、離型剤を用いても用いなくてもよい。
【0034】
注型重合は、所望の形状の樹脂成型体をなす鋳型の空間部に先に調製した組成物を注入し加熱重合を行い、その後脱型して成型体を得る重合法である。ここで、該鋳型には組成物を封じ込める、組成物の重合硬化収縮に鋳型を追随させるなどの目的のためにガスケットを配設する。
平板の樹脂成型体を得るには、ガラスやステンレスからなる鋳型を選択し、ガスケットとしては塩化ビニルやシリコン樹脂製のシートやチューブから選択して用いるのが一般的である。
本発明における共重合の加熱温度は組成物およびラジカル開始剤の種類や使用量にもよるが、通常は40〜170℃であるのが望ましい。より具体的には、加熱初期の温度が40℃以上、好ましくは50℃以上、より好ましくは60℃以上であって、加熱終期の温度が170℃以下、好ましくは150℃以下、より好ましくは130℃以下であるのが望ましく、それぞれの温度範囲において、一定温度に保つ時間および昇温速度を適宜選択し、段階的に昇温する温度条件とするのが望ましい。また、重合時間は、加熱温度にもよるが、通常は4〜7時間、好ましくは5〜7時間であるのが望ましい。
【0035】
本発明のメタクリル系樹脂において、吸水性の指標である吸水率は、例えば、ASTM D570法で厚さ2mmの樹脂板において、通常は0.49%以下であり、好ましくは0.44%以下、より好ましくは0.39%以下である。一方、耐熱性の指標であるTgは、通常は120℃以上であり、好ましくは125℃以上、より好ましくは130℃以上である。また、剛性の指標である曲げ弾性率は、通常は3.2GPa以上、好ましくは3.6GPa以上、より好ましくは4.0GPa以上である。
なお、本発明のメタクリル系樹脂は、アセトンやトルエンなどの有機溶剤、苛性ソーダや硫酸などの無機アルカリ/無機酸の水溶液に対し耐性も有している。
【0036】
本発明のメタクリル系樹脂は、低吸水性、耐熱性、剛性、および耐薬品性などへの要求が現行のPMMAを相当程度超える分野に好適に用いることができる。例えば、既存のグレージング材、各種のカバー、看板などに物性が向上した材として置き換えが可能である。また、透明部材、とりわけディスプレイ用透明部材、或いは自動車用透明部材などとして有用である。
ディスプレイ用透明部材としては、具体的には、リアプロジェクター用成形部品(拡散型リアプロジェクション・スクリーン、レンチキュラー・スクリーン、球面レンズ型/直交レンチキュラー型レンズアレイ・スクリーン、フレネルレンズ付拡散型/フレネルレンズ付レンチキュラー・スクリーン、リアプロジェクションTV用投写レンズ、リアプロジェクションTV用前面板など)、PDP前面板、液晶プラスチック基板、有機EL基板、タッチパネル基板などが挙げられる。一方、自動車用透明部材としては、具体的には、ヘッド/テールランプレンズ、ランプカバー、ルーフ窓、リヤクォーター窓、フロント/リヤパネル、バイザーなどが挙げられる。
【0037】
【実施例】
以下、実施例に基づいて本発明をさらに具体的に説明するが、本発明はこれらの実施例に限定されるものではない。尚、以下の実施例および比較例において、重量部はgを表わす。
〈評価方法〉
樹脂の各物性の評価は、以下のようにして行った。
【0038】
【0039】
(調製例1)
攪拌機、温度計、乾燥管および滴下ロートを備えた四つ口フラスコに3−イソプロペニル−α,α−ジメチルベンジルイソシアネート150.0g、ジブチルスズラウレート0.07gを仕込み、内温45〜50℃で2−ヒドロキシエチルメタクリレート97.0gを2時間かけて滴下した。その後、50℃で8時間熟成反応を行って化合物(6−1)を得た。
【0040】
(調製例2)
攪拌機、温度計、乾燥管および滴下ロートを備えた四つ口フラスコに3−イソプロペニル−α,α−ジメチルベンジルイソシアネート150.0g、ジブチルスズラウレート0.07gを仕込み、内温45〜50℃で2−メチル−1−メタクリロイルオキシエタノール107.5gを2時間かけて滴下した。その後、50℃で8時間熟成反応を行って化合物(6−2)を得た。
【0041】
【実施例1】
MMA100重量部とイソボルニルアクリレート(IBA)15重量部の混合液に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.3重量部を添加混合し、その後脱気して重合に備えた。
この組成物を一辺が200mmのガラス板に塩化ビニル製のガスケットを配した空間距離が2mmの注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、70℃から130℃まで2時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中80℃付近で重合がやや暴走し、脱型して得られた樹脂板にはワカメ現象が僅かに認められた。
【0042】
【実施例2】
MMA100重量部とシクロヘキシルメタクリレート(CHMA)10重量部の混合液に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.3重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から130℃まで3時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中75℃付近で重合がやや暴走し、得られた樹脂板にはワカメ現象が僅かに認められた。
【0043】
【実施例3】
MMA100重量部、調製例1に記載の化合物(6−1)25重量部、およびジシクロペンタニルメタクリレート(DCPtaMA)25重量部の混合液に、t−ブチルパーオキシ−2−エチルヘキサノエート0.2重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.1重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、70℃で2時間一定温度に保った後、70℃から130℃まで2時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。
