JP2003317307A - Light emitting/receiving unit and method for manufacturing the same - Google Patents
Light emitting/receiving unit and method for manufacturing the sameInfo
- Publication number
- JP2003317307A JP2003317307A JP2002124633A JP2002124633A JP2003317307A JP 2003317307 A JP2003317307 A JP 2003317307A JP 2002124633 A JP2002124633 A JP 2002124633A JP 2002124633 A JP2002124633 A JP 2002124633A JP 2003317307 A JP2003317307 A JP 2003317307A
- Authority
- JP
- Japan
- Prior art keywords
- light
- component mounting
- optical component
- mounting portion
- light beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 5
- 230000003287 optical effect Effects 0.000 claims abstract description 244
- 238000007493 shaping process Methods 0.000 claims description 19
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000010287 polarization Effects 0.000 description 7
- 230000010354 integration Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910001111 Fine metal Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
- Optical Head (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、受発光ユニット及
びその製造方法に係り、特に、光学的記録媒体への情報
の書き込み及び/または光学的記録媒体の記録情報の読
み出しに利用される小型光ピックアップ装置に好適な受
発光ユニット及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting / receiving unit and a method of manufacturing the same, and more particularly, to a small-sized light used for writing information on an optical recording medium and / or reading recorded information on the optical recording medium. The present invention relates to a light emitting / receiving unit suitable for a pickup device and a method for manufacturing the same.
【0002】[0002]
【従来の技術】近年、光ピックアップ装置においては、
装置の小型化や軽量化を達成するために、各構成部分を
一体化する手段が導入されており、その一例として、例
えば特開平10−143934号に開示の「光磁気ピッ
クアップ装置」(以下、この装置を第1構成例という)
や、特開平10−241186号に開示の「光ピックア
ップ装置およびそれを備えた光学記録媒体駆動装置」
(以下、この装置を第2構成例という)等が知られてい
る。2. Description of the Related Art Recently, in an optical pickup device,
In order to reduce the size and weight of the device, a means for integrating the respective constituent parts has been introduced. As an example, a "magneto-optical pickup device" disclosed in Japanese Patent Laid-Open No. 10-143934 (hereinafter This device is called a first configuration example)
"Optical pickup device and optical recording medium driving device including the same" disclosed in JP-A-10-241186
(Hereinafter, this device is referred to as a second configuration example) and the like are known.
【0003】ここで、図8は、前記第1構成例に係わる
光磁気ピックアップ装置を示す側面図である。Here, FIG. 8 is a side view showing a magneto-optical pickup device according to the first configuration example.
【0004】図8に示されるように、この第1構成例の
光磁気ピックアップ装置は、筐体80の内部に、光ビー
ム放射源となるレーザーダイオード81と、誤差信号検
出用のフォトダイオード82、83と、情報信号検出用
のフォトダイオード84と、モニター用のフォトダイオ
ード85とを表面に形成したシリコン基板86を配置
し、筐体80の開口部分をホログラム素子87aを有す
るガラスカバー87により密封し、ガラスカバー87上
にP偏光とS偏光とで光反射率及び光透過率を異にする
偏光分離膜88aを含む偏光プリズム88とウォラスト
ンプリズム89とを一体化した複合プリズム90を配置
し、複合プリズム90上に対物レンズ91を配置したも
のである。また、この対物レンズ91に対向した位置に
光磁気ディスク92が装着配置される。As shown in FIG. 8, in the magneto-optical pickup device of the first configuration example, a laser diode 81 serving as a light beam radiation source and a photo diode 82 for detecting an error signal are provided inside a housing 80. 83, a photodiode 84 for detecting an information signal, and a photodiode 85 for monitoring are formed on the surface of the silicon substrate 86, and the opening portion of the housing 80 is sealed with a glass cover 87 having a hologram element 87a. On the glass cover 87, a composite prism 90 in which a polarization prism 88 including a polarization separation film 88a having different light reflectance and light transmittance for P-polarized light and S-polarized light and a Wollaston prism 89 are integrated is arranged. The objective lens 91 is arranged on the compound prism 90. Further, a magneto-optical disk 92 is mounted and arranged at a position facing the objective lens 91.
【0005】この第1構成例の光磁気ピックアップ装置
においては、筐体80内に配置されたシリコン基板86
の表面に複数の受光素子、すなわち誤差信号検出用のフ
ォトダイオード82、83と情報信号検出用のフォトダ
イオード84、モニター用のフォトダイオード85が同
一平面上にあるように形成配置され、それぞれのフォト
ダイオード82乃至85には、偏光プリズム88、ホロ
グラム素子87a等を用いて光ビームの光路が分岐、分
割され、それぞれのフォトダイオード82乃至85に必
要とする光ビームが入射するような構成になっている。In the magneto-optical pickup device of the first configuration example, the silicon substrate 86 arranged in the housing 80.
A plurality of light receiving elements, that is, photodiodes 82 and 83 for detecting an error signal, a photodiode 84 for detecting an information signal, and a photodiode 85 for a monitor are formed and arranged on the same surface so as to be on the same plane. The optical paths of the light beams are branched and split into the diodes 82 to 85 by using the polarization prism 88, the hologram element 87a, etc., and the necessary light beams are incident on the photodiodes 82 to 85, respectively. There is.
【0006】また、図9(a)、(b)は、前記第2構
成例に係わる光ピックアップ装置及びそれを備えた光学
記録媒体駆動装置における投受光ユニットを示すもの
で、(a)はその分解斜視図、(b)はその外観斜視図
である。Further, FIGS. 9A and 9B show an optical pickup device according to the second configuration example and a light emitting / receiving unit in an optical recording medium driving device including the same, and FIG. 9A shows the same. The disassembled perspective view, (b) is the external appearance perspective view.
【0007】図9(a)に示されるように、この投受光
ユニット(受発光ユニットと同義)は、上フレーム10
1と、主フレーム102と、下フレーム103との3つ
のフレーム101乃至103からなっている。上フレー
ム101は、窪み状の支持面101aに第1フォトダイ
オード(第1受光素子)104が配置され、主フレーム
102は、同じく窪み状の支持面102aに半導体レー
ザ素子(発光素子)105、透過型3分割用回折格子1
06、透過型ホログラム素子107、上反射ミラー10
8、下反射ミラー109がそれぞれ配置され、下フレー
ム103は、同じ窪み状の支持面103aに第2フォト
ダイオード(第2受光素子)110が配置されている。As shown in FIG. 9A, the light emitting / receiving unit (synonymous with the light emitting / receiving unit) is an upper frame 10.
1, a main frame 102, and a lower frame 103. In the upper frame 101, the first photodiode (first light receiving element) 104 is arranged on the recessed supporting surface 101a, and in the main frame 102, the semiconductor laser element (light emitting element) 105 and the transmission are formed on the recessed supporting surface 102a. Type 3 division diffraction grating 1
06, transmission hologram element 107, upper reflection mirror 10
8, the lower reflection mirror 109 is arranged, and the lower frame 103 has the second photodiode (second light receiving element) 110 arranged on the same recessed support surface 103a.
【0008】これらの3つのフレーム101乃至103
は、それぞれの位置調整が行われた後、主フレーム10
2の上面(支持面102aの形成側)に上フレーム10
1の下面(支持面101aの非形成側)が、主フレーム
102の下面(支持面102aの非形成側)に下フレー
ム103の上面(支持面103aの形成側)がそれぞれ
貼着固定され、図12(b)に示されるように、それら
のフレーム101乃至103が一体化され、投受光ユニ
ツトが構成される。These three frames 101 to 103
After the respective position adjustments are made, the main frame 10
The upper frame 10 is provided on the upper surface of 2 (on the side where the supporting surface 102a is formed).
The lower surface of 1 (the side on which the supporting surface 101a is not formed) is attached and fixed to the lower surface of the main frame 102 (the side on which the supporting surface 102a is not formed) and the upper surface of the lower frame 103 (the side on which the supporting surface 103a is formed). As shown in FIG. 12 (b), the frames 101 to 103 are integrated to form a light emitting / receiving unit.
【0009】[0009]
【発明が解決しようとする課題】一般に、光ピックアッ
プ装置は、2つ以上の受光素子が搭載されており、より
制御機能を高めるために搭載される受光素子の数が増え
る傾向にある。そして、光ピックアップ装置における受
光素子の搭載数が増大し、受光素子の一体化の程度が高
まると、それぞれの受光素子に他の受光素子に入射する
光ビームの一部が入射する現象、すなわち迷光が発生す
るようになる。Generally, an optical pickup device is equipped with two or more light-receiving elements, and the number of light-receiving elements mounted to further enhance the control function tends to increase. When the number of light-receiving elements mounted in the optical pickup device increases and the degree of integration of the light-receiving elements increases, a part of the light beam incident on the other light-receiving elements enters each light-receiving element, that is, stray light. Will occur.
【0010】ところで、第1構成例に係わる光磁気ピッ
クアップ装置は、モニター用(光量制御用)のフォトダ
イオード85を、誤差信号検出用のフォトダイオード8
2、83や情報信号検出用のフォトダイオード84とと
もに同一平面内にあるように配置している。このような
配置にした場合、これらのフォトダイオード82乃至8
5は、それぞれの受光面が同方向になるため、どうして
も不必要な迷光を拾い易くなる。そして、これらのフォ
トダイオードの中に光量制御用のフォトダイオード85
が含まれている場合は、前記迷光の発生によって光量制
御の精度を高めることが難しくなる。By the way, in the magneto-optical pickup device according to the first configuration example, the photodiode (for controlling light quantity) 85 for monitoring and the photodiode 8 for detecting an error signal are used.
2, 83 and the photodiode 84 for detecting the information signal are arranged in the same plane. In such an arrangement, these photodiodes 82 to 8
In No. 5, since the respective light receiving surfaces are in the same direction, it is easy to pick up unnecessary stray light. Then, in these photodiodes, a photodiode 85 for controlling the amount of light is included.
In the case of including, it is difficult to improve the accuracy of the light amount control due to the generation of the stray light.
【0011】このような迷光の発生を回避するため、光
量制御用のフォトダイオード85を貼着する場合に、光
量制御用のフォトダイオード85に迷光が入射しないよ
うな取付け位置を選んだり、光量制御用のフォトダイオ
ード85の取付け面を他のフォトダイオード82乃至8
4の取付け面に対して所定の角度(直角等)だけ傾ける
等の工夫をしたりすればよいが、このような貼着作業
は、同一平面上に複数個のフォトダイオードを取付ける
ときの作業に比べると効率が大幅に低下してします。In order to avoid the generation of such stray light, when the photodiode 85 for controlling the light amount is attached, the mounting position is selected so that the stray light does not enter the photodiode 85 for controlling the light amount, or the light amount control is performed. The mounting surface of the photodiode 85 for use with other photodiodes 82 to 8
It may be possible to devise such as tilting the mounting surface of No. 4 by a predetermined angle (right angle, etc.), but this kind of sticking work is suitable for mounting multiple photodiodes on the same plane. Compared to this, the efficiency is greatly reduced.
