JP2003232966A - Photoelectric back plane board and information processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoelectric back plane board which simplifies positioning and fixing an optical data bus and improves the assembling workability and enables easy connection between a circuit board for optical communication and a light emitting element as well as a light receiving element and easy signal input/output and feed to the circuit board. <P>SOLUTION: A projecting part 42 for positioning of an optical data bus 40 is inserted to an optical data bus fixing hole 23 formed on a cover plate 20 to position and fix the optical data bus 40, and the cover plate 20 is placed on a printed circuit board 30. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal light input / output unit by forming one side of a long, plate-shaped light transmissive material in a staircase shape and inclining its end face to approximately 45 degrees with respect to the plate surface. The present invention relates to a backplane board using an optical data bus formed by the above as a signal transmission medium, and an information processing apparatus using the backplane board.

[0002]

2. Description of the Related Art Conventionally, a backplane board (motherboard) and a plurality of nodes (daughter boards) are used.
In order to improve the processing capability of a signal processing device that employs a parallel architecture, the bandwidth is being improved by increasing the bus speed and increasing the number of bits.

Signal processing devices adopting such a parallel architecture are required to have a higher speed. However, in order to realize a higher speed with conventional electrical wiring, noise and noise are generated on the mother board and the daughter board. A circuit board design considering delay is required. Further, although the wiring becomes complicated, an optical fiber connection has been introduced for speeding up.

As described above, while the speed of the conventional signal processing device by electric wiring is increased, the speed of the signal processing device by the optical connection technique in the system called optical interconnection is being studied.

For example, the Institute of Electronics, Information and Communication Engineers, Vol. 7
9 (No. 9), pp. 907-909, September 1996.
Moon, "Optical interconnection technology and its application" (Osamu Wada), Journal of Japan Institute of Electronics Packaging, Vol. 1, N
o. 3 (1998), pp. 176-179, "The world of computers that changes with optical interconnection" (Masatoshi Ishikawa), various forms of optical interconnection technology have been proposed depending on the system configuration.

However, in the above-mentioned optical interconnection using the optical fiber as a signal transmission medium, it is necessary to position the optical coupling portion with high accuracy, and further, when the interconnection of multiple nodes is performed by the optical fiber. Since the wiring becomes complicated, there are problems that the assembling workability is poor and the mounting cost is high.

As a technique for solving this problem, 2000
, 25th Optical Symposium, Lecture No. 8, “Study of Backplane Optical System and Application to Optical Data Bus” (Junji Okada et al.), Optical Data Bus 80 as shown in FIG.
Was proposed. 6A and 6B are explanatory views of the optical data bus 80. FIG. 6A is a plan view of the optical data bus 80 as viewed from above, FIG. 6B is a side view, and FIG. 6C is an optical data bus 80.
It is explanatory drawing which shows the principle which performs optical transmission using.

The optical data bus 80 is made of a long, plate-shaped light-transmitting material (for example, a light-transmitting resin made of acrylic having a refractive index of 1.49, olefin polymer having a refractive index of 1.525, etc.). , A transparent transmission medium that transmits signal light in the longitudinal direction by repeating internal reflection.

As shown in FIG. 6A, the optical data bus 80 has one side along the longitudinal direction of a rectangular resin flat plate.
It has a shape in which a light emitting element (for example, a laser diode LD) or a light receiving element (photodiode PD) is formed stepwise from one end side to the other end in the longitudinal direction at intervals that can be arranged.

Further, as shown in FIG. 6 (b), each end face of one end in the longitudinal direction, which is formed in a stepwise manner, is arranged with respect to the plate face.
The signal light entrance / exit portion 82 is formed by inclining it by 5 degrees.

To perform optical transmission using the optical data bus 80, as shown in FIG. 6C, the optical data bus 80 is used.
On the rear end surface opposite to the signal light entrance / exit portion 82 of
A reflection diffusion section (for example, a light diffusion film) 84 having a diffusion angle in the thickness direction of the optical data bus 80 of 0.2 degrees and a diffusion angle in the width direction of 40 degrees is provided, and further, each signal light input / output section 82.
The laser diode LD or the photodiode PD is arranged above the optical disk so that the optical axis thereof is orthogonal to the plate surface of the optical data bus 80.

In this state, the laser diode LD arranged in the arbitrary signal light input / output unit 82 is driven to make laser light incident from above the optical data bus 80. Then, the incident light is totally reflected by the end surface inclined by 45 degrees with respect to the plate surface of the optical data bus 80 and transmitted toward the reflection / diffusion section 84, and thereafter, the signal light input / output section 82 is reflected by the reflection / diffusion section 84. Is reflected and diffused toward.

Then, the reflected light is totally reflected by the end faces of the respective signal light input / output sections 82 and emitted from the upper surface of the optical data bus 80. In this way, the signal light emitted from the laser diode LD is transmitted to the photodiode PD arranged above the signal light incident / emitting portion 82, and the laser diode LD and the optical data bus are changed from the current flowing through the photodiode PD. The signal transmitted via 80 can be obtained.

Therefore, if a backplane board using the above optical data bus as a signal transmission medium is put into practical use,
An electronic circuit for generating an electric signal and a light emitting means including a light emitting element for converting the electric signal into a signal light, a light receiving element for converting the signal light into an electric signal, and an electronic circuit for processing the converted electric signal It is possible to realize interconnection of a plurality of circuit boards having at least one of the light receiving means with a simple configuration.

[0015]

In order to use the above optical data bus as a signal transmission medium, how to fix the optical data bus is a problem.

The optical data bus is a transparent transmission medium and transmits the signal light by repeating internal reflection. Therefore, the optical data bus, the light emitting element and the light receiving element are arranged so that the light is totally reflected at the signal light input / output section. Need to be positioned relatively accurately. Further, in optical transmission in the optical data bus, air having a refractive index of 1 is used as the cladding layer, and therefore it is desirable to use no adhesive when fixing the optical data bus.

