JP2003264372A - Ceramic multilayer substrate, method of manufacturing the same, and method of manufacturing electronic components using the ceramic multilayer substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the run or sag of an electrode pattern when the electrode pattern is printed on a ceramic multilayered substrate. <P>SOLUTION: A burn-off underlayer 3 is provided on at least the surface of an electrode 7 of the main body of the ceramic multilayered substrate 4 on the surface of which at least the electrode 7 is provided. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a square chip resistor,
The present invention relates to a ceramic multilayer substrate such as an LC filter and a composite high frequency electronic component, a method for manufacturing the same, and a method for manufacturing an electronic component using the ceramic multilayer substrate.

[0002]

2. Description of the Related Art Conventionally, square chip resistors, LC filters,
Electronic components such as composite high-frequency electronic components are printed with predetermined electrodes, resistors, insulators, magnetic substances, etc. on a ceramic multilayer substrate such as alumina or glass ceramics for miniaturization and fired at a predetermined temperature. It is manufactured by

[0003]

As the printing method, screen printing or drawing technology has been used. But,
In the case of screen printing, the cost was high because a screen plate was required. Further, the drawing technique is not practical because the drawing speed is slow. Then, JP-A-59-8
Japanese Patent No. 2793 proposes a method for manufacturing a ceramic electronic component using an ink jet method as the above printing method. FIG. 6 shows how an electrode pattern is formed on a ceramic multilayer substrate by an ink jet method. Figure 6
In (a), the electrode ink 2 is ejected from the ink jet printer 1 in the direction of arrow 3. The thus ejected electrode ink 2 lands on the ceramic multilayer substrate 4 for the purpose of forming the electrode pattern 5. An inner layer electrode 6 is formed inside the ceramic multilayer substrate 4. A surface layer electrode 7 is formed on the surface of the ceramic multilayer substrate 4, and the surface layer electrode 7 and the inner layer electrode 6 are electrically connected by via holes (not shown) or the like as necessary. FIG. 6B shows an electrode pattern actually formed on the ceramic multilayer substrate 4,
As shown in FIG. 6B, according to the actual ink jet method, the deformed electrode pattern 8 is formed on the ceramic multilayer substrate 4 with the pinhole 9 formed in the center thereof. In this way, the electrode pattern immediately after printing is
Even a desirable shape as shown in FIG. 6A is likely to change to a state as shown in FIG. 6B after a few seconds, a few minutes, or after drying. Further, as shown in FIG. 6C, which is a cross-sectional view taken along the line AB of FIG. 6B, a pinhole 9 is formed inside the deformed electrode pattern 8 on the ceramic multilayer substrate 4. Here, when the ceramic multilayer substrate 4 is exposed inside the pinhole 9,
Or it may not be exposed (a kind of dimple or dimple). As described above, in the conventional ink jet technique, the electrode ink 2 printed on the ceramic multilayer substrate 4 is repelled or bleeds due to the difference in wettability with the ceramic multilayer substrate 4, so that the electrode ink 2 is highly accurate. No pattern was obtained.

The conventional problems will be described in more detail with reference to the sectional view of FIG. For example, the inventors
As shown in FIG. 7A, the electrode ink 2 jetted from the ink jet printing apparatus 1 flies in the direction of arrow 3 to land on the ceramic multilayer substrate 4 to form the electrode pattern 5. However, in reality
Only the electrode patterns 8 and 10 having the shape as shown in (c) were obtained. FIG. 7B is similar to FIG. 7C, but shows that the electrode ink 2 landed on the ceramic multilayer substrate 4 is repelled due to the difference in wettability with the ceramic multilayer substrate. It is a thing. Especially when handling the ceramic multilayer substrate, if mechanical oil or hand oil adheres to the surface,
Such repelling (or pinhole) of the electrode ink 2 is likely to occur. Further, in FIG. 7C, the electrode ink 2 that has landed on the ceramic multilayer substrate 4 is wet and spread on the surface of the ceramic multilayer substrate 4 to form a blurred electrode pattern 10. As described above, depending on the surface property (or surface roughness) of the ceramic multilayer substrate 4, the landed ink 2 may spread on the ceramic multilayer substrate 4 and cause a short circuit. Further, when the ceramic multi-layer substrate 4 is fired due to the difference in wettability, there are the following problems. That is, as shown in FIG.
After firing, the electrode pattern is rolled 11 or crimped. As described above, there is a problem in that it is not possible to manufacture a desired electronic component because irregular irregularities due to the wettability are formed on the cross section of the electrode pattern. In addition to the electrode ink, such a problem similarly occurs with glass ink, ceramic ink, resistor ink, and the like.

