JP2004017374A - Squeegee for filling conductive paste, method and apparatus for filling conductive paste - Google Patents

Abstract

An object of the present invention is to provide a conductive paste filling squeegee and the like excellent in productivity that can surely fill a conductive via into a micro via provided in a base material.
After a filling operation is performed with a squeegee having a sharp corner or a small R shape in contact with a base material, a scraping operation is performed with a squeegee having a rounded R shape at least larger than the corner in the filling operation. Then, the paste is reliably filled in all the micro vias, so that the micro vias are reliably filled with the conductive paste.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a squeegee for filling a small via with a conductive paste and a conductive paste filling apparatus used for manufacturing a double-sided or multilayer wiring board used for various electronic devices.
[0002]
[Prior art]
In recent years, the density of multilayer wiring boards has been particularly high, and the vias for interlayer connection have been miniaturized accordingly. Of the conductive paste greatly affects the connection resistance value.
[0003]
That is, when the paste is sufficiently filled up to the surface of the substrate, connection between the layers can be obtained. However, when the paste is recessed from the surface of the substrate, the connection resistance between the layers increases. The smaller the via becomes, the greater the influence of the filling factor on the connection resistance value becomes.
[0004]
A conventional conductive paste filling method will be described below.
[0005]
First, a method for manufacturing a circuit board is described with reference to FIGS.
[0006]
FIG. 7A shows that an insulating layer 703 and a cover film 704 are laminated on a base material 702 on which a connection land 701a is formed. Is formed. Here, since the micro via 705 is formed by a laser, a ring-shaped protrusion 705a that projects out from the surface of the cover film 704 by about several μm is generated around the micro via 705 due to the melting and shrinking action due to the heat of the laser. I have.
[0007]
After that, the conductive paste 706 is filled in the minute via 705 by moving the squeegee 707.
[0008]
FIG. 7B shows a state where the cover film 704 is peeled upward after the conductive paste 706 is filled.
[0009]
FIG. 7C shows a state in which the patterned copper foils 708 are laminated and hot pressed. At this time, on the surface of the patterned copper foil 708, the portion where the connection land 701a is in the lower layer is convex, and the portion where the connection land 701a is not in the lower layer is concave, causing slight undulation.
[0010]
FIG. 7D shows a state where the pattern copper foil 707 on the surface layer is patterned to form the connection lands 701b.
[0011]
In FIG. 7E, a connection land 701b is formed, and an insulating layer 703 and a cover film 704 are adhered to each other. A micro via 705 matching the connection land 701b is formed by laser. At this time, the surface of the cover film 704 is convex at the portion where the connection land 701b and the circuit pattern are in the lower layer, and is concave at the portion where the connection land 701b and the circuit pattern are not in the lower layer, thereby causing more complicated undulation.
[0012]
In order to multi-layer the substrate, these steps are repeatedly performed.
[0013]
As a first conventional example of a squeegee, a paste filling method using a method of inclining a flat squeegee will be described with reference to FIG. FIG. 6 shows the state of FIG. 7 (e). The material of the squeegee 601 is made of hard urethane rubber and is inclined in the direction of the arrow indicating the squeegee traveling direction. This inclination facilitates the rolling movement of the conductive paste 706 and facilitates the filling of the minute via 705. Further, the straightness of the ridge line at the corner of the squeegee 601 which is in contact with the cover film 704 is improved by polishing the bottom 601a of the squeegee 601.
[0014]
Further, the squeegee 601 is sandwiched by a holder (not shown) and is protruded and held so as to obtain an appropriate elasticity. Thus, even if the surface of the cover film 704 is undulating, it moves while following and fills the paste.
[0015]
As a second conventional example, FIG. 5 shows paste filling using a squeegee made of a thin metal plate having elasticity. FIG. 5 shows the state of FIG. 7 (e). The metal squeegee 501 is inclined in the direction of the arrow indicating the traveling direction. This inclination facilitates the rolling movement of the conductive paste 706 and facilitates the filling of the minute via 705. Further, the metal squeegee 501 is sandwiched by a holder (not shown) and is protruded and held so as to obtain an appropriate elasticity. Thus, even if the surface of the cover film 704 is undulating, it moves while following and fills the paste.