【0012】また、第2構成例に係わる投受光ユニツト
は、複数のフォトダイオード(受光素子)104、11
0を貼着する際に、それらの受光面がそれぞれ異なる方
向を向くように構成しているものであって、複数のフォ
トダイオード104、110の受光面がそれぞれ異なる
方向を向くようにするため、主フレーム102の他に上
フレーム101と下フレーム103とを用い、投受光ユ
ニットの厚さ方向に上フレーム101、主フレーム10
2、下フレーム103を重ね合わせた状態に貼着するよ
うにしている。そして、上フレーム101、主フレーム
102、下フレーム103を3段重ねにした場合には、
投受光ユニットの厚みが厚くなってしまい、一体化によ
って小型の光ピックアップ装置を構成することが難しく
なる。The light emitting / receiving unit according to the second configuration example has a plurality of photodiodes (light receiving elements) 104 and 11.
When 0 is attached, the light-receiving surfaces of the photodiodes are oriented in different directions, and the light-receiving surfaces of the plurality of photodiodes 104 and 110 are oriented in different directions. An upper frame 101 and a lower frame 103 are used in addition to the main frame 102, and the upper frame 101 and the main frame 10 are arranged in the thickness direction of the light emitting / receiving unit.
2. The lower frame 103 is attached in a state of being overlapped. When the upper frame 101, the main frame 102, and the lower frame 103 are stacked in three stages,
The thickness of the light emitting / receiving unit becomes thick, and it becomes difficult to configure a small optical pickup device by integration.
【0013】また、使用するフォトダイオードの数を増
やしたい場合、すなわち、第1フォトダイオード104
及び第2フォトダイオード110の他に、別のフォトダ
イオードを用いたい場合には、3つのフレーム101乃
至103を用いる他に、別のフレームを用いる必要がな
り、その結果、投受光ユニットの厚みがより厚くなって
しまい、ひいては光ピックアップ装置の厚みが厚くなっ
てしまう。When it is desired to increase the number of photodiodes used, that is, the first photodiode 104.
When it is desired to use another photodiode in addition to the second photodiode 110, it is necessary to use another frame in addition to the three frames 101 to 103, and as a result, the thickness of the light emitting / receiving unit is reduced. The thickness of the optical pickup device becomes thicker, and the thickness of the optical pickup device becomes thicker.
【0014】この他にも、前記第1構成例及び前記第2
構成例に係わる光ピックアップ装置は、光ピックアップ
が駆動される際に、各受光素子から取り出される出力信
号を一つの信号処理基板に供給するため、各受光素子か
ら導出される出力信号をフィルム状回路基板等を用いて
横並びの信線群にまとめて供給する必要があるが、この
ような構成にした場合、光ピックアップ装置を組立て、
各受光素子から導出される出力信号をフィルム状回路基
板を介して信号処理回路基板に供給するまで、光ピック
アップ装置の電気的特性の状態を把握することができな
いもので、組立てられた光ピックアップ装置の電気的特
性の状態が好ましくなかった場合、各受光素子の配置箇
所等の調整を行わねばならない。In addition to this, the first configuration example and the second configuration example
The optical pickup device according to the configuration example supplies the output signal extracted from each light receiving element to one signal processing board when the optical pickup is driven. Therefore, the output signal derived from each light receiving element is supplied to the film circuit. It is necessary to collectively supply them to a side-by-side line group using a substrate or the like, but in such a configuration, an optical pickup device is assembled,
The assembled optical pickup device cannot detect the electrical characteristics of the optical pickup device until the output signal derived from each light receiving element is supplied to the signal processing circuit substrate through the film-like circuit substrate. If the state of the electric characteristics of 1 is not preferable, it is necessary to adjust the arrangement position of each light receiving element.
【0015】さらに、前記第1構成例及び前記第2構成
例に係わる各光ピックアップ装置は、光ピックアップ装
置を組立てる際に、光ピックアップ装置の基準面と投受
光ユニツトの基準面との間に位置ずれが生じ、その位置
ずれの影響により受光素子の出力信号に変化が生じたり
することがある。また、第1構成例での筐体、あるいは
第2構成例での投受光ユニットの外部に取り付けた整形
プリズムによって光ビームの整形を行うタイプのものに
おいては、第1構成例での筐体、あるいは第2構成例で
の投受光ユニットの内部の受光素子への入射光強度分布
が整形プリズムの配置誤差の影響によって変化してしま
い、それにより受光素子の出力信号にも変化が生じたり
するようになる。Further, the optical pickup devices according to the first configuration example and the second configuration example are positioned between the reference surface of the optical pickup device and the reference surface of the light emitting / receiving unit when the optical pickup device is assembled. A shift may occur, and the output signal of the light receiving element may change due to the influence of the shift. Further, in the case of the type in which the light beam is shaped by the casing in the first configuration example or the shaping prism attached to the outside of the light emitting / receiving unit in the second configuration example, Alternatively, the distribution of the intensity of incident light on the light receiving element inside the light emitting and receiving unit in the second configuration example may change due to the influence of the positioning error of the shaping prism, which causes a change in the output signal of the light receiving element. become.
【0016】本発明は、このような技術的背景に鑑みて
なされたもので、その目的は、厚さを厚くせずに複数の
受光素子をそれらの受光面がそれぞれ異なる方向を向く
ように配置し、組立直前の特性を把握することができ、
かつ、各構成部品の一体化の度合いを高めた受発光ユニ
ット及びその製造方法を提供することにある。The present invention has been made in view of the above technical background, and an object thereof is to arrange a plurality of light-receiving elements such that their light-receiving surfaces face different directions without increasing the thickness. However, you can grasp the characteristics just before assembly,
Another object of the present invention is to provide a light emitting / receiving unit and a method for manufacturing the same, in which the degree of integration of each component is improved.
【0017】[0017]
【課題を解決するための手段】前記目的を達成するため
に、本発明は、少なくとも、光ビームを放射する光源、
光ビームを分岐する1つ以上の光ビーム分岐手段、光ビ
ームの光路を屈曲変更する1つ以上の光路変更手段をそ
れぞれ凹部内に装着した第1光学部品装着部と、受光素
子が貼着された2つ以上の第1保持板及び受光素子が貼
着されない1つ以上の第2保持板の表面に、第1保持板
及び第2保持板の接合部が屈曲可能にフィルム状回路基
板を貼着した第2光学部品装着部とを備え、光源をフィ
ルム状回路基板に設けたランドに導電接続し、2つ以上
の第1保持板に貼着した受光素子の受光面が他の受光素
子の受光面と異なる方向を向くように各第1保持板を屈
曲し、1つ以上の光ビーム分岐手段のいずれかから分岐
された光ビームが直接または1つ以上の光路変更手段の
いずれかで屈曲されて対応する受光素子に入射するよう
に相互配置した状態にし、第1光学部品装着部に第2光
学部品装着部の第1保持板及び第2保持板を貼着するよ
うに構成した手段を備える。In order to achieve the above object, the present invention provides at least a light source which emits a light beam,
One or more light beam branching means for branching the light beam and one or more optical path changing means for bending and changing the optical path of the light beam are attached to the first optical component mounting portion and the light receiving element, respectively. Also, a film-like circuit board is attached to the surface of the one or more second holding plates to which the two or more first holding plates and the light-receiving element are not attached so that the joint portion of the first holding plate and the second holding plate is bendable. And a light receiving surface of another light receiving element attached to two or more first holding plates, the light source being conductively connected to a land provided on the film-like circuit board. Each first holding plate is bent so as to face a direction different from the light receiving surface, and the light beam branched from any one or more of the light beam branching means is bent directly or by one of the one or more optical path changing means. Are arranged so that they are incident on the corresponding light receiving element. To comprises means configured so as to adhere the second optical component mounting portion first holding plate and a second holding plate of the first optical component mounting unit.
【0018】前記手段によれば、受光素子を除いた各種
の光学部品を搭載した第1光学部品装着部と、受光素子
を貼着した2つ以上の第1保持板及び受光素子を貼着し
ない1つ以上の第2保持板の表面にフィルム状回路基板
を貼着し、第1保持板及び第2保持板の接合部が屈曲可
能になるように構成した第2光学部品装着部とを用い、
第1光学部品装着部と第2光学部品装着部とを貼着する
際に、始めに光源をフィルム状回路基板に設けたランド
に導電接続し、次に2つ以上の第1保持板に貼着した受
光素子の受光面が他の受光素子の受光面と異なる方向を
向くように各第1保持板を屈曲し、その後1つ以上の光
ビーム分岐手段のいずれかから分岐された光ビームが直
接または1つ以上の光路変更手段のいずれかで屈曲され
て対応する受光素子に入射するように相互配置し、その
状態で第1光学部品装着部に第2光学部品装着部の第1
保持板及び第2保持板を貼着するようにしたので、複数
の受光素子を、複数の異なる配置面における各受光素子
に最も適した位置に配置することができ、使用される受
光素子の数が増しても、受発光ユニットの厚さを厚くす
ることなく、それらの受光素子を適宜好ましい状態に配
置できるもので、受発光ユニットにおける構成部品の一
体化の度合いが高く、同一平面に配置しないときの各受
光素子の貼着や導電接続による効率の低下を防ぎ、しか
も、受光素子からの出力信号の電気的特性を光ピックア
ップ装置を組立てたものと同じ状態での把握が可能にな
る。According to the above-mentioned means, the first optical component mounting portion on which various optical components other than the light receiving element are mounted, the two or more first holding plates to which the light receiving element is attached, and the light receiving element are not attached. And a second optical component mounting portion configured such that a film-shaped circuit board is attached to the surface of one or more second holding plates, and a joint between the first holding plate and the second holding plate is bendable. ,
When attaching the first optical component mounting portion and the second optical component mounting portion, first, the light source is conductively connected to the land provided on the film-shaped circuit board, and then attached to the two or more first holding plates. Each first holding plate is bent so that the light-receiving surface of the attached light-receiving element faces a direction different from the light-receiving surface of another light-receiving element, and a light beam branched from any one or more of the light beam branching means is then applied. The first optical component mounting portion and the first optical component mounting portion are arranged so that they are bent either directly or by one or more optical path changing means and are incident on the corresponding light receiving elements.
Since the holding plate and the second holding plate are attached, it is possible to arrange a plurality of light receiving elements at positions most suitable for the respective light receiving elements on a plurality of different arrangement surfaces, and the number of light receiving elements used. The light receiving and emitting units can be appropriately arranged in a preferable state without increasing the thickness of the light emitting and receiving unit, and the degree of integration of the components in the light receiving and emitting unit is high and they are not arranged in the same plane. At this time, it is possible to prevent deterioration of efficiency due to sticking of each light receiving element or conductive connection, and it is possible to grasp the electrical characteristics of the output signal from the light receiving element in the same state as that of the assembled optical pickup device.
【0019】この場合、前記手段における第2光学部品
装着部の2つ以上の第1保持板は、全受光素子の受光面
が同一方向を向いた状態でフィルム状回路基板が貼着さ
れるものである。In this case, the two or more first holding plates of the second optical component mounting portion in the above-mentioned means are those to which the film-like circuit board is attached in a state in which the light receiving surfaces of all the light receiving elements face the same direction. Is.
【0020】このような構成にすれば、複数の受光素子
を貼着したり、導電接続することが容易になり、かつ、
互いに直交配置した保持板にそれぞれ受光素子を貼着し
なくても、受光素子を互いに直交配置した保持板に配置
することができ、貼着操作機能や導電接続操作機能が向
上し、受光素子の配置の自由度を向上させることが可能
になる。With such a structure, it becomes easy to attach a plurality of light receiving elements or to electrically connect them, and
Even if the light receiving elements are not attached to the holding plates arranged orthogonally to each other, the light receiving elements can be arranged on the holding plates arranged orthogonally to each other, and the attachment operation function and the conductive connection operation function are improved. It is possible to improve the degree of freedom of arrangement.