Therefore, an object of the present invention is to suppress printing unevenness of various patterns when an electronic component forming member such as an electrode is formed on a ceramic multilayer substrate.

[0006]

According to a first aspect of the present invention, there is provided a ceramic multi-layer substrate body having at least one electrode on the surface thereof, and a ceramic multi-layer substrate having a burnable underlayer provided on at least the surface of the electrode. Since it is a substrate, even if it is an ink jet ink for forming electronic parts that easily bleeds or is easily repelled by forming a burnable underlayer on the surface, it can be printed with high precision, so various electronic circuits can be printed on a ceramic multilayer substrate. Can be built on demand,
The lead time of various composite electronic components can be greatly shortened, and it is possible to manufacture a wide variety of products in small quantities, thus reducing manufacturing costs.

According to a second aspect of the present invention, any one of an ink jet printing device, a coating machine and a printing machine is used on at least the surface of the electrode of a ceramic multilayer substrate having at least one electrode provided on the surface thereof. This is a method for producing a ceramic multilayer substrate in which a solution containing a resin or latex is applied and then dried. A firing underlayer can be simply formed by applying a solution containing a resin or latex and then drying.

According to a third aspect of the present invention, at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least one electrode is provided on the surface of the ceramic multilayer substrate by a burnable underlayer. A method for manufacturing an electronic component, in which a predetermined pattern is formed with an electrode ink using an ink jet printing device on the surface of a ground layer, and then the ceramic multilayer substrate on which the pattern is formed is baked. By this method, the electrode pattern can be formed with high accuracy, the lead time of manufacturing can be greatly shortened, and a large number of products in small quantities can be manufactured, and the manufacturing cost can be reduced.

According to a fourth aspect of the present invention, at least one electrode is provided on the surface of the ceramic multilayer substrate body, and a burnable underlayer is provided on at least the surface of the electrode. A method for manufacturing an electronic component, in which a predetermined pattern is formed with a resistance ink using an ink jet printing device on the surface of a ground layer, and then the ceramic multilayer substrate on which the pattern is formed is fired. Since the resistor pattern can be formed on the substrate, the lead time for manufacturing the resistor can be significantly shortened, and it is possible to manufacture a large number of products in small quantities, which reduces the manufacturing cost.

According to a fifth aspect of the present invention, at least one electrode is provided on the surface of the ceramic multilayer substrate body, and a burnable underlayer is provided on at least the surface of the electrode. A method for manufacturing an electronic component, wherein a predetermined pattern is formed on a surface of a ground layer by using a ceramic ink or a glass ink by using an ink jet printing device, and then the ceramic multilayer substrate on which the pattern is formed is baked. Insulation layers such as and capacitor forming members can be formed on the ceramic multi-layer substrate with high precision, so that the lead time for capacitor manufacturing can be greatly shortened.
It is possible to manufacture a large number of products in small quantities and reduce manufacturing costs.

According to a sixth aspect of the present invention, there is provided a ceramic multilayer substrate main body, wherein at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least the surface of the electrode is provided with a burnable underlayer. A predetermined pattern is formed on the surface of the ground layer by using an ink jet printing device with one or more kinds of electrode ink, resistor ink, ceramic ink and glass ink, and then the ceramic substrate on which the pattern is formed is fired. It is a method for manufacturing electronic components, and by burning out the burnable underlayer after firing, it is possible to combine the electrodes and the patterns of various electronic component forming members formed by the ink jet method on the surface of the composite electronic component with high accuracy. The manufacturing time can be shortened, the lead time can be shortened, and a large amount of small quantities can be manufactured, and the manufacturing cost can be reduced.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to embodiments.

(Embodiment 1) Embodiment 1 of the present invention and the invention according to claims 1 to 3 according to FIG. 1, in particular, a method for forming an electrode pattern on the surface of a ceramic multilayer substrate on which a burnable underlayer is formed. Will be described.

