JP2003209336A - Printed wiring substrate and method for processing the same - Google Patents
Printed wiring substrate and method for processing the sameInfo
- Publication number
- JP2003209336A JP2003209336A JP2002007733A JP2002007733A JP2003209336A JP 2003209336 A JP2003209336 A JP 2003209336A JP 2002007733 A JP2002007733 A JP 2002007733A JP 2002007733 A JP2002007733 A JP 2002007733A JP 2003209336 A JP2003209336 A JP 2003209336A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- adhesive film
- film layer
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000002313 adhesive film Substances 0.000 claims description 40
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、加熱硬化型の接
着フィルムが貼り合わされたプリント配線基板の加工方
法及びプリント配線基板に関し、特に、開口部等の加工
部分への接着剤のはみ出しを抑えることにより、加工部
分の加工精度を向上するプリント配線基板の加工方法及
びプリント配線基板に係わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of processing a printed wiring board and a printed wiring board to which a heat-curable adhesive film is attached, and more particularly, to prevent the adhesive from protruding to a processed portion such as an opening. Thus, the present invention relates to a printed wiring board processing method and a printed wiring board for improving the processing accuracy of a processed portion.
【０００２】[0002]
【従来の技術】一般に、電子部品を備える電子部品基板
を接着するための加熱硬化型の接着フィルムが表面上に
貼り合わされたプリント配線基板の加工処理は金型を用
いて行われる。2. Description of the Related Art Generally, a mold is used to process a printed wiring board having a surface on which a heat-curable adhesive film for adhering an electronic component substrate having electronic components is adhered.
【０００３】[0003]
【発明が解決しようとする課題】ところで、接着フィル
ムは、加熱接着の際の流動性増加に伴い、加工部からは
み出し、加工部の加工精度を悪化させることが知られて
いる。すなわち、従来では、図２（ａ）に示す様に、８
０〜１００℃に加熱されたステージ１０上に基板層２，
パッド部３，および接着フィルム１１からなるプリント
配線基板を載置し、撮像素子等の電子部品７を備える電
子部品基板８を２００℃〜２５０℃で加熱してバンプ部
９を介して上記プリント配線基板上に加熱圧着するわけ
であるが、この時、図２（ｂ）に示す様に、上記接着フ
ィルム１１は、加熱により流動性を増し、加工部へのは
み出し１１ａ（状況により加工端から０．２mm程度）が
生じてしまうものであった。By the way, it is known that the adhesive film sticks out from the processed portion and deteriorates the processing accuracy of the processed portion as the fluidity increases during heat bonding. That is, in the conventional case, as shown in FIG.
The substrate layer 2, on the stage 10 heated to 0 to 100 ° C.
A printed wiring board including the pad portion 3 and the adhesive film 11 is placed, an electronic component substrate 8 including an electronic component 7 such as an image sensor is heated at 200 ° C. to 250 ° C., and the printed wiring is provided via the bump portion 9. This is heat-pressed onto the substrate. At this time, as shown in FIG. 2 (b), the adhesive film 11 increases in fluidity due to heating, and the adhesive film 11 protrudes into the processed portion 11a (0 0.2 mm) was generated.
【０００４】しかしながら、上記のような金型加工によ
るプリント配線基板の加工方法では、このような接着剤
のはみ出しによる加工精度の悪化の問題に対処すること
ができない。However, the above-described method for processing a printed wiring board by means of die processing cannot deal with the problem of deterioration of processing accuracy due to such protrusion of the adhesive.