[0016]
As a third conventional example, FIG. 4 shows paste filling using a squeegee (Japanese Patent Application Laid-Open No. 2001-88271) in which a portion made of hard rubber and in contact with the substrate surface is hardened. FIG. 4 shows the state of FIG. The material of the squeegee 401 is made of hard rubber, and is inclined in a direction indicated by an arrow indicating a traveling direction of the squeegee. This inclination facilitates the rolling movement of the conductive paste 706 and facilitates the filling of the minute via 705. Further, a metal plate 401a is attached to the bottom of the squeegee, and a portion in contact with the cover film 704 is cured. Further, the squeegee 401 is sandwiched by a holder (not shown) and is protruded and held so as to obtain an appropriate elasticity. Thus, even if the surface of the cover film 704 is undulating, it moves while following and fills the paste.
[0017]
[Problems to be solved by the invention]
However, when the conductive paste is filled into the micro vias in Conventional Example 1, the corners of the squeegee that come into contact with the cover film have sharp edges, and the rigidity decreases toward the tip. This causes the squeegee tip to enter the via due to the pressing force of the squeegee during the filling of the minute via. For this reason, the surface of the filled conductive paste is hollowed out, and the filling amount of the conductive paste is insufficient. The phenomenon in which the surface of the conductive paste is recessed depends on the pressing force of the squeegee against the base material. If the pressing force is increased, the amount of the squeegee tip that enters the via increases. Conversely, when the pressing force is reduced, the amount of the squeegee tip that enters the via decreases, but the conductive paste remains on the cover film. When the conductive paste remains on the cover film, in the step of peeling the cover film, the already filled conductive paste is removed from the minute via while being attached to the cover film. Further, the viscosity of the conductive paste rapidly increases due to the paste resin component adhering to the cover film.
[0018]
This causes a connection failure due to an insufficient amount of conductive paste filling and an increase in the amount of conductive paste used due to a shortened conductive paste life.
[0019]
In the filling of the conductive paste into the small vias in the conventional example 2, since the contact portion of the squeegee to the cover film is made of metal, there is no phenomenon that the tip of the squeegee enters the vias while passing through the small vias. However, since the micro vias are formed by a laser, the periphery of the micro vias protrude from the cover film surface by several μm due to the heat of the laser to form ring-shaped protrusions. When the conductive squeegee is moved, the protrusion around the micro via is scraped off by the tip of the metal squeegee. There is a problem that the shaved debris enters the inside of the minute via or is mixed in the conductive paste.
[0020]
This causes a connection failure due to an insufficient filling amount of the conductive paste or mixing of shavings into the minute via.
[0021]
In filling the conductive paste into the micro vias in Conventional Example 3, a metal plate is attached to the bottom of the squeegee to harden the portion in contact with the cover film. Here, when the metal plate attached to the bottom of the squeegee is filled with the paste while contacting the cover film, the problem described in the second conventional example similarly occurs.
[0022]
When a resin member softer than metal is attached to the tip of the squeegee and the tip is hardened, the phenomenon of filling the paste differs depending on the pressing force of the squeegee. In other words, the squeegee tip does not penetrate into the via when the pressing force is weak. The filling amount of the conductive paste is insufficient, or the conductive paste remains on the surface of the cover film. Further, when the pressing force is increased, the micro via projections are strongly rubbed, so that the projections are pressed and bent inside the micro vias or are scraped off. Here, if the resin member is further softened, the phenomenon of scraping can be avoided, but the tip of the squeegee is pushed into the via, and the filled conductive paste surface is hollowed out and becomes concave.
[0023]
This causes a connection failure due to an insufficient amount of conductive paste filling and an increase in the amount of conductive paste used due to a shortened conductive paste life.
[0024]
The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to fill a conductive paste into a fine via provided in a base material with excellent productivity, which can surely fill the conductive paste. A squeegee and a conductive paste filling device are provided.
[0025]
[Means for Solving the Problems]
A first aspect of the present invention is a squeegee used when a conductive paste is filled in micro vias provided in a base material,
A squeegee for filling a conductive paste, wherein a corner in contact with the base material is rounded into an R shape.
[0026]
A second aspect of the present invention is a squeegee used when a conductive paste is filled in micro vias provided in a base material,
A conductive paste filling squeegee in which one corner in contact with the base material is rounded into an R shape and the opposite corner is sharp.