However, a fixing means suitable for using the staircase-shaped optical data bus as shown in FIG. 6 as a signal transmission medium has not been established yet.

Therefore, as a fixing means of the optical data bus, an optical data bus fixing concave portion which is opened corresponding to the plate shape of the optical data bus is formed on the plate surface of the flat plate, and the optical data bus is inserted. It is conceivable to use a multiple optical data bus fixed substrate in which a positioning portion for positioning and fixing the light emitting element or the light receiving element is formed above each signal light input / output portion of the optical data bus inserted in the recess for use.

That is, the optical data bus is inserted into the optical data bus insertion concave portion formed on the multiple optical data bus fixing substrate and fixed using a predetermined holding member. By utilizing the positioning portion formed on the fixed substrate, the light emitting element and the light receiving element can be positioned and fixed above each signal light input / output portion of the optical data bus inserted in the optical data bus insertion recess. .

If such a multiplex type optical data bus fixed board is used, not only the relative positioning of the signal light input / output section of the optical data bus with the light emitting element and the light receiving element can be performed very easily, but also When fixing the optical data bus, it is not necessary to use an adhesive, and the above-mentioned requirements can be sufficiently satisfied.

However, when actually performing optical communication using the optical data bus fixed to the multiplex type optical data bus fixing substrate, the light emitting element and the light receiving element whose relative positions to the optical data bus are positioned are used. It is necessary to connect to a plurality of circuit boards (the above-mentioned daughter boards) and perform the light emitting element drive processing and the light receiving signal processing for each circuit board.

Therefore, when the relative positions of the optical data bus and the light emitting element and the light receiving element are positioned by using the above-described multiple optical data bus fixed substrate, the positioned light emitting element and light receiving element and the positioned light emitting element and the light receiving element are used. Therefore, there is a problem of how to connect with each circuit board that actually performs optical communication and how to control the signal processing executed in each circuit board.

That is, in order to perform optical communication between a plurality of circuit boards by using the light emitting element and the light receiving element whose relative position to the optical data bus is positioned via the above-mentioned multiple optical data bus fixed board, It is necessary to adjust the synchronization of the light emitting element drive processing and light receiving signal processing executed on each circuit board between the circuit boards, and in order to do so, it is necessary to distribute various control signals such as synchronization signals to each circuit board. However, in order to simplify the signal supply to each circuit board, it is necessary to connect the light emitting element and the light receiving element, which are positioned and fixed on the multiple optical data bus fixing board, to each circuit board. The question has arisen about what to do.

Further, it is necessary to supply power to each circuit board, but if a dedicated power supply line is used for this power supply,
Since the wiring work is troublesome, the power supply function to each circuit board is added to the multiple optical data bus fixed board, and when each circuit board is mounted on the multiple optical data bus fixed board, the multiple optical data bus is attached. It is also necessary to be able to supply power from the fixed board to each circuit board.

In the opto-electrical backplane board in which this multiplex type optical data bus fixed board is mounted on the printed wiring board, the signal light input / output section of each optical data bus arranged substantially linearly on the printed wiring board is provided. As one group, one optical connector (in other words, a circuit board) is assigned to the signal light input / output units of one or more groups, and each optical connector and the circuit board mounted on each optical connector are printed wiring boards. Above, it is arranged so as to straddle (in other words, cross) each optical data bus.

On the printed wiring board, a plurality of electric connectors for supplying power or inputting / outputting signal light to / from each of the circuit boards arranged in this manner are fixed. Via electrical connector
Power supply or signal input / output to each circuit board is performed.

According to such an opto-electrical backplane board, the optical data is fixed by using the multiple optical data bus fixed board or the printed wiring board and the positioning portion provided on the multiple optical data bus fixed board. Not only can the relative position between the bus and the light emitting element and light receiving element held by the optical connector be easily positioned, but the circuit board mounted on the optical connector can also be fed with power or signals can be input from the printed wiring board via the electrical connector. Output can be done.

Therefore, according to this opto-electric backplane board, it is possible to construct an information processing device capable of performing high-speed data communication between a plurality of circuit boards using the optical data bus very easily. Becomes

However, the following problems have been found in the manufacture of the multiple optical data bus fixed substrate. (1) In order to secure the relative positional accuracy between the optical data bus and the light emitting element and the light receiving element, a high processing accuracy is required to form the optical data bus insertion recess of the multiple optical data bus fixed substrate. Then, the cost will increase again. (2) Since a plurality of holding members are required to fix the optical data bus in the optical data bus insertion recess, the assembly workability is low and the cost is high.

The present invention has been made in view of the above problems, and in the above-mentioned fixing of the optical data bus, positioning and fixing of the optical data bus is simplified, the assembling workability is improved, and the optical communication is performed. An optoelectronic backplane board that can easily connect the circuit board to the light emitting element and the light receiving element and to input / output signals to / from the circuit board and supply power.
Another object of the present invention is to provide an information processing device using this optoelectric backplane board.