【０００５】本発明は、上記のような課題を解決するた
めになされたものであり、その目的は、接着剤の加工部
へのはみ出しを抑えることにより、加工部の加工精度を
向上するプリント配線基板の加工方法及びプリント配線
基板を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to prevent printed matter from sticking out to a processed portion to improve the processing accuracy of the processed portion. It is intended to provide a method for processing a board and a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】本発明に係るプリント配
線基板の加工方法は、電子部品を備える半導体基板を接
着するための加熱硬化型の接着フィルム層が表面上に形
成されたプリント配線基板の加工方法であって、電子部
品を内包する開口部を形成する領域のプリント配線基板
を接着フィルム層と共に一括除去する除去工程を有し、
除去工程は、接着フィルム層を加熱して半導体基板とプ
リント配線基板とを接着する際に接着剤の開口部への流
入を防ぐダム構造を形成する工程を含むことを特徴とす
る。A method of processing a printed wiring board according to the present invention is directed to a printed wiring board having a thermosetting adhesive film layer for adhering a semiconductor substrate having electronic components formed on the surface thereof. A processing method, which has a removing step of collectively removing the printed wiring board in a region where an opening for containing an electronic component is formed together with an adhesive film layer,
The removing step is characterized by including a step of heating the adhesive film layer to form a dam structure for preventing the adhesive from flowing into the opening when the semiconductor substrate and the printed wiring board are bonded together.
【０００７】また、本発明に係るプリント配線基板は、
電子部品を備える半導体基板を接着するための加熱硬化
型の接着フィルム層が表面上に形成されたプリント配線
基板であって、プリント配線基板を前記接着フィルム層
と共に一括除去することにより形成された、電子部品を
内包する開口部を備え、開口部の周部の接着フィルム層
は熱硬化していることを特徴とする。Also, the printed wiring board according to the present invention is
A heat-curable adhesive film layer for adhering a semiconductor substrate having an electronic component is a printed wiring board formed on a surface, and the printed wiring board is formed by removing the printed wiring board together with the adhesive film layer. It is characterized in that it has an opening containing an electronic component, and the adhesive film layer on the peripheral portion of the opening is thermoset.
【０００８】すなわち、本発明の特徴は、電子部品が内
包される開口部周部の接着フィルム層は熱硬化している
ことにある。このような構成によれば、接着フィルム層
を加熱してプリント配線基板と半導体基板とを接着する
際に、硬化した接着フィルムが接着剤が開口部に流入す
ることを防ぐので、開口部の加工精度を向上することが
できる。また、この結果、実装する電子部品がＣＣＤ等
のような撮像素子である場合には、開口面積に匹敵する
撮像エリアを確保し、撮像素子の性能を低下させること
がない。That is, the feature of the present invention resides in that the adhesive film layer in the peripheral portion of the opening in which the electronic component is contained is thermoset. According to such a configuration, when the adhesive film layer is heated to bond the printed wiring board and the semiconductor substrate together, the cured adhesive film prevents the adhesive from flowing into the opening. The accuracy can be improved. Further, as a result, when the electronic component to be mounted is an image pickup device such as a CCD, an image pickup area comparable to the opening area is secured and the performance of the image pickup device is not deteriorated.
【０００９】[0009]
【発明の実施の形態】以下、図１を参照して、本発明の
実施の形態となるプリント配線基板の加工方法について
説明する。なお、ここでは、図１（ａ）に示すような構
成を有するプリント配線基板１に開口部を形成する処理
を例として、本発明の実施の形態となるプリント配線基
板の加工方法について具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION A method of processing a printed wiring board according to an embodiment of the present invention will be described below with reference to FIG. It should be noted that here, the processing method of the printed wiring board according to the embodiment of the present invention will be specifically described by taking as an example a process of forming an opening in the printed wiring board 1 having the configuration shown in FIG. explain.
【００１０】図１（ａ）に示すプリント配線基板１は、
１０〜５０μｍ程度の膜厚を有する基板層２と、この基
板層２表面に形成された４〜１８μｍ程度の膜厚を有す
る銅箔のパッド部３、基板層２とパッド部３とをラミネ
ートする接着フィルム層４とを備える。基板層２は、耐
熱性を有し、比較的誘電率の低い例えばポリイミド樹脂
等の樹脂材料により形成される。また、接着フィルム層
４は、液状で粘度が低い熱硬化型の材料から成る。な
お、この接着フィルム層４内に金属を混入させて、異方
性導電膜となるように構成しても良い。The printed wiring board 1 shown in FIG.
