JP2003227849A - Probe element and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a probe element having a large height dimension from a tip of a projection to a connection portion to a connection land. A method of manufacturing a probe element includes a first step of preparing a base having a main surface and having one or more recesses in the main surface, and laminating two or more film-shaped dry photoresists. A second step of forming a first photoresist layer on the main surface, the first photoresist layer having a protrusion reaching the recess by penetrating the first photoresist layer in a thickness direction thereof; It is characterized by including.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe element used as a probe or a contact used in an electric current test of an integrated circuit or a display panel, and a manufacturing method thereof.

[0002]

2. Description of the Related Art A flat plate-like object to be inspected, such as an integrated circuit, is generally subjected to an energization test using a probe device such as a probe card. As one of this kind of probe device,
Some use a plurality of probe elements each including a columnar portion, an arm portion extending from one end of the columnar portion in a direction substantially at a right angle, and a protrusion protruding from the tip end portion of the arm portion to the side opposite to the columnar portion. .

The probe element is soldered to a connection land such as a wiring of a wiring board at the other end of the columnar portion, and is used as a protruding electrode whose protruding portion is pressed against the electrode portion of the device under test.

As one of the methods for manufacturing such a probe element, a mold having a recess for a protruding electrode on the main surface of a stainless steel base is used, and a photoresist is applied to the main surface of the base, An opening having the shape of the probe element to be manufactured is formed in the photoresist by exposing and developing the photoresist, and a conductive material such as nickel is attached to the opening by an appropriate method such as electroforming to project. Section and arm section are formed, the second photoresist is applied to the photoresist, the protrusion section and the arm section, and the second photoresist is exposed and developed to form holes corresponding to the columnar section in the second photoresist. , A conductive material such as nickel is attached to the hole by an appropriate method such as electroforming to form a columnar portion, all remaining photoresist is removed, and the obtained probe element is There is a technique to remove from the mold.

[0005]

However, in the conventional manufacturing technique, since the liquid photoresist is used, the thickness dimension of the applied photoresist layer is small, and therefore, the height dimension of the protrusion and the columnar portion is small. It is not possible to obtain a probe element having a large height dimension from the tip of the protrusion to the connection portion to the connection land.

An object of the present invention is to obtain a probe element having a large height dimension from the tip of the protrusion to the connection portion to the connection land.

[0007]

The manufacturing method according to the present invention is
A first step of preparing a base having a main surface and having one or more recesses in the main surface; and a first photoresist layer in which two or more film-shaped dry photoresists are overlaid, And a second step of forming a first photoresist layer on the main surface, the first photoresist layer having a protrusion that penetrates the photoresist layer in the thickness direction thereof and reaches the recess.

The first photoresist layer is formed, for example, by arranging one dry photoresist on a base and forming a hole in the dry photoresist to reach a recess of the base by a technique such as an exposure / development technique. Part of the protrusion is formed by a technique such as electroforming, and then the step of placing the dry photoresist on top of the existing dry photoresist and reaching the recess of the base on the new dry photoresist It can be formed by repeating the step of forming a hole and the step of forming a part of the protrusion in the hole for each dry photoresist.

The first photoresist layer is also formed by arranging two or more dry photoresists on a base, and forming a hole in the dry photoresist to reach a recess of the base by a technique such as a laser processing technique. It can also be formed by forming a protrusion in the hole by a technique such as electroforming.

The thickness dimension of the resist layer formed by the film-shaped dry photoresist is larger than the thickness dimension of the resist layer formed by the liquid photoresist. The thickness dimension of the first photoresist layer in which two or more such dry photoresists are stacked is also large. Therefore, such a first
The use of the photoresist layer of (1) makes it possible to form a protrusion having a larger protruding length dimension than in the conventional case, and thus the height dimension of the finally formed probe element also becomes larger.

The method of manufacturing a probe element further includes a third step of forming a first conductive layer bonded to the protrusion on the first photoresist layer by sputtering using a conductive material, and the third step. A fourth step of forming a second photoresist layer on the first conductive layer; and an arm portion that passes through the second photoresist layer in the thickness direction of the second photoresist layer and is overlaid on and bonded to the first conductive layer. And a fifth step of forming an arm portion, which extends substantially at right angles to the protrusion, in the second photoresist layer.

Even if the protrusion, the first conductive layer and the arm are made of the same material, for example, nickel, the protrusion having a large protrusion length and the arm having a large thickness are formed by a plating technique such as electroforming. Despite being able to get
The protrusion and the first conductive layer are firmly bonded together, and the first conductive layer and the arm are firmly bonded together.