[0031]

Means for Solving the Problems and Effects of the Invention The optoelectronic backplane board according to claim 1 made to solve the above problems comprises (1) a long and plate-shaped light-transmitting material. , One side along the longitudinal direction is formed stepwise at intervals enabling arrangement of the light emitting element or the light receiving element from one end side to the other end in the longitudinal direction, and the one end side in the longitudinal direction formed in the stepwise shape By inclining each of the end faces of the plate surface with respect to the plate surface by about 45 degrees, a signal light input / output section is formed, and a plurality of alignment projections are provided on the plate surface.
And, the optical data bus in which the reflection / diffusion portion is brought into contact with the end surface on the side opposite to the signal light input / output portion, and (2) the optical data bus by inserting the alignment projection provided in the optical data bus. The optical data bus fixing holes for positioning and fixing the bus are arranged such that, when the optical data bus is inserted, the signal light input / output sections corresponding to each other of the optical data bus are arranged on substantially straight lines, and substantially the same. The light-emitting elements and the light-receiving elements which are formed to have the intervals and which are provided at positions corresponding to the signal light input / output section of the optical data bus when the optical data bus is positioned and fixed. A device package passage hole that is larger than the outer shape of the device package, and the signal light input / output unit of the optical data bus arranged on a substantially straight line as a group with respect to one or a plurality of groups of signal light input / output units. Individual Optical communication is performed via the optical data bus by holding the plurality of light emitting elements and light receiving elements that perform input / output of signal light to and from the above and inputting and outputting electric signals to and from the light emitting elements and the light receiving elements. An optical connector fixing hole for positioning and fixing the optical connector on which the circuit board is mounted is formed, and (3) an optical data bus insertion recess larger than the outer shape of the optical data bus is formed. , An electrical connector for supplying power to or inputting / outputting signals to / from a plurality of circuit boards that perform optical communication with each other via the optical data bus is provided on the plate surface on which the optical data bus insertion recess is formed. A printed wiring board for supplying power or inputting / outputting signals to / from the circuit board through an electric connector, and the optical data bus fixing hole formed in the lid plate is provided with a position of the optical data bus. Projections Insert the for combined, the cover plate, characterized in that it is placed on the printed wiring board.

The optical data bus described in (1) above is shown in FIG.
It has the same plane and side shape as the optical data bus described in (4) above, and is characterized in that a plurality of projections for alignment are provided on the upper part of the plate surface.

The positioning projection is inserted into the optical data bus fixing hole provided in the cover plate described in the above (2) to uniquely determine the fixing position and the arranging direction of the optical data bus. It is provided to decide.

When the signal light is transmitted in the optical data bus, the signal light is slightly emitted to the outside from the alignment projection. In order to suppress the loss of signal light, it is desirable that the shape of the alignment projection of the optical data bus is as small as possible and the number of installations is small. In order to uniquely determine the arrangement direction of the optical data bus, it is sufficient to provide two alignment protrusions.

In the lid plate described in (2) above, the optical data bus fixing holes correspond to each other when the optical data bus fixing holes are inserted into the optical data bus fixing holes. The respective signal light input / output sections are arranged substantially linearly and are formed at substantially equal intervals.

This is because if the signal light input / output sections corresponding to each other in each optical data bus are arranged on a substantially straight line,
On the optical connector side, light emitting elements and light receiving elements that input and output signal light to and from the signal light input / output section of each of the optical data buses are arranged in a line, and the circuit board can be arranged along the arrangement direction. is there.

Further, the signal light input / output units of each optical data bus arranged in a substantially straight line on the printed wiring board are set as a group, and one optical connector (in other words, one optical connector for each of the signal light input / output units). Circuit board) is assigned, and the optical connectors and the circuit boards mounted on the optical connectors are arranged on the printed wiring board so as to straddle the optical data buses, in other words, to cross the optical data buses.

When the hole for fixing the optical data bus is formed in the cover plate as described above, the optical connector and the circuit board are one of the signal light input / output sections arranged in the longitudinal direction of the optical data bus or a predetermined number of adjacent ones. Therefore, the plurality of optical connectors holding the light emitting element and the light receiving element can be commonly used. Further, in particular, as described in the embodiments described later, if the optical data bus fixing holes are formed in the cover plate so that the signal light input / output units of all the optical data buses are arranged in a rectangular lattice pattern, The connector and the circuit board mounted thereon can be aligned along the outer shape of the printed wiring board.

Further, since the optical data bus is covered from above by the cover plate, the optical data bus plate surface is scratched,
It is possible to prevent the adhesion of dust, liquid, etc., and thus prevent the reduction of the transmission efficiency of the signal light.

As described above, in this opto-electric backplane board, when fixing the optical data bus, the lid plate is provided with the alignment projection formed on the optical data bus without using a special holding member. By simply inserting the optical data bus into the hole for fixing the optical data bus, the optical data bus can be fixed easily and with high position accuracy, the number of parts in assembling can be reduced, and the assembling workability can be improved.

Further, when fixing the optical data bus, it is not necessary to press the optical data bus against the wall surface of the optical data bus insertion recess by the holding member, so that a wall surface portion is formed between adjacent optical data buses. The adjacent optical data buses can be arranged close to each other. Therefore, the arrangement density of the optical data buses can be increased.

Further, the cover plate is provided with an optical connector fixing hole as a positioning portion for positioning and fixing a plurality of optical connectors, and further, an optical data bus fixing hole is provided in the printed wiring board. On the formed plate surface,
A plurality of electrical connectors for feeding or inputting / outputting signals to / from a circuit board mounted on an optical connector positioned through an optical connector fixing hole provided on a cover plate are fixed. Then, the printed wiring board performs power supply or signal input / output to / from each circuit board through the electric connector.

Therefore, in this opto-electrical backplane board, not only the relative positions of the optical data bus and the light emitting element and the light receiving element held in the optical connector can be easily positioned, but also with respect to the circuit board mounted in the optical connector. Thus, power supply or signal input / output can be performed from the printed wiring board through the electric connector.

Therefore, if this opto-electric backplane board is used, an information processing apparatus capable of performing high-speed data communication between a plurality of circuit boards (the above-mentioned daughter boards) by utilizing an optical data bus is extremely simple. It is possible to build.

According to a second aspect of the present invention, in the optical backplane board according to the first aspect, the cover plate is formed of a material having the same or substantially the same coefficient of thermal expansion as the optical data bus. Characterize.