[0027]
A third aspect of the present invention is a squeegee used when filling a conductive paste into a micro via provided in a base material,
One corner in contact with the base material is rounded into an R shape, and the R shape of the opposite corner is a conductive paste filling squeegee different from the R shape of the one corner.
[0028]
According to a fourth aspect of the present invention, there is provided the squeegee for filling a conductive paste according to any one of the first to third aspects, wherein the squeegee includes a holder and hard rubber, and the hardness of the hard rubber held on the holder is 60 to 90. is there.
[0029]
A fifth aspect of the present invention is a method of filling a conductive paste into a micro via provided in a base material,
This is a conductive paste filling method in which a conductive paste supplied in front of a squeegee is filled at a sharp corner of the squeegee and then the paste is scraped off at a rounded R portion of the squeegee.
[0030]
A sixth aspect of the present invention is a method of filling a conductive via into a micro via provided in a base material,
This is a conductive paste filling method in which the conductive paste supplied in front of the squeegee is filled in a rounded R portion of the squeegee, and then the paste is scraped off in an R portion larger than the R portion.
[0031]
According to a seventh aspect of the present invention, there is provided a base for holding and fixing a base material provided with micro vias, and abuts on an outer peripheral portion of the base material placed on an upper surface of the base except for a conductive paste filling region. A plate frame, a support movable relative to the substrate, a squeegee provided on the support and having at least a vertically movable corner in contact with the substrate rounded into an R shape, and a squeegee having an arbitrary angle. And a squeegee moving mechanism.
[0032]
As described above, according to the present invention, since the corner of the squeegee that comes into contact with the base material is rounded in an R shape, the conductive paste surface in the micro via is not cut off, so that the micro via can be filled with a sufficient amount of paste. . Here, the scraping operation is to remove the paste adhering to the periphery of the micro via and the surface of the base material.At the same time, the paste is added to the slightly concave paste in the micro via, and the surface of the base material is filled. A uniforming operation is also performed to make the upper surface of the via paste and the upper surface of the via paste even.
[0033]
Further, after the filling operation is performed with a squeegee having a sharp corner or a small R shape in contact with the base material, the scraping operation is performed with a squeegee having a rounded R shape at least larger than the corner in the filling operation. This ensures that all the micro vias can be filled with the paste. Since the protrusions around the micro vias are not scraped off during filling, no shavings are mixed into the micro vias and the conductive paste, so the paste filling quality to the micro vias is stabilized and the consumption of conductive paste is reduced. It becomes possible.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0035]
The method for manufacturing the base material according to the embodiment of the present invention has already been described with reference to FIG.
[0036]
Next, a paste containing copper powder as a main component was produced and used as a conductive paste to be filled in the minute vias to form a conductor circuit in the minute vias.
[0037]
As the conductive conductive paste, a copper powder having an average particle diameter of 2 μm was used as a conductive filler, a thermosetting epoxy resin (solvent-free type) was used as a resin, and an acid anhydride-based curing agent was used as a curing agent. The mixing ratio was 85% by weight of copper powder, 12.5% by weight of an epoxy resin, and 2.5% by weight of a curing agent, and they were sufficiently kneaded. The viscosity was 20 Pa · S.
[0038]
Next, the configuration of the conductive paste filling apparatus according to the first embodiment will be described with reference to the cross-sectional view of FIG.
[0039]
It is composed of a base 301, a plate frame 302, a guide shaft 303, a squeegee 304, a support 305, and an up-and-down elevating guide shaft 306, the function of which is to seal the back side of the base material 700 and place the squeegee 304 The conductive paste 706, which is closely arranged and supplied in the forward direction of the squeegee 304, is passed over the minute via 705 by moving the squeegee 304.
[0040]
In order to uniformly hold and fix the base material 700 so as not to generate wrinkles and undulations, countless vacuum suction holes 307a made of porous sintered metal are provided at least in an area inside the outer shape of the base material 700. The suction member 307 is buried on the upper surface of the base 301 and is configured. A plurality of suction grooves 307b are provided on the lower surface of the suction member 307, and the suction grooves 307b are assembled together and then evacuated from a vacuum exhaust port 307c provided through the inside of the base 301 to a vacuum exhaust means such as a vacuum pump. (Not shown).