【0044】
【実施例4】
MMA100重量部、調製例1に記載の化合物(6−1)40重量部、およびジシクロペンテニルオキシエチルメタクリレート(DCPteOEMA)20重量部の混合液に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシラウレート0.2重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から110℃まで2時間かけて昇温、その後110℃で1時間、継いで130℃で1時間各々一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。
【0045】
【実施例5】
MMA100重量部、調製例1に記載の化合物(6−1)25重量部、およびジメチロール−トリシクロデカンジアクリレート(DMTCDDA)20重量部の混合液に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.3重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から130℃まで3時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。
【0046】
【実施例6】
MMA100重量部、調製例1に記載の化合物(6−1)30重量部、およびイソボルニルメタクリレート(IBMA)30重量部の混合液に、t−ブチルパーオキシ−2−エチルヘキサノエート0.2重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.1重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、70℃で2時間一定温度に保った後、70℃から130℃まで4時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。
【0047】
【実施例7】
MMA100重量部、調製例2に記載の化合物(6−2)20重量部、およびジシクロペンテニルアクリレート(DCPteA)15重量部の混合液に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシラウレート0.2重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から110℃まで2時間かけて昇温、その後110℃で1時間、継いで130℃で1時間各々一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。
【0048】
【実施例8】
MMA100重量部とジシクロペンテニルオキシエチルアクリレート(DCPteOEA)60重量部の混合液に、t−ブチルパーオキシ−2−エチルヘキサノエート0.2重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.1重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、70℃で2時間一定温度に保った後、70℃から130℃まで4時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中90℃付近で重合がやや暴走し、脱型して得られた樹脂板にはワカメ現象が僅かに見られた。
【0049】
【比較例1】
MMA100重量部に、ベンゾイルパーオキサイド0.3重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.2重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から130℃まで2時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中何ら異常は認められず、脱型して面状態が良好な透明樹脂板を得た。しかし、本樹脂の吸水率は0.5%以上であった。
【0050】
【比較例2】
MMA100重量部、およびエチレングリコールジメタクリレート(EGDMA)25重量部の混合液に、t−ブチルパーオキシ−2−エチルヘキサノエート0.2重量部とt−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート0.1重量部を添加混合し、その後脱気して重合に備えた。
この組成物を実施例1に示したと同じ注型重合用鋳型に注入し、60℃で2時間一定温度に保った後、60℃から130℃まで4時間かけて昇温、その後130℃で1時間一定温度に保って重合を行った。
重合中80℃付近で重合が暴走し、脱型して得られた樹脂板にはほぼ全面にワカメ現象が見られた。
上記実施例1〜9および比較例1〜2について、組成物および組成比を第1表(表1)に、また樹脂の物性評価を第2表(表2)に示す。
【0051】
【表1】
【0052】
【表2】
【0053】
【発明の効果】
本発明によれば、透明性、低吸水性、耐熱性、剛性、および耐薬品性などに優れたメタクリル系樹脂を、重合反応の暴走を伴うことなく生産性よく提供することができる。また、上記特性に優れた透明部材、ディスプレイ用透明部材、自動車用透明部材を提供することができる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a methacrylic resin and a transparent member formed from the methacrylic resin, and more particularly, to a methacrylic resin obtained by copolymerizing methyl methacrylate (MMA) and a specific compound.
