JP2003323956A - Socket for electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electrical component capable of uniformizing a contact pressure of a terminal and a contact pin by the same contact pin even when IC packages with different diameters are attached. <P>SOLUTION: In the IC socket, a holding face part holding the IC package is provided on a socket body, a plurality of contact pins 15 capable of contacting and separating with respect to solder balls 12b of the IC package are arranged side by side on the socket body, a moving plate 1 is provided movably with respect to the socket body, and by moving the moving plate 1, elastic pieces 15b of the contact pins 15 are elastically deformed, contact parts 15h provided on tips of the elastic pieces 15b are displaced, and they are separated from side face parts of the solder balls 12b of the IC package 12. A moving range of the moving plate 17 can be adjusted, and a deformation amount of the elastic pieces 15b can be changed in response to a diameter of the solder balls 12b. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for detachably holding an electric component such as a semiconductor device (hereinafter referred to as "IC package"), and particularly to terminals of different diameters of the electric component. The present invention relates to a socket for electric parts in which the contact pressure of a contact pin can be made substantially constant.

[0002]

2. Description of the Related Art Conventionally, as this type of "electrical component socket", there is an IC socket that detachably holds an "electrical component" IC package.

This IC package has a BGA (Ball Gr
id array) type, which has a large number of solder balls as terminals provided on the lower surface of a rectangular package body.

Further, a contact pin is arranged in the IC socket, and a pair of elastic pieces are formed on the contact pin. The tip ends of these elastic pieces are separated from the side surface of the solder ball of the IC package. A contact portion to be contacted is formed, and the elastic piece is elastically deformed by being pressed by a moving plate that moves in the vertical direction.

By moving the moving plate to elastically deform the elastic piece, the gap between both contact portions of both elastic pieces is widened, the solder balls are inserted between them, and then the moving plate returns to its original position. By doing so, the contact portion of the elastic piece also returns to the original position, and the solder ball is sandwiched between both contact portions and electrically connected. In this case, it is necessary to set the contact pressure between the solder ball and the contact pin to a predetermined value to stabilize the conductivity.

In this state, for example, a burn-in test is performed, and then, similarly to the above, the moving plate is moved to displace the contact portions of both elastic pieces to widen the distance between the both contact portions and separate them from the solder balls. Then, the IC package is taken out from the IC socket by an automatic machine.

In this way, the IC package can be attached and detached in a non-insertion force type by simply moving the moving plate, so that the working efficiency can be remarkably improved.

[0008]

However, in such a conventional device, when a plurality of IC packages each having a different solder ball are to be mounted in the same IC socket, for example, 0.3 mm is used. When contact pins of an IC socket are brought into contact with IC packages having ball diameters of 0.5 mm and 0.5 mm, if the contact pressure (elastic force of contact pin) is set with a ball diameter of 0.3 mm as a reference, When the contact pin is brought into contact with an object having a thickness of 5 mm, the contact pressure becomes too high, the durability of the contact pin is reduced, and the solder ball is deformed. On the contrary, if the contact pressure is set on the basis of 0.5 mm, the contact pressure will not be sufficient for 0.3 mm and stable contact pressure may not be obtained. Therefore, a plurality of types of contact pins or the like corresponding to the ball diameter have been required.

Therefore, according to the present invention, even when IC packages having different diameters are mounted, the same contact pin is used.
An object of the present invention is to provide a socket for electric parts in which the contact pressure between the terminal and the contact pin can be made substantially the same.

[0010]

In order to achieve the above object, the invention according to claim 1 is characterized in that an accommodating surface portion for accommodating an electric component is provided on the socket body, and the socket body has a terminal for the electric component. A plurality of contact pins that can be brought into and out of contact with each other are arranged side by side, and a moving plate is movably provided with respect to the socket body. By moving the moving plate, the elastic piece of the contact pin is elastically deformed. In a socket for an electric component in which a contact portion provided at a tip end portion of the elastic piece is displaced and brought into contact with a side surface portion of a terminal of the electric component, the moving range of the moving plate is adjustable, It is characterized in that it is an electric component socket in which the amount of deformation of the elastic piece can be changed according to the diameter of the terminal.