[0041]
Further, the base upper surface 301a of the base 301 including the base material holding surface 307d of the suction member 307 is finished to a flatness of 0.02 mm or less, so that a step with the base material holding surface 307d does not occur. This is for holding and fixing the substrate 700 uniformly.
[0042]
The plate frame 302, which is in contact with the outer peripheral portion of the base material 700 held and fixed to the base 301 excluding the conductive paste filling region, is moved by a plate frame elevating guide (not shown) and a plate frame elevating drive mechanism (not shown). The vertical movement is enabled in parallel with the base material holding surface 307d of the suction member 307. This enables uniform contact with the outer peripheral portion of the plate frame 302 excluding the conductive paste filled region of the base material 700.
[0043]
In addition, a 60-degree chamfer is formed on at least two corners of the inner periphery of the plate frame 302 that is in contact with the outer periphery of the base material 700 and that is perpendicular to the squeegee moving direction, and a tip angle of the side is a 30-degree knife edge. A portion 302a is provided. The upper surfaces of the inclined portion 302a and the plate frame 302 are mirror-finished by buffing. Thereby, the squeegee can be smoothly moved on the upper surface of the plate frame 302 and the upper surface of the inclined portion 302a at the time of squeegee contact. That is, the upper surface of the plate frame 302 and the inclined portion 302a are smooth.
[0044]
Above the base 301, a pair of guide shafts 303 are supported in parallel with each other and in parallel with the base material holding surface 307d of the suction member 307. A support 305 to which a squeegee 304 is attached is attached to the guide shaft 303 via a sliding member such as a slide bearing so as to be movable in the longitudinal direction of the guide shaft 303. It can be driven by driving means (not shown) such as a ball screw or an air cylinder. Thus, the support 305 can move in the longitudinal direction of the guide shaft 303 with respect to the substrate 700 uniformly held on the substrate holding surface 307d.
[0045]
The support body 305 includes a vertical lifting guide shaft 306 and a pressing force adjusting mechanism (not shown) such as a regulator. Further, a squeegee 304 is provided at a lower end of the vertical lifting guide shaft 306 via a squeegee holder 304a and a rotation shaft 304b. Can be set at a predetermined angle with respect to the base material 700, and can be fixed by a rotation shaft fixing mechanism (not shown). As a result, the squeegee 304 can be set and fixed at a predetermined angle and can move in the vertical direction, and can obtain a predetermined pressing force.
[0046]
Next, the squeegee 304 will be described in detail with reference to FIGS. The squeegee 304 is guided by a guide shaft and moves in the direction of filling and scraping.
[0047]
FIG. 1A shows a state in which the squeegee 304 is moved in the filling direction. The squeegee 304 is held by a squeegee holder 304a and fixed at a position inclined by a predetermined angle about a rotation shaft 304 (b) as a fulcrum. I have. The corners that come into contact with the substrate are sharp or slightly rounded at the tip.
[0048]
FIG. 1B shows a state in which the squeegee 304 is moved in the direction of scraping opposite to the filling direction. It is fixed at an inclined position. At least one corner in contact with the substrate is rounded into at least an R shape larger than the slightly rounded R shape in the filling direction.
[0049]
Next, a filling method will be described with reference to FIGS.
[0050]
FIG. 2A shows a state in which the base material 700 is vacuum-fixed and fixed to the base material holding surface 307d, and the outer peripheral portion excluding the conductive paste filling region is pressed by the plate frame 302. The squeegee 304 is fixed after the angle adjustment so that the sharp corner of the squeegee 304 shown by the broken line is in contact with the base material 700. Further, the squeegee 304 is positioned at the squeegee initial position P1 above the plate frame 302.
[0051]
Next, the conductive paste 706 is supplied onto the plate frame 302 with a width covering at least the filling region and an amount capable of filling a predetermined number of sheets using a supply unit such as a dispenser.
[0052]
Next, as shown by the solid line, the squeegee 304 is lowered to the squeegee filling movement start position P2 on the plate frame 302. At this time, the squeegee 304 is in close contact with the plate frame 302 at a predetermined pressure.