【0021】また、前記手段における第1光学部品装着
部は、光源が放射した光ビームを第1光学部品装着部か
ら光ビームを導出する2つ以上の開口部を有し、開口部
の中の少なくとも1つは光ビームを平行光にする手段に
より封止されるようにしたものである。Further, the first optical component mounting portion in the above-mentioned means has two or more openings for guiding the light beam emitted from the light source from the first optical component mounting portion. At least one is sealed by a means for collimating a light beam.
【0022】このような構成にすれば、コリメータレン
ズと光源との配置誤差に伴う、受光素子への光ビームの
入射状態の変化を除去することができ、かつ、第1光学
部品装着部の内部を完全に封止することができる。According to this structure, it is possible to eliminate the change in the incident state of the light beam on the light receiving element due to the arrangement error between the collimator lens and the light source, and the inside of the first optical component mounting portion. Can be completely sealed.
【0023】さらに、前記手段における第1光学部品装
着部は、光源が放射した光ビームを第1光学部品装着部
から導出する2つ以上の開口部を有し、開口部の中の少
なくとも1つは光ビームを平行光にする手段及び光ビー
ムを整形する手段により封止されるようにしたものであ
る。Further, the first optical component mounting portion in the above-mentioned means has two or more openings through which the light beam emitted by the light source is led out from the first optical component mounting portion, and at least one of the openings is provided. Is designed to be sealed by a means for collimating the light beam and a means for shaping the light beam.
【0024】このような構成にすれば、光ビーム整形を
行うコリメータレンズや整形プリズムをあらかじめ装着
した後で受光素子の位置調整を行うので、コリメータレ
ンズを出射したときと、光媒体等で反射されて再度戻っ
てきたときとで、光ビーム形状変化を起こすような整形
プリズムも一体化して、かつ各受光素子を最適に機能さ
せることができる。また、コリメータレンズや整形プリ
ズムにより受発光ユニットの内部を完全に封止すること
も可能になる。With such a configuration, the position of the light receiving element is adjusted after the collimator lens and the shaping prism for shaping the light beam are mounted in advance, so that the light is reflected by the optical medium and the like when the collimator lens is emitted. Then, a shaping prism that causes a change in the shape of the light beam depending on the time of returning to the original position can be integrated, and each light receiving element can function optimally. Further, the inside of the light emitting / receiving unit can be completely sealed by the collimator lens and the shaping prism.
【0025】また、前記手段における第1光学部品装着
部及び第2光学部品装着部は、それらの貼着面のいずれ
か一方に円筒状位置決め凹部、他方にその凹部よりも小
径の円筒状凸部が形成されているものである。Further, the first optical component mounting portion and the second optical component mounting portion in the above means have a cylindrical positioning concave portion on one of their attaching surfaces and a cylindrical convex portion having a diameter smaller than the concave portion on the other side. Are formed.
【0026】このような構成にすれば、第1光学部品装
着部及び第2光学部品装着部の一方に凹部を、他方に凸
部をそれぞれ形成しているので、受光素子の位置調整を
行うときの初期位置の設定が簡単になる。With this structure, the concave portion is formed in one of the first optical component mounting portion and the second optical component mounting portion, and the convex portion is formed in the other, so that the position adjustment of the light receiving element is performed. Setting the initial position of is easy.
【0027】さらに、前記手段における第1光学部品装
着部は、光源の装着面に平行した延長面と、光源から出
射した光ビームを光学的記録媒体上に集光させる集光手
段と、集光手段を光学的記録媒体の径方向に移行させる
駆動手段とを有し、駆動手段は、延長面を基準面として
第1光学部品装着部に組み立てられるものである。Further, the first optical component mounting portion in the above means is an extension surface parallel to the mounting surface of the light source, a condensing means for condensing the light beam emitted from the light source onto the optical recording medium, and a condensing means. Drive means for moving the means in the radial direction of the optical recording medium, and the drive means is assembled to the first optical component mounting portion with the extension surface as a reference surface.
【0028】このような構成にすれば、第1光学部品装
着部が集光手段を光学的記録媒体の径方向に移行させる
駆動手段の基準となるので、集光手段の傾きを第1光学
部品装着部の一面を基準にして調整することができ、集
光手段の組み込み精度を改善することができる。According to this structure, the first optical component mounting portion serves as a reference for the driving means for moving the light collecting means in the radial direction of the optical recording medium, and therefore the inclination of the light collecting means is adjusted. The adjustment can be performed with reference to one surface of the mounting portion, and the assembling accuracy of the light collecting means can be improved.
【0029】また、前記手段の製造方法において、第1
光学部品装着部の凹部内に、光源、1つ以上の光ビーム
分岐手段、1つ以上の光路変更手段を装着する工程と、
第2光学部品装着部の各第1保持板にそれぞれ貼着した
受光素子の位置とそれらの受光素子への光ビームの投射
位置とを相互調整しながら第1光学部品装着部を第1保
持板または第2保持板の中の1つに貼着する工程とを経
て受発光ユニットが製造されるものである。In the manufacturing method of the above-mentioned means,
Mounting a light source, one or more light beam branching means, and one or more optical path changing means in the recess of the optical component mounting portion;
The first optical component mounting portion is attached to the first holding plate while mutually adjusting the positions of the light receiving elements attached to the respective first holding plates of the second optical component mounting portion and the projection positions of the light beams on the light receiving elements. Alternatively, the light emitting / receiving unit is manufactured through a step of sticking to one of the second holding plates.
【0030】このような構成にすれば、光学部品の配置
状態のバラツキに基づく各受光素子への光ビームの入射
位置の変動をなくすことができ、第1光学部品装着部と
第2光学部品装着部とを貼着した際に生じる各受光素子
への光ビームの入射状態のずれ等の発生を未然に防ぐこ
とができる。With such a configuration, it is possible to eliminate the fluctuation of the incident position of the light beam on each light receiving element due to the variation of the arrangement state of the optical components, and to mount the first optical component mounting portion and the second optical component mounting portion. It is possible to prevent the occurrence of a shift in the incident state of the light beam on each light receiving element that occurs when the parts are attached.
【0031】さらに、前記手段の製造方法において、第
1光学部品装着部を第2光学部品装着部に貼着する際
に、第1光学部品装着部を第2光学部品装着部に仮貼着
する工程と、第2光学部品装着部のフィルム状回路基板
の一部を第1光学部品装着部の対応部分に貼着する工程
と、光源及び全受光素子をフィルム状回路基板に設けた
ランドに連続的に導電接続する工程とを経て、第1光学
部品装着部を第2光学部品装着部に完全貼着する工程が
実行されるものである。Further, in the manufacturing method of the above means, when the first optical component mounting portion is attached to the second optical component mounting portion, the first optical component mounting portion is temporarily attached to the second optical component mounting portion. The step, the step of adhering a part of the film-shaped circuit board of the second optical component mounting portion to the corresponding part of the first optical component mounting portion, and the light source and all the light receiving elements are continuous to the land provided on the film-shaped circuit board. The step of completely affixing the first optical component mounting portion to the second optical component mounting portion is performed through the step of electrically conductively connecting.
【0032】このような構成にすれば、第1光学部品装
着部と第2光学部品装着部とを貼着する前に、第2光学
部品装着部のフィルム状回路基板の一部を第1光学部品
装着部の対応部分に貼着することにより、光源と受光素
子をフィルム状回路基板に同時に導電接続することがで
き、導電接続工程を迅速にかつ効率的に実行することが
できる。According to this structure, before the first optical component mounting portion and the second optical component mounting portion are bonded together, a part of the film-shaped circuit board of the second optical component mounting portion is covered with the first optical component. By sticking to the corresponding part of the component mounting portion, the light source and the light receiving element can be conductively connected to the film-like circuit board at the same time, and the conductive connection step can be performed quickly and efficiently.
【0033】また、前記手段の製造方法において、第1
光学部品装着部を第2光学部品装着部に貼着する際に、
第1光学部品装着部を第2光学部品装着部に仮貼着する
工程と、第2光学部品装着部のフィルム状回路基板の一
部を第1光学部品装着部の対応部分に貼着する工程と、
光源をフィルム状回路基板に設けたランドに導電接続す
る工程と、光源を駆動する工程と、光源から放射される
光ビームを外部の光反射体で反射させ、そのときの反射
光ビームの集光位置を観測しながら、対応する光ビーム
分岐手段の位置を調整固定する工程とを経て、第1光学
部品装着部を第2光学部品装着部に完全貼着する工程が
実行されるものである。In the manufacturing method of the above-mentioned means,
When attaching the optical component mounting portion to the second optical component mounting portion,
A step of temporarily attaching the first optical component mounting portion to the second optical component mounting portion, and a step of attaching a part of the film-shaped circuit board of the second optical component mounting portion to a corresponding portion of the first optical component mounting portion. When,
Conductive connection of the light source to the land provided on the film-like circuit board, driving the light source, reflecting the light beam emitted from the light source by an external light reflector, and condensing the reflected light beam at that time While observing the position, the step of adjusting and fixing the position of the corresponding light beam branching means is performed, and then the step of completely attaching the first optical component mounting portion to the second optical component mounting portion is executed.
【0034】このような構成にすれば、光源をフィルム
状回路基板に導電接続した後に、光源を発光させなが
ら、光ビーム分岐手段の位置の調整を行うことにより、
光ビーム分岐手段で光ビームを分岐した後の焦点方向の
光ビームの入射位置の誤差を低減させることができる。According to this structure, after the light source is conductively connected to the film-like circuit board, the position of the light beam branching means is adjusted while the light source is emitting light.
It is possible to reduce the error in the incident position of the light beam in the focal direction after the light beam is branched by the light beam branching means.
【0035】[0035]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【0036】図1は、本発明による受発光ユニットの第
1の実施の形態に係わり、第1光学部品装着部の要部構
成を示す斜視図である。FIG. 1 relates to a first embodiment of a light emitting / receiving unit according to the present invention, and is a perspective view showing a main configuration of a first optical component mounting portion.
【0037】図1に示されるように、第1光学部品装着
部1は、各種の光学部品が装着できるように形成された
凹部1aと、光ビームを放射する光源2と、光ビームを
分岐する光ビームスプリッタ(光ビーム分岐手段)3
と、光ビーム回折素子4と、光ビームの光路を屈曲変更
する表面反射型45度ミラー(光路変更手段)5とを有
し、光源2、光ビームスプリッタ3、光ビーム回折素子
4、表面反射型45度ミラー5は、いずれも第1光学部
品装着部1の凹部1a内に装着される。また、光学部品
配置部材1は、凹部1aの正面壁部に第1光ビーム出射
口6、凹部1aの一方の側面壁部に第2光ビーム出射口
7、凹部1aの他方の側面壁部に第3光ビーム出射口8
が設けられる。As shown in FIG. 1, the first optical component mounting portion 1 divides the light beam into a recess 1a formed so that various optical components can be mounted, a light source 2 for emitting a light beam, and a light beam. Light beam splitter (light beam splitting means) 3
And a light beam diffracting element 4 and a surface reflection type 45-degree mirror (light path changing means) 5 for changing the optical path of the light beam. The light source 2, the light beam splitter 3, the light beam diffracting element 4, and the surface reflection. Each of the mold 45-degree mirrors 5 is mounted in the concave portion 1a of the first optical component mounting portion 1. The optical component placement member 1 includes a first light beam emission port 6 on the front wall of the recess 1a, a second light beam emission port 7 on one side wall of the recess 1a, and another side wall of the recess 1a. Third light beam exit 8
Is provided.