According to a second aspect of the present invention, in addition to the structure of the first aspect, the movable plate is provided so as to be vertically movable with respect to the socket body, and the movable plate is moved in the vertical direction. Thus, the elastic piece is elastically deformed to displace the contact portion of the elastic piece, and the moving range can be adjusted by changing the highest position of the moving plate.

According to a third aspect of the present invention, in addition to the structure of the second aspect, a plurality of locking portions having different locking positions are provided on the socket body, and the different locking portions are engaged with the moving plate. It is characterized in that the maximum rising position of the moving plate can be changed by stopping the moving plate.

The invention according to a fourth aspect is the first to the third aspects.
In addition to the configuration described in any one of the above, the contact pin is provided with a pair of elastic pieces, and the terminal is clamped by a contact portion formed at an upper end portion of both elastic pieces. It is characterized by

The invention according to a fifth aspect is the first to the fourth aspects.
In addition to the configuration according to any one of the above, the moving plate is provided to be movable up and down with respect to the socket body,
The moving plate is formed with one pressing portion for each of the contact pins, and the pressing portion elastically deforms the pair of elastic pieces of the contact pin.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

1 to 9 show an embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electrical component socket”, and the IC socket 11 is used to perform a performance test of the IC package 12 which is an “electrical component”.
It is intended to electrically connect the solder ball 12b, which is the second "terminal", and the printed wiring board (not shown) of the measuring device (tester).

The IC package 12 is a so-called BGA (Ball Grid), as partially shown in FIG.
Array type, in which a large number of substantially spherical solder balls 12b are arranged in a matrix form on the lower surface of a rectangular package body 12a.

As shown in FIGS. 2 and 3, the IC socket 11 generally has a socket body 13 mounted on a printed wiring board, and the socket body 13 is separated from each solder ball 12b. Contact pin 1 contacted
5 is arranged, a moving plate 17 for displacing the contact pin 15 is arranged so as to be vertically movable, and a top plate 19 is arranged above the moving plate 17 by being fixed to the socket body 13. It is set up. Further, the top plate 19 is provided with a first guide member 20 or a second guide member 21 which can be exchanged, and an operation member 22 for moving the moving plate 17 up and down.

The contact pin 15 is formed of a plate material having a spring property and excellent conductivity by press working into a shape as shown in FIGS. 6 and 7.

Specifically, the contact pin 15 has a first elastic piece 15a and a second elastic piece 15b formed on the upper side, and a single solder tail portion 15c formed on the lower side (see FIG. 1, etc.).

The pair of elastic pieces 15a and 15b are formed so as to face each other by bending the base portion 15f on the lower end side into a substantially U shape.

The first elastic piece 15a is formed to have high rigidity, and the second elastic piece 15b is formed to have lower rigidity than the first elastic piece 15a. The first elastic piece 15a and the second elastic piece 15d have the same rigidity. Are projected in a state where the projecting pieces 15d and 15e pressed by the moving plate 17 are bent 90 degrees (see FIG. 7). These protrusions 15d and 15e
Are formed at different heights, and the protruding pieces 15e of the second elastic pieces 15b are formed at higher positions. Then, the elastic pieces 15a and 15b are elastically deformed by pressing the projecting pieces 15d and 15e by the pressing portion 17a of the moving plate 17.

The solder balls 1 of the IC package 12 are attached to the upper ends (tips) of the elastic pieces 15a and 15b.
Contact portions 15g and 15h are formed on and away from the side surface of 2b, and the solder ball 12b is sandwiched between these contact portions 15g and 15h.

The solder tail portion 15c and the base portion 15f of the contact pin 15 are attached to the socket body 13
The contact pin 15 is press-fitted into the base body 15f, and a biting part (not shown) formed on the base part 15f bites into the socket body 13 to prevent the contact pin 15 from slipping upward.

The solder tail portion 15c protruding downward from the socket body 13 is further protruded downward via the locate board 23, as shown in FIGS.
The printed wiring board (not shown) is connected by being inserted into each through hole and soldered.

On the other hand, the moving plate 17, as shown in FIGS. 2 and 5, is arranged in the socket body 13 so as to be vertically movable, and is biased upward by a spring 24. A pair of arms 26 for moving the moving plate 17 up and down is provided.