The method of manufacturing the probe element further includes a third method in which two or more dry photoresists in film form are laminated.
A photoresist layer, an electrically insulating resin layer overlaid on the third photoresist layer, a second conductive layer overlaid on the electrically insulating resin layer, and a fourth overlaid layer over the second electrically conductive layer. A sixth step of forming a laminated sheet layer including a photoresist layer on the arm portion and the second photoresist layer in a state where the third photoresist layer is on the second photoresist layer side; A seventh step of forming a base portion on the fourth photoresist layer, the base portion being overlaid on and bonded to the second conductive layer and lacking a portion corresponding to the columnar portion of the probe element; Removing the photoresist layer to remove the second conductive layer except for the region where the base portion is joined; and a fifth step on the exposed surface of the base portion and the electrically insulating resin layer. Photoresist layer A seventh step of forming, a ninth step of forming a hole from the fifth photoresist layer to reach the arm portion through the lacking portion of the base portion and the laminated sheet layer, the arm portion, the A second step of forming a conductive columnar part bonded to the second conductive layer and the base part in the hole; and the first, second, and third steps.
And a fifth step of removing the photoresist layer and the electrically insulating resin film layer, and removing unnecessary portions of the first and second conductive layers.

According to the above, since the third photoresist layer, the electrically insulating resin layer and the second conductive layer have large thicknesses, it is possible to obtain a columnar portion having a large length dimension.

The laminated sheet layer is formed on the arm portion and the second photoresist layer by stacking, for example, two or more dry photoresists, an electrically insulating resin layer, a second conductive layer and a fourth photoresist layer in that order. Alternatively, it can be formed by disposing a laminated sheet layer formed in advance on the arm portion and the second photoresist layer.

As the electrically insulating resin layer and the second conductive layer, a commercially available sheet in which a polyimide resin layer is formed on a copper foil can be used. By doing so, the work of joining the electrically insulating resin layer and the second conductive layer becomes unnecessary, so that the manufacturing cost of the probe element can be reduced.

Even if the second conductive layer is copper and the base portion and the columnar portion are made of the same material as the base portion, for example, nickel, the columnar portion having a large length and the thickness are formed by a plating technique such as electroforming. Although the base portion having a large size can be obtained, the base portion is firmly bonded to the second conductive layer, and the columnar portion is firmly bonded to the base portion, the second conductive layer and the arm portion. To be joined.

According to another manufacturing method of the present invention, a first step of preparing a base having a main surface and having one or more recesses on the main surface, and one or more film-shaped dry photoresists are used. The first laminated sheet layer including the first photoresist layer used and the first conductive layer laminated on the first photoresist layer is placed on the base so that the first photoresist layer is on the base side. Forming a through hole reaching the recess in the first laminated sheet layer, and forming the through hole from the recess to the first photoresist layer and the first conductive layer. And a fourth step (8) of forming a protrusion reaching to the recess and the through hole.

In another manufacturing method, the through hole can be formed by, for example, an etching technique using a photoresist or a laser processing technique using a laser beam. Further, the protrusions can be formed by a plating technique such as electroforming.

Also in other manufacturing methods, since the thickness dimensions of the first photoresist layer and the first conductive layer can be increased, it is possible to form a protrusion having a large protrusion length dimension, and thus the final dimension. The height dimension of the probe element that is formed is also large.

The through hole reaching the recess can be formed by a technique such as an exposure / development / etching technique using a photoresist or a laser processing technique.

Another manufacturing method further includes a fifth step of forming a second photoresist layer on the first conductive layer, and the first step of penetrating the second photoresist layer in the thickness direction thereof. An arm portion which is overlapped and joined to the conductive layer of the above and extends substantially at right angles to the protrusion portion.
And a sixth step of forming a photoresist layer of

In another manufacturing method, the arm portion is formed of, for example, an exposure / development technique for the second photoresist layer,
It can be formed by utilizing a plating technique such as electroforming.

Another manufacturing method further comprises a third photoresist layer in which two or more film-shaped dry photoresists are laminated, an electric insulating resin layer laminated on the third photoresist layer, and the electric insulating resin. A second laminated sheet layer including a second conductive layer laminated on a layer and a fourth photoresist layer laminated on the second conductive layer, wherein the third photoresist layer is the second photoresist. In the state of being on the layer side, a seventh step of forming the arm portion and the second photoresist layer, and a base portion which is overlapped and joined to the second conductive layer and which is a columnar portion of the probe element. An eighth step of forming a base portion lacking a corresponding portion on the fourth photoresist layer, and removing the fourth photoresist layer to remove the first portion except the region where the base portion is bonded. Guide to 2 A ninth step of removing the layer, and the tenth step of forming a fifth photoresist layer on the exposed surface of the base portion and the electrically insulating resin layer, the fifth
Eleventh step of forming a hole from the photoresist layer to the arm portion through the lacking portion of the base portion and the laminated sheet layer, and joining the arm portion, the second conductive layer and the base portion. A twelfth step of forming a conductive columnar portion in the hole, and the first, second, and fourth steps.
And a fifth photoresist layer, the electrically insulating resin layer, and the eleventh step of removing the first conductive layer.

According to the above, since the third photoresist layer, the electrically insulating resin layer, and the second conductive layer have large thicknesses, it is possible to obtain a columnar portion having a large length dimension.