【0038】この場合、第1光ビーム出射口6は、光源
2から放射された光ビームLAを直進状態で第1光学部
品装着部1から外部に出射させる出射口であり、第2光
ビーム出射口7は、光源2から放射された光ビームLA
を光ビームスプリッタ3で直角方向に屈曲反射させるこ
とにより得られた光ビームLBを第1光学部品装着部1
から外部に出射させる出射口であり、第3光ビーム出射
口8は、第1光ビーム出射口6から出射された光ビーム
LAが光ピックアップ装置の外部の反射物体(例えば、
光ディスク)によって反射され、その反射光ビームが光
ビームスプリッタ3に戻り、再び直角方向に屈曲反射さ
せることにより得られた光ビームLCを第1光学部品装
着部1から外部に出射させる出射口である。また、光源
2から放射された光ビームLAが光ピックアップ装置の
外部の反射物体で反射され、その反射光ビームが光ビー
ム回折素子4に戻ったとき、その反射光ビームの一部が
光ビーム回折素子4で回折され、回折光ビームとして表
面反射型45度ミラー5に向う。回折光ビームは、表面
反射型45度ミラー5で再度反射され、光ビームLDと
して第1光学部品装着部1の高さ方向(y方向)に投射
される。In this case, the first light beam exit 6 is an exit through which the light beam LA emitted from the light source 2 is emitted straight from the first optical component mounting portion 1 to the outside. The mouth 7 is a light beam LA emitted from the light source 2.
The light beam LB obtained by bending and reflecting the light beam at a right angle by the light beam splitter 3 is attached to the first optical component mounting portion 1
The light beam LA emitted from the first light beam emission port 6 is an emission port for emitting the light beam LA from the optical pickup device to the outside.
The light beam is reflected by the optical disc), the reflected light beam returns to the light beam splitter 3, and the light beam LC obtained by bending and reflecting again in the perpendicular direction is emitted from the first optical component mounting portion 1 to the outside. . Further, when the light beam LA emitted from the light source 2 is reflected by a reflecting object outside the optical pickup device and the reflected light beam returns to the light beam diffraction element 4, a part of the reflected light beam is diffracted by the light beam. The light is diffracted by the element 4 and goes to the surface reflection type 45-degree mirror 5 as a diffracted light beam. The diffracted light beam is reflected again by the surface reflection type 45-degree mirror 5 and projected as a light beam LD in the height direction (y direction) of the first optical component mounting portion 1.
【0039】なお、第1光学部品装着部1においては、
光ビーム分岐手段に光ビームスプリッタ3を用い、光路
変換手段に表面反射型45度ミラー5を用いた例を示し
ているが、光ビーム分岐手段として光ビームスプリッタ
3の代わりに同等の機能を達成できる手段を採用しても
よく、光路変換手段として表面反射型45度ミラー5の
代わりに同等の機能を達成できる手段を採用してもよ
い。In the first optical component mounting portion 1,
An example is shown in which the light beam splitter 3 is used as the light beam branching means and the surface reflection type 45 degree mirror 5 is used as the light path changing means, but an equivalent function is achieved instead of the light beam splitter 3 as the light beam branching means. Means capable of achieving the same function may be employed instead of the surface reflection type 45-degree mirror 5 as the optical path changing means.
【0040】また、光ビーム分岐手段である光ビームス
プリッタ3は、偏光の種類別に光透過率、光反射率が異
なる特性を持った偏光ビームスプリツタや、偏光ビーム
スプリッタに複屈折性材料で形成した偏光分離素子を複
合した形態の複合光学素子であってもよい。同様に、光
ビーム分岐手段である光ビーム回折素子4は、入射光ビ
ームを複数に分割する機能や、入射光ビームの発散角を
変換する機能等が付加された光ビーム回折素子であって
もよい。さらに、光路変換手段である表面反射型45度
ミラー5は、内部反射型45度ミラーを用いてもよい。The light beam splitter 3, which is a light beam splitting means, is formed of a polarization beam splitter having characteristics of different light transmittance and light reflectance depending on the type of polarization, and a birefringent material for the polarization beam splitter. It may be a composite optical element in the form of a composite of the above polarization separation elements. Similarly, the light beam diffractive element 4 as the light beam branching unit may be a light beam diffractive element having a function of splitting the incident light beam into a plurality of parts, a function of converting the divergence angle of the incident light beam, and the like. Good. Further, as the surface reflection type 45 degree mirror 5 which is the optical path changing means, an internal reflection type 45 degree mirror may be used.
【0041】次に、図2は、本発明による受発光ユニッ
トの第1の実施の形態に係わり、第2光学部品装着部の
要部構成を示す斜視図であり、図1に図示の第1光学部
品装着部1に貼着されるものである。Next, FIG. 2 is a perspective view showing a configuration of a main part of a second optical component mounting portion according to the first embodiment of the light emitting / receiving unit according to the present invention. It is attached to the optical component mounting portion 1.
【0042】図2に示されるように、第2光学部品装着
部9は、3枚の第1保持板10、11、12と、1枚の
第2保持板13と、3枚の第1保持板10乃至12と1
枚の第2保持板13の各表面に貼着されたフィルム状回
路基板14と、第1保持板10のフィルム状回路基板1
4貼着面側に貼着された受光素子10aと、第1保持板
11のフィルム状回路基板14貼着面側に貼着された受
光素子11aと、第1保持板12のフィルム状回路基板
14貼着面側に貼着された受光素子12aと、を備え
る。また、フィルム状回路基板14は、表面の複数箇所
にランド群15、16、17、18が設けられ、フィル
ム状回路基板14に形成された図示されない配線群によ
ってこれらのランド群15乃至18がそれぞれ対応する
駆動回路等に接続される。As shown in FIG. 2, the second optical component mounting portion 9 includes three first holding plates 10, 11, 12 and one second holding plate 13 and three first holding plates. Boards 10 to 12 and 1
The film-like circuit board 14 attached to each surface of the second holding plates 13 and the film-like circuit board 1 of the first holding plate 10.
4 Light-receiving element 10a attached to the attachment surface side, film-shaped circuit board 14 of the first holding plate 11, light-receiving element 11a attached to the attachment surface side, and film-shaped circuit board of the first holding plate 12 14 and a light receiving element 12a attached to the attachment surface side. The film-like circuit board 14 is provided with land groups 15, 16, 17, and 18 at a plurality of positions on the surface, and these land groups 15 to 18 are respectively provided by a wiring group (not shown) formed on the film-like circuit board 14. It is connected to a corresponding drive circuit or the like.
【0043】この場合、ランド群15は8つのランド部
(図番なし)を有し、ランド群16は6つのランド部
(図番なし)を有し、ランド群17は3つのランド部
(図番なし)を有し、ランド群18は2つのランド部
(図番なし)を有している。受光素子10aは、その受
光面の対応する箇所が8つのランド部に微細な金属線群
(図番なし)によってそれぞれ導電接続され、受光素子
10bは、その受光面の対応する箇所が6つのランド部
に微細な金属線群(図番なし)によってそれぞれ導電接
続され、受光素子10cは、その受光面の対応する箇所
が3つのランド部に微細な金属線群(図番なし)によっ
てそれぞれ導電接続される。このときの微細な金属線に
は金線あるいはアルミ・シリコンの合金線等が用いられ
る。In this case, the land group 15 has eight land parts (no figure number), the land group 16 has six land parts (no figure number), and the land group 17 has three land parts (no figure number). No land), and the land group 18 has two land parts (no figure). In the light receiving element 10a, corresponding portions of its light receiving surface are conductively connected to eight lands by fine metal wire groups (no drawing numbers), and in the light receiving element 10b, corresponding portions of its light receiving surface are six lands. Portions are conductively connected to each other by a fine metal wire group (no figure number), and the light receiving element 10c is conductively connected to three lands at corresponding portions of the light receiving surface by a fine metal wire group (no figure number). To be done. At this time, a gold wire or an aluminum-silicon alloy wire is used as the fine metal wire.
【0044】また、3枚の第1保持板10乃至12と1
枚の第2保持板13の各表面にフィルム状回路基板14
を貼着する場合、第1保持板10、11の接合部、第1
保持板10、12の接合部、第1保持板10と第2保持
板13の接合部にそれぞれ間隙を有する状態で貼着する
ようにし、第2光学部品装着部9を第1光学部品装着部
第1に貼着する際に、第1保持板10に対して、第1保
持板11、第1保持板12、第2保持板13のそれぞれ
を約90°屈曲させることができるようにしている。Further, the three first holding plates 10 to 12 and 1
A film-like circuit board 14 is provided on each surface of the second holding plates 13.
When attaching the first holding plate 10 and the first holding plate 11,
The second optical component mounting portion 9 is attached to the joint portion of the holding plates 10 and 12 and the joint portion of the first holding plate 10 and the second holding plate 13 with a gap, respectively. Firstly, each of the first holding plate 11, the first holding plate 12, and the second holding plate 13 can be bent about 90 ° with respect to the first holding plate 10 when the first holding plate 10 is attached. .
【0045】第2光学部品装着部9は、受光素子11b
とランド群16とを含んだ部分の大きさが第1光学部品
装着部1に形成した第2光ビーム出射口7の口径よりも
小さくなるように構成され、同様に、受光素子11cと
ランド群17とを含んだ部分の大きさが第1光学部品装
着部1に形成した第3光ビーム出射口8の口径よりも小
さくなるように構成される。このように構成している理
由は、後述するように、第1光学部品装着部1に第2光
学部品装着部9を貼着した際に、受光素子11bとラン
ド群16とを含んだ部分が第2光ビーム出射口7の口径
内に、受光素子11cとランド群17とを含んだ部分が
第3光ビーム出射口8の口径内にそれぞれ入ることによ
り、第2光学部品装着部9の第1保持板11、12を第
1光学部品装着部1の対応する側面に隙間なく貼り合わ
せることができるようにするためである。The second optical component mounting portion 9 includes the light receiving element 11b.
And the land group 16 are configured so that the size of the portion including the land group 16 is smaller than the diameter of the second light beam emission port 7 formed in the first optical component mounting portion 1. Similarly, the light receiving element 11c and the land group are similarly configured. The size of the portion including 17 and 17 is smaller than the diameter of the third light beam emission port 8 formed in the first optical component mounting portion 1. The reason for this configuration is that, as will be described later, when the second optical component mounting portion 9 is attached to the first optical component mounting portion 1, the portion including the light receiving element 11b and the land group 16 is By inserting the portions including the light receiving element 11c and the land group 17 into the aperture of the second light beam emission port 7 into the aperture of the third light beam emission port 8, respectively, This is because the first holding plates 11 and 12 can be attached to the corresponding side surfaces of the first optical component mounting portion 1 without any gap.