FIG. 1 (a) illustrates how a predetermined electrode pattern is formed on a ceramic multilayer substrate 4 on which a burnable underlayer is formed by an ink jet method. Further, FIG. 1B shows a state of an electrode pattern formed in a predetermined shape, and FIG. 1C shows a state after firing in a cross section.

In FIG. 1A, the ink jet printing apparatus 1 contains a predetermined electrode ink 2 and is ejected in the direction of arrow 3 as the electrode ink 2 according to a signal from the outside. On the surface of the ceramic multilayer substrate 4, a burnable underlayer 13 which is a feature of the present invention is formed. Here, the electrode ink 2 ejected from the ink jet printing apparatus 1 lands on the burnable underlayer 13 and is formed as an electrode pattern 5. Thus, the electrode pattern 5 formed on the burnable underlayer 13 changes with time (for example,
It is possible to maintain a normal shape even when the electrode ink 2 is dried, without requiring several seconds to several days). An example of the electrode pattern shape on the ceramic multilayer substrate 4 thus formed is shown in FIG. In this way, the electrode pattern 5
Are accurately formed without bleeding or repelling due to aging or drying. Further, FIG. 1C is a cross-sectional view taken along the line AB of the sample of FIG. 1B after firing. Figure 1
In (c), the electrode pattern 5 is formed on the ceramic multilayer substrate 4 with high accuracy and uniform thickness. In addition, in FIG. 1B, the surface electrode 7 and the electrode pattern 5 are
The burnable underlayer 13, which was also present during the period, is completely burned out during firing, and therefore does not exist in FIG. 1C. Therefore, in FIG. 1C, the surface layer electrode 7 and the electrode pattern 5 are electrically connected, and at the same time, they are physically and firmly bonded.

By thus forming the burnable underlayer 13 on the surface of the ceramic multilayer substrate 4, it is possible to prevent the electrode ink 2 from flowing or solidifying on the ceramic multilayer substrate 4 due to gravity or surface tension. Further, since the burnable underlayer 13, which is a feature of the present invention, is not burned in the subsequent firing step, it does not adversely affect the reliability and the like of the electronic component as a product.

As the ceramic multi-layer substrate 4 used in the first embodiment, an alumina-based multi-layer substrate including a tungsten-based inner layer electrode 6 therein is used. Next, using a commercially available ink jet printing apparatus, an attempt was made to print a commercially available black ink on the ceramic multilayer substrate 4 with a predetermined electrode pattern, as shown in FIGS. 6 (b) and 7 (c). As a result, the target electrode pattern 5 could not be obtained because it was immediately repelled or the surface was smeared out.

Therefore, a commercially available polyvinyl acetal resin (for example, KW1 or KW3 manufactured by Sekisui Chemical Co., Ltd.) dissolved in water is used as the burnable underlayer 13, and the dry thickness is 0.5 μm on the ceramic multilayer substrate 4. It was applied by using a coating machine so that the degree becomes uniform. In addition to the coating machine, it is also possible to use an ink jet printing device or a printing machine.

An attempt was made to print a predetermined electrode pattern 5 on the ceramic multilayer substrate 4 on which the burnable underlayer 13 was formed with a commercially available ink jet printing device with a commercially available black ink. Then, as shown in FIGS. 1A and 1B, the target electrode pattern 5 without deformation was obtained with high accuracy. Thus, it was confirmed that the burnable underlayer 13 could prevent the electrode pattern 5 from being deformed.

Further, electrode ink 2 for ink jet
Was prototyped and the same test was conducted. First, as the electrode ink 2 for an ink jet, an ink in which AgPd fine particles were made into an ink based on the method for producing an electrode ink for an ink jet proposed by the inventors in JP-A-11-102615 and the like was used.

Then, a burnable underlayer 13 is formed on the ceramic multilayer substrate 4, and on the burnable underlayer 13,
When printing was performed directly using the ink jet printing apparatus 1, the electrode ink 2 was repelled and greatly deformed on the ceramic multilayer substrate 4. On the other hand, the electrode ink 2 was formed on the burnable underlayer 13 in a highly accurate state without being repelled or bleeding, and there was no pattern deformation after drying. Therefore, the electrode pattern 5 is formed on the burnable underlayer 13.
When the ceramic multi-layer substrate 4 on which was formed was fired at 850 ° C., a predetermined ceramic multi-layer component was obtained.