In another manufacturing method, the second laminated sheet layer and the hole can be formed by the same method as the laminated sheet layer and the hole in the manufacturing method described above, respectively.

In another manufacturing method, a commercially available sheet having a polyimide resin layer formed on a copper foil can be used as the electrically insulating resin layer and the second conductive layer. By doing so, the work of joining the electrically insulating resin layer and the second conductive layer becomes unnecessary, so that the manufacturing cost of the probe element can be reduced.

In another manufacturing method, even if the second conductive layer is copper and the base portion and the columnar portion are made of the same material as the base portion, for example, nickel, the length dimension is determined by a plating technique such as electroforming. Although a columnar portion having a large thickness and a base portion having a large thickness can be obtained, the base portion is firmly bonded to the second conductive layer, and the columnar portion has the base portion and the second conductive layer. And firmly joined to the arm portion.

The probe element according to the present invention comprises a mounting seat portion, and a columnar portion extending from the mounting seat portion at a substantially right angle thereto.
An arm portion extending from the columnar portion at a substantially right angle to the columnar portion and a protrusion protruding from the tip of the arm portion in a direction opposite to the columnar portion are included.

According to the probe element described above, the height dimension of the probe element is increased by at least the thickness dimension of the mounting seat portion as compared with the conventional probe element.

Further, according to the probe element of the present invention, the area of the base portion can be increased and the adhesion area between the columnar portion and the connection land can be increased without increasing the cross-sectional area of the columnar portion. Therefore, the adhesive force between the columnar portion and the connection land is strong, and the probe element is unlikely to peel off from the substrate.
However, in the conventional probe element, the adhesive area between the columnar portion and the connection land cannot be increased unless the cross-sectional area of the columnar portion is increased. Easy to peel off from the substrate.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a probe element will be described with reference to FIG.

The probe element 10 has a prismatic mounting seat portion 12 extending in one direction, a columnar portion 14 extending from one end of the mounting seat portion 12 at a substantially right angle, and a columnar portion 14 at a substantially right angle. It includes a prismatic arm portion 16 that extends, and a protruding portion 18 that projects from the tip of the arm portion 16 in the direction opposite to the columnar portion 14. The mounting seat portion 12, the columnar portion 14, the arm portion 16 and the protrusion portion 18 have conductivity, and adjacent portions are integrally connected.

Although the mounting seat portion 12 and the arm portion 16 extend from the columnar portion 14 in opposite directions in the illustrated example, they may extend from the columnar portion 14 in the same direction. In that case, if the length dimension from the columnar portion 16 to the tip of the mounting seat portion 12 is made smaller than the length dimension of the arm portion 16 from the columnar portion 16 to the position of the protrusion portion 18, the elastically deformable range of the arm portion 16 is increased. Is increased by the thickness of the mounting seat portion 12.

Although the columnar portion 14 has a circular cross-sectional shape in the illustrated example, it has other cross-sectional shapes such as a polygon such as a square, a rectangle, and a hexagon, an ellipse, and an oval. May be. The protruding portion 18 is formed at the tip portion thereof, that is, a pyramid shape in the illustrated example, but may have another shape such as a conical shape, a hemispherical shape, or a short cylindrical shape.

Next, an embodiment of the method for manufacturing the probe element 10 as described above will be described with reference to FIGS.

First, as shown in FIG. 2A, 1 is formed on the main surface.
A base 22 having the above recesses 20 is prepared. Recess 2
0 is a base 2 using a punch having a tip corresponding to the tip shape of the protrusion of the probe element, such as a pyramid or a cone.
2 can be formed. The base 22 is preferably made of stainless steel, but other materials may be used.

Next, as shown in FIG. 2B, the base 2
One or more film-shaped dry photoresists are arranged on the main surface of No. 2 to form the photoresist layer 24. The photoresist layer 24 can be formed by adhering dry photoresist to the main surface of the base 22.

Next, as shown in FIG. 2 (C), the photoresist layer 24 is exposed and developed to form the base 2
A hole 26 communicating with the second recess 20 is formed.

Next, as shown in FIG. 2D, the first plating treatment with a conductive material is performed from the photoresist layer 24 side, and acts on the recess 20 and the hole 26 as a part of the protrusion. The convex portion 28 is formed. The plating treatment can be nickel plating by an appropriate method such as electroforming.

Next, as shown in FIG. 3A, one or more film-shaped dry photoresists are arranged on the photoresist layer 24 to form a photoresist layer 30.
The photoresist layer 30 can be formed by overlaying and adhering dry photoresist on the photoresist layer 24.

Next, as shown in FIG. 3 (B), the photoresist layer 30 is exposed and developed to form the protrusions 2.
Holes 32 are formed at locations corresponding to 8.

Next, as shown in FIG. 3C, a second plating process using a conductive material is performed from the side of the photoresist layer 30 to form a convex shape which acts as the remaining portion of the protrusion in the hole 32. The main part is formed. This main portion is integrally coupled with the convex portion 28 formed by the previous plating process, and forms the protruding portion 18 of the probe element 10 together with the convex portion 28. The plating treatment at this time can be nickel plating by an appropriate method such as electroforming, as in the previous plating treatment. By doing so, the convex portion and the main portion are firmly and integrally coupled.