By doing so, the degree of expansion and contraction of the lid plate and the optical data bus at the time of heat change can be made the same, and the optical connector can be displaced following the thermal expansion. The relative position of the light emitting element and the signal light input / output section of the optical data bus is deviated, and the communication performance deteriorates.
Can be prevented.

The invention described in claim 3 relates to an information processing apparatus configured by using the optical backplane board according to claim 1 or 2.

This information processing apparatus includes the above-mentioned optical backplane board, a plurality of information devices including a computer,
It is connected to at least one of the above information devices via a signal line, and is electrically connected to the printed wiring board via an electrical connector fixed to the printed wiring board of the opto-electric backplane board. According to the signal input / output from the information equipment and the printed wiring board via the connector, the printed wiring of the opto-electric backplane board and a plurality of circuit boards that perform optical communication via the optical data bus fixed on the printed wiring board. A plurality of light emitting elements for individually inputting / outputting signal light to / from one or a plurality of groups of light input / output units, with the signal light input / output units of each optical data bus arranged in a substantially straight line on the substrate as a group, and A plurality of optical connectors that hold the light receiving element and that support each of the above-mentioned circuit boards so that an electric signal can be input to and output from the light emitting element and the light receiving element. That.

According to the information processing apparatus having the above-mentioned structure, the signal light can be efficiently transmitted to the backplane board for transmitting and receiving the signal between the plurality of information devices including the computer. Using the opto-electric backplane board of the present invention, an electric signal input / output to / from each information device is once converted into a signal light by a circuit board and the signal is transmitted.

From this fact, this information processing apparatus has less crosstalk generated in the electric wiring like the conventional information processing apparatus for transmitting signals between information devices by using the electric wiring, and further, the optical processing is possible. Since the transmission is performed, the signal waveform is less disturbed due to the influence of electromagnetic radiation noise from the outside, and extremely stable signal transmission is possible. Further, by increasing the reaction speed of the light emitting element and the light receiving element, it becomes possible to perform high-speed data transmission at a level that is difficult to realize by electrical transmission.

Further, the opto-electric backplane board has
The optical connector and the circuit board can be mounted through the optical connector fixing hole formed in the lid plate that constitutes this, and the power supply to the circuit board or the signal input / output of various control signals is fixed to the printed wiring board. Since it can be directly performed from the printed wiring board via the electric connector, workability in assembling the information processing apparatus of the present invention can be improved.

[0052]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following description, FIG. 1 shows the overall configuration of an optoelectronic backplane board 10 of an embodiment to which the present invention is applied, (a) is a perspective view of the optoelectronic backplane board, and (b) and (c). 8A is a cross-sectional view showing a state when the optoelectronic backplane board is cut along the line bb ′ and the line cc ′ shown in FIG. FIG. 2 is a plan view of the optoelectronic backplane board as seen from above. FIG. 3 is an assembly drawing of the optoelectronic backplane board 10.

As shown in FIGS. 1 and 2, the opto-electric backplane board 10 of this embodiment includes a lid plate 20 made of a synthetic resin flat plate, a printed wiring board 30, and a plurality of (in this embodiment, 4 Optical data bus 40.

The cover plate 20 is the printed wiring board 3
0, and the cover plate 20 in the printed wiring board 30
A plurality of (three in the present embodiment) electric connectors 31a are assembled on the mounting surface.

The cover plate 20 is provided with optical connector fixing holes 22 for positioning and fixing a plurality of optical connectors 50 on the cover plate 20.

The electrical connector 31a supplies power and inputs / outputs signal to / from the circuit board PK mounted on the plurality of optical connectors 50 positioned and fixed on the cover plate 20 through the optical connector fixing holes 22. It is for doing.

On the printed wiring board 30, a wiring pattern for supplying power to the circuit board PK via the electrical connector 31a and a wiring pattern for inputting and outputting various control signals such as synchronization signals to the circuit board. Is formed, and electronic components for generating power supply voltage and various control signals supplied through these wiring patterns are mounted.

The optical data bus 40 is made of an amorphous polyolefin (coefficient of thermal expansion 6.0 × 10 6) which is a light transmissive resin.
^-5 / ° C.), and similarly to the optical data bus 80 shown in FIG. 6, one side along the longitudinal direction of a rectangular resin flat plate made of a light-transmissive resin is formed in a step shape, and the step shape is formed. The plurality of (six in the present embodiment) signal light input / output portions 41 are formed by inclining the respective end faces on the one end side in the longitudinal direction formed at 4 ° with respect to the plate surface. Then, on the plate surface, a projection 42 for positioning for projecting the optical data bus 40 into the optical data bus fixing hole 23 provided in the cover plate 20 is provided.

The optical data bus 40 may be integrally formed by injection molding an amorphous polyolefin resin. Alternatively, after forming the above resin into a rectangle,
The signal light input / output section 41 may be formed by grinding. Further, the material to be used is not limited to the amorphous polyolefin resin, but a light transmissive resin such as polycarbonate or polymethylmethacrylate, or inorganic glass may be used.

The cover plate 20 is made of synthetic resin (for example, glass fiber).
Fiber-containing polyethylene terephthalate resin (Unitika stock
Company made, product name Unirate, coefficient of thermal expansion (vertical) 4.0 x 1
0 ^-Five/ ℃, (horizontal) 7.4 × 10^-Five/ ° C)),
The diameter is approximately the same as the diameter of the alignment protrusion 42 of the optical data bus 40.
Then, the optical data bus fixing hole 23 is formed. So
Each of the optical data bus fixing holes 23 is shown in FIG.
As described above, the optical data bus 4 is inserted into each optical data bus fixing hole 23.
When the positioning protrusion 42 of 0 is fitted, each optical data
The corresponding signal light input / output units 41 of the bus 40 are arranged in a substantially straight line.
Is placed, and the signal light is input and output in each optical data bus 40.
The arrangement direction of the parts 41 is substantially orthogonal to the straight line (in other words,
By doing so, all the signal light input / output sections 41 are formed in the outer shape of the cover plate 20.
Along the orthogonal grid).