【0046】この第2光学部品装着部9においては、受
光素子11aを貼着した第1保持板10、受光素子11
bを貼着した第1保持板11、受光素子11cを貼着し
た第1保持板12が互いに平行な貼着面を有しているの
で、各受光素子11a、11b、11cをそれぞれフィ
ルム状回路基板14に導電接続する際の操作性が良好に
なる。すなわち、この実施の形態に係わる受発光ユニッ
トは、各受光素子11a、11b、11cを導電接続す
る際に、各受光素子11a、11b、11cの位置関係
が同一平面上にあって、導電接続に適した状態にあり、
一方、各受光素子11a、11b、11cの位置調整を
する際に、各受光素子11a、11b、11cの位置関
係が互いに異なる面上にあって、位置調整固定に適した
状態に変化させることができるので、受発光ユニットの
設計及び各受光素子11a、11b、11cの導電接続
時の操作性等を個別に改善することができる。In the second optical component mounting portion 9, the first holding plate 10 to which the light receiving element 11a is attached and the light receiving element 11 are attached.
Since the first holding plate 11 to which b is attached and the first holding plate 12 to which the light receiving element 11c is attached have the attachment surfaces parallel to each other, each of the light receiving elements 11a, 11b, and 11c is formed into a film circuit. The operability when conductively connecting to the substrate 14 is improved. That is, in the light receiving and emitting unit according to this embodiment, when the light receiving elements 11a, 11b and 11c are electrically connected, the light receiving elements 11a, 11b and 11c have a positional relationship on the same plane and are electrically connected. In good condition,
On the other hand, when adjusting the position of each of the light receiving elements 11a, 11b, 11c, it is possible to change the light receiving elements 11a, 11b, 11c to a state suitable for position adjustment fixing on the surface where the positional relationship is different from each other. Therefore, it is possible to individually improve the design of the light emitting / receiving unit and the operability at the time of conductive connection of the light receiving elements 11a, 11b, 11c.
【0047】なお、図2に図示の例においては、第2保
持板13に何の部品も装着されていないが、第2保持板
13上のフィルム状回路基板14には、光源2に半導体
レーザを用いる場合、光源2を駆動する直流電源に高周
波を重畳させるための高周波発生回路部を実装すること
ができる。In the example shown in FIG. 2, no component is attached to the second holding plate 13, but the film-like circuit board 14 on the second holding plate 13 has a semiconductor laser connected to the light source 2. In the case of using, a high-frequency generation circuit unit for superposing a high frequency on a DC power supply that drives the light source 2 can be mounted.
【0048】また、図2に図示の例において、3枚の第
1保持板10乃至12と1枚の第2保持板13の各表面
に貼着されるフィルム状回路基板14には、第1保持板
10と他の保持板11、12、13との接合部にそれぞ
れ開口部を設けていないが、第1保持板10に対して、
第1保持板11、第1保持板12、第2保持板13のそ
れぞれを屈曲させる際の屈曲性を高めるために、第1保
持板10と他の保持板11、12、13との接合部のそ
れぞれに、それらの接合部に沿って延びる長い楕円形の
開口部を設けるようにしてもよい。Further, in the example shown in FIG. 2, the film-like circuit board 14 attached to the respective surfaces of the three first holding plates 10 to 12 and the one second holding plate 13 has the first No openings are provided in the joints between the holding plate 10 and the other holding plates 11, 12, and 13, respectively.
In order to enhance flexibility when bending each of the first holding plate 11, the first holding plate 12, and the second holding plate 13, a joint portion between the first holding plate 10 and the other holding plates 11, 12, 13 Each of them may be provided with a long elliptical opening extending along their joint.
【0049】次いで、図3及び図4は、第1光学部品装
着部1と第2光学部品装着部9とを貼着して受発光ユニ
ットを形成する際の製造過程を示す斜視図であって、図
3は最初の状態、図4は最終の状態をそれぞれ表してい
る。Next, FIGS. 3 and 4 are perspective views showing a manufacturing process when the first optical component mounting portion 1 and the second optical component mounting portion 9 are adhered to each other to form a light emitting / receiving unit. 3 shows the initial state, and FIG. 4 shows the final state.
【0050】図3及び図4において、19は第1光学部
品装着部1に設けた円筒状凸部、20は第2光学部品装
着部9の第1保持板10に設けた円筒状凹部であり、そ
の他、図1及び図2に示された構成要素と同じ構成要素
については同じ符号を付けている。In FIGS. 3 and 4, 19 is a cylindrical convex portion provided on the first optical component mounting portion 1, and 20 is a cylindrical concave portion provided on the first holding plate 10 of the second optical component mounting portion 9. In addition, the same components as those shown in FIGS. 1 and 2 are designated by the same reference numerals.
【0051】この場合、円筒状凸部19及び円筒状凹部
20は、調整開始位置(受光素子の設計時点での所定の
位置)への位置決め用のもので、円筒状凸部19の直径
が円筒状凹部20の直径よりも小さくなるように形成さ
れている。In this case, the cylindrical convex portion 19 and the cylindrical concave portion 20 are for positioning to the adjustment start position (predetermined position at the time of designing the light receiving element), and the diameter of the cylindrical convex portion 19 is a cylinder. The recess 20 is formed to have a diameter smaller than that of the recess 20.
【0052】ここで、図3及び図4を用い、この受発光
ユニットの製造過程について説明する。Here, the manufacturing process of this light emitting / receiving unit will be described with reference to FIGS.
【0053】始めに、図3に示されるように、図1に図
示された第1光学部品装着部1の背面に、図2に図示さ
れた第2光学部品装着部9の第2保持板13を当接し、
第2保持板13上から外側方向に延びているフィルム状
回路基板14を第1光学部品装着部1の背面に沿って折
曲し、ランド群18が形成されている突出部分を、第1
光学部品装着部1の凹部1a内の光源2の配置部分の近
傍に貼着する。First, as shown in FIG. 3, the second holding plate 13 of the second optical component mounting portion 9 shown in FIG. 2 is provided on the back surface of the first optical component mounting portion 1 shown in FIG. Abut
The film-shaped circuit board 14 extending outward from the second holding plate 13 is bent along the back surface of the first optical component mounting portion 1, and the protruding portion where the land group 18 is formed
It is attached in the vicinity of the portion where the light source 2 is arranged in the concave portion 1a of the optical component mounting portion 1.
【0054】次に、光源2とランド群18の対応するラ
ンド部とを金属線(図番なし)によって導電接続する。Next, the light source 2 and the corresponding land portion of the land group 18 are conductively connected by a metal wire (no drawing number).
【0055】次いで、光源2とランド群18の対応する
ランド部とを導電接続した状態で、フィルム状回路基板
14における第1保持板10、11の接合部、第1保持
板10、12の接合部、第1保持板10と第2保持板1
3の接合部をそれぞれ略90°屈曲させ、第1光学部品
装着部1の背面に第2保持板13が、第1光学部品装着
部1の両側面に第1保持板11、12が、第1光学部品
装着部1の上面に第1保持板10がそれぞれくるよう
に、第2光学部品装着部9を折り畳むようにして第1光
学部品装着部1に被せる。このとき、第1光学部品装着
部1に設けた円筒状凸部19を、第2光学部品装着部9
の第1保持板10に設けた円筒状凹部20に嵌め込むこ
とにより、第1光学部品装着部1と第1保持板10との
調整開始位置への位置決めが行われる。Next, in a state where the light source 2 and the corresponding land portion of the land group 18 are conductively connected, the joining portion of the first holding plates 10 and 11 and the joining of the first holding plates 10 and 12 in the film-like circuit board 14 are joined. Section, first holding plate 10 and second holding plate 1
The joint portions of 3 are bent by approximately 90 °, and the second holding plate 13 is provided on the back surface of the first optical component mounting portion 1, and the first holding plates 11 and 12 are provided on both side surfaces of the first optical component mounting portion 1. The first optical component mounting portion 1 is covered by folding the second optical component mounting portion 9 so that the first holding plate 10 is placed on the upper surface of the first optical component mounting portion 1. At this time, the cylindrical convex portion 19 provided on the first optical component mounting portion 1 is replaced by the second optical component mounting portion 9
The first optical component mounting portion 1 and the first holding plate 10 are positioned at the adjustment start position by fitting into the cylindrical recess 20 provided in the first holding plate 10.
【0056】続いて、図4に示されるように、第1光学
部品装着部1に折り畳んだ第2光学部品装着部9を被せ
て受発光ユニットを仮形成した後、光源2を発光させ、
位置調整が必要な受光素子10a等の位置を調整する。
この調整において、例えば、第1保持板10上にある受
光素子10aを位置調整する必要がある場合は、第1保
持板10上に設けられた凹部あるいは凸部(図示なし)
に先端が係合するような専用のアーム(図示なし)を用
い、第1保持板10ごとに受光素子10aを移動させ、
受光素子10aから出力された所定の信号がフィルム状
回路基板14を介して得られるように受光素子10aの
位置を調整する。同じように、他の受光素子11a、1
2aの位置の調整を行う。これらの受光素子10a、1
1a、12aの位置の調整が終了したら、第1光学部品
装着部1の内部を封止するように第2光学部品装着部9
を第1光学部品装着部1に貼着固定し、受発光ユニット
が完成する。Subsequently, as shown in FIG. 4, the first optical component mounting portion 1 is covered with the folded second optical component mounting portion 9 to temporarily form the light emitting / receiving unit, and then the light source 2 is caused to emit light.
The position of the light receiving element 10a or the like that requires position adjustment is adjusted.
In this adjustment, for example, when it is necessary to adjust the position of the light receiving element 10a on the first holding plate 10, a concave portion or a convex portion (not shown) provided on the first holding plate 10 is used.
Using a dedicated arm (not shown) whose tip engages with, move the light receiving element 10a for each first holding plate 10,
The position of the light receiving element 10a is adjusted so that the predetermined signal output from the light receiving element 10a is obtained via the film-shaped circuit board 14. Similarly, other light receiving elements 11a, 1
Adjust the position of 2a. These light receiving elements 10a, 1
When the adjustment of the positions of 1a and 12a is completed, the second optical component mounting portion 9 is sealed so as to seal the inside of the first optical component mounting portion 1.
Is attached and fixed to the first optical component mounting portion 1, and the light emitting / receiving unit is completed.
【0057】このようにして得られた受発光ユニット
は、第2光学部品装着部9の第1保持板11、12及び
第2保持板13が、第1光学部品装着部1と第2光学部
品装着部9とを組み合わせる段階で、第1光学部品装着
部1の側面側に配置されるので、受光素子10a、11
a、12aの各受光面をそれぞれ異なる方向を向くよう
に一体化できるだけなく、受発光ユニットの厚み(図3
のY方向の厚さ)を第1光学部品装着部1の厚さと第1
保持板10の厚さとの和の範囲に収まっており、受発光
ユニットの厚さを増すことなく、一体化の度合いを高め
ることができる。この場合、受発光ユニットを仮形成し
た状態で各受光素子10a、11a、12aから得られ
る信号の状態を、光ピックアップ装置(例えば、最も簡
単なものは、この受発光ユニットと、同受発光ユニット
からの出射光を光媒体に集光する手段とによって構成さ
れる)を組み上げたときと同じ信号の状態として把握す
ることができ、受発光ユニット単体であっても、その性
能を把握することができる。In the light emitting / receiving unit thus obtained, the first holding plates 11 and 12 and the second holding plate 13 of the second optical component mounting portion 9 have the first optical component mounting portion 1 and the second optical component. Since the light receiving elements 10a and 11 are arranged on the side surface side of the first optical component mounting portion 1 when the mounting portion 9 and the mounting portion 9 are combined.