[0002]
[Prior art]
Methacrylic resin (PMMA) is used as a molding material in the vehicle field, such as glazing materials, lamps, and meter covers, in the light electrical field, such as optical lenses, optical filters, and printer covers; Widely used as a board material for signboards and displays such as large aquariums, building materials such as carports and bathtubs, weak electric and industrial parts such as light guide plates for LCDs and vending machine front panels, and lighting equipment such as lighting covers. ing.
In this context, there is a strong demand for improvement in physical properties such as heat resistance and rigidity of PMMA, and chemical resistance and water absorption. However, regarding the water absorption, if the water absorption is high, the molded product will undergo dimensional change, refractive index change, or heat resistance. There is a strong demand for a need to improve water absorption to avoid such changes in sex.
Therefore, MS resin obtained by random copolymerization of methyl methacrylate and styrene monomer has been attracting attention as a resin for improving the water absorption and heat resistance of PMMA. However, this resin has the drawback of being brittle, and has the disadvantage of injection molding and extrusion. It is used as a molding material for molding and the like, but is not used as a plate material.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide a methacrylic resin having low water absorption, and more preferably to provide a methacrylic resin having improved heat resistance, rigidity, and chemical resistance.
[0004]
[Means for Solving the Problems]
The methacrylic resin of the present invention,
(1) <1> Methyl methacrylate,
<2> a compound selected from the group of compounds represented by the following general formulas (1) (Chem. 7) to (5) (Chem. 11),
<3> radical initiator,
Methacrylic resin obtained by polymerizing a composition containing
Embedded image
[0006]
(In the formula, R1 represents a hydrogen atom or a methyl group. Also, n represents an integer of 0 to 3.)
[0007]
Embedded image
[0008]
(In the formula, R2 represents a hydrogen atom or a methyl group. Also, n represents an integer of 0 to 3.)
[0009]
Embedded image
[0010]
(In the formula, R3 and R4 each independently represent a hydrogen atom or a methyl group.)
[0011]
Embedded image
[0012]
(In the formula, R5 represents a hydrogen atom or a methyl group.)
[0013]
Embedded image
[0014]
(In the formula, R6 represents a hydrogen atom or a methyl group.)
(2) <1> methyl methacrylate,
<2> a compound selected from the group of compounds represented by general formulas (1) to (5),
<3> radical initiator,
<4> a compound represented by the following general formula (6) (formula 12),
A methacrylic resin obtained by polymerizing a composition containing
Embedded image
[0016]
(Wherein, R 7 represents a hydrogen atom or a methyl group)
{Circle around (3)} Compounds selected from the group of compounds represented by general formulas (1) to (5)
Dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, 2- (dicyclopentenyloxy) ethyl acrylate, 2- (dicyclopentenyloxy) ethyl methacrylate, dimethylol-tricyclodecane diacrylate, isobornyl A methacrylic resin according to any one of (1) to (2), which is any one of acrylate, isobornyl methacrylate, cyclohexyl acrylate, and cyclohexyl methacrylate;
(A) an organic peroxide having a 10-hour half-life temperature of 50 to 75 ° C.,
(B) A methacrylic resin according to (1) to (3), wherein at least one of organic peroxides having a 10-hour half-life temperature of 95 to 120 ° C. is used in combination. A methacrylic resin described in (1) to (4) at 170 ° C., comprising a transparent member formed by molding the methacrylic resin described in (6), (1) to (5), a transparent member for automobiles, and a transparent member for display. .
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described specifically.
Methacrylic resin The methacrylic resin of the present invention is:
<1> methyl methacrylate,
<2> a compound selected from the group of compounds represented by the general formulas (1) to (5),
<3> radical initiator,
Is a composition containing, more preferably,
<1> methyl methacrylate,
<2> a compound selected from the group of compounds represented by the general formulas (1) to (5),
<3> radical initiator,
<4> a compound represented by the general formula (6),
Is obtained by copolymerizing a composition containing
[0018]
Specific examples of the compound selected from the compound group represented by the general formulas (1) to (5) include the following compounds.
Examples of the compound of the general formula (1) include dicyclopentanyl acrylate, dicyclopentanyl methacrylate, 2- (dicyclopentanyloxy) ethyl acrylate, 2- (dicyclopentanyloxy) ethyl methacrylate, and 2- (di Cyclopentanyloxy) ethyl-2 ′-(acryloyloxy) ethyl ether, 2- (dicyclopentanyloxy) ethyl-2 ′-(methacryloyloxy) ethyl ether, 2- {2- (dicyclopentanyloxy) Ethyloxy {-1-} 2 '-(acryloyloxy) ethyloxy} ethane, 2- {2- (dicyclopentanyloxy) ethyloxy} -1- {2'-(methacryloyloxy) ethyloxy} ethane and the like.
