JP2003268247A - Modifier for resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a modifier which improves the affinity of a resin component with its additive. <P>SOLUTION: A modifier constituted of a polysilane is used together with a resin component and its additive to obtain a resin composition having improved affinity of the both. The above modifier may be constituted of a linear or cyclic polysilane containing an aryl group. The above additive may be constituted with a filler, a reinforcing agent, a flame-retardant and the like. The ratio of the additive is about 1 to 100 pts.wt based on 100 pts.wt. resin component. The ratio of the above modifier is about 0.1-30 pts.wt. based on 100 pts.wt. sum of the resin component and the additive. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a modifier for resin composed of polysilane, a resin composition containing the modifier, and a molded article formed from the resin composition.

[0002]

2. Description of the Related Art Generally, plastic materials have higher plasticity and excellent moldability than inorganic materials such as metal materials, but on the other hand, they are easy to burn and have low mechanical strength. Therefore, in order to improve these properties of the plastic material, various additives such as a flame retardant and a filler or a reinforcing agent are blended depending on the application. However, if the proportions of these additives increase, the mechanical properties such as tensile strength and impact strength of the obtained molded article deteriorate.

In order to solve such a problem, a silane coupling agent may be used as a modifier capable of binding to both the plastic surface and the surface of the inorganic additive to improve the affinity between them. Are known. For example, in glass fiber reinforced plastics, organic functional groups (vinyl group, epoxy group, amino group, methacryloxy group, methoxy group, ethoxy group, etc.) as silane coupling agents.
And silanes having a long-chain saturated alkyl group are used.

However, even if these silane coupling agents are used, the affinity between the plastic polymer and the additive is not sufficiently improved, and both cannot be uniformly dispersed. Is difficult to control.

[0005]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a modifier capable of improving the affinity between the resin component and its additive.

Another object of the present invention is to provide a modifier capable of suppressing deterioration of mechanical properties even if the proportion of additives such as fillers and flame retardants is large, resin compositions containing the modifier and molding. To provide the body.

Still another object of the present invention is to provide a resin composition and a molded product having high flame retardancy and mechanical properties.

[0008]

The inventors of the present invention have conducted extensive studies to solve the above-mentioned problems, and as a result, a modifier composed of polysilane has an affinity for a resin component and its additive. Found to improve.

That is, the modifying agent of the present invention is a modifying agent used in combination with a resin component and its additive, and is at least one of structural units represented by the following formulas (1) to (3). It is composed of polysilane having one structural unit.

[0010]

[Chemical 2]

(Wherein R ^{1 to} R ³ are the same or different and are a hydrogen atom, a hydroxyl group, an alkyl group, an alkoxy group, an alkenyl group, a cycloalkyl group, a cycloalkyloxy group, a cycloalkenyl group or an aryl group. , An aryloxy group, an aralkyl group, an aralkyloxy group or a silyl group, x, y and z each represent a number of 0 or more, and the sum of x, y and z is a number of 2 or more).

The modifier may be composed of polysilane having a structural unit (1) in which at least one of R ¹ and R ² is an aryl group. Further, the modifier may be composed of linear or cyclic polysilane.

The present invention also includes a resin composition composed of a resin component, its additive, and the above-mentioned modifier. The resin component may be composed of a polycarbonate resin, a polyester resin, a styrene resin, an acrylic resin, an olefin resin, or the like. The additive may be composed of a component which is insoluble or incompatible with the resin component, and may be composed of, for example, a filler, a reinforcing agent, a flame retardant, a color pigment or the like. The ratio of the additive may be about 1 to 100 parts by weight with respect to 100 parts by weight of the resin component. The ratio of the modifier may be about 0.1 to 30 parts by weight based on 100 parts by weight of the resin component and the additive.