The arm 26 is rotatably attached to the socket body 13 by a shaft 27, and
The upper end portion 26 a is formed so as to come into contact with the operation member 22. As a result, when the operation member 22 is lowered,
By being pushed by the operating member 22, the arm 26 is rotated around the shaft 27 as shown in FIGS. 5 (a) to 5 (b), so that the arm 26 is pushed by the contact portion 26b. The moving plate 17 is lowered.

As shown in FIGS. 6 and 7, the moving plate 17 is provided with one pressing portion 17a for each contact pin 15, and the pressing portion 17a forms a pair of elastic pieces 15a and 15b. The protrusions 15d and 15e are pressed to elastically deform the elastic pieces 15a and 15b.

As shown in FIGS. 2 and 4, the moving plate 17 has a first locking step 17b and a second locking step 1b.
7c is formed, and as shown in FIG. 2, the first locking step 13b of the socket body 13 is locked to the first locking step 17b, whereby the highest position of the moving plate 17 is regulated. Further, as shown in FIG. 4, the second locking step portion 17c is
By locking the second locking portion 13b of the socket body 13, the highest position of the moving plate 17 is restricted at a position lower than that in FIG. Thereby, the first and second locking portions 13a and 13b having different locking positions (height) are provided.
By providing such elements, the moving range (the highest position) of the moving plate 17 can be adjusted, and the deformation amount of the elastic pieces 15a and 15b can be changed according to the diameter of the solder ball 12b.

As shown in FIG. 1, the top plate 19 has a housing surface portion 19a for housing the IC package 12 on the upper side, and a through hole 19b into which the contact pin 15 is inserted is formed in the housing surface portion 19a. Has been done.

Further, on the upper side around the top plate 19, as shown in FIGS. 1 and 4, a first guide member 20 for guiding the IC package 12 at the time of accommodation, or FIG.
As shown in, the second guide member 21 is provided so as to be replaceable. As shown in FIG. 2, a locking claw 20a extending downward is formed on the first guide member 20, and the locking claw 20a is locked and attached to the socket body 13. . In addition, the first guide member 2
0, as shown in FIG. 4, a lock prevention protrusion 20b for preventing the second lock portion 13b from being locked to the second lock step portion 17c.
Are formed.

Further, as shown in FIG. 8, the second guide member 21 is not formed with anything corresponding to the locking prevention projection 20b of the first guide member 20, and the second engagement member of the socket body 13 is not formed. The stop portion 13b is the second locking step portion 17c of the moving plate 17.
The uppermost position of the moving plate 17 is regulated by being locked by the.

Further, as shown in FIG. 2, the operation member 22 has an opening 22 having a size into which the IC package 12 can be inserted.
a, and the IC package 12 is opened through this opening 22a.
Is inserted and accommodated in a predetermined position on the accommodation surface portion 19a of the top plate 19. In addition, as shown in FIG.
It is arranged so as to be able to move up and down with respect to, and is urged upward by a spring 28, and at the most raised position, the locking claw 22b.
Is locked to the locked portion 13c of the socket body 13 to prevent the operation member 22 from coming off.

Furthermore, the operating member 22 is formed with an operating portion 22c for rotating the latch 30.

As shown in FIG. 3, the latch 30 is rotatably attached to the socket body 13 about a shaft 30a, is urged counterclockwise in FIG. The pressing portion 30b is configured to press the peripheral portion of the IC package 12.

The latch 30 also includes an operating member 22.
When the operated member 22 is lowered, the pressed portion 30c is formed to be pressed by the operating portion 22c, and the pressed portion 30c slides on the operating portion 22c to rotate the latch 30 clockwise in FIG. Thus, the holding portion 30b is retracted from the IC package 12 mounting position.

Next, the operation of this embodiment will be described.

FIG. 6 shows a solder ball 12b having a diameter of 0.3 mm.
Further, FIG. 9 shows a case where the solder balls 12b having a diameter of 0.5 mm are respectively sandwiched.

First, the case of sandwiching the solder ball 12b having a diameter of 0.3 mm will be described.