In addition, on the cover plate 20, the projections 42 for aligning the optical data bus 40 are provided in the respective holes 23 for fixing the optical data bus.
Signal light input / output unit 41 of the optical data bus 40 when
So as to be seen from above, an element package passage hole 24 that is larger than the outer shape of the package of the light emitting element or the light receiving element corresponding to the signal light input / output portion 41 is provided. this is,
Assemble the opto-electric backplane board 10 as shown in FIG.
When the optical connector 50 is attached to this, the optical connector 5
The light emitting element and the light receiving element protruding from 0 are the optical data bus 40.
This is so that it can come into contact with the signal light entrance / exit portion 41.

The cover plate 20 also has a holding member 70. This is because when the positioning protrusion 42 of the optical data bus 40 is fitted into the optical data bus fixing hole 23, the end surface (rear end surface) of the optical data bus 40 opposite to the signal light input / output portion 41 is The signal light incident / exiting portion 41 is pressed and urged toward the tip end. As shown in FIG. 2, the holding member 70 allows the optical data bus 4 to be fixed when the alignment protrusion 42 of the optical data bus 40 is fitted into the optical data bus fixing hole 23.
The main body 70c made of synthetic resin or metal fixed to the rear end portion of 0 with screws or the like, and a light diffusion film (for example, Physic
Reflective diffusion sheet from al Optics Corporation, model number "L
ORS0.2 × 40PCB-MB ”) is provided between the reflection type diffusion plate 70a and the main body portion 70c and the reflection type diffusion plate 70a, with the light reflection surface facing outside, and the reflection type diffusion plate 70a. Board 70a
(Refer to the reflection surface of the light diffusion film for details.)
The coil spring 70b is configured to press the optical data bus 40 from the rear end side to the front end side at the same time when the coil spring 70b contacts the rear end surface of the optical data bus 0.

Next, the optical connector fixing hole 22 for positioning and fixing the optical connector 50 in the cover plate 20 is fitted with the positioning protrusion 42 of each optical data bus 40 in the optical data bus fixing hole 23. As a result, the four optical data buses 40 arranged in parallel with each other are formed so as to sandwich the four optical data buses 40, and the optical connector 50 is positioned in the optical connector fixing hole 22 so that the four optical data buses 40 are arranged. It is fixed to the cover plate 20 so as to straddle the optical data bus 40. The thickness of the lid plate 20 in the region where the optical connector fixing hole 22 is formed (hereinafter referred to as the leg portion 25) is thicker than other portions so that the optical connector 50 can be stably fixed to the lid plate 20. ing.

That is, when the optical connector 50 is fixed to the cover plate 20, the four optical signal input / output units 41 arranged in a straight line in each optical data bus 40 are grouped together to form an optical data bus 40. 2 in the longitudinal direction of each optical data bus 40 so that the signal light can be input / output by utilizing the two groups of signal light input / output units 41 adjacent to each other in the longitudinal direction.
A total of eight elements are held, four in each of the optical data buses 40 arranged side by side.

In this embodiment, the optical connector 5
0 is fixed to the cover plate 20 by using the optical connector fixing hole 22 so as to straddle the four optical data buses 40, so that the eight elements held in the optical connector 50 are converted into four pieces. The optical data bus 40 can be simultaneously positioned above two consecutive signal light input / output sections 41.

In the optical data bus 40 of this embodiment, six signal light input / output sections 41 are formed at substantially equal intervals along the longitudinal direction of the optical data bus 40. Three pieces are formed on both sides of each of the four optical data buses 40 arranged side by side. Above each optical data bus 40, three sets of the optical connector fixing holes 22 are used to form three pieces. The individual optical connectors 50 will be arranged.

Next, the structure of the printed wiring board 30 will be described with reference to FIG. The printed wiring board 30 includes a recess 33 for inserting an optical data bus and an electric connector 31.
A and a cutout 32 corresponding to the leg portion 25 of the cover plate 20 are provided.

As shown in FIG. 3, a printed wiring board 30 is provided.
The external shape of the optical data bus insertion concave portion 33 is such that the optical data bus 40 can be easily inserted and the optical data bus 40 does not interfere with the optical data bus 40 even if the optical data bus 40 thermally expands. It is larger than the outer shape of the data bus 40.

The longitudinal length of the optical data bus insertion recess 33 is longer than that of the optical data bus 40 so as not to interfere with the holding member 70 of the cover plate 20. There is.

The distance from the upper surface of the printed wiring board 30 to the bottom surface of the optical data bus insertion recess 33, that is, the depth of the optical data bus insertion recess 33 is slightly larger than the thickness of the optical data bus 40. .

This is because the printed wiring board 30 is covered with the cover plate 20.
The optical data bus 40 is prevented from being obstructed when the optical connector 5 is fixed with screws or the like, and the optical connector 5 is attached to the cover plate 20.
When 0 is positioned and fixed, the light emitting element or the light receiving element protruding from the optical connector 50 presses and urges the optical data bus 40 toward the bottom surface of the optical data bus insertion recess 33. The light emitting element and the light receiving element will be described later. Since the amount of protrusion of the optical connector 50 from the bottom surface of the lower case is limited, if the optical data bus insertion recess 33 is too deep, the optical data bus 40 cannot be pressed onto the bottom surface of the optical data bus insertion recess 33. This is to prevent things.

