JP2003347708A - Transfer method of electrode pattern and manufacturing method of hybrid electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer method of an electrode pattern and a manufacturing method of a hybrid electronic component capable of easy transfering to a destination while an electrode pattern of a desired dimension is surely transferred to the destination. <P>SOLUTION: A conductive paste is applied by screen-printing to a releasing surface 1a of a transfer film 1 where a mold releasing treatment is applied to its surface to provide a peeling strength of 250-1000 mN/25 mm, to form a land pattern (electrode pattern) 2 for mounting a chip component. The transfer film 1 is placed on the upper surface of a laminate 10, which is a destination, with the releasing surface 1a, where the land pattern 2 for mounting a chip component is formed, being faced down. The transfer film 1 is pressed under a prescribed pressure. The pressure is preferred to be 20-60 N/mm<SP>2</SP>. Then, by peeling off the transfer film 1, the land pattern 2 for mounting a chip component is transferred on the upper surface of the laminate 10. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for transferring an electrode pattern and a method for manufacturing a composite electronic component, and more particularly to a method for manufacturing a composite electronic component such as a multilayer ceramic substrate or a multilayer ceramic substrate on which chip components are mounted.

[0002]

2. Description of the Related Art Conventionally, a method described in Japanese Patent Application Laid-Open No. 57-60896 has been known as a method of manufacturing a multilayer ceramic substrate. In this method, as shown in FIGS. 10A to 10E, a plurality of wiring conductor layers 52 are stacked via an insulating layer 51 made of ceramic to form a laminate (FIG. 10A).
(A)), a wiring conductor layer 54 formed by printing with a conductive paste on the surface of the transfer film 53 is superimposed on the laminated body (FIG. 10B), and heated and pressed (FIG. 10B).
(C)), the wiring film 53 is transferred to the surface of the laminate by peeling off the transfer film 53 (FIG. 10D) (FIG. 10E).

[0003]

However, generally, a transfer film used in a method for manufacturing a multilayer ceramic substrate has a peel strength of 30 to 200 mN / 25 mm (J).
There was only IS standard K6854), and the wiring conductor printed on the transfer film was sometimes peeled off before transfer. Further, when the peel strength of the transfer film is low (the wettability of the wiring conductor is low), the wiring conductor transferred to the transfer target is repelled, and a wiring conductor having a desired size may not be obtained. Further, there is a problem that the wiring conductor is easily peeled off from the transferred body even after the wiring conductor on the transferred body is dried.

Accordingly, an object of the present invention is to provide a method of transferring an electrode pattern and a composite electronic device which can easily transfer an electrode pattern of a desired size to a transfer object, and can easily transfer the electrode pattern to the transfer object. An object of the present invention is to provide a method for manufacturing a component.

[0005]

In order to achieve the above object, a method for transferring an electrode pattern according to the present invention comprises:
(A) The surface is subjected to a release treatment to have a peel strength of 250 to 10
A step of forming an electrode pattern on the release surface of the transfer film having a thickness of 00 mN / 25 mm; and (b) superposing the electrode pattern formed on the release surface of the transfer film in contact with the surface of the object to be transferred. And a step of transferring the electrode pattern to the surface of the transfer-receiving body by removing the transfer film after pressing at a pressing pressure of.

The transfer object is, for example, a laminate of a composite electronic component formed by stacking an internal conductor and an insulating layer, and a part of the via hole for interlayer connection electrically connected to the internal conductor is formed on the surface of the laminate. And an electrode pattern is transferred so as to be electrically connected to the via hole for interlayer connection. As the transfer film, a PET film or the like is used.

The peel strength of the release surface is 250 to 1000 mN
By using a / 25 mm transfer film, the transfer operation to the transfer object is facilitated. Because the peel strength is 2
If the thickness is less than 50 mN / 25 mm, the electrode pattern formed on the transfer film may be peeled off before the transfer. On the other hand, if the peel strength exceeds 1000 mN / 25 mm, the electrode pattern becomes difficult to separate from the transfer film and may remain on the transfer film when the electrode pattern is transferred to the transfer target.