In this case, the first guide member 20 is attached to the upper side of the top plate 19 as shown in FIGS. 2 and 4, and the first locking portion 13a is the first locking step portion 17b. The maximum rising position of the moving plate 17 is restricted by being locked at.

At this maximum raised position, as shown in FIG. 6 (a), the protruding piece 15d of the first elastic piece 15a is hardly pressed by the pressing portion 17a of the moving plate 17 and is in a closed state. (Displaced to the right in the figure).

The protruding piece 15e of the second elastic piece 15b is
The movable plate 17 is in a closed state (a state in which it is displaced to the left side in the drawing) by being pressed by the pressing portion 17a and elastically deformed.

When the operating member 22 is lowered from this state, the arm 26 is rotated about the shaft 27 from the state shown in FIG. 5A to the state shown in FIG.
The moving plate 17 is lowered at the contact portion 26b. At this lowest position, as shown in FIG. 6B, the pressing portion 17a of the moving plate 17 moves downward, so that the second elastic piece 15 moves.
The pressing force of b on the protrusion 15e is released and opened (displaced to the right in the figure). In addition, the protrusion 15d of the first elastic piece 15a is pressed by the pressing portion 17a,
The first elastic piece 15a is elastically deformed and displaced leftward in the drawing to open.

Next, the IC package 12 is guided by the first guide member 20, and the accommodating surface portion 1 of the top plate 19 is guided.
By accommodating the solder ball 12b on the 9a, both contact portions 15g and 15h of the elastic pieces 15a and 15b in which the solder ball 12b is opened
Inserted between.

After that, by moving the operating member 22 upward, the moving plate 17 is moved up by the spring 24, and the first locking step portion 17b of the moving plate 17 is fitted with the first locking portion 13a of the socket body 13. By locking
The moving plate 17 is stopped at the highest position.
At this time, the locking prevention protrusion 20b of the first guide member 20
As a result, the second locking portion 13b of the socket body 13 is prevented from being locked to the second locking step portion 17c (see FIG. 4), so that the moving plate 17 is not stopped from being raised in the middle.
As shown in FIG. 1, the first locking portion 13a and the first locking step portion 17b are raised to the locking position.

As the moving plate 17 is lifted, as shown in FIG.
As shown in FIG. 6, the pressing of the first elastic piece 15a of the pressing portion 17a against the projecting piece 15d is released, and the first elastic piece 15a returns to the closing direction (the right direction in the drawing) by the elastic force. The contact portion 15g of the first elastic piece 15a contacts one side surface portion of the solder ball 12b.

Further, when the moving plate 17 is raised, the pressing portion 1
The projecting piece 15e of the second elastic piece 15b is pressed by 7a,
The second elastic piece 15b closes against the elastic force, and the contact portion 15h of the second elastic piece 15b becomes the solder ball 12b.
To the other side surface of the.

As a result, the solder ball 12b is sandwiched between the contact portions 15g and 15h and brought into contact with each other with a predetermined contact pressure.

Next, the case of sandwiching the solder balls 12b having a diameter of 0.5 mm will be described.

In this case, instead of the first guide member 20, as shown in FIG.
The 2nd guide member 21 is attached and the 2nd locking part 13b is locked by the 2nd locking step part 17c, and the highest position of the moving plate 17 is regulated. The highest position is lower than the case where the solder ball 12b having a diameter of 0.3 mm is sandwiched.

At this maximum raised position, as shown in FIG. 9A, the projecting piece 15d of the first elastic piece 15a is pushed by the pressing portion 17a of the moving plate 17 slightly larger than that in FIG. 6A. Accordingly, the position of the contact portion 15g is at a position displaced leftward in the drawing from the position shown in FIG. This state is 0.5
First when sandwiching a solder ball 12b having a diameter of mm
The closed state of the elastic piece 15a is shown.

The protruding piece 15e of the second elastic piece 15b is
The pressing portion 17a of the moving plate 17 is pushed in slightly smaller than that in FIG. 6A, and the contact portion 15h is positioned as shown in FIG. 6A.
It is located at a position displaced to the right in the figure from the position shown in. This state shows the closed state of the second elastic piece 15b when sandwiching the solder ball 12b having a diameter of 0.5 mm.