The present invention also includes a molded body formed of the resin composition.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION [Polysilane] The modifier of the present invention comprises polysilane. The polysilane is not particularly limited as long as it is a linear, cyclic, branched or network compound having a Si-Si bond, but the above formula (1)
At least one structural unit among the structural units represented by (3) to (3) is included. As such a polysilane,
For example, a linear or cyclic polysilane composed of the structural unit represented by the formula (1), a branched or network polysilane composed of the structural unit represented by the formula (2) or (3), In the combination of structural units represented by the formulas (1) to (3) (for example, formula (1) and formula (2), formula (1) and formula (3), formulas (1) to (3)) The polysilane etc. which were comprised are mentioned.

In the above formulas (1) and (2), R ¹ to
The substituent represented by R ³ is a hydrogen atom, a hydroxyl group, an alkyl group, an alkoxy group, an alkenyl group, a cycloalkyl group, a cycloalkyloxy group, a cycloalkenyl group, an aryl group, an aryloxy group, an aralkyl group or an aralkyl. Examples thereof include an oxy group and a silyl group. Of these, R ^{1 to} R ³ are usually hydrocarbon groups such as an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, and an aralkyl group in many cases. In addition, a hydrogen atom, a hydroxyl group, an alkoxy group, and a silyl group are often substituted in the terminal group.

The alkyl group is a C _1-14 alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, t-butyl or pentyl (preferably C _1-10 alkyl group, more preferably C _1-6 alkyl group). ) Is mentioned. As the alkoxy group, a C _1-14 alkoxy group such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, t-butoxy, pentyloxy (preferably C
_1-10 alkoxy group, more preferably C _1-6 alkoxy group). The alkenyl group is a C _2-14 alkenyl group such as vinyl, allyl, butenyl, pentenyl (preferably C _2-10 alkenyl group, more preferably C _2-10 alkenyl group).
_2-6 alkenyl group).

The cycloalkyl group includes C such as cyclopentyl, cyclohexyl and methylcyclohexyl.
_{A 5-14} cycloalkyl group (preferably a C _5-10 cycloalkyl group, more preferably a C _5-8 cycloalkyl group) can be mentioned. _{Examples of the} cycloalkyloxy group include C _5-14 cycloalkyloxy groups such as cyclopentyloxy and cyclohexyloxy (preferably C _5-10 cycloalkyloxy group, more preferably C _5-8 cycloalkyloxy group). As the cycloalkenyl group, a C _5-14 cycloalkenyl group such as cyclopentenyl or cyclohexenyl (preferably a C _5-10 cycloalkenyl group,
More preferably, it is a C _5-8 cycloalkenyl group).

The aryl group is a C _6-20 aryl group such as phenyl, methylphenyl (tolyl), dimethylphenyl (xylyl) or naphthyl (preferably C _6-15 aryl group, more preferably C _6-12 aryl group). ) Is mentioned. The aryloxy group is a C _6-20 aryloxy group (preferably C) such as phenoxy or naphthyloxy.
_6-15 aryloxy group, and more preferably C _6-12 aryloxy group). Examples of the aralkyl group include C _6-20 aryl-C _1-4 alkyl groups (preferably C _6-10 aryl-C _1-2 alkyl groups) such as benzyl, phenethyl and phenylpropyl. Examples of the aralkyloxy group include C _6-20 aryl-C _1-4 alkyloxy groups (preferably C _6-10 aryl-C _1-2 alkyloxy groups) such as benzyloxy, phenethyloxy and phenylpropyloxy. .

Examples of the silyl group include Si _1-10 silanyl groups (preferably Si _1-6 silanyl groups) such as silyl group, disilanyl group and trisilanyl group.

When R ^{1 to} R ³ are the above organic substituents or silyl groups, at least one of the hydrogen atoms thereof is substituted with a functional group such as an alkyl group, an aryl group or an alkoxy group. Good. Examples of such a functional group include the same groups as described above.

Of these substituents, an aryl group (for example, a C _6-20 aryl group such as a phenyl group) and an alkyl group (for example, a C _1-4 alkyl group such as a methyl group) are widely used.