[0008] Further, it is preferable that the pressing pressure at the time of transferring the electrode pattern to the object to be transferred is set to 20 N / mm ² or more and 60 N / mm ² or less. Because the press pressure is 20
If the thickness is less than N / mm ² , the variation in the thickness of the electrode pattern increases, and the length of the flat portion of the electrode pattern decreases. On the other hand, if the pressing pressure exceeds 60 N / mm ² , the electrode pattern is strongly pressed and the thickness becomes too thin. Thereby, the flatness of the electrode pattern is improved, so that when the chip component is mounted on the surface of the laminate, the electrical connection between the external electrode of the chip component and the electrode pattern is improved.

Further, by setting the thickness of the transfer film to 75 μm or more, the mechanical strength of the transfer film increases, and the transfer film becomes easy to handle. Further, by forming the transfer film from an opaque material, the alignment when forming the electrode pattern on the transfer film becomes easy.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for manufacturing a composite electronic component according to the present invention will be described with reference to the accompanying drawings.

[First Embodiment, FIGS. 1 to 7] As shown in FIG.
Release surface 1 of transfer film 1 of 000 mN / 25 mm
A conductive paste is screen-printed on a to form a land pattern (electrode pattern) 2 for mounting chip components.
Here, the peel strength means that a conductive tape is screen-printed on the surface of the transfer film 1 to form a test tape having a pattern width of 25 mm, and the force required to peel the test tape is measured. (JIS K6854).

Here, the peel strength of the peeled surface 1a is set to 250 to
Setting within the range of 1000 mN / 25 mm is 25 mN / 25 mm.
If the thickness is less than 0 mN / 25 mm, the land pattern 2 for mounting chip components formed on the transfer film 1 may be peeled off before the transfer. 1000 mN /
When the distance exceeds 25 mm, the land pattern 2 for mounting chip components becomes difficult to separate from the transfer film 1 when the land pattern 2 for mounting chip components is transferred to a transfer target (laminated body 10 described later), and remains on the transfer film 1. This is because there are times when it does.

As the transfer film 1, a polyethylene terephthalate film (PET film) or the like is used. The thickness of the transfer film 1 is 75 μm or more (preferably 80 μm or more and 100 μm or more) in consideration of ease of handling.
Below). Thereby, the mechanical strength of the transfer film 1 is increased, and the transportability is improved. The peel strength of the release surface 1a is 250 to 1000 mN / 25 m in accordance with the type of conductive paste such as Ag, Cu, Ag-Pd, and Ni.
m. The chip component mounting land pattern 2 is, for example, a circular shape having a diameter of 0.3 mm, or a vertical and horizontal size of 0.3 mm × 0.4 mm.
And the like.

Next, as shown in FIG. 2, the transfer film 1 is placed on the upper surface of the laminated body 10 which is the object to be transferred, with the release surface 1a on which the chip component mounting land pattern 2 is formed facing downward. Here, the laminate 10 is produced, for example, as follows. After forming a ceramic green sheet 11 by applying a paste-like ceramic material on a carrier film (not shown), a via hole for interlayer connection is opened using a laser beam or the like, and further, a conductive material is screen-printed. Then, an internal conductor pattern 16 (constituting a capacitor, an inductor, a resistor, a filter, a delay line, etc.) is formed, and a hole is filled with a conductive material to form a via hole 14 for interlayer connection. The plurality of ceramic green sheets 11 thus created are stacked, and become a laminate 10 by a known laminating apparatus (not shown). As the carrier film, usually, the film thickness is 40 to 50 μm and the peel strength is 30 to 200 m
A general PET film of N / 25 mm is used.

Next, as shown in FIG. 3, the transfer film 1 is pressed at a predetermined press pressure. At this time, the laminate 10
May be heated (for example, about 50 to 70 ° C.). It is preferable that the pressing pressure is set to 20 N / mm ² or more and 60 N / mm ² or less. Because the press pressure is 20N
/ Mm is less than ^2, the chip component mounting land pattern 2
This is because the thickness of the flat portion increases and the length of the flat portion decreases (see FIGS. 6 and 7). On the other hand, if the pressing pressure exceeds 60 N / mm ² , the land pattern 2 for mounting chip components is strongly pressed, and the thickness becomes too thin.