[0019]
Examples of the compound of the general formula (2) include dicyclopentenyl acrylate, dicyclopentenyl methacrylate, 2- (dicyclopentenyloxy) ethyl acrylate, 2- (dicyclopentenyloxy) ethyl methacrylate, and 2- (dicyclopentenyloxy) Ethyl-2 ′-(acryloyloxy) ethyl ether, 2- (dicyclopentenyloxy) ethyl-2 ′-(methacryloyloxy) ethyl ether, 2- {2- (dicyclopentenyloxy) ethyloxy} -1- {2 '-(Acryloyloxy) ethyloxy} ethane, 2- {2- (dicyclopentenyloxy) ethyloxy} -1- {2'-(methacryloyloxy) ethyloxy} ethane and the like.
[0020]
Examples of the compound of the general formula (3) include dimethylol-tricyclodecane diacrylate, dimethylol-tricyclodecane dimethacrylate, and the like.
[0021]
Examples of the compound of the general formula (4) include isobornyl acrylate and isobornyl methacrylate.
[0022]
Examples of the compound of the general formula (5) include cyclohexyl acrylate and cyclohexyl methacrylate.
[0023]
Particularly preferred among the compounds selected from the group of compounds represented by the general formulas (1) to (5) are dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, and 2- (dicyclopentenyl). Oxy) ethyl acrylate, 2- (dicyclopentenyloxy) ethyl methacrylate, dimethylol-tricyclodecane diacrylate, isobornyl acrylate, isobornyl methacrylate, cyclohexyl acrylate, and cyclohexyl methacrylate.
[0024]
The compound represented by the general formula (6) specifically includes N- (3-isopropenyl-α, α-dimethylbenzyl) -2-methacryloyloxyethyl carbamate and N- (3-isopropenyl Propenyl-α, α-dimethylbenzyl) -1-methacryloyloxypropan-2-ylcarbamate.
[0025]
A low water-absorbing PMMA is formed by copolymerizing a compound selected from the compounds represented by the general formulas (1) to (5) with MMA in the presence of a radical initiator. Further, a composition containing a compound represented by the general formula (6) in a compound selected from the group of compounds represented by the general formulas (1) to (5) is mixed with MMA in the presence of a radical initiator. By polymerization, PMMA has improved properties such as heat resistance, rigidity, and chemical resistance as well as low water absorption.
[0026]
Here, the ratio of use with MMA is represented by the general formulas (1) to (5) with respect to 100 parts by weight of MMA in order to sufficiently and effectively exhibit various physical properties including low water absorption. The compound selected from the compound group is preferably in the range of 5 to 50 parts by weight.
In addition, two or more compounds may be selected and used from the compound group represented by the general formulas (1) to (5). It is preferable that the total amount of the compounds represented by (1) to (5) is in the range of 5 to 50 parts by weight.
[0027]
On the other hand, when the compound represented by the general formula (6) is used in combination with the MMA, the compound represented by the general formula (6) is preferably used in an amount of 5 to 50 parts by weight based on 100 parts by weight of the MMA. . Further, in this case, it is more preferable that the parts by weight of the compound represented by the general formula (6) ≧ the parts by weight of the compound selected from the compound group represented by the general formulas (1) to (5).
[0028]
In the present invention, the radical initiator is not particularly limited,
It is more preferable to use at least one of (a) an organic peroxide having a 10-hour half-life temperature of 50 to 75 ° C and (b) an organic peroxide having a 10-hour half-life temperature of 95 to 120 ° C.
[0029]
(A) 10-hour organic compounds having a half-life temperature of 50 to 75 ° C. (organic peroxide (a)) include 2,4-dichlorobenzoyl peroxide, t-butylperoxypivalate, 5-trimethylhexanoyl peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, succinic acid peroxide, acetyl peroxide, t-butylperoxy-2-ethylhexanoate, m-toluoyl peroxide Oxide, benzoyl peroxide and the like.