The cross section of this alumina wiring substrate was observed with a scanning electron microscope, but the burnable underlayer 13 was not observed. This is because the burnable underlayer 13 made of resin disappears and volatilizes during firing, and does not adversely affect the finished product.

When the burnable underlayer 13 is made of resin (when a ceramic member described later is not added), the burnable underlayer 13 has a thickness of 20 μm or less (desirably 5 μm).
The following) is desirable. This is because when the thickness of the burnable underlayer 13 made of resin is thicker than 20 μm, defects such as delamination may occur in the product, and in the case where the ceramic part and the electrode part are separated after firing. It is desirable to add a glass component to the burnable underlayer 13.
By this addition, even if the thickness of the burnable underlayer 13 is 20 μm or more, defects such as interface peeling between the ceramic multilayer substrate 4 and the electrode 14 will not occur.

The proportion of the glass member in the burnable underlayer 13 is preferably 0.1 wt% or more and 98 wt% or less. This is because the addition effect may be low with the addition of a ceramic member of less than 0.1 wt%, while the addition of 99% of the burnable underlayer 13 may be insufficient.
When the glass component is more than wt%, the other components (for example, a binding component such as resin) are less than 1 wt%, the strength of the burnable underlayer 13 itself becomes low, and peeling or detachment from the ceramic multilayer substrate occurs. This is because it is likely to occur, and as a result, the yield of manufacturing electronic components may be reduced.

(Embodiment 2) In Embodiment 1, the method of forming the electrode pattern 5 on the surface of the ceramic multilayer substrate 4 on which the burnable underlayer 13 is formed has been described, but in Embodiment 2, FIG. The invention according to claim 4, particularly thickness unevenness due to the presence or absence of the burnable underlayer 13 will be described below.

A burnable underlayer 13 is formed by using a ceramic multilayer substrate 4 on which a burnable underlayer 13 is formed on a predetermined part thereof.
The effect of will be described with reference to FIG. In FIG. 2A, 15 is a resistor pattern, which is a burnable underlayer 13.
It is formed with high precision on top. Further, 16 is a deformed resistor pattern, which is directly printed on the surface of the ceramic multilayer substrate 4. As described above, the resistor pattern 15 formed on the burnable underlayer 13 has a uniform thickness, but the deformed resistor pattern 16 directly formed on the ceramic multilayer substrate 4 has a thickness as shown in FIG. b) and Fig. 7
As shown in (b) and the electrode patterns 8 and 10 shown in FIG. 7 (c), there are large irregularities.

FIG. 2B shows the result of measuring the amount of the resistor component of the resistor pattern 15 and the deformed resistor pattern 16 of FIG. 2A by fluorescent X-rays, and the X axis is the pattern width (mm). ), And the Y axis represents the amount of ruthenium applied per unit area (the unit is arbitrary). The spot diameter of this fluorescent X-ray is 0.1 mm in diameter. Further, the black circles in FIG. 2 (b) are examples of the manufacturing method of the present invention,
It corresponds to the resistor pattern 15 of FIG. In addition, the white circles are obtained by the conventional manufacturing method and correspond to the deformed resistor pattern 16 in FIG.

As shown in FIG. 2B, in the electronic component manufactured by the manufacturing method of the present invention, a uniform coating film thickness is obtained regardless of the position of the pattern width. On the other hand, in a portion without the burnout base layer 13, that is, in the electronic component manufactured by the conventional manufacturing method, the amount of coating on the peripheral portion of the deformed resistor pattern 16 is extremely small, and the central portion of the deformed resistor pattern 16 is coated. The amount is extremely large, and there is large unevenness on the whole.
The distribution of the coating amount by the fluorescent X-rays was measured several times during the process, immediately after printing by the ink jet method, one day after printing (the ink is sufficiently dried), and after firing. Was repeated, but the measurement results shown in FIG. 2B were obtained in all the measurements. As described above, since the resistor pattern 15 can be formed with high accuracy by forming the burnable underlayer 13, variations in the resistance value of the product can be reduced, and as a result, the characteristics and cost of the ceramic multilayer component can be improved. Become.