When the polysilane has an acyclic structure (straight chain, branched chain, network), the terminal substituent is usually a hydrogen atom,
A hydroxyl group, an alkyl group, an alkoxy group, and a silyl group.

Preferred polysilanes include R ¹ and R ²
A polysilane having a structural unit (1) in which at least one is an aryl group, a polysilane having a structural unit (2) in which R ³ is an aryl group or an alkyl group, and a polysilane having the structural unit (1) and the structural unit (2) In particular, polysilanes having a combination, particularly polysilanes having a structural unit (1) in which R ¹ is an aryl group (eg, phenyl group) and R ² is an alkyl group (eg, methyl group), and R ¹ and R ² are both Examples thereof include polysilane having a structural unit (1) which is an aryl group (for example, a phenyl group), polysilane having a structural unit (2) in which R ³ is an aryl group (for example, a phenyl group), and the like. Specifically, cyclic polydiphenylsilane (5- to 8-membered ring), linear polymethylphenylsilane (terminal trimethylsilyl group), linear polymethylphenylsilane (terminal hydroxyl group), polyphenylsiline (terminal hydroxyl group) ), Polydiphenylsilane-
Examples thereof include polyphenylsiline copolymer (terminal hydroxyl group). The structure of polysilane is preferably linear or cyclic, and particularly preferably linear. The polysilin means a branched polysilane composed of the structural unit (2).

The degree of polymerization of polysilane, that is, the sum of x, y and z in the structural units (1) to (3) is 2 or more, but usually 5 to 400, preferably 10 to 35.
It is 0, more preferably about 20 to 300.

The molecular weight of polysilane is 3 in terms of number average molecular weight.
00-100,000, preferably 400-50000,
More preferably, it is about 500 to 20,000. In this molecular weight range, polysilane tends to be easily compatible with the resin and additives. If the number average molecular weight is too large, the compatibility with the resin and the additive may decrease.

[Production Method of Polysilane] The polysilane can be prepared by various known methods. In order to produce these polysilanes, for example, a method of dehalogenating polyhalogenated halosilanes using a silicon-containing monomer having a specific structural unit as a raw material and magnesium as a reducing agent (“magnesium reduction method”, WO98 / 29476). Etc.), a method of dehalogenating polycondensation of halosilanes in the presence of an alkali metal (“kipping method”, J. Am. Che
m.Soc., 110,124 (1988), Macromolecules, 23,3423 (1990)
Etc.), a method for dehalogenative condensation polymerization of halosilanes by electrode reduction (J. Chem. Soc., Chem. Commun., 1161 (199
0), J. Chem. Soc., Chem. Commun. 897 (1992), etc.), a method of dehydrogenative condensation polymerization of hydrazines in the presence of a metal catalyst (JP-A-4-334551, etc.), biphenyl, etc. Method by anionic polymerization of cross-linked disilene (Ma
cromolecules, 23, 4494 (1990)), and a method such as a method by ring-opening polymerization of cyclic silanes.

Among these production methods, the obtained polysilane has excellent purity and molecular weight distribution, excellent compatibility with resins and additives, low sodium and chlorine contents, and industrial properties such as production cost and safety. From this point, the magnesium reduction method is most preferable. Incidentally, water may be added to the obtained polysilane to generate a silanol group.

[Resin Composition] The resin composition of the present invention comprises a resin component, its additive, and the above-mentioned modifier.
The modifying agent is a modifying agent for resin, improves the affinity between the resin component and its additive, and has a role as an auxiliary agent of the additive.

(Resin Component) The resin component includes a thermoplastic resin and a thermosetting resin.