The substrate layer 2 having a film thickness of about 10 to 50 μm, the pad portion 3 of the copper foil formed on the surface of the substrate layer 2 and having a film thickness of about 4 to 18 μm, the substrate layer 2 and the pad portion 3 are laminated. And an adhesive film layer 4. The substrate layer 2 is made of a resin material such as polyimide resin having heat resistance and a relatively low dielectric constant. The adhesive film layer 4 is made of a liquid thermosetting material having a low viscosity. A metal may be mixed into the adhesive film layer 4 to form an anisotropic conductive film.
【００１１】本発明の実施の形態となるプリント配線基
板の加工方法においては、この図１（ａ）に示すプリン
ト配線基板１に開口部を形成する際、図１（ｂ）に示す
ように、開口部を形成するプリント配線基板領域に炭酸
ガスレーザ等のレーザ光線５を数秒照射することによ
り、接着フィルム層４ごと一括してプリント配線基板１
に加工処理を施す。このような加工処理によれば、加工
処理時の局所的な加熱により、加工部の端部付近の接着
フィルム層４のみが熱硬化し、加工部端部に接着フィル
ム層４の硬化層６を形成することができる。In the method of processing a printed wiring board according to the embodiment of the present invention, when forming an opening in the printed wiring board 1 shown in FIG. 1 (a), as shown in FIG. 1 (b), By irradiating a laser beam 5 such as a carbon dioxide gas laser for several seconds on the printed wiring board region where the opening is to be formed, the printed wiring board 1 together with the adhesive film layer 4 is batched.
Is processed. According to such a processing treatment, only the adhesive film layer 4 near the end of the processed portion is thermally cured by local heating during the processing treatment, and the cured layer 6 of the adhesive film layer 4 is formed on the processed portion end portion. Can be formed.
【００１２】その後は、図１（ｃ）に示すように、加熱
されたステージ１０上にプリント配線基板１を載置して
接着フィルム層４を加熱すると共に、上記加工処理によ
り形成された開口部の中心に例えば撮像素子等の電子部
品７を備える電子部品基板８をバンプ部９を介して加熱
圧着してフリップチップ実装するのであるが、この時、
加熱圧着処理により接着フィルム層４の流動性が増加し
ても、上記硬化層６が開口部への接着剤のはみ出しを抑
えるので、開口部の加工精度を維持することができる。After that, as shown in FIG. 1C, the printed wiring board 1 is placed on the heated stage 10 to heat the adhesive film layer 4 and the opening formed by the above-mentioned processing. An electronic component substrate 8 having an electronic component 7 such as an image sensor is thermocompression-bonded via a bump portion 9 to the flip-chip mounting at the center of,
Even if the fluidity of the adhesive film layer 4 is increased by the heat-pressing treatment, the cured layer 6 suppresses the adhesive from squeezing out into the opening, so that the processing accuracy of the opening can be maintained.
【００１３】〔実施の形態の効果〕以上の説明から明ら
かなように、この実施形態のプリント配線基板１におい
ては、加工部の端部に接着フィルム層４が熱硬化した硬
化層６が形成されているので、接着フィルム層４を加熱
してプリント配線基板１と電子部品基板８とを圧着する
際に、硬化層６が接着剤が加工部に流入することを防
ぎ、加工部の加工精度を向上することができる。[Effects of the Embodiment] As is apparent from the above description, in the printed wiring board 1 of this embodiment, the cured film 6 in which the adhesive film layer 4 is thermoset is formed at the end of the processed portion. Therefore, when the adhesive film layer 4 is heated and the printed wiring board 1 and the electronic component substrate 8 are pressure-bonded to each other, the cured layer 6 prevents the adhesive from flowing into the processed portion, and improves the processing accuracy of the processed portion. Can be improved.
