JP2003247031A - Refining method for removing residual lead and the like from recycled (regenerated) lead-free solder (solder containing tin as main component and no lead) - Google Patents
Refining method for removing residual lead and the like from recycled (regenerated) lead-free solder (solder containing tin as main component and no lead)Info
- Publication number
- JP2003247031A JP2003247031A JP2002093259A JP2002093259A JP2003247031A JP 2003247031 A JP2003247031 A JP 2003247031A JP 2002093259 A JP2002093259 A JP 2002093259A JP 2002093259 A JP2002093259 A JP 2002093259A JP 2003247031 A JP2003247031 A JP 2003247031A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- free solder
- tin
- solder
- recycled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 40
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 4
- 238000007670 refining Methods 0.000 title abstract description 3
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 15
- 230000005496 eutectics Effects 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000010953 base metal Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、環境問題による半
田の鉛フリー化(有毒な鉛を使わない)に伴う鉛フリー
半田再生材の混入鉛等の除去精錬方法。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing and refining lead and the like mixed in a lead-free solder reclaimed material due to lead-free solder (without using toxic lead) due to environmental problems.
【0002】[0002]
【従来の技術】従来の半田は大部分が鉛入り半田でした
ので、再生しても鉛を除去する必要がありませんでし
た。[Prior Art] Most of the conventional solders are lead-containing solders, so it is not necessary to remove lead even after recycling.
【0003】[0003]
【発明が解決しようとする課題】従来、半田とは鉛入り
半田を指す言葉でしたが、最近は鉛の毒性が問題とな
り、鉛を使わない鉛フリー半田に半田の使用が移行しだ
しております。鉛フリー半田は錫を主成分としているの
で、再生リサイクルしようとしても、鉛が少量混入して
いたら(一般的に鉛分0,1%以下)せっかく再生した
鉛フリー半田が鉛を含有していて使えない。鉛フリー半
田としてリサイクルすることが出来ないと言う結果とな
ります。半田の製造現場、使用現場が同一な訳ですか
ら、鉛を含んだ鉛半田が、鉛を含まない鉛フリー半田に
混入するのは自然な事だとも言えます。現在主流の一般
的な鉛フリー半田は高価である銀を多く含み、錫もまた
高価な金属です。資源を無駄にしない為、また環境問題
の上からもリサイクルによる再使用は必要と考えられま
す。In the past, solder was a term for solder containing lead, but recently, the toxicity of lead has become a problem, and the use of solder has begun to shift to lead-free solder that does not use lead. I will. Since lead-free solder has tin as a main component, even if you try to recycle and recycle, if a small amount of lead is mixed (generally, the lead content is 0.1% or less), the regenerated lead-free solder contains lead. Not available. The result is that it cannot be recycled as lead-free solder. Since the manufacturing site and the usage site of the solder are the same, it can be said that it is natural that lead solder containing lead is mixed with lead-free solder containing no lead. Common lead-free solders, which are currently mainstream, contain a lot of expensive silver, and tin is also an expensive metal. It is considered necessary to recycle by reusing it because it does not waste resources and is environmentally friendly.
【0004】[0004]
【課題を解決するための手段】上記の問題を解決するた
めには、再生した再生鉛フリー半田地金から混入鉛を除
去すればよい訳ですから、錫の金属的な性質と、金属の
融点差を利用して鉛等を除去します。錫は融点に近い温
度まで熱すると非常に脆くなり、少しの衝撃で割れま
す。(割れた錫を割れ錫と言う)割れた面には錫結晶が
見られ錫の純度が高いほど錫の結晶は大きく粗くなりま
す。鉛フリー半田は錫が主成分ですから、回転ドラム等
で融点に近い温度を保持して、回転させれば鉛フリー半
田(融点は一般的には200度前後)は細かく割れ、割
れ錫となり、鉛等は錫と共晶体(鉛と錫の共晶体は融点
183度)を作り、共晶体の融点が鉛フリー半田融点よ
り低い共晶体と、低融点物質は溶出いたします。溶出物
を除去し、残存金属を成分調整すれば、同じ鉛フリー半
田として再利用する事が出来、また再生鉛フリー半田の
利用価値を上げる事ともなります。[Means for Solving the Problems] In order to solve the above problems, it is necessary to remove the mixed lead from the regenerated regenerated lead-free solder metal. Is used to remove lead, etc. When tin is heated to a temperature close to its melting point, it becomes extremely brittle and cracks with a slight impact. (Cracked tin is called cracked tin) Tin crystals are seen on the cracked surface, and the higher the purity of tin, the larger and coarser the tin crystals. Since lead-free solder is mainly composed of tin, if you keep it at a temperature close to the melting point with a rotating drum etc. and rotate it, the lead-free solder (melting point is generally around 200 degrees) will be finely cracked and broken tin, Etc. make a eutectic with tin (the eutectic of lead and tin has a melting point of 183 ° C), and the eutectic with a melting point lower than that of the lead-free solder and the low-melting substance will be eluted. By removing the eluate and adjusting the composition of the residual metal, it can be reused as the same lead-free solder, and it will also increase the utility value of recycled lead-free solder.