Next, as shown in FIG.
Is peeled off, the chip component mounting land pattern 2 is transferred onto the upper surface of the laminate 10. At this time, the chip component mounting land pattern 2 is in a state where it is slightly sunk into the uppermost ceramic green sheet 11 of the multilayer body 10 (1/2 or less of the thickness of the land pattern 2). Some of the land patterns 2 for mounting a plurality of chip components include via holes 1 for interlayer connection exposed on the upper surface of the laminate 10.
4, and are electrically connected to each other.
If necessary, the series of operations described above may be repeated to transfer the land pattern 2 twice, thereby increasing the thickness of the land pattern 2.

Similarly, as shown in FIG.
The printed circuit board connection land pattern 3 is transferred to the lower surface of the reference numeral 0. The land pattern 3 on the lower surface may be screen-printed on the lowermost ceramic green sheet 11 in advance. Thereafter, the laminate 10 is integrally fired. Chip components 31 and 32 such as inductors, capacitors, resistors and ICs are provided on the upper surface of the laminate 10 thus obtained.
Are mounted, and the external electrodes of the chip components 31 and 32 are electrically connected to the chip component mounting land pattern 2.

As described above, the peel strength of the release surface is 250
Since the transfer film 1 having a thickness of up to 1000 mN / 25 mm is used, the transfer operation to the laminate 10 is facilitated. In addition, the transfer operation only needs to set the transfer film 1 in a laminating device (a device for stacking and temporarily pressing the ceramic green sheets 11 and peeling the carrier film) for forming the laminated body 10. Available.

Further, the pressing pressure at the time of transfer is set to 20 N / mm.
Since the set to ^two or more 60N / mm ² or less, and improved flatness of the chip component mounting land pattern 2, it is possible to reduce the mounting failure of the chip components 31 and 32.

When the internal electrodes 16 are formed on the ceramic green sheets 11 constituting the laminate 10, since the ceramic green sheets 11 are made of an opaque material, alignment marks are formed on a transparent carrier film. However, it is easy to determine the front and back sides, and positioning at the time of printing is easy. However, in the case of a transparent transfer film, since there is no ceramic green sheet, the alignment marks are shown off, making it difficult to determine the front and back of the transfer film. Therefore,
By making the transfer film 1 from an opaque material,
It is preferable that the alignment marks formed on the transfer film 1 are not shown off, so that the front and back of the transfer film 1 can be easily understood. As a result, alignment during manufacturing (particularly, when printing the land pattern 2) is facilitated, and an existing printing device (device for forming the internal conductor pattern 16 on the ceramic green sheet 11) can be used.

[Second Embodiment, FIGS. 8 and 9] As shown in FIG. 8, the composite electronic component of the second embodiment
A cavity 40 for accommodating a chip component is provided in an upper part of the chip 0A. The laminate 10A is obtained by further laminating a ceramic green sheet 11 having a cavity forming hole 11a on the upper surface of the laminate 10 on which the chip component mounting land pattern 2 is transferred in the first embodiment. . Ceramic green sheet 11
Is formed into a laminated body 10A by a known laminating apparatus (not shown).

The transfer film 1 is placed on the upper surface of the laminate 10A.
After placing A, the transfer film 1A is pressed with a predetermined press pressure. Next, the transfer film 1A is peeled off, and the printed circuit board connection land pattern 2A is transferred to the upper surface of the laminate 10A. Similarly, as shown in FIG.
The land pattern 2 for chip component mounting is transferred to the lower surface of 0A. Thereafter, the laminate 10A is integrally fired.
The chip component 33 is mounted on the chip component mounting land pattern 2 exposed in the cavity 40 of the laminate 10A thus obtained, and the laminate 10A is turned over so that the upper surface of the laminate 10A (in FIG. The chip component 34 is mounted on the chip component mounting land pattern 2 (on the lower surface). Then, the composite electronic component is mounted such that the upper surface of the laminate 10A is a mounting surface on a printed board (not shown), and the printed board connecting land pattern 2A is electrically connected to the wiring conductor of the printed board.

The composite electronic component having the above configuration has the same function and effect as the composite electronic component of the first embodiment.

[Other Embodiments] The method of manufacturing a composite electronic component according to the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the gist. For example, a signal line pattern, a ground pattern, a capacitor pattern, an inductor pattern, and the like may be formed on the release surface of the transfer film in addition to the land pattern.