【００１４】また、この実施形態のプリント配線基板１
においては、加工部から接着剤がはみ出し、はみ出した
接着剤が撮像素子に入射される光を遮るようなことがな
いので、ＣＣＤ等のような撮像素子を実装する場合であ
っても、加工面積に匹敵する撮像エリアを確保し、撮像
素子の性能の低下させることがない。Further, the printed wiring board 1 of this embodiment
In the above, since the adhesive does not stick out from the processed part and the adhesive that sticks out does not block the light incident on the image pickup device, even if an image pickup device such as a CCD is mounted, the processing area is An image pickup area comparable to the above is secured, and the performance of the image pickup element is not deteriorated.
【００１５】〔その他の実施の形態〕最後に、以上、本
発明者らによってなされた発明を適用した実施形態につ
いて説明したが、この実施形態による本発明の開示の一
部をなす論述及び図面により本発明は限定されることは
ない。[Other Embodiments] Lastly, the embodiment to which the invention made by the present inventors has been applied has been described above. However, with reference to the discussion and drawings that form part of the disclosure of the present invention according to this embodiment, The present invention is not limited.
【００１６】例えば、上記実施の形態においては、レー
ザ光線５により接着フィルム層４の加工端を硬化させる
ようにしたが、金型を加熱し、金型加工の際には、加熱
された金型から開口部周部の接着フィルム層４に熱が加
わるようにすることにより、接着フィルム層４の加工端
を硬化させ硬化層６を形成するようにしても良い。For example, in the above-described embodiment, the processing end of the adhesive film layer 4 is cured by the laser beam 5, but the mold is heated, and when the mold is processed, the heated mold is heated. From the above, heat may be applied to the adhesive film layer 4 on the peripheral portion of the opening to cure the processed end of the adhesive film layer 4 to form the cured layer 6.
【００１７】このように、この実施形態に基づいて当業
者等によりなされる他の実施の形態、実施例及び運用技
術等は全て本発明の範疇に含まれることは勿論であるこ
とを付け加えておく。As described above, it is needless to say that all other embodiments, examples, operation techniques and the like made by those skilled in the art based on this embodiment are included in the scope of the present invention. .
【００１８】[0018]
【発明の効果】本発明によれば、接着剤が加工部にはみ
出すことを防止することができるので、加工部の加工精
度を向上することができる。According to the present invention, the adhesive can be prevented from sticking out to the processed portion, so that the processing accuracy of the processed portion can be improved.
【図１】本発明の一実施形態となるプリント配線基板の
加工方法を説明するための断面工程図である。FIG. 1 is a sectional process diagram for explaining a method for processing a printed wiring board according to an embodiment of the present invention.
【図２】従来のプリント配線基板の加工方法を説明する
ための断面図である。FIG. 2 is a cross-sectional view for explaining a conventional method for processing a printed wiring board.
１…プリント配線基板、２…基板層、３…パッド部、４
…接着フィルム層、５…レーザ光線、６…硬化層、７…
電子部品、８…電子部品基板、９…バンプ部1 ... Printed wiring board, 2 ... Board layer, 3 ... Pad part, 4
... Adhesive film layer, 5 ... Laser beam, 6 ... Curing layer, 7 ...
Electronic component, 8 ... Electronic component substrate, 9 ... Bump part
Claims (6)
ための加熱硬化型の接着フィルム層が表面上に形成され
たプリント配線基板の加工方法であって、 前記電子部品を内包する開口部を形成する領域のプリン
ト配線基板を前記接着フィルム層と共に一括除去する除
去工程を有し、 前記除去工程は、前記接着フィルム層を加熱して前記半
導体基板と前記プリント配線基板とを接着する際に接着
剤の前記開口部への流入を防ぐダム構造を形成する工程
を含むことを特徴とするプリント配線基板の加工方法。1. A method of processing a printed wiring board, wherein a heat-curable adhesive film layer for adhering a semiconductor substrate having an electronic component is formed on a surface thereof, wherein an opening for enclosing the electronic component is formed. A removing step of collectively removing the printed wiring board in the area to be removed together with the adhesive film layer, and the removing step includes an adhesive agent when heating the adhesive film layer to bond the semiconductor substrate and the printed wiring board together. A method of processing a printed wiring board, comprising the step of forming a dam structure that prevents the dam from flowing into the opening.