(Embodiment 3) In Embodiment 3, the invention described in claims 5 and 6 will be described with reference to FIGS. 3 and 4.

First, the pattern of FIG. 2 (a) is being dried, and the cross section is shown in FIG. 3 (a), (b), (c),
4 (d), FIG. 4 (e), (f), (g), and (h).
In the second embodiment, 15 is a resistor pattern and 16 is a deformed resistor pattern in FIG. 2A. However, in the third embodiment, 15 is a dielectric pattern.
6 will be replaced with a modified dielectric pattern.

In FIG. 3A, the ceramic multilayer substrate 4
The surface electrode 7 is formed on the surface of the. In FIG. 3B, the burnable underlayer 13 is formed on a part of the surface electrode 7. This is for evaluating the effect of the burnable underlayer 13. In FIG. 3C, as shown in FIG.
The dielectric ink is printed by the ink jet method. In FIG. 3C, 17 is a dielectric pattern, which is formed on the surface electrode 7. The dielectric pattern 17 has a uniform thickness by being directly printed on the burnable underlayer 13, but this has a uniform thickness with respect to the electrode ink and the resistor ink described in the first and second embodiments. It is the same as the effect of the stratum. Also, FIG.
Reference numeral 18 in (c) is a deformed dielectric pattern, which is formed directly on the surface layer electrode 7, and therefore has a deformation in which the central portion is thick and the peripheral portion is thin. Next, FIG. 3D shows how the cross-sectional shape of these samples changes as they dry. FIG. 3 (d) shows a slightly dried state. The dielectric pattern 17 maintains a uniform cross-sectional shape, but the deformed dielectric pattern 18 gradually dries from the thinnest peripheral part, so the central part (undried) is the peripheral part (dry). It turns out that it will be extremely exciting compared to. FIG. 4E shows a completely dried state. Figure 4
In (e), 19 is a crack, which is generated everywhere in the deformed dielectric pattern 18. This crack 19
Is caused by the uneven thickness of the deformed dielectric pattern 18 described with reference to FIGS. 3 (c) to 3 (d). FIG. 4F shows a state after firing, and 20 is a dielectric layer, in which the dielectric pattern 17 is fired. Reference numeral 21 denotes a deformed dielectric layer, which is obtained by firing the deformed dielectric pattern 18. Also, cracks 19 are generated in places on the deformed dielectric layer 21. Figure 4
The cracks 19 in (f) include both those generated by the drying step of FIG. 4 (e) and those generated by the firing step. Further, FIG. 4 (g) is an example of forming a capacitor, 22 is an evaluation electrode, and the dielectric 20
Are formed individually on the deformed dielectric body 21. Further, in FIG. 4 (h), reference numeral 23 is a measuring instrument, and the surface electrode 7
Then, the characteristics of the dielectric 20 sandwiched between the evaluation electrodes 22 and the deformed dielectric 21 are measured. According to the experiments by the inventors, the dielectric 20 has a small variation in the capacitance value and the dielectric breakdown voltage sufficiently satisfies the specifications. On the other hand, most of the deformed dielectric 21 was short-circuited, and the yield was low. In addition, even the samples that were not short-circuited had many variations in capacitance value, and the breakdown voltage was low, so the specifications could not be satisfied. When the inventors observed the cross section of the sample corresponding to FIG. 4 (h) with a scanning electron microscope, the dielectric 20 showed a uniform cross section without cracks 19 or the like.
Many cracks 19 were generated in the deformed dielectric 21. In the deformed dielectric 21, cracks 19 were generated not only on the surface but also inside. From these results, it was found that the yield was so different despite the ink jet method using the same dielectric ink.
It was found that the unevenness of printing and the unevenness of drying can be reduced by forming the, and as a result, the sintered dielectric can be made more uniform.

When a water-soluble resin is used as the burnable underlayer 13, it is preferable to use a water-soluble resin such as polyvinyl alcohol, methyl cellulose, carboxymethyl cellulose or hydroxypropyl cellulose, in addition to the polyvinyl acetal resin.