Not only can the light receiving surfaces of a and 12a be integrated so as to face different directions, the thickness of the light receiving and emitting unit (see FIG.
Of the first optical component mounting portion 1 and the first optical component mounting portion 1
Since it is within the range of the sum of the thickness of the holding plate 10, the degree of integration can be increased without increasing the thickness of the light emitting / receiving unit. In this case, the state of the signal obtained from each light receiving element 10a, 11a, 12a in a state where the light emitting and receiving unit is temporarily formed is determined by an optical pickup device (for example, the simplest one is this light receiving and emitting unit and the same light receiving and emitting unit). It is possible to understand the performance of the light emitting / receiving unit alone, even if the light emitting / receiving unit is a single unit. it can.
【0058】さらに、この受発光ユニットの製造方法に
ついて述べると、第1光学部品装着部1に対し第2光学
部品装着部9のフィルム状回路基板14の一部、すなわ
ちランド群18が形成されている突出部分を凹部1aに
貼着した後に、光源2、各受光素子10a、11a、1
2aとフィルム状回路基板14に設けた各ランド群1
5、15、17、18との間で連続的に導電接続を行え
ば、導電接続工程を迅速に効率的に行うことができる。A method of manufacturing the light emitting / receiving unit will be described. A part of the film-like circuit board 14 of the second optical component mounting portion 9, that is, the land group 18, is formed with respect to the first optical component mounting portion 1. After sticking the protruding portion on the concave portion 1a, the light source 2 and the respective light receiving elements 10a, 11a, 1
2a and each land group 1 provided on the film-like circuit board 14
If the conductive connection is continuously performed between the electrodes 5, 15, 17, and 18, the conductive connection step can be performed quickly and efficiently.
【0059】また、第1光学部品装着部1に装着する光
ビーム分岐手段の中で、例えば、ビームスプリッタ3を
装着固定する場合、光源2の導電接続を行った後の工程
で、光源2を発光させてその放射光を受発光ユニットの
外部の反射物体(光ディスク等)に投射し、反射物体か
ら戻った反射光ビームを用い、ビームスプリツタ3を光
源2からの放射光ビームの光軸に平行な方向(Z方向)
の位置を調整して固定することにより、受光素子13a
方向に分岐される光ビームが受光素子13aの受光面へ
入射する際の焦点ずれ誤差を改善することができる。な
お、外部のの反射物体としてコーナーリフレクタを用い
れば、放射光ビームが平行光ビームであるか、集束光ビ
ームであるかに係わりなく、ビームスプリッタ3の位置
調整を簡単に行うことができる。In addition, for example, in the case where the beam splitter 3 is mounted and fixed in the light beam splitting means mounted on the first optical component mounting portion 1, the light source 2 is connected in a step after the conductive connection of the light source 2 is performed. The emitted light is emitted and projected onto a reflection object (optical disk or the like) outside the light emitting / receiving unit, and the beam splitter 3 is used as the optical axis of the emission light beam from the light source 2 by using the reflected light beam returned from the reflection object. Parallel direction (Z direction)
By adjusting and fixing the position of the
The defocus error when the light beam branched in the direction enters the light receiving surface of the light receiving element 13a can be improved. If a corner reflector is used as an external reflection object, the position of the beam splitter 3 can be easily adjusted regardless of whether the emitted light beam is a parallel light beam or a focused light beam.
【0060】なお、この実施の形態においては、第1光
学部品装着部1に円筒状凸部19を設け、第2光学部品
装着部9の第1保持板10に円筒状凹部20を設けてい
るが、それとは逆に、第1光学部品装着部1に円筒状凹
部20を設け、第2光学部品装着部9の第1保持板10
に円筒状凸部19を設けるようにしてもよい。また、第
1光学部品装着部1と第1保持板10との間の位置決め
の精度が比較的ラフでよい場合、円筒状凸部19を設け
ること及び円筒状凹部20を設けることをそれぞれ省略
するようにしてもよい。In this embodiment, the first optical component mounting portion 1 is provided with the cylindrical convex portion 19, and the first holding plate 10 of the second optical component mounting portion 9 is provided with the cylindrical concave portion 20. However, conversely, a cylindrical recess 20 is provided in the first optical component mounting portion 1, and the first holding plate 10 of the second optical component mounting portion 9 is provided.
Alternatively, the cylindrical convex portion 19 may be provided. Further, when the positioning accuracy between the first optical component mounting portion 1 and the first holding plate 10 is relatively rough, the provision of the cylindrical convex portion 19 and the provision of the cylindrical concave portion 20 are omitted. You may do it.
【0061】続く、図5は、本発明による受発光ユニッ
トの第2の実施の形態に係わり、第1光学部品装着部1
の要部構成を示す斜視図である。Next, FIG. 5 relates to the second embodiment of the light emitting / receiving unit according to the present invention, and relates to the first optical component mounting portion 1
It is a perspective view which shows the principal part structure of.
【0062】図5に図示されるように、第2の実施の形
態に係わる第1光学部品装着部1は、図1に図示した第
1の実施の形態の第1光学部品装着部1における第1光
ビーム出射口6に、出射光ビームを平行光ビームに変換
するコリメータレンズ21を嵌め込んだものであり、そ
の他の構成は第1の実施の形態の第1光学部品装着部1
と同じである。なお、図5において、図1に図示された
構成要素と同じ構成要素については同じ符号を付けてい
る。As shown in FIG. 5, the first optical component mounting portion 1 according to the second embodiment is similar to the first optical component mounting portion 1 of the first embodiment shown in FIG. A collimator lens 21 for converting the emitted light beam into a parallel light beam is fitted in the one light beam emission port 6, and other configurations are the same as the first optical component mounting portion 1 of the first embodiment.
Is the same as. In FIG. 5, the same components as those shown in FIG. 1 are designated by the same reference numerals.
【0063】コリメータレンズを受発光ユニットに一体
化する場合は、コリメータレンズ21と光源2との位置
関係の設計値からのずれが問題になってくるが、第2の
実施の形態においてはそのずれの影響が出ないような方
法で受発光ユニットを構成することができる。When the collimator lens is integrated with the light emitting / receiving unit, the deviation of the positional relationship between the collimator lens 21 and the light source 2 from the design value becomes a problem, but in the second embodiment, the deviation occurs. The light emitting and receiving unit can be configured in such a manner that the influence of the above does not occur.
【0064】第2の実施の形態に係わる第1光学部品装
着部1は、第1光ビーム出射口6にコリメータレンズ2
1をはめ込んだ後で、前述のように第1光学部品装着部
1と第2光学部品装着部9とを貼着して、受発光ユニッ
トを構成しているもので、例えば、コリメータレンズ2
1と光源2との位置関係の設計値からのずれによる誤差
を吸収し、開口部8の出口に戻り光の焦点位置を持って
くる操作、すなわちビームスプリッター3の位置を調整
固定して第1光学部品装着部1を完成しておいて、さら
に各受光素子10a、11a、12aの中の位置調整が
必要な受光素子も、コリメータレンズ21と光源2との
位置関係の設計値からのずれの影響を吸収するようにし
て位置調整し、固定することができる。なお、コリメー
タレンズ21により受発光ユニットの内部を封止するこ
ともできる。The first optical component mounting portion 1 according to the second embodiment has the collimator lens 2 at the first light beam emission port 6.
After fitting in 1, the first optical component mounting portion 1 and the second optical component mounting portion 9 are adhered to each other to form a light emitting and receiving unit as described above. For example, the collimator lens 2
The operation of absorbing the error due to the deviation of the positional relationship between the light source 1 and the light source 2 from the design value and bringing the focal position of the returning light to the exit of the opening 8, that is, the position of the beam splitter 3 is adjusted and fixed. After the optical component mounting portion 1 is completed, the light receiving elements in each of the light receiving elements 10a, 11a, 12a that require position adjustment are also deviated from the design value of the positional relationship between the collimator lens 21 and the light source 2. The position can be adjusted and fixed so as to absorb the influence. The inside of the light emitting / receiving unit may be sealed by the collimator lens 21.
【0065】続いて、図6は、本発明による受発光ユニ
ットの第3の実施の形態に係わり、第1光学部品装着部
1の要部構成を示す斜視図である。Next, FIG. 6 is a perspective view showing a main configuration of the first optical component mounting portion 1 according to the third embodiment of the light emitting / receiving unit according to the present invention.
【0066】図6に図示されるように、第3の実施の形
態に係わる第1光学部品装着部1は、高さ方向(図のY
軸方向)から見たとき、第1光学部品装着部1の全体の
投影形状が台形になっているものであり、第1光学部品
装着部1における第1光ビーム出射口6に出射光ビーム
を平行光ビームに変換するコリメータレンズ21を嵌め
込み、第1光学部品装着部1の傾斜部分にある第1光ビ
ーム出射口6に整形プリズム22を取付けているもの
で、それ以外の構成は第1の実施の形態の第1光学部品
装着部1と同じである。なお、図6において、図1に図
示された構成要素と同じ構成要素については同じ符号を
付けている。As shown in FIG. 6, the first optical component mounting portion 1 according to the third embodiment has a height direction (Y in the figure).
When viewed from the axial direction), the entire projected shape of the first optical component mounting portion 1 is a trapezoid, and the emitted light beam is emitted to the first light beam emission port 6 of the first optical component mounting portion 1. A collimator lens 21 for converting into a parallel light beam is fitted, and a shaping prism 22 is attached to the first light beam emission port 6 in the inclined portion of the first optical component mounting portion 1. Other configurations are the same as those of the first embodiment. This is the same as the first optical component mounting portion 1 of the embodiment. Note that, in FIG. 6, the same components as those shown in FIG. 1 are designated by the same reference numerals.
【0067】第3の実施の形態に係わる第1光学部品装
着部1において、台形の斜辺部分の傾斜角θや整形プリ
ズム22の形状は、整形プリズム22の硝材や整形比及
び光源2から放射される光ビーム波長によって決まる。
例えば、光源2から放射される光ビーム波長が405n
mであり、2つの面のなす角度が直角で、硝材BK7で
加工された整形比が1.5倍の整形プリズム22が用い
られる場合、図6に示される傾斜角θは23.1°であ
り、整形プリズム22の頂角φは32.8°である。In the first optical component mounting portion 1 according to the third embodiment, the inclination angle θ of the trapezoidal hypotenuse and the shape of the shaping prism 22 are radiated from the glass material and shaping ratio of the shaping prism 22 and the light source 2. It depends on the light beam wavelength.
For example, the wavelength of the light beam emitted from the light source 2 is 405n.
m, the angle formed by the two surfaces is a right angle, and when the shaping prism 22 processed with the glass material BK7 and having a shaping ratio of 1.5 is used, the inclination angle θ shown in FIG. 6 is 23.1 °. The apex angle φ of the shaping prism 22 is 32.8 °.
