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JP2003218675A5
JP2003218675A5 JP2002012285A JP2002012285A JP2003218675A5 JP 2003218675 A5 JP2003218675 A5 JP 2003218675A5 JP 2002012285 A JP2002012285 A JP 2002012285A JP 2002012285 A JP2002012285 A JP 2002012285A JP 2003218675 A5 JP2003218675 A5 JP 2003218675A5
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voltage
terminal
semiconductor element
current
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第1の電源に接続されて主電流の入出力にかかわる第1の端子と、第2の端子と、制御端子とを備えた半導体素子の駆動装置であって、主電流の導通及び遮断を入力信号に応じて制御し、主電流の導通及び遮断時に発生する過電圧サージを抑制する駆動装置において、
前記過電圧サージ電圧の抑制時に、前記制御端子に流れる電流を制限する要素と、前記主半導体素子の遮断時に制御端子の電圧を放電する回路に流れる電流を制限する要素と、前記電流により駆動回路内で発生する損失を低減する要素とを備えたことを特徴とする半導体素子の駆動装置。
A first terminal related to the input and output of the connected main current to the first power supply, a second terminal, a driving device for a semi conductor device having a control terminal, the conduction and interruption of the main current In the drive device that controls according to the input signal and suppresses the overvoltage surge that occurs when the main current is turned on and off,
An element that limits the current flowing to the control terminal when the overvoltage surge voltage is suppressed; an element that limits the current flowing to a circuit that discharges the voltage of the control terminal when the main semiconductor element is shut off; and the current in the drive circuit And a device for reducing loss generated in the semiconductor device.
請求項1において、前記制御端子へ接続した第1の抵抗器と、前記第2の端子に接続した前記入力信号もしくは、前記第1の端子と第2の端子との間の電圧に応じて抵抗値を変化させる第1の抵抗手段と、前記入力信号により前記第1の抵抗手段に流れる電流の導通及び遮断を制御するスイッチ手段を備えた第1の可変抵抗手段と、前記第1の端子と第2の端子との間が第1の電圧以上のときに、前記第1の電源より低い電圧である第2の電源を経由して前記第1の抵抗器に電流を注入する電流源を備え、前記第1の可変抵抗手段と前記電流源とが、前記第1の抵抗器により前記制御端子に接続されることを特徴とする半導体素子の駆動装置。  2. The resistor according to claim 1, wherein the first resistor connected to the control terminal and the input signal connected to the second terminal or a voltage between the first terminal and the second terminal are selected. A first variable resistance means having a first resistance means for changing a value; a switch means for controlling conduction and interruption of a current flowing through the first resistance means by the input signal; and the first terminal. A current source for injecting a current into the first resistor via a second power supply that is lower in voltage than the first power supply when the voltage between the second terminal and the second terminal is equal to or higher than the first voltage; The driving device for a semiconductor element, wherein the first variable resistance means and the current source are connected to the control terminal by the first resistor. 請求項1,2の何れかにおいて、前記電流源が、前記第1の端子に接続される前記第1の端子と第2の端子との間の電圧が前記第1の電圧値に到達することにより電流が流れるツェナー型もしくはアバランシェ型の第1のダイオードと、該ダイオードに接続した第3の抵抗器と、前記第1のダイオードの電流を検知し前記第1の電源より低い電圧である第2の電源を経由して前記第1の抵抗器に電流を注入する要素を備えることを特徴とする半導体素子の駆動装置。  The voltage between the first terminal and the second terminal connected to the first terminal in the current source according to claim 1, wherein the voltage between the first terminal and the second terminal reaches the first voltage value. A zener-type or avalanche-type first diode through which a current flows, a third resistor connected to the diode, and a second voltage that is lower than the first power supply by detecting the current in the first diode. A device for driving a semiconductor element, comprising: an element for injecting a current into the first resistor via a power source. 請求項1〜3の何れかにおいて、前記主半導体素子の第1及び第2の端子との間の電圧が、その導通状態での定格電流時の電圧より大きくなる場合に、前記第1の抵抗手段の抵抗値が高くなることを特徴とする半導体素子の駆動装置。4. The first resistor according to claim 1, wherein a voltage between the first and second terminals of the main semiconductor element is larger than a voltage at a rated current in the conductive state. A device for driving a semiconductor element, characterized in that the resistance value of the means increases. 請求項4において、前記入力信号が前記主半導体素子の主電流を遮断する指令を発生し、第1の時間が経過した後に前記第1の抵抗手段の抵抗値が高くなることを特徴とする半導体素子の駆動装置。5. The semiconductor device according to claim 4, wherein the input signal generates a command for cutting off a main current of the main semiconductor element , and a resistance value of the first resistance means becomes high after a first time has elapsed. Device drive device. 請求項1〜3の何れかにおいて、前記第1の抵抗手段が制御電圧を微分する回路と、その微分値を判定する要素とを備え、前記微分値が一定値になった場合に前記第1の抵抗手段の抵抗値が高くなることを特徴とする半導体素子の駆動装置。  4. The method according to claim 1, wherein the first resistance means includes a circuit for differentiating the control voltage and an element for determining the differential value, and the first value when the differential value becomes a constant value. A resistance driving means for the semiconductor element has a high resistance value. 請求項1〜6の何れかにおいて、前記第1の可変抵抗手段が、並列接続した複数の
MOSFETを備え、前記入力信号が前記主半導体素子の主電流を遮断する指令を発生した時に、前記複数のMOSFETが導通状態に変化して低抵抗状態となり、その後少なくとも1つ以上のMOSFETが遮断状態となることで高抵抗となることを特徴とする半導体素子の駆動装置。
7. The method according to claim 1, wherein the first variable resistance means includes a plurality of MOSFETs connected in parallel, and when the input signal generates a command to cut off a main current of the main semiconductor element. The semiconductor device driving device is characterized in that the MOSFET is turned into a conductive state and is in a low resistance state, and then at least one or more MOSFETs are cut off to become a high resistance.