The plurality (three) of the electrical connectors 31a are provided with the optical connector 50 through the optical connector fixing hole 22 and the cover plate 2.
When the circuit board PK is mounted on the optical connector 50, the optical connector 50 is arranged at a position where it can be connected to the circuit board PK via the electric connector 31b assembled to the circuit board PK (or directly). There is.

Next, the structure of the optical connector 50 will be described with reference to FIG. In FIG. 4, (a) is a plan view of the optical connector 50 seen from above, and (b) is an optical connector 5
0 is a side view when viewed from the side, (c) is a bottom view when the optical connector 50 is viewed from below, and (d) is a cross-sectional view showing a state in which the optical connector 50 is cut along the line DD ′ shown in FIG. It is a figure.

As shown in FIG. 4, the optical connector 50 includes the above eight elements, specifically four light emitting elements (in this embodiment, the laser diode L housed in the CAN package).
D) and four light receiving elements (photodiode PD accommodated in the CAN package in this embodiment), the lower case 52 for accommodating the signal light input / output tip end thereof protruding downward, and the lower case 52. And an upper case 54 fixed to the upper part of the lower case 52 so as to close the upper opening of the.

The lower case 52 is composed of a long box having an open top, and at the bottom thereof eight elements for positioning the four laser diodes LD and the four photodiodes PD, respectively. An insertion hole is provided.
The element insertion holes are formed so as to be arranged in two rows along the longitudinal direction of the lower case, and the four laser diodes LD and the four photodiodes PD are respectively arranged in the element insertion holes of each row. The signal light entrance / exit tip is inserted so as to face outward. Since each of these elements has a brim on the rear end side, even if the elements are inserted into the element insertion holes, the respective elements do not jump out. Further, a pair of rods 56 for inserting into the pair of optical connector fixing holes 22 provided in the cover plate 20 are provided on both sides in the longitudinal direction of the bottom of the lower case 52.

On the other hand, the upper case 54 is the lower case 5
A coil spring 58 for urging the laser diode LD and the photodiode PD positioned at the bottom of the lower case 52 outward from the rear end side thereof is provided for closing the upper opening of 2. ing. Therefore, the laser diode LD held by the optical connector 50
The photodiode PD moves to the inside of the optical connector 50 when the tip end surface protruding from the optical connector 50 hits an external obstacle, and is projected again from the optical connector 50 when the tip end surface is opened. .

Next, on both sides in the longitudinal direction of the upper end surface of the upper case 54, the circuit boards PK for performing data communication using the laser diode LD and the photodiode PD held by the optical connector 50 are set up. A pair of substrate fixing portions 60 are provided.

The board fixing portion 60 is composed of two members for sandwiching the board surface of the circuit board PK, and the circuit board PK inserted between the members is fastened with a screw to fix the optical connector 50. The circuit board PK can be mounted on the top.

Further, in the upper case 54, signal lines connected to the leads of the laser diode LD and the photodiode PD for electrically connecting the circuit board PK and the internal laser diode LD and the photodiode PD. (For example, flat cable) 62 to the optical connector 5
A signal line insertion hole for pulling out above 0 is bored, and the signal line 62 pulled out from this hole is the connector 6
4 is connected to the signal processing circuit formed on the circuit board PK.

Next, a method of assembling the opto-electric backplane board 10 will be described with reference to FIG. First, the alignment protrusion 42 of each optical data bus 40 is fitted into the optical data bus fixing hole 23 of the cover plate 20, and then each optical data bus 4 is inserted.
The holding member 70 is attached to the rear end portion of 0. At this stage, the optical data bus 40 is pressed and urged by the holding member 70 from the rear end side to the front end side.
0 is in a state in which it is difficult to come off from the cover plate 20.

A plurality (4) of optical data buses 40 described above and a plurality (4) of optical data buses 40 corresponding to the optical data buses 40 are provided.
The lid plate 20 including the holding member of the printed wiring board 3
Placed at 0.

As described above, in the optical / electrical backplane board 10 of this embodiment, the optical data bus 40 is positioned and fixed by the cover plate 20 and the optical connector fixing hole 22 formed in the cover plate 20. By using the to position and fix the optical connector 50 above the optical data bus 40, the relative position of the signal light input / output unit 41 of the optical data bus 40 and the laser diode LD or the photodiode PD can be easily and surely. It can be positioned.

The lid plate 20 is a printed wiring board 30.
The optical connector 5 is mounted on the printed wiring board 30.
The electrical connector 31 for the circuit board PK mounted on
An electrical connector 31a for inputting and outputting various control signals such as power supply and synchronization signals via b is fixed.

Therefore, according to the optoelectronic backplane board 10 of this embodiment, not only the relative position between the signal light input / output unit 41 of the optical data bus 40 and the laser diode LD or the photodiode PD can be easily positioned. The power supply and the signal input / output can be performed from the printed wiring board 30 to the circuit board PK mounted on the optical connector 50 through the electric connector 31a.

Therefore, if the opto-electric backplane board 10 of this embodiment is used, an information processing apparatus capable of performing high-speed data communication between a plurality of circuit boards PK by using the optical data bus 40 can be extremely simplified. It is possible to build.

In the opto-electric backplane board of this embodiment, positioning of the plurality of optical data buses 40 is performed by
This can be performed using the lid plate 20 having a simple structure. Further, by positioning the optical data buses 40 using the cover plate 20, the pressing force of each optical data bus 40 can be performed by one holding member 70. Therefore, the optoelectronic backplane board 10 can be realized with a simple configuration.

Since the printed wiring board 30 and the cover plate 20 are formed separately, the coefficient of thermal expansion of the cover plate 20 and the heat of the optical data bus 40 can be selected by appropriately selecting the material of the cover plate 20. The expansion coefficient can be easily matched (or substantially matched).