Further, the transfer object of the above-described embodiment is obtained by stacking insulating sheets on which the internal conductor patterns and via holes are formed, and then firing them integrally, but is not necessarily limited to this. The transferred object is, in addition to the laminate,
It may be a double-sided substrate or a single-sided substrate. Moreover, you may produce a laminated body by the manufacturing method demonstrated below. After an insulating layer is formed from a paste-like insulating material by a method such as printing, a paste-like conductive material is applied from above the insulating layer to form an arbitrary internal conductor pattern and via holes for interlayer connection. Next, a paste-like insulating material is applied from above the pattern to form an insulating layer having a built-in internal conductor pattern and via holes for interlayer connection. Similarly, a layered product is obtained by successively applying layers.

[0026]

As is apparent from the above description, according to the present invention, the peel strength of the release surface is from 250 to 1000 mN / 2.
Since the transfer film of 5 mm is used, the transfer operation to the transfer object becomes easy. Further, the press pressure at the time of transfer is 2
Since 0N / mm ² or more 60N / mm ² is set below, it is possible to improve the flatness of the electrode patterns, to reduce the mounting failure of the chip component.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a method for transferring an electrode pattern and a method for manufacturing a composite electronic component according to the present invention.

FIG. 2 is a sectional view showing a manufacturing step following FIG. 1;

FIG. 3 is a sectional view showing a manufacturing step following FIG. 2;

FIG. 4 is a sectional view showing a manufacturing step following FIG. 3;

FIG. 5 is a sectional view showing a manufacturing step following FIG. 4;

FIG. 6 is a graph showing a relationship between a press pressure and a land thickness.

FIG. 7 is a graph showing a relationship between a pressing pressure and a length of a land flat portion.

FIG. 8 is a sectional view showing a second embodiment of the method for transferring an electrode pattern and the method for manufacturing a composite electronic component according to the present invention.

FIG. 9 is a sectional view showing a manufacturing step following FIG. 8;

FIG. 10 is a cross-sectional view showing a conventional method for transferring an electrode pattern and a method for manufacturing a composite electronic component.

[Explanation of symbols]

1,1A ... Transfer film 1a ... Release surface 2. Land pattern (electrode pattern) for mounting chip components 10, 10A: laminate (transfer object) 11 ... insulating sheet 14 ... Via hole for interlayer connection 16 ... Inner conductor 31-34 ... Chip parts

Continuation of front page    F term (reference) 5E082 AA01 AB03 BB07 EE04 FF05                       FG26 FG46 GG10 GG28 JJ23                       MM22 MM24                 5E343 AA23 BB72 DD03 DD54 DD56                       DD64 GG08 GG11                 5E346 AA15 CC16 DD34 EE24 FF18                       FF45 GG04 GG06 GG08 HH26                       HH32

Claims (7)

[Claims] 1. A mold release treatment is applied to the surface to give a peel strength of 25.
Forming an electrode pattern on the release surface of the transfer film having a thickness of 0 to 1000 mN / 25 mm; and superposing the electrode pattern formed on the release surface of the transfer film in contact with the surface of the transfer object. Transferring the electrode pattern to the surface of the transfer-receiving member by pressing the transfer film after pressing at a press pressure of the following. 2. The press pressure is 20 N / mm ² or more and 60 or more.
^{2. The} method for transferring an electrode pattern according to claim 1, wherein the value is N / mm ² or less. 3. The method according to claim 1, wherein the transfer film is a PET film. 4. The method according to claim 1, wherein the transfer film is made of an opaque material. 5. The method according to claim 1, wherein the thickness of the transfer film is 75 μm or more. 6. A method for manufacturing a composite electronic component using the method for transferring an electrode pattern according to claim 1, wherein the object to be transferred is formed by stacking an internal conductor and an insulating layer. A part of a via hole for interlayer connection electrically connected to the internal conductor is exposed on the surface of the laminate, and the electrode is electrically connected to the via hole for interlayer connection. A method for manufacturing a composite electronic component, wherein a pattern is transferred. 7. The method according to claim 6, further comprising a step of mounting a chip component on a surface of the laminate and electrically connecting an external electrode of the chip component to the electrode pattern. Of manufacturing composite electronic components.