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JP2004034319A5 - - Google Patents

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Publication number
JP2004034319A5
JP2004034319A5 JP2002190355A JP2002190355A JP2004034319A5 JP 2004034319 A5 JP2004034319 A5 JP 2004034319A5 JP 2002190355 A JP2002190355 A JP 2002190355A JP 2002190355 A JP2002190355 A JP 2002190355A JP 2004034319 A5 JP2004034319 A5 JP 2004034319A5
Authority
JP
Japan
Prior art keywords
laminated board
cutting
segmentation
baking
division
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002190355A
Other languages
Japanese (ja)
Other versions
JP2004034319A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002190355A priority Critical patent/JP2004034319A/en
Priority claimed from JP2002190355A external-priority patent/JP2004034319A/en
Priority to TW092117047A priority patent/TWI232797B/en
Priority to KR1020030042313A priority patent/KR100621453B1/en
Priority to CNB031484778A priority patent/CN1280074C/en
Publication of JP2004034319A publication Critical patent/JP2004034319A/en
Publication of JP2004034319A5 publication Critical patent/JP2004034319A5/ja
Pending legal-status Critical Current

Links

Claims (1)

前記焼成後に積層板を分断する場合のその分断を、切断砥石を使用して行うことを特徴とする請求項1〜3いずれか1項記載の積層板の切断方法The cutting method of the laminated board of any one of Claims 1-3 which performs the division | segmentation in the case of dividing a laminated board after the said baking using a cutting grindstone.
JP2002190355A 2002-06-28 2002-06-28 Cutting method for laminated sheet and half-cut device used therein Pending JP2004034319A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002190355A JP2004034319A (en) 2002-06-28 2002-06-28 Cutting method for laminated sheet and half-cut device used therein
TW092117047A TWI232797B (en) 2002-06-28 2003-06-24 Process for cutting laminate boards and half-cutting device used in the process
KR1020030042313A KR100621453B1 (en) 2002-06-28 2003-06-27 Cutting method of laminate and half cut used in the cutting method
CNB031484778A CN1280074C (en) 2002-06-28 2003-06-27 Cut-off method of laminated board, and half-cutting appts. used by such method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002190355A JP2004034319A (en) 2002-06-28 2002-06-28 Cutting method for laminated sheet and half-cut device used therein

Publications (2)

Publication Number Publication Date
JP2004034319A JP2004034319A (en) 2004-02-05
JP2004034319A5 true JP2004034319A5 (en) 2005-05-26

Family

ID=31700292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002190355A Pending JP2004034319A (en) 2002-06-28 2002-06-28 Cutting method for laminated sheet and half-cut device used therein

Country Status (4)

Country Link
JP (1) JP2004034319A (en)
KR (1) KR100621453B1 (en)
CN (1) CN1280074C (en)
TW (1) TWI232797B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780752B2 (en) * 2004-12-28 2011-09-28 Uht株式会社 Cutting device
CN101160021B (en) * 2007-10-31 2010-11-10 无锡凯尔科技有限公司 Whole panel cutting device and cutting method for jigsaw of printed circuit board
JP5145499B2 (en) * 2008-05-14 2013-02-20 国立大学法人福井大学 Method and apparatus for manufacturing modified curved extruded product
KR20110119663A (en) * 2008-12-23 2011-11-02 트렐레보르그 루보레 에이비 How to form a cutting line partially through multi-layered plate structure
TWI462885B (en) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
CN102438399B (en) * 2011-09-30 2014-08-06 景旺电子科技(龙川)有限公司 Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
CN104028824B (en) * 2014-06-16 2017-02-15 惠州华阳通用电子有限公司 Cut-off PCB (printed circuit board) separator
CN105174180B (en) * 2015-09-24 2018-05-01 山东新华医疗器械股份有限公司 Plastic ampoule rotary slot mechanism
KR101711451B1 (en) * 2015-10-05 2017-03-02 양승철 Pre-cutting line forming apparatus
CN105618857A (en) * 2016-03-28 2016-06-01 胜宏科技(惠州)股份有限公司 Manufacturing method for PCB inner bevel edges
CN105818177A (en) * 2016-04-29 2016-08-03 英拓自动化机械(深圳)有限公司 Cutting tool for circuit boards and method for cutting circuit boards
JP6177412B1 (en) 2016-11-22 2017-08-09 株式会社ソディック Additive manufacturing equipment
CN108040431B (en) * 2017-12-11 2020-01-07 吉安满坤科技股份有限公司 Machining method for copper precipitation front gong groove
CN108135087A (en) * 2018-02-05 2018-06-08 江西景旺精密电路有限公司 A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB
IT201800003287A1 (en) 2018-03-05 2019-09-05 V Shapes S R L ENGRAVING STATION FOR PACKAGING MACHINE AND RELATIVE ENGRAVING METHOD
TWI659790B (en) * 2018-10-24 2019-05-21 得力富企業股份有限公司 Multiple half cutting tool set
CN113400383A (en) * 2021-07-09 2021-09-17 石华 Production process of modified asphalt waterproof coiled material
CN114670271A (en) * 2022-04-06 2022-06-28 林州致远电子科技有限公司 PCB copper-clad plate processing and cutting all-in-one machine

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