The thermoplastic resin is not particularly limited, but examples thereof include olefin resins (poly α-C _2-10 olefins such as polyethylene, polypropylene and polymethylpentene) and amorphous polyolefin resins (low density polyethylene). Such as amorphous polyolefins, cyclopentadiene resins and cyclic olefins such as norbornene resins), vinyl resins (polyvinyl chloride, vinyl acetate resins, etc.), aromatic vinyl resins (polystyrene, acrylonitrile-styrene resin) , Styrene-methyl methacrylate resin, ABS resin, etc., acrylic resin (polymethyl methacrylate, (meth) acrylic acid-
Homo- or copolymers of (meth) acrylic monomers such as (meth) acrylic acid esters, methyl methacrylate-styrene copolymers, etc., polycarbonate resins (bisphenol A type polycarbonate etc.), polyester resins (polyethylene) Poly C _2-10 alkylene arylate or copolyester such as terephthalate, polybutylene terephthalate, polycyclohexane dimethylene terephthalate, polyethylene naphthalate, polyarylate, liquid crystal polyester, etc., polyacetal (polyoxymethylene, etc.), polyamide resin (nylon) 6,
Nylon 66, Nylon 46, Nylon 6T, Nylon MXD, etc., Sulfone-based resins (Polysulfone, Polyethersulfone, etc.), Phenylene ether-based resins (Polyphenylene ether, Modified polyphenylene ether, etc.), Thermoplastic elastomers (Styrene-based thermoplastic elastomers, Olefin-based thermoplastic elastomer, etc.),
Fluorine resin (polytetrafluoroethylene etc.) etc. can be illustrated. These thermoplastic resins may be used alone or in combination of two or more.

The thermosetting resin is not particularly limited, and examples thereof include phenolic resins (resole type, novolac type phenolic resin, etc.), amino type resins (urea resin,
Melamine resin, etc.), furan resin, polyurethane resin, epoxy resin (bisphenol A type epoxy resin, etc.), unsaturated polyester resin, diallyl phthalate resin, vinyl ester resin, thermosetting acrylic resin,
Silicone resin, polyimide resin (polyether imide, polyamide imide, polyamino bismaleimide,
Bismaleimide triazine resin etc.) and the like. These thermosetting resins can be used alone or in combination of two or more. A conventional curing agent may be used for the thermosetting resin. The resin component may be a photocurable resin.

Among these resin components, a thermoplastic resin is generally used, and a polycarbonate resin (for example, a bisphenol A type polycarbonate or a polycarbonate obtained from bisphenols containing a fluorene skeleton),
Polyester resin (for example, poly C _2-4 alkylene arylate such as polyethylene terephthalate or copolyester), polystyrene resin (polystyrene,
A rubber-reinforced styrene resin, an AS resin, an ABS resin, etc., an acrylic resin (for example, polymethyl methacrylate), an olefin resin (for example, polyethylene, polypropylene, etc.) can be preferably used. When the modifier of the present invention is used, the affinity with the additive can be improved even with these aromatic resins and nonpolar resins.

(Additives) As additives for the resin component, various additives such as plasticizers, curing agents, polymerization initiators, catalysts, stabilizers (antioxidants, ultraviolet absorbers, etc.),
Release agent, antistatic agent, vulcanizing agent, defoaming agent, leveling agent,
Examples thereof include a dispersant, a flow control agent, and a stress reducing agent, which are not particularly limited, but are components insoluble or incompatible with the resin component (dispersible solid component or phase-separated solid component with respect to the resin component). Is preferred. Examples of such additives include fillers, reinforcing materials, flame retardants, and color pigments.

(1) Filler and Reinforcing Agent As the filler and reinforcing material, conventional fillers and reinforcing materials can be used, and examples thereof include oxide-based inorganic compounds, non-oxide-based inorganic compounds, organic resin fine particles, and inorganic resins. Or an organic fiber etc. are mentioned.