[0053]
Next, when the squeegee 304 is moved in the filling direction indicated by an arrow in a state in which the squeegee 304 is in close contact with the plate frame 302, the conductive paste 706 supplied onto the plate frame 302 is scraped up, and Then, it passes smoothly over the inclined portion 302a and the substrate 700 while maintaining a predetermined pressing force, and further reaches the squeegee movement end position P3.
[0054]
When the squeegee 304 reaches the micro via 705 provided on the base material 700 during the movement, the conductive paste 706 is filled into the micro via 705 by a pressing action. However, at this point, since the tip of the squeegee 304 is sharp, the conductive paste 706 rolls and has an excellent filling effect, but the sharp tip enters the micro via 705 and the paste surface is cut off. Such an operation is repeatedly performed in the conductive paste filling region of the base material 700, and the filling amount is insufficient for all the micro vias 705.
[0055]
Since the squeegee 304 moves on the base material 700 at a predetermined pressure, the conductive paste 706 does not remain in a region other than the micro via 705 on the base material 700. The squeegee is raked at the squeegee movement end position P3 on the frame 302.
[0056]
Next, a method of scraping the conductive paste with a squeegee having a rounded corner in contact with the substrate 700 in an R shape will be described with reference to FIG. After the filling operation at the sharp corner of the squeegee 304, the angle of the squeegee 304 is reversed so that the corner rounded into an R shape at the position P4 indicated by the broken line contacts the substrate 700.
[0057]
Next, as shown by the solid line, the squeegee 304 is lowered to the squeegee scraping movement start position P3 'on the plate frame 302. At this time, the squeegee 304 is in close contact with the plate frame 302 at a predetermined pressure.
[0058]
Next, when the squeegee 304 is moved in the scraping direction indicated by an arrow in a state in which the squeegee 304 is in close contact with the plate frame 302, the conductive paste 706 on the plate frame 302 is scraped up and the mirror-finished plate frame 302 and the inclined surface are tilted. It passes smoothly through the portion 302a and the substrate 700 while maintaining a predetermined pressure, and further reaches the squeegee movement end position P2 '.
[0059]
During the movement, when the squeegee 304 reaches the micro via 705 provided on the base material 700, the squeegee pressing force is dispersed because the corners are rounded even though the squeegee 304 is made of urethane rubber and is soft. It does not enter the via 705. Here, the rubber hardness at which the R-shaped portion of the squeegee 304 did not enter the minute via with respect to a predetermined pressing force was 60 or more. Furthermore, since the rounded squeegee corners are made of urethane rubber and are soft, the protrusions around the micro vias generated during laser formation are not scraped off or scraped off.
[0060]
By this action, the surface of the paste filled in the micro via 705 is leveled with the protrusion. Such an operation is repeatedly performed in the conductive paste filling region of the base material 700, and the filling amount of all the micro vias 705 is sufficiently filled.
[0061]
Note that the squeegee 304 protrudes from the squeegee holder 304a, and absorbs irregularities against undulations on the base material 700 when it moves on the base material 700 with a predetermined pressure. That is, since the squeegee 304 protrudes from the squeegee holder 304a, the protruding portion is easily bent, and easily follows the undulation irregularities.
[0062]
Furthermore, since the corners of the squeegee 304 that come into contact with the base material 700 are rounded, a part of the R shape can always be stably brought into contact with a change in the contact point when the deflection of the squeegee 304 is absorbed. It becomes possible. As a result, the conductive paste 706 does not remain in the region except for the micro via 705, and after the movement of the squeegee 304 is completed, the conductive paste 706 is raked to the squeegee movement end position P2 ′ on the plate frame 302.
[0063]
In the second embodiment, a squeegee having a slightly rounded corner is used in place of the sharp squeegee used in the filling operation. This is because, in a squeegee having a sharp corner, the upper portion of the squeegee slightly comes in contact with the base material due to the pressing force and the moving operation, so that the wear of this portion progresses most. Due to this abrasion, the pointed tip becomes wavy, and the filling state becomes unstable, and it is necessary to re-polish periodically.
[0064]
Here, the life of the squeegee was improved to about three times by rounding the tip to R0.3 mm. The rolling action of the conductive paste with a squeegee having a rounded R at the tip to a size of 0.3 mm was almost equivalent to a squeegee having sharp corners. However, the surface of the conductive paste after the filling operation is recessed from the upper surface of the micro via.