Examples of (b) an organic peroxide having a 10-hour half-life temperature of 95 to 120 ° C. (hereinafter referred to as “organic peroxide (b)”) include t-butylperoxymaleic acid and t-butylperoxylaurate. , T-butylperoxy-3,5,5-trimethylhexanoate, cyclohexanone peroxide, t-butylperoxyisopropyl carbonate, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, 2-bis (t-butylperoxy) octane, t-butylperoxyacetate, 2,2-bis (t-butylperoxy) butane, t-butylperoxybenzoate, n-butyl-4,4-bis ( t-butylperoxy) valerate, di-t-butyl-diperoxyisophthalate, methyl ethyl ketone peroxide, Mill peroxide, 2,5-dimethyl (t-butyl peroxy) hexane, t-butyl cumyl peroxide and the like.
[0030]
The ratio of the organic peroxide (a) to the organic peroxide (b) is more preferably organic peroxide (a) ≧ organic peroxide (b). Further, it is even more preferable that the organic peroxide (b) has a 10-hour half-life temperature of 95 to 110 ° C.
[0031]
In the copolymerization, when the organic peroxide (a) and the organic peroxide (b) are used in combination as the radical initiator, the organic peroxide (a) having a 10-hour half-life temperature of 50 to 75 ° C. acts first. It is considered that the polymerization starts and the initial polymerization proceeds, and at a certain stage, the organic peroxide (b) having a 10-hour half-life temperature of 95 to 120 ° C. acts to further promote the polymerization and the crosslinking. For this reason, by using the organic peroxide (a) and the organic peroxide (b) together as the radical initiator, the copolymerization reaction proceeds mildly, and it is easy to avoid runaway of the polymerization reaction.
The amount of the radical initiator used is preferably such that the total amount of the radical initiator is in the range of 0.01 to 5% by weight based on the composition to be subjected to the copolymerization.
[0032]
In producing the methacrylic resin of the present invention, another polymerizable monomer may be appropriately added.
[0033]
The composition thus prepared is degassed and prepared for copolymerization.
Copolymerization may be performed by any method. For example, in cast polymerization, the following can be performed. In the casting polymerization, a release agent may or may not be used.
[0034]
Casting polymerization is a polymerization method in which the previously prepared composition is injected into a space of a mold forming a resin molded body having a desired shape, heat polymerization is performed, and then the molded body is demolded to obtain a molded body. Here, the mold is provided with a gasket for the purpose of enclosing the composition, making the mold follow the polymerization curing shrinkage of the composition, and the like.
In order to obtain a flat resin molded body, it is common to select a mold made of glass or stainless steel and to use a gasket selected from sheets or tubes made of vinyl chloride or silicone resin.
The heating temperature for copolymerization in the present invention depends on the type and amount of the composition and the radical initiator, but is usually preferably from 40 to 170 ° C. More specifically, the initial heating temperature is 40 ° C. or higher, preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and the final heating temperature is 170 ° C. or lower, preferably 150 ° C. or lower, more preferably 130 ° C. or lower. It is desirable that the temperature is not more than 0 ° C., and it is desirable to appropriately select the time for keeping the temperature constant and the rate of temperature rise in each temperature range, and to set the temperature condition to raise the temperature stepwise. The polymerization time depends on the heating temperature, but is usually 4 to 7 hours, preferably 5 to 7 hours.
[0035]
In the methacrylic resin of the present invention, the water absorption as an index of water absorption is, for example, usually 0.49% or less, preferably 0.44% or less in a resin plate having a thickness of 2 mm according to the ASTM D570 method. It is more preferably at most 0.39%. On the other hand, Tg, which is an index of heat resistance, is usually 120 ° C. or higher, preferably 125 ° C. or higher, more preferably 130 ° C. or higher. The flexural modulus, which is an index of rigidity, is usually 3.2 GPa or more, preferably 3.6 GPa or more, and more preferably 4.0 GPa or more.
The methacrylic resin of the present invention also has resistance to organic solvents such as acetone and toluene, and aqueous solutions of inorganic alkalis and inorganic acids such as caustic soda and sulfuric acid.
[0036]
The methacrylic resin of the present invention can be suitably used in fields where the requirements for low water absorption, heat resistance, rigidity, chemical resistance, and the like substantially exceed current PMMA. For example, existing glazing materials, various covers, signs, and the like can be replaced with materials having improved physical properties. Further, it is useful as a transparent member, especially a transparent member for a display or a transparent member for an automobile.