請求項1〜7の何れかにおいて、前記第1の抵抗器として前記制御端子の電圧の低下により抵抗値が増加し、前記制御端子の電圧を前記主半導体素子のしきい電圧以下の第2の電圧に維持する機能を備えた第1の非線型素子を設けたことを特徴とする半導体素子の駆動装置。In any one of Claims 1-7, resistance value increases by the fall of the voltage of the said control terminal as said 1st resistor, The voltage of the said control terminal is made into 2nd below the threshold voltage of the said main semiconductor element . A drive device for a semiconductor element, comprising a first non-linear element having a function of maintaining a voltage. 請求項8において、前記第1の非線型素子が第2のダイオードと第4の抵抗器とを直列に接続したことを特徴とする半導体素子の駆動装置。  9. The semiconductor element driving device according to claim 8, wherein the first non-linear element includes a second diode and a fourth resistor connected in series. 請求項1〜9の何れかの半導体素子の駆動装置により駆動される半導体装置を備えたことを特徴とする電力変換装置。Power conversion apparatus characterized by comprising a semi-conductor device that is driven by the drive unit of any of the semiconductor device according to claim 1-9. 半導体素子が請求項1〜9の何れかの駆動装置により駆動され、前記主半導体素子と第1の電源の間の主回路インダクタンスがLsである電力変換装置において、
VBを第1の電源電圧、fを電力変換装置キャリア周波数、Ron(V)を前記主半導体装置のオン抵抗を素子の耐電圧の関数として表したときに、前記第1の電圧を、下記の式(1)を満たす電圧Vの近傍に設定したことを特徴とする電力変換装置。
dRon(V)/dV=Ls×f/2×VB/(V−VB)2 …(1)
In the power conversion device in which the semiconductor element is driven by the driving device according to any one of claims 1 to 9, and the main circuit inductance between the main semiconductor element and the first power source is Ls.
When VB is a first power supply voltage, f is a power converter carrier frequency, and Ron (V) is an on-resistance of the main semiconductor device as a function of a withstand voltage of the element, the first voltage is expressed as follows: A power converter characterized by being set in the vicinity of a voltage V that satisfies Equation (1).
dRon (V) / dV = Ls × f / 2 × VB / (V−VB) 2 (1)
主電流の入出力に係わる主半導体素子を制御する駆動装置を1チップの半導体基板に集積回路化した3相インバータ型の電力変換装置において、
前記駆動装置の主半導体素子への制御信号の出力回路部が集積回路の周辺部に形成され、前記集積回路の周辺沿面方向に、第1の相の上アーム,第2の相の上アーム,第3の相の上アーム,第3の相の下アーム,第2の相の下アーム,第1の相の上アームの順番に設け、前記インバータの制御のための前記制御回路への外部信号の入力回路を、第1の相の上アーム,第2の相の上アーム,第3の相の上アーム、第3の相の下アームの各領域の間以外の領域に設けたことを特徴とする電力変換装置。
In a three-phase inverter type power converter in which a driving device for controlling a main semiconductor element related to input / output of a main current is integrated on a one-chip semiconductor substrate,
An output circuit portion for a control signal to the main semiconductor element of the driving device is formed in the peripheral portion of the integrated circuit, and the upper arm of the first phase, the upper arm of the second phase in the peripheral creeping direction of the integrated circuit, An external signal to the control circuit for controlling the inverter is provided in the order of the upper arm of the third phase, the lower arm of the third phase, the lower arm of the second phase, and the upper arm of the first phase. Is provided in a region other than between the regions of the upper arm of the first phase, the upper arm of the second phase, the upper arm of the third phase, and the lower arm of the third phase. A power converter.
請求項5,10,11,12の何れかの電力変換装置を備えた電気車であって、前記主半導体素子がMOSFETであり、前記電力変換装置の半導体駆動装置が1つの集積回路チップに集積され、VBを第1の電源電圧、fを電力変換装置キャリア周波数、Ron(V)を前記主半導体装置のオン抵抗を素子の耐電圧の関数として表したときに、その上限が下記の式(1)
dRon(V)/dV=Ls×f/2×VB/(V−VB)2 …(1)
を満たす電圧近傍に設けられており、前記主半導体素子の第1及び第2の端子間の耐電圧が前記第1の電圧より大きくかつその近傍の値となることを特徴とする電気車
13. An electric vehicle comprising the power conversion device according to claim 5, wherein the main semiconductor element is a MOSFET, and the semiconductor drive device of the power conversion device is integrated on one integrated circuit chip. Where V B is the first power supply voltage, f is the power converter carrier frequency, and Ron (V) is the on-resistance of the main semiconductor device as a function of the withstand voltage of the element, the upper limit is (1)
dRon (V) / dV = Ls × f / 2 × VB / (V−VB) 2 (1)
An electric vehicle characterized in that the withstand voltage between the first and second terminals of the main semiconductor element is greater than and close to the first voltage.
JP2002012285A 2002-01-22 2002-01-22 Semiconductor device driving apparatus and power conversion apparatus using the same Expired - Fee Related JP3979096B2 (en)

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