The protrusion 18 obtained as described above is
Since the photoresist layers 24 and 30 are formed of a plurality of dry photoresists having a large thickness dimension, they have a large protruding length dimension as compared with the case where they are formed of a general liquid photoresist.

Instead of performing the exposure / development treatment and the plating treatment twice each as described above, a plurality of dry photoresists are superposed and arranged on the base to form a photoresist layer, and the photoresist layer is irradiated with a laser beam. It is also possible to form holes corresponding to the holes 26 and 32 and then perform plating treatment.

Next, as shown in FIG. 3D, the conductive layer 36 is formed on the photoresist layer 30 by sputtering the conductive material. As the conductive material at this time, it is preferable to use nickel used in the above-mentioned two plating treatments. By doing so, the protrusion 18 and the conductive layer 36 are firmly and integrally coupled.

Next, as shown in FIG. 4A, one or more film-shaped dry photoresists are arranged on the conductive layer 36 to form a photoresist layer 38. By overlaying and adhering the dry photoresist on the conductive layer 36,
Can be formed.

Next, as shown in FIG. 4B, the photoresist layer 38 is exposed and developed to form holes 40 corresponding to the arm portions of the probe element.

Next, as shown in FIG. 4C, a third plating process using a conductive material is performed from the photoresist layer 38 side, and the holes 40 act as part of the arm portions 16 of the probe element 10. In order to do so, a first arm region 42 extending substantially at right angles to the protrusion 18 is formed. The first arm region 42 is integrally bonded to the conductive layer 36 formed by the previous sputtering process. The plating treatment at this time may be nickel plating by an appropriate method such as electroforming, similarly to the plating treatments performed twice.

The first arm region 42 obtained as described above is formed of a plurality of dry photoresists having a larger thickness than the case where the photoresist layer 38 is formed of a general liquid photoresist. Has a large thickness dimension.

Next, as shown in FIG. 5A, a photoresist layer 44 using two or more film-shaped dry photoresists is formed on the photoresist layer 38 and the first arm region 42. The photoresist layer 44 can be formed by stacking multiple dry photoresists and adhering them to the photoresist layer 38 and the first arm region 42.

Then, as shown in FIG. 5B, the photoresist layer 4 is formed with the electrically insulating resin layer 46 and the conductive layer 48 with the electrically insulating resin layer 46 on the photoresist layer 44 side.
4 is formed. As the electrically insulating resin layer 46 and the conductive layer 48, a commercially available one in which an electrically insulating resin layer such as a polyimide film and a conductive layer such as a copper film are laminated can be used. By doing so, the electrically insulating resin layer 46
Also, since the work of joining the conductive layer 48 is unnecessary, the manufacturing cost of the probe element is reduced.

Next, as shown in FIG. 5C, a photoresist layer 50 is formed on the conductive layer 48. The photoresist layer 50 may be formed of a dry photoresist,
It may be formed of a liquid photoresist.

By performing a plurality of steps as described above, instead of forming a laminated sheet layer of the photoresist layer 44, the electrically insulating resin layer 46, the conductive layer 48 and the photoresist layer 50, the photoresist layer 44 and the electrically insulating resin layer are formed. Four
The number of steps may be reduced by using 6, the conductive layer 48 and the photoresist layer 50 or some of them in advance.

Next, as shown in FIG. 6 (A), the photoresist layer 50 is exposed and developed to correspond to the mounting seat portion 12 where the portion corresponding to the columnar portion 14 of the probe element 10 is removed. A hole 52 is formed.

Next, as shown in FIG. 6B, a plating process using a conductive material is performed from the photoresist layer 50 side to form a first seat region 54 corresponding to the hole 52. The plating treatment at this time can be nickel plating by an appropriate method such as electroforming, as in the case of the plating treatments so far. By doing so, the first seat region 54 made of nickel is firmly and integrally coupled to the conductive layer 46 made of copper. Further, when the photoresist layer 50 is formed by using the dry photoresist, the first seat region 54 having a larger thickness dimension can be obtained as compared with the case where the liquid photoresist is used.

Next, as shown in FIG. 7 (A), in the hole 56 in the photoresist layer 50, which corresponds to the photoresist remaining around the first seat region 54 and the columnar portion 14 of the probe element 10. The photoresist remaining on the substrate is removed. As a result, the hole 56 is opened.

Then, as shown in FIG. 7B, the conductive material around the first seat region 54 and in the portion corresponding to the hole 56 in the conductive layer 48 is removed by etching. As a result, holes 58 penetrating the first seat region 54 and the remaining conductive layer 48 are formed in the first seat region 54 and the remaining conductive layer 48. As a result, the remaining area of the conductive layer 48 that remains acts as the second seat area and forms the mounting seat 12 of the probe element 10 together with the first seat area 54.