Specific examples of the transparent member for display include molded parts for rear projectors (diffusion type rear projection screen, lenticular screen, spherical lens type / orthogonal lenticular type lens array screen, diffusion type with Fresnel lens / with Fresnel lens A lenticular screen, a projection lens for a rear projection TV, a front panel for a rear projection TV, a PDP front panel, a liquid crystal plastic substrate, an organic EL substrate, a touch panel substrate, and the like. On the other hand, specific examples of the transparent member for an automobile include a head / tail lamp lens, a lamp cover, a roof window, a rear quarter window, a front / rear panel, and a visor.
[0037]
【Example】
Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, parts by weight represent g.
<Evaluation method>
Evaluation of each physical property of the resin was performed as follows.
[0038]
[0039]
(Preparation Example 1)
A 4-neck flask equipped with a stirrer, thermometer, drying tube and dropping funnel was charged with 150.0 g of 3-isopropenyl-α, α-dimethylbenzyl isocyanate and 0.07 g of dibutyltin laurate. 97.0 g of 2-hydroxyethyl methacrylate was added dropwise over 2 hours. Thereafter, an aging reaction was performed at 50 ° C. for 8 hours to obtain a compound (6-1).
[0040]
(Preparation Example 2)
A 4-neck flask equipped with a stirrer, thermometer, drying tube and dropping funnel was charged with 150.0 g of 3-isopropenyl-α, α-dimethylbenzyl isocyanate and 0.07 g of dibutyltin laurate. 107.5 g of 2-methyl-1-methacryloyloxyethanol was added dropwise over 2 hours. Thereafter, an aging reaction was performed at 50 ° C. for 8 hours to obtain a compound (6-2).
[0041]
Embodiment 1
To a mixture of 100 parts by weight of MMA and 15 parts by weight of isobornyl acrylate (IBA), 0.3 parts by weight of benzoyl peroxide and 0.3 parts by weight of t-butylperoxy-3,5,5-trimethylhexanoate were added. The mixture was added and mixed, and then degassed to prepare for polymerization.
This composition was poured into a casting mold having a space distance of 2 mm in which a vinyl chloride gasket was placed on a glass plate having a side of 200 mm and kept at a constant temperature of 60 ° C. for 2 hours. Until 2 hours, and then kept at 130 ° C. for 1 hour at a constant temperature to carry out polymerization.
During the polymerization, the polymerization slightly ran at around 80 ° C., and a slight wakame phenomenon was observed in the resin plate obtained by demolding.
[0042]
Embodiment 2
To a mixture of 100 parts by weight of MMA and 10 parts by weight of cyclohexyl methacrylate (CHMA), 0.3 parts by weight of benzoyl peroxide and 0.3 parts by weight of t-butylperoxy-3,5,5-trimethylhexanoate are added and mixed. Then, it was degassed to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, and then heated from 60 ° C. to 130 ° C. over 3 hours. The polymerization was carried out while keeping the temperature constant for a period of time.
During the polymerization, the polymerization slightly ran at around 75 ° C., and a slight wakame phenomenon was observed in the obtained resin plate.
[0043]
Embodiment 3
To a mixture of 100 parts by weight of MMA, 25 parts by weight of compound (6-1) described in Preparation Example 1, and 25 parts by weight of dicyclopentanyl methacrylate (DCPtaMA), t-butylperoxy-2-ethylhexanoate 0 was added. 0.2 parts by weight and 0.1 parts by weight of t-butylperoxy-3,5,5-trimethylhexanoate were added and mixed, followed by degassing to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 70 ° C. for 2 hours, then heated from 70 ° C. to 130 ° C. over 2 hours, and then heated at 130 ° C. for 1 hour. The polymerization was carried out while keeping the temperature constant for a period of time.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state.
[0044]
Embodiment 4
A mixture of 100 parts by weight of MMA, 40 parts by weight of compound (6-1) described in Preparation Example 1, and 20 parts by weight of dicyclopentenyloxyethyl methacrylate (DCPteOEMA) was added with 0.3 parts by weight of benzoyl peroxide and t-butyl. 0.2 parts by weight of peroxylaurate was added and mixed, and then deaerated to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, then heated from 60 ° C. to 110 ° C. over 2 hours, and then heated at 110 ° C. for 1 hour. The polymerization was carried out at 130 ° C. for 1 hour and at a constant temperature for 1 hour.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state.
[0045]
Embodiment 5
To a mixture of 100 parts by weight of MMA, 25 parts by weight of the compound (6-1) described in Preparation Example 1, and 20 parts by weight of dimethylol-tricyclodecane diacrylate (DMTCDDA), 0.3 part by weight of benzoyl peroxide and t- 0.3 parts by weight of butylperoxy-3,5,5-trimethylhexanoate was added and mixed, and then deaerated to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, and then heated from 60 ° C. to 130 ° C. over 3 hours. The polymerization was carried out while keeping the temperature constant for a period of time.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state.