【0005】[0005]
【発明の実施の形態】鉛フリー半田を小塊にし、小孔を
開けた回転ドラム等に入れてゆっくりと回転させなが
ら、入れた鉛フリー半田の融点に近い温度を保持すれ
ば、融点が保持温度より低い鉛等の共晶体および低融点
物質は溶出し。小孔より流出して来ます。BEST MODE FOR CARRYING OUT THE INVENTION If the lead-free solder is made into a small lump, and is put in a rotary drum or the like having small holes and is rotated slowly while maintaining a temperature close to the melting point of the put lead-free solder, the melting point is maintained. Eutectics such as lead below the temperature and substances with low melting points will not elute. It flows out from the small hole.
【0006】その際、回転ドラム内部にブレードを取り
付け、金属塊をより高い適当な位置より落下させる事に
より、割れ錫生産を効率よく行うことが出来ます。なお
金属塊を落下させる位置はブレードの幅で調節すること
ができます。[0006] At that time, by mounting a blade inside the rotary drum and dropping the metal block from a higher appropriate position, the cracked tin can be efficiently produced. The position where the metal block is dropped can be adjusted by the width of the blade.
【0007】連続作業をする為には、温度を鉛フリー半
田の融点よりわずかに低く保持し、回転ドラムを傾けて
回転させ、内部の鉛フリー半田塊を少しずつ後ろに送
る。または、回転ドラムは水平のまま、ドラム内部のブ
レードをスクリュー状に取り付けて鉛フリー半田小塊を
後方に送る。あるいはドラムを固定し、圧送スクリュー
で鉛フリー半田小塊をゆっくり回転させながら後方に送
りつつ溶融物を採取し、残留物を溶解釜へ自動投入し溶
解して、成分調整の為サンプルを取り、鋳型に鋳込み素
地金といたします。For continuous operation, the temperature is kept slightly lower than the melting point of the lead-free solder, the rotary drum is tilted and rotated, and the lead-free solder mass inside is gradually fed backward. Alternatively, while the rotating drum remains horizontal, the blade inside the drum is attached in a screw shape to send the lead-free solder blobs backward. Alternatively, the drum is fixed, the lead-free solder blobs are slowly rotated by the pressure-feeding screw, and the melt is sampled while sending backward, and the residue is automatically charged into the melting pot and melted, and samples are taken for component adjustment, We will cast it into a mold and use it as a base metal.
【0008】とったサンプルを分析し、素地金を溶解、
必要不足成分を添加して、元の鉛フリー半田に再生す
る。Analyzing the sample taken, melting the base metal,
Add necessary and deficient components to regenerate the original lead-free solder.
【0009】採取した溶出物は鉛を添加、一般の鉛半田
に使うか、鉱山等に送り成分金属を分離、リサイクル使
用する。The extracted eluate is added with lead and used for general lead solder, or sent to a mine or the like to separate and recycle the component metals.
Claims (2)
錫の製造方法。1. A method for producing cracked tin at a temperature close to the melting point of lead-free solder.
ビスマス等の共晶体との融点差を利用した鉛、ビスマス
等の分離方法。2. A method for separating lead, bismuth, etc., which utilizes the difference in melting points between recycled lead-free solder and mixed lead, and a eutectic such as bismuth as a component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002093259A JP2003247031A (en) | 2002-02-22 | 2002-02-22 | Refining method for removing residual lead and the like from recycled (regenerated) lead-free solder (solder containing tin as main component and no lead) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002093259A JP2003247031A (en) | 2002-02-22 | 2002-02-22 | Refining method for removing residual lead and the like from recycled (regenerated) lead-free solder (solder containing tin as main component and no lead) |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003247031A true JP2003247031A (en) | 2003-09-05 |
Family
ID=28671738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002093259A Pending JP2003247031A (en) | 2002-02-22 | 2002-02-22 | Refining method for removing residual lead and the like from recycled (regenerated) lead-free solder (solder containing tin as main component and no lead) |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003247031A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101006936B1 (en) | 2008-07-11 | 2011-01-10 | 한국생산기술연구원 | How to remove lead from tin alloy |
JP2012246532A (en) * | 2011-05-27 | 2012-12-13 | Panasonic Corp | Metal processing method |
CN103255297A (en) * | 2013-05-22 | 2013-08-21 | 中南大学 | Treatment method of tin anode slurry |
WO2016076764A1 (en) * | 2014-11-12 | 2016-05-19 | Денис Александрович ВТУЛКИН | Device and method for recovering tin-lead solder from scrap |
-
2002
- 2002-02-22 JP JP2002093259A patent/JP2003247031A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101006936B1 (en) | 2008-07-11 | 2011-01-10 | 한국생산기술연구원 | How to remove lead from tin alloy |
JP2012246532A (en) * | 2011-05-27 | 2012-12-13 | Panasonic Corp | Metal processing method |
CN103255297A (en) * | 2013-05-22 | 2013-08-21 | 中南大学 | Treatment method of tin anode slurry |
WO2016076764A1 (en) * | 2014-11-12 | 2016-05-19 | Денис Александрович ВТУЛКИН | Device and method for recovering tin-lead solder from scrap |
RU2600156C2 (en) * | 2014-11-12 | 2016-10-20 | Денис Александрович Втулкин | Method of extracting tin-lead solders from scrap electronic printed circuit boards and device therefor |
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