Next, as shown in FIG. 7C, the photoresist layer 60 covers the first seat region 54, the remaining conductive layer, that is, the second seat region 48 and the exposed portion of the electrically insulating resin layer 46. It is formed so as to cover the first seat region 54, the remaining conductive layer 48, and the electrically insulating resin layer 46. The photoresist layer 60 can be formed by applying a liquid photoresist.

Next, as shown in FIG. 8A, the photoresist layer 60 is exposed and developed to form holes 58.
The photoresist in the inside is removed, and the material in the portions corresponding to the holes 58 in the conductive layer 48 is removed by etching, so that the photoresist layer 60, the first seat region 54 and the second seat region 54.
A hole 62 is formed through the seat region 48 of the.

Then, as shown in FIG.
From this, a hole 64 penetrating the electrically insulating resin layer 46 and the photoresist layer 44 is formed by using a laser beam. As a result, a through hole 64 penetrating the photoresist layer 60, the first seat region 54, the second seat region 48, the electrically insulating resin layer 46, and the photoresist layer 44 is formed. Through hole 6
4 reaches the first arm region 42.

Next, as shown in FIG. 9A, a plating treatment with a conductive material is performed from the photoresist layer 60 side, so that the columnar portion 14 of the probe element 10 is first formed in the hole 64.
Of the arm region 42 to the first seat region 54. In this plating process, the columnar portion 14 is formed to penetrate the first seat portion region 54,
It is not formed on the photoresist layer 60.

The plating treatment shown in FIG. 9A can also be nickel plating by an appropriate method such as electroforming, similarly to the plating treatments performed twice. By doing so, the columnar portion 14 made of nickel is firmly and integrally coupled to the arm portion 42, the second seat portion region 48, and the first seat portion region 54.

The columnar portion 14 formed as described above has a large length because the photoresist layer 44 is formed by using a dry photoresist having a large thickness dimension as compared with the case where the photoresist layer 44 is formed by using a liquid photoresist. Have dimensions.

Then, as shown in FIG. 9B, the photoresist layers 24 and 30, the conductive layer 36, and the first arm region 4 are formed.
2, photoresist layer 44, remaining electrically insulating resin layer 4
6, the blocks of the second seat area 48 and the first seat area 54 are removed from the base 22.

Next, as shown in FIG. 9C, the photoresist layers 24 and 30, the conductive layer 36 not bonded to the first arm region 42, the photoresist layer 44 and the remaining electrically insulating resin layer 46 are removed. To be removed. This allows
The remaining region of the conductive layer 36 acts as a second arm region to form the arm portion 16 of the probe element 10 with the first arm region 42.

The probe element 10 manufactured by the above-mentioned method has a protruding portion 18 as compared with the conventional probe element.
Since the projecting length dimension and the columnar portion 14 are large, the height dimension from the seat 12 to the tip of the protrusion 18 is large.

Next, another embodiment of the method for manufacturing the probe element 10 as described above will be described with reference to FIGS.

First, as shown in FIG. 10A, a base 22 having one or more recesses 20 on its main surface is prepared.

Next, as shown in FIG. 10B, one or more film-shaped dry photoresists are arranged on the main surface of the base 22 to form a photoresist layer 24.

Next, as shown in FIG. 10C, the conductive layer 70 is placed on the photoresist layer 24 in such a manner that a film such as a copper foil is adhered to the photoresist layer 24 so as to be overlaid.

Next, as shown in FIG. 10 (D), a photoresist layer 72 is formed on the conductive layer 70 in a superposed state. The photoresist layer 72 can be formed by stacking and adhering a film-shaped dry photoresist on the conductive layer 70, or can be formed by applying a liquid photoresist to the conductive layer 70.

Instead of forming the photoresist layer 24, the conductive layer 70 and the photoresist layer 72 in separate steps as described above, a dry photoresist forming the photoresist layer 24 may be pre-deposited on the conductive layer 70, or the photoresist layer may be formed. The dry photoresist forming 24, the conductive layer 70, and the photoresist layer 72 may be stacked in advance, and they may be arranged on the base.

Next, as shown in FIG. 11A, the photoresist layer 72 is exposed and developed. As a result, a hole 73A is formed at a location corresponding to the recess 20 of the base 22.

Next, as shown in FIG. 11B, the conductive layer 70 is etched. As a result, a hole 73B penetrating the conductive layer 70 and the photoresist layer 72 is formed at a position corresponding to the recess 20 of the base 22.

Next, as shown in FIG. 11C, the photoresist layer 24 is exposed and developed. As a result, a hole 73C that penetrates the photoresist layer 72, the conductive layer 70, and the photoresist layer 24 and reaches the recess 20 is formed.

Next, as shown in FIG. 12A, the photoresist layer 72 is formed by the first plating process using a conductive material.
Performed from the side of, the projection 20 of the probe element 10 is formed in the recess 20 and the hole 73C. The protrusion 18 is formed so as to penetrate the photoresist layer 24 and the conductive layer 70, but is not formed in the photoresist layer 72. The plating treatment can be nickel plating by an appropriate method such as electroforming. By doing so, the protrusion 18
Are firmly and integrally bonded to the conductive layer 70.