[0046]
Embodiment 6
To a mixture of 100 parts by weight of MMA, 30 parts by weight of the compound (6-1) described in Preparation Example 1, and 30 parts by weight of isobornyl methacrylate (IBMA), 0.1 part of t-butylperoxy-2-ethylhexanoate was added. 2 parts by weight and 0.1 part by weight of t-butylperoxy-3,5,5-trimethylhexanoate were added and mixed, followed by degassing to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 70 ° C. for 2 hours, then heated from 70 ° C. to 130 ° C. over 4 hours, and then heated at 130 ° C. for 1 hour. The polymerization was carried out while keeping the temperature constant for a period of time.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state.
[0047]
Embodiment 7
A mixture of 100 parts by weight of MMA, 20 parts by weight of the compound (6-2) described in Preparation Example 2, and 15 parts by weight of dicyclopentenyl acrylate (DCPteA) was added with 0.3 parts by weight of benzoyl peroxide and t-butylperoxy. 0.2 parts by weight of laurate was added and mixed, and then deaerated to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, then heated from 60 ° C. to 110 ° C. over 2 hours, and then heated at 110 ° C. for 1 hour. The polymerization was carried out at 130 ° C. for 1 hour and at a constant temperature for 1 hour.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state.
[0048]
Embodiment 8
In a mixture of 100 parts by weight of MMA and 60 parts by weight of dicyclopentenyloxyethyl acrylate (DCPteOEA), 0.2 parts by weight of t-butylperoxy-2-ethylhexanoate and t-butylperoxy-3,5,5 0.1 part by weight of trimethylhexanoate was added and mixed, and then degassed to prepare for polymerization.
This composition was poured into the same casting polymerization mold as shown in Example 1, kept at a constant temperature of 70 ° C. for 2 hours, then heated from 70 ° C. to 130 ° C. over 4 hours, and then heated at 130 ° C. for 1 hour. The polymerization was carried out while keeping the temperature constant for a period of time.
During the polymerization, the polymerization slightly ran away at around 90 ° C., and the resin plate obtained by demolding showed a slight wakame phenomenon.
[0049]
[Comparative Example 1]
To 100 parts by weight of MMA, 0.3 parts by weight of benzoyl peroxide and 0.2 parts by weight of t-butylperoxy-3,5,5-trimethylhexanoate were added and mixed, followed by degassing to prepare for polymerization.
This composition was poured into the same casting polymerization mold as in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, then heated from 60 ° C. to 130 ° C. over 2 hours, and then heated at 130 ° C. for 1 hour. The polymerization was carried out while keeping the temperature constant for a period of time.
No abnormality was observed during the polymerization, and the mold was removed to obtain a transparent resin plate having a good surface state. However, the water absorption of the resin was 0.5% or more.
[0050]
[Comparative Example 2]
In a mixture of 100 parts by weight of MMA and 25 parts by weight of ethylene glycol dimethacrylate (EGDMA), 0.2 parts by weight of t-butylperoxy-2-ethylhexanoate and t-butylperoxy-3,5,5- 0.1 part by weight of trimethylhexanoate was added and mixed, and then degassed to prepare for polymerization.
This composition was poured into the same casting polymerization mold as in Example 1, kept at a constant temperature of 60 ° C. for 2 hours, then heated from 60 ° C. to 130 ° C. over 4 hours, and then heated at 130 ° C. for 1 hour. The polymerization was carried out while keeping the temperature constant for a period of time.
During the polymerization, the polymerization runaway occurred at around 80 ° C., and the resin plate obtained by demolding exhibited a wakame phenomenon on almost the entire surface.
The compositions and composition ratios of Examples 1 to 9 and Comparative Examples 1 and 2 are shown in Table 1 (Table 1), and physical properties of the resins are shown in Table 2 (Table 2).
[0051]
[Table 1]
[0052]
[Table 2]
[0053]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, methacrylic-type resin excellent in transparency, low water absorption, heat resistance, rigidity, chemical resistance, etc. can be provided with high productivity, without involving runaway of a polymerization reaction. Further, it is possible to provide a transparent member, a transparent member for a display, and a transparent member for an automobile which are excellent in the above characteristics.