Examples of the oxide-based inorganic compound include silica-based compounds (silica, silica sand, quartz, novaculite, diatomaceous earth, synthetic amorphous silica, etc.), silicates (kaolinite, mica, talc). (Talc), wollastonite, asbestos, calcium silicate, aluminum silicate, etc.), glass body (glass powder, glass sphere,
Hollow glass spheres, glass flakes, foam glass spheres, carbonates (calcium carbonate, magnesium carbonate, etc.), sulfates (barium sulfate, etc.), metal oxides (zinc oxide, alumina, zirconia, magnesia, titanium oxide, beryllium oxide) Etc.) can be exemplified.

Examples of non-oxide type inorganic substances include nitrides (boron nitride, aluminum nitride, titanium nitride, silicon nitride, etc.), carbides (boron carbide, aluminum carbide, silicon carbide, titanium carbide, etc.), borides (borides). Titanium oxide, etc.), sulfides (molybdenum disulfide, tungsten disulfide, etc.), fluorides (carbon fluoride, etc.), metal bodies (aluminum, copper, lead, stainless steel, zinc, etc.), carbon bodies (carbon black, coke) , Graphite, pyrolytic carbon, hollow carbon spheres, etc.).

The inorganic compound may have any of needle-like (including whiskers), granular, scale-like or plate-like shape.

The organic resin fine particles include, for example, crosslinked thermoplastic resin [crosslinked styrene resin (eg, crosslinked polystyrene, crosslinked polydivinylbenzene, crosslinked polyvinyltoluene, crosslinked styrene-methyl methacrylate copolymer), crosslinked acrylic resin, etc. Resin (for example, crosslinked polymethylmethacrylate etc.), crosslinked olefin resin (crosslinked polyethylene, crosslinked polypropylene etc.) fine particles, crosslinked thermosetting resin (crosslinked melamine resin, crosslinked benzoguanamine resin, crosslinked silicone resin etc.) fine particles etc. It can be illustrated.

Examples of the inorganic or organic fibers include inorganic fibers (glass fiber, carbon fiber, silica fiber, silica-alumina fiber, etc.) and organic fibers (aromatic polyamide, aromatic polyester, fluororesin, polyacrylonitrile, etc.). It can be illustrated.

These fillers and reinforcing materials can be used alone or in combination of two or more. Among these fillers and reinforcing materials, silica compounds (such as silica), silicates (such as mica and talc), carbonates (such as calcium carbonate), glass fibers or carbon fibers can be preferably used.

(2) Flame Retardant As the flame retardant, a conventional flame retardant can be used,
For example, inorganic compounds, organic phosphorus compounds (phosphates such as triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, etc.), nitrogen compounds (phosphonitrile, guanidine phosphate, guanidine sulfamate, guanyl phosphate) Urea, guanidine carbonate, etc.), halogen compounds (chlorinated polyethylene,
Chlorinated paraffin, tetrabromoethane, tetrabromobutane, tribromopropane, etc., reactive organic compounds (dibromobutenediol, tetrabromobisphenol A, vinyl bromide, phosphorus-containing polyol, tetrabromophthalic anhydride, tetrachlorophthalic anhydride Acid, etc.), colloidal compounds (Sb ₂ O _3, etc.) and the like. Further, the filler and the reinforcing material may be added as a flame retardant (incombustible substance).

Of these flame retardants, inorganic compounds are preferred. Examples of the inorganic compound include phosphorus compounds (red phosphorus, phosphoric acid, phosphorous acid, hypophosphorous acid, polyphosphoric acid or metal salts thereof), boric acid compounds (boric acid, tetraboric acid, pentaphosphate). Boric acid, octaboric acid or metal salts thereof (zinc borate, barium metaborate, etc.), antimony compounds (diantimony trioxide, sodium antimonate, etc.), borate compounds (zinc borate, ammonium fluoroborate, etc.) ) Etc. can be illustrated.