The protrusion 18 obtained as described above is
Since the photoresist layer 24 is formed of a plurality of dry photoresists having a large thickness dimension, it has a large protruding length dimension as compared with the case where it is formed of a general liquid photoresist.

Next, as shown in FIG. 12B, the photoresist layer 72 is removed, and instead, a photoresist layer 74 is formed on the conductive layer 70 as shown in FIG. 12C. Since the conductive layer 70 is used as a part of the arm portion as described later, the photoresist layer 74 can be formed by applying a liquid photoresist to the conductive layer 70.

Next, as shown in FIG. 12D, the photoresist layer 74 is exposed and developed to form a hole 76 at a location corresponding to the arm portion 16 of the probe element 10.

Next, as shown in FIG. 13A, the second plating process using the conductive material is performed by the photoresist layer 74.
Performed from the side of, the first arm region 78 forming a part of the arm portion 16 of the probe element 10 is formed. The plating treatment at this time can be nickel plating by an appropriate method such as electroforming, as in the previous plating treatment. By doing so, the first arm region 78
Is firmly and integrally bonded to the conductive layer 70 and the protrusion 18.

If the photoresist layer 74 is formed of dry photoresist, the thickness dimension of the first arm region 78 and thus the arm portion 16 of the probe element 10 can be increased.

Then, as shown in FIG. 13B, a photoresist layer 80 using two or more film-shaped dry photoresists is formed on the photoresist layer 74 and the first arm region 78. The photoresist layer 80 can be formed similarly to the photoresist layer 44 in the previous embodiment.

Next, as shown in FIG. 13C, the electrically insulating resin layer 82 and the conductive layer 84 are replaced by the electrically insulating resin layer 82.
Is formed on the photoresist layer 80 with the photoresist layer 80 side facing the photoresist layer 80 side. Electrically insulating resin layer 82 and conductive layer 84
Can be formed similarly to the electrically insulating resin layer 46 and the conductive layer 48 in the previous embodiment. Therefore, the work of joining the electrically insulating resin layer 82 and the conductive layer 84 becomes unnecessary, and the manufacturing cost of the probe element is reduced.

Next, as shown in FIG. 14A, a photoresist layer 86 is formed on the conductive layer 84. The photoresist layer 86 may be formed of a dry photoresist or a liquid photoresist.

Photoresist layer 80, electrically insulating resin layer 8
2, the laminated sheet layer of the conductive layer 84 and the photoresist layer 86 is also a laminate of the photoresist layer 80, the electrically insulating resin layer 82, the conductive layer 84 and the photoresist layer 86, or some of them in advance, as in the previous embodiment. May be used to reduce the number of steps.

Next, as shown in FIG. 14B, the photoresist layer 86 is exposed and developed to correspond to the mounting seat portion 12 where the portion corresponding to the columnar portion 14 of the probe element 10 is removed. A hole 88 is formed.

Then, as shown in FIG. 14C, a plating process using a conductive material is performed from the photoresist layer 86 side to form a first seat region 90 corresponding to the hole 88. The plating treatment at this time can be nickel plating by an appropriate method such as electroforming, as in the previous plating treatment. By doing so, the first seat portion region 90 made of nickel is firmly and integrally coupled to the conductive layer 84 made of copper. Further, when the photoresist layer 86 is formed by using the dry photoresist, the first seat region 90 having a larger thickness dimension can be obtained as compared with the case where the liquid photoresist is used.

Next, as shown in FIG. 15A, in the photoresist layer 86, the photoresist remaining around the first seat portion region 90 and the columnar portion 14 of the probe element 10 are left.
The photoresist remaining in the hole 92 at the location corresponding to is removed. As a result, the hole 92 is opened.

Next, as shown in FIG. 15B, the conductive material in the conductive layer 84 around the first seat region 90 and in the portions corresponding to the holes 92 is removed by etching. As a result, a hole 94 penetrating the first seat region 90 and the remaining conductive layer 84 is formed in the first seat region 90 and the remaining conductive layer 84. As a result, the remaining area of the conductive layer 84 that remains acts as the second seat area, and forms the mounting seat 12 of the probe element 10 together with the first seat area 90.

Next, as shown in FIG. 15C, the photoresist layer 96 is formed into the first seat region 90, the remaining conductive layer, that is, the second seat region 84 and the electrically insulating resin layer 82.
Is formed on the first seat portion region 90, the second seat portion region 84, and the electrically insulating resin layer 82 side so as to cover the exposed portion.
The photoresist layer 96 can be formed by applying a liquid photoresist.

Next, as shown in FIG. 16A, the photoresist layer 96 is exposed and developed to form holes 9
4 is removed, and at the same time, the material in the portions corresponding to the holes 98 in the second seat region 84 is removed by etching to remove the photoresist layer 96, the first and second seat regions 90, 84. A hole 100 is formed therethrough.