In this way, the optical connector 50 positioned and fixed on the cover plate 20 is made to have the same degree of expansion and contraction when the cover plate 20 and the optical data bus 40 change due to heat.
Since it can be displaced following this thermal expansion, the relative positions of the laser diode LD and the photodiode PD in the optical connector 50 and the signal light input / output unit 41 of the optical data bus 40 are displaced when the heat changes. It is possible to prevent the communication performance from decreasing.

As described above, when the opto-electric backplane board of this embodiment is used, the optical data bus 40 can be used as a signal transmission medium to connect a plurality of circuits very easily and without causing a transmission loss. It ’s possible,
It is possible to easily realize an information processing device having a parallel architecture that is compatible with high speed and can realize interconnection of multiple nodes with a simple configuration.

Therefore, an example of an information processing apparatus configured by using the opto-electric backplane board 10 of this embodiment will be described next with reference to FIG.

The information processing apparatus shown in FIG. 5 is provided with a computer 91 and two hard disks 92, 93 connected to it as information equipment connected to each other via the opto-electric backplane board 10. Then, from the computer 91, from the data bus of the internal motherboard (or the expansion board connected to the motherboard) to the SC
A cable 95 for inputting / outputting data according to standards such as SI and PCI is drawn out, and a cable 95 for outputting / inputting data according to the same standard is also drawn out from a hard disk. .

On the other hand, three optical connectors 50 are fixed to the opto-electric backplane board 10, and the above-mentioned information devices (computer 91 and hard disks 92, 93) are attached to the board fixing portion 60 of each optical connector 50. ) Corresponding to the circuit board PK is fixed.

Each of these circuit boards PK operates by being supplied with power and various control signals from the printed wiring board 30 via the above-mentioned electric connector 31b, and operates in accordance with corresponding information equipment (computer 91 or hard disks 92, 9).
According to the output data from 3), a drive signal for driving the laser diode LD in the optical connector 50 is generated to drive the laser diode LD, and the received light signal output from the photodiode PD in the optical connector 50 is handled. The information device (computer 91 or hard disks 92, 93) converts the data into readable data and outputs the data to the information device (computer 91 or hard disks 92, 93). A processing IC 66 and other electronic components are mounted.

At the end of each circuit board PK opposite to the optical connector 50, a connector 94 for connecting a cable for data transmission drawn from the above information equipment (computer 91 and hard disks 92, 93). Is provided, and each circuit board PK and the corresponding information equipment (computer 91 or hard disks 92, 93) are connected to each other via this connector 94 and a cable 95 which is a signal line so as to be capable of data transmission. There is.

In the information processing apparatus thus configured, the computer 91 or the hard disk 92,
When the data is output from 93 to the circuit board PK, the output data is signal-processed by the corresponding circuit board PK, and the laser diode LD in the optical connector 50 to which the circuit board PK is fixed outputs the output data. Driven accordingly. As a result, the laser diode LD held by the optical connector 50 emits signal light corresponding to the output data, which is the optoelectronic backplane board 10.
It is incident on the signal light input / output unit 41 of the optical data bus 40 inside.

In this opto-electric backplane board 10, the optical data bus 40 is arranged as shown in FIG. 2B, and the signal light from the above-mentioned laser diode LD is rear end in the optical data bus 40. Is transmitted in the direction
It is reflected by the reflection type diffusion plate 70a which is brought into contact with the rear end surface of the optical data bus 40 by the holding member 70, and is returned to the front end direction of the optical data bus 40. Then, the returned signal light is emitted from the respective signal light input / output units 41 of the optical data bus 40 toward the upper side of the optical data bus 40.

The emitted signal light is incident on the photodiode PD arranged above each signal light incident / emission unit 41 and converted into an electric signal.

Then, the electric signal is transmitted to each circuit board PK.
Then, after being converted into data to be transmitted to the corresponding information device (computer 91 or hard disks 92, 93), the information device (computer 9
1 or hard disk 92, 93).

That is, according to the information processing apparatus shown in FIG. 5, when the computer 91 outputs data to the corresponding circuit board PK in order to store or read data in the hard disks 92, 93, The output data passes through the circuit board PK, the laser diode LD in the optical connector 50, the optoelectronic backplane board 10 (specifically, the optical data bus 40), the photodiode PD in the optical connector 50, and the circuit board PK, and the hard disk. The data is transmitted to the computers 92 and 93, and in response to the data request from the computer 91, the data is transmitted from the hard disks 92 and 93 to the computer 91 by a route reverse to this.

Then, in the information processing apparatus shown in FIG.
The computer 91 and the hard disk 9 are equipped with the opto-electric backplane board 10 that can efficiently transmit the signal light.
Since it is possible to transmit data between 2, 93,
The data transmission quality can be improved as compared with an information processing apparatus that connects a plurality of information devices with electrical wiring. Further, by increasing the speed of the light emitting element and the light receiving element, it becomes possible to perform high-speed data transmission at a level that is difficult to achieve by electrical transmission.

Since the circuit board PK is fixed to the opto-electric backplane board 10 via the optical connector 50, the circuit board PK is fixed to the opto-electric back plane board 10 or the opto-electric back plane board. When removing the circuit board PK from the circuit board 10,
If the circuit board PK is attached and detached from the opto-electric backplane board 10 while K is attached to the optical connector 50, the attaching and detaching work can be performed very easily.

When the circuit board PK is fixed to the optoelectronic backplane board 10 (specifically, on the cover plate 20) via the optical connector 50, at the same time, the optoelectronic backplane board 10 (specifically, the printed wiring board). The circuit board PK is connected to the printed wiring board 30 via the electric connector 31a fixed on the upper side 30) and receives power and various control signals from the printed wiring board 30.
In addition, wiring for supplying power and inputting / outputting signals is not required, which also makes it possible to simplify the work of attaching / detaching the circuit board PK to / from the optoelectronic backplane board 10.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and various modes can be adopted.