(3) Coloring Pigment As the coloring pigment, for example, a black pigment such as an inorganic pigment [carbon black (for example, acetylene black, lamp black, thermal black, furnace black, channel black, Ketjen black, etc.), titanium oxide, etc. White pigments such as chrome yellow, yellow pigments such as chrome yellow, red pigments such as iron oxide red, orange pigments such as molybdate orange, green pigments such as chrome green, blue pigments such as dark blue, purple pigments such as manganese violet, etc.], organic Pigments [azo pigments (Pigment Yellow, Hansa Yellow, Benzidine Yellow, Permanent Red, Brilliant Carmine 6B, etc.), phthalocyanine pigments (Phthalocyanine Blue, Phthalocyanine Green, etc.), lake pigments (Lake Red, Watch Chan Red, etc.), etc. Etc. can be exemplified.

Among these additives, inorganic compounds, particularly ceramic compounds (eg, silicon-containing compounds) are preferable. Furthermore, as additives, fillers and reinforcing materials,
Flame retardants, especially fillers and reinforcing materials, are preferred.

Since the modifier of the present invention can improve the affinity between the resin component and the additive, it is possible to suppress the deterioration of the characteristics of the resin component even if the ratio of the additive is large. Therefore, the ratio of the additive is 1 to 100 parts by weight of the resin component.
The amount is 100 parts by weight, preferably 3 to 70 parts by weight, more preferably 5 to 50 parts by weight (particularly 10 to 40 parts by weight). When the additive is a filler or a reinforcing material, the ratio of the filler or the reinforcing material is 5 with respect to 100 parts by weight of the resin component.
It is about 100 to 100 parts by weight, preferably about 10 to 70 parts by weight.

The ratio of the modifier is 0.1 to 30 parts by weight, preferably 0.3 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the total of the resin component and the additive.
It is about part by weight.

The ratio of the modifier to the resin component is 0.05 to 20 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the resin component.
It is about part by weight.

The ratio of the modifier to the additive is the additive 1
The amount is 0.1 to 50 parts by weight, preferably 0.5 to 30 parts by weight, more preferably 1 to 20 parts by weight (particularly 1 to 10 parts by weight) with respect to 00 parts by weight.

The resin composition can be prepared by blending a resin component, an additive and a modifier. Usually, a resin pellet is pre-mixed with a stabilizer and then the modifier is mixed with other additives. It can be prepared by melt mixing with. The kneading device may be a batch type or a continuous type. The batch-type kneading device, for example, a mixing roll,
Examples include a kneader and an intensive mixer. Examples of the continuous kneading device include a single screw extruder, a meshing twin screw extruder, and a non-mating twin screw extruder. The melt-mixed resin composition is usually pelletized.

When the resin composition is formed as a coating film, the resin component, the additive and the modifier are dissolved in a solvent to form a coating film on the article to be coated, and then dried. You can also The solvent can be appropriately selected depending on the type of resin, additive, polysilane, and is not particularly limited,
For example, water, alcohols (methanol, ethanol,
C such as propanol, isopropanol, butanol
_1-6 alcohol, cyclohexanol, etc.), ethers (cyclic or chain C _4-6 ether such as 1,4-dioxane, tetrahydrofuran, diethyl ether, diisopropyl ether, dimethoxyethane), ketones (acetone, methyl ethyl ketone, etc.) C _3-6 dialkyl ketone, cyclohexanone etc.), esters (carboxylic acid C _1-4 alkyl ester such as methyl acetate, ethyl acetate, butyl acetate etc.), hydrocarbons [aliphatic hydrocarbons (hexane etc.), fats Cyclic hydrocarbons (cyclohexane, methylcyclohexane, etc.), aromatic hydrocarbons (toluene, xylene, etc.)], cellosolves (methyl cellosolve, ethyl cellosolve, butyl cellosolve, etc.),
Examples thereof include carbitols (carbitol, diethylene glycol methyl ether, etc.). These solvents may be used alone or in combination of two or more.

The thickness of the coating film is 0.1 to 500 μm, preferably 0.5 to 200 μm, more preferably 0.5 to
It is about 50 μm.