When the burnable underlayer 13 is formed on the ceramic multilayer substrate 4 by coating, the viscosity of the aqueous solution containing the water-soluble resin is preferably 50 poise or less. At a high concentration of 70 poise or more, unevenness may occur when high-speed coating is performed at 10 m / min or more. The solid content of the aqueous solution is preferably 1% by weight or more. If the amount is 0.5% by weight or less, the amount of the solvent component is too large. Therefore, when applied at a high speed of 10 m / min or more, drying unevenness may occur due to insufficient capacity of the dryer. When the burnable underlayer 13 is formed on the ceramic multilayer substrate 4 by screen printing, the viscosity of the aqueous solution containing the water-soluble resin is preferably 5000 poise or less. When it is 7,000 poise or more, uneven printing is likely to occur.

When a resin soluble in an organic solvent is used for the burnable underlayer 13, polyvinyl butyral, acrylic resin or the like can be used. In the case of a resin soluble in an organic solvent, a water-soluble component (glycols such as glycerin or polyethylene glycol or alcohol, or a water-soluble resin) or the like is added in order to improve ink receptivity
It is desirable to add it in an amount of not less than 60% by weight and not less than 60% by weight. By adding such a water-soluble component, it is possible to suppress the thickness variation of various patterns printed by the ink jet method and improve the wettability of the burnable underlayer 13 with the ceramic substrate 4 (depending on the resin, If the water-soluble component is not added, the ceramic substrate 4 may be crisply cracked).

It is also possible to combine the patterns formed by the electrode ink, the resistor ink, the ceramic ink, and the glass ink used in the first to third embodiments, and in this case, it is possible to manufacture the composite electronic component with high precision. can do.

(Fourth Embodiment) In the third embodiment,
Although the thickness unevenness of the electrode coating film depending on the presence or absence of the burnable underlayer 13 has been described, in the fourth embodiment, the invention according to claim 1 and claim 2, in particular, in order to further suppress the printing unevenness, A case where a material that chemically reacts with the electrode ink is used for the burnable underlayer 13 will be described with reference to FIG.

First, a commercially available anionic polyvinyl alcohol was used as the material for the burnable underlayer 13. Next, this was dissolved in pure water and applied onto the ceramic multilayer substrate 4 so that the dry thickness was about 0.5 μm.

On the other hand, the electrode ink 2 was prepared using a commercially available nonionic polyvinyl alcohol, and this was printed on the burnable underlayer 13 by a commercially available ink jet printer. The printer is the Epson MJ51.
0C was used in 720 dpi print mode.

In this way, when the electrode pattern 5 is printed on the burnable underlayer 13, the electrode ink 2 becomes the burnable underlayer 1.
At the same time as it was on the surface of No. 3, gelation started, and the landed ink did not flow in the electrode pattern 5. Note that this chemical reaction was performed using commercially available PVA synthetic laundry paste with borax (Na ₂ B ₄
It is considered to be similar to the gelation reaction that occurs when mixed with O ₇ · 10H20). It is considered that this chemical reaction is similar to the one in which PVA hydrated with sodium borate was cross-linked. However, when borax is used, the contained sodium and boric acid remain as a residue, which is not suitable for the burnable underlayer 13 of the present invention.

In order to gel or precipitate the PVA-containing electrode ink 2, methyl alcohol or acetone as an organic solvent is added to the burn-out base layer 13 in advance, so that the PVA-containing electrode ink 2 is burned out. It is also possible to reduce the thickness unevenness by aggregating on the underlayer 13.

Further, resorcin, Congo red, diaminostilbell type dye, etc. are preliminarily burned down.
By adding it to No. 3, the landed PVA-containing electrode ink 2 can be gelated and uneven thickness can be reduced.

As the chemical reaction, a kind of salting-out reaction of precipitating these substances by adding salts to an aqueous solution containing a water-soluble resin, protein, hydrophilic colloid and the like can be used.

For example, by adding a hydrocolloid to the electrode ink 2 side and adding a water-soluble salt to the burnable underlayer 13, the landed electrode ink 2 does not flow due to its surface tension or the like. It can be immediately gelled (set in printing terminology). As such a salt, a salt that completely ionizes in an aqueous solution to give ionic conductivity is preferable, and a salt in which a carboxylic acid is added to a side chain of a polymer such as PVA is also preferable.