For example, in the above embodiment, the coil spring 70b of the holding member 70 may be changed to a cushioning material made of rubber or the like or another spring material.

Further, in the above-described embodiment, it is explained that eight optical data bus fixing holes 23 are formed in the cover plate 20 so that the opto-electric backplane board 10 has four optical data buses 40. However, the number of the optical data buses 40 and the number of the optical data bus fixing holes 23 may be appropriately set depending on the application of the optoelectronic backplane board.

In the above embodiment, the optical data bus 40 is used.
Although it has been described that the two projections 42 for alignment are provided on the plate surface of the above, three or more projections 42 for alignment are provided for the optical data bus 40. Alternatively, if the holding member 70 is sufficiently positioned and fixed, the number of alignment protrusions may be one.

Further, in the above embodiment, the optical data bus fixing hole 23 has been described as a hole penetrating the cover plate 20, but it may be a non-through hole.

Further, in the above embodiment, the material of the cover plate 20 has been described as synthetic resin, but it may be metal.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of an optoelectronic backplane board according to an embodiment.

2A and 2B are a plan view and a cross-sectional view of an optoelectronic backplane board of an embodiment as seen from above.

FIG. 3 is an assembly diagram of an optoelectronic backplane board according to an embodiment.

FIG. 4 is an explanatory diagram showing a configuration of an optical connector mounted on the optoelectronic backplane board of the embodiment.

FIG. 5 is an explanatory diagram illustrating an example of an information processing device configured using the optoelectronic backplane board according to the embodiment.

FIG. 6 is an explanatory diagram showing a configuration of a conventional optical data bus and a usage state thereof.

[Explanation of symbols]

10 Optoelectronic backplane board 20 lid plate 22 Optical connector fixing hole 23 Optical data bus fixing hole 24 element package passage hole 25 legs 30 printed wiring board 31a electrical connector 31b electrical connector 32 hollow 33 Optical data bus insertion recess 40 optical data bus 41 Signal light input / output unit 42 Alignment protrusion 50 optical connector 52 lower case 54 upper case 56 rod 58 coil spring 60 PCB fixing part 62 signal line 64 connector 66 IC 70 holding member 70a reflective diffuser 70b coil spring 70c main body 80 optical data bus 82 Signal light input / output section 84 Reflective Diffuser 91 Computer 92 hard disk 93 hard disk 94 connector 95 cable LD laser diode PD photodiode PK circuit board

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H037 AA01 BA02 BA11 CA37 CA39                       DA03 DA06 DA11                 5F089 AA01 AB20 AC02 AC16 CA20

Claims (3)

[Claims] 1. A long, plate-shaped light-transmissive material, and one side along the longitudinal direction is stepwise with an interval at which a light emitting element or a light receiving element can be arranged from one end side to the other end in the longitudinal direction. And the end faces of the one end in the longitudinal direction, which are formed in a stepwise manner, are inclined by approximately 45 degrees with respect to the plate surface, thereby forming a signal light input / output section, and further, at the upper part of the plate surface. An optical data bus provided with a plurality of alignment protrusions, and a reflection / diffusion portion is in contact with the end face opposite to the signal light incident / emission portion, and an alignment protrusion provided on the optical data bus. When the optical data bus is inserted, the corresponding signal light input / output sections of the optical data bus are arranged in a substantially straight line when the optical data bus is inserted. They are arranged and formed so that they are arranged at substantially equal intervals. In addition, when the optical data bus is positioned and fixed, it is provided at a position corresponding to the signal light input / output section, and from the outer shape of the package of the light emitting element or the light receiving element corresponding to the signal light input / output section of the optical data bus. Also, a large device package passage hole and the signal light input / output unit of the optical data bus arranged on a substantially straight line as a group,
A plurality of light emitting elements and light receiving elements for individually inputting / outputting signal light to / from one or more groups of signal light input / output sections are held, and input / output of electric signals to / from the light emitting elements and light receiving elements. An optical connector fixing hole for positioning and fixing an optical connector for mounting a circuit board for performing optical communication through the optical data bus by performing the operation, and a light larger than the outer shape of the optical data bus. A recess for data bus insertion is formed, and power or signal input to a plurality of circuit boards that perform optical communication with each other is performed on the plate surface on which the recess for optical data bus insertion is formed. The optical data formed on the cover plate is provided with an electric connector for outputting, and a printed wiring board for supplying power to the circuit board or for inputting / outputting signals through the electric connector. The optical data bus is characterized in that the optical data bus positioning protrusion is inserted into the fixing hole to fix and position the optical data bus, and the lid plate is placed on the printed wiring board. Backplane board. 2. The optoelectronic backplane board according to claim 1, wherein the cover plate is formed of a material having a thermal expansion coefficient that is the same as or substantially the same as that of the optical data bus. 3. The opto-electrical backplane board according to claim 1 or 2, a plurality of information devices including a computer, and at least one of the information devices connected to each other via a signal line, and the optical device. It is electrically connected to the printed wiring board through the electric connector fixed to the printed wiring board of the electric backplane board, and is input from the information device and the printed wiring board through the signal line and the electric connector. According to the output signal, a plurality of circuit boards that perform optical communication via the optical data bus fixed on the printed wiring board and a plurality of circuit boards arranged in a substantially straight line on the printed wiring board of the optoelectronic backplane board. The signal light input / output units of each of the optical data buses are grouped into one group or a plurality of groups are individually transmitted to the signal light input / output units. Holding a plurality of light emitting elements and light receiving elements for inputting and outputting the signal light, and each of the circuit boards,
An information processing device comprising: a plurality of optical connectors that support input and output of electrical signals to and from the light emitting element and the light receiving element.