When the operating member 22 is lowered from this state, the arm 26 is rotated around the shaft 27 from the state shown in FIG. 5A to the state shown in FIG.
The moving plate 17 is lowered at the contact portion 26b. At this lowest position, as shown in FIG. 9 (b), the pressing portion 17a is positioned downward, so that the protruding piece 15 of the second elastic piece 15b is located.
The pressing force on e is released and opened. Further, the protruding piece 15d of the first elastic piece 15a is opened by elastically deforming the fixed side piece 15a by being pressed by the pressing portion 17a.

In this case, since the lowermost position of the moving plate 17 is the same as the position shown in FIG.
The opening amount of both contact portions 15g and 15h of a and 15b is as shown in FIG.
9B and FIG. 9B are substantially the same.

Next, the IC package 12 is guided by the second guide member 21 and the receiving surface portion 1 of the top plate 19 is guided.
The solder ball 12b is inserted between the elastic pieces 15a and 15b which are opened by accommodating the solder ball 12b on the surface 9a.

Then, the operating member 22 is moved up to raise the moving plate 17 by the spring 24, and the second locking step portion 17c of the moving plate 17 is moved to the second locking portion 13b of the socket body 13. By locking
The moving plate 17 is stopped at the highest position.

As the moving plate 17 is lifted, as shown in FIG.
As shown in, the pressing portion 17a releases the pressing of the first elastic piece 15a against the projecting piece 15d, and the first elastic piece 15a returns to the closing direction by the elastic force. The contact portion 15g contacts one side surface portion of the solder ball 12b.

Further, when the moving plate 17 is raised, the pressing portion 1
The projecting piece 15e of the second elastic piece 15b is pressed by 7a,
The second elastic piece 15b closes against the elastic force, and the contact portion 15h of the second elastic piece 15b becomes the solder ball 12b.
To the other side surface of the.

As a result, the solder ball 12b is sandwiched between the contact portions 15g and 15h and brought into contact with each other with a predetermined contact pressure.

As described above, even if the lowermost position of the moving plate 17 is the same, the uppermost position is changed according to the diameter of the solder ball 12b and the moving range is adjusted, whereby the second elastic piece 15 is adjusted.
The pushing amount for b is changed. Here, by increasing the pushing amount of the second elastic piece 15b when the ball diameter is 0.3 mm, the contact pressures on the solder balls 12b having different diameters can be made substantially the same.

With respect to the contact pressure between the contact pin 15 and the solder ball 12b, the elastic force generated by the displacement of the first elastic piece 15a which changes according to the pushing amount of the second elastic piece 15b is set to a predetermined value. , Solder balls 12b having different ball diameters are brought into contact with each other with a preferable pressure.

In the above embodiment, the invention is applied to the IC socket 11 as the "electrical component socket", but the invention is not limited to this and can be applied to other devices. Further, in the above embodiment, both the pair of elastic pieces 15a and 15b are elastically deformed to open and close, but the invention is not limited to this, and only one elastically deformable. Further, in the case of elastically deforming only one of the pair of elastic pieces, the movable plate may be elastically deformed by moving in the lateral direction. In this case, the moving range of the moving plate can be changed by changing the mounting position of the moving plate with respect to the link member that moves the moving plate. Furthermore, in the above-described embodiment, the present invention is applied to the IC socket 11 corresponding to the IC package 12 having the solder balls 12b as electric components, but the present invention is not limited to this, and so-called PGA (having a bar-shaped terminal ( Pin
It can also be applied to IC sockets compatible with Grid Array type IC packages.

[0064]

As described above, according to the invention described in claim 1, the moving range of the moving plate can be adjusted, and the deformation amount of the elastic piece can be changed according to the diameter of the terminal. Even if the diameter of the terminal changes, the contact pressure of the contact pin against the terminal can be made substantially constant.

According to the second aspect of the invention, in addition to the above effects, the movable plate is provided so as to be vertically movable with respect to the socket body, and the elastic plates are moved by vertically moving the movable plate. Is elastically deformed to displace the contact parts of both elastic pieces, and by changing the highest rising position, the moving range can be adjusted, so that the contact pressure of the contact pin against the terminal can be changed even if the terminal diameter changes. It can be easily made almost constant.