(Fifth Embodiment) In the fourth embodiment, a water-soluble resin is used as the burnout underlayer 13, but in the fifth embodiment, a case where a latex resin is used as the burnout underlayer 13 is shown in FIG. Described in.

First, as the latex resin, one obtained by emulsifying polyvinyl butyral and dispersing it in water at 10% by weight was used. Next, this butyral latex was coated on the ceramic multilayer substrate 4 at 20 m / min. Thus
The burnable underlayer 13 was formed on the ceramic multilayer substrate 4 to a thickness of 1 μm or less.

Alternatively, a commercially available butyral resin was similarly dissolved in butyl acetate at 10% by weight, and this butyral solution was similarly coated on the ceramic multilayer substrate 4. In this way, the solvent-based burnable underlayer 13 can be formed on the ceramic multilayer substrate 4 with a thickness of about 2 μm.

As described above, by using butyral resin for the burnable underlayer 13, the adhesive force between the ceramic multilayer substrate 4 and the burnable underlayer 13 can be increased.

When a latex resin or an emulsion resin is used for the burnable underlayer 13, it is desirable to emulsify it so that the particle size thereof is 3 μm or less (desirably 1 μm or less). When the latex resin has a thickness of 5 μm or more, coating unevenness is likely to occur, which is not suitable for manufacturing electronic parts.

The viscosity of the aqueous dispersion solution of latex or emulsion is preferably 10 poise or less. In case of 20 poise or more, high speed coating of 10 m / min or more is difficult,
In addition, uneven coating is likely to occur. The solid content of these aqueous dispersions is preferably 1% by weight or more. If the solid content is 0.5% by weight or less, the amount of the solvent component is too large, and when applying at a high speed of 10 m / min or more, uneven drying may occur due to insufficient capacity of the dryer.

As a method for forming the burnable underlayer 13, even if a general coater (gravure coater, microgravure coater, kiss coater, etc.) is used, a non-contact type coater using an ink jet printer or the like is used. May be. When using a coater, a coating speed of 10 m / min or more (desirably 20 m / min or more) is desirable. This is because coating unevenness is likely to occur at 5 m / min or less.

It is also possible to use a ceramic green sheet in place of the ceramic multilayer substrate 4 (alumina substrate, alumina nitride, etc.). The ceramic green sheet is printed by the ink jet method in a state of being peeled from the base film. Is also good. Even in this case, by forming the burnable underlayer 13, a highly accurate pattern can be easily formed.

(Sixth Embodiment) In the sixth embodiment, a method of forming the burnable underlayer 13 by dip coating will be described with reference to FIG. 2 in FIG.
Reference numeral 4 is a jig that hangs a plurality of ceramic multilayer substrates 4. First, as shown in FIG. 5A, a plurality of ceramic multilayer substrates 4 are fixed to the jig 24. Next, FIG. 5 (b)
As shown in (3), the plurality of ceramic multilayer substrates 4 are fixed to the jig 24 and immersed in the base forming liquid 25. Finally, as shown in FIG. 5C, the plurality of ceramic multilayer substrates 4 are pulled up at a predetermined speed by using the jig 24, so that the burnable underlayer 13 having a uniform thickness can be formed on the surface. it can. Further, in FIG. 5 (c), 26 is a drop, which shows a state in which the excess base forming liquid 25 is removed.
The coating thickness can be adjusted to a desired value depending on the concentration and viscosity of the underlayer forming liquid 25 and the pulling rate. According to the experiments by the inventors, the pulling speed is 0.1 mm / min or more and 1 m.
/ Sec is desirable. If the pulling rate is less than 0.1 mm / min, the productivity will be too low. Further, at a pulling rate of 1 m / sec or more, the substrates 4 collide with each other, so that the substrates 4 are easily scratched and uneven coating is also increased. The base forming liquid 25 may be water or an organic solvent as a solvent, but it is desirable that the concentration is 0.1% by weight or more and less than 80% by weight. When the amount is 0.1% by weight or less, the drying time of water or the organic solvent becomes long and the productivity is lowered. 80% by weight
In the above cases, coating unevenness may occur.
In the case of dip coating, the viscosity of the base forming liquid 25 is preferably 0.5 centipoise or more and less than 100 poise. If the viscosity is lower than 0.5 cp or high viscosity is 100 poise or more, printing unevenness may occur. Note that, in FIG. 5, the drips 26 are shown in order to show the state of the dip coating in an easy-to-understand manner, but it is desirable that the drips 26 are not generated in the actual process. This is because when the drop 26 occurs, the drop 26
This is because there is a possibility that thickness unevenness may occur particularly in the lower portion of the ceramic substrate 4 depending on whether or not it falls. Depending on the size and surface roughness of the ceramic substrate 4, the drips 26 may cause uneven thickness. In such a case, it is desirable to add various additives for reducing the surface tension and liquid breakage to the underlayer forming liquid 25, or to lower the pulling rate (for example, 5 mm / sec or less).

