JP2003295422A - Photosensitive printing plate precursor - Google Patents
Photosensitive printing plate precursorInfo
- Publication number
- JP2003295422A JP2003295422A JP2002099616A JP2002099616A JP2003295422A JP 2003295422 A JP2003295422 A JP 2003295422A JP 2002099616 A JP2002099616 A JP 2002099616A JP 2002099616 A JP2002099616 A JP 2002099616A JP 2003295422 A JP2003295422 A JP 2003295422A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- coating layer
- photosensitive resin
- layer
- photosensitive printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002243 precursor Substances 0.000 title abstract 4
- 239000011247 coating layer Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000013039 cover film Substances 0.000 claims abstract description 10
- 238000002834 transmittance Methods 0.000 claims abstract description 7
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 239000006096 absorbing agent Substances 0.000 claims description 10
- 239000002250 absorbent Substances 0.000 abstract 1
- 230000002745 absorbent Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- -1 amide compound Chemical class 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 9
- 239000004952 Polyamide Substances 0.000 description 8
- 229920002647 polyamide Polymers 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920001059 synthetic polymer Polymers 0.000 description 3
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- GRDGBWVSVMLKBV-UHFFFAOYSA-N (2-amino-5-nitrophenyl)-(2-chlorophenyl)methanone Chemical compound NC1=CC=C([N+]([O-])=O)C=C1C(=O)C1=CC=CC=C1Cl GRDGBWVSVMLKBV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- ZWPKWMGPJWNIKP-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine;hexanedioic acid Chemical compound OC(=O)CCCCC(O)=O.NCCCN1CCN(CCCN)CC1 ZWPKWMGPJWNIKP-UHFFFAOYSA-N 0.000 description 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- SNIOPGDIGTZGOP-UHFFFAOYSA-N Nitroglycerin Chemical compound [O-][N+](=O)OCC(O[N+]([O-])=O)CO[N+]([O-])=O SNIOPGDIGTZGOP-UHFFFAOYSA-N 0.000 description 1
- 239000000006 Nitroglycerin Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- ASNOTQBHLYJNQZ-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine;hexanedioic acid Chemical compound NCC1CCCC(CN)C1.OC(=O)CCCCC(O)=O ASNOTQBHLYJNQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229920013820 alkyl cellulose Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920003174 cellulose-based polymer Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229960003711 glyceryl trinitrate Drugs 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229920013821 hydroxy alkyl cellulose Polymers 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- FGTVYMTUTYLLQR-UHFFFAOYSA-N n-ethyl-1-phenylmethanesulfonamide Chemical compound CCNS(=O)(=O)CC1=CC=CC=C1 FGTVYMTUTYLLQR-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は印刷用レリーフ版を
製造するために使用される感光性印刷原版に関する。FIELD OF THE INVENTION The present invention relates to a photosensitive printing original plate used for producing a relief plate for printing.
【0002】[0002]
【従来の技術】通常、印刷用レリーフ版に用いる感光性
印刷原版は、支持体層、感光性樹脂組成物層、被覆層、
カバーフィルムからなり、使用時はカバーフィルムを除
去し用いられる。2. Description of the Related Art Usually, a photosensitive printing original plate used for a relief plate for printing has a support layer, a photosensitive resin composition layer, a coating layer,
It consists of a cover film, and is used by removing the cover film at the time of use.
【0003】カバーフィルムを除去した感光性印刷原版
に透明な画像部を有するネガフィルム(またはポジフィ
ルム)を通して活性光線を照射し、露光部の感光性樹脂
層を硬化させた後、非露光部の感光性樹脂層を適当な溶
剤で溶解除去することにより、印刷用レリーフ版を作成
することは広く知られている。The photosensitive printing original plate from which the cover film has been removed is irradiated with an actinic ray through a negative film (or a positive film) having a transparent image area to cure the photosensitive resin layer in the exposed area, and then in the unexposed area. It is widely known that a relief plate for printing is prepared by dissolving and removing the photosensitive resin layer with an appropriate solvent.
【0004】最近、印刷用レリーフ版に用いられる感光
性印刷原版に対する要求は、より微細なパターンを再現
する方向へ進んでおり、白抜きパターンの線幅も30μ
m程度微細な印刷用レリーフが求められている。しかし
この要求に対して感光性樹脂組成物を用いた印刷用レリ
ーフ版材では充分に対応できず、製版及び印刷で微細な
パターンを再現できる感光性印刷原版を得ることができ
ていなかった。Recently, a demand for a photosensitive printing original plate used as a relief plate for printing has been progressing toward the reproduction of finer patterns, and the line width of the blank pattern is 30 μm.
There is a demand for printing reliefs as fine as m. However, a relief printing plate material for printing using a photosensitive resin composition cannot sufficiently meet this demand, and a photosensitive printing original plate capable of reproducing a fine pattern in plate making and printing cannot be obtained.