[0065]
Next, when the size of R at the tip is larger than 0.3 mm, the scouring of the conductive paste surface is reduced, but it is impossible to reliably fill all the micro vias provided in the base material with the conductive paste. I could not do it. In other words, the filling of the conductive paste into the minute via becomes uncertain because providing a large R shape at the corner of the squeegee impedes the rolling action.
[0066]
Therefore, after performing the filling operation described in the first embodiment with a squeegee having a rounded corner having a radius of 0.3 mm, the squeegee is inverted in angle to have an R shape larger than at least one of the filling operations. A scraping operation was performed at the rounded corner. After the scraping operation, the micro vias are securely filled, and the paste surface is leveled with the protrusions, and the conductive paste is scraped off in the region other than the micro vias on the base material without remaining. Was. .
[0067]
It should be noted that the present invention is not limited to the above-described embodiment, and similar effects can be obtained by changing the configuration as described below.
(A) In this embodiment, the angle of the squeegee is inverted and switched to a sharp corner and a rounded corner, but a pair of squeegee mechanism units may be provided for filling and scraping.
(B) In the second embodiment, a squeegee having a corner with a rounded tip of R 0.3 mm is used for filling. However, an appropriate R size is determined by the material and hardness of the squeegee, the paste composition, the viscosity, and the like. Applicable.
(C) The base material is not limited to a divided one, and a roll sheet-shaped base material can be used, and the apparatus can be continuously filled with the functions of a supply unit and a winding unit.
(D) A ceramic green sheet may be used as the base material, and a mask plate provided with holes corresponding to the positions of the minute vias may be mounted on the plate frame.
[0068]
【The invention's effect】
As described above, according to the present invention, a small via can be filled with a sufficient amount of paste, and as a result, the paste filling quality into the small via can be stabilized and the consumption of the conductive paste can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram schematically illustrating a conductive paste filling squeegee according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a conductive paste filling method according to an embodiment of the present invention. FIG. 4 is a diagram schematically illustrating a conductive paste filling apparatus according to an embodiment of the invention. FIG. 4 is a diagram illustrating filling of a conductive paste according to a third related art. FIG. 5 is a conductive paste filling according to a second related art. FIG. 6 is a diagram illustrating filling of a conductive paste according to a first conventional technique. FIG. 7 is a diagram schematically illustrating a method of manufacturing a base material according to an embodiment of the present invention.
304 Squeegee 304a Squeegee holder 304b Rotation axis

Claims (7)

A squeegee used when filling the conductive paste into the micro vias provided in the base material,
A squeegee for filling a conductive paste, wherein a corner in contact with the base material is rounded into an R shape. A squeegee used when filling the conductive paste into the micro vias provided in the base material,
A conductive paste filling squeegee in which one corner in contact with the base material is rounded into an R shape and the opposite corner is sharp. A squeegee used when filling the conductive paste into the micro vias provided in the base material,
A conductive paste filling squeegee wherein one corner in contact with the base material is rounded into an R shape, and the R shape of the opposite corner is different from the R shape of the one corner. The conductive paste filling squeegee according to any one of claims 1 to 3, comprising a holder and a hard rubber, wherein the hardness of the hard rubber held at the upper portion by the holder is from 60 to 90. A method of filling a conductive paste into micro vias provided in a base material,
A conductive paste filling method in which a conductive paste supplied in front of a squeegee is filled at a sharp corner of the squeegee, and then the paste is scraped off at a rounded R portion of the squeegee. A method of filling a conductive paste into micro vias provided in a base material,
A conductive paste filling method in which a conductive paste supplied in front of a squeegee is filled in a rounded R portion of a squeegee, and then the paste is scraped off in an R portion larger than the R portion. A base for holding and fixing the base provided with the micro vias, a plate frame abutting on an outer peripheral portion of the base placed on the upper surface of the base excluding a conductive paste filling region, and the base A squeegee that is relatively movable with respect to the squeegee provided on the support, the squeegee having at least a vertically movable corner in contact with the substrate, and a mechanism for adjusting and fixing the squeegee at an arbitrary angle. And a squeegee moving mechanism.

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