When the resin component is a thermosetting resin, generally, a modifier is mixed with a curing agent and an additive together with an initial condensate of the resin to prepare a liquid composition, which is then dried and cured. . When a filler or a reinforcing material is used as an additive, a liquid composition may be prepared and then kneaded or impregnated with the filler or the reinforcing material and dried / cured.

[Molded Article] The molding method of the obtained resin composition varies depending on the kind and application of the resin, but in the case of a thermoplastic resin, extrusion molding, injection molding, blow molding, stretched film molding, compression molding Examples of the method include calender molding and RIM molding. For thermosetting resins, compression molding, transfer molding, lamination molding, cast molding, R
A method such as IM molding can be exemplified.

The resin composition of the present invention does not decrease in mechanical strength even if it contains a large amount of additives (fillers, reinforcing materials, flame retardants, etc.), and therefore has neither flame retardancy nor mechanical properties. Is also highly satisfied. In addition, since modifiers composed of polysilane are less harmful to the environment, they are paints, insulating materials for electric devices, wire covering materials, sealing materials and protective films for electronic devices and liquid crystal members, printed circuit boards, ICs. Package, sliding member,
It is suitable for automobile parts materials, aerospace materials, inks, adhesives, adhesives, building materials, interior materials, etc. Further, even if added in a small amount, it is compatible with the resin and does not deteriorate the transparency, so that it is particularly suitable for optical parts such as an optical waveguide, a nonlinear optical element, an optical memory, an optical switch, a light emitting element, an amplifying element, and a lens. Is.

[0056]

The modifier of the present invention can improve the affinity between the resin component and its additive. Further, according to the present invention, it is possible to obtain a resin composition and a molded product in which deterioration of mechanical properties is suppressed even when the proportion of additives such as a filler and a flame retardant is large. Therefore, the resin composition and the molded article,
It has high flame retardancy and mechanical properties.

[0057]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples. The resin components and polysilane used in the examples and comparative examples are shown below. Moreover, the measuring method of the tensile test performed in the examples and comparative examples is shown below.

[Tensile Test] The chips obtained in the examples and comparative examples were injection molded by an injection molding machine (N100B manufactured by Japan Steel Works Ltd.).
II, L / D = 22) and molded under the following conditions, JI
Test piece A (width 1/2 inch x length 8.5 inch x thickness 1/8 inch) and test piece B based on SK-7113
(Width 1/4 inch x Length 5 inch x Thickness 1/2 inch)
Was produced. Regarding the obtained test piece, JIS K-6
A tensile test based on 760 was performed (test piece A: strength at break, test piece B: elongation at break).

(Injection molding conditions) Temperature setting: feed 260 ° C., nozzle 280 ° C., mold 60 ° C. Injection pressure: 35-40 kg / cm ²

Example 1 Polycarbonate resin (manufactured by Teijin Kasei Co., Ltd., L-122)
5) For 100 parts by weight, 30 parts by weight of mica and 1 part by weight of linear polymethylphenylsilane (terminal trimethylsilyl group, number average molecular weight 2700, abbreviated as PMPS-R) were added to a twin-screw extruder (Plastics). Made by Engineering Research Institute,
Melt-kneading using BT-30-L, L / D = 30),
Chips were obtained by extruding in a strand form under the following conditions.
When a tensile test was performed on the obtained chips, the strength at break was 93 MPa and the elongation at break was 1.3%.

(Extrusion conditions) Temperature setting: feed 260 ° C., kneading section 300 ° C., head 260 ° C. rotation speed: 60 rpm

Comparative Example 1 A chip was obtained in the same manner as in Example 1 except that linear polymethylphenylsilane was not used. When a tensile test was conducted on the obtained chips, the strength at break was 89 MPa and the elongation at break was 1.1%.

The test piece of Example 1 has a strength at break improved by 5% and an elongation at break of 2 as compared with the test piece of Comparative Example 1.
It has improved by 0%.