Claims (8)
〈2〉下記一般式(1)(化1)〜(5)(化5)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
を含有する組成物を重合してなることを特徴とするメタクリル系樹脂。
<2> a compound selected from the group of compounds represented by the following general formulas (1) (Chem. 1) to (5) (Chem. 5)
<3> radical initiator,
A methacrylic resin obtained by polymerizing a composition containing
〈2〉上記一般式(1)〜(5)で表される化合物群から選ばれた化合物、
〈3〉ラジカル開始剤、
〈4〉下記一般式(6)で表される化合物、
を含有する組成物を重合してなることを特徴とするメタクリル系樹脂。
<2> a compound selected from the group of compounds represented by the general formulas (1) to (5),
<3> radical initiator,
<4> a compound represented by the following general formula (6),
A methacrylic resin obtained by polymerizing a composition containing
ジシクロペンタニルアクリレート、ジシクロペンタニルメタクリレート、ジシクロペンテニルアクリレート、2−(ジシクロペンテニルオキシ)エチルアクリレート、2−(ジシクロペンテニルオキシ)エチルメタクリレート、ジメチロール−トリシクロデカンジアクリレート、イソボルニルアクリレート、イソボルニルメタクリレート、シクロヘキシルアクリレート、シクロヘキシルメタクリレートのいずれかである請求項1〜2記載のメタクリル系樹脂。Compounds selected from the group of compounds represented by general formulas (1) to (5)
Dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, 2- (dicyclopentenyloxy) ethyl acrylate, 2- (dicyclopentenyloxy) ethyl methacrylate, dimethylol-tricyclodecane diacrylate, isobornyl The methacrylic resin according to claim 1, which is any one of acrylate, isobornyl methacrylate, cyclohexyl acrylate, and cyclohexyl methacrylate.
(a)10時間半減期温度50〜75℃の有機過酸化物、
(b)10時間半減期温度95〜120℃の有機過酸化物
からそれぞれ少なくとも1種を併用することを特徴とする請求項1〜3記載のメタクリル系樹脂。Radical initiator,
(A) an organic peroxide having a 10-hour half-life temperature of 50 to 75 ° C.,
The methacrylic resin according to any one of claims 1 to 3, wherein at least one of (b) an organic peroxide having a 10-hour half-life temperature of 95 to 120 ° C is used in combination.
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WO2004108778A1 (en) * | 2003-06-09 | 2004-12-16 | Mitsui Chemicals, Inc. | Crosslinkable methacrylic resin composition and transparent member |
JP2007168261A (en) * | 2005-12-22 | 2007-07-05 | Riken Technos Corp | Matte decorative sheet |
JP2012508803A (en) * | 2008-11-14 | 2012-04-12 | エボニック レーム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Copolymers for producing heat-deformable molded bodies from molding materials or cast transparent sheets |
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WO2022090857A1 (en) * | 2020-10-29 | 2022-05-05 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and abbe number |
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Cited By (11)
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WO2004108778A1 (en) * | 2003-06-09 | 2004-12-16 | Mitsui Chemicals, Inc. | Crosslinkable methacrylic resin composition and transparent member |
JP2007168261A (en) * | 2005-12-22 | 2007-07-05 | Riken Technos Corp | Matte decorative sheet |
JP2012508803A (en) * | 2008-11-14 | 2012-04-12 | エボニック レーム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Copolymers for producing heat-deformable molded bodies from molding materials or cast transparent sheets |
US11667742B2 (en) | 2019-05-03 | 2023-06-06 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and Abbe number |
US11708440B2 (en) | 2019-05-03 | 2023-07-25 | Johnson & Johnson Surgical Vision, Inc. | High refractive index, high Abbe compositions |
US11958923B2 (en) | 2019-05-03 | 2024-04-16 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and abbe number |
US12071497B2 (en) | 2019-05-03 | 2024-08-27 | Johnson & Johnson Surgical Vision, Inc. | High refractive index, high Abbe compositions |
CN112442150A (en) * | 2019-08-30 | 2021-03-05 | 中国石油化工股份有限公司 | High molecular polymer and preparation method thereof |
CN112442150B (en) * | 2019-08-30 | 2022-09-20 | 中国石油化工股份有限公司 | High molecular polymer and preparation method thereof |
WO2022090857A1 (en) * | 2020-10-29 | 2022-05-05 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and abbe number |
US11795252B2 (en) | 2020-10-29 | 2023-10-24 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and Abbe number |
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