工方法であって、 前記ダム構造は接着フィルム層が熱硬化することにより
開口部周部に形成された硬化層であることを特徴とする
プリント配線基板の加工方法。2. The method for processing a printed wiring board according to claim 1, wherein the dam structure is a hardened layer formed on the peripheral portion of the opening by thermosetting the adhesive film layer. Printed wiring board processing method.
配線基板の加工方法であって、 前記除去工程はレーザ光線を利用して行うことを特徴と
するプリント配線基板の加工方法。3. The method for processing a printed wiring board according to claim 1 or 2, wherein the removing step is performed by using a laser beam.
配線基板の加工方法であって、 前記除去工程は加熱した金型を利用して行うことを特徴
とするプリント配線基板の加工方法。4. The method of processing a printed wiring board according to claim 1 or 2, wherein the removing step is performed by using a heated mold.
ための加熱硬化型の接着フィルム層が表面上に形成され
たプリント配線基板であって、 前記プリント配線基板を前記接着フィルム層と共に一括
除去することにより形成された、前記電子部品を内包す
る開口部を備え、 前記開口部の周部の接着フィルム層は熱硬化されたダム
構造となっていることを特徴とするプリント配線基板。5. A printed wiring board having a heat-curable adhesive film layer for adhering a semiconductor substrate having electronic components formed on a surface thereof, wherein the printed wiring board is removed together with the adhesive film layer. A printed wiring board, comprising an opening portion formed by the above, which encloses the electronic component, and an adhesive film layer on a peripheral portion of the opening portion has a thermosetting dam structure.
形成され、電子部品を備える半導体基板が接着されたプ
リント配線基板であって、 前記プリント配線基板を前記接着フィルム層と共に一括
除去することにより形成された、前記電子部品を内包す
る開口部を備え、 前記接着フィルムの内で、前記開口部の周部の接着フィ
ルム層は少なくとも先に熱硬化されていることを特徴と
するプリント配線基板。6. A printed wiring board having a thermosetting adhesive film layer formed on a surface thereof and a semiconductor substrate having electronic components bonded thereto, wherein the printed wiring board is removed together with the adhesive film layer. A printed wiring board, characterized in that the adhesive film layer of the peripheral portion of the opening is thermoset at least first in the adhesive film. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007733A JP3910852B2 (en) | 2002-01-16 | 2002-01-16 | Method for processing printed wiring board and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007733A JP3910852B2 (en) | 2002-01-16 | 2002-01-16 | Method for processing printed wiring board and printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003209336A true JP2003209336A (en) | 2003-07-25 |
| JP3910852B2 JP3910852B2 (en) | 2007-04-25 |
Family
ID=27646174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002007733A Expired - Fee Related JP3910852B2 (en) | 2002-01-16 | 2002-01-16 | Method for processing printed wiring board and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3910852B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8716839B2 (en) | 2012-06-21 | 2014-05-06 | Fujitsu Limited | Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus |
| KR102104859B1 (en) * | 2019-05-14 | 2020-04-27 | (주)와이에스티 | Mike hole laser manufacturing method of ductility circuit board |
| JP7541246B2 (en) | 2021-07-16 | 2024-08-28 | 日亜化学工業株式会社 | Substrate manufacturing method |
-
2002
- 2002-01-16 JP JP2002007733A patent/JP3910852B2/en not_active Expired - Fee Related
Cited By (4)
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| US8716839B2 (en) | 2012-06-21 | 2014-05-06 | Fujitsu Limited | Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus |
| US8866270B2 (en) | 2012-06-21 | 2014-10-21 | Fujitsu Limited | Method of manufacturing semiconductor device mounting structure |
| KR102104859B1 (en) * | 2019-05-14 | 2020-04-27 | (주)와이에스티 | Mike hole laser manufacturing method of ductility circuit board |
| JP7541246B2 (en) | 2021-07-16 | 2024-08-28 | 日亜化学工業株式会社 | Substrate manufacturing method |
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