[0053]

As described above, the present invention is a ceramic multilayer substrate in which at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least the surface of the electrode is provided with a burnable underlayer. By forming the base layer, it is possible to print with high accuracy even with an ink jet ink for forming electronic parts, which easily bleeds or repels easily.

[Brief description of drawings]

1A and 1B are perspective views showing a manufacturing process of an embodiment of the present invention, respectively, and FIG. 1C is a sectional view taken along line AB of FIG. 1B.

2A is a perspective view of a ceramic multilayer substrate showing the effect of the present invention, and FIG. 2B is an analysis diagram thereof.

3A to 3D are cross-sectional views showing the same manufacturing process.

4 (e) to 4 (h) are cross-sectional views showing the same manufacturing process.

5 (a) to 5 (c) are perspective views showing a manufacturing process according to an embodiment of the present invention.

6A and 6B are perspective views showing a conventional manufacturing process, and FIG. 6C is a sectional view taken along line AB of FIG. 6B.

7A to 7D are cross-sectional views showing a conventional manufacturing process.

[Explanation of symbols]

1 Inkjet printing device 2 electrode ink 3 arrows 4 Ceramic multilayer substrate 5 electrode pattern 6 Inner layer electrode 7 Surface electrode 8 Deformed electrode pattern 9 pinholes 10 Blurred electrode pattern 11 Rolled electrode 12 contracted electrodes 13 Burnable underlayer 15 resistor pattern 16 Deformed resistor pattern 17 Dielectric pattern 18 Deformed dielectric pattern 19 crack 20 Dielectric layer 21 Deformed dielectric layer 22 Evaluation electrode 23 Measuring machine 24 jigs 25 Underlayer forming liquid 26 Shizuku

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Claims (6)

[Claims] 1. A ceramic multilayer substrate in which a burnable underlayer is provided on at least the surface of the electrode of a ceramic multilayer substrate body having at least one electrode provided on the surface. 2. A ceramic multilayer substrate having at least one electrode provided on the surface thereof is coated with a solution containing a resin or latex on at least the surface of the electrode using an ink jet printer, a coater or a printer. And a method for manufacturing a ceramic multilayer substrate which is then dried. 3. An ink jet printing apparatus is used on the surface of the burnable underlayer of a ceramic multilayer substrate in which at least one electrode is provided on the surface of the ceramic multilayer substrate body and at least the surface of the electrode is provided with a burnable underlayer. Forming a predetermined pattern with an electrode ink, and then firing the ceramic multilayer substrate having the pattern formed thereon. 4. An ink jet printing apparatus is used on the surface of the burnable underlayer of the ceramic multilayer substrate, wherein at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least the burnable underlayer is provided on the surface of the electrode. To form a predetermined pattern with resistance ink, and then to sinter the ceramic multilayer substrate having the pattern formed thereon. 5. An ink jet printing apparatus is used on the surface of the burnable underlayer of the ceramic multilayer substrate, wherein at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least the surface of the electrode is provided with a burnable underlayer. To form a predetermined pattern with ceramic ink or glass ink, and then to sinter the ceramic multilayer substrate with the pattern formed thereon. 6. An ink jet printing apparatus is used on the surface of the burnable underlayer of the ceramic multilayer substrate, wherein at least one electrode is provided on the surface of the ceramic multilayer substrate body, and at least the surface of the electrode is provided with a burnable underlayer. Electrode ink, resistor ink, ceramic ink, glass ink to form a predetermined pattern,
Then, a method of manufacturing an electronic component, in which the ceramic substrate on which the pattern is formed is fired.