Then, as shown in FIG. 16B, the hole 1
00 to the electrically insulating resin layer 82 and the photoresist layer 80.
A hole passing through is formed using a laser beam. Thereby, the through hole 10 penetrating the photoresist layer 96, the first seat region 90, the remaining conductive layer, that is, the second seat region 84, the electrically insulating resin layer 82, and the photoresist layer 80.
2 is formed. The through hole 102 is formed in the first arm region 7
Has reached eight.

Next, as shown in FIG. 17A, a plating process using a conductive material is performed from the photoresist layer 96 side so that the columnar portion 14 of the probe element 10 is formed in the hole 102 from the first arm region 78. It is formed over the first seat region 90. In this plating process, the columnar portion 14
Are formed up to the state of penetrating the first seat region 90, but are not formed in the photoresist layer 96.

The plating treatment shown in FIG. 17A can also be nickel plating by an appropriate method such as electroforming, similarly to the plating treatments performed twice. By doing so, the columnar portion 14 made of nickel is provided in the first arm region 7
8, firmly coupled to the second seat region 84 and the first seat region 78.

The columnar portion 14 formed as described above also has a large length because the photoresist layer 80 is formed using a dry photoresist having a large thickness dimension as compared with the case where the photoresist layer 80 is formed using a liquid photoresist. Have dimensions.

Then, as shown in FIG. 17B, the photoresist layer 24, the conductive layer 70, the first arm region 78,
The blocks of the photoresist layer 80, the remaining electrically insulating resin layer 82, the second seat area 84 and the first seat area 90 are removed from the base 22.

Next, as shown in FIG. 17C, the photoresist layer 24, the conductive layer 70, the photoresist layer 80 and the remaining electrically insulating resin layer 82 are removed.

The probe element 10 manufactured by the above method is also different from the conventional probe element in the protrusion 18.
Since the projecting length dimension and the columnar portion 14 are large, the height dimension from the seat 12 to the tip of the protrusion 18 is large.

In the above embodiment, as the film-shaped dry photoresist, a product of "Liston" FRA063 series manufactured by DuPont MRC Dry Film Co., Ltd. (for example, a thickness dimension is 50 μm) can be used.

Next, an embodiment of a probe card using a plurality of probe elements 10 manufactured by the above method will be described with reference to FIGS. 18 and 19.

The probe card 110 includes a wiring board 112.
And a plurality of probe elements 10. Wiring board 112
Has a plurality of strip-shaped connection lands 116 on one surface of the electric insulating plate 114, and has a plurality of tester lands 118 on the other surface of the electric insulating plate 114.

Connection land 116 and tester land 118
And are individually associated with each other and with the probe element 10 and are connected in a one-to-one fashion by wires 120.

The connection lands 116 are divided into two sets of connection lands arranged in parallel while being extended in one direction at intervals in the other direction and arranged in two rows. The tester lands 118 are multiply formed on the peripheral portion of the other surface of the electric insulating plate 114.

Each probe element 10 has the mounting seat 1 with the projection 18 on the side opposite to the side of the electrical insulating plate 114.
2 is attached to the corresponding connection land 114 by a conductive adhesive such as solder.

The probe card 110 is used for conducting a current test of a semiconductor device such as an integrated circuit. It can also be applied to the probe element used for the energization test and its manufacturing method.

The present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the spirit thereof.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a probe element according to the present invention.

FIG. 2 is a diagram showing steps for explaining an embodiment of a method for manufacturing a probe element according to the present invention.

FIG. 3 is a diagram showing a step that follows the step shown in FIG.

FIG. 4 is a diagram showing a step that follows the step shown in FIG.

5 is a diagram showing a step that follows the step shown in FIG. 4. FIG.

FIG. 6 is a diagram showing a step that follows the step shown in FIG.

FIG. 7 is a diagram showing a step that follows the step shown in FIG. 6.

FIG. 8 is a diagram showing a step that follows the step shown in FIG. 7.

9 is a diagram showing a step that follows the step shown in FIG. 8. FIG.

FIG. 10 is a diagram showing steps for explaining another embodiment of the method for manufacturing a probe element according to the present invention.

11 is a diagram showing a step that follows the step shown in FIG.

FIG. 12 is a diagram showing a step that follows the step shown in FIG. 11.

FIG. 13 is a diagram showing a step that follows the step shown in FIG. 12.

FIG. 14 is a diagram showing a step that follows the step shown in FIG.

FIG. 15 is a diagram showing a step that follows the step shown in FIG.

16 is a diagram showing a step that follows the step shown in FIG.

FIG. 17 is a diagram showing a step that follows the step shown in FIG. 16.

FIG. 18 is a diagram showing an example of a probe card using the probe element shown in FIG. 1.

19 is a cross-sectional view taken along line 19-19 in FIG.