【0005】[0005]
【発明が解決しようとする課題】本発明は、上記の問題
を解決しようとするものであり、製版時と印刷時におけ
る微細なパターンの再現性に優れた感光性印刷原版を提
供することを課題とするものである。SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and it is an object of the present invention to provide a photosensitive printing original plate excellent in reproducibility of a fine pattern during plate making and printing. It is what
【0006】[0006]
【課題を解決するための手段】本発明者らは、前記課題
を解決するために、鋭意検討した結果、感光性印刷原版
の被覆層が微細なパターンの製版及び印刷における再現
性に関与していることを見出し、遂に、本発明を完成す
るに到った。すなわち本発明は、少なくとも支持体、
感光性樹脂層、被覆層およびカバーフィルムを有する感
光性印刷原版であって、前記被覆層が、感光性樹脂層の
活性光線領域に吸収をもつ平均分子量1,000以上の
光吸収剤を含有することを特徴とする感光性印刷原版。
被覆層の光透過率が波長360nmの光に対し、50%
〜99%である前記記載の感光性印刷原版である。Means for Solving the Problems The inventors of the present invention have made extensive studies in order to solve the above-mentioned problems, and as a result, have been involved in the reproducibility in plate making and printing of a fine pattern in the coating layer of the photosensitive printing original plate. That is, the present invention was finally completed. That is, the present invention is at least a support,
A photosensitive printing original plate having a photosensitive resin layer, a coating layer and a cover film, wherein the coating layer contains a light absorber having an average molecular weight of 1,000 or more and having an absorption in an actinic ray region of the photosensitive resin layer. A photosensitive printing original plate characterized by the above.
The light transmittance of the coating layer is 50% for light with a wavelength of 360 nm.
It is the said photosensitive printing original plate which is -99%.
【0007】[0007]
【発明の実施の形態】本発明に特徴的な被覆層は、感光
性樹層に対するネガの密着を防ぐために設けられている
層であって、スリップコート層、剥離層、粘着防止層等
と称されることもある。構成材料としては、ポリアミ
ド、ポリビニルアルコールとその誘導体、セルローズ系
ポリマー等が挙げられる。これらは、何れか1種を単独
で使用しても、2種以上を併用してもよい。また、一般
的な被覆層には上記成分の他に、シリカなどの無機微粒
子、ポリスチレンやアクリル系モノマーを三次元内部架
橋して得られる有機微粒子、界面活性剤、多価アルコー
ルなどが必要により配合されている。BEST MODE FOR CARRYING OUT THE INVENTION The coating layer characteristic of the present invention is a layer provided to prevent the adhesion of a negative to a photosensitive resin layer and is referred to as a slip coat layer, a peeling layer, an anti-adhesion layer or the like. It may be done. Examples of constituent materials include polyamide, polyvinyl alcohol and its derivatives, and cellulosic polymers. Any of these may be used alone or in combination of two or more. In addition to the above components, a general coating layer contains inorganic fine particles such as silica, organic fine particles obtained by three-dimensionally internally crosslinking polystyrene or an acrylic monomer, a surfactant, and a polyhydric alcohol, if necessary. Has been done.
【0008】本発明で用いる被覆層に含有させる光吸収
剤は分子量が1,000以上、好ましくは5,000以
上、さらに好ましくは10,000以上である。分子量
が1,000未満では光吸収剤が感光性樹脂層に移行
し、被覆層の活性光線吸収性を低下させるため好ましく
ない。分子量1,000以上の光吸収剤としては、被覆
層構成物に相溶、分散する物がよい。たとえば、アクリ
ル酸エステル、スチレン等のラジカル重合可能な化合物
とベンゾフェノン骨格、或いはベンゾトリアゾール骨格
を持ち、且つ、ラジカル重合可能な紫外線吸収剤を乳化
重合によって共重合させた微粒子状光吸収剤。あるいは
ポリビニルアルコール、セルローズ系ポリマー等にエポ
キシ化合物を介しベンゾフェノン系またはベンゾトリア
ゾール系化合物をグラフト付加させた光吸収剤。または
被覆層構成物に相溶で分子末端に活性水素を持つ分子量
1,000以上のオリゴマーにジイソシアネートを介し
ベンゾフェノン系、あるいはベンゾトリアゾール系の光
吸収剤等が挙げられるが、とくにこれらに限定されるも
のではない。The light absorber contained in the coating layer used in the present invention has a molecular weight of 1,000 or more, preferably 5,000 or more, and more preferably 10,000 or more. When the molecular weight is less than 1,000, the light absorber migrates to the photosensitive resin layer, which reduces the actinic ray absorbability of the coating layer, which is not preferable. As the light absorber having a molecular weight of 1,000 or more, a substance that is compatible with and dispersed in the coating layer constituent is preferable. For example, a fine particle light absorber having a radical-polymerizable compound such as acrylic acid ester and styrene and a benzophenone skeleton or a benzotriazole skeleton, and a radical-polymerizable ultraviolet absorber copolymerized by emulsion polymerization. Alternatively, a light absorber obtained by graft-adding a benzophenone-based or benzotriazole-based compound via an epoxy compound to polyvinyl alcohol, a cellulose-based polymer or the like. Alternatively, a benzophenone-based or benzotriazole-based light absorber which is compatible with the coating layer composition and has an active hydrogen at the molecular end and having a molecular weight of 1,000 or more via a diisocyanate may be mentioned, but is not limited thereto. Not a thing.
【0009】本発明の被覆層の活性光線透過率は波長3
60nmの光に対し、50%〜99%、好ましくは70
〜95%、さらに好ましくは80〜90%である。50
%未満だと感光性樹脂組成物層に届く活性光線が少なす
ぎレリーフの再現性が低下し、また、99%を超えると
活性光線が通り過ぎて微細パターンが再現できないため
好ましくない。The actinic ray transmittance of the coating layer of the present invention is 3
50% to 99%, preferably 70 for 60 nm light
˜95%, more preferably 80-90%. Fifty
If it is less than 100%, the amount of actinic rays reaching the photosensitive resin composition layer is too small and the reproducibility of the relief is lowered, and if it exceeds 99%, the actinic rays pass by and the fine pattern cannot be reproduced, which is not preferable.
【0010】被覆層の厚みは0.1〜10μm、好まし
くは0.1〜2μm、特に好ましくは0.1〜1μmで
ある。厚みが0.1μmより薄いとネガとの粘着を生じ
てしまい、また10μmを超えるとレリーフの解像性が
低下するため好ましくない。The thickness of the coating layer is 0.1 to 10 μm, preferably 0.1 to 2 μm, particularly preferably 0.1 to 1 μm. If the thickness is less than 0.1 μm, adhesion with a negative will occur, and if it exceeds 10 μm, the resolution of the relief will decrease, which is not preferable.
【0011】本発明における感光性樹脂層は、公知の可
溶性合成高分子化合物、光重合性不飽和化合物(以下、
架橋剤ともいう)及び光重合開始剤を少なくとも含む組
成物の層である。さらに添加剤、例えば可塑剤、熱重合
防止剤剤、染料、顔料、紫外線吸収剤、香料または酸化
防止剤を含んでもよい。The photosensitive resin layer in the present invention comprises a known soluble synthetic polymer compound, a photopolymerizable unsaturated compound (hereinafter,
(Also referred to as a cross-linking agent) and a photopolymerization initiator. It may also contain additives such as plasticizers, thermal polymerization inhibitors, dyes, pigments, UV absorbers, perfumes or antioxidants.
【0012】本発明において、可溶性合成高分子化合物
としては公知の可溶性合成高分子化合物を使用できる。
例えばポリエーテルアミド(例えば特開昭55−79437
号公報等)、ポリエーテルエステルアミド(例えば特開
昭58−113537号公報等)、三級窒素含有ポリア
ミド(例えば特開昭50−76055公報等)、アンモ
ニウム塩型三級窒素原子含有ポリアミド(例えば特開昭
53−36555公報等)、アミド結合を1つ以上有す
るアミド化合物と有機ジイソシアネート化合物の付加重
合体(例えば特開昭58−140737号公報等)、アミ
ド結合を有しないジアミンと有機ジイソシアネート化合
物の付加重合体(例えば特開平4-97154号公報等)などが
挙げられ、そのなかでも三級窒素原子含有ポリアミドお
よびアンモニウム塩型三級窒素原子含有ポリアミドが好
ましい。In the present invention, known soluble synthetic polymer compounds can be used as the soluble synthetic polymer compound.
For example, polyether amide (for example, JP-A-55-79437)
Gazette, etc.), polyether ester amide (eg JP-A-58-113537 etc.), tertiary nitrogen-containing polyamide (eg JP-A-50-76055 etc.), ammonium salt type tertiary nitrogen atom-containing polyamide (eg JP-A-53-36555), addition polymers of an amide compound having one or more amide bonds and an organic diisocyanate compound (for example, JP-A-58-140737), diamines having no amide bond and organic diisocyanate compounds. Examples thereof include addition polymers (for example, JP-A-4-97154), and among them, tertiary nitrogen atom-containing polyamides and ammonium salt type tertiary nitrogen atom-containing polyamides are preferable.
【0013】また、好適に用いられる光重合性不飽和化
合物としては、多価アルコールのポリグリシジルエーテ
ルとメタアクリル酸およびアクリル酸との開環付加反応
生成物であり、前記多価アルコールとして、ジペンタエ
リスリトール、ペンタエリスリトール、トリメチロール
プロパン、グリセリン、エチレングリコール、ジエチレ
ングリコール、トリエチレングリコール、フタル酸のエ
チレンオキサイド付加物などが挙げられ、そのなかでも
トリメチロールプロパンが好ましい。Further, the photopolymerizable unsaturated compound preferably used is a ring-opening addition reaction product of polyglycidyl ether of polyhydric alcohol with methacrylic acid and acrylic acid. Pentaerythritol, pentaerythritol, trimethylolpropane, glycerin, ethylene glycol, diethylene glycol, triethylene glycol, an ethylene oxide adduct of phthalic acid, and the like can be mentioned, and among them, trimethylolpropane is preferable.
【0014】光開始剤の例としては、ベンゾフェノン
類、ベンゾイン類、アセトフェノン類、ベンジル類、ベ
ンゾインアルキルエーテル類、ベンジルアルキルケター
ル類、アントラキノン類、チオキサントン類などが挙げ
られる。具体的には、ベンゾフェノン、クロロベンゾフ
ェノン、ベンゾイン、アセトフェノン、ベンジル、ベン
ゾインメチルエーテル、ベンゾインエチルエーテル、ベ
ンゾインイソプロピルエーテル、ベンゾインイソブチル
エーテル、ベンジルジメチルケタール、ベンジルジエチ
ルケタール、ベンジルジイソプロピルケタール、アント
ラキノン、2−エチルアントラキノン、2―メチルアン
トラキノン、2−アリルアントラキノン、2−クロロア
ントラキノン、チオキサントン、2−クロロチオキサン
トンなどが挙げられる。Examples of photoinitiators include benzophenones, benzoins, acetophenones, benzyls, benzoin alkyl ethers, benzyl alkyl ketals, anthraquinones, thioxanthones and the like. Specifically, benzophenone, chlorobenzophenone, benzoin, acetophenone, benzyl, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, benzyl diethyl ketal, benzyl diisopropyl ketal, anthraquinone, 2-ethyl anthraquinone Examples thereof include 2-methylanthraquinone, 2-allylanthraquinone, 2-chloroanthraquinone, thioxanthone, and 2-chlorothioxanthone.
【0015】本発明において、カバーフィルムは原版の
貯蔵および取り扱いの間に感光性樹脂層を保護するため
に設けられるものであり、活性光線を照射する前に除去
(剥離)される。カバーフィルムの構成材料としては、
ポリアミド;ポリビニルアルコール;エチレンとビニル
アセテートとのコポリマー;両性インターポリマー;ヒ
ドロキシアルキルセルローズ、セルローズアセテートの
ようなセルローズ系ポリマー;ポリブチラール;環状ゴ
ム等が好適である。ここで、両性インターポリマーは米
国特許第4,293,635号に記載されているもので
ある。当該材料はいずれか1種を単独で使用しても、2
種以上を併用してもよい。また、ニトロセルローズとニ
トログリセリンのような自己酸化性化合物;アルキルセ
ルローズ(例、エチルセルローズ)、ポリアクリル酸お
よびそのアルカリ金属塩のような非自己酸化性ポリマ
ー;ポリアセタール;ポリイミド;ポリカーボネート;
ポリエステル;ポリエチレン、ポリブチレンのようなポ
リアルキレン;ポリフェニレンエーテル;ポリエチレン
オキサイド;ポリラクトンおよびこれらの組合せ等も使
用できる。カバーフィルムの厚みは10〜300μmが
好ましく、特に好ましくは10〜200μmである。In the present invention, the cover film is provided to protect the photosensitive resin layer during storage and handling of the original plate and is removed (peeled) before irradiation with actinic rays. As the constituent material of the cover film,
Polyamide; polyvinyl alcohol; copolymers of ethylene and vinyl acetate; amphoteric interpolymers; cellulosic polymers such as hydroxyalkyl cellulose and cellulose acetate; polybutyral; cyclic rubber and the like are suitable. Here, the amphoteric interpolymer is that described in U.S. Pat. No. 4,293,635. Even if any one of the materials is used alone, 2
You may use together 1 or more types. Also, auto-oxidizing compounds such as nitrocellulose and nitroglycerin; non-self-oxidizing polymers such as alkyl cellulose (eg, ethyl cellulose), polyacrylic acid and its alkali metal salts; polyacetals; polyimides; polycarbonates;
Polyesters; polyalkylenes such as polyethylene and polybutylene; polyphenylene ethers; polyethylene oxides; polylactones and combinations thereof can also be used. The thickness of the cover film is preferably 10 to 300 μm, particularly preferably 10 to 200 μm.
【0016】本発明に用いる支持体としては、ポリエス
テルフィルムなどのプラスチックフィルム、鉄、ステン
レス、アルミニウムなどの金属板、金属蒸着したフィル
ムなどが挙げられる。支持体の厚みは用途に応じて適宜
に選ぶことができる。また、必要により支持体と感光性
樹脂層との接着を向上させるために、この種の目的で従
来から使用されている公知の接着剤を表面に設けても良
い。Examples of the support used in the present invention include plastic films such as polyester films, metal plates such as iron, stainless steel and aluminum, and metal vapor deposited films. The thickness of the support can be appropriately selected depending on the application. Further, if necessary, in order to improve the adhesion between the support and the photosensitive resin layer, a known adhesive conventionally used for this type of purpose may be provided on the surface.
【0017】本発明の感光性印刷原版を作製する方法は
特に限定されないが、一般的には、支持体上に塗布、ス
プレーコーティング等で感光性樹脂層を形成するか、若
しくは、市販の感光性印刷版から保護フィルムを剥がす
ことで一方の積層体を作成し、さらにこれとは別に、基
材フィルム(カバーフィルム)に塗布、スプレーコーテ
ィング等で被覆層を形成後、このようにして得られた2
つの積層体をヒートプレス機等を用いてラミネートする
ことにより作製する。ラミネート条件は、温度を室温〜
150℃、好ましくは50〜120℃とし、圧力を20
〜200kg重/cm2、好ましくは50〜150kg
重/cm2とするのがよい。本発明の感光性樹脂たとえ
ば熱プレス、注型、溶融押出し、溶液キャストなど公知
の任意の方式により、所望の厚さのシート状物とするこ
とが出来る。The method for producing the photosensitive printing original plate of the present invention is not particularly limited, but generally, a photosensitive resin layer is formed on a support by coating, spray coating or the like, or a commercially available photosensitive resin is used. One of the laminates was prepared by peeling the protective film from the printing plate, and separately from this, a base film (cover film) was coated, and a coating layer was formed by spray coating or the like. Two
It is manufactured by laminating two laminated bodies using a heat press machine or the like. Lamination conditions include temperature from room temperature to
150 degreeC, Preferably it is 50-120 degreeC, and pressure is 20.
~ 200 kg weight / cm 2 , preferably 50-150 kg
Weight / cm 2 is recommended. The photosensitive resin of the present invention can be formed into a sheet having a desired thickness by any known method such as hot pressing, casting, melt extrusion, and solution casting.
【0018】本発明の感光性樹脂原版においては、その
感光層上に透明画像部を有するネガフィルムまたはポジ
フィルムを密着して重ね合せ、その上方から活性光線を
照射して露光を行うと、露光部が硬化して不溶化する。
活性光線には通常300〜400nmの波長を中心とす
る高圧水銀灯、超高圧水銀灯、メタルハライドランプ、
キセノン灯、ケミカルランプ等の光源を用いることがで
きる。In the photosensitive resin original plate of the present invention, a negative film or a positive film having a transparent image portion is closely contacted and superposed on the photosensitive layer, and an actinic ray is irradiated from above to carry out exposure, The part hardens and becomes insoluble.
Actinic rays are usually high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps with a wavelength of 300 to 400 nm,
A light source such as a xenon lamp or a chemical lamp can be used.
【0019】露光後、適当な溶剤、好ましくは、水、特
に中性水を溶剤に用いて非露光部分を溶解除去すること
によって、短時間で速やかに現像がなされ、印刷版(レ
リーフ版)が得られる。現像方式としては、スプレー式
現像装置、ブラシ式現像装置等を用いるのが好ましい。After the exposure, a suitable solvent, preferably water, especially neutral water is used as a solvent to dissolve and remove the non-exposed portion, whereby rapid development is carried out in a short time and a printing plate (relief plate) is obtained. can get. As a developing system, it is preferable to use a spray developing device, a brush developing device, or the like.
【0020】次に本発明を実施例により具体的に説明す
るが、本発明はこれらの実施例に限定されるものではな
い。実施例中単に部とあるのは重量部を示す。Next, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. In the examples, "parts" means "parts by weight".
【0021】実施例1
ε−カプロラクタム55.0部、N,N’−ビス(γ−
アミノプロピル)ピペラジンアジペート40.0部、
1,3−ビスアミノメチルシクロヘキサンアジペート
7.5部および水100部を、反応器に入れ、充分な窒
素置換を行った後に密閉して徐々に加熱した。内圧が1
0kg/cm2に達した時点から、反応器内の水を徐々
に留出させて1時間で常圧に戻し、その後1.0時間常
圧で反応させた。最高重合温度は220℃であった。得
られた重合体は、融点140℃、比粘度2.00の透明
淡黄色のポリアミドを得た。Example 1 55.0 parts of ε-caprolactam, N, N'-bis (γ-
Aminopropyl) piperazine adipate 40.0 parts,
7.5 parts of 1,3-bisaminomethylcyclohexane adipate and 100 parts of water were put into a reactor, and after performing sufficient nitrogen substitution, the container was sealed and gradually heated. Internal pressure is 1
From the time when the pressure reached 0 kg / cm 2 , the water in the reactor was gradually distilled off, returned to normal pressure in 1 hour, and then reacted for 1.0 hour at normal pressure. The maximum polymerization temperature was 220 ° C. The polymer obtained was a transparent pale yellow polyamide having a melting point of 140 ° C. and a specific viscosity of 2.00.
【0022】得られたポリアミドを50.0部、N−エ
チルトルエンスルホン酸アミド5.0部、1,4−ナフ
トキノン0.03部、メタノール50.0部および水1
0部を、攪拌付き加熱解釜中で60℃、2時間混合して
ポリマーを完全に溶解してから、ビスフェノールAジグ
リシジルエステルのアクリル酸付加物40.6部、メタ
クリル酸2.9部、ハイドロキノンモノメチルエーテル
0.1部、亜硫酸アンモニウム0.3部、シュウ酸0.
1部およびベンジルジメチルケタール1.0部を添加し
て30分間溶解した。次いで、徐々に昇温してメタノー
ルと水を留出させて、釜内の温度が110℃となるまで
濃縮した。この段階で流動性のある粘稠な感光性樹脂を
得た。50.0 parts of the obtained polyamide, 5.0 parts of N-ethyltoluenesulfonic acid amide, 0.03 part of 1,4-naphthoquinone, 50.0 parts of methanol and 1 part of water.
0 parts were mixed at 60 ° C. for 2 hours in a heating disintegrator with stirring to completely dissolve the polymer, and then 40.6 parts of an acrylic acid adduct of bisphenol A diglycidyl ester, 2.9 parts of methacrylic acid, Hydroquinone monomethyl ether 0.1 part, ammonium sulfite 0.3 part, oxalic acid 0.
1 part and 1.0 part of benzyl dimethyl ketal were added and dissolved for 30 minutes. Next, the temperature was gradually raised to distill off methanol and water, and the mixture was concentrated until the temperature inside the kettle reached 110 ° C. At this stage, a viscous photosensitive resin having fluidity was obtained.
【0023】次に250μのポリエチレンテレフタレー
ト支持体上に接着層を20μm設けた全厚みが270μ
mのポリエステルフィルムを作製した。Next, an adhesive layer of 20 μm was formed on a 250 μm polyethylene terephthalate support to give a total thickness of 270 μm.
m polyester film was prepared.
【0024】接着層はポリエステルウレタン系接着材を
用い、接着層用組成物溶液は次のように調整した。東洋
紡績(株)製ポリエステル系樹脂「バイロンRV−20
0」80重量部をトルエン/メチルエチルケトン=80
/20(重量比)の混合溶剤1940重量部に80℃で
加熱溶解した。冷却後、イソシアヌレート型多価イソシ
アネートとしてヘキサメチレンジイソシアネートとトル
エンジイソシアネートを原料とする住友バイエルウレタ
ン(株)製のイソシアヌレート型多価イソシアネートの
「デスモジュールHL」20重量部、硬化触媒としてト
リエチレンジアミン0.06重量部を添加し、10分攪
拌した。A polyester urethane adhesive was used for the adhesive layer, and the composition solution for the adhesive layer was prepared as follows. Toyobo Co., Ltd. polyester resin "Byron RV-20"
0 "80 parts by weight of toluene / methyl ethyl ketone = 80
It was dissolved in 1940 parts by weight of a mixed solvent of / 20 (weight ratio) by heating at 80 ° C. After cooling, 20 parts by weight of "Desmodur HL" of isocyanurate-type polyisocyanate manufactured by Sumitomo Bayer Urethane Co., which uses hexamethylene diisocyanate and toluene diisocyanate as isocyanurate-type polyisocyanate as raw materials, and triethylenediamine 0 as a curing catalyst 0.06 part by weight was added and stirred for 10 minutes.
【0025】このようにして得られた接着層用組成物溶
液を膜厚みが20μm となるように厚さ250μのポリ
エチレンテレフタレートフィルム上に塗布して120℃
で3分間乾燥キュアーし、接着層を設けた支持体を得
た。この支持体の接着層上に、上記の感光性樹脂組を流
延し、感光層を形成した。The adhesive layer composition solution thus obtained was applied onto a polyethylene terephthalate film having a thickness of 250 μm so that the film thickness would be 20 μm, and then 120 ° C.
It was dried and cured for 3 minutes to obtain a support having an adhesive layer. The above-mentioned photosensitive resin set was cast on the adhesive layer of this support to form a photosensitive layer.
【0026】一方、ポリエステルフィルム(原反は東洋
紡績(株)製のE5000で厚さ125μm、にポリビ
ニルアルコール(日本合成化学工業(株)製ゴーセノー
ルGH−23)/紫外線吸収エマルジョン(新中村化学
工業(株)製ニューコートUVA−204W:平均分子
量約10万)/純水=4.4部/3.3部/92.3部
の比率で溶解した水溶液をバーコーター#8で塗布し、
100℃、3分間乾燥して、乾燥後の厚みが0.5μm
の被覆層を形成した。被覆層の波長360nmにおける
光透過率は80%であった。この光透過率はU−321
0形自記分光光度計((株)日立製作所製)によって測
定した。この被覆層を有する厚さ125μmのポリエス
テルフィルムを、当該被覆層側が感光層と接するよう
に、当該ポリエステルフィルムをラミネーターで感光層
上に積層し、全厚みが1075μmで感光層厚みが68
0μmのシート状積層体を得た。この積層体は30℃で
保管下板状に固化した。24時間後、この積層体を10
3℃で3分間加熱して、7日間以上保管した後、感光性
樹脂原版(生版)を得た。On the other hand, a polyester film (raw cloth is E5000 manufactured by Toyobo Co., Ltd., thickness: 125 μm, polyvinyl alcohol (Gosenol GH-23 manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) / UV absorption emulsion (Shin-Nakamura Chemical Co., Ltd.) Co., Ltd. Newcoat UVA-204W: average molecular weight of about 100,000) / pure water = 4.4 parts / 3.3 parts / 92.3 parts of an aqueous solution dissolved in a bar coater # 8,
Dry at 100 ℃ for 3 minutes and the thickness after drying is 0.5μm
To form a coating layer. The light transmittance of the coating layer at a wavelength of 360 nm was 80%. This light transmittance is U-321
It was measured by a type 0 self-recording spectrophotometer (manufactured by Hitachi, Ltd.). A 125 μm-thick polyester film having this coating layer was laminated on the photosensitive layer with a laminator so that the coating layer side was in contact with the photosensitive layer, and the total thickness was 1075 μm and the photosensitive layer thickness was 68 μm.
A 0 μm sheet-shaped laminate was obtained. This laminated body was solidified into a lower plate at 30 ° C. for storage. After 24 hours 10
After heating at 3 ° C. for 3 minutes and storing for 7 days or more, a photosensitive resin original plate (raw plate) was obtained.
【0027】微細な白抜きパターンの再現性評価は次の
ようにして行った。125μmのポリエステルフィルム
を剥離して、テストネガフィルムを真空密着させ、日本
電子精機(株)製のA2 サイズ用プリンター(三菱製ケ
ミカルランプ)を使って10分間露光したサンプルを作
った。次いで、水道水を現像液とし、ブラシ式ウォッシ
ヤー(140μmφナイロンブラシ、日本電子精機
(株)製JW−A2−PD型)を用いて25℃で2分間
現像してレリーフ画像を得ることができた。さらに70
℃で10分間温風乾燥した後、日本電子精機(株)製の
A2 サイズ用プリンターで3分間露光してレリーフ版を
得た。得られた感光性印刷原版の白抜きパターンの再現
性を評価した結果、ネガフィルムのスリット幅30μm
の遮光パターンに対し、レリーフ凹部の幅も30μmを
再現しており、ネガフィルムのパターンを忠実に再現す
る結果となった。次にこのレリーフ版を使って30μm
白抜けパターンの印刷性を評価した。評価は三条機械製
作所(株)製のシール印刷機P−20を使って墨インキ
(T&K社 UVベストキュアー No5 BF 墨)で
印刷テストを行い、30μmの白抜けパターンはインキ
の埋まりのないシャープな刷り上がりの印刷物が得られ
た。The reproducibility of the fine white pattern was evaluated as follows. A 125 μm polyester film was peeled off, a test negative film was vacuum-bonded, and a sample was exposed for 10 minutes using an A2 size printer (Mitsubishi Chemical Chemical Lamp) manufactured by JEOL Ltd. Then, using tap water as a developing solution and using a brush type washer (140 μmφ nylon brush, JW-A2-PD type manufactured by JEOL Ltd.) for 2 minutes at 25 ° C., a relief image could be obtained. . 70 more
After drying with warm air at 10 ° C. for 10 minutes, a relief plate was obtained by exposing for 3 minutes with a printer for A2 size manufactured by JEOL Ltd. The reproducibility of the blank pattern of the obtained photosensitive printing original plate was evaluated, and the slit width of the negative film was 30 μm.
With respect to the light-shielding pattern, the width of the relief recess was also reproduced to be 30 μm, and the result was to faithfully reproduce the pattern of the negative film. Next, using this relief plate, 30 μm
The printability of the blank pattern was evaluated. For the evaluation, a printing test was performed with a black ink ink (UV Best Cure No5 BF black ink by T & K, Inc.) using a sticker printing machine P-20 manufactured by Sanjo Kikai Seisakusho Co., Ltd. A printed product was obtained.
【0028】比較例1
実施例1において、被覆層中の紫外線吸収性エマルジョ
ンを添加しなかったこと以外は実施例1と同様の方法に
より、感光性印刷原版を得た。得られた感光性印刷原版
の白抜きパターンの再現性を評価した結果、スリット幅
30μmの遮光パターンに対し、レリーフ凹部の幅は2
0μmであり、ネガフィルムのパターンを再現しなかっ
た。次にこのレリーフ版を使って実施例1と同様に印刷
性を評価した。また、印刷物も白く抜けるべき部分にイ
ンキが付着しシャープな刷り上がりの印刷物は得られな
かった。Comparative Example 1 A photosensitive printing original plate was obtained in the same manner as in Example 1 except that the ultraviolet absorbing emulsion in the coating layer was not added. As a result of evaluating the reproducibility of the blank pattern of the obtained photosensitive printing original plate, the width of the relief concave portion was 2 with respect to the light shielding pattern of the slit width of 30 μm.
It was 0 μm and did not reproduce the pattern of the negative film. Next, using this relief plate, the printability was evaluated in the same manner as in Example 1. In addition, the printed matter was not able to obtain a sharp printed matter due to the ink adhering to the white areas.
【0029】比較例2
ポリエステルフィルム(原反は東洋紡績製のE5000
で厚さ125μm)にポリビニルアルコール(日本合成
化学工業製ゴーセノールGH−23)/分子量323の
紫外線吸収剤(大塚化学製 RUVA−93)/純水=
4.7部/0.6部/95部の比率で添加した水溶液を
バーコーター#8で塗布し、100℃、3分間乾燥し
て、乾燥後の厚みが0.5μmの被覆層を形成した。被
覆層の波長360nmにおける光透過率は80%であっ
た。以下、実施例1と同様の方法で感光性印刷原版を得
た。得られた感光性樹脂積層体の微細な白抜きパターン
の再現性を評価した結果、スリット幅30μmの遮光パ
ターンに対し、レリーフ凹部の幅は20μmであり、ネ
ガフィルムのパターンを再現しなかった。次にこのレリ
ーフ版を使って実施例1と同様に印刷性を評価した。ま
た、印刷物も白く抜けるべき部分にインキが付着しシャ
ープな刷り上がりの印刷物は得られなかった。Comparative Example 2 Polyester film (original is E5000 manufactured by Toyobo Co., Ltd.)
At a thickness of 125 μm, polyvinyl alcohol (Gosenol GH-23 manufactured by Nippon Synthetic Chemical Industry) / UV absorber having a molecular weight of 323 (RUVA-93 manufactured by Otsuka Chemical) / pure water =
The aqueous solution added at a ratio of 4.7 parts / 0.6 parts / 95 parts was applied with a bar coater # 8 and dried at 100 ° C. for 3 minutes to form a coating layer having a thickness after drying of 0.5 μm. . The light transmittance of the coating layer at a wavelength of 360 nm was 80%. Hereinafter, a photosensitive printing original plate was obtained in the same manner as in Example 1. As a result of evaluating the reproducibility of the fine white pattern of the obtained photosensitive resin laminate, the relief recess width was 20 μm with respect to the light-shielding pattern having a slit width of 30 μm, and the pattern of the negative film was not reproduced. Next, using this relief plate, the printability was evaluated in the same manner as in Example 1. In addition, the printed matter was not able to obtain a sharp printed matter due to the ink adhering to the white areas.
【0030】[0030]
【発明の効果】以上、かかる構成よりなる本発明感光性
印刷原版によれば、微細な白抜きパターンをレリーフ、
印刷物で再現でき、高品位の印刷が可能な印刷版を得る
ことが出来るので、産業界に寄与すること大である。As described above, according to the photosensitive printing original plate of the present invention having such a constitution, a fine white pattern is reliefed,
Since it is possible to obtain a printing plate that can be reproduced on a printed matter and can perform high-quality printing, it is a great contribution to the industrial world.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2H025 AA02 AA04 AB03 AC01 AD01 DA02 DA03 FA17 2H096 AA06 BA01 GA08 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 2H025 AA02 AA04 AB03 AC01 AD01 DA02 DA03 FA17 2H096 AA06 BA01 GA08
Claims (2)
およびカバーフィルムを有する感光性印刷原版であっ
て、前記被覆層が、感光性樹脂層の活性光線領域に吸収
をもつ平均分子量1,000以上の光吸収剤を含有する
ことを特徴とする感光性印刷原版。1. A photosensitive printing original plate having at least a support, a photosensitive resin layer, a coating layer and a cover film, wherein the coating layer has an average molecular weight of 1, which has absorption in the actinic ray region of the photosensitive resin layer. A photosensitive printing original plate comprising at least 000 light absorbers.
し、50%〜99%である請求項1記載の感光性印刷原
版。2. The photosensitive printing original plate according to claim 1, wherein the light transmittance of the coating layer is 50% to 99% with respect to light having a wavelength of 360 nm.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002099616A JP4129670B2 (en) | 2002-04-02 | 2002-04-02 | Photosensitive printing master |
KR1020030019556A KR100942485B1 (en) | 2002-04-02 | 2003-03-28 | Photosensitive printing disc |
TW092107340A TW594420B (en) | 2002-04-02 | 2003-04-01 | Photo-sensitive printed board |
US10/405,031 US7026095B2 (en) | 2002-04-02 | 2003-04-02 | Photosensitive plate |
EP03007590A EP1353227B1 (en) | 2002-04-02 | 2003-04-02 | Photosensitive plate |
CNB031077102A CN1324404C (en) | 2002-04-02 | 2003-04-02 | Photosensitive printing original edition |
DE60305562T DE60305562T2 (en) | 2002-04-02 | 2003-04-02 | Photosensitive plate |
ES03007590T ES2266667T3 (en) | 2002-04-02 | 2003-04-02 | PHOTOSENSIBLE PLATE. |
AT03007590T ATE328304T1 (en) | 2002-04-02 | 2003-04-02 | LIGHT SENSITIVE PLATE |
HK04102535.4A HK1059650B (en) | 2002-04-02 | 2004-04-08 | Photosensitive plate |
Applications Claiming Priority (1)
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JP2002099616A JP4129670B2 (en) | 2002-04-02 | 2002-04-02 | Photosensitive printing master |
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JP2003295422A true JP2003295422A (en) | 2003-10-15 |
JP4129670B2 JP4129670B2 (en) | 2008-08-06 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007123031A1 (en) * | 2006-04-20 | 2007-11-01 | Konica Minolta Medical & Graphic, Inc. | Printing plate material |
JP2012189848A (en) * | 2011-03-11 | 2012-10-04 | Asahi Kasei E-Materials Corp | Photosensitive resin constituent for letterpress printing plate |
WO2013035535A1 (en) | 2011-09-09 | 2013-03-14 | 東洋紡株式会社 | Flexographic printing original plate and water-developable photosensitive resin laminate |
-
2002
- 2002-04-02 JP JP2002099616A patent/JP4129670B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007123031A1 (en) * | 2006-04-20 | 2007-11-01 | Konica Minolta Medical & Graphic, Inc. | Printing plate material |
JP2012189848A (en) * | 2011-03-11 | 2012-10-04 | Asahi Kasei E-Materials Corp | Photosensitive resin constituent for letterpress printing plate |
WO2013035535A1 (en) | 2011-09-09 | 2013-03-14 | 東洋紡株式会社 | Flexographic printing original plate and water-developable photosensitive resin laminate |
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