【0068】この第3の実施の形態による受発光ユニッ
トは、第1光学部品装着部1にコリメータレンズ21、
整形プリズム22をそれぞれ固定した後、第1光学部品
装着部1に対し第2光学部品装着部9を貼着しているも
ので、光源2から出た光がコリメータレンズ21を出射
したときと、光媒体等で反射されて再度戻ってきたとき
とで、光ビーム形状を変化させるような整形プリズム2
2を一体化しても、各受光素子10a、11a、12a
の中の位置調整が必要な受光素子の位置に関して、この
光ビーム形状の変化を反映した位置調整を行って固定す
ることができる。なお、コリメータレンズ21や整形プ
リズム22により受発光ユニットの内部を封止すること
もできる。In the light emitting / receiving unit according to the third embodiment, the collimator lens 21, the collimator lens 21,
After fixing the shaping prisms 22 respectively, the second optical component mounting portion 9 is attached to the first optical component mounting portion 1, and when the light emitted from the light source 2 is emitted from the collimator lens 21, A shaping prism 2 that changes the shape of a light beam when reflected by an optical medium and returned again
Even if 2 are integrated, each light receiving element 10a, 11a, 12a
Regarding the position of the light receiving element in which the position adjustment is necessary, it is possible to fix the position by performing the position adjustment reflecting the change of the light beam shape. The collimator lens 21 and the shaping prism 22 may seal the inside of the light emitting / receiving unit.
【0069】次に、図7は、本発明による受発光ユニッ
トの第4の実施の形態に係わり、その受発光ユニット
と、その受発光ユニットからの出射光の集光手段とを合
わせたピックアップ装置の要部構成を示す斜視図であ
る。Next, FIG. 7 relates to a fourth embodiment of a light emitting / receiving unit according to the present invention, and a pickup device including the light emitting / receiving unit and a means for collecting light emitted from the light emitting / receiving unit. It is a perspective view which shows the principal part structure of.
【0070】図7に示されるように、第4の実施の形態
による受発光ユニットを用いた光ピックアップ装置は、
図5に図示された受発光ユニットと基本的に同じ構成要
素を持つ受発光ユニットの他に、光路変換手段としての
表面反射型45度ミラー23と、光ディスク27の表面
に光ビームを集束させる集光手段としての対物レンズ2
4と、対物レンズ24を駆動する駆動手段25(一部だ
けが図示されている)とを備えている。なお、図7にお
いて、図5に図示された構成要素と同じ構成要素につい
ては同じ符号を付けている。As shown in FIG. 7, an optical pickup device using the light emitting / receiving unit according to the fourth embodiment is
In addition to the light emitting / receiving unit basically having the same components as the light emitting / receiving unit shown in FIG. 5, a surface reflection type 45 ° mirror 23 as an optical path changing unit and a focusing unit for focusing a light beam on the surface of the optical disk 27. Objective lens 2 as light means
4 and driving means 25 (only a part of which is shown) for driving the objective lens 24. 7, the same components as those shown in FIG. 5 are designated by the same reference numerals.
【0071】そして、第4の実施の形態による受発光ユ
ニットは、第2の実施の形態による受発光ユニットにお
ける第1光学部品装着部1の形状を一部変更したもの
で、第1光学部品装着部1から延長した光源2の装着面
と平行な突出面26が設けられ、対物レンズ24を駆動
する駆動手段25は、突出面26上に突出面26を基準
にして組み立てられる。The light emitting / receiving unit according to the fourth embodiment is obtained by partially changing the shape of the first optical component mounting portion 1 in the light emitting / receiving unit according to the second embodiment. A projecting surface 26 that extends from the portion 1 and is parallel to the mounting surface of the light source 2 is provided, and the driving means 25 that drives the objective lens 24 is assembled on the projecting surface 26 with the projecting surface 26 as a reference.
【0072】この場合、対物レンズ24を駆動する駆動
手段25は、対物レンズ24が光ピックアップ装置の基
準面に対して平行になるように組み立てられることにな
り、受発光ユニットからの出射光ビームを光ディスク2
7の表面に集束させる対物レンズ24を駆動する駆動手
段25を、受発光ユニットに高精度で組み込むことがで
きる。In this case, the driving means 25 for driving the objective lens 24 is assembled so that the objective lens 24 is parallel to the reference plane of the optical pickup device, and the light beam emitted from the light emitting / receiving unit is emitted. Optical disc 2
The driving means 25 for driving the objective lens 24 for focusing on the surface of the light source 7 can be incorporated in the light emitting / receiving unit with high accuracy.
【0073】前記各実施の形態においては、第1光学部
品装着部9が3枚の第1保持板10、11、12と1枚
の第2保持板13とによって形成される例を挙げて説明
したが、本発明による第1光学部品装着部9は3枚の第
1保持板10、11、12と1枚の第2保持板13とに
よって形成される場合に限られるものではなく、2枚ま
たは4枚の第1保持板を有するものであってもよく、2
枚またはそれ以上の第2保持板を有するものであっても
よい。In each of the above-mentioned embodiments, an example in which the first optical component mounting portion 9 is formed by three first holding plates 10, 11, 12 and one second holding plate 13 will be described. However, the first optical component mounting portion 9 according to the present invention is not limited to the case where it is formed by three first holding plates 10, 11, 12 and one second holding plate 13, and two first holding plates 10, 11 and 12 are used. Alternatively, it may have four first holding plates,
It may have one or more second holding plates.
【0074】[0074]
【発明の効果】以上のように、本発明による受発光ユニ
ットによれば、受光素子を除いた各種の光学部品を搭載
した第1光学部品装着部と、受光素子を貼着した2つ以
上の第1保持板及び受光素子を貼着しない2つ以上の第
2保持板の表面にフィルム状回路基板を貼着し、第1保
持板及び第2保持板の接合部が屈曲可能になるように構
成した第2光学部品装着部とを用い、第1光学部品装着
部と第2光学部品装着部とを貼着する際に、始めに光源
をフィルム状回路基板に設けたランドに導電接続し、次
に2つ以上の第1保持板に貼着した受光素子の受光面が
他の受光素子の受光面と異なる方向を向くように各第1
保持板を屈曲し、その後1つ以上の光ビーム分岐手段の
いずれかから分岐された光ビームが直接または1つ以上
の光路変更手段のいずれかで屈曲されて対応する受光素
子に入射するように相互配置し、その状態で第1光学部
品装着部に第2光学部品装着部の第1保持板及び第2保
持板を貼着するようにしたので、複数の受光素子を、複
数の異なる配置面における各受光素子に最も適した位置
に配置することができ、使用される受光素子の数が増し
ても、受発光ユニットの厚さを厚くすることなく、それ
らの受光素子を適宜好ましい状態に配置できるもので、
受発光ユニットにおける構成部品の一体化の度合いが高
く、各受光素子の貼着や導電接続による効率の低下を防
ぎ、しかも、受光素子からの出力信号の電気的特性を光
ピックアップ装置を組立てたものと同じ状態での把握が
可能になるという効果がある。As described above, according to the light emitting and receiving unit of the present invention, the first optical component mounting portion on which various optical components except the light receiving element are mounted, and the two or more light receiving elements are attached. A film-shaped circuit board is attached to the surfaces of two or more second holding plates to which the first holding plate and the light-receiving element are not attached, so that the joint between the first holding plate and the second holding plate can be bent. When the first optical component mounting portion and the second optical component mounting portion are attached using the configured second optical component mounting portion, first, the light source is conductively connected to the land provided on the film-shaped circuit board, Next, each of the first light-receiving elements attached to the two or more first holding plates is arranged so that the light-receiving surface of each light-receiving element faces a different direction from the light-receiving surface of another light-receiving element.
The holding plate is bent, and then the light beam branched from any one of the one or more light beam branching means is bent directly or one of the one or more optical path changing means to enter the corresponding light receiving element. Since the first holding plate and the second holding plate of the second optical component mounting portion are attached to the first optical component mounting portion in such a state that they are mutually arranged, a plurality of light receiving elements are arranged on a plurality of different arrangement surfaces Can be arranged at the most suitable position for each light receiving element, and even if the number of light receiving elements used increases, those light receiving elements are appropriately arranged without increasing the thickness of the light receiving and emitting unit. You can,
A high degree of integration of components in the light receiving and emitting unit, preventing deterioration of efficiency due to sticking of each light receiving element and conductive connection, and assembling the optical characteristics of the output signal from the light receiving element in an optical pickup device. There is an effect that it becomes possible to grasp in the same state as.
【0075】また、本発明による受発光ユニットの製造
方法によれば、受発光ユニットを構成する光学部品の配
置状態のバラツキに基づく各受光素子への光ビームの入
射位置の変動の影響を、受光素子の位置調整時や第1光
学部品装着部の作成時に排除することができ、整形プリ
ズムを受発光ユニットに一体化する場合のように受光素
子への入射光ビーム形状が変化する等の光ビームの入射
状態変化を事前に反映した受発光ユニットを製造するこ
とができるという効果がある。Further, according to the method of manufacturing the light emitting / receiving unit of the present invention, the influence of the fluctuation of the incident position of the light beam on each light receiving element due to the variation in the arrangement state of the optical components constituting the light receiving / emitting unit is received. Light beam that can be eliminated when adjusting the position of the element or when creating the first optical component mounting part, and changes the shape of the incident light beam to the light receiving element as in the case where the shaping prism is integrated with the light receiving and emitting unit. There is an effect that it is possible to manufacture a light emitting / receiving unit in which the change of the incident state of is reflected in advance.
【図1】本発明による受発光ユニットの第1の実施の形
態に係わり、第1光学部品装着部の要部構成を示す斜視
図である。FIG. 1 is a perspective view showing a main part configuration of a first optical component mounting portion according to a first embodiment of a light emitting / receiving unit according to the present invention.
【図2】本発明による受発光ユニットの第1の実施の形
態に係わり、第2光学部品装着部の要部構成を示す斜視
図である。FIG. 2 is a perspective view showing a main part configuration of a second optical component mounting portion according to the first embodiment of the light emitting and receiving unit according to the present invention.
【図3】第1光学部品装着部と第2光学部品装着部とを
貼着して受発光ユニットを形成する際の製造過程の初期
状態を示す斜視図である。FIG. 3 is a perspective view showing an initial state of a manufacturing process when the first optical component mounting portion and the second optical component mounting portion are attached to each other to form a light emitting / receiving unit.
【図4】第1光学部品装着部と第2光学部品装着部とを
貼着して受発光ユニットを形成する際の製造過程の終了
直前の状態を示す斜視図である。FIG. 4 is a perspective view showing a state immediately before the end of the manufacturing process when the first optical component mounting portion and the second optical component mounting portion are attached to each other to form a light emitting / receiving unit.
【図5】本発明による受発光ユニットの第2の実施の形
態に係わり、第1光学部品装着部の要部構成を示す斜視
図である。FIG. 5 is a perspective view showing a main part configuration of a first optical component mounting portion according to the second embodiment of the light emitting and receiving unit according to the present invention.
【図6】本発明による受発光ユニットの第3の実施の形
態に係わり、第1光学部品装着部の要部構成を示す斜視
図である。FIG. 6 is a perspective view showing a main part configuration of a first optical component mounting portion according to a third embodiment of a light emitting / receiving unit according to the present invention.
【図7】本発明による受発光ユニットの第4の実施の形
態に係わり、同受発光ユニットを用いた光ピックアップ
装置の要部構成を示す斜視図である。FIG. 7 is a perspective view showing a main part configuration of an optical pickup device using the light emitting / receiving unit according to a fourth embodiment of the present invention.
【図8】既知の第1構成例に係わる光磁気ピックアップ
装置を示す側面図である。FIG. 8 is a side view showing a magneto-optical pickup device according to a known first configuration example.
【図9】既知の第2構成例に係わる光ピックアップ装置
及びそれを備えた光学記録媒体駆動装置における投受光
ユニットを示す構成図である。FIG. 9 is a configuration diagram showing an optical pickup device according to a second known configuration example and a light emitting / receiving unit in an optical recording medium driving device including the same.