[Explanation of symbols]

10 probe elements 12 Mounting seat 14 Column 16 arms 18 Projection 20 base recess 24, 38, 44, 50, 60 photoresist layer 22 base 36, 46, 70, 82 Conductive layer 42,78 First arm area 46, 82 Electrically insulating resin layer 50,90 First seat area 64,102 through holes 72,74,80,86,96 photoresist layer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akihisa Akabira             2-6-8 Honcho, Kichijoji, Musashino City, Tokyo               Within Japan Micronics Co., Ltd. F-term (reference) 2G011 AA09 AA15 AA21 AB06 AB08                       AC31 AD01 AE01 AE03                 4M106 AA01 BA01 DD03 DD10

Claims (7)

[Claims] 1. A first step of preparing a base having a main surface and having one or more recesses in the main surface; and a first photoresist layer in which two or more dry photoresists in a film shape are stacked. And forming a first photoresist layer on the main surface, the first photoresist layer having a protrusion that penetrates the first photoresist layer in the thickness direction thereof and reaches the recess.
And a manufacturing method thereof. 2. A third step of forming on the first photoresist layer a first conductive layer joined to the protrusion by sputtering using a conductive material, and the third conductive layer being formed on the first photoresist layer. Fourth forming a second photoresist layer
And a step of penetrating the second photoresist layer in the thickness direction thereof and overlapping and joining the first conductive layer to the first conductive layer, the arm section extending substantially at right angles to the projecting portion. 5. The method according to claim 1, further comprising a fifth step of forming the photoresist layer. 3. A third photoresist layer in which two or more film-shaped dry photoresists are laminated, an electric insulating resin layer laminated on the third photoresist layer, and an electric insulating resin layer laminated on the electric insulating resin layer. A laminated sheet layer including a second conductive layer and a fourth photoresist layer stacked on the second conductive layer, in a state where the third photoresist layer is on the second photoresist layer side, A sixth step of forming the arm portion and the second photoresist layer, and a portion corresponding to the columnar portion of the probe element, which is a base portion that is overlapped and joined to the second conductive layer, are omitted. A seventh step of forming a base portion on the fourth photoresist layer, and removing the fourth photoresist layer to remove the second conductive layer except for the region where the base portion is joined. Eighth A step, a ninth step of forming a fifth photoresist layer on the exposed surface of the base portion and the electrically insulating resin layer, and a step of removing the base portion and the laminated sheet layer from the fifth photoresist layer. A tenth step of forming a hole through which the arm portion is reached, and an eleventh step of forming a conductive columnar portion bonded to the arm portion, the second conductive layer and the base portion in the hole. A twelfth step of removing the first, second, third and fifth photoresist layers and the electrically insulating resin film layer and removing unnecessary portions of the first and second conductive layers. The manufacturing method of Claim 3 containing. 4. A first step of preparing a base having a main surface and having one or more recesses in the main surface, a first photoresist layer using one or more film-shaped dry photoresists, and A second step of forming a first laminated sheet layer including a first conductive layer overlaid on the first photoresist layer on the base so that the first photoresist layer is on the base side; A third step of forming a through hole reaching the recess in the first laminated sheet layer, and a protrusion extending from the recess to the first photoresist layer and the first conductive layer And a fourth step of forming the through hole, and a method of manufacturing the probe element. 5. A fifth step of forming a second photoresist layer on the first conductive layer, and a step of penetrating the second photoresist layer in the thickness direction thereof to form the first conductive layer. 6. The manufacturing method according to claim 4, further comprising a sixth step of forming an arm portion that is overlapped and joined and that extends substantially at a right angle with the protruding portion on the second photoresist layer. 6. A third photoresist layer in which two or more film-shaped dry photoresists are laminated, an electric insulating resin layer laminated on the third photoresist layer, and an electric insulating resin layer laminated on the electric insulating resin layer. A second conductive layer and a fourth photoresist layer overlying the second conductive layer
Forming a laminated sheet layer on the arm portion and the second photoresist layer in a state in which the third photoresist layer is on the second photoresist layer side; and the second conductive layer. An eighth step of forming in the fourth photoresist layer a base portion which is overlapped and joined to the probe element and in which a portion corresponding to the columnar portion of the probe element is absent, and the fourth photoresist layer. A ninth step of removing and removing the second conductive layer except the region where the base portion is joined, and a fifth photoresist layer on the exposed surface of the base portion and the electrically insulating resin layer. A tenth step of forming, an eleventh step of forming a hole from the fifth photoresist layer to reach the arm portion through the lacking portion of the base portion and the laminated sheet layer, A twelfth step of forming, in the hole, a conductive columnar portion bonded to the hole portion, the second conductive layer and the base portion, the first, second, fourth and fifth photoresist layers, First to remove the electrically insulating resin layer and the first conductive layer
The manufacturing method according to claim 5, further comprising the step of 1. 7. A mounting seat portion, a columnar portion extending from the mounting seat portion substantially at a right angle thereto, an arm portion extending from the columnar portion at a substantially right angle thereto, and a columnar portion from a tip end portion of the arm portion. A probe element including a protrusion protruding in an opposite direction.