According to the invention described in claim 3, in addition to the above effects, a plurality of locking portions having different locking positions are provided on the socket body, and the different locking portions are locked to the moving plate. Since the maximum rising position of the moving plate can be changed, it is possible to change the maximum rising position of the moving plate without any significant change in shape.

According to the invention as set forth in claim 5, in addition to the above effects, since the pair of elastic pieces of the contact pin is elastically deformed by one pressing portion, the pair of elastic pieces has a simple structure. The piece can be elastically deformed and the terminal can be clamped.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1 according to the first embodiment.

FIG. 3 is a sectional view taken along line BB of FIG. 1 according to the first embodiment.

FIG. 4 is a sectional view taken along the line CC of FIG. 1 according to the first embodiment.

5A and 5B are schematic diagrams showing the movement of the IC socket according to the first embodiment, FIG. 5A showing a state in which the operating member is at the highest position, and FIG. .

FIG. 6 is a diagram showing a movement of a moving plate and a contact pin of the IC socket according to the first embodiment when sandwiching a solder ball having a diameter of 0.3 mm, and (a) is both contact portions of the contact pin. Is a view showing a closed state, (b) is a view showing a state in which both contact portions of the contact pin are open, and (c) is a view showing a state in which the solder balls are held by both contact portions of the contact pin.

FIG. 7 is a sectional view taken along the line D-D in FIG. 6 according to the first embodiment.

FIG. 8 shows an IC socket according to the first embodiment, which has 0.5 of
FIG. 5 is a cross-sectional view of a portion corresponding to FIG. 4, showing a case where a mm-diameter solder ball is held.

FIG. 9 is a view showing the movement of a moving plate and a contact pin of the IC socket according to the first embodiment when sandwiching a solder ball having a diameter of 0.5 mm, and (a) is both contact portions of the contact pin. Is a view showing a closed state, (b) is a view showing a state in which both contact portions of the contact pin are open, and (c) is a view showing a state in which the solder balls are held by both contact portions of the contact pin.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12 IC package (electrical parts) 12a package body 12b solder ball 13 Socket body 13a First locking part 13b Second locking part 15 contact pins 15a 1st elastic piece 15b Second elastic piece 15d, 15e protrusion 15g, 15h contact part 17 Moving plate 17a Pressing part 17b First locking step 17c Second locking step 19 top plate 19a Housing surface 19b through hole 20 First guide member 20a locking claw 20b Locking prevention protrusion 21 Second guide member 22 Control members

Claims (5)

[Claims] 1. A housing surface portion for housing an electrical component is provided on the socket body, and a plurality of contact pins that can be connected to and detached from the terminals of the electrical component are arranged side by side on the socket body, with respect to the socket body. A movable plate is movably provided, and by moving the movable plate, the elastic piece of the contact pin is elastically deformed to displace the contact portion provided at the tip end of the elastic piece, and In an electric component socket adapted to be brought into contact with and separated from a side surface of a terminal, a moving range of the moving plate can be adjusted, and a deformation amount of the elastic piece can be changed according to a diameter of the terminal. A socket for electrical components. 2. The moving plate is provided so as to be movable up and down with respect to the socket body, and by moving the moving plate in the vertical direction, the elastic piece is elastically deformed and the contact portion of the elastic piece. 2. The socket for electrical parts according to claim 1, wherein the socket is displaced, and the movable range can be adjusted by changing the highest position of the movable plate. 3. The socket main body is provided with a plurality of locking portions having different locking positions, and the maximum rising position of the moving plate can be changed by locking the different locking portions to the moving plate. 3. The structure according to claim 2, wherein
The socket for electrical parts described in. 4. The contact pin is provided with a pair of elastic pieces, and the terminals are sandwiched by contact portions formed at the upper ends of the elastic pieces. The socket for electric parts according to any one of 1 to 3. 5. The moving plate is provided so as to be movable up and down with respect to the socket body, and one pressing portion is formed on each of the contact pins on the moving plate. 5. The socket for electrical parts according to claim 1, wherein the pair of elastic pieces of the contact pin are elastically deformed.