1 第1光学部品装着部 1a 凹部 2 光源 3 光ビームスプリッタ(光ビーム分岐手段) 4 光ビーム回折素子 5、23 表面反射型45度ミラー(光路変更手段) 6 第1光ビーム出射口 7 第2光ビーム出射口 8 第3光ビーム出射口 9 第2光学部品装着部 10、11、12 第1保持板 10a、11a、12a 受光素子 13 第2保持板 14 フィルム状回路基板 15、16、17、18 ランド群 19 円筒状凸部 20 円筒状凹部 21 コリメータレンズ 22 整形プリズム 24 対物レンズ 25 駆動手段 26 突出面 27 光ディスク 1 First optical component mounting part 1a recess 2 light sources 3 Optical beam splitter (optical beam splitting means) 4 Light beam diffraction element 5,23 Surface reflection type 45 degree mirror (optical path changing means) 6 First light beam exit 7 Second light beam exit 8 Third light beam exit 9 Second optical component mounting part 10, 11, 12 1st holding plate 10a, 11a, 12a Light receiving element 13 Second holding plate 14 Film circuit board 15, 16, 17, 18 Lands 19 Cylindrical protrusion 20 Cylindrical recess 21 Collimator lens 22 Shaped prism 24 Objective lens 25 Drive means 26 Projection surface 27 optical disc
フロントページの続き Fターム(参考) 5D117 AA02 CC07 HH12 5D119 AA02 AA20 AA38 BA01 FA33 FA35 FA37 JC05 JC07 KA41 KA42 LB01 NA02 PA02 5D789 AA02 AA20 AA38 BA01 FA33 FA35 FA37 JC05 JC07 KA41 KA42 LB01 NA02 PA02 Continued front page F-term (reference) 5D117 AA02 CC07 HH12 5D119 AA02 AA20 AA38 BA01 FA33 FA35 FA37 JC05 JC07 KA41 KA42 LB01 NA02 PA02 5D789 AA02 AA20 AA38 BA01 FA33 FA35 FA37 JC05 JC07 KA41 KA42 LB01 NA02 PA02
Claims (9)
前記光ビームを分岐する1つ以上の光ビーム分岐手段、
前記光ビームの光路を屈曲変更する1つ以上の光路変更
手段をそれぞれ凹部内に装着した第1光学部品装着部
と、受光素子が貼着された2つ以上の第1保持板及び受
光素子が貼着されない1つ以上の第2保持板の表面に、
前記第1保持板及び前記第2保持板の接合部が屈曲可能
にフィルム状回路基板を貼着した第2光学部品装着部と
を備え、前記光源を前記フィルム状回路基板に設けたラ
ンドに導電接続し、前記2つ以上の第1保持板に貼着し
た受光素子の受光面が他の受光素子の受光面と異なる方
向を向くように前記各第1保持板を屈曲し、前記1つ以
上の光ビーム分岐手段のいずれかから分岐された光ビー
ムが直接または前記1つ以上の光路変更手段のいずれか
で屈曲されて対応する受光素子に入射するように相互配
置した状態にし、前記第1光学部品装着部に前記第2光
学部品装着部の前記第1保持板及び前記第2保持板を貼
着するように構成したことを特徴とする受発光ユニッ
ト。1. A light source for emitting at least a light beam,
One or more light beam splitting means for splitting the light beam;
A first optical component mounting portion in which one or more optical path changing means for changing the optical path of the light beam is mounted in the recess respectively, and two or more first holding plates and light receiving elements to which the light receiving elements are attached are provided. On the surface of one or more second holding plates that are not attached,
And a second optical component mounting portion in which a film-shaped circuit board is attached so that the joint portion of the first holding plate and the second holding plate is bendable, and the light source is electrically conductive to a land provided on the film-shaped circuit board. The respective first holding plates are bent so that the light-receiving surfaces of the light-receiving elements that are connected and attached to the two or more first holding plates face different directions from the light-receiving surfaces of other light-receiving elements, and the one or more The light beams branched from any one of the light beam branching means are directly arranged or bent by any one of the one or more optical path changing means so as to be incident on the corresponding light receiving element. A light emitting / receiving unit, characterized in that the first holding plate and the second holding plate of the second optical component mounting portion are attached to the optical component mounting portion.
1保持板は、全受光素子の受光面が同一方向を向いた状
態で前記フィルム状回路基板が貼着されることを特徴と
する請求項1に記載の受発光ユニット。2. The film-shaped circuit board is attached to the two or more first holding plates of the second optical component mounting portion with the light-receiving surfaces of all the light-receiving elements facing in the same direction. The light emitting and receiving unit according to claim 1.
放射した光ビームを前記第1光学部品装着部から光ビー
ムを導出する2つ以上の開口部を有し、前記開口部の中
の少なくとも1つは前記光ビームを平行光にする手段に
より封止されるようにしたことを特徴とする請求項1ま
たは2に記載の受発光ユニット。3. The first optical component mounting portion has two or more openings for guiding the light beam emitted by the light source from the first optical component mounting portion, and the inside of the opening portion 3. The light emitting / receiving unit according to claim 1 or 2, wherein at least one of the light emitting / receiving units is sealed by a means for collimating the light beam.
放射した光ビームを前記第1光学部品装着部から導出す
る2つ以上の開口部を有し、前記開口部の中の少なくと
も1つは前記光ビームを平行光にする手段及び前記光ビ
ームを整形する手段により封止されるようにしたことを
特徴とする請求項1または2に記載の受発光ユニット。4. The first optical component mounting portion has two or more openings through which the light beam emitted by the light source is led out from the first optical component mounting portion, and at least one of the openings. 3. The light emitting / receiving unit according to claim 1, wherein the light emitting / receiving unit is sealed by means for collimating the light beam and means for shaping the light beam.
学部品装着部は、それらの貼着面のいずれか一方に円筒
状位置決め凹部、他方に前記凹部よりも小径の円筒状凸
部が形成されていることを特徴とする請求項1乃至4の
いずれかに記載の受発光ユニット。5. The first optical component mounting portion and the second optical component mounting portion each have a cylindrical positioning recess on one of their adhering surfaces and a cylindrical protrusion having a smaller diameter than the recess on the other. The light emitting and receiving unit according to claim 1, wherein the light receiving and emitting unit is formed.
装着面に平行した延長面と、前記光源から出射した光ビ
ームを光学的記録媒体上に集光させる集光手段と、前記
集光手段を前記光学的記録媒体の径方向に移行させる駆
動手段とを有し、前記駆動手段は、前記延長面を基準面
として前記第1光学部品装着部に組み立てられることを
特徴とする請求項1乃至5のいずれかに記載の受発光ユ
ニットを用いた光ピックアップ装置。6. The first optical component mounting portion has an extension surface parallel to the mounting surface of the light source, a condensing unit that condenses a light beam emitted from the light source onto an optical recording medium, and the concentrator. Drive means for moving the optical means in the radial direction of the optical recording medium, wherein the drive means is assembled to the first optical component mounting portion with the extension surface as a reference surface. An optical pickup device using the light emitting / receiving unit according to any one of 1 to 5.
光ユニットの製造方法であって、第1光学部品装着部の
凹部内に、光源、1つ以上の光ビーム分岐手段、1つ以
上の光路変更手段を装着する工程と、第2光学部品装着
部の各第1保持板にそれぞれ貼着した受光素子の位置と
それらの受光素子への光ビームの投射位置とを相互調整
しながら前記第1光学部品装着部を第1保持板または第
2保持板の中の1つに貼着する工程とを経て受発光ユニ
ットが製造されることを特徴とする受発光ユニットの製
造方法。7. The method of manufacturing a light emitting / receiving unit according to claim 1, wherein the light source, one or more light beam branching means, and one light beam are provided in the recess of the first optical component mounting portion. While mutually adjusting the step of mounting the above-mentioned optical path changing means, the positions of the light receiving elements attached to the respective first holding plates of the second optical component mounting portion, and the projection positions of the light beams onto these light receiving elements. A method of manufacturing a light emitting / receiving unit, comprising the steps of: attaching the first optical component mounting portion to one of the first holding plate or the second holding plate, and manufacturing the light receiving / emitting unit.
方法において、前記第1光学部品装着部を前記第2光学
部品装着部に貼着する際に、前記第1光学部品装着部を
前記第2光学部品装着部に仮貼着する工程と、前記第2
光学部品装着部のフィルム状回路基板の一部を前記第1
光学部品装着部の対応部分に貼着する工程と、光源及び
全受光素子をフィルム状回路基板に設けたランドに連続
的に導電接続する工程とを経て、前記第1光学部品装着
部を前記第2光学部品装着部に完全貼着する工程が実行
されることを特徴とする受発光ユニットの製造方法。8. The method for manufacturing a light emitting and receiving unit according to claim 7, wherein when the first optical component mounting portion is attached to the second optical component mounting portion, the first optical component mounting portion is the The step of temporarily adhering to the second optical component mounting portion,
A part of the film-shaped circuit board of the optical component mounting portion is attached to the first
The first optical component mounting portion is connected to the corresponding part of the optical component mounting portion, and the light source and all the light receiving elements are continuously conductively connected to lands provided on the film-like circuit board. 2. A method of manufacturing a light emitting / receiving unit, wherein a step of completely adhering to the optical component mounting portion is executed.
方法において、前記第1光学部品装着部を前記第2光学
部品装着部に貼着する際に、前記第1光学部品装着部を
前記第2光学部品装着部に仮貼着する工程と、前記第2
光学部品装着部のフィルム状回路基板の一部を前記第1
光学部品装着部の対応部分に貼着する工程と、光源を前
記フィルム状回路基板に設けたランドに導電接続する工
程と、前記光源を駆動する工程と、前記光源から放射さ
れる光ビームを外部の光反射体で反射させ、そのときの
反射光ビームの集光位置を観測しながら、対応する光ビ
ーム分岐手段の位置を調整固定する工程とを経て、前記
第1光学部品装着部を前記第2光学部品装着部に完全貼
着する工程が実行されることを特徴とする受発光ユニッ
トの製造方法。9. The method for manufacturing a light emitting and receiving unit according to claim 7, wherein when the first optical component mounting portion is attached to the second optical component mounting portion, the first optical component mounting portion is the The step of temporarily adhering to the second optical component mounting portion,
A part of the film-shaped circuit board of the optical component mounting portion is attached to the first
A step of adhering to a corresponding part of the optical component mounting part, a step of electrically connecting the light source to a land provided on the film-like circuit board, a step of driving the light source, And then fixing and fixing the position of the corresponding light beam branching means while observing the converging position of the reflected light beam at that time. 2. A method of manufacturing a light emitting / receiving unit, wherein a step of completely adhering to the optical component mounting portion is executed.
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JP2002124633A JP3981293B2 (en) | 2002-04-25 | 2002-04-25 | Light emitting / receiving unit and manufacturing method thereof |
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Application Number | Priority Date | Filing Date | Title |
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JP2002124633A JP3981293B2 (en) | 2002-04-25 | 2002-04-25 | Light emitting / receiving unit and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
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JP2003317307A true JP2003317307A (en) | 2003-11-07 |
JP3981293B2 JP3981293B2 (en) | 2007-09-26 |
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JP (1) | JP3981293B2 (en) |
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