JP2004034319A5 - - Google Patents
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- Publication number
- JP2004034319A5 JP2004034319A5 JP2002190355A JP2002190355A JP2004034319A5 JP 2004034319 A5 JP2004034319 A5 JP 2004034319A5 JP 2002190355 A JP2002190355 A JP 2002190355A JP 2002190355 A JP2002190355 A JP 2002190355A JP 2004034319 A5 JP2004034319 A5 JP 2004034319A5
- Authority
- JP
- Japan
- Prior art keywords
- laminated board
- cutting
- segmentation
- baking
- division
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 1
- 230000011218 segmentation Effects 0.000 claims 1
Claims (1)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002190355A JP2004034319A (en) | 2002-06-28 | 2002-06-28 | Cutting method for laminated sheet and half-cut device used therein |
TW092117047A TWI232797B (en) | 2002-06-28 | 2003-06-24 | Process for cutting laminate boards and half-cutting device used in the process |
KR1020030042313A KR100621453B1 (en) | 2002-06-28 | 2003-06-27 | Cutting method of laminate and half cut used in the cutting method |
CNB031484778A CN1280074C (en) | 2002-06-28 | 2003-06-27 | Cut-off method of laminated board, and half-cutting appts. used by such method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002190355A JP2004034319A (en) | 2002-06-28 | 2002-06-28 | Cutting method for laminated sheet and half-cut device used therein |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004034319A JP2004034319A (en) | 2004-02-05 |
JP2004034319A5 true JP2004034319A5 (en) | 2005-05-26 |
Family
ID=31700292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002190355A Pending JP2004034319A (en) | 2002-06-28 | 2002-06-28 | Cutting method for laminated sheet and half-cut device used therein |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004034319A (en) |
KR (1) | KR100621453B1 (en) |
CN (1) | CN1280074C (en) |
TW (1) | TWI232797B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4780752B2 (en) * | 2004-12-28 | 2011-09-28 | Uht株式会社 | Cutting device |
CN101160021B (en) * | 2007-10-31 | 2010-11-10 | 无锡凯尔科技有限公司 | Whole panel cutting device and cutting method for jigsaw of printed circuit board |
JP5145499B2 (en) * | 2008-05-14 | 2013-02-20 | 国立大学法人福井大学 | Method and apparatus for manufacturing modified curved extruded product |
KR20110119663A (en) * | 2008-12-23 | 2011-11-02 | 트렐레보르그 루보레 에이비 | How to form a cutting line partially through multi-layered plate structure |
TWI462885B (en) * | 2010-12-13 | 2014-12-01 | Mitsuboshi Diamond Ind Co Ltd | Method of breaking the substrate |
CN102438399B (en) * | 2011-09-30 | 2014-08-06 | 景旺电子科技(龙川)有限公司 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
CN104028824B (en) * | 2014-06-16 | 2017-02-15 | 惠州华阳通用电子有限公司 | Cut-off PCB (printed circuit board) separator |
CN105174180B (en) * | 2015-09-24 | 2018-05-01 | 山东新华医疗器械股份有限公司 | Plastic ampoule rotary slot mechanism |
KR101711451B1 (en) * | 2015-10-05 | 2017-03-02 | 양승철 | Pre-cutting line forming apparatus |
CN105618857A (en) * | 2016-03-28 | 2016-06-01 | 胜宏科技(惠州)股份有限公司 | Manufacturing method for PCB inner bevel edges |
CN105818177A (en) * | 2016-04-29 | 2016-08-03 | 英拓自动化机械(深圳)有限公司 | Cutting tool for circuit boards and method for cutting circuit boards |
JP6177412B1 (en) | 2016-11-22 | 2017-08-09 | 株式会社ソディック | Additive manufacturing equipment |
CN108040431B (en) * | 2017-12-11 | 2020-01-07 | 吉安满坤科技股份有限公司 | Machining method for copper precipitation front gong groove |
CN108135087A (en) * | 2018-02-05 | 2018-06-08 | 江西景旺精密电路有限公司 | A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB |
IT201800003287A1 (en) | 2018-03-05 | 2019-09-05 | V Shapes S R L | ENGRAVING STATION FOR PACKAGING MACHINE AND RELATIVE ENGRAVING METHOD |
TWI659790B (en) * | 2018-10-24 | 2019-05-21 | 得力富企業股份有限公司 | Multiple half cutting tool set |
CN113400383A (en) * | 2021-07-09 | 2021-09-17 | 石华 | Production process of modified asphalt waterproof coiled material |
CN114670271A (en) * | 2022-04-06 | 2022-06-28 | 林州致远电子科技有限公司 | PCB copper-clad plate processing and cutting all-in-one machine |
-
2002
- 2002-06-28 JP JP2002190355A patent/JP2004034319A/en active Pending
-
2003
- 2003-06-24 TW TW092117047A patent/TWI232797B/en not_active IP Right Cessation
- 2003-06-27 CN CNB031484778A patent/CN1280074C/en not_active Expired - Lifetime
- 2003-06-27 KR KR1020030042313A patent/KR100621453B1/en not_active Expired - Lifetime
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