Example 2 Chips were obtained in the same manner as in Example 1 except that 15 parts by weight of calcium carbonate was used instead of 30 parts by weight of mica. When a tensile test was performed on the obtained chips, the strength at break was 80 MPa and the elongation at break was 2.8%.

Example 3 A chip was obtained in the same manner as in Example 1 except that a high density polyethylene resin (HIZEX 1300J, manufactured by Mitsui Chemicals, Inc.) was used instead of the polycarbonate resin. When a tensile test was performed on the obtained chips, the strength at break was 31 MPa and the elongation at break was 6.5%.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsuyoshi Fujiki             4-1-2 Hirano-cho, Chuo-ku, Osaka City, Osaka             Gas Co., Ltd. (72) Inventor Hironori Sakamoto             4-1-2 Hirano-cho, Chuo-ku, Osaka City, Osaka             Gas Co., Ltd. (72) Inventor Mitsuaki Yamada             4-1-2 Hirano-cho, Chuo-ku, Osaka City, Osaka             Gas Co., Ltd. F-term (reference) 4J002 BB00W BB03W BB17W BC02W                       BC06W BC07W BC12W BD03W                       BF02W BF05W BG00W CB00W                       CC04W CD05W CE00W CF00W                       CF06W CF07W CG00W CK02W                       CL01W CL03W CP21X DE136                       DE146 DE236 DG046 DJ006                       DK006 DL006 FA016 FA046                       FA076 FD016 FD027 FD107                       FD147 FD177 FD207

Claims (14)

[Claims] 1. A modifier used in combination with a resin component and its additive, which comprises the following formulas (1) to (3): (In the formula, R ^{1 to} R ³ are the same or different and are a hydrogen atom,
A hydroxyl group, an alkyl group, an alkoxy group, an alkenyl group, a cycloalkyl group, a cycloalkyloxy group, a cycloalkenyl group, an aryl group, an aryloxy group, an aralkyl group, an aralkyloxy group or a silyl group,
x, y, and z each represent a number of 0 or more, and the total of x, y, and z is a number of 2 or more), and is composed of a polysilane having at least one structural unit among the structural units represented by Modifier. 2. The modifier according to claim 1, which is composed of a polysilane having a structural unit (1) in which at least one of R ¹ and R ² is an aryl group. 3. A structural unit (1) in which R ¹ is an aryl group and R ² is an alkyl group, and the total of x, y and z is 5 to 4.
The modifying agent according to claim 1, which is composed of polysilane which is 00. 4. The modification according to claim 1, which comprises a polysilane having a structural unit (1) in which R ¹ and R ² are aryl groups, and the total of x, y and z is 5 to 400. Agent. 5. The modifier according to claim 1, which is composed of a linear or cyclic polysilane. 6. A resin composition comprising a resin component, its additive, and the modifier according to claim 1. 7. The composition according to claim 6, wherein the additive is composed of a component insoluble or incompatible with the resin component. 8. The composition according to claim 6, wherein the additive is composed of at least one selected from a filler, a reinforcing agent, a flame retardant, and a coloring pigment. 9. The composition according to claim 6, wherein the additive is composed of an inorganic compound. 10. The resin component is composed of at least one selected from a polycarbonate resin, a polyester resin, a styrene resin, an acrylic resin and an olefin resin, and the additive is a filler, a reinforcing agent and a flame retardant. It is composed of at least one selected from, and the ratio of the additive is 1 to 1 with respect to 100 parts by weight of the resin component.
7. The composition according to claim 6, which is 00 parts by weight. 11. The composition according to claim 10, wherein the proportion of the modifier is 0.1 to 30 parts by weight based on 100 parts by weight of the total of the resin component and the additive. 12. The composition according to claim 10, wherein the ratio of the modifier is 1 to 10 parts by weight based on 100 parts by weight of the additive. 13. A molded product formed from the resin composition according to claim 6. 14. A resin composition comprising a resin component and its additive, wherein the modifier according to claim 1 is used,
A method for improving the